TWI647068B - Processing device - Google Patents

Abstract

An object of the present invention is to provide a processing device which has reduced processing influence due to vibration. The solution is to construct the following components: a holding component for holding the processed object; a processing component for processing the processed object; a device base provided with the holding component and the processing component; and a device base, the holding component, and processing A device frame that surrounds the module and supports parts that become sources of vibration. The device base and the device frame are independently and erected separately, and are in contact with each other through the vibration-proof member to maintain the mutual positional relationship, and the vibration-proof member absorbs the vibration generated by the parts.

Description

Processing device Field of invention

The present invention relates to a processing device for processing a workpiece such as a semiconductor wafer.

Background of the invention

Semiconductor wafers in which components such as ICs are formed in a plurality of areas on the surface side divided by a planned dividing line called a street. After, for example, grinding the back side, the semiconductor wafer is divided into corresponding areas. A plurality of component wafers of the component can be assembled into an electronic device or the like. Processing of such a semiconductor wafer is generally performed using a processing device such as a grinding device or a dicing device.

In recent years, in order to improve the productivity of element wafers, the diameter of semiconductor wafers has continued to increase. On the other hand, when the semiconductor wafer is made larger in diameter, the processing equipment also needs to be increased in size due to the circumstances. In order to solve this problem, there has been proposed a processing device that reduces the internal clearance by arranging electrical components and the like at the upper portion to reduce the area (see, for example, Patent Documents 1 and 2).

Prior art literature Patent literature

Patent Document 1: Japanese Patent Laid-Open No. 2010-162665

Patent Document 2: Japanese Patent Laid-Open No. 2010-287764

Summary of invention

In the above-mentioned processing device, a frame (device frame) capable of providing electrical components and the like is fixed to a base (device base) of the processing device, and the electrical components and the like are arranged on the upper portion. Since heat is generated from the electrical components, a fan for suction and exhaust that discharges heat to the outside and draws in low-temperature air is attached to the frame.

However, when a heavy object such as an electric component is placed on the upper part as described above, the position of the center of gravity becomes high, which makes the processing device easy to vibrate. Therefore, in the above-mentioned processing apparatus, there may be a case where vibrations generated by a fan for suction and exhaust may adversely affect processing of a workpiece such as a semiconductor wafer.

The present invention has been made in view of the problems described above, and it is an object of the present invention to provide a processing device that has reduced the influence of processing by vibration.

The processing device according to the present invention is characterized in that it comprises: a holding component for holding the processed object; a processing component for processing the processed object; a device base configured with the holding component and the processing component; and the device base The device frame, which is surrounded by the base, the holding component, and the processing component, and which will support the parts that will become the source of the vibration generation, the device base and the device frame are each independently set upright, and are connected through the vibration-proof member Touch to maintain the mutual positional relationship, and the vibration-proof member absorbs the vibration generated by the part.

In the present invention, it is desirable that the device frame can be fixed to the device base through a detachable fixing member.

In the processing device of the present invention, since the device base on which the holding component and the processing component are arranged, and the device frame supporting the parts that become a source of vibration are independently and vertically arranged, and are in contact with each other through the vibration-proof member, The vibration generated on this part can be absorbed by the vibration-proof member, and it hardly propagates to the device base. According to this, it is possible to reduce the processing influence due to vibration.

2‧‧‧Processing equipment

4‧‧‧ device base

4a‧‧‧ opening

4b‧‧‧foot

4c‧‧‧Screw hole

6‧‧‧Dustproof and dripproof cover

8‧‧‧Work clamp table (holding assembly)

8a‧‧‧ keep face

10‧‧‧ support structure

11‧‧‧Processed

12‧‧‧ mobile agency

14‧‧‧Turning unit (machining component)

16‧‧‧Rotary turning wheel (rotating tool)

18‧‧‧ device frame

20‧‧‧Frame material

22‧‧‧Frame Ontology

24‧‧‧Frame feet

24a‧‧‧ opening

26‧‧‧Storage Box

28‧‧‧Anti-vibration member

30‧‧‧ Fixture

32‧‧‧screw (fixing member)

X, Y, Z‧‧‧ directions

FIG. 1 is an exploded perspective view schematically showing a processing device.

FIG. 2 is an enlarged view showing a part of the front side of the processing device in an enlarged manner.

Forms used to implement the invention

An embodiment of the present invention will be described with reference to the attached drawings. FIG. 1 is an exploded perspective view schematically showing a processing device according to this embodiment, and FIG. 2 is an enlarged view showing a part of the front side of the processing device in an enlarged manner.

In addition, in this embodiment, the processing device is exemplified by a rotary device that performs a rotary cutting (spinning) of a plate-shaped workpiece represented by a semiconductor wafer, but the processing device in the present invention may also be used. Grinding device, cutting device (cutting device), laser cutting device (laser Processing equipment) and so on.

As shown in FIG. 1, the processing device 2 of this embodiment includes a cuboid-shaped device base 4. A long rectangular opening 4a is formed on the upper surface of the device base 4 in the front-rear direction (X-axis direction).

Inside this opening 4a are disposed a horizontal moving table (not shown), a horizontal moving mechanism (not shown) that moves the horizontal moving table in the front-rear direction, and a dustproof and drip-proof cover 6 covering the horizontal moving mechanism.

Above the horizontal moving table, a work clamping table (holding unit) 8 for holding and holding the workpiece 11 is provided. The work clamp table 8 is also moved in the front-rear direction together with the horizontal moving table by the above-mentioned horizontal moving mechanism.

The processed object 11 is, for example, a rectangular semiconductor wafer, and bumps (not shown) made of metal or the like are arranged on the upper surface side. The processing device 2 of the present embodiment is used in, for example, the turning processing of this bump. However, the workpiece 11 is not limited to this.

The rectangular upper surface of the work table 8 is a holding surface 8 a for attracting and holding the workpiece 11. The holding surface 8a is connected to a suction source (not shown) through a flow path (not shown) formed inside the work clamp 8. By placing the workpiece 11 on the holding surface 8 a and applying the negative pressure of the suction source, the workpiece 11 can be sucked and held by the work clamp 8.

A gate-shaped support structure 10 is erected above the side after the opening 4a. A turning unit 14 (processing unit) is provided in front of the support structure 10 through the moving mechanism 12. The turning unit 14 includes a main shaft (not shown) constituting a rotation axis substantially parallel to the vertical direction (Z-axis direction).

A rotary wheel (rotating tool) 16 is attached to a lower end portion of the main shaft. Spin The cutting wheel 16 includes a wheel base formed of a metal material such as aluminum or stainless steel. A blade (cutting edge) made of diamond or the like is fixed to the lower surface of the wheel base.

A rotating mechanism (not shown) such as a motor is connected to the upper end side of the main shaft, and the turning wheel 16 is rotated by a rotating force transmitted from the rotating mechanism. The rotary wheel 16 is moved in the left-right direction (the Y-axis direction) and the vertical direction by the moving mechanism 12 described above.

For example, the blade of the rotary wheel 16 is positioned at a height contacting the workpiece 11 sucked and held by the work clamp table 8, and the work clamp table 8 is moved from the front to the rear while the rotary wheel 16 is rotated. The upper surface side of the workpiece 11 can be turned.

A device frame 18 is disposed at a position that surrounds the device base 4, the work table 8, and the turning unit 14. The device frame 18 includes a frame body 22 composed of a plurality of frame materials 20, and a plurality of frame leg portions 24 fixed to the bottom of the frame body 22. The device frame 18 can stand alone by the frame leg portion 24.

To the rear of the upper part of the device frame 18, a storage box 26 for accommodating electric components, a fan for suction and exhaust (a component that becomes a source of vibration generation), and the like are fixed. As described above, by disposing the electric components and the like (the storage box 26) above, the footprint of the processing device 2 can be reduced.

As shown in FIG. 2, a vibration-proof member 28 made of a material such as rubber is fixed to the inside of the frame leg portion 24 by a fixing tool 30. The device base 4 and the device frame 18 are in contact with each other through this vibration-proof member 28.

Thereby, for example, the vibration generated by the fan of the storage box 26 is absorbed by the vibration-proof member 28 and hardly propagates to the device base 4. Also, because of independence Since the device base 4 and the device frame 18 which are erected are in contact with each other through the vibration-proof member 28, the positional relationship can be appropriately maintained. Furthermore, the device base 4 can stand alone by the base leg portion 4b fixed to the bottom.

Further, an opening 24 a is formed in the frame leg portion 24 adjacent to the vibration-proof member 28 and the fixture 30. On the other hand, the device base 4 is provided with a screw hole 4c corresponding to the opening 24a. By fixing the screw (fixing member) 32 to the screw hole 4c through the opening 24a, the device frame 18 can be firmly fixed to the device base 4.

This screw 32 is attached when, for example, the processing device 2 is moved or transported. In this manner, as long as the device base 4 and the device frame 18 are fixed with screws 32, the processing device 2 can be moved and transported while maintaining the positional relationship between the device base 4 and the device frame 18. Moreover, the screw 32 is removed after the processing device 2 is set.

As described above, in the processing device 2 of this embodiment, the device base 4 on which the work clamp 2 (holding unit) and the turning unit (processing unit) 14 are arranged, and the support fan (which becomes a source of vibration generation) Parts) of the device frame 18 are independently and erected, and are in contact with each other through the anti-vibration member 28. Therefore, the vibration generated by the fan is absorbed by the anti-vibration member 28, and hardly propagates to the device base 4. According to this, it is possible to reduce the processing influence due to vibration.

In addition, this invention is not limited to the description of the said embodiment, It can implement various changes. For example, in the above-mentioned embodiment, although it is assumed that the suction and exhaust fan is used as a vibration generating source, the vibration is generated. The source parts are not limited to this.

In the above-mentioned embodiment, although the vibration-proof member 28 is fixed to the frame leg portion 24, the vibration-proof member 28 may be fixed to any position of the frame material 20. Similarly, an opening may be formed at an arbitrary position of the frame material 20, and the screw (fixing member) 32 may be fixed.

In addition, the configuration, method, and the like of the above embodiments can be appropriately modified and implemented as long as they do not depart from the purpose of the present invention.

Claims (2)

A processing device is characterized by comprising: a holding component for holding a processed object; a processing component for processing a processed object; a device base provided with the holding component and the processing component; and the device base and the holding component And a device frame surrounded by the periphery of the processing component and supporting the parts that will be sources of vibration, the device base and the device frame are independently and erected, and are in contact with each other through the vibration-proof member to maintain the mutual position Relationship, and the vibration-proof member absorbs the vibration generated by the part. The processing device according to claim 1, wherein the device frame can be fixed to the device base through a detachable fixing member.