TWI642805B - Methods for manufacturing deposition mask and deposition mask - Google Patents

Abstract

The present invention is a method for manufacturing a film-forming mask in which a resin film layer provided with an opening pattern of a predetermined predetermined shape and a magnetic metal material layer having a gap of the size of the opening pattern are laminated The opening pattern is formed by irradiating laser light from both sides to a part of the thin film layer corresponding to the gap to penetrate the thin film layer.

Description

Manufacturing method of film forming mask and film forming mask

The present invention relates to a method of manufacturing a film-forming mask in which a thin film layer made of a resin with an opening pattern and a magnetic metal material layer are laminated, and particularly to a method of forming an opening pattern by laser processing. Method for manufacturing film-forming mask for suppressing generation of burrs at the edge of opening pattern and film-forming mask.

Conventional manufacturing methods for such masks use a patterned mask to irradiate a resin film with a short-wavelength beam of about 248 nm, such as KrF excimer laser, and remove the resin film to form an opening pattern (for example, see Japan Special Table No. 2005-517810).

However, in the conventional mask manufacturing method, since the laser light is usually irradiated to one side of the resin film to form the opening pattern, an opening edge portion on the opposite side of the opening pattern from the laser light irradiation side may occur The problem of cutting leftovers (hereinafter referred to as "burrs").

In this way, the burrs may become so-called film-forming shadows, which may cause unevenness in the shape of the edges of the formed film pattern, or a gap between the film-forming mask and the film-forming substrate to make the film-forming material easily entangle To the lower side of the mask, the problem of blurring the edge of the film pattern may be caused.

Therefore, the present invention corresponds to such a problem, and an object of the present invention is to provide a method for manufacturing a film-forming mask capable of suppressing the occurrence of burrs at the edge of the opening pattern when forming an opening pattern by laser processing and a film-forming mask cover.

In order to achieve the above object, the method for manufacturing a film-forming mask of the present invention is to laminate a resin film layer provided with an opening pattern of a predetermined predetermined shape, and to provide a large layer capable of containing the opening pattern The manufacturing method of the film forming mask for the structure of the magnetic metal material layer with a small gap, the opening pattern is formed by irradiating laser light from both sides to a part of the thin film layer corresponding to the gap to penetrate the thin film layer.

Moreover, the film-forming mask of the present invention is formed by laminating a resin film layer provided with an opening pattern of a predetermined predetermined shape, and a magnetic metal material layer provided with a gap of a size that can contain the opening pattern In the film mask, the opening pattern irradiates the laser light to a part of the thin film layer corresponding to the gap from both sides to penetrate the thin film layer.

According to the present invention, since the laser light is irradiated from both sides of the thin film layer to form the opening pattern, generation of the edge of the opening pattern on the side opposite to the magnetic metal material layer of the thin film layer (the side close to the surface of the film-forming substrate) Raw edges. Therefore, it is possible to prevent the burrs of the opening pattern from becoming shadows, and to prevent a gap between the thin plate layer and the film-forming substrate due to the burrs. With this, the formation accuracy of the thin film pattern including the shape and position accuracy can be improved.

1‧‧‧ film layer

1a‧‧‧one side

1b‧‧‧other side

2‧‧‧ Magnetic metal material layer

2a‧‧‧ noodles

3‧‧‧Frame

4‧‧‧ opening pattern

5‧‧‧First recess

6‧‧‧Second recess

7‧‧‧ Clearance

8‧‧‧ Stripe pattern

9‧‧‧Frame pattern

10‧‧‧ opening

11‧‧‧Mask components

12‧‧‧Alignment mark

13‧‧‧Through hole

14‧‧‧recess

P‧‧‧ line

O‧‧‧ line

L‧‧‧Laser

1 is a diagram showing an embodiment of the film-forming mask of the present invention, (a) is a top view, (b) is a line OO line arrow view of (a), (c) is a line PP line arrow view of (a) , (D) is a partially enlarged cross-sectional view of (c).

2 is a plan view showing a modification of the magnetic metal material layer of the film-forming mask of the present invention.

3 is a diagram illustrating an example of forming an opening pattern using the method for manufacturing a film-forming mask of the present invention, which is a cross-sectional view showing the forming process of a first concave portion, (a) shows the start of laser processing, (b) shows (C) is an enlarged cross-sectional view of the first recessed portion, showing that the laser processing is completed.

FIG. 4 is a diagram illustrating an example of forming an opening pattern by the method for manufacturing a film-forming mask of the present invention, and is a cross-sectional view showing a forming process of a second concave portion, (a) shows that laser processing is started, (b) shows (C) is an enlarged cross-sectional view of the second concave portion showing that the laser processing is completed.

5 is a diagram illustrating a modification of the formation of an opening pattern by the method for manufacturing a film-forming mask of the present invention, which is a cross-sectional view showing a process of forming a through hole, (a) shows the start of laser processing, (b) shows (C) is an enlarged cross-sectional view of the through-hole showing the completion of laser processing.

6 is a diagram illustrating a modification of the formation of an opening pattern by the method for manufacturing a film-forming mask of the present invention, which is a cross-sectional view showing the forming process of a recessed part, (a) shows that laser processing is started, (b) shows After the laser processing is completed, (c) is an enlarged cross-sectional view of the concave portion.

Hereinafter, an embodiment of the present invention will be described in detail based on the attached drawings. 1 is a diagram showing an embodiment of the film-forming mask of the present invention, (a) is a top view, (b) is a line OO line arrow view of (a), (c) is a line PP line arrow view of (a) , (D) is a partially enlarged sectional view of (c). The film-forming mask forms a plurality of thin-film patterns of a predetermined shape on a film-forming substrate, and is configured to include a thin-film layer 1, a magnetic metal material layer 2, and a frame 3.

The thin film layer 1 is used for forming a main mask of a thin film pattern on a film-forming substrate, and as shown in FIG. 1 (a), for example, polyimide or polyparaphenylene having a thickness of about 5 μm to 30 μm, for example Ethylene dicarboxylate (PET) and other resin films that allow visible light to pass through are provided with opening patterns 4 of a predetermined shape. Preferably, it is preferable that the linear expansion coefficient is a polyacrylic acid having a linear expansion coefficient approximately 3 × 10 ⁻⁶ to 5 × 10 ⁻⁶ / ° C, which is similar to the linear expansion coefficient of glass as a film-forming substrate (hereinafter, simply referred to as “substrate”) Imine.

In detail, as shown in FIG. 1 (a), the opening pattern 4 has the same shape as the film pattern, and is arranged in a vertical and horizontal matrix corresponding to the film pattern, and is shown in FIG. On one surface 1 a of the thin film layer 1, for example, a first concave portion 5 having a depth of about 4 μm to 5 μm and a second concave portion 6 formed on the other surface 1 b of the thin film layer 1 so as to reach the depth of the first concave portion 5. In this case, it is preferable that the opening area of the second recess 6 is wider than the opening area of the first recess 5. In addition, as described later, the first concave portion 5 may be a through hole 13 (see FIG. 5) penetrating the thin film layer 1.

A magnetic metal material layer 2 is laminated on the other surface 1b side of the thin film layer 1. The magnetic metal material layer 2 is composed of a magnetic metal material such as nickel, nickel alloy, indium or indium alloy with a gap 7 in which the opening pattern 4 can be embedded and having a thickness of about 10 μm to 50 μm, for example. During the film formation, the magnet arranged on the inner surface of the substrate is attracted to achieve the function of making the thin film layer 1 adhere to the film formation surface of the substrate.

In this case, as shown in FIGS. 1 (a) to (c), the gap 7 is a slit provided through the magnetic metal material layer 2. Alternatively, as shown in FIG. 2, it may be a portion between the stripe patterns 8 adjacent to each other among the elongated stripe patterns constituting a part of the magnetic metal material layer 2. When the magnetic metal material layer 2 includes the structure of the stripe pattern 8 shown in FIG. 2, due to the difference in the linear expansion coefficient between the magnetic metal material layer 2 and the thin film layer 1, the internal stress generated in the thin film layer 1 becomes small. The positional deviation of the opening pattern 4 formed by laser processing after lamination can be suppressed. Therefore, there is an effect of widening the selection range of the magnetic metal material. In addition, the stripe pattern 8 can also be In the long axis direction, it is divided into plural unit stripe patterns with shorter lengths. In this way, the internal stress generated in the thin film layer 1 becomes smaller. In FIG. 2, the symbol 9 is a frame-like pattern having an opening encapsulating the plurality of stripe patterns 8 and stacked on the periphery of the thin film layer 1 to form a part of the magnetic metal material layer 2.

The surface 2a of the magnetic metal material layer 2 opposite to the thin film layer 1 is provided with a frame 3. The frame body 3 fixedly supports the peripheral portion of the magnetic metal material layer 2 and is formed of a magnetic metal material composed of, for example, indium steel or iron-nickel alloy, and is configured to have the magnetic metal material layer enclosed The shape of the opening 10 having the size of the plural gap 2 of 2 is a frame shape. In addition, the frame body 3 is not limited to the one made of a magnetic metal material, and may be made of a non-magnetic metal material or hard resin. In this embodiment, the frame body 3 is formed of a magnetic metal material.

Next, the manufacturing method of the film-forming mask thus constructed will be described.

First, a metal thin plate composed of, for example, nickel, nickel alloy, indium steel, or indium steel alloy, etc., having a thickness of about 10 μm to 50 μm, and a magnetic metal material is combined with the surface area of the substrate to be film-formed to cut the metal thin plate One side is coated with a resin solution such as polyimide and dried at a temperature of about 200 ° C. to 300 ° C. to form a thin film layer 1 having a thickness of about 5 μm to 30 μm that can transmit visible light.

Next, after the resist is sprayed on the other surface of the metal thin plate, for example, it is dried to form a resist film, and then, after the resist film is exposed using a photomask, development is performed, and the formation of slits corresponding to a plurality of rows Position to form a resist mask with elongated plural openings.

Next, after using the resist mask to wet etch the metal sheet to remove the metal sheet corresponding to the opening of the resist mask, a slit penetrating the metal sheet is formed to form the magnetic metal material layer 2, For example, an organic solvent is used to dissolve and remove the resist mask. With this, the mask member 11 (see FIG. 3) in which the thin film layer 1 and the magnetic metal material layer 2 are stacked is formed. In addition, the etching liquid used to etch the metal thin plate can be appropriately selected according to the material of the metal thin plate used, and conventional techniques are applied.

In addition, when a thin metal plate is etched to form a slit, a mask-side alignment mark 12 (refer to FIGS. 1 and 2) used for alignment may be formed on the substrate-side alignment mark provided in advance with respect to the substrate for alignment. The slit forms a predetermined position outside the area. In this case, when forming the resist mask, it is only necessary to provide an opening for the alignment mark at a position corresponding to the mask-side alignment mark 12.

The mask member 11 is not limited to the above method, and may be formed by other methods. E.g, After forming a seed layer on one side of the film by, for example, electroless plating, a photoresist is coated thereon and exposed and developed, and a plurality of rows of stripe resin patterns are formed corresponding to the positions of the formation of a plurality of slits, A magnetic metal material such as nickel, nickel alloy, indium steel, or indium steel alloy is plated on the outer region of the striped resin pattern. Then, after removing the stripe resin pattern, the seed layer at the formation position of the stripe resin pattern may be removed by etching to form the mask member 11.

Thereby, the mask member 11 provided with the magnetic metal material layer 2 in which the plural slits shown in FIG. 1 (a) are juxtaposed in the direction where the long axis crosses can be formed.

In addition, as shown in FIG. 2, the formation of the mask member 11 provided with the frame-shaped pattern 9 and the magnetic metal material layer 2 provided with a plurality of stripe patterns 8 inside the frame-shaped pattern 9 can be performed as follows. For example, a seed layer is formed on one surface of the film by, for example, electroless plating, and a photoresist is coated thereon and exposed and developed to form a position where the frame-like pattern 8 and the plurality of stripe patterns 8 are to be formed. After the resin pattern of the seed layer on the outer side, a magnetic metal material such as nickel, nickel alloy, indium steel or indium steel alloy is plated at the position where the frame pattern 9 and the plurality of stripe patterns 8 are to be formed. Then, after removing the resin pattern, the seed layer at the formation position of the resin pattern is etched away.

Alternatively, in the same way as described above, a resin liquid may be coated on one side of the metal thin plate to form the thin film layer 1. The other side of the metal thin plate may be coated with a resist, and after drying it, a photoresist may be used to expose the resist and Developing, forming a resist mask with an opening outside the position where the frame pattern 9 and the plurality of stripe patterns 8 are to be formed, and using the resist mask to etch the magnetic metal thin plate to form a frame pattern 9 and the masking member 11 of the magnetic metal material 2 of the plural stripe pattern 8.

Next, the magnetic metal material layer 2 opposed to the mask member 11 is provided with a frame body 3 made of a magnetic metal material, and in a state where the mask member 11 is erected on the frame body 3, The laser beam is irradiated to the periphery of the mask member 11 to spot weld the magnetic metal material layer 2 to the end surface of the frame body 3.

Next, it transfers to the opening pattern formation process which is the characteristic of this invention. Hereinafter, the opening pattern forming process will be described with reference to FIGS. 3 and 4.

First, as shown in FIG. 3 (a), on the surface opposite to the magnetic metal material layer 2 of the thin film layer 1 (hereinafter referred to as "one surface 1a"), an excimer laser such as KrF248nm, or the third of YAG laser is used. The high frequency or the fourth high frequency irradiates the laser light L with a wavelength of 400 nm or less, and the thin film layer 1 is removed to provide the first concave portion 5 of a fixed depth as shown in FIG. (C).

In detail, the laser light is moved in a two-dimensional direction by a predetermined distance in a plane parallel to the surface of the mask member 11 based on, for example, the mask-side registration mark 12 formed in advance, and is placed on the thin film layer 1 One surface 1a irradiates the laser light to the portion corresponding to the gap 7 of the magnetic metal material layer 2 to form the first concave portion 5.

Alternatively, the mask member 11 may be positioned on the reference substrate corresponding to the reference pattern for the laser light L irradiation target corresponding to the position where the opening pattern 4 is to be formed, and the thin film layer 1 may be used to observe the two-dimensional camera. The reference pattern, after detecting the position coordinate of the reference pattern, sets the irradiation target of the laser light L as the position coordinate of the reference pattern, and irradiates the laser light L to the surface 1a of the thin film layer 1 to form the first concave portion 5.

In any case, as long as a projection-type laser processing apparatus using a mask having a plurality of openings in a similar shape in the first recess 5 is used, the plurality of openings are reduced and projected onto the surface 1a of the thin film layer 1, and The plurality of first recesses 5 may be formed by converging. In addition, FIG. 3 shows a case where the first recess 5 shown in FIG. 1 (a) is enclosed by a broken line and formed.

After that, as shown in FIG. 3 (a), the laser light L is stepwise moved in a two-dimensional direction indicated by an arrow on one surface 1a of the thin film layer 1 by a predetermined distance, and one surface 1a of the thin film layer 1 is removed, as shown in the figure. As shown in (b), a plurality of first concave portions 5 are arranged in a vertical and horizontal matrix on one surface 1a of the thin film layer 1.

Next, the mask member 11 is turned upside down, and as shown in FIG. 4 (a), the laser light is irradiated from the magnetic metal material layer 2 side to the surface of the thin film layer 1 on the magnetic metal material side 2 side (hereinafter referred to as " On the other side 1b "), the second concave portion 6 reaching the first concave portion 5 is formed in the portion of the thin film layer 1 corresponding to the gap 7 of the magnetic metal material layer 2. Thereby, as shown in FIG. (C), the first concave portion 5 and the second concave portion 6 are connected to form an opening pattern 4 penetrating the thin film layer 1. Preferably, it is preferable that the opening area of the second recess 6 is wider than the opening area of the first recess 5.

In this case, as described above, as long as a projection-type laser processing apparatus using a mask provided with a plurality of openings of a similar shape in the second recess 6 is used, the plurality of openings are reduced and projected onto the other surface of the thin film layer 1 1b, it suffices to form a plurality of second recesses 6 together.

Alternatively, the second concave portion 6 may be formed using laser light L having an irradiation area equivalent to the area of the area in which the first concave portions 5 are included. In this case, the magnetic metal material layer 2 will function as a mask, and the portion of the thin film layer 1 corresponding to the gap 7 of the magnetic metal material layer 2 will be removed to form the second recess 6.

After that, as shown in FIG. 4 (a), the laser light is stepwise moved in a two-dimensional direction indicated by an arrow on the other surface 1b of the thin film layer 1, and the other surface 1b of the thin film layer 1 is removed, as As shown in FIG. (B), a plurality of second concave portions 6 are formed on the other surface 1b of the thin film layer 1. With this, the film-forming mask shown in FIG. 1 or FIG. 2 is formed.

In this way, according to the present invention, since the laser light L is irradiated from both sides of the thin film layer 1 to form the opening pattern 4, the edge of the opening pattern 4 on the side of the thin film layer 1 (adhering surface to the substrate) 1a side can be suppressed There are burrs in the area. Therefore, it is possible to prevent the burrs of the opening pattern 4 from becoming a shadow of film formation, and to prevent a gap between the thin film layer 1 and the substrate due to the presence of the burrs. Thereby, the formation accuracy of the thin film pattern including shape and position accuracy can be improved.

In this case, after the first recess 5 is formed, if the second recess 6 having a larger area than the opening area of the first recess 5 is formed, the occurrence of the burr can be further suppressed. In addition, since the opening area of the second concave portion 6 is larger than that of the first concave portion 5, the processing positioning accuracy of the second concave portion 6 can be omitted.

Next, other forming examples will be described regarding the formation of the opening pattern 4.

FIG. 5 is a diagram illustrating a modification of the opening pattern by the method for manufacturing a film-forming mask of the present invention, a cross-sectional view showing the forming process of a through hole, (a) shows the start of laser processing, (b) shows the end Laser processing, (c) is an enlarged cross-sectional view of the through hole. 6 is a diagram illustrating a modified example of an opening pattern by the method for manufacturing a film-forming mask of the present invention, a cross-sectional view showing the forming process of a concave portion, (a) shows the start of laser processing, (b) shows the end of laser Shot processing, (c) is an enlarged cross-sectional view of the recess.

First, as shown in FIG. 5 (a), the laser light L is irradiated to one surface 1a of the thin film layer 1, and the thin film layer 1 is removed, as shown in FIG. (C), a through hole 13 penetrating through the thin film layer 1 is provided.

Specifically, in the same manner as above, for example, the laser light is moved in a two-dimensional direction by a predetermined distance in a plane parallel to the surface of the mask member 11 using the mask-side registration mark 12 formed as a reference, And on one surface 1a of the thin film layer 1, the laser light is irradiated to the portion corresponding to the gap 7 of the magnetic metal material layer 2 to form a through hole 13 having the same shape as the thin film pattern.

Alternatively, the mask member 11 may be positioned on the reference substrate corresponding to the reference pattern for the laser light L irradiation target corresponding to the position where the opening pattern 4 is to be formed, and the thin film layer 1 may be used to observe the two-dimensional camera. The reference pattern, after detecting the position coordinate of the reference pattern, sets the irradiation target of the laser light L as the position coordinate of the reference pattern, and irradiates the laser light L to the surface 1a of the thin film layer 1 to form the through hole 13 .

Then, as shown in FIG. 5 (a), the laser light L is drawn on one surface 1a of the thin film layer 1 with arrows The indicated two-dimensional direction moves stepwise by a predetermined distance and removes the surface 1a of the thin film layer 1, and as shown in FIG. (B), the plurality of through holes 13 are arranged in a vertical and horizontal matrix on the surface 1a of the thin film layer 1.

Next, the mask member 11 is turned upside down, and as shown in FIG. 6 (a), the laser light L is irradiated from the side of the magnetic metal material layer 2 to the other surface 1b of the thin film layer 1 to correspond to the magnetic metal material The portion of the thin film layer 1 of the gap 7 of the layer 2 has a recess 14 having an opening portion having a thin layer of about 1 μm to 4 μm remaining on one side 1 a side of the thin film layer 1 and having a wider opening area than the through hole 13. As a result, as shown in FIG. (C), the thin film layer 1 is formed with the opening pattern 4 composed of the through hole 13 and the concave portion 14.

After that, as shown in FIG. 6 (a), the laser light is stepwise moved in a two-dimensional direction indicated by an arrow on the other surface 1b of the thin film layer 1, and the other surface 1b of the thin film layer 1 is removed as As shown in FIG. (B), a plurality of concave portions 14 are formed on the other surface 1b of the thin film layer 1. With this, the film-forming mask shown in FIG. 1 or FIG. 2 is formed.

In this case, the laser light L is irradiated from both sides of the thin film layer 1 to form the opening pattern 4. Therefore, it is possible to suppress the occurrence of burrs on the edge of the opening pattern 4 on the side of one surface (adhering surface to the substrate) 1a side of the thin film layer 1.

Therefore, the film-forming mask of the present invention can improve the adhesion to the substrate and is suitable for vapor deposition of an organic EL layer including, for example, a light-emitting layer of an organic EL display substrate.

In the above description, the case where the film forming mask is provided with the frame body 3 has been described, but the present invention is not limited to this, and the frame body 3 may not be required.

Claims (20)

A method for manufacturing a film-forming mask, which is formed by laminating a resin film layer provided with an opening pattern of a predetermined predetermined shape, and a magnetic metal material layer provided with a gap of a size capable of containing the opening pattern Method for manufacturing a film mask, wherein the opening pattern is irradiated with laser light from a side of the magnetic metal material layer to a part of the thin film layer corresponding to the gap, and then irradiated with laser light from the magnetic metal material layer side to penetrate This thin film layer is formed. For example, in the method for manufacturing a film-forming mask of claim 1, the opening pattern is that the opening area on the magnetic metal material layer side is wider than the opening area on the opposite side of the magnetic metal material layer. For example, the method for manufacturing a film-forming mask according to item 1 or 2 of the patent application, in which the opening pattern is on the surface on the opposite side of the magnetic metal material layer of the thin film layer to set the first After the recessed portion, the surface of the thin film layer on the magnetic metal material layer side is irradiated with laser light to form a second recessed portion that reaches a depth of the first recessed portion. For example, the method for manufacturing a film-forming mask according to item 1 or 2 of the patent application, wherein the opening pattern is provided on the surface opposite to the magnetic metal material layer of the thin film layer to irradiate the laser light to set After the through hole, the laser light is irradiated to the surface of the thin film layer on the side of the magnetic metal material layer to form a concave portion with a fixed depth. For example, in the method for manufacturing a film-forming mask of claim 1 or 2, the gap is a slit provided through the magnetic metal material layer. For example, in the method for manufacturing a film-forming mask of claim 3, the gap is a slit provided through the magnetic metal material layer. For example, in the method for manufacturing a film-forming mask of claim 4, the gap is a slit provided through the magnetic metal material layer. For example, in the method for manufacturing a film-forming mask according to item 1 or 2 of the patent application range, the gap is a portion between adjacent stripe patterns in the elongated plural stripe pattern constituting a part of the magnetic metal material layer. For example, in the method of manufacturing a film-forming mask according to item 3 of the patent application range, the gap is a portion between adjacent stripe patterns in the elongated plural stripe pattern that constitutes a part of the magnetic metal material layer. For example, in the method for manufacturing a film-forming mask according to item 4 of the patent application range, the gap is a portion between adjacent stripe patterns in the elongated plural stripe pattern constituting a part of the magnetic metal material layer. A film-forming mask formed by laminating a resin film layer provided with an opening pattern of a predetermined shape and a magnetic metal material layer having a gap of the size of the opening pattern , Wherein the opening pattern is irradiated with laser light from the opposite side of the magnetic metal material layer to a portion of the thin film layer corresponding to the gap, and then irradiated with laser light from the magnetic metal material layer side to penetrate the thin film layer form. For example, in the film-forming mask of claim 11, the opening pattern is that the opening area of the magnetic metal material layer is wider than the opening area of the opposite side of the magnetic metal material layer. As in the film-forming mask of claim 11 or 12, the opening pattern is the first concave portion of a fixed depth formed by the surface of the thin film layer opposite to the magnetic metal material layer, and the thin film layer The surface on the magnetic metal material layer side is constituted by a second concave portion formed to reach a depth of the first concave portion. As in the film-forming mask of claim 11 or 12, wherein the opening pattern is formed by irradiating laser light to the surface of the thin-film layer opposite to the magnetic metal material layer to penetrate through the thin-film layer The hole and a concave portion of a fixed depth formed by irradiating the laser light to the surface of the thin film layer on the magnetic metal material layer side. As in the film-forming mask of claim 11 or 12, the gap is a slit provided through the magnetic metal material layer. As in the film-forming mask of claim 13, the gap is a slit provided through the magnetic metal material layer. As in the film-forming mask of claim 14, the gap is a slit provided through the magnetic metal material layer. As in the film-forming mask of claim 11 or 12, the gap is in the elongated plural stripe pattern constituting a part of the magnetic metal material layer, which is the part between the adjacent stripe patterns. As in the film-forming mask of claim 13 of the patent application range, the gap is a portion between the stripe patterns adjacent to each other in the elongated stripe pattern constituting a part of the magnetic metal material layer. As in the film-forming mask of claim 14 of the patent application range, the gap is a part between the stripe patterns adjacent to each other in the elongated stripe pattern constituting a part of the magnetic metal material layer.