TWI646335B - Guide board, manufacturing method thereof, and probe head having the same - Google Patents

Abstract

The present disclosure provides a leader plate, a method of manufacturing the same, and a probe head having the same. The guiding plate comprises: a carrier plate comprising at least one opening; and a micro hole guiding plate connected to the carrier plate and assembled at the position of the at least one opening of the carrier plate, wherein the micro hole guiding plate comprises a plurality of One opening, and each opening is for assembly corresponding to a probe.

Description

Positioning plate, manufacturing method thereof and probe head having the same

The present disclosure relates to a aligning plate and a method of manufacturing the same, and more particularly to a directional plate using a multi-plate assembly structure and a probe head having the same.

The probe head has a plurality of guide plates for holding a plurality of probes and providing a mechanism for consistent actuation. The existing single-plate guide plates are integrally formed and are all made of a single inorganic insulating material. In order to make the positioner sufficiently rigid, most of the materials of the commercially available guide plates are tantalum nitride.

The price of tantalum nitride material is too high, and the conventional sintering method cannot meet the quality requirements. Therefore, in the manufacturing process, special sintering methods, such as discharge plasma sintering, are required. Moreover, tantalum nitride must be processed by grinding to a desired size and thickness after sintering into a block. Since the conventional pad is a single structure, as the pad position increases and the requirements for multi-die wafer synchronization testing are met, the area of the pad will increase as the number of probes increases. However, as the size of the leader plate is larger, the manufacturing price is also more expensive. In particular, it is difficult to grind a large-sized (for example, 12 Å) tantalum nitride substrate by the prior art, and the processing quality is difficult to control within the required specifications, except that the polishing machine is difficult to manufacture. In addition, in order to successfully form tiny holes in the guide plate, the processing conditions are limited to femtosecond lasers that require short pulses. There is a certain failure rate in technology, so if the hole processing fails, the entire guide plate will be scrapped. All of the above limitations will limit the design and application of the guide plate. As the size of the guide plate increases, the processing difficulty, material cost, and processing time will increase, which will result in high manufacturing cost and influence on the guide. Board development.

In view of this, it is necessary to propose a guide plate for assembly on the probe head to solve the problems in the prior art.

In order to solve the above problems of the prior art, the purpose of the present disclosure is to provide a guiding plate and a probe head having the same, wherein the guiding plate is a combined structure of multiple plates, and suitable materials are used according to requirements. And the processing method, thereby solving the problem of manufacturing difficulty and high cost of the large-sized guide plate.

In order to achieve the above object, the present disclosure provides a guiding plate for a wafer measuring probe head, comprising: a carrier plate including at least one opening; and a micro hole guiding plate connected to the carrier plate and assembled At a position of the at least one opening of the carrier, wherein the micro-pore plate comprises a plurality of openings, and each opening is for assembly corresponding to a probe.

In one of the preferred embodiments of the present disclosure, the micropore guide plate and the carrier plate are made of different materials.

In a preferred embodiment of the present disclosure, the microporous leader plate and the material of the carrier plate comprise ceramic, metal, glass, or sapphire.

In a preferred embodiment of the present disclosure, the bezel further includes an adhesive layer disposed between the carrier and the microvia, for bonding the microvia and the carrier board.

The present disclosure also provides a probe head for wafer measurement, comprising: a plurality of probes a pin; at least one of the guide plates, comprising: a carrier plate including at least one opening; and a microporous leader plate coupled to the carrier plate and assembled at the position of the at least one opening of the carrier plate, wherein the microvia The director plate includes a plurality of openings, and each of the openings is for assembly corresponding to one of the plurality of probes.

In a preferred embodiment of the present disclosure, the bezel further includes an adhesive layer disposed between the carrier and the microvia, for bonding the microvia and the carrier board.

The present disclosure also provides a method of fabricating a bead for a wafer measurement probe head, the method comprising: providing a carrier, wherein the carrier includes at least one opening; and providing a microvia guide a plate, wherein the micropore guide plate comprises a plurality of openings, and each of the openings is for assembly corresponding to a probe; and connecting the carrier plate and the micropore guide plate, wherein the micropore guide plate And assembled at the position of the at least one opening of the carrier.

In one of the preferred embodiments of the present disclosure, the micropore plate is assembled on the carrier in an adhesive manner.

In a preferred embodiment of the present disclosure, the method for forming the plurality of openings of the micropore plate includes laser perforation, laser modified etching perforation, ultraviolet light modified etching perforation, or plasma perforation processing. law.

Compared to the prior art, the present disclosure is constructed by making the positioner of the probe head separate from the non-micropore area and then combining the multiple sheets. In this way, separately produced panels can be selected according to their respective needs, and appropriate processing methods can be selected to achieve the most advantageous production method, thereby increasing production yield and reducing production costs.

10‧‧‧guide board

11‧‧‧ Carrier Board

110‧‧‧ first opening

111‧‧‧ second opening

12‧‧‧First micropore guide

121‧‧‧First opening

13‧‧‧Second micropore guide

131‧‧‧Second opening

2‧‧‧Probe head

21‧‧‧First Spacer

22‧‧‧First leader board

221‧‧‧ first carrier

2210‧‧‧ first opening

222‧‧‧First micropore guide

2220‧‧‧First opening

23‧‧‧Second spacer

24‧‧‧Second Guide Plate

241‧‧‧Second carrier

2410‧‧‧second opening

242‧‧‧Second micropore guide

2420‧‧‧Second opening

25‧‧‧Adhesive layer

26‧‧‧Adhesive layer

27‧‧‧ probe

S1~S3‧‧‧ steps

1 is a schematic view showing the structure of a preferred embodiment of the present disclosure; FIG. 2 is a flow chart showing the manufacture of the first embodiment; and FIG. 3 is a view showing the probe head of the preferred embodiment of the present disclosure. The exploded view of the part; and Figure 4 shows a schematic cross-sectional view of the probe head of Figure 3.

The above and other objects, features, and advantages of the present invention will become more apparent and understood.

Referring to FIG. 1 and FIG. 2, FIG. 1 is a schematic structural view of a preferred embodiment of the present disclosure, and FIG. 2 is a flow chart showing the manufacturing of the first embodiment. The leader plate 10 is a part of the probe head for wafer measurement, and includes a carrier 11, a first micro-pore plate 12, and a second micro-pore plate 13. In the manufacture of the leader plate 10, first, in step S1, the carrier plate 11 is provided, wherein the carrier plate 11 is internally provided with a first opening 110 and a second opening 111 (corresponding to the dotted line range of Fig. 1). Optionally, an assembly hole or a registration hole for assembling corresponding to another component may be disposed on the carrier board 11. The material of the carrier 11 may be selected from metals, ceramics (including tantalum nitride), sapphire, or glass. It should be noted that since the carrier 11 occupies a larger area of the spacer 10, the material selection loading plate 11 can be used as compared with the first micro-pore plate 12 and the second micro-pore plate 13 The material is relatively inexpensive and easy to process, so that the manufacturing cost of the entire positioning plate 10 can be effectively reduced.

As shown in FIG. 1 and FIG. 2, next, step S2 is performed to provide a first micropore guide plate 12 and a second micropore guide plate 13, wherein the first micropore guide plate 12 and the second micropore The guiding plate 13 is respectively provided with a plurality of first openings 121 and a plurality of second openings 131. The first opening 121 and the second opening 131 are for separating a plurality of probes inserted in the probe head from each other Therefore, the adjacent two probes are prevented from contacting each other to cause a short circuit or an abnormal signal. The material of the first micropore plate 12 and the second micropore plate 13 may be selected from metal, ceramic (including tantalum nitride), sapphire, or glass. Preferably, the first micropore guide plate 12 and the second micropore guide plate 13 can be processed using a substrate of a smaller size (e.g., less than 12 inches). It can be understood that, for small-area material processing, not only the processing machine is easily obtained, but also the maturity of the processing technology is high, and the first opening 121 and the second opening 131 can be effectively improved. Processing yield.

In order to meet the quality requirements of the probe head 10 of the probe head, the first aperture 121 and the second aperture 131 of the first micropore guide plate 12 and the second micropore guide plate 13 may be selected from femtosecond mines. The method of perforation is processed. Further, in order to reduce the processing time, in addition to femtosecond laser perforation, other processing methods such as laser modified etching perforation, ultraviolet light modified etching perforation, or plasma perforation may be used to accelerate the first micropore guide plate. The fabrication of 12 and the second micropore guide plate 13. For example, in the case of ultraviolet light-modified etching and perforation, when the first micro-pore plate 12 and the second micro-pore plate 13 are made of a photosensitive material, since the photosensitive material is present in the photosensitive material, After absorbing the ultraviolet light energy and heat-treating at a high temperature (for example, 600 degrees), crystallization is generated in the ultraviolet light irradiation region, so that the crystallization region and the amorphous region have tens of times the reaction rate difference under the etching of the chemical liquid, By using the chemical liquid etching method, a large number of micropores can be produced at one time, thereby effectively reducing the processing time. Moreover, the laser-modified etching perforation is a method of selecting another suitable substrate and changing the ultraviolet light into laser light. On the other hand, in the fabrication of the micropore guide plate of the present disclosure, a larger-sized substrate can be selected, and a plurality of micro-pore guide plates arranged in an array are simultaneously processed thereon, and then the hole state is excellent. Part, and then cut the part to obtain a single microporous lead with excellent opening quality Plates (such as first micropore guide plate 12 and second micropore guide plate 13). By means of batch production of a plurality of micropore guide plates, the production time of the position plate 10 can be effectively saved.

As shown in FIGS. 1 and 2, finally, step S3 is performed to connect the carrier 11, the first micro-pore plate 12, and the second micro-pore plate 13. The carrier 11, the first micro-pore plate 12, and the second micro-pore plate 13 are separate plates. The carrier board 11 is located in the non-micropore area of the guiding board 10, and the first micropore guiding board 12 and the second micropore guiding board 13 are located on the guiding board 10 as viewed from the whole of the guiding plate 10. The micropore region, wherein the first micropore plate 12 is assembled at the first opening 110 of the carrier 11 by precision bonding equipment, and the second microvia 13 is by precision bonding equipment. The position of the second opening 111 of the carrier 11 is assembled. Preferably, considering that the entire guide plate 10 has to be a thin plate member to facilitate its application, the carrier plate 11, the first micropore guide plate 12, and the second micropore guide plate 13 are attached. Bonded in a way. In this way, the carrier 11, the first micro-pore plate 12, and the second micro-pore plate 13 are separately manufactured, so that the materials can be selected according to the respective requirements, and an appropriate processing method can be selected. In order to achieve the most favorable production method, thereby increasing production yield and reducing production costs. On the other hand, since the carrier 11, the first micro-pore plate 12, and the second micro-pore plate 13 are plates which are formed independently of each other, there is no damage to the single plate during manufacture. As a result, the lead plate 10 is scrapped, thereby reducing material loss and manufacturing cost. Further, when the leader plate 10 having a large size (for example, 12 inches or more) is to be produced, the carrier plate 11 is preferably made of a metal material which is easy to process, has a good flatness, and is inexpensive. Moreover, a plurality of micropore guide plates can be placed relatively on the large-sized carrier plate 11. Thus, the size of the positioning plate 10 is not difficult to produce a large-sized specification due to limitations in material processing, and the probe head having a relatively large finished product size can be efficiently produced.

Please refer to FIG. 3 and FIG. 4, which shows a preferred embodiment of the present disclosure. The exploded view of the part of the needle 2, and Fig. 4 shows a schematic cross-sectional view of the probe head 2 of Fig. 3. It should be noted that, for clarity of representation, Figures 3 and 4 are not drawn to scale. The probe head 2 includes a first partitioning plate 21, a first guiding plate 22, a second spacing plate 23, a second guiding plate 24, and a plurality of probes 27. The probe head 2 is a mechanism for holding a plurality of probes 27 and providing consistent actuation during wafer measurement.

As shown in FIG. 3, the first guiding plate 22 includes a first carrier plate 221 and two first micro hole guiding plates 222, wherein the first carrier plate 221 is provided with two first micro hole guiding plates. The two first openings 2210 corresponding to the 222, and each of the first micropore guide plates 222 are provided with a plurality of first openings 2220 arranged in an array. The two first micropore guide plates 222 are respectively connected to the first guide plate 22 and disposed at positions corresponding to the two first openings 2210. Similarly, the second guiding plate 24 includes a second carrier plate 241 and two second micro hole guiding plates 242, wherein the second carrier plate 241 is provided with two corresponding to the two second micro hole guiding plates 242. The second openings 2410, and each of the second micropore guide plates 242 are provided with a plurality of second openings 2420 arranged in an array. The two second micropore guide plates 242 are respectively connected to the second guide plate 24 and disposed at positions corresponding to the two second openings 2410. It should be noted that in other different embodiments, the number of the guide plates, the number and arrangement of the openings on the carrier, the number and arrangement of the micro-pore plates, and the number of openings on the micro-pore plate The arrangement and the arrangement may vary depending on the actual application, and the present disclosure is not limited thereto.

As shown in FIG. 3, in order to allow the probes 27 to pass smoothly, the positions of the first spacer 21 and the second spacer 23 in the micropore regions corresponding to the first and second guide plates 22, 24, respectively Open with openings. And, the first partitioning plate 21 is for separating the first guiding plate 22 and the other element by a specific distance, and the second spacing plate 23 is for the first guiding plate 22 and the second guiding The bit plates 24 are separated by a specific distance. Moreover, as shown in FIG. 4, the first micropore guide plate 222 And each of the first opening 2220 and each of the second opening 2420 of the second micropore 242 allows only one probe 27 to pass, so that isolation between the spacer and the opening can be ensured. The adjacent two probes 27 are separated from each other for the purpose of contact.

As shown in FIG. 4 , an adhesive layer 25 is further disposed between the first carrier 221 and the first microvia guide 222 for bonding the first carrier 221 and the first microvia 222. Moreover, another adhesive layer 26 is further disposed between the second carrier 241 and the second microvia guide 242 for bonding the second carrier 241 and the second microvia 242. It can be understood that the first carrier 221 and the first micropore plate 222 are connected by adhesive, or the second carrier 241 and the second microvia 242 are connected to achieve the first guiding position. The distance between the plate 22 and the second guiding plate 24 is less than 25 mm, which further makes the probe head 2 as thin as a whole.

In summary, the present disclosure is constructed by making the positioner of the probe head separate from the non-microporous area and then combining the multiple pieces. In this way, separately produced panels can be selected according to their respective needs, and appropriate processing methods can be selected to achieve the most advantageous production method, thereby increasing production yield and reducing production costs. Moreover, since the micropore region and the non-micropore region of the guiding plate are plates which are formed independently of each other, the entire guiding plate is not scrapped due to damage of the single plate member, and the material can be reduced. Loss and production costs.

The above is only a preferred embodiment of the present disclosure, and it should be noted that those skilled in the art can also make several improvements and refinements without departing from the principles of the present disclosure. These improvements and refinements should also be considered as protected range.

Claims (12)

A guiding plate for a wafer measuring probe head, comprising: a carrier plate comprising at least one opening; and a micro hole guiding plate connected to the carrier plate and assembled on the at least one of the carrier plates a position of the opening, wherein the micro-pore plate comprises a plurality of openings, and each of the openings is for assembling with a probe, wherein the micro-pore plate is made of a photosensitive material, and the plurality of openings It is formed by etching the perforation with ultraviolet light. The guide plate of claim 1, wherein the microporous guide plate and the carrier plate are made of different materials. The guide plate of claim 1, wherein the microporous guide plate and the material of the carrier plate comprise ceramic, metal, glass, or sapphire. The guide plate of claim 1 further includes an adhesive layer disposed between the carrier plate and the micropore guide plate for bonding the micropore guide plate and the carrier plate. A probe head for wafer measurement, comprising: a plurality of probes; and at least one lead plate comprising: a carrier plate comprising at least one opening; and a micropore guide plate connected to the carrier plate And assembling at the position of the at least one opening of the carrier, wherein the micro-pore plate comprises a plurality of openings, and each opening is for assembling corresponding to one of the plurality of probes, Wherein the microporous position plate is made of a photosensitive material, and the plurality of openings are formed by etching and etching the ultraviolet light. A probe head for wafer measurement according to claim 5, wherein the micropore guide plate and the probe The carrier board is made of different materials. The probe head for wafer measurement according to claim 5, wherein the microporous guide plate and the material of the carrier plate comprise ceramic, metal, glass, or sapphire. The probe head for wafer measurement according to claim 5, wherein the guide plate further comprises an adhesive layer disposed between the carrier plate and the micropore guide plate for bonding the same. A micropore guide plate and the carrier plate. A method for manufacturing a guide plate for a wafer measurement probe head, the method for manufacturing the guide plate comprises: providing a carrier plate, wherein the carrier plate comprises at least one opening; providing a micropore guide a plate, wherein the microporous guide plate comprises a plurality of openings, and each of the openings is for assembling with a probe, wherein the microporous guide plate is made of a photosensitive material, and the plurality of openings are Forming an ultraviolet etched etched via; and connecting the carrier to the microvia, wherein the microvia is assembled at the at least one opening of the carrier. The method for manufacturing a guide plate according to claim 9, wherein the microporous guide plate is assembled on the carrier plate in an adhesive manner. The method for manufacturing a guide plate according to claim 9, wherein the microporous guide plate and the carrier plate are made of different materials. The method for manufacturing a guide plate according to claim 9, wherein the microporous guide plate and the material of the carrier plate comprise ceramic, metal, glass, or sapphire.