TWI645914B - 用於基板之化學機械研磨之後段清潔該等基板之刷具、用於對半導體晶圓之表面進行化學機械研磨後段清潔之方法、及用於對晶圓進行化學機械研磨後段清潔之圓柱形泡沫滾筒 - Google Patents

用於基板之化學機械研磨之後段清潔該等基板之刷具、用於對半導體晶圓之表面進行化學機械研磨後段清潔之方法、及用於對晶圓進行化學機械研磨後段清潔之圓柱形泡沫滾筒 Download PDF

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Publication number
TWI645914B
TWI645914B TW104143352A TW104143352A TWI645914B TW I645914 B TWI645914 B TW I645914B TW 104143352 A TW104143352 A TW 104143352A TW 104143352 A TW104143352 A TW 104143352A TW I645914 B TWI645914 B TW I645914B
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Taiwan
Prior art keywords
protrusions
edge
central
brush
projections
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TW104143352A
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English (en)
Chinese (zh)
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TW201615291A (zh
Inventor
克里斯多福 瓦歌
拉克許 辛
大衛 崔歐
艾瑞克 麥克納瑪拉
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美商恩特葛瑞斯股份有限公司
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Application filed by 美商恩特葛瑞斯股份有限公司 filed Critical 美商恩特葛瑞斯股份有限公司
Publication of TW201615291A publication Critical patent/TW201615291A/zh
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0412—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes

Landscapes

  • Cleaning Or Drying Semiconductors (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Brushes (AREA)
TW104143352A 2010-02-22 2011-02-22 用於基板之化學機械研磨之後段清潔該等基板之刷具、用於對半導體晶圓之表面進行化學機械研磨後段清潔之方法、及用於對晶圓進行化學機械研磨後段清潔之圓柱形泡沫滾筒 TWI645914B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US30658210P 2010-02-22 2010-02-22
US61/306,582 2010-02-22
US201061425644P 2010-12-21 2010-12-21
US61/425,644 2010-12-21

Publications (2)

Publication Number Publication Date
TW201615291A TW201615291A (zh) 2016-05-01
TWI645914B true TWI645914B (zh) 2019-01-01

Family

ID=44483614

Family Applications (2)

Application Number Title Priority Date Filing Date
TW104143352A TWI645914B (zh) 2010-02-22 2011-02-22 用於基板之化學機械研磨之後段清潔該等基板之刷具、用於對半導體晶圓之表面進行化學機械研磨後段清潔之方法、及用於對晶圓進行化學機械研磨後段清潔之圓柱形泡沫滾筒
TW100105743A TW201200256A (en) 2010-02-22 2011-02-22 Post-CMP cleaning brush

Family Applications After (1)

Application Number Title Priority Date Filing Date
TW100105743A TW201200256A (en) 2010-02-22 2011-02-22 Post-CMP cleaning brush

Country Status (7)

Country Link
US (1) US20130048018A1 (https=)
JP (1) JP5977175B2 (https=)
KR (1) KR20130038806A (https=)
CN (1) CN102792424A (https=)
SG (1) SG183419A1 (https=)
TW (2) TWI645914B (https=)
WO (1) WO2011103538A2 (https=)

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TWI286096B (en) 2003-08-08 2007-09-01 Entegris Inc Methods and materials for making a monolithic porous pad onto a rotatable base
US9202723B2 (en) 2011-11-29 2015-12-01 Illinois Tool Works, Inc. Brush with cantilevered nodules
US8778087B2 (en) * 2012-04-03 2014-07-15 Illinois Tool Works Inc. Conical sponge brush for cleaning semiconductor wafers
US9704729B2 (en) * 2013-06-13 2017-07-11 K.C. Tech Co., Ltd. Substrate cleaning apparatus and method and brush assembly used therein
JP5685631B2 (ja) * 2013-09-04 2015-03-18 日東電工株式会社 光学フィルムの製造方法
US10790167B2 (en) * 2014-02-20 2020-09-29 Entegris, Inc. Nodule ratios for targeted enhanced cleaning performance
JP6366544B2 (ja) 2014-07-04 2018-08-01 株式会社荏原製作所 洗浄装置及びロール洗浄部材
US9873180B2 (en) 2014-10-17 2018-01-23 Applied Materials, Inc. CMP pad construction with composite material properties using additive manufacturing processes
US9776361B2 (en) 2014-10-17 2017-10-03 Applied Materials, Inc. Polishing articles and integrated system and methods for manufacturing chemical mechanical polishing articles
US10875153B2 (en) 2014-10-17 2020-12-29 Applied Materials, Inc. Advanced polishing pad materials and formulations
US11745302B2 (en) 2014-10-17 2023-09-05 Applied Materials, Inc. Methods and precursor formulations for forming advanced polishing pads by use of an additive manufacturing process
SG11201703114QA (en) 2014-10-17 2017-06-29 Applied Materials Inc Cmp pad construction with composite material properties using additive manufacturing processes
CN107078046B (zh) * 2014-10-31 2020-11-27 株式会社荏原制作所 基板清洗辊、基板清洗装置及基板清洗方法
US10271636B2 (en) * 2014-11-10 2019-04-30 Illinois Tool Works Inc. Archimedes brush for semiconductor cleaning
JP7018768B2 (ja) * 2014-11-24 2022-02-14 コーニング インコーポレイテッド 基板表面洗浄方法および装置
US9748090B2 (en) 2015-01-22 2017-08-29 Toshiba Memory Corporation Semiconductor manufacturing apparatus and manufacturing method of semiconductor device
JP6482891B2 (ja) * 2015-02-16 2019-03-13 日東電工株式会社 光学フィルムの製造方法
KR20230169424A (ko) 2015-10-30 2023-12-15 어플라이드 머티어리얼스, 인코포레이티드 원하는 제타 전위를 가진 연마 제품을 형성하는 장치 및 방법
US10593574B2 (en) 2015-11-06 2020-03-17 Applied Materials, Inc. Techniques for combining CMP process tracking data with 3D printed CMP consumables
US10391605B2 (en) 2016-01-19 2019-08-27 Applied Materials, Inc. Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process
CN106583295B (zh) * 2016-12-23 2019-05-17 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） Cmp后清洗设备清洗刷同心卡接结构及使用方法
US11471999B2 (en) 2017-07-26 2022-10-18 Applied Materials, Inc. Integrated abrasive polishing pads and manufacturing methods
WO2019032286A1 (en) 2017-08-07 2019-02-14 Applied Materials, Inc. ABRASIVE DISTRIBUTION POLISHING PADS AND METHODS OF MAKING SAME
KR20210042171A (ko) 2018-09-04 2021-04-16 어플라이드 머티어리얼스, 인코포레이티드 진보한 폴리싱 패드들을 위한 제형들
US10758946B2 (en) * 2019-01-23 2020-09-01 Tung An Development Ltd. Device of cleaning brush
US11694910B2 (en) * 2019-09-10 2023-07-04 Illinois Tool Works Inc. Brush with non-constant nodule density
US11470956B2 (en) 2020-03-06 2022-10-18 Applied Materials, Inc. Brush, method of forming a brush, and structure embodied in a machine readable medium used in a design process
CN113967888B (zh) * 2020-07-23 2022-06-24 长鑫存储技术有限公司 海绵刷的更换工具和安装方法、半导体化学机械抛光设备
WO2022115671A1 (en) * 2020-11-30 2022-06-02 Araca, Inc. Brush for cleaning a substrate
US11878389B2 (en) 2021-02-10 2024-01-23 Applied Materials, Inc. Structures formed using an additive manufacturing process for regenerating surface texture in situ
KR102727237B1 (ko) * 2021-08-20 2024-11-08 주식회사 브러쉬텍 웨이퍼 베벨 영역 세정용 브러쉬
US20230178360A1 (en) * 2021-12-06 2023-06-08 Tung An Development Ltd. Device Having Cleaning Bodies
CN115365183B (zh) * 2022-08-09 2024-05-17 重庆雄达铨瑛电子有限公司 一种铝箔化成自动生产线的清洗机构
TWI873778B (zh) * 2023-08-11 2025-02-21 碩晨生醫股份有限公司 清潔滾輪軸心

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US6299698B1 (en) * 1998-07-10 2001-10-09 Applied Materials, Inc. Wafer edge scrubber and method
JP2001358110A (ja) * 2000-06-13 2001-12-26 Hitachi Ltd スクラブ洗浄装置およびそれを用いた半導体装置の製造方法
US6616516B1 (en) * 2001-12-13 2003-09-09 Lam Research Corporation Method and apparatus for asymmetric processing of front side and back side of semiconductor substrates

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JP3403108B2 (ja) * 1999-02-26 2003-05-06 アイオン株式会社 洗浄用スポンジローラ
US6502273B1 (en) * 1996-11-08 2003-01-07 Kanebo, Ltd. Cleaning sponge roller
JP2009066527A (ja) * 2007-09-13 2009-04-02 Nec Electronics Corp 洗浄用ローラおよび洗浄装置

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JPH1034091A (ja) * 1996-07-19 1998-02-10 Kanebo Ltd 洗浄用ローラ
US6299698B1 (en) * 1998-07-10 2001-10-09 Applied Materials, Inc. Wafer edge scrubber and method
JP2001358110A (ja) * 2000-06-13 2001-12-26 Hitachi Ltd スクラブ洗浄装置およびそれを用いた半導体装置の製造方法
US6616516B1 (en) * 2001-12-13 2003-09-09 Lam Research Corporation Method and apparatus for asymmetric processing of front side and back side of semiconductor substrates

Also Published As

Publication number Publication date
SG183419A1 (en) 2012-09-27
TW201200256A (en) 2012-01-01
US20130048018A1 (en) 2013-02-28
CN102792424A (zh) 2012-11-21
JP2013520803A (ja) 2013-06-06
TW201615291A (zh) 2016-05-01
KR20130038806A (ko) 2013-04-18
WO2011103538A2 (en) 2011-08-25
JP5977175B2 (ja) 2016-08-24
WO2011103538A3 (en) 2011-11-17

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