TWI645389B - Flexible electronic device - Google Patents

Abstract

A flexible electronic device includes a flexible substrate and a conductive structure. The flexible substrate has a bendable region and an element region in contact with the bendable region. The conductive structure is located on the flexible substrate and extends from the element region to the bendable region in an extending direction. The conductive structure includes a plurality of openings located on the bendable area, and the projection areas projected by the openings on the projection surface partially overlap on a projection plane parallel to the extending direction.

Description

Flexible electronic device

The present invention relates to an electronic device, and more particularly, to a flexible electronic device.

With the rapid development of electronic technology, electronic products are constantly being introduced. In order to be applicable to different fields, electronic products have gradually gained attention due to their flexibility, thinness, and unrestricted appearance. In other words, electronic products are gradually required to have different appearances according to different application methods and application environments, and often need to be flexed or bent due to user needs.

However, when a flexible electronic product is in a flexed or bent state, it may cause structural breaks due to hard cases, which may further cause internal circuit breaks. Therefore, how to make the flexible electronic products still have good yield and reliability has become an urgent problem to be solved.

The invention provides a flexible electronic device, which has a better yield or reliability.

The flexible electronic device of the present invention includes a flexible substrate and a conductive structure. The flexible substrate has a bendable region and an element region in contact with the bendable region. The conductive structure is located on the flexible substrate and extends from the element region to the bendable region in an extending direction. The conductive structure includes a plurality of openings located on the bendable area, and the projection areas projected by the openings on the projection surface partially overlap on a projection plane parallel to the extending direction.

The flexible electronic device of the present invention includes a flexible substrate and a conductive structure. The flexible substrate has a bendable region and an element region in contact with the bendable region. The conductive structure is located on the flexible substrate and extends from the element area to the bendable area in an extending direction. Part of the conductive structure located in the bendable area has a plurality of conductive areas separated from each other on an arbitrary cross section. The normal direction is substantially the same as the extension direction.

The flexible electronic device of the present invention includes a flexible conductive structure. The flexible conductive structure has an extending direction. The flexible conductive structure includes a plurality of openings, and on a projection plane parallel to the extending direction, the projections are projected on the projection area of the projection plane to form a continuous pattern.

The flexible electronic device of the present invention includes a flexible conductive structure. The flexible conductive structure has an extending direction, wherein the flexible conductive structure has a plurality of conductive regions on any cross section perpendicular to the extending direction, and the plurality of conductive regions are separated from each other.

Based on the above, in a flexible electronic device provided by the present invention, the conductive structure has a plurality of openings, and on a projection plane parallel to the extending direction, the projection areas projected on the projection plane by the openings partially overlap so that The conductive structure may have a plurality of conductive regions separated from each other on a cross section whose normal direction is the same as the extension direction. Therefore, the possibility of disconnection of the conductive structure can be reduced, and the yield or reliability of the flexible electronic device can be improved.

In order to make the above features and advantages of the present invention more comprehensible, embodiments are hereinafter described in detail with reference to the accompanying drawings.

FIG. 1A is a schematic cross-sectional view of a flexible electronic device according to a first embodiment of the present invention. FIG. 1B is a schematic cross-sectional view of a flexible electronic device having a corresponding flexed state when subjected to an external force according to a first embodiment of the present invention. FIG. 1C is a schematic top view of a portion of a flexible electronic device according to a first embodiment of the present invention. Fig. 1D is a schematic cross-sectional view taken along the line A-A 'in Fig. 1C. Fig. 1E is a schematic cross-sectional view taken along the line B-B 'in Fig. 1C. Specifically, for clarity, FIG. 1C to FIG. 1D only illustrate a part of the conductive structure located in the bendable area A1.

Please refer to FIGS. 1A to 1C at the same time. In this embodiment, the flexible electronic device 100 may include a flexible substrate 110, a buffer layer 111, an electronic component 112, and a conductive structure 120. The flexible substrate 110 has a bendable area A1, a device area A2, and a connection area A3. The device area A2 and the connection area A3 are separated from each other, and the bendable area A1 is connected between the device area A2 and the connection area A3. . The buffer layer 111 covers the flexible substrate 110, the electronic component 112 and the conductive structure 120 are disposed on the buffer layer 111, and the electronic component 112 can be electrically connected to the conductive structure 120.

The material of the flexible substrate 110 is, for example, polyimide (PI) or other flexible materials, so that the flexible electronic device 100 having the flexible substrate 110 can be flexed correspondingly when subjected to an external force. Or bent. For example, as shown in FIG. 1A and FIG. 1B, when an end of the flexible electronic device 100 in FIG. 1A is subjected to an external force perpendicular to the direction of the flexible substrate 110 (such as the Z direction in FIG. 1A), it can Part of the flexible substrate 110 (eg, the bendable area A1 of the flexible substrate 110) is flexed or bent correspondingly, and the buffer layer 111 and the conductive structure 120 located on the bendable area A1 may also have Corresponding flexure or bending is to constitute a flexible electronic device 100 'having a flexed or bent state as shown in FIG. 1B.

Generally speaking, in the design of the flexible electronic device 100, the configuration of the component or the film layer can be used so that the bending or bending deformation generated by the flexible electronic device 100 can be concentrated in a partial area (such as : Bendable area A1 of the flexible substrate 110). For example, compared to the buffer layer 111b located on the element area A2 and / or the connection area A3 of the flexible substrate 110, the buffer layer 111a located on the bendable area A1 of the flexible substrate 110 may have The thickness is thin, so that the bendable area A1 of the flexible substrate 110 may have a larger deflection or bend than the element area A2 and / or the connection area A3. In addition, on the bendable area A1 of the flexible substrate 110, the conductive structure 120 may also be designed in this embodiment or any of the following embodiments to reduce the exposure of the conductive structure 120 to bending or bending. Stress, which reduces the possibility of disconnection and disconnection. In some feasible embodiments, the conductive structure 120 may be directly covered on the flexible substrate 110 on the bendable area A1 of the flexible substrate 110.

The buffer layer 111 may be made of an inorganic material and / or an organic material. The aforementioned inorganic material may be silicon oxide (SiO _x ), silicon nitride (SiN _x ), silicon oxynitride (SiON), aluminum oxide (AlO _x ), aluminum nitride (AlON), other similar materials, or the above materials. combination. The foregoing organic material may be polysilazane, other similar polymer materials, or a combination of the foregoing materials. Generally speaking, the buffer layer 111 can be made of a flexible material with good insulation and / or water and gas blocking capabilities, so as to improve the reliability and flexibility of the flexible electronic device 100.

In this embodiment, the electronic component 112 is a transistor having a source S, a drain D, a gate G, a channel layer CH, and a gate dielectric layer GI as an example. The electronic component 112 may be located on the flexible substrate 110. On the element region A2, but the present invention is not limited thereto. In other embodiments, the electronic component 112 may be other similar active or passive components, and the electronic component 112 may be located on the element area A2 and / or the bendable area A1 of the flexible substrate 110. For example, the electronic element 112 may be an organic light emitting element, and the light emitting region of the organic light emitting element may be located on the element region A2 and / or the bendable region A1 of the flexible substrate 110.

In this embodiment, the conductive structure 120 may pass through the bendable area A1 so that the wiring layers 113 located at opposite ends of the bendable area A1 (ie, the wiring layer 113a located at one end of the electronic component 112 and the electronic component 112 One end of the circuit layer 113 b) can be electrically connected to each other by passing through the bendable area A1 conductive structure 120. In other words, the conductive structure 120 located on the flexible substrate 110 may extend from the device region A2 to the bendable region A1 along an extending direction 121. In terms of structure, the extending direction 121 of the conductive structure 120 is substantially a direction formed by the conductive structure 120 connecting the opposite ends of the circuit layer 113 respectively. In terms of circuits, the extending direction 121 of the conductive structure 120 may be a signal transmission direction, that is, a current / electron flow direction 122 transmitted through the conductive structure 120. For example, as shown in FIG. 1A and FIG. 1B, the conductive structure 120 may be electrically connected to the electronic component 112 through the circuit layer 113 in the element area A2 and along the extending direction 121 (such as the roughly The X direction or the substantially current / electron flow direction 122) in FIG. 1C extends to the bendable area A1.

Generally speaking, based on considerations of conductivity, ductility, and / or flexibility, the conductive structure 120 may use a metal material, but the present invention is not limited thereto. In other embodiments, the conductive structure 120 may also use graphene, carbon nanotubes, or other similar flexible conductive materials. In this embodiment, in a direction 121 perpendicular to the extending direction of the conductive structure 120, the wire width 123 of the wire may be less than 10 micrometers (μm). In other words, the opening distance 125 between the two adjacent openings 124 in the conductive structure 120 may be less than 10 microns. In this way, the fracture toughness of the conductive structure 120 can be improved and the possibility of fracture can be reduced.

Please refer to FIG. 1A to FIG. 1E simultaneously. In this embodiment, the conductive structure 120 may include a mesh structure composed of a plurality of wires, and some of the wires are parallel to each other. For example, in this embodiment, the plurality of wires may include a plurality of first wire portions 126a parallel to each other, a plurality of second wire portions 126b parallel to each other, and a plurality of third wire portions 126c parallel to each other. The first lead portion 126a, the second lead portion 126b, and the third lead portion 126c are not parallel to each other, and different first lead portions 126a, second lead portions 126b, and third lead portions 126c may be connected to different points, respectively. To form a mesh structure as shown in FIG. 1C. In other words, in the conductive structure 120, a plurality of openings 124 having a closed contour can be formed by the first and second conductive portions 126a, 126b, and 126c adjacent to and connected to each other, and the openings 124 is located on the bendable area A1 of the flexible substrate 110. In this embodiment, the outlines of the openings 124 have substantially the same shape, and two adjacent openings 124 are staggered in a point symmetry manner, but the present invention is not limited thereto.

In this embodiment, on a projection surface 130 parallel to the extending direction 121 of the conductive structure 120, the projection area 131 projected on the projection surface 130 by the opening 124 partially overlaps and does not completely overlap. Specifically, as shown in FIG. 1C, taking the state when the flexible electronic device 100 is not subjected to an external force as an example, the flexible substrate 110 may be located on an XY plane (ie, a paper surface) formed by the X direction and the Y direction. The extending direction 121 of the conductive structure 120 may be substantially the X direction, and the projection surface 130 may be located on an XZ plane formed by the X direction and the Z direction. In FIG. 1C, the projection areas 131 projected on the projection surface 130 by two adjacent openings 124 partially overlap and do not completely overlap, and the projection areas 131 projected on the projection surface 130 by these openings 124 form a continuous pattern, and the aforementioned The continuous pattern passes through the bendable area A1. It should be noted that, in the embodiment shown in FIG. 1C, the projection surface 130 is a plane as an example, and the present invention is not limited thereto. In other embodiments, the projection surface 130 may also be a curved surface or an arc surface, as long as the normal vector of any point on the projection surface 130 is orthogonal to the vector of the extension direction 121.

As shown in FIG. 1C to FIG. 1E, the conductive structure 120 located in the bendable region A1 may have a plurality of conductive regions 140 separated from each other on the aforementioned cross section in any section perpendicular to the extending direction 121 of the conductive structure 120. For example, as shown in FIG. 1D, in a region where two adjacent openings 124 are not overlapped, the conductive structure 120 may have a conductive region 140 composed of two first wire portions 126 a separated from each other in a cross section. Moreover, as shown in FIG. 1E, in a region where two adjacent openings 124 partially overlap, the conductive structure 120 may have a cross section formed by two first wire portions 126 a and one second wire portion 126 b separated from each other. Conductive region 140. The stress applied to the structure will be concentrated in the discontinuous (non-smooth) areas of the geometric structure. Compared with other parts of the mesh structure, these areas are more likely to fracture due to the concentration of stress, and the direction of the fracture crack is roughly The extending direction 121 is perpendicular to the conductive structure 120. Generally speaking, the discontinuous regions of the network structure are mostly near the intersection 150. Therefore, each intersection point 150 can be made by the staggered openings 124 (eg, the intersection point 150b of the first wire portion 126a and the second wire portion 126b or the intersection point 150c of the first wire portion 126a and the third wire portion 126c) Not on the same profile. In this way, by having the above-mentioned mesh-shaped conductive structure 120, the stress value on the conductive structure 120 can be reduced, so as to reduce the possibility that the conductive structure 120 is broken due to a force. In addition, in the corresponding flexed state of the flexible electronic device 100 under external force, even if a part of the conductive structure 120 is near the intersection 150 due to fatigue of the material, the conductive structure 120 may still be broken. The surface stops at the opening 124, so that the conductive structure 120 can still transmit electronic signals, so the yield or reliability of the flexible electronic device 100 can be improved.

In this embodiment, the buffer layer 111 may be filled in the opening 124, but the present invention is not limited thereto. In some embodiments, the buffer layer 111 may further cover the conductive structure 120 so that the conductive structure 120 may be embedded in the buffer layer 111.

FIG. 2 is a schematic top view of a portion of a flexible electronic device according to a second embodiment of the present invention. Specifically, for clarity, FIG. 2 only illustrates a part of the conductive structure located in the bendable area A1. Please refer to FIG. 1C and FIG. 2. The flexible electronic device 200 of this embodiment is similar to the flexible electronic device 100 of the above embodiment. The difference is that the openings 224 of the conductive structure 220 may have different configurations.

In this embodiment, the conductive structure 220 may include a mesh structure composed of a plurality of wires, and the plurality of wires may include a plurality of first wire portions 226a parallel to each other and a plurality of second wire portions 226b parallel to each other. And the first wire portion 226a is perpendicular to the second wire portion 226b. In this way, a plurality of openings 224 having a rectangular outline are formed by the first lead portions 226a and the second lead portions 226b adjacent to and connected to each other. In this embodiment, the contour sizes of the openings 224 may be different, and two adjacent openings 224 are staggered.

3 is a schematic top view of a portion of a flexible electronic device according to a third embodiment of the present invention. Specifically, for clarity, FIG. 3 only illustrates a part of the conductive structure located in the bendable area A1. Please refer to FIG. 1C and FIG. 3. The flexible electronic device 300 in this embodiment is similar to the flexible electronic device 100 in the above embodiment. The difference is that the openings 324 of the conductive structure 320 may have different configurations.

In this embodiment, the opening 324 includes a first sub-opening 324a and a plurality of second sub-openings 324b located on opposite sides of the first sub-opening 324a. The first sub-opening 324a has a first wire portion 326a and a second wire. The closed contour formed by the portion 326b, and the second sub-opening 324b has a closed contour formed by the first lead portion 326a, the second lead portion 326b, and the third lead portion 326c. In the same opening 324, the projection area 131 of the first sub-opening 324a and the second sub-opening 324b projected on the projection surface 130 (as shown in FIG. 1C) partially overlaps. Among the two openings 324 arranged adjacently and staggered, the projection areas 131 formed on the projection surface 130 by the two second sub-openings 324b, 324b 'located between the two first sub-openings 324a may completely overlap.

4 is a schematic top view of a portion of a flexible electronic device according to a fourth embodiment of the present invention. Specifically, for clarity, FIG. 4 only illustrates a part of the conductive structure located in the bendable area A1. Please refer to FIG. 1C and FIG. 4. The flexible electronic device 400 of this embodiment is similar to the flexible electronic device 100 of the above embodiment. The difference is that the openings 424 of the conductive structure 420 can have different configurations.

In this embodiment, the conductive structure 420 may include a mesh structure composed of a plurality of wires, and the plurality of wires may include a plurality of first wire portions 426a parallel to each other and a plurality of second wire portions 426b parallel to each other. The first lead portion 426a is a zigzag pattern line, the second lead portion 426b is staggered along the pattern direction of the first lead portion 426a, and the turning point of the second lead portion 426b at the turning point of the first lead portion 426a will be adjacent two The first lead portions 426a are connected to each other. In this way, the openings 424 having a zigzag-shaped outline can be formed by the first lead portions 426a and the second lead portions 426b adjacent to and connected to each other, and two adjacent openings 424 are staggered.

5 is a schematic top view of a portion of a flexible electronic device according to a fifth embodiment of the present invention. Specifically, for clarity, FIG. 5 only illustrates a part of the conductive structure located in the bendable area A1. Please refer to FIG. 1C and FIG. 5. The flexible electronic device 500 in this embodiment is similar to the flexible electronic device 100 in the above embodiment. The difference is that the openings 524 of the conductive structure 520 can have different configurations.

In this embodiment, the conductive structure 520 may include a mesh structure composed of a plurality of wires, and the plurality of wires may include a plurality of first wire portions 526a parallel to each other and a plurality of second wire portions 526b parallel to each other. In this way, the openings 524 formed by the first lead portions 526a and the second lead portions 526b adjacent to and connected to each other have a point-symmetrical profile, and two adjacent openings 524 are staggered.

FIG. 6A is a partial perspective view of a flexible electronic device according to a sixth embodiment of the present invention. FIG. 6B is a schematic cross-sectional view taken along section R1 in FIG. 6A. Specifically, for clarity, FIG. 6A only illustrates a part of the conductive structure located in the bendable area A1. Please refer to FIG. 2 and FIG. 6A. The flexible electronic device 600 of this embodiment is similar to the flexible electronic device 100 of the above embodiment, except that the conductive structure 620 has a three-dimensional mesh structure.

In this embodiment, the conductive structure 620 may be composed of a first conductive layer 661, a second conductive layer 662, and a plurality of conductive connecting members 663, and the conductive connecting members 663 are connected to the first conductive layer 661 and the second conductive layer. Between 662. The first conductive layer 661 and the second conductive layer 662 may be formed by a patterning process such as deposition and etching commonly used in general electronic component manufacturing processes, and the conductive connection member 663 may be a conductive via, so here The first conductive layer 661, the second conductive layer 662, and the conductive connecting member 663 are not described in detail.

In this embodiment, the opening 624 of the conductive structure 620 may include a plurality of first openings 626 and a plurality of second openings 627. The first conductive layer 661 may include a plurality of first conductive wire portions 626a parallel to each other and a plurality of second conductive wire portions 626b parallel to each other, and the first conductive wire portions 626a and the second conductive wire portions 626b adjacent to and connected to each other may constitute The first opening 626 has a closed profile. The first conductive portion 626a of the first conductive layer 661, two adjacent conductive connections 663, and the second conductive layer 662 may form a second opening 627. The first opening 626 and the second opening 627 partially overlap on a projection plane 130 (as shown in FIG. 1C) parallel to the extending direction 121. It is worth noting that, for simplicity, in FIG. 6A, only one conductive connecting member 663 is shown by way of example, but other conductive connecting members 663 not shown in the conductive structure 620 may be located in two adjacent ones. Between two second wire portions 626b.

In terms of structure, as shown in FIG. 6B, the conductive structure 120 located in the bendable area A1 may have a plurality of conductive layers separated from each other in the aforementioned section on any section perpendicular to the extending direction 121 of the conductive structure 120. Regions 640a, 640b, and the conductive regions 640a, 640b are non-linearly distributed. For example, as shown in FIG. 6B, in a cross section between two adjacent second openings 627 (that is, located on the conductive connecting member 663), the conductive region 640 a formed by a portion of the first conductive layer 661 does not It is located in the extending direction of the conductive region 640 b formed by the conductive connecting member 663. In addition, on a cross section (not shown) of an area where the first opening 626 and the second opening 627 overlap, the conductive region formed by the two first conductive wire portions 626a and the second conductive layer 662 separated from each other may be triangular. distributed.

Because the three-dimensional mesh-shaped conductive structure 620 is provided in this embodiment, even if the flexible electronic device 600 has a corresponding flexed or twisted state due to external force, part of the conductive structure 620 is fatigued by materials. This results in fracture, but the fracture surface of the conductive structure 620 can still stop at the first opening 626 or the second opening 627, so that the conductive structure 620 can still transmit electronic signals, thereby improving the yield of the flexible electronic device 600 or Reliability.

FIG. 7 is a partial perspective view of a flexible electronic device according to a seventh embodiment of the present invention. Specifically, for clarity, FIG. 7 only illustrates a part of the conductive structure located in the bendable area A1. Please refer to FIG. 7 and FIG. 6. The flexible electronic device 800 of this embodiment is similar to the flexible electronic device 600 of the above embodiment. The difference is that the second conductive layer 762 of the conductive structure 720 may have multiple third openings. 728.

In this embodiment, the opening 724 of the conductive structure 720 may include a plurality of first openings 626, a plurality of second openings 627, and a plurality of third openings 728. The second conductive layer 762 may include a plurality of fourth conductive line portions 726d parallel to each other and a plurality of fifth conductive line portions 726e parallel to each other, and the fourth conductive line portions 726d and the fifth conductive line portions 726e adjacent to and connected to each other may constitute A third opening 728 having a closed profile. In this embodiment, the layout design of the second conductive layer 762 may be similar to the first conductive layer 661, but the present invention is not limited thereto.

In this embodiment, on the projection plane 130 (as shown in FIG. 1C) parallel to the extending direction 121, the second opening 627 and the first opening 626 adjacent to each other partially overlap and do not completely overlap, and are adjacent to each other. The second opening 627 and the third opening 728 partially overlap and do not completely overlap. In this way, a part of the conductive structure 120 located in the bendable area A1 may have a plurality of conductive areas separated from each other in any cross section.

FIG. 8 is a partial perspective view of a flexible electronic device according to an eighth embodiment of the present invention. Specifically, for clarity, FIG. 8 only illustrates a part of the conductive structure located in the bendable area A1. Please refer to FIG. 8 and FIG. 7. The flexible electronic device 800 of this embodiment is similar to the flexible electronic device 700 of the above embodiment. The difference is that the second lead portion 126 b and the fifth lead portion 726 e are on the projection surface 130 ( (As shown in Figure 1C). As such, the first opening 626 and the third opening 728 may partially overlap and not completely overlap.

FIG. 9 is a partial perspective view of a flexible electronic device according to a ninth embodiment of the present invention. Specifically, for clarity, FIG. 9 only illustrates a part of the conductive structure located in the bendable area A1. Please refer to FIG. 9 and FIG. 7. The flexible electronic device 900 of this embodiment is similar to the flexible electronic device 700 of the above embodiment. The difference is that a plurality of conductive connecting members 663 can be staggered. In other words, on the projection plane 130 (as shown in FIG. 1C) parallel to the extending direction 121, the plurality of conductive connecting members 663 may not overlap.

FIG. 10 is a partial perspective view of a flexible electronic device according to a tenth embodiment of the present invention. Specifically, for clarity, FIG. 10 only illustrates a part of the conductive structure located in the bendable area A1. Please refer to FIG. 10 and FIG. 7. The flexible electronic device 1000 of this embodiment is similar to the flexible electronic device 700 of the above embodiment. The difference is that the opening area of the first opening 626 may be smaller than the opening area of the third opening 728. . In other words, a partial opening area of the third opening 728 may completely overlap the first opening 626.

FIG. 11 is a partial perspective view of a flexible electronic device 1100 according to an eleventh embodiment of the present invention. Specifically, for clarity, FIG. 11 only illustrates a part of the conductive structure located in the bendable area A1. Please refer to FIG. 11 and FIG. 2. The flexible electronic device 1100 in this embodiment is similar to the flexible electronic device 200 in the above embodiment. The difference is that the conductive structure 1120 is arranged perpendicular to the flexible substrate 110. . Specifically, the conductive structure 1120 may be composed of a plurality of conductive layers 1160 and a conductive connection member 663 located between the conductive layers 1160. A plurality of openings 1124 may be formed by the conductive layers 1160 and the conductive connecting members 663. In this embodiment, the contour sizes of the openings 1124 may be different, and two adjacent openings 1124 are arranged alternately. Test case

In order to prove that the stress can be reduced by the conductive structure of the present invention under the same degree of bending or bending, the following test example is taken as an illustration. However, these test cases are not to be construed as limiting the scope of the present invention in any sense.

Please refer to FIG. 12A and FIG. 12B at the same time. In the following comparative examples and test examples, simulation software is used to calculate the stress distribution diagrams of different conductive structures under the same degree of bending or bending. FIG. 12A is a stress distribution diagram of a comparative example according to the present invention. FIG. 12B is a stress distribution diagram of a test example according to the present invention. Specifically, the conductive structure in FIG. 12B may be similar to the conductive structure 120 in FIG. 1C. The conductive structure of the comparative example has a similar mesh structure to the conductive structure of the test example, except that in the test example, two adjacent openings partially overlap a projection area on a projection plane parallel to the extending direction. And, in the test example, the maximum wire width is less than 10 microns. In other words, the opening distance between two adjacent openings in the conductive structure is also less than 10 microns.

As shown in FIG. 12A and FIG. 12B, under the same degree of bending or bending, in the comparative example of FIG. 12A, the stress value corresponding to the maximum stress point P1 is about 1150 MPa, and in the test example of FIG. 12A, the maximum The stress value corresponding to the stress point P1 is about 1100 MPa. That is, under the same degree of bending or bending, the stress value corresponding to the conductive structure of the present invention is reduced to reduce the possibility that the conductive structure is broken due to stress, so the yield of the flexible electronic device can be improved. Or reliability.

In summary, in the flexible electronic device of the present invention, the conductive structure may have a plurality of openings, and on a projection plane parallel to the extending direction, the projection areas projected on the projection plane partially overlap. In other words, the conductive structure 120 may form a plurality of conductive regions separated from each other on an arbitrary cross section, wherein the normal direction of the cross section is substantially the same as the extending direction. In this way, when the flexible electronic device is flexed or bent when subjected to an external force, the stress value corresponding to the conductive structure can be reduced, and the possibility that the conductive structure is broken due to the force can be reduced. In addition, even if part of the conductive structure may be broken due to fatigue of the material, the fracture surface of the conductive structure can still be stopped at the opening, so that the conductive structure can still transmit electronic signals. In this way, the possibility of disconnection of the conductive structure can be reduced, and the yield or reliability of the flexible electronic device can be improved.

Although the present invention has been disclosed as above with the examples, it is not intended to limit the present invention. Any person with ordinary knowledge in the technical field can make some modifications and retouching without departing from the spirit and scope of the present invention. The protection scope of the present invention shall be determined by the scope of the attached patent application.

100, 100 ', 200, 300, 400, 500, 600, 700, 800, 900, 1000, 1100‧‧‧ flexible electronic devices

110‧‧‧ flexible substrate

A1‧‧‧Bendable area

A2‧‧‧Element Area

111‧‧‧ buffer layer

112‧‧‧Electronic components

S‧‧‧Source

D‧‧‧ Drain

G‧‧‧Gate

CH‧‧‧ Channel layer

GI‧‧‧Gate dielectric layer

113, 113a, 113b‧‧‧ Line layer

120, 220, 320, 420, 520, 620, 720, 1120‧‧‧ conductive structure

121‧‧‧ extension direction

122‧‧‧Current / electron current direction

123‧‧‧Wire width

124, 224, 324, 424, 520, 624, 1124‧‧‧ opening

324a‧‧‧First child opening

324b, 324b'‧‧‧ second child opening

125‧‧‧ opening spacing

126a, 226a, 326a, 426a, 526a, 626a

126b, 226b, 326b, 426b, 526b, 626b‧‧‧Second wire section

126c, 326c‧‧‧Third wire section

726d‧‧‧ Fourth wire section

726e‧‧‧The fifth wire section

130‧‧‧ projection surface

131‧‧‧ projection area

140, 640a, 640b‧‧‧ conductive area

150, 150b, 150c ‧‧‧ meeting point

1160‧‧‧ conductive layer

661‧‧‧first conductive layer

662, 762‧‧‧Second conductive layer

663‧‧‧Conductive connection

626‧‧‧first opening

627‧‧‧Second opening

728‧‧‧ third opening

X, Y, Z‧‧‧ directions

R1‧‧‧ section

P1, P2‧‧‧ maximum stress point

FIG. 1A is a schematic cross-sectional view of a flexible electronic device according to a first embodiment of the present invention. FIG. 1B is a schematic cross-sectional view of a flexible electronic device having a corresponding flexed state when subjected to an external force according to a first embodiment of the present invention. FIG. 1C is a schematic top view of a portion of a flexible electronic device according to a first embodiment of the present invention. Fig. 1D is a schematic cross-sectional view taken along the line A-A 'in Fig. 1C. Fig. 1E is a schematic cross-sectional view taken along the line B-B 'in Fig. 1C. FIG. 2 is a schematic top view of a portion of a flexible electronic device according to a second embodiment of the present invention. 3 is a schematic top view of a portion of a flexible electronic device according to a third embodiment of the present invention. 4 is a schematic top view of a portion of a flexible electronic device according to a fourth embodiment of the present invention. 5 is a schematic top view of a portion of a flexible electronic device according to a fifth embodiment of the present invention. FIG. 6A is a partial perspective view of a flexible electronic device according to a sixth embodiment of the present invention. FIG. 6B is a schematic cross-sectional view taken along section R1 in FIG. 6A. FIG. 7 is a partial perspective view of a flexible electronic device according to a seventh embodiment of the present invention. FIG. 8 is a partial perspective view of a flexible electronic device according to an eighth embodiment of the present invention. FIG. 9 is a partial perspective view of a flexible electronic device according to a ninth embodiment of the present invention. FIG. 10 is a partial perspective view of a flexible electronic device according to a tenth embodiment of the present invention. FIG. 11 is a partial perspective view of a flexible electronic device according to an eleventh embodiment of the present invention. FIG. 12A is a stress distribution diagram of a comparative example according to the present invention. FIG. 12B is a stress distribution diagram of a test example according to the present invention.

Claims (23)

A flexible electronic device includes: a flexible substrate having a bendable region and a component region connected to the bendable region; and a conductive structure located on the flexible substrate and from the flexible substrate. The element region extends to the bendable region along an extension direction. The conductive structure includes a plurality of openings on the bendable region, and on a projection plane parallel to the extension direction, the openings are projected on the projection. The projection areas on the surface partially overlap, and the spacing between the openings is less than 10 microns. The flexible electronic device according to item 1 of the scope of patent application, wherein the projections of the openings on the projection surface form a continuous pattern. As in the flexible electronic device described in the first item of the patent application scope, the projection areas of the openings projected on the projection surface do not completely overlap. The flexible electronic device according to item 1 of the scope of patent application, wherein the projection plane is more perpendicular to the bendable area of the flexible substrate. The flexible electronic device according to item 1 of the scope of patent application, wherein the openings include a first sub-opening and a plurality of second sub-openings adjacent to the first sub-opening, wherein the first sub-opening and The projection areas projected on the projection surface by the second sub-openings partially overlap, and the projection areas formed on the projection surface by the second sub-openings completely overlap. The flexible electronic device according to item 5 of the scope of patent application, wherein the contours of the first sub-openings and the contours of the second sub-openings are respectively different geometric shapes. According to the flexible electronic device described in item 1 of the patent application scope, the outlines of some of the openings have substantially the same shape. The flexible electronic device according to item 1 of the scope of patent application, wherein the openings are staggered along the extending direction. The flexible electronic device according to item 1 of the scope of patent application, further comprising: a buffer layer located between the flexible substrate and the conductive structure. The flexible electronic device according to item 9 of the scope of patent application, wherein the buffer layer is further filled in the openings. The flexible electronic device according to item 1 of the patent application scope, wherein the openings include a plurality of first openings and a plurality of second openings, and the conductive structure includes: a first conductive layer having the first openings A second conductive layer, wherein the first conductive layer is located between the flexible substrate and the second conductive layer; and a plurality of conductive connectors connected between the first conductive layer and the second conductive layer, And the first conductive layer, the conductive connections and the second conductive layer constitute the second openings, wherein the first openings and the second openings partially overlap. The flexible electronic device according to item 1 of the scope of patent application, wherein the openings include a plurality of first openings, a plurality of second openings, and a plurality of third openings, and the conductive structure includes: a first conductive layer, Having the first openings; a second conductive layer having the third openings, wherein the first conductive layer is located between the flexible substrate and the second conductive layer; and a plurality of conductive connecting members connected to the Between the first conductive layer and the second conductive layer, and the first conductive layer, the conductive connections, and the second conductive layer constitute the second openings, wherein: the second openings and the first openings The openings partially overlap; or the second openings and the third openings partially overlap. A flexible electronic device includes: a flexible substrate having a bendable region and a component region connected to the bendable region; and a conductive structure located on the flexible substrate and from the flexible substrate. The element region extends to the bendable region in an extending direction. A portion of the bendable region of the conductive structure has a plurality of conductive regions separated from each other on an arbitrary cross section, wherein the normal direction of the cross section is substantially the same In the extending direction, the width of the conductive regions is less than 10 microns. The flexible electronic device according to item 13 of the application, wherein the conductive regions overlap each other. The flexible electronic device according to item 13 of the scope of patent application, wherein the conductive structure includes a mesh structure, and the mesh structure includes a plurality of connected wires. The flexible electronic device according to item 15 of the scope of patent application, wherein the wires are parallel to each other. According to the flexible electronic device described in item 15 of the scope of patent application, some of the wires are parallel to each other, and the other wires are not parallel to each other. The flexible electronic device according to item 17 of the scope of patent application, wherein the wires that are not parallel to each other are connected at one point. The flexible electronic device according to item 13 of the patent application scope further includes: a buffer layer located between the flexible substrate and the conductive structure. The flexible electronic device according to item 19 of the application, wherein the conductive structure is further embedded in the buffer layer. The flexible electronic device according to item 13 of the scope of patent application, wherein the conductive regions are non-linearly distributed on some of the sections. A flexible electronic device includes a flexible conductive structure having an extending direction, and the flexible conductive structure includes a plurality of openings, wherein a distance between the openings is less than 10 micrometers, and the openings are parallel to the extending direction. On a projection plane, the openings are projected on the projection area of the projection plane to form a continuous pattern. A flexible electronic device includes: a flexible conductive structure having an extending direction, wherein the flexible conductive structure has a plurality of conductive regions on an arbitrary cross section perpendicular to the extending direction, and the conductive regions Separate from each other, the width of the conductive regions is less than 10 microns.