TWI644631B - Insole structure - Google Patents
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- TWI644631B TWI644631B TW106134606A TW106134606A TWI644631B TW I644631 B TWI644631 B TW I644631B TW 106134606 A TW106134606 A TW 106134606A TW 106134606 A TW106134606 A TW 106134606A TW I644631 B TWI644631 B TW I644631B
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Abstract
一種鞋墊結構,主要包含一上墊及一下墊,該上墊為一柔軟可撓性的織物層,該上墊底面設置有定位元件;該下墊的主體係為一有眾多氣室不相連的獨立氣泡所構成的發泡體,該下墊的底面有一防滑元件,頂面有結合元件;係將該上墊的定位元件與下墊的結合元件相連結,使上墊定位於下墊上,透過下墊達到支撐、緩衝及吸震散壓的功效,而上墊則達到舒適踩踏之功效,當上墊髒污時,只要進行上墊更換即可,無須更換整個鞋墊。 An insole structure mainly comprises an upper pad and a lower pad, wherein the upper pad is a soft and flexible fabric layer, and the bottom surface of the upper pad is provided with a positioning component; the main system of the lower pad is a plurality of air cells not connected a foam composed of independent bubbles, the bottom surface of which has an anti-slip element, and the top surface has a coupling element; the positioning element of the upper pad is coupled with the bonding element of the lower pad, and the upper pad is positioned on the lower pad, The underpad achieves the functions of support, cushioning and shock absorption, while the upper pad achieves the effect of comfortable pedaling. When the pad is dirty, the pad can be replaced without replacing the entire insole.
Description
本發明是有關一種鞋墊結構,特別是一種具有更拆裝的上墊,當上墊髒污時,只要更換上墊或將上墊進行清洗,無須清洗整個或將整個鞋墊丟棄的鞋墊結構。 The invention relates to an insole structure, in particular to an insole structure having a more disassembled upper pad. When the upper pad is dirty, the upper pad is replaced or the upper pad is cleaned, and the insole structure is not required to be washed or discarded.
習知功能性鞋墊主要訴求重點不外乎是足弓的支撐,或是透氣防腳氣的設計,或是結合吸震散壓材降低腳底的壓力,舉凡訴求功能性的鞋墊,在費用上皆較一般鞋墊昂貴,且為製作具有功能性的鞋墊,通常會造成製作上的工序增加,導致製作繁瑣,且為了達到其中一種功能,通常就必需捨棄其他功能,例如:透氣性鞋墊,通常支撐效果就不佳,因此,習知鞋墊很難集中多功能於一身。再者,足弓支撐的鞋墊通常為專業醫師建議穿戴,以進行足弓的矯正,使矯正鞋墊的費用更為高昂,且為了矯正足弓,必然捨棄吸震散壓及透氣等功能,顧此失彼,實有改良之必要。 The main point of the functional insole is that it is the support of the arch, or the design of the breathable anti-foot, or the combination of the shock-absorbing material to reduce the pressure on the sole of the foot, and the insole that appeals to the function is more expensive. Insole is expensive, and in order to make a functional insole, it usually causes an increase in the number of manufacturing processes, resulting in cumbersome production, and in order to achieve one of the functions, it is usually necessary to discard other functions, such as: breathable insole, usually the support effect is not Good, therefore, the conventional insole is difficult to concentrate on one. Furthermore, the insole supported by the arch is usually recommended by a professional physician for the correction of the arch, so that the cost of the corrective insole is higher, and in order to correct the arch, it is necessary to abandon the functions of shock absorption, ventilation and ventilation. There is a need for improvement.
且無論是有功能的鞋墊或是一般的鞋墊,主要的構造上通常包含一個主體的泡棉層,並在該主體泡棉層的頂面固定結合一層面布層,透過面布層進行除臭、抗菌或添加能量石,以避免鞋子發出異味,及顧及使用者的腳部健康。 And whether it is a functional insole or a general insole, the main structure usually comprises a foam layer of the main body, and a top layer of the main foam layer is fixedly combined with a layer of cloth layer, and the surface layer is deodorized. , antibacterial or add energy stone to avoid the smell of shoes, and take into account the health of the user's feet.
雖然習知鞋墊已具有多種功能,但該面布層通常無法自主體的泡棉層中拆除,因面布層會與泡棉層緊密接合,一但面布層發生破損或髒損時, 使用者通常只能將鞋墊丟棄重新更換,或者,將整個鞋墊進行刷洗,如此,即會讓泡棉層吸收水分而受潮,使鞋墊的使用壽命降低。 Although the conventional insole has a plurality of functions, the face layer is usually not removed from the foam layer of the main body, because the face layer is tightly bonded to the foam layer, and when the face layer is damaged or dirty, The user can usually only discard the insole and replace it, or brush the entire insole. This will cause the foam layer to absorb moisture and get wet, which will reduce the service life of the insole.
再者,要將多層材料的鞋墊依序堆疊固定,並維持表面的平整,在製作程序上非常繁瑣耗時,尤其若要添加其他功能時,必須針對構造進行改良,因製作程序繁瑣,必然耗費諸多工時,導致成本增加,相對造成消費者需花費更多的費用才能購買,造成消費者經濟上的負擔。 Furthermore, it is necessary to stack and fix the insole of the multi-layer material in order, and to maintain the smoothness of the surface, which is very cumbersome and time-consuming in the production process. In particular, if other functions are to be added, the structure must be improved, and the production process is cumbersome and inevitable. Many working hours lead to increased costs, which in turn causes consumers to spend more to purchase, resulting in a financial burden on consumers.
因此,若能設計一款價格便宜,縮短製作工時,且同時集多種功能於一身的鞋墊,方是當務之急的設計。 Therefore, if you can design an insole that is cheap, shortens the production time, and combines multiple functions at the same time, it is a must.
一種鞋墊結構,係包括:一上墊,該上墊係具有柔軟及可捲繞收折之特性,具有一頂面及一底面,該底面上設置有定位元件,而頂面則為舒適表面;一下墊,該下墊包含有一具有眾多氣室不相連的獨立氣泡所構成的發泡體,該發泡體的底端有一防滑元件,並於發泡體頂面設置有一結合元件;係將該上墊的底面結合於該下墊的發泡體頂面上,使定位元件與結合元件相結合,致使上墊不會在下墊上滑動,而穩定結合於下墊上。 An insole structure comprising: an upper pad having a soft and windable folding property, having a top surface and a bottom surface, wherein the bottom surface is provided with a positioning component, and the top surface is a comfortable surface; a lower pad comprising a foam body having a plurality of independent cells which are not connected to each other, the bottom end of the foam body having an anti-slip element, and a coupling member disposed on the top surface of the foam body; The bottom surface of the upper pad is bonded to the top surface of the foam of the lower pad, so that the positioning component is combined with the bonding component, so that the upper pad does not slide on the lower pad, and is stably coupled to the lower pad.
於一較佳實施例中,其中該上墊為一織物或泡棉或織物與泡棉的結合。 In a preferred embodiment, the upper pad is a fabric or a combination of foam or fabric and foam.
於一較佳實施例中,其中該上墊內部具有一填充空間,以供緩衝物進行填充。 In a preferred embodiment, the top of the upper pad has a filling space for the buffer to fill.
於一較佳實施例中,其中該上墊的定位元件為及下墊的結合元件為可相互氈合的魔鬼氈。 In a preferred embodiment, the positioning element of the upper pad and the bonding element of the lower pad are devil felts that can be mated to each other.
於一較佳實施例中,其中該魔鬼氈是局部設置於下墊及上墊,使上墊及下墊的結合面具有縫隙,以供空氣流通,讓使用者的腳底不會有悶濕感。 In a preferred embodiment, the devil felt is partially disposed on the lower pad and the upper pad, so that the joint surface of the upper pad and the lower pad has a gap for air circulation, so that the user's sole does not have a feeling of suffocation. .
於一較佳實施例中,其中該上墊的定位元件為一毛面,而下墊的定位元件係為一網狀籤維毛刺絲,該網狀纖維毛刺絲的長度小於上墊的厚度,使該網狀纖維毛刺絲不會貫穿上墊的頂面,且當該網住纖維毛刺絲刺入上墊的毛面中時,該上墊會穩定固定於上墊的頂面,不會隨意移動。 In a preferred embodiment, wherein the positioning component of the upper pad is a matte surface, and the positioning component of the lower pad is a mesh-shaped burr, the length of the reticular fiber burr is less than the thickness of the upper pad. The reticular fiber burr wire does not penetrate the top surface of the upper pad, and when the meshing fiber burr is inserted into the matte surface of the upper pad, the upper pad is stably fixed to the top surface of the upper pad, and is not free mobile.
於一較佳實施例中,其中該網狀纖維毛刺絲係為不規則朝上或斜上設置,刺入上墊毛面內時,讓上墊更為穩固於下墊上。 In a preferred embodiment, wherein the reticular fiber burr is irregularly arranged upward or obliquely, the upper pad is more stable on the lower pad when piercing into the upper surface of the upper pad.
於一較佳實施例中,其中該具有眾多氣室不相連的獨立氣泡所構成的發泡體可為化學架橋(cross-linked)發泡體(XPE Foam或XPP Foam)或電子架橋(cross-linked)發泡體(EPE Foam或EPP Foam),發泡倍數為2-40倍,厚度為2~5mm。 In a preferred embodiment, the foam composed of the closed cells having a plurality of gas chambers that are not connected may be a cross-linked foam (XPE Foam or XPP Foam) or an electronic bridge (cross-). Linked) Foam (EPE Foam or EPP Foam) with a foaming ratio of 2 to 40 times and a thickness of 2 to 5 mm.
於一較佳實施例中,其中該防滑元件係為合成橡膠,該防滑元件表面具有防滑花紋。 In a preferred embodiment, the anti-slip element is a synthetic rubber having a non-slip pattern on the surface.
1‧‧‧上墊 1‧‧‧Upper pad
11‧‧‧頂面 11‧‧‧ top surface
12‧‧‧底面 12‧‧‧ bottom
121‧‧‧定位元件 121‧‧‧ Positioning components
2‧‧‧下墊 2‧‧‧ Under pad
21‧‧‧發泡體 21‧‧‧Foam
22‧‧‧防滑元件 22‧‧‧Slip components
23‧‧‧結合元件 23‧‧‧Combined components
3‧‧‧氣流 3‧‧‧ airflow
4‧‧‧鞋子 4‧‧‧ shoes
5‧‧‧腳部 5‧‧‧foot
[第1圖]係本發明鞋墊結構之第一實施例之組裝示意圖。 [Fig. 1] is a schematic view showing the assembly of the first embodiment of the insole structure of the present invention.
[第2圖]係本發明鞋墊結構之第一實施例之立體背面示意圖。 [Fig. 2] is a perspective rear perspective view showing a first embodiment of the insole structure of the present invention.
[第3圖]係本發明鞋墊結構之第一實施例之立體正面示意圖。 [Fig. 3] is a perspective front elevational view showing a first embodiment of the insole structure of the present invention.
[第4圖]係本發明鞋墊結構之第一實施例之剖面示意圖。 [Fig. 4] is a schematic cross-sectional view showing a first embodiment of the insole structure of the present invention.
[第5圖]係本發明鞋墊結構之第一實施例上墊拆卸示意圖。 [Fig. 5] Fig. 5 is a schematic view showing the disassembly of the pad of the first embodiment of the insole structure of the present invention.
[第6圖]係本發明鞋墊結構之第二實施例分解示意圖。 [Fig. 6] is an exploded perspective view showing a second embodiment of the insole structure of the present invention.
[第7圖]係本發明鞋墊結構之第二實施例組裝示意圖。 [Fig. 7] Fig. 7 is a schematic view showing the assembly of the second embodiment of the insole structure of the present invention.
[第8圖]係本發明鞋墊結構之腳後跟踩踏示意圖。 [Fig. 8] is a schematic view of the heel pedal of the insole structure of the present invention.
[第9圖]係本發明鞋墊結構之第三實施示意圖。 [Fig. 9] is a third embodiment of the structure of the insole of the present invention.
[第10圖]係本發明鞋墊結構之第四實施示意圖。 [Fig. 10] is a fourth embodiment of the structure of the insole of the present invention.
[第11圖]係本發明鞋墊結構之第五實施示意圖。 [Fig. 11] is a fifth embodiment of the structure of the insole of the present invention.
[第12圖]係本發明鞋墊結構之氣流流動示意圖。 [Fig. 12] is a schematic view showing the flow of airflow of the insole structure of the present invention.
[第13圖]係本發明鞋墊結構之置放於鞋內示意圖。 [Fig. 13] is a schematic view showing the insole structure of the present invention placed in a shoe.
有關於本發明其他技術內容、特點與功效,在以下配合參考圖式之較佳實施例的詳細說明中,將可清楚的呈現。 Other details, features, and advantages of the present invention will be apparent from the following description of the preferred embodiments.
請參閱第1、2及3圖,為本發明鞋墊結構之第一實施例分解、立體示意圖,由圖中可知,主要包含有一上墊1及一下墊2,該上墊1係為具有柔軟或可捲繞或可撓性或可變形的彈性體、織物或發泡體或織物與發泡體的結合或柔軟透氣的皮革,該上墊1具有一頂面11及一底面12,該頂面11係為舒適表面,可具有防滑及吸濕排汗及除臭的特性,而該底面12上設置有一定位元件121,於本實施例中,該定位元件121為一毛面。且該上墊1可視需求設置為一實心體或空心體,若為空心體,會使上墊具有一填充空間,該填充空間可供具有吸震散壓特性的填充物進行填充。 Please refer to the figures 1 , 2 and 3 , which are exploded and perspective views of the first embodiment of the insole structure of the present invention. As can be seen from the drawings, the main pad 1 and the lower pad 2 are mainly included, and the upper pad 1 is soft or a rollable or flexible or deformable elastomer, fabric or foam or fabric bonded to a foam or a soft breathable leather, the upper mat 1 having a top surface 11 and a bottom surface 12, the top surface 11 is a comfortable surface, which has the characteristics of anti-slip and moisture wicking and deodorization, and the bottom surface 12 is provided with a positioning member 121. In the embodiment, the positioning member 121 is a matte surface. The upper pad 1 can be set as a solid body or a hollow body according to requirements. If it is a hollow body, the upper pad has a filling space, and the filling space can be filled with a filler having shock absorbing and diffusing characteristics.
該下墊2包含一具有眾多氣室不相連的獨立氣泡所構成的發泡體21,該發泡體21係為可為化學架橋(cross-linked)發泡體(XPE Foam或XPP Foam)或電子架橋(cross-linked)發泡體(EPE Foam或EPP Foam)製作而成,發泡倍數為 2-40倍,厚度為2mm、3mm、4mmc或5mm,該發泡體21的底端面有一防滑元件22,該防滑元件22可為合成橡膠,係於防滑元件22上設置有防滑花紋,而發泡體21的頂面設置有結合元件23,於本實施例中,該結合元件23為網狀纖維毛刺絲,該網狀纖維毛刺絲可佈滿或局部結合於發泡體2的頂面上,該網狀纖維毛刺絲23的長度必須小於上墊1的厚度,避免網狀纖維毛刺絲23貫穿該上墊1頂面,且該網狀纖維毛刺絲23為傾斜向上或直上設置。 The underpad 2 comprises a foam 21 composed of a plurality of independent cells which are not connected to each other, and the foam 21 is a chemically cross-linked foam (XPE Foam or XPP Foam) or Made of cross-linked foam (EPE Foam or EPP Foam) with a foaming ratio of 2-40 times, the thickness is 2mm, 3mm, 4mmc or 5mm, the bottom end surface of the foam body 21 has an anti-slip element 22, the anti-slip element 22 can be a synthetic rubber, and the anti-slip element 22 is provided with a non-slip pattern, and The top surface of the bubble body 21 is provided with a bonding member 23, which in this embodiment is a reticular fiber burr wire which can be fully or partially bonded to the top surface of the foam body 2. The length of the reticular fiber burr 23 must be smaller than the thickness of the upper pad 1 to prevent the reticular fiber burr 23 from penetrating the top surface of the upper pad 1, and the reticular fiber burr 23 is disposed obliquely upward or straight.
上述該發泡體21的發泡倍數較佳為2倍、3倍、4倍、5倍、6倍、7倍、8倍、9倍、10倍、11倍、12倍、13倍、14倍、15倍、16倍、17倍、18倍、19倍、20倍、21倍、22倍、23倍、24倍、25倍、26倍、27倍、28倍、29倍、30倍、31倍、32倍、33倍、34倍、35倍、36倍、37倍、38倍、39倍及40倍。 The foaming ratio of the foam 21 is preferably 2, 3, 4, 5, 6, 7, 8, 8, 9, 10, 11, 12, 13 or 14 Multiple, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29, 30, 31 times, 32 times, 33 times, 34 times, 35 times, 36 times, 37 times, 38 times, 39 times and 40 times.
係將該上墊1的底面結合於下墊2的頂面,使上墊1的定位元件121與下墊2的結合元件23緊密結合,讓上墊1固定於下墊2上,在本實施例中,請參照第4~6圖所示,該網狀纖維毛刺絲23係穿入上墊2的毛面中,一旦上墊1受到X(左右方向)或Y軸(前後方向)方向的力量時,該上墊1並不會滑動,因受到網狀纖維毛刺絲23的限位。但若如第6圖所示,該上墊1若受到Z軸(上下方向)方向的力量時,即可輕易被向上拉拔,使上墊1毛面脫離網狀纖維毛刺絲23,而與下墊2相脫離。 The bottom surface of the upper pad 1 is coupled to the top surface of the lower pad 2, so that the positioning component 121 of the upper pad 1 and the bonding component 23 of the lower pad 2 are tightly coupled, and the upper pad 1 is fixed to the lower pad 2, in the present embodiment. In the example, as shown in Figs. 4 to 6, the reticular fiber burr 23 penetrates into the matte surface of the upper mat 2, and once the upper mat 1 is subjected to X (left-right direction) or Y-axis (front-rear direction) When the force is applied, the upper pad 1 does not slide due to the restriction of the reticular fiber burr 23 . However, as shown in Fig. 6, when the upper pad 1 receives the force in the Z-axis (up and down direction) direction, it can be easily pulled upward, so that the upper surface of the upper pad 1 is separated from the reticular fiber burr 23, and The lower pad 2 is detached.
請參閱第7及8圖所示,該下墊2可先被塑形成腳底的造型(對應於足弓位置隆起),由於該上墊1具有可變形的特性,因此,當上墊1結合於下墊2上時,該上墊1即會如第8圖所示,被塑形出與下墊2頂面相同的形狀(具有足弓的造型)。 Referring to Figures 7 and 8, the underpad 2 can be first molded into a shape of the sole (corresponding to the position of the arch of the arch). Since the upper pad 1 has deformable characteristics, when the upper pad 1 is coupled to When the lower pad 2 is placed, the upper pad 1 is shaped like the top surface of the lower pad 2 as shown in Fig. 8 (having a shape of a foot arch).
請參閱第9、10及11圖所示,該上墊1底面的定位元件121及下墊2頂面的結合元件23可為相互氈黏的魔鬼氈,如第9圖所示,該定位元件121及結合元件23可設置於上墊1及下墊2的兩側邊;或如第10圖所示,該定位元件121及結合元件23可為長條狀,並設置於上墊1及下墊2的接近中間處;或如第11圖所示,該定位元件121及結合元件23可設置於上墊1及下墊2的接近接近前端及後端處,其他結構皆與第1~8圖相同,於此不在贅述。 Referring to Figures 9, 10 and 11, the positioning member 121 of the bottom surface of the upper pad 1 and the bonding member 23 of the top surface of the lower pad 2 may be mutually felted devil felts, as shown in Fig. 9, the positioning element 121 and the coupling member 23 can be disposed on both sides of the upper pad 1 and the lower pad 2; or as shown in FIG. 10, the positioning member 121 and the coupling member 23 can be elongated and disposed on the upper pad 1 and below. The locating element 121 and the splicing element 23 can be disposed near the front end and the rear end of the upper pad 1 and the lower pad 2, and other structures are the same as the first to eighth ends. The figures are the same and will not be described here.
請參閱的12圖所示,由於該上墊1底面12與下墊2頂面並非完全密合的結合,使上墊1與下墊2之間具有隙縫,此隙縫即可供氣流3流通,達到散熱之目的。 Referring to FIG. 12, since the bottom surface 12 of the upper pad 1 and the top surface of the lower pad 2 are not completely tightly joined, a gap is formed between the upper pad 1 and the lower pad 2, and the slit is available for the airflow 3 to circulate. To achieve the purpose of heat dissipation.
請參閱第13圖所示,當結合有上墊1的下墊2放置於鞋子4內時,由於該下墊2的結合元件23會限制上墊1的定位元件121朝X軸(左右方向)及Y軸(前後方向)方向的移動,因此,當使用者腳部5踏於上墊1上進行走路時,該上墊1因受到下墊2之結合元件23的限制,所以不會往前、後或左、右移動,讓使用者可穩定行走,腳部5不會有不舒服的感受,且透過發泡體21具有獨立的封閉式氣泡,而具有重量輕、支撐力夠的優點,同時兼具吸震散壓及緩衝的特性,以減輕使用者腳部下壓時的力量。且由於上墊1及下墊2的接合處並非密合,而有縫隙,使用者在走路時,該上墊1會往下墊2壓抵,使上墊1及下墊2會產生開合及閉合動作,以帶動氣流通動,而迅速將腳底熱能帶出,以達到散熱之目的;再者,由於該上墊1與下墊2為可裝拆的結合方式,當上墊1使用一段時間,產生髒污或異味時,使用者可將上墊1自下墊2拆除,更換新的上墊1即可,達到節省成本之目的。 Referring to FIG. 13, when the lower pad 2 incorporating the upper pad 1 is placed in the shoe 4, since the coupling member 23 of the lower pad 2 restricts the positioning member 121 of the upper pad 1 toward the X-axis (left-right direction) And the movement in the Y-axis (front-rear direction) direction. Therefore, when the user's foot portion 5 is stepped on the upper pad 1, the upper pad 1 is restricted by the coupling member 23 of the lower pad 2, so it does not advance. Moving backwards or left and right, the user can walk stably, the foot 5 does not have an uncomfortable feeling, and the foam 21 has independent closed bubbles, and has the advantages of light weight and sufficient supporting force. At the same time, it combines the characteristics of shock absorption and cushioning to reduce the force when the user presses the foot. Moreover, since the joint between the upper pad 1 and the lower pad 2 is not tight and there is a gap, when the user walks, the upper pad 1 will be pressed against the lower pad 2, so that the upper pad 1 and the lower pad 2 will open and close. And the closing action, in order to drive the airflow, and quickly bring out the heat energy of the sole to achieve the purpose of heat dissipation; further, since the upper pad 1 and the lower pad 2 are detachable and combined, when the upper pad 1 uses a section When the time or dirt is generated, the user can remove the upper pad 1 from the lower pad 2 and replace the new upper pad 1 to achieve cost saving.
本發明所提供之鞋墊結構,與其他習用技術相互比較時,其優點如下: The advantages of the insole structure provided by the present invention when compared with other conventional techniques are as follows:
1.本發明的下墊是採用化學架橋(cross-linked)發泡體(XPE Foam或XPP Foam)或電子架橋(cross-linked)發泡體(EPE Foam或EPP Foam)的具有眾多氣室不相連的獨立氣泡所構成的發泡體做為主體,所以緩衝及吸震散壓效果相當佳,可以吸收使用者在走路時腳部產生的振動力及壓力,且發泡體的重量輕,置放於鞋內時,可降低整個鞋子的重量,進而減輕使用者腳部的負擔,且下墊的重量輕特性,更可讓上墊材料具有更好的選擇及設計。 1. The underpad of the present invention has a plurality of gas chambers using a chemical cross-linked foam (XPE Foam or XPP Foam) or an electronic cross-linked foam (EPE Foam or EPP Foam). The foam composed of the connected independent bubbles is used as the main body, so the cushioning and shock absorption and dispersion effects are quite good, and the vibration force and pressure generated by the user when walking can be absorbed, and the weight of the foam is light and placed. When in the shoe, the weight of the whole shoe can be reduced, thereby reducing the burden on the user's foot, and the lightweight weight of the underpad can make the upper pad material have better selection and design.
2.本發明的下墊材料為化學架橋(cross-linked)發泡體(XPE Foam或XPP Foam)或電子架橋(cross-linked)發泡體(EPE Foam或EPP Foam)的具有眾多氣室不相連的獨立氣泡所構成的發泡體,因材料特性,所以具有強度,容易加熱軟化以模具冷卻成各種足弓形狀,以合各種腳型,解決扁平足低足弓及高足弓問題,以達到平衡支撐,進而達到骨盆及脊椎端正之目的。 2. The underlying material of the present invention is a chemical cross-linked foam (XPE Foam or XPP Foam) or an electronic cross-linked foam (EPE Foam or EPP Foam) having a plurality of gas chambers. The foam composed of the connected independent bubbles has strength due to the material characteristics, and is easy to be heated and softened to be cooled into various arch shapes by the mold to fit various foot types, thereby solving the problems of the flat foot low arch and the high arch. Balance the support, and then achieve the purpose of the pelvis and the spine.
3.本發明將上墊及下墊分開製作後,在使用上再行結合,以省略習知鞋墊一體加工成型繁瑣的工序,造成本案的成本相對低廉,以減輕消費者的負擔。 3. The present invention separates the upper pad and the lower pad, and then combines them in use, so as to omit the cumbersome process of the integrated insoles, and the cost of the case is relatively low, so as to reduce the burden on the consumer.
4.本發明將鞋墊區分成上墊及下墊,只要施加來自Z軸(向上的力量)的力量,該上墊即可輕易自下墊拆除,讓使用者可進行上墊之更換,更可對上墊進行清洗,此為習用鞋墊無法達成的效果。 4. The present invention divides the insole into upper and lower pads. As long as the force from the Z axis (upward force) is applied, the upper pad can be easily removed from the lower pad, so that the user can replace the upper pad, and The upper pad is cleaned, which is an effect that cannot be achieved by the conventional insole.
5.本發明之上墊具有變形的特性,只要將下墊塑形成人體腳底的造型,該 上墊放置於下墊時,即會隨之依照下墊頂面形狀進行塑形,以省略上墊塑形之工時。 5. The upper pad of the present invention has a deformed property, as long as the lower pad is molded into the shape of the human sole, When the upper pad is placed on the lower pad, it will be shaped according to the shape of the top surface of the lower pad to omit the working time of the upper pad shaping.
本發明已透過上述之實施例揭露如上,然其並非用以限定本發明,任何熟悉此一技術領域具有通常知識者,在瞭解本發明前述的技術特徵及實施例,並在不脫離本發明之精神和範圍內,當可作些許之更動與潤飾,因此本發明之專利保護範圍須視本說明書所附之請求項所界定者為準。 The present invention has been disclosed in the above embodiments, and is not intended to limit the present invention. Any of those skilled in the art can understand the foregoing technical features and embodiments of the present invention without departing from the invention. In the spirit and scope, the scope of patent protection of the present invention is subject to the definition of the claims attached to the present specification.
Claims (6)
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TW106134606A TWI644631B (en) | 2017-10-06 | 2017-10-06 | Insole structure |
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TW106134606A TWI644631B (en) | 2017-10-06 | 2017-10-06 | Insole structure |
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Citations (5)
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TW477170U (en) * | 2000-02-18 | 2002-02-21 | Taiwan Footwear Res Inst | Hygienic insole with replaceable surface body |
TW500602B (en) * | 2000-09-22 | 2002-09-01 | You-Yang Su | Method for integrally producing shoes |
TWM290676U (en) * | 2005-12-09 | 2006-05-21 | Chyau Ke Co Ltd | Anti-skid and anti-wrinkling movable soft shoe pad |
CN203121212U (en) * | 2013-01-28 | 2013-08-14 | 香港玛浩洋行 | Combined-type insole |
CN103976498B (en) * | 2014-06-04 | 2016-05-04 | 浙江润阳新材料科技有限公司 | A kind of slippers |
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Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW477170U (en) * | 2000-02-18 | 2002-02-21 | Taiwan Footwear Res Inst | Hygienic insole with replaceable surface body |
TW500602B (en) * | 2000-09-22 | 2002-09-01 | You-Yang Su | Method for integrally producing shoes |
TWM290676U (en) * | 2005-12-09 | 2006-05-21 | Chyau Ke Co Ltd | Anti-skid and anti-wrinkling movable soft shoe pad |
CN203121212U (en) * | 2013-01-28 | 2013-08-14 | 香港玛浩洋行 | Combined-type insole |
CN103976498B (en) * | 2014-06-04 | 2016-05-04 | 浙江润阳新材料科技有限公司 | A kind of slippers |
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