CN110470872A - Guide plate and its manufacturing method and probe with the guide plate - Google Patents
Guide plate and its manufacturing method and probe with the guide plate Download PDFInfo
- Publication number
- CN110470872A CN110470872A CN201810442838.4A CN201810442838A CN110470872A CN 110470872 A CN110470872 A CN 110470872A CN 201810442838 A CN201810442838 A CN 201810442838A CN 110470872 A CN110470872 A CN 110470872A
- Authority
- CN
- China
- Prior art keywords
- guide plate
- micropore
- support plate
- plate
- probe
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06733—Geometry aspects
- G01R1/06738—Geometry aspects related to tip portion
Abstract
This announcement provides a kind of guide plate and its manufacturing method and the probe with the guide plate.Guide plate includes: a support plate, includes at least one opening；And a micropore guide plate, the position of at least one opening described in the support plate is connect and is assembled in the support plate, wherein the micropore guide plate includes multiple apertures, and each aperture is assembled for corresponding with a probe.
Description
Technical field
This announcement is related to a kind of guide plate and its manufacturing method, more particularly to a kind of leading using more plate combination structures
Position plate and the probe with the guide plate.
Background technique
Probe (probe head) has multi-disc guide plate to the multiple probes of fixation and to provide consistency actuation
Mechanism.Existing single guide plate is integrally formed structures, and is all made of single kind of inorganic insulating material production.In order to make
Guide plate has enough rigidity, and the material of commercially available guide plate selects silicon nitride mostly.
The sintering processing on the high side and traditional of silicon nitride material is unable to satisfy its quality requirements, therefore is manufacturing
In the process, special sintering mode, such as discharge plasma sintering need to be used.Also, silicon nitride must be with grinding after sintering is blocking
Mode is machined to required size and thickness.Due to traditional guide plate be single structure, so that with wafer foot position increase and
In order to meet the needs of multiple grain wafer synchronism detection, the area of guide plate will increase with the quantity of probe and be become larger.However,
As the size of guide plate is bigger, manufacturing price is also more expensive.Particularly, current art is also difficult to large scale (such as 12
Inch) silicon nitride board carry out attrition process, in addition to grinder station production be not easy other than, processing quality, which is also difficult to control, to be wanted
In the specification asked.In addition, processing conditions, which is limited in, need to use short pulse in order to successfully form small hole on guide plate
Femtosecond laser carry out, there are certain failure rates for the technology, if in this way, hole processing failure then will lead to and entirely lead position
Plate is scrapped.Above-mentioned various limitations can all cause the design of guide plate and application to be limited to, and as the size of guide plate increases,
Its processing difficulties degree, material cost, process time all can with raising, in turn result in manufacturing cost it is high with influence guide plate
Development.
In view of this, it is necessary to propose it is a kind of for being assembled in the guide plate of probe, with solve exist in the prior art
The problem of.
Summary of the invention
To solve above-mentioned problem of the prior art, this announcements is designed to provide a kind of guide plate and leads position described in having
The probe of plate, wherein guide plate is the composite structure using more plates, and uses material appropriate and processing side according to demand
Method, so solve the problems, such as the manufacture of large-sized guide plate it is difficult with it is with high costs.
To reach above-mentioned purpose, this announcement provides a kind of guide plate, for the probe that wafer measures, includes: a support plate,
Include at least one opening；And a micropore guide plate, it is connect with the support plate and is assembled in described in the support plate at least one and opened
The position of mouth, wherein the micropore guide plate includes multiple apertures, and each aperture is for assembling corresponding with a probe.
In one of them preferred embodiment of this announcement, the micropore guide plate is using different materials from the support plate.
In one of them preferred embodiment of this announcement, the material of the micropore guide plate and the support plate includes ceramics, gold
Category, glass or sapphire.
In one of them preferred embodiment of this announcement, the guide plate also includes an adhered layer, setting the support plate with
Between the micropore guide plate, for being bonded the micropore guide plate and the support plate.
This announcement also provides a kind of probe measured for wafer, includes: multiple probes；An at least guide plate includes:
One support plate includes at least one opening；And a micropore guide plate, it connect and is assembled in described in the support plate extremely with the support plate
The position of a few opening, wherein the micropore guide plate includes multiple apertures, and each aperture be for the multiple spy
The corresponding assembling of one of needle probe.
In one of them preferred embodiment of this announcement, the guide plate also includes an adhered layer, setting the support plate with
Between the micropore guide plate, for being bonded the micropore guide plate and the support plate.
This announcement also provides the manufacturing method of guide plate, and the guide plate is used for the probe that wafer measures, and method includes:
A support plate is provided, wherein the support plate includes at least one opening；And a micropore guide plate is provided, wherein the micropore guide plate
Comprising multiple apertures, and each aperture is for assembling corresponding with a probe；And the connection support plate is led with the micropore
Position plate, wherein the micropore guide plate is assembled in the position of at least one opening of the support plate.
In one of them preferred embodiment of this announcement, the micropore guide plate is that the support plate is assembled in bonding way
On.
In one of them preferred embodiment of this announcement, the forming method of multiple apertures of the micropore guide plate includes laser
Perforation, laser modification etching and punching, ultraviolet light modification etching and punching or plasma perforation processing method.
Compared to prior art, this announcement is by being designed as the guide plate of probe by micro-porous area and non-micro-porous area
It is fabricated separately the structure of the then more plates of recombinant together.In this way, the plate being fabricated separately can carry out material according to respective demand
The selection of material, and selection are appropriately machined method, to reach best production method, and then increase production yield and reduce and give birth to
Produce cost.
Detailed description of the invention
Fig. 1 shows the structural schematic diagram of the guide plate of the preferred embodiment of this announcement；
Fig. 2 shows the manufacturing flow chart of Fig. 1 guide plate；
Fig. 3 shows the part explosive view of the probe of the preferred embodiment of this announcement；And
Fig. 4 shows the diagrammatic cross-section of the probe of Fig. 3.
Specific embodiment
In order to which the above-mentioned and other purposes of this announcement, feature, advantage can be clearer and more comprehensible, it is excellent that spy is hereafter lifted into this announcement
Embodiment is selected, and cooperates institute's accompanying drawings, is described in detail below.
Referring to Fig.1 and 2, Fig. 1 shows the structural schematic diagram of the guide plate 10 of the preferred embodiment of this announcement, Yi Jitu
The manufacturing flow chart of 2 display Fig. 1 guide plates.Guide plate 10 is the wherein some zero as the probe measured for wafer
Part, it includes support plate 11, the first micropore guide plate 12 and the second micropore guide plates 13.When manufacturing guide plate 10, firstly, step
Rapid S1 provides support plate 11, and the first opening 110 and the second 111 (dotted line models of corresponding diagram 1 of opening are wherein offered inside support plate 11
It encloses).Optionally, settable assembly hole or registration holes for assembling corresponding with another element on support plate 11.The material of support plate 11
It can be selected from metal, ceramics (comprising silicon nitride), sapphire or glass etc..It should be noted that since support plate 11 accounts for leading position
The area of 10 major part of plate, therefore the upper support plate 11 of material selection can be used and lead compared to the first micropore guide plate 12 and the second micropore
The relative low price and the material of handling ease of position plate 13 are made, can so be effectively reduced the whole manufacture of guide plate 10 at
This.
As depicted in figs. 1 and 2, then, step S2 is carried out, the first micropore guide plate 12 and the second micropore guide plate are provided
13, it is opened wherein the first micropore guide plate 12 and the second micropore guide plate 13 are respectively equipped with multiple first apertures 121 and multiple second
Hole 131.The multiple first aperture 121 and the second aperture 131 are that multiple probes for making to be inserted into probe divide each other
From, and then avoid adjacent two probe from being in contact with each other and cause short circuit or signal abnormal.First micropore guide plate 12 and the second micropore
The material of guide plate 13 can be selected from metal, ceramics (comprising silicon nitride), sapphire or glass etc..Preferably, the first micropore is led
The substrate of smaller size (being, for example, less than 12 inch) can be used to be processed for position plate 12 and the second micropore guide plate 13.It is understood that
It is that for the processing of the material of small area, not only machine table is easy to obtain, and the maturity of processing technology is also higher, into
And the processing yield of the multiple first aperture 121 and the second aperture 131 can be effectively improved.
In order to meet probe guide plate 10 quality requirements, the first micropore guide plate 12 and the second micropore guide plate 13
The multiple first aperture 121 and the second aperture 131 can be selected femtosecond laser perforation mode process.Further, in order to
The manufacturing process time is reduced, other than femtosecond laser perforation, laser modification etching and punching, ultraviolet light modification etching also can be used to wear
Other processing methods of hole or plasma perforation accelerate the production of the first micropore guide plate 12 and the second micropore guide plate 13.
For example, by taking ultraviolet light modifies etching and punching as an example, when the first micropore guide plate 12 and the second micropore guide plate 13 are to use
In the case where photosensitive material, due to having emulsion in photosensitive material, is absorbing UV energy and passing through high temperature (such as 600
Degree) heat treatment after, can ultraviolet light region generate crystallization so that crystal region and noncrystalline domain are under the etching of chemical liquid
There is the characteristic of the reaction rate differences of decades of times, whereby with chemical liquid etching mode, can once complete the production of a large amount of micropores,
And then efficiently reduce the manufacturing process time.Also, laser modification etching and punching as selects another substrate appropriate, and will be purple
The processing method that outer light is changed to laser light.On the other hand, make this announcement micropore guide plate when, can first select a size compared with
Big substrate, simultaneous processing makes multiple micropore guide plates arranged with array on it, and it is excellent then to choose hole state
Part, then cut that (such as the first micropore leads position to obtain aperture single a micropore guide plate best in quality to the part
Plate 12 and the second micropore guide plate 13).The mode of the multiple micropore guide plates of production batch whereby, can be effectively saved guide plate
10 production time.
As depicted in figs. 1 and 2, finally, carrying out step S3, connection support plate 11, the first micropore guide plate 12 and the second micropore
Guide plate 13.Support plate 11, the first micropore guide plate 12 and 13 three of the second micropore guide plate are plate independent of each other.To lead
On the whole, support plate 11 is that position is micro- in the non-micro-porous area of guide plate 10 and the first micropore guide plate 12 and second to position plate 10
Hole guide plate 13 is position in the micro-porous area of guide plate 10, wherein the first micropore guide plate 12 is by delicate joint equipment group
It mounted in the position of the first opening 110 of support plate 11 and the second micropore guide plate 13 is assembled in by delicate joint equipment
The position of second opening 111 of support plate 11.Preferably, it is contemplated that guide plate 10 is whole to be necessary for slim plate so that it is answered
With, therefore support plate 11, the first micropore guide plate 12 and 13 three of the second micropore guide plate are bonded by the way of fitting.In this way,
By support plate 11, the first micropore guide plate 12 and 13 three of the second micropore guide plate by the way of being fabricated separately, therefore can be according to respective
Demand carries out the selection of material, and selection is appropriately machined method, and to reach best production method, and then it is good to increase production
Rate and reduction production cost.On the other hand, due to 13 three of support plate 11, the first micropore guide plate 12 and the second micropore guide plate
For the plate formed independently of one another, therefore scrapping for guide plate 10 will not be led to because of the damage of single a plate in production, into
And the loss and cost of manufacture of material can be reduced.Furthermore, it is understood that for make with large scale (such as more than 12 inch)
When guide plate 10, metal material that support plate 11 preferably can be good and cheap using handling ease, flatness.Also, it is big
It is opposite on the support plate 11 of size to place more multiple micropore guide plates.In this way, the size of guide plate 10 would not add because of material
Limitation in work and be difficult to produce large-sized specification, and then can effectively produce the relatively large probe of finished size
Head.
Referring to figure 3. and Fig. 4, Fig. 3 show this announcement preferred embodiment probe 2 part explosive view and Fig. 4
Show the diagrammatic cross-section of the probe 2 of Fig. 3.It should be noted that in order to clearly show that, Fig. 3 and Fig. 4 not etc. are drawn with ratio
System.Probe 2 includes the first spacing board 21, the first guide plate 22, the second spacing board 23, the second guide plate 24, multiple probes 27.
Probe 2 is for fixing multiple probes 27 and providing the mechanism of consistency actuation in wafer measurement.
As shown in figure 3, the first guide plate 22 includes the first support plate 221 and two the first micropore guide plates 222, wherein first
Two first openings 2210 corresponding with two the first micropore guide plates 222 and every one first micropore are provided on support plate 221
Guide plate 222 is provided with multiple the first apertures 2220 arranged with array.Two the first micropore guide plates 222 are to be connected to
On first guide plate 22, and the position for corresponding to two first openings 2210 is set.Similarly, the second guide plate 24 includes the
Two support plates 241 and two the second micropore guide plates 242, wherein being provided on the second support plate 241 and two the second micropore guide plates
242 corresponding two second openings 2410 and every one second micropore guide plate 242 are provided with multiple with the second of array arrangement
Aperture 2420.Two the second micropore guide plates 242 are to be connected on the second guide plate 24, and be arranged and corresponding to two the
The position of two openings 2410.Opening number it should be noted that in other different embodiments, in the quantity of guide plate, support plate
The quantity of aperture of the amount with arrangement, the quantity of micropore guide plate and arrangement, on micropore guide plate and arrangement can be according to practical applications
And change, this announcement is not limited to this.
As shown in figure 3, the first spacing board 21 and the second spacing board 23 are right in order to allow the multiple probe 27 to pass through
The position of the micro-porous area of the first guide plate 22 and the second guide plate 24 is answered to offer opening respectively.Also, the first spacing board 21
It is for allowing both the first guide plate 22 and another element to be spaced a specific distance and the second spacing board 23 is for allowing
Both first guide plate 22 and the second guide plate 24 are spaced a specific distance.Also, as shown in figure 4, the first micropore guide plate
222 and second micropore guide plate 242 every one first aperture 2220 and every one second aperture 2420 only allow a probe 27
Pass through, so by being isolated between spacing board and aperture, can reach ensures that adjacent two probe 27 is separated from each other discontiguous mesh
's.
As shown in figure 4, also including adhered layer 25 between the first support plate 221 and the first micropore guide plate 222, for being bonded the
One support plate 221 and the first micropore guide plate 222.Also, also comprising another between the second support plate 241 and the second micropore guide plate 242
Adhered layer 26, for being bonded the second support plate 241 and the second micropore guide plate 242.It is understood that being connected by way of gluing
The first support plate 221 and the first micropore guide plate 222, or the second support plate 241 of connection and the second micropore guide plate 242 are connect, can reach
Make the first guide plate 22 and the second guide plate 24 between the two away from less than 25 millimeters, and then allows probe 2 that integrally there is slimming
Feature.
In conclusion this announcement is by making the guide plate of probe be designed as separately making micro-porous area and non-micro-porous area
Make the structure of the then more plates of recombinant together.In this way, the plate being fabricated separately can carry out the choosing of material according to respective demand
It selects, and selection is appropriately machined method, to reach best production method, and then increases production yield and be produced into reduction
This.Furthermore since the micro-porous area of guide plate and non-micro-porous area be the plate formed independently of one another, therefore will not be because on making
The damage of single a plate and lead to that guide plate is whole to be scrapped, and then the loss and cost of manufacture of material can be reduced.
The above is only the preferred embodiments of this announcement, it is noted that for one of ordinary skill in the art, is not departing from this
Under the premise of disclosing principle, several improvements and modifications can also be made, these improvements and modifications also should be regarded as the protection of this announcement
Range.
Claims (13)
1. a kind of guide plate, the probe that is measured for wafer, characterized by comprising:
One support plate includes at least one opening；And
One micropore guide plate connect with the support plate and is assembled in the position of at least one opening described in the support plate, wherein institute
Stating micropore guide plate includes multiple apertures, and each aperture is for assembling corresponding with a probe.
2. guide plate as claimed in claim 1, which is characterized in that the micropore guide plate is using different materials from the support plate
Material.
3. guide plate as claimed in claim 1, which is characterized in that the material of the micropore guide plate and the support plate include ceramics,
Metal, glass or sapphire.
4. guide plate as claimed in claim 1, which is characterized in that the guide plate further includes an adhered layer, is arranged described
Between support plate and the micropore guide plate, for being bonded the micropore guide plate and the support plate.
5. it is a kind of for wafer measure probe, characterized by comprising:
Multiple probes；And
An at least guide plate includes:
One support plate includes at least one opening；And
One micropore guide plate connect with the support plate and is assembled in the position of at least one opening described in the support plate, wherein institute
Stating micropore guide plate includes multiple apertures, and each aperture is for corresponding group of a probe therein with the multiple probe
Dress.
6. the probe measured as claimed in claim 5 for wafer, which is characterized in that the micropore guide plate is with the support plate
Using different materials.
7. the probe measured as claimed in claim 5 for wafer, which is characterized in that the micropore guide plate and the support plate
Material includes ceramics, metal, glass or sapphire.
8. the probe measured as claimed in claim 5 for wafer, which is characterized in that the guide plate also includes an adhered layer,
It is arranged between the support plate and the micropore guide plate, for being bonded the micropore guide plate and the support plate.
9. a kind of guide plate manufacturing method, the guide plate is used for the probe that wafer measures, which is characterized in that the guide plate
Manufacturing method includes:
A support plate is provided, wherein the support plate includes at least one opening；
A micropore guide plate is provided, wherein the micropore guide plate includes multiple apertures, and each aperture is for visiting with one
For should assemble；And
The support plate and the micropore guide plate are connected, wherein the micropore guide plate is assembled in described at least the one of the support plate
The position of opening.
10. guide plate manufacturing method as claimed in claim 9, which is characterized in that the micropore guide plate is assembled with bonding way
On the support plate.
11. guide plate manufacturing method as claimed in claim 9, which is characterized in that the micropore guide plate is to use with the support plate
Different materials.
12. guide plate manufacturing method as claimed in claim 9, which is characterized in that the material of the micropore guide plate and the support plate
Include ceramics, metal, glass or sapphire.
13. guide plate manufacturing method as claimed in claim 9, which is characterized in that the multiple aperture of the micropore guide plate
Forming method includes laser beam perforation, laser modification etching and punching, ultraviolet light modification etching and punching or plasma perforation processing method.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810442838.4A CN110470872A (en) | 2018-05-10 | 2018-05-10 | Guide plate and its manufacturing method and probe with the guide plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810442838.4A CN110470872A (en) | 2018-05-10 | 2018-05-10 | Guide plate and its manufacturing method and probe with the guide plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110470872A true CN110470872A (en) | 2019-11-19 |
Family
ID=68503925
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810442838.4A Pending CN110470872A (en) | 2018-05-10 | 2018-05-10 | Guide plate and its manufacturing method and probe with the guide plate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110470872A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1979177A (en) * | 2005-12-07 | 2007-06-13 | 旺矽科技股份有限公司 | Micro-hole guide with reinforcing structure |
| TW201009348A (en) * | 2008-08-13 | 2010-03-01 | Formfactor Inc | Probe head controlling mechanism for probe card assemblies |
| CN104198772A (en) * | 2014-08-28 | 2014-12-10 | 安拓锐高新测试技术（苏州）有限公司 | Embedded chip testing socket and manufacturing method thereof |
| CN107064575A (en) * | 2015-12-01 | 2017-08-18 | 旺矽科技股份有限公司 | Probe seat of vertical probe device |
-
2018
- 2018-05-10 CN CN201810442838.4A patent/CN110470872A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1979177A (en) * | 2005-12-07 | 2007-06-13 | 旺矽科技股份有限公司 | Micro-hole guide with reinforcing structure |
| TW201009348A (en) * | 2008-08-13 | 2010-03-01 | Formfactor Inc | Probe head controlling mechanism for probe card assemblies |
| CN104198772A (en) * | 2014-08-28 | 2014-12-10 | 安拓锐高新测试技术（苏州）有限公司 | Embedded chip testing socket and manufacturing method thereof |
| CN107064575A (en) * | 2015-12-01 | 2017-08-18 | 旺矽科技股份有限公司 | Probe seat of vertical probe device |
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Application publication date: 20191119 |