TWI645194B - Probe module, probe device, and electronic component detection method and equipment using the probe device - Google Patents

Probe module, probe device, and electronic component detection method and equipment using the probe device Download PDF

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Publication number
TWI645194B
TWI645194B TW106123366A TW106123366A TWI645194B TW I645194 B TWI645194 B TW I645194B TW 106123366 A TW106123366 A TW 106123366A TW 106123366 A TW106123366 A TW 106123366A TW I645194 B TWI645194 B TW I645194B
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Taiwan
Prior art keywords
probe
electronic component
patent application
scope
item
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TW106123366A
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Chinese (zh)
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TW201908739A (en
Inventor
盧昱呈
林芳旭
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萬潤科技股份有限公司
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Priority to TW106123366A priority Critical patent/TWI645194B/en
Priority to CN201810162583.6A priority patent/CN109254179A/en
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Publication of TWI645194B publication Critical patent/TWI645194B/en
Publication of TW201908739A publication Critical patent/TW201908739A/en

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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/06Measuring leads; Measuring probes
    • G01R1/067Measuring probes
    • G01R1/06711Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716Elastic
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/06Measuring leads; Measuring probes
    • G01R1/067Measuring probes
    • G01R1/06711Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716Elastic
    • G01R1/06722Spring-loaded
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/06Measuring leads; Measuring probes
    • G01R1/067Measuring probes
    • G01R1/073Multiple probes
    • G01R1/07307Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07357Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with flexible bodies, e.g. buckling beams

Abstract

本發明提供一種探針模組、探針裝置及使用該探針裝置之電子元件檢測方法及設備,該探針模組包括:複數支探針;一罩殼,設有複數個滑槽,該複數支探針可分別在對應之滑槽內滑移;一底座,設於該罩殼下方,該底座上設有一支撐座;複數支彈性件,設於該支撐座上,各彈性件的一端與該支撐座接觸,另一端頂撐在對應之探針的下方;該電子元件檢測方法包括:在電子元件受一間歇性旋轉之轉盤搬運至探針裝置上方時,移動機構受驅動模組驅動而連動探針模組位移;使複數支探針在接觸電子元件進行特性檢測時,複數支探針各在對應之滑槽內位移壓縮對應之彈性件。 The invention provides a probe module, a probe device, and an electronic component detection method and device using the probe device. The probe module includes: a plurality of probes; a cover, provided with a plurality of chute slots, the A plurality of probes can be respectively slid in the corresponding chute; a base is provided below the casing, and a support is provided on the base; a plurality of elastic members are provided on the support, and one end of each elastic member The other end is in contact with the supporting base, and the other end is supported under the corresponding probe. The electronic component detection method includes: when the electronic component is transferred to the probe device by an intermittently rotating turntable, the moving mechanism is driven by the driving module. And the linkage probe module is displaced; when the plurality of probes contact the electronic component for characteristic detection, each of the plurality of probes is displaced in the corresponding chute to compress the corresponding elastic member.

Description

探針模組、探針裝置及使用該探針裝置之電子元件檢測方法及設備 Probe module, probe device, and electronic component detection method and equipment using the probe device

本發明係有關於一種探針模組、探針裝置及使用該探針裝置之電子元件檢測方法及設備,尤指一種可減少成本之探針模組、探針裝置及使用該探針裝置之電子元件檢測方法及設備。 The invention relates to a probe module, a probe device, and an electronic component detection method and equipment using the probe device, and more particularly, to a probe module, a probe device and a probe device capable of reducing the cost. Electronic component detection method and equipment.

按,一般電子元件由於具有不同的物理特性,故常需經由檢測、分類的程序來進行包裝或分類,專利號第M452344號「電子元件檢測裝置」已揭露一種用於進行高電壓、高電流與高頻率檢測之探針裝置,其探針構造設有一呈片狀之探針、一呈條狀且較粗、短之探測桿與一連結在兩者之間呈片狀且較細、長之力臂;該探測桿設於該探針之斜上方,該力臂由探針之上表面向上斜向延伸至探測桿底部,使力臂之下表面與探針之上表面間之夾角為銳角,且力臂之下表面與探針之上表面間形成一鏤空之緩衝區;在探測桿與電子元件接觸進行檢測時,探測桿因承受了電子元件之重量而對傾斜之力臂施加向下之壓力,使力臂向下彎曲產生些微變形而達到緩衝之效果。 According to the general electronic components have different physical characteristics, they often need to be packaged or sorted through testing and classification procedures. Patent No. M452344 "Electronic Component Testing Device" has disclosed a method for performing high voltage, high current and high voltage. A probe device for frequency detection, the probe structure of which is provided with a sheet-shaped probe, a strip-shaped, thicker and shorter detection rod, and a sheet-shaped, thinner and longer force connected between the two. Arm; the detection rod is arranged obliquely above the probe, the force arm extends obliquely upward from the upper surface of the probe to the bottom of the detection rod, so that the angle between the lower surface of the force arm and the upper surface of the probe is an acute angle, And a hollow buffer area is formed between the lower surface of the force arm and the upper surface of the probe; when the detection rod is in contact with the electronic component for detection, the detection rod applies the downward force to the inclined arm due to the weight of the electronic component. The pressure causes the force arm to bend downward to produce a slight deformation to achieve the effect of cushioning.

習知探針裝置在對電子元件進行檢測時,係利用力臂來達到緩衝之效果,但因電子元件之重量極為輕巧,故力臂之下表面不僅須與探針之上表面形成銳角,且力臂須有一定程度的長度方能確保電子元件之重量可使力臂產生些微變形而達到緩衝之效果;此種探針構造之探測桿通常位於探針之斜上方,如此會造成探針構造之整體水平寬度增加,又因電子元件 通常極為微小,一顆電子元件又至少須同時以複數支探針進行檢測,故探針在探針裝置內之空間配置變得較為複雜,常令設計者煞費苦心的進行空間規畫,造成製造成本之增加;此外,此種探針構造通常為一體成型,相同之力臂不能對應於不同重量之電子元件,故在對不同重量之電子元件進行檢測時,設計者亦須重新設計力臂可承載之重量且操作者須配合更換不同之新探針構造,如此亦造成使用成本之增加。 The conventional probe device uses a force arm to achieve the cushioning effect when detecting electronic components. However, because the weight of the electronic component is extremely light, the lower surface of the force arm must not only form an acute angle with the upper surface of the probe, and The force arm must have a certain length of length to ensure that the weight of the electronic components can slightly deform the force arm to achieve a cushioning effect; the probe rod of this probe structure is usually located above the probe obliquely, which will cause the probe structure The overall horizontal width increases due to electronic components Usually it is extremely small, and at least one electronic component must be tested by multiple probes at the same time. Therefore, the space configuration of the probe in the probe device becomes more complicated, which often makes the designer painstakingly carry out space planning, resulting in manufacturing costs. In addition, this probe structure is usually integrally formed, and the same arm cannot correspond to electronic components of different weights, so when testing electronic components of different weights, the designer must also redesign the arm to carry Weight and the operator must cooperate with the replacement of a different new probe structure, which also increases the use cost.

爰是,本發明的目的,在於提供一種可減少成本之探針模組。 That is, the object of the present invention is to provide a probe module capable of reducing costs.

本發明的另一目的,在於提供一種使用本發明目的所提供之探針模組的探針裝置。 Another object of the present invention is to provide a probe device using the probe module provided by the object of the present invention.

本發明的又一目的,在於提供一種使用本發明另一目的所提供之探針裝置的電子元件檢測方法。 Another object of the present invention is to provide an electronic component detection method using a probe device provided by another object of the present invention.

本發明的再一目的,在於提供一種使用本發明又一目的所提供之電子元件檢測方法的電子元件檢測設備。 Another object of the present invention is to provide an electronic component detection device using the electronic component detection method provided by another object of the present invention.

本發明的又再一目的,在於提供一種使用本發明另一目的所提供之探針裝置的電子元件檢測設備。 Yet another object of the present invention is to provide an electronic component detection device using the probe device provided by another object of the present invention.

依據本發明目的之探針模組,包括:複數支探針;一罩殼,設有複數個滑槽,該複數支探針可分別在對應之滑槽內滑移;一底座,設於該罩殼下方,該底座上設有一支撐座;複數支彈性件,設於該支撐座上,各彈性件的一端與該支撐座接觸,另一端頂撐在對應之探針的下方。 A probe module according to the purpose of the present invention includes: a plurality of probes; a cover provided with a plurality of slide grooves, the plurality of probes can be slid in the corresponding slide grooves respectively; a base provided in the Below the cover, a support seat is provided on the base; a plurality of elastic members are provided on the support seat, one end of each elastic member is in contact with the support seat, and the other end is supported under the corresponding probe.

依據本發明另一目的之探針裝置,使用如所述探針模組,包括:一座架,設有一移動區間;一移動機構,設於該座架之該移動區間內,該移動機構設有一移動部與一支撐部;一驅動模組,設於該座架下方,使移動機構在該移動區間內上、下往復移動;該探針模組設於該支撐部上,受移動機構之連動而上、下往復移動。 According to another aspect of the present invention, a probe device using the probe module includes: a frame provided with a moving section; a moving mechanism provided in the moving section of the seat frame; the moving mechanism is provided with a A moving part and a supporting part; a driving module provided under the seat frame to move the moving mechanism up and down in the moving section; the probe module is provided on the supporting part and is linked by the moving mechanism And up and down reciprocating.

依據本發明又一目的之電子元件檢測方法,使用如所述探針裝置,包括:使複數支探針各在對應之滑槽內滑移,並各受滑槽內對應之彈性件頂撐;在電子元件受一間歇性旋轉之轉盤搬運至探針裝置上方時,移動機構受驅動模組驅動而連動探針模組位移;使複數支探針在接觸電子元件進行特性檢測時,複數支探針各在對應之滑槽內位移壓縮對應之彈性件。 According to another object of the present invention, a method for detecting an electronic component, using the probe device as described, comprises: sliding a plurality of probes each in a corresponding chute, and supporting each corresponding elastic member in the chute; When the electronic component is carried over the probe device by an intermittently rotating turntable, the moving mechanism is driven by the driving module to move the probe module in linkage; when a plurality of probes contact the electronic component for characteristic testing, the plurality of probes are probed. The needles are each displaced in the corresponding chute to compress the corresponding elastic member.

依據本發明再一目的之電子元件檢測設備,包括:用以執行如所述電子元件檢測方法之設備。 An electronic component testing device according to another object of the present invention includes: a device for performing the electronic component testing method as described above.

依據本發明又再一目的之電子元件檢測設備,使用如所述探針裝置,包括:一工作台面;一轉盤,設於該工作台面上,其周緣環列佈設等間距且設有朝外開口之容槽;該探針裝置設於該工作台面之下方,用以對該容槽內之一電子元件進行檢測。 According to still another object of the present invention, an electronic component detection device using the probe device includes: a work surface; a turntable provided on the work surface; the peripheral ring lines are arranged at equal intervals and outward openings are provided; The probe device is disposed below the work surface and used to detect an electronic component in the receiver.

本發明實施例之探針模組、探針裝置及使用該探針裝置之電子元件檢測方法及設備,探針具有不同水平寬度之本體部、延伸部與針身部且三者之端面皆切齊同一條垂直線上,可限制探針整體之水平寬度在本體部之寬度範圍內,此種探針在空間配置上較為簡單,可減少製造之成本;且探針在探針模組內以其導引部在滑槽內滑移,探針裝置在驅動探針模組位移使探針接觸到電子元件時,探針在滑槽內可壓縮彈性件以緩衝探針接觸電子元件之壓力,不僅可取代習知之力臂,且在對不同重量之電子元件進行檢測時,僅須更換對應彈性係數之彈性件,不須重新設計並更換新的探針,可減少使用之成本。 In the probe module, the probe device, and the electronic component detection method and device using the probe device according to the embodiment of the present invention, the probe has a body portion, an extension portion, and a needle body portion with different horizontal widths, and the end faces of the three are all cut. Aligning the same vertical line can limit the overall horizontal width of the probe to the width of the body portion. This probe is relatively simple in spatial configuration and can reduce manufacturing costs; and the probe is in the probe module with its The guide part slides in the chute. When the probe device drives the probe module to displace the probe to contact the electronic component, the probe can compress the elastic member in the chute to buffer the pressure of the probe contacting the electronic component. It can replace the conventional force arm, and when testing electronic components with different weights, only the elastic parts corresponding to the elastic coefficients need to be replaced, without redesigning and replacing new probes, which can reduce the cost of use.

A‧‧‧探針 A‧‧‧ Probe

A1‧‧‧本體部 A1‧‧‧Body

A11‧‧‧導引部 A11‧‧‧Guide

A111‧‧‧第一端面 A111‧‧‧first end face

A112‧‧‧導接件 A112‧‧‧Guide piece

A113‧‧‧擋面 A113‧‧‧Surface

A12‧‧‧側面 A12‧‧‧side

A13‧‧‧第二端面 A13‧‧‧Second end face

A14‧‧‧第五端面 A14‧‧‧Fifth end face

A2‧‧‧延伸部 A2‧‧‧ extension

A21‧‧‧第三端面 A21‧‧‧Third end face

A22‧‧‧第四端面 A22‧‧‧Fourth end face

A23‧‧‧導接孔 A23‧‧‧Guide hole

A3‧‧‧針身部 A3‧‧‧Needle

A31‧‧‧第六端面 A31‧‧‧Sixth end face

A32‧‧‧接觸面 A32‧‧‧contact surface

B‧‧‧探針模組 B‧‧‧ Probe Module

B1‧‧‧罩殼 B1‧‧‧Cover

B11‧‧‧外罩 B11‧‧‧Cover

B111‧‧‧間隔部 B111‧‧‧spacer

B112‧‧‧滑槽 B112‧‧‧Chute

B113‧‧‧長槽孔 B113‧‧‧long slot

B12‧‧‧間隔件 B12‧‧‧ spacer

B13‧‧‧插銷 B13‧‧‧ Bolt

B14‧‧‧擋件 B14‧‧‧stop

B2‧‧‧底座 B2‧‧‧base

B21‧‧‧支撐座 B21‧‧‧Support

B22‧‧‧缺槽 B22‧‧‧lack of slot

B3‧‧‧彈性件 B3‧‧‧Elastic piece

C‧‧‧探針裝置 C‧‧‧ Probe device

C1‧‧‧座架 C1‧‧‧seat

C11‧‧‧第一架體 C11‧‧‧First frame

C111‧‧‧樞座 C111‧‧‧ Pivot

C112‧‧‧緩衝件 C112‧‧‧Buffer

C113‧‧‧槽道 C113‧‧‧Slot

C12‧‧‧第二架體 C12‧‧‧Second frame

C121‧‧‧通孔 C121‧‧‧through hole

C13‧‧‧移動區間 C13‧‧‧moving interval

C131‧‧‧導引件 C131‧‧‧Guide

C2‧‧‧第一調整座 C2‧‧‧The first adjustment seat

C21‧‧‧探針架 C21‧‧‧Probe holder

C211‧‧‧探針孔座 C211‧‧‧ Probe hole seat

C212‧‧‧探針孔 C212‧‧‧Probe hole

C22‧‧‧固定塊 C22‧‧‧Fixed block

C221‧‧‧鏤孔 C221‧‧‧hole

C23‧‧‧第一調整件 C23‧‧‧First adjustment

C231‧‧‧偏心部 C231‧‧‧eccentric

C232‧‧‧軸桿部 C232‧‧‧Shaft

C24‧‧‧滑動部 C24‧‧‧Sliding part

C241‧‧‧樞孔 C241‧‧‧ Pivot

C3‧‧‧移動機構 C3‧‧‧ mobile agency

C31‧‧‧移動部 C31‧‧‧Mobile

C311‧‧‧彈性件 C311‧‧‧Elastic piece

C312‧‧‧容置孔 C312‧‧‧Receiving hole

C313‧‧‧槽孔 C313‧‧‧Slot

C314‧‧‧調整塊 C314‧‧‧Adjustment block

C315‧‧‧長槽孔 C315‧‧‧long slot

C316‧‧‧微調件 C316‧‧‧fine adjustment

C317‧‧‧偏心部 C317‧‧‧eccentric

C318‧‧‧樞孔 C318‧‧‧ Pivot

C32‧‧‧支撐部 C32‧‧‧ support

C321‧‧‧鏤孔 C321‧‧‧hole

C4‧‧‧第二調整座 C4‧‧‧Second adjustment seat

C41‧‧‧螺孔 C41‧‧‧Screw hole

C42‧‧‧第二調整件 C42‧‧‧Second adjustment

C421‧‧‧螺紋部 C421‧‧‧Thread

C422‧‧‧卡嵌部 C422‧‧‧Card Insertion Section

C423‧‧‧轉動部 C423‧‧‧Rotating part

C43‧‧‧槽道 C43‧‧‧Slot

C431‧‧‧樞孔 C431‧‧‧ Pivot

C44‧‧‧第三調整件 C44‧‧‧Third adjustment

C441‧‧‧偏心部 C441‧‧‧eccentric

C442‧‧‧轉動部 C442‧‧‧Rotating part

C45‧‧‧槽道 C45‧‧‧Slot

C5‧‧‧驅動模組 C5‧‧‧Drive Module

C51‧‧‧驅動機構 C51‧‧‧Drive mechanism

C511‧‧‧馬達 C511‧‧‧Motor

C512‧‧‧凸輪 C512‧‧‧cam

C52‧‧‧從動機構 C52‧‧‧ Follower

C521‧‧‧滑軌 C521‧‧‧Slide

C522‧‧‧側板 C522‧‧‧Side panel

C523‧‧‧滑塊 C523‧‧‧Slider

C524‧‧‧頂銷 C524‧‧‧Top pin

C525‧‧‧從動輪 C525‧‧‧ Follower

D‧‧‧電子元件檢測設備 D‧‧‧Electronic component testing equipment

D1‧‧‧工作台面 D1‧‧‧ work surface

D11‧‧‧鏤口 D11‧‧‧Spigot

D2‧‧‧轉盤 D2‧‧‧ Turntable

D21‧‧‧容槽 D21‧‧‧Tank

L1‧‧‧水平線 L1‧‧‧Horizontal

L2‧‧‧垂直線 L2‧‧‧ vertical line

W‧‧‧電子元件 W‧‧‧Electronic components

圖1係本發明實施例中探針之立體示意圖。 FIG. 1 is a schematic perspective view of a probe in an embodiment of the present invention.

圖2係本發明實施例中探針之側面示意圖。 FIG. 2 is a schematic side view of a probe in an embodiment of the present invention.

圖3係本發明實施例中探針模組之立體示意圖。 FIG. 3 is a schematic perspective view of a probe module according to an embodiment of the present invention.

圖4係本發明實施例中探針模組之立體分解示意圖。 FIG. 4 is a three-dimensional exploded view of a probe module according to an embodiment of the present invention.

圖5係本發明實施例中探針裝置之立體示意圖。 FIG. 5 is a schematic perspective view of a probe device according to an embodiment of the present invention.

圖6係本發明實施例中探針裝置之部分剖面示意圖。 6 is a schematic partial cross-sectional view of a probe device according to an embodiment of the present invention.

圖7係本發明實施例中圖6之A-A剖面示意圖。 Fig. 7 is a schematic cross-sectional view taken along the line A-A of Fig. 6 in the embodiment of the present invention.

圖8係本發明實施例中探針裝置之X、Y、Z軸調整機構之立體分解示意圖。 FIG. 8 is an exploded perspective view of the X, Y, and Z axis adjustment mechanisms of the probe device according to the embodiment of the present invention.

圖9係本發明實施例中電子元件檢測設備之探針裝置與工作台面及轉盤之立體分解示意圖。 FIG. 9 is a three-dimensional exploded view of a probe device, a work surface, and a turntable of an electronic component detection device according to an embodiment of the present invention.

請參閱圖1、2,本發明實施例之探針A,設有包括:一本體部A1,凸設有一導引部A11於其一側面A12,該導引部A11具有矩形截面且導引部A11之一第一端面A111平齊該本體部A1之一第二端面A13,兩者切齊於同一條水平線L1上;導引部A11之水平寬度略小於本體部A1使該側面A12可部分地顯露;導引部A11上設有一導接件A112與一擋面A113,導接件A112可以螺固件固定於導引部A11上,螺固件亦可同時使導線(圖未示)與導接件A112連接;一延伸部A2,其由本體部A1向上延伸,設有一第三端面A21與一第四端面A22;該第三端面A21平齊本體部A1相對第二端面A13之第五端面A14,兩者皆切齊同一條垂直線L2上;第四端面A22係由本體部A1之第二端面A13朝第三端面A21方向向上傾斜,使延伸部A2之水平寬度向上遞減;延伸部A2開設有一導接孔A23可連接導線(圖未示)或連結件(圖未示),連結件係當特殊檢測時用於串聯或並聯探針A之用; 一針身部A3,設於延伸部A2上方,針身部A3具有矩形截面且其一第六端面A31平齊延伸部A2之第三端面A21與本體部A1之第五端面A14,三者皆切齊同一條垂直線L2上;針身部A3上設有一呈矩形之接觸面A32;其中,本體部A1、延伸部A2與針身部A3,三者具有相同之厚度但具有不同之垂直高度與水平寬度;高度由高至低之排序為本體部A1>延伸部A2>針身部A3;寬度由寬至窄之排序為本體部A1>延伸部A2>針身部A3。 Please refer to FIGS. 1 and 2. A probe A according to an embodiment of the present invention includes: a body portion A1, a guide portion A11 protruding from a side surface A12 thereof, the guide portion A11 having a rectangular cross section and a guide portion; One of the first end faces A111 of A11 is flush with one of the second end faces A13 of the main body portion A1, and the two are aligned on the same horizontal line L1; the horizontal width of the guide portion A11 is slightly smaller than that of the main body portion A1 so that the side surface A12 can be partially It is revealed that a guide piece A112 and a blocking surface A113 are provided on the guide portion A11. The guide piece A112 can be screwed to the guide portion A11, and the screw can also make the wire (not shown) and the guide piece at the same time. A112 connection; an extension A2 extending upward from the body portion A1, provided with a third end face A21 and a fourth end face A22; the third end face A21 is flush with the fifth end face A14 of the body portion A1 opposite the second end face A13, Both are aligned on the same vertical line L2; the fourth end face A22 is inclined upward from the second end face A13 of the body portion A1 toward the third end face A21, so that the horizontal width of the extension portion A2 decreases upward; an extension portion A2 is provided with a The lead-through hole A23 can be connected to a wire (not shown) or a connecting piece (not shown). The connecting piece is a special For series or parallel with the time measurement probe A; A needle body portion A3 is provided above the extension portion A2. The needle body portion A3 has a rectangular cross section and a sixth end surface A31 is flush with the third end surface A21 of the extension portion A2 and the fifth end surface A14 of the main body portion A1. Cut the same vertical line L2; the needle body part A3 is provided with a rectangular contact surface A32; among them, the body part A1, the extension part A2 and the needle body part A3, the three have the same thickness but different vertical heights And horizontal width; the order of height from highest to lowest is body part A1> extension part A2> needle part A3; the order of width from wide to narrow is body part A1> extension part A2> needle part A3.

請參閱圖3、4,本發明實施例之探針A係使用於如圖所示之探針模組B上,該探針模組B設有包括:一罩殼B1,其設有兩個外罩B11與兩個片狀間隔件B12,外罩B11與間隔件B12皆為絕緣材質;各外罩B11之內側設有以一片狀間隔部B111隔開之兩個相互平行之滑槽B112,外罩B11上開設有兩個提供導接件A112穿出之長槽孔B113;兩個間隔件B12被夾設在兩個外罩B11之間並由兩個插銷B13穿經外罩B11與間隔件B12對應之銷孔將兩者固定;罩殼B1在滑槽B112上方開口處設有兩個絕緣材質之擋件B14;四支探針A,在兩相鄰之探針A具有鏡射之對稱特徵下以各針身部A3相互靠攏之方型矩陣方式排列;探針A之導引部A11可在滑槽B112內滑移,且導引部A11上之擋面A113可受擋件B14阻擋而使導引部A11保持在罩殼B1內滑動,而延伸部A2與針身部A3顯露出罩殼B1外;各探針A之間以間隔件B12與間隔部B111相隔使各探針A不會因接觸而導致檢測失誤;一底座B2,設於罩殼B1下方,該底座B2上設有一絕緣材質之支撐座B21,底座B2之一側設有一缺槽B22;四個例如彈簧之彈性件B3,設於該支撐座B21上,各彈性件B3的一端與支撐座B21接觸,另一端頂撐在對應之探針A之導引部A11下方,探針A受彈性件B3 之頂撐以其擋面A113頂觸在擋件B14下方,使各探針A皆能維持在同一水平高度上。 Please refer to FIGS. 3 and 4. The probe A of the embodiment of the present invention is used on the probe module B shown in the figure. The probe module B is provided with: a cover B1, which is provided with two The outer cover B11 and the two sheet spacers B12, the outer cover B11 and the spacer B12 are both insulating materials; inside each outer cover B11 is provided two parallel sliding grooves B112 separated by a one-piece spacer B111, and the outer cover B11 Two long slotted holes B113 are provided on the upper part for providing the lead piece A112 to pass through; two spacers B12 are sandwiched between the two covers B11 and passed through two pins B13 through the pins corresponding to the cover B11 and the spacer B12. The holes fix the two; the cover B1 is provided with two blocking members B14 of insulating material at the opening above the chute B112; four probes A are formed by two adjacent probes A having a mirrored symmetrical feature. The needle body parts A3 are arranged in a square matrix manner; the guide part A11 of the probe A can slide in the chute B112, and the blocking surface A113 on the guide part A11 can be blocked by the stopper B14 to guide. The portion A11 is kept sliding inside the cover B1, and the extension A2 and the needle body portion A3 are exposed outside the cover B1; each probe A is separated by a spacer B12 and a spacer B111 so that each Probe A will not cause detection errors due to contact; a base B2 is provided under the cover B1, a support base B21 of an insulating material is provided on the base B2, and a notch B22 is provided on one side of the base B2; four examples are A spring elastic member B3 is provided on the support base B21. One end of each elastic member B3 is in contact with the support base B21, and the other end is supported under the corresponding guide part A11 of the probe A. The probe A is supported by the elastic member B3. The top support is in contact with the stopper B14 with its blocking surface A113, so that each probe A can be maintained at the same level.

請參閱圖5、6、7,本發明實施例之探針模組B係使用於如圖所示之探針裝置C上,該探針裝置C設有包括:一座架C1,設有一位於上方呈倒L型之第一架體C11與一位於下方呈水平之第二架體C12,該第一架體C11與第二架體C12組成呈ㄈ字型之座架C1,並在第一架體C11水平頂部與第二架體C12之間形成一移動區間C13;第一架體C11水平頂部之下方設有一樞座C111與一撓性材質之緩衝件C112;第二架體C12上設有一通孔C121;移動區間C13內設有兩個相互平行之Z軸方向的導引件C131;一第一調整座C2,設於第一架體C11水平頂部之上方,其上設有一具有一探針孔座C211之探針架C21,該探針孔座C211上設有四個方型矩陣排列之探針孔C212;一移動機構C3,設於座架C1之移動區間C13內,該移動機構C3設有一移動部C31與一支撐部C32;該移動部C31上方設有一提供一例如彈簧之彈性件C311容置之容置孔C312,該彈性件C311設於第一架體C11水平頂部與移動部C31之間,一端樞套於樞座C111而另一端位於容置孔C312內;移動部C31下方設有一Z軸方向的槽孔C313,並有一調整塊C314設於該槽孔C313內,該調整塊C314上開設有一長槽孔C315,可嵌入一微調件C316之偏心部C317,並轉動該微調件C316而調整調整塊C314在槽孔C313內之高度;移動部C31上開設有兩個Z軸方向之樞孔C318,提供導引件C131穿設其中使移動機構C3可在移動區間C13內上、下移動;該支撐部C32上設有一第二調整座C4;一驅動模組C5,設於座架C1下方,該驅動模組C5設有一驅動機構C51與一受該驅動機構C51驅動之從動機構C52;驅動機構C51設有一馬達C511與一凸輪C512,該馬達C511設於第二架體C12上;該從動機構C52設有一具有滑軌C521之 側板C522與一滑塊C523,該側板C521設於第二架體C12上,該滑塊C523上設有一頂銷C524,可穿經第二架體C12之通孔C121而頂觸移動機構C3之調整塊C314,滑塊C523底部樞設有一從動輪C525與凸輪C512碰觸;從動機構C52藉由馬達C511驅動凸輪C512轉動而使滑塊C523在滑軌C521上進行上、下往復移動,進而使頂銷C524頂觸移動機構C3之調整塊C314而連動移動機構C3在移動區間C13內上、下往復移動,並在移動機構C3向上移動時與緩衝件C112接觸;該探針模組B設於支撐部C32之第二調整座C4上,可受連動而上、下往復移動使探針A之針身部A3穿經探針孔C212。 Please refer to FIGS. 5, 6, and 7. The probe module B according to the embodiment of the present invention is used on the probe device C shown in the figure. The probe device C is provided with: a rack C1, which is provided above A first frame C11 in an inverted L-shape and a second frame C12 in a horizontal position below the first frame C11 and the second frame C12 form a saddle-shaped seat C1. A moving section C13 is formed between the horizontal top of the body C11 and the second frame C12; a pivot seat C111 and a cushioning member C112 of a flexible material are arranged below the horizontal top of the first frame C11; a second frame C12 is provided with a A through-hole C121; a moving section C13 is provided with two guide members C131 parallel to each other in the Z-axis direction; a first adjusting seat C2 is provided above the horizontal top of the first frame C11, and a probe having a A probe holder C21 of the pinhole holder C211, which is provided with four probe holes C212 arranged in a square matrix; a moving mechanism C3 is provided in a moving section C13 of the holder C1, and the moving mechanism C3 is provided with a moving part C31 and a supporting part C32; a receiving part provided with an elastic member C311 such as a spring is arranged above the moving part C31 Hole C312, the elastic member C311 is located between the horizontal top of the first frame C11 and the moving portion C31, one end is pivoted on the pivot base C111 and the other end is located in the accommodation hole C312; a Z-axis direction is provided below the moving portion C31. Slot hole C313, and an adjustment block C314 is set in the slot hole C313. The adjustment block C314 is provided with a long slot hole C315, which can be inserted into the eccentric part C317 of the trimmer C316, and the trimmer C316 is rotated to adjust the adjustment block. The height of C314 in the slot C313; the moving part C31 is provided with two pivot holes C318 in the Z axis direction, and a guide C131 is provided to allow the moving mechanism C3 to move up and down in the moving section C13; the support A second adjusting seat C4 is provided on the part C32; a driving module C5 is provided under the seat frame C1, and the driving module C5 is provided with a driving mechanism C51 and a driven mechanism C52 driven by the driving mechanism C51; the driving mechanism C51 is provided with a motor C511 and a cam C512, and the motor C511 is provided on the second frame C12; the driven mechanism C52 is provided with a slide rail C521 Side plate C522 and a slider C523, the side plate C521 is provided on the second frame C12, and the slider C523 is provided with a top pin C524, which can pass through the through hole C121 of the second frame C12 and contact the moving mechanism C3. The adjusting block C314 and the bottom of the slider C523 are provided with a driven wheel C525 in contact with the cam C512. The driven mechanism C52 drives the cam C512 to rotate by the motor C511 to cause the slider C523 to reciprocate up and down on the slide C521. The top pin C524 is brought into contact with the adjustment block C314 of the moving mechanism C3, and the moving mechanism C3 is moved up and down in the moving section C13, and contacts the buffer C112 when the moving mechanism C3 moves upward; the probe module B is provided On the second adjustment base C4 of the support portion C32, the needle body portion A3 of the probe A can pass through the probe hole C212 by reciprocating up and down movement.

請參閱圖8,第一架體C11之水平頂部上設有一Y軸方向之槽道C113,第一架體C11旁側設有一固定塊C22,該固定塊C22上開設有一X軸方向之鏤孔C221與槽道C113相連通,並有一第一調整件C23由該鏤孔C221穿入槽道C113內,該第一調整件C23設有一偏心部C231與一軸桿部C232;第一調整座C2在下方凸設有一滑動部C24,該滑動部C24上設有一樞孔C241;移動機構C3之支撐部C32上設有一Y軸方向之鏤孔C321;第二調整座C4上設有一Z軸方向之螺孔C41,可提供一第二調整件C42穿入,該第二調整件C42設有一螺紋部C421與一卡嵌部C422及一轉動部C423;第二調整座C4之一側設有一X軸方向之槽道C43,支撐部C32設於該槽道C43內,槽道C43內設有一樞孔C431,並有一第三調整件C44由支撐部C32之一鏤孔C321穿入樞孔C431內,該第三調整件C44設有一偏心部C441與一轉動部C442;第二調整座C4之另一側設有一Z軸方向之槽道C45,探針模組B設於該槽道C45內;因探針A不如細長狀探針具有可撓曲之特性,故在進行檢測前需調整探針A位置使探針A之針身部A3可對準穿經探針孔座C211之探針孔C212,以使接觸面A32碰觸電子元件W底部;探針裝置C可分別調整第一調整座C2、第二調整座C4與探針模組B之相對位置而進行探針裝置C之X、Y、Z軸方向之調 整;第一調整座C2可進行Y軸方向之調整,以第一調整座C2下方之滑動部C24裝設在第一架體C11頂部之槽道C113內,使第一調整件C23之偏心部C231嵌入樞孔C241內,藉由轉動軸桿部C232以進行第一調整座C2在第一架體C11上Y軸方向之位移,並在移動到確定位置時以複數個螺固件將第一調整座C2固定於第一架體C11上;探針模組B可進行X或Z軸方向之調整,在進行Z軸方向調整時,探針模組B一側貼靠在第二調整座C4一側之槽道C45內,第二調整件C42之卡嵌部C422嵌入探針模組B之缺槽B21內,螺紋部C421螺入第二調整座C4之螺孔C41內,藉由轉動轉動部C423以進行探針模組B在第二調整座C4上Z軸方向之位移,並在移動到確定位置時以複數個螺固件固定探針模組B在第二調整座C4之位置;在進行X軸方向調整時,支撐部C32貼靠於第二調整座C4另一側之槽道C43內,使第三調整件C44之偏心部C441嵌入樞孔C431內,藉由轉動轉動部C442以進行第二調整座C4在支撐部C32上X軸方向之位移,並在移動到確定位置時以複數個螺固件將第二調整座C4固定於支撐部C32上。 Please refer to FIG. 8. A horizontal axis C113 is provided on the horizontal top of the first frame C11, and a fixing block C22 is provided on the side of the first frame C11. An opening in the X-axis direction is provided on the fixing block C22. C221 communicates with the channel C113, and a first adjusting member C23 penetrates the channel C113 through the through hole C221. The first adjusting member C23 is provided with an eccentric portion C231 and a shaft portion C232; the first adjusting seat C2 is at A sliding portion C24 is protruded below, and a pivot hole C241 is provided on the sliding portion C24; a support C32 of the moving mechanism C3 is provided with a yoke C321 in the Y axis direction; a second adjustment seat C4 is provided with a screw in the Z axis direction The hole C41 can be provided with a second adjusting member C42. The second adjusting member C42 is provided with a threaded portion C421, an engaging portion C422, and a rotating portion C423. One side of the second adjusting seat C4 is provided with an X-axis direction. The channel C43, the supporting portion C32 is provided in the channel C43, the channel C43 is provided with a pivot hole C431, and a third adjusting member C44 is penetrated into the pivot hole C431 by the one of the support holes C32 through the hole C321. The third adjusting member C44 is provided with an eccentric portion C441 and a rotating portion C442; the other side of the second adjusting seat C4 is provided with a Z-axis direction Channel C45, probe module B is located in this channel C45; because probe A is not as flexible as the slender probe, it is necessary to adjust the position of probe A to make the needle of probe A The body A3 can be aligned with the probe hole C212 passing through the probe hole base C211, so that the contact surface A32 touches the bottom of the electronic component W; the probe device C can adjust the first adjustment base C2, the second adjustment base C4, and Adjust the X, Y, and Z axis directions of the probe device C with the relative position of the probe module B The first adjustment base C2 can be adjusted in the Y-axis direction. A sliding portion C24 below the first adjustment base C2 is installed in a channel C113 at the top of the first frame C11, so that the eccentric portion of the first adjustment piece C23 C231 is embedded in the pivot hole C241, and the first adjustment seat C2 is displaced in the Y-axis direction on the first frame C11 by rotating the shaft C232, and the first adjustment is performed by a plurality of screws when moving to a certain position The base C2 is fixed on the first frame C11; the probe module B can be adjusted in the X or Z axis direction. When the Z axis is adjusted, the probe module B side is abutted against the second adjustment base C4. In the channel C45 on the side, the engaging portion C422 of the second adjusting member C42 is inserted into the lacking groove B21 of the probe module B, and the threaded portion C421 is screwed into the screw hole C41 of the second adjusting seat C4. C423 performs the displacement of the probe module B on the second adjustment base C4 in the Z axis direction, and when moving to a certain position, fixes the position of the probe module B on the second adjustment base C4 with a plurality of screw fixtures; When adjusting in the X-axis direction, the support portion C32 abuts on the channel C43 on the other side of the second adjustment base C4, so that the eccentric portion C441 of the third adjustment member C44 Into the pivot hole C431, the second adjustment base C4 is displaced in the X-axis direction on the support portion C32 by rotating the rotating portion C442, and the second adjustment base C4 is fixed to the position by a plurality of screws when moving to a certain position. On the support portion C32.

請參閱圖9,本發明實施例之探針裝置C係使用於如圖所示之電子元件檢測設備D上,該電子元件檢測設備D設有包括:一工作台面D1,呈水平設置,其上開設有一鏤口D11;一轉盤D2,設於該工作台面D1上,其周緣環列佈設等間距且設有朝外開口之容槽D21,電子元件W在該容槽D21內以一間歇旋轉流路受轉盤D2搬送;該探針裝置C設於工作台面D1之下方,用以對容槽D21內之電子元件W進行物理特性檢測,探針裝置C之探針架C21可伸入鏤口D11中使探針孔座C211約略與工作台面D1之上表面切齊在同一水平。 Please refer to FIG. 9. The probe device C according to the embodiment of the present invention is used in the electronic component testing equipment D shown in the figure. The electronic component testing equipment D is provided with a work surface D1, which is horizontally disposed thereon. A cutout D11 is set up; a turntable D2 is set on the work surface D1, and a circumferential groove is arranged at equal intervals and an outward opening is provided in the groove D21, and the electronic component W flows intermittently in the groove D21 It is transported by the turntable D2; the probe device C is located below the work surface D1, and is used to detect the physical characteristics of the electronic component W in the tank D21. The probe holder C21 of the probe device C can extend into the opening D11. The middle of the probe hole base C211 is approximately aligned with the upper surface of the work surface D1.

本發明實施例之電子元件檢測方法在實施上,四支探針A以方型矩陣方式排列使各探針A之導引部A11可在對應之滑槽B112內滑移,並各受滑 槽B112內對應之彈性件B3頂撐;在電子元件W受一間歇性旋轉之轉盤D2搬運至探針裝置C上方時,移動機構C3受驅動模組C5驅動而連動探針模組B向上位移;使各探針A在其針身部A3之接觸面A32頂觸容槽D21內之電子元件W底部進行物理特性檢測時,探針A會因電子元件W之重量而以其導引部A11在對應之滑槽B112內向下位移壓縮對應之彈性件B3以達緩衝之效果。 In the implementation of the electronic component detection method of the embodiment of the present invention, four probes A are arranged in a square matrix manner, so that the guide portion A11 of each probe A can slide in the corresponding chute B112, and each is subject to sliding. The corresponding elastic piece B3 in the groove B112 is supported by the top; when the electronic component W is carried over the probe device C by an intermittently rotating turntable D2, the moving mechanism C3 is driven by the drive module C5 to move the probe module B upward. ; When each probe A performs physical property detection on the bottom of the electronic component W in the contact surface A32 of the needle body A3 top contact volume D21, the probe A uses its guide A11 due to the weight of the electronic component W The corresponding elastic member B3 is compressed and displaced downward in the corresponding chute B112 to achieve the buffer effect.

本發明實施例之探針模組、探針裝置及使用該探針裝置之電子元件檢測方法及設備,探針A具有不同水平寬度之本體部A1、延伸部A2與針身部A3且三者之端面A31、A21、A14皆切齊同一條垂直線L2上,可限制探針A整體之水平寬度在本體部A1之寬度範圍內,此種探針A在空間配置上較為簡單,可減少製造之成本;且探針A在探針模組B內以其導引部A11在滑槽B112內滑移,探針裝置C在驅動探針模組B位移使探針A接觸到電子元件W時,探針A在滑槽B112內可壓縮彈性件B3以緩衝探針A接觸電子元件W之壓力,不僅可取代習知之力臂,且在對不同重量之電子元件進行檢測時,僅須更換對應彈性係數之彈性件B3,不須重新設計並更換新的探針A,可減少使用之成本。 In the probe module, the probe device, and the electronic component detection method and device using the probe device according to the embodiment of the present invention, the probe A has a body portion A1, an extension portion A2, and a needle body portion A3 and three of different horizontal widths. The end faces A31, A21, and A14 are all aligned on the same vertical line L2, which can limit the overall horizontal width of the probe A to the width of the body portion A1. This probe A is simple in space configuration and can reduce manufacturing Cost; and the probe A slides in the chute B112 with its guide A11 in the probe module B. When the probe device C drives the probe module B to displace and makes the probe A contact the electronic component W The probe A can compress the elastic member B3 in the chute B112 to cushion the pressure of the probe A contacting the electronic component W. Not only can it replace the conventional force arm, but when testing electronic components with different weights, it only needs to be replaced. The elastic component B3 of the elastic coefficient does not need to be redesigned and replaced with a new probe A, which can reduce the cost of use.

惟以上所述者,僅為本發明之較佳實施例而已,當不能以此限定本發明實施之範圍,即大凡依本發明申請專利範圍及發明說明內容所作之簡單的等效變化與修飾,皆仍屬本發明專利涵蓋之範圍內。 However, the above are only the preferred embodiments of the present invention. When the scope of implementation of the present invention cannot be limited by this, that is, the simple equivalent changes and modifications made according to the scope of the patent application and the description of the invention, All are still within the scope of the invention patent.

Claims (11)

一種探針模組,包括:複數支探針;一罩殼,設有複數個滑槽,該複數支探針可分別在對應之滑槽內滑移;一底座,設於該罩殼下方,該底座上設有一支撐座;複數支彈性件,設於該支撐座上,各彈性件的一端與該支撐座接觸,另一端頂撐在對應之探針的下方。A probe module includes: a plurality of probes; a cover provided with a plurality of slide grooves, the plurality of probes can be slid in the corresponding slide grooves respectively; a base provided under the cover, The base is provided with a support base; a plurality of elastic members are arranged on the support base, one end of each elastic member is in contact with the support base, and the other end is supported under the corresponding probe. 如申請專利範圍第1項所述探針模組,其中,該探針包括:一本體部;一延伸部,其由該本體部向上延伸;一針身部,設於延伸部上方;該本體部、該延伸部與該針身部,三者分別具有不同之水平寬度,寬度由寬至窄之排序為該本體部>該延伸部>該針身部;該本體部之一端面平齊該延伸部之一端面與該針身部之一端面,三者皆切齊同一條垂直線上。The probe module according to item 1 of the patent application scope, wherein the probe comprises: a body portion; an extension portion extending upward from the body portion; a needle body portion provided above the extension portion; the body The body part, the extension part and the needle body part respectively have different horizontal widths, and the width is sorted from wide to narrow as the body part> the extension part> the needle body part; one end face of the body part is flush with the One end surface of the extension portion and one end surface of the needle body portion are all aligned on the same vertical line. 如申請專利範圍第2項所述探針模組,其中,該本體部凸設有一導引部於其一側面,該導引部具有矩形截面且導引部之一端面平齊該本體部之一端面,兩者皆切齊同一條水平線上。According to the probe module according to item 2 of the scope of patent application, the main body part is provided with a guide part on one side thereof, the guide part has a rectangular cross section and one end face of the guide part is flush with the main body part. One end face, both are aligned on the same horizontal line. 如申請專利範圍第3項所述探針模組,其中,該導引部上設有一導接件用以與導線連接。According to the probe module according to item 3 of the patent application scope, a guiding member is provided on the guiding portion for connecting with the lead wire. 如申請專利範圍第2項所述探針模組,其中,該延伸部之水平寬度向上遞減。The probe module according to item 2 of the scope of patent application, wherein the horizontal width of the extension portion decreases upward. 如申請專利範圍第2項所述探針模組,其中,該延伸部上設有一導接孔用以與導線連接。The probe module according to item 2 of the scope of patent application, wherein the extension portion is provided with a lead-through hole for connecting with the lead wire. 如申請專利範圍第2項所述探針模組,其中,該針身部上設有一呈矩形之接觸面。The probe module according to item 2 of the scope of patent application, wherein the needle body is provided with a rectangular contact surface. 一種探針裝置,使用如申請專利範圍第1至7項任一項所述探針模組,包括:一座架,設有一移動區間;一移動機構,設於該座架之該移動區間內,該移動機構設有一移動部與一支撐部;一驅動模組,設於該座架下方,使移動機構在該移動區間內上、下往復移動;該探針模組設於該支撐部上,受移動機構之連動而上、下往復移動。A probe device using the probe module according to any one of claims 1 to 7 of the scope of patent application, comprising: a frame provided with a moving section; a moving mechanism provided in the moving section of the seat frame, The moving mechanism is provided with a moving part and a supporting part; a driving module is arranged below the seat frame, so that the moving mechanism moves up and down in the moving section; the probe module is arranged on the supporting part, Reciprocated by the moving mechanism to move up and down. 一種電子元件檢測方法,使用如申請專利範圍第8項所述探針裝置,包括:使複數支探針各在對應之滑槽內滑移,並各受滑槽內對應之彈性件頂撐;在電子元件受一間歇性旋轉之轉盤搬運至探針裝置上方時,移動機構受驅動模組驅動而連動探針模組位移;使複數支探針在接觸電子元件進行特性檢測時,複數支探針各在對應之滑槽內位移壓縮對應之彈性件。An electronic component detection method using the probe device described in item 8 of the scope of patent application, comprising: sliding a plurality of probes each in a corresponding chute, and each receiving a corresponding elastic member top support in the chute; When the electronic component is carried over the probe device by an intermittently rotating turntable, the moving mechanism is driven by the driving module to move the probe module in linkage; when a plurality of probes contact the electronic component for characteristic detection, the plurality of probes are The needles are each displaced in the corresponding chute to compress the corresponding elastic member. 一種電子元件檢測設備,包括:用以執行如申請專利範圍第9項所述電子元件檢測方法之設備。An electronic component testing device includes: a device for performing the electronic component testing method according to item 9 of the scope of patent application. 一種電子元件檢測設備,使用如申請專利範圍第8項所述探針裝置,包括:一工作台面;一轉盤,設於該工作台面上,其周緣環列佈設等間距且設有朝外開口之容槽;該探針裝置設於該工作台面之下方,用以對該容槽內之一電子元件進行檢測。An electronic component testing equipment using the probe device as described in item 8 of the scope of patent application, comprising: a work surface; a turntable provided on the work surface, the peripheral ring lines of which are arranged at equal intervals and are provided with outward openings Receptacle; the probe device is arranged below the work surface and used to detect an electronic component in the receptacle.
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