TWI641306B - Electronic component packaging device and packaging method thereof - Google Patents
Electronic component packaging device and packaging method thereof Download PDFInfo
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- TWI641306B TWI641306B TW106138485A TW106138485A TWI641306B TW I641306 B TWI641306 B TW I641306B TW 106138485 A TW106138485 A TW 106138485A TW 106138485 A TW106138485 A TW 106138485A TW I641306 B TWI641306 B TW I641306B
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- cylindrical body
- electronic component
- mold
- protective layer
- packaging method
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 19
- 238000000034 method Methods 0.000 title claims abstract description 18
- 239000011241 protective layer Substances 0.000 claims abstract description 32
- 239000000463 material Substances 0.000 claims abstract description 30
- 230000001681 protective effect Effects 0.000 claims abstract description 27
- 238000005096 rolling process Methods 0.000 claims abstract description 14
- 239000007769 metal material Substances 0.000 claims abstract description 5
- 229910010293 ceramic material Inorganic materials 0.000 claims abstract description 4
- 239000011256 inorganic filler Substances 0.000 claims description 15
- 229910003475 inorganic filler Inorganic materials 0.000 claims description 15
- 239000002184 metal Substances 0.000 claims description 8
- 239000000919 ceramic Substances 0.000 claims description 6
- 239000003822 epoxy resin Substances 0.000 claims description 5
- 229920000647 polyepoxide Polymers 0.000 claims description 5
- 150000004767 nitrides Chemical group 0.000 claims description 3
- 239000010410 layer Substances 0.000 abstract description 2
- 238000012546 transfer Methods 0.000 description 6
- 238000000576 coating method Methods 0.000 description 5
- 238000010521 absorption reaction Methods 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- 238000007731 hot pressing Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 229920000642 polymer Polymers 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000002360 explosive Substances 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 229910052573 porcelain Inorganic materials 0.000 description 1
- 238000009966 trimming Methods 0.000 description 1
- 238000011144 upstream manufacturing Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14336—Coating a portion of the article, e.g. the edge of the article
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/0053—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor combined with a final operation, e.g. shaping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/0053—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor combined with a final operation, e.g. shaping
- B29C45/0055—Shaping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
- B29C45/37—Mould cavity walls, i.e. the inner surface forming the mould cavity, e.g. linings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/565—Moulds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/0053—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor combined with a final operation, e.g. shaping
- B29C45/0055—Shaping
- B29C2045/0058—Shaping removing material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C2045/0094—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor injection moulding of small-sized articles, e.g. microarticles, ultra thin articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2063/00—Use of EP, i.e. epoxy resins or derivatives thereof, as moulding material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2105/00—Condition, form or state of moulded material or of the material to be shaped
- B29K2105/06—Condition, form or state of moulded material or of the material to be shaped containing reinforcements, fillers or inserts
- B29K2105/20—Inserts
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2509/00—Use of inorganic materials not provided for in groups B29K2503/00 - B29K2507/00, as filler
- B29K2509/02—Ceramics
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2715/00—Condition, form or state of preformed parts, e.g. inserts
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2995/00—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds
- B29K2995/0003—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds having particular electrical or magnetic properties, e.g. piezoelectric
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2009/00—Layered products
- B29L2009/005—Layered products coated
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2031/00—Other particular articles
- B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
- B29L2031/3406—Components, e.g. resistors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2031/00—Other particular articles
- B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
- B29L2031/3487—Resistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
Abstract
一種電子元件封裝方法包含下列步驟:首先,備製一具有圓柱本體的電子元件,其中,該圓柱本體之前、後端為金屬材質,而該圓柱本體之中端為陶瓷材質,且該圓柱本體之前、後端的外徑大於該圓柱本體之中端,接著,備製一具有上、下模之模具,然後,將該圓柱本體夾合於該上、下模中,再將一保護材料加熱軟化填入該模具中,使該保護材料包覆於該圓柱本體之表面形成一保護層,最後,將該圓柱本體自該上、下模中取出並投入一滾動器中,以去除該圓柱本體之前、後端多餘的保護層。
Description
本發明是有關一種電子元件的封裝裝置,特別是指一種無接腳之電子元件的封裝裝置及其封裝方法。
隨著各種電子化產品爆炸性的急速擴張,在電子產品組件製程上佔據舉足輕重地位之積體電路封裝技術也因應此需求朝向微型化與高密度化發展。其中,電子元件從插件式印刷電路板演進到緣面黏著式印刷電路板,以滿足微型化之要求,傳統電子元件均設計有金屬的接腳,而現今為了配合緣面黏著技術,各式電子零組件都已演進出無接腳式結構的設計。
舉以傳統晶圓電阻、柱狀電阻或無引線晶圓電阻製造流程來說,會在具有阻抗之柱狀瓷棒的兩端分別設置一金屬帽,然後再利用雷射或刀片螺旋切割一次修整兩者之接合處至目標值,之後,利用滾輪將高分子聚合物保護層轉印到柱狀瓷棒表面,但是過程中,除了保護層容易覆蓋到兩側之金屬帽上,轉印時亦容易產生氣泡,使得塗裝在電子元件表面的保護層不完整,而影響電子元件之可靠度,且轉印到柱狀瓷棒上的保護層會使柱狀瓷棒與
金屬帽呈現一非平整的凹陷面,為了使保護層平整均勻地包覆電子元件,就需重覆塗附保護層至表面平整,如此作業將造成時間與成本的浪費。
再者,該有高分子聚合物保護層材料中會加入無機填充物,以降低其吸水率和提高熱傳導係數,但無機填充物的添加比例若太高,將造成保護層材料流動不佳,而無法完整地塗裝在電子元件表面,反而影響塗裝之均勻性。
上述缺點都顯現習知電子元件塗裝方法在製造過程所衍生的種種問題,長久下來,常常導致電子元件的不良率與壽命降低,因此,現有技術確實有待提出更佳解決方案之必要性。
有鑑於此,本發明之目的,是提供一種電子元件封裝方法,該方法包含下列步驟。
首先,備製一具有圓柱本體的電子元件,其中,該圓柱本體之前、後端為金屬材質,而該圓柱本體之中端為陶瓷材質,且該圓柱本體之前、後端的外徑大於該圓柱本體之中端,接著,備製一具有上、下模之模具,然後,將該圓柱本體夾合於該上、下模中,再將一保護材料加熱軟化填入該模具中,使該保護材料包覆於該圓柱本體之表面形成一保護層,最後,將該圓柱本體自該上、下模中取出並投入一滾動器中,以去除該圓柱本體之前、後
端多餘的保護層。
本發明的另一技術手段,是在於上述之封裝方法更在該滾動器中投入一媒介物與該電子元件進行物理碰撞,以去除該圓柱本體表面多餘的保護層。
本發明的又一技術手段,是在於上述之媒介物是選自於硬度高的金屬球或陶瓷球。
本發明的再一技術手段,是在於上述之保護材料是由環氧樹脂與無機填充物所組成,且無機填充物的比例大於50%。
本發明的另一技術手段,是在於上述之無機填充物是選自於氮化物、氧化物,及此等之組合。
本發明之又一目的,即在提供一種電子元件封裝裝置,其包含一模具。
該模具包括一上模,及一可分離地與該上模蓋設在一起之下模,其中,該上、下模分別具有複數相對設置於該上、下模表面之上、下溝槽,該電子元件是承放於該上、下溝槽中。
本發明的再一技術手段,是在於上述之電子元件包括一具有一前端、一相反之後端,及一位於該前、後端間之中端的圓柱本體,且該圓柱本體具有電性特性。
本發明的另一技術手段,是在於上述之電子元件為無引腳的電感、電阻其中之一。
本發明的又一技術手段,是在於上述之電
子元件封裝裝置,更包含一用以供該圓柱本體投入之滾動器,及一可分離地投入該滾動器中以與該圓柱本體進行物理碰撞之媒介物。
本發明的再一技術手段,是在於上述之上模更具有一灌模孔、一連接該灌模孔之上主流道,及複數間隔設置於相鄰兩上溝槽間且與該上主流道相連通之上次流道,該下模更具有一相對該上主流道設置之下主流道,及複數間隔設置於相鄰兩下溝槽間且與該下主流道相連通之下次流道。
本發明之有益功效在於,藉由將該電子元件夾合於該上、下模中進行熱壓成型,並將該保護材料注入該模具中,使該保護材料形成該保護層,並透過熱壓成型作業一次性均勻地形成於該圓柱本體表面,且利用熱壓過程可將氣體排出,使該電子元件表面兼具平整性與保護性,進而提升產品良率及使用壽命,再者,利用更在該滾動器中投入硬度高之媒介物與該電子元件進行物理滾動碰撞,以撥除該前、後端表面之整片多餘的保護層,可簡化加工作業,而含有50%以上之無機填充物的保護材料,則可提升塗裝之均勻性、降低吸水率以及提高熱傳導係數,使該電子元件於更嚴苛的溫度環境下使用。
1‧‧‧電子元件
11‧‧‧圓柱本體
111‧‧‧前端
112‧‧‧後端
113‧‧‧中端
2‧‧‧模具
21‧‧‧上模
211‧‧‧上溝槽
212‧‧‧灌模孔
213‧‧‧上主流道
214‧‧‧上次流道
22‧‧‧下模
221‧‧‧下溝槽
222‧‧‧下主流道
223‧‧‧下次流道
23‧‧‧第一流動通道
24‧‧‧第二流動通道
3‧‧‧滾動器
4‧‧‧媒介物
5‧‧‧保護層
91~94‧‧‧步驟
圖1是一立體示意圖,說明本發明電子元件封裝裝置
的較佳實施例中一上模的態樣;圖2是一立體示意圖,說明本較佳實施例中一下模的態樣;圖3是圖1的A-A剖面圖與圖2的A1-A1剖面圖組合,說明該較佳實施例中該上模與該下模蓋設在一起之態樣;圖4是圖1的B-B剖面圖與圖2的B1-B1剖面圖組合,說明該較佳實施例中該上模與該下模蓋設在一起之另一態樣;圖5是一示意圖,說明該較佳實施例之流程示意;及圖6是一示意圖,說明本發明電子元件封裝方法的步驟流程。
有關本發明之相關申請專利特色與技術內容,在以下配合參考圖式之較佳實施例的詳細說明中,將可清楚的呈現。
參閱圖1、2,及3,為本發明電子元件封裝裝置及其封裝方法,該電子元件1的封裝裝置包含一模具2、一滾動器3,及一媒介物4。
該電子元件1包括一具有一前端111、一相反之後端112,及一位於該前、後端111、112間之中端113的圓柱本體11,且該圓柱本體11具有電性特性。在本較佳實施例中,該電子元件1為呈圓柱外觀之無引腳的電感、電阻其中之一。
該模具2包括一上模21,及一可分離地與該上模21蓋設在一起之下模22,其中,該上、下模21、22分別具有複數相對設置於該上、下模21、22表面之上、下溝槽211、221,該電子元件1是承放於蓋設在一起之上、下模21、22的上、下溝槽211、221中。
進一步地,該上模21更具有一灌模孔212、一連接該灌模孔212之上主流道213,及複數間隔設置於相鄰兩上溝槽211間且與該上主流道213相連通之上次流道214,該下模22更具有一相對該上主流道213設置之下主流道222,及複數間隔設置於相鄰兩下溝槽221間且與該下主流道222相連通之下次流道223。
再請參閱圖4、5,該上主流道213與該下主流道222形成一第一流動通道23,而該上次流道214與該下次流道223形成一第二流動通道24,該第一、二流動通道23、24作為該保護材料之流動通道。
該滾動器3用以供該圓柱本體11投入,該媒介物4是可分離地投入該滾動器3中以與該圓柱本體11進行物理滾動碰撞。
配合參閱圖6,依據上述之電子元件封裝裝置,本發明電子元件封裝方法包含下列步驟。
首先,進行步驟91,備製具有該圓柱本體11的電子元件1,其中,該圓柱本體11之前、後端111、112為金屬材質,而該圓柱本體11之中端113為具有電性
特性之陶瓷材質,且該圓柱本體11之前、後端111、112的外徑大於該圓柱本體11之中端113。
然後,進行步驟92,備製具有該上、下模21、22之模具2,其中,該模具2一批次可處理複數個電子元件1的保護層封裝。
接著,進行步驟93,將該圓柱本體11夾合於該上、下模21、22中,再將該保護材料經加熱軟化成具有流動性後,施加壓力填入該模具2中,以進行熱壓成型作業,使該保護材料包覆於該圓柱本體11之表面形成一保護層5,於此,該保護材料的加熱溫度為50~250度,而填入該模具2中所施加的壓力為5~50Kg/cm2。
該保護材料是由該上模21之灌模孔212注入該模具2中,當該灌模孔212注入該保護材料,該保護材料會由該第一流動通道23流至相連通之複數第二流動通道24,再由該第二流動通道24流至兩側的上、下溝槽211、221,使位於該上、下溝槽211、221中之電子元件1被該保護材料所包覆,待進行熱壓成型作業後,即形成該保護層5。
特別說明的是,位於兩上溝槽211間之上次流道214與兩下溝槽221間之下次流道223,其設置位置是低於相鄰之上溝槽211與下溝槽221,進一步地,該二上溝槽211與該上次流道214,及該二下溝槽221與該下次流道223是相連在一起,以形成三個溝槽一組的設
計,而正因上述之溝槽設計,當該上、下模21、22蓋設在一起時,上方之上次流道214與上方之下次流道223不會相互接合而封閉該第二流動通道24,其所留下之間隙得以供位於該第二流動通道24中之保護材料向兩旁的上、下溝槽211、221流動,以提升位於該上、下溝槽211、221中之電子元件1被該保護材料所包覆之效率。
此外,該上次流道214與該下次流道223所形成之第二流動通道24除了作為該保護材料之流動通道外,當熱壓成型作業完成後,該第二流動通道24更可作為拿取整排位於該上、下溝槽211、221中之電子元件1的卸料溝槽,以提升人員作業之便利性。
較佳地,該保護材料是由環氧樹脂與無機填充物所組成,且無機填充物的比例大於50%,而無機填充物是選自於氮化物、氧化物,及此等之組合。
透過熱壓填充的方式將該保護層5形成於該圓柱本體11之表面,可將氣體排出,杜絕習知將保護材料轉印到該電子元件1表面所衍生之氣泡,使該電子元件1表面兼具平整性與保護性,進而提升產品良率及使用壽命。
進一步地,更是將含有至少50%以上之無機填充物的保護材料填入該模具2中熱壓成形,不會因無機填充物的比例過高而有流動不佳的困擾,除了可提升塗裝之均勻性與降低吸水率和提高熱傳導係數外,更得以使
包覆有該保護層5之電子元件1可於更嚴苛的溫度環境下使用,以符合不同領域之使用需求。
再者,由於該圓柱本體11之前、後端111、112的外徑大於該圓柱本體11之中端113,所以該中端113與該前、後端111、112呈中間凹陷的平面,利用熱壓填充的方式,可使該保護層5一次性均勻地形成於該圓柱本體11表面,以使該中端113與該前、後端111、112呈平面,而不需如同習知技術是以反覆轉印保護材料來增加厚度至表面平整。
實際實施時,可藉由改變承放該電子元件1之上、下溝槽211、221的尺寸,以滿足該上、下模21、22蓋設在一起所能承放之電子元件1的圓柱大小,以符合不同使用需求。
最後,進行步驟94,將該圓柱本體11自該上、下模21、22中取出並投入該滾動器3中,且更在該滾動器3中投入該媒介物4與該電子元件1進行物理滾動碰撞,以去除該圓柱本體11之前、後端111、112多餘的保護層5,而留下該中端113表面的保護層5。其中,該媒介物4是選自於硬度高的金屬球或陶瓷球。
由於該圓柱本體11之前、後端111、112為金屬材質,而該保護層5則是環氧樹脂與無機填充物所組成,含有環氧樹脂之保護層5在金屬之前、後端111、112上的結合性差,利用硬度高之媒介物4即可撥除位於
該前、後端111、112表面之整片多餘的保護層5,以省去習知利用雷射或刀片切割多餘之保護層5的繁雜處理。
綜上所述,本發明電子元件封裝裝置及其封裝方法,藉由熱壓填充的方式將該保護層5形成於該圓柱本體11之表面,可將該圓柱本體11表面之氣體排出,以提升該電子元件1表面之平整性與保護性,且將該圓柱本體11夾合於該上、下模21、22中進行熱壓成型,可使該保護層5一次性均勻地形成於該圓柱本體11表面。
進一步地,在該滾動器3中投入該媒介物4與該電子元件1進行物理滾動碰撞,以去除該圓柱本體11之前、後端111、112多餘的保護層5,而含有50%以上之無機填充物的保護材料填入該模具2中進行熱壓成形,則可提升塗裝之均勻性與降低吸水率和提高熱傳導係數,使該電子元件1於更嚴苛的溫度環境下使用,故確實可以達成本發明之目的。
惟以上所述者,僅為本發明之較佳實施例而已,當不能以此限定本發明實施之範圍,即大凡依本發明申請專利範圍及發明說明內容所作之簡單的等效變化與修飾,皆仍屬本發明專利涵蓋之範圍內。
Claims (5)
- 一種電子元件封裝方法,包含下列步驟:備製一具有圓柱本體的電子元件,其中,該圓柱本體之前、後端為金屬材質,而該圓柱本體之中端為陶瓷材質,且該圓柱本體之前、後端的外徑大於該圓柱本體之中端;備製一具有上、下模之模具;將該圓柱本體夾合於該上、下模中,再將一保護材料加熱軟化填入該模具中,使該保護材料包覆於該圓柱本體之表面形成一保護層;及將該圓柱本體自該上、下模中取出並投入一滾動器中,以去除該圓柱本體之前、後端多餘的保護層。
- 依據申請專利範圍第1項所述之電子元件封裝方法,其中,更在該滾動器中投入一媒介物與該電子元件進行物理碰撞,以去除該圓柱本體表面多餘的保護層。
- 依據申請專利範圍第2項所述之電子元件封裝方法,其中,該媒介物是選自於硬度高的金屬球或陶瓷球。
- 依據申請專利範圍第3項所述之電子元件封裝方法,其中,該保護材料是由環氧樹脂與無機填充物所組成,且無機填充物的比例大於50%。
- 依據申請專利範圍第4項所述之電子元件封裝方法,其中,無機填充物是選自於氮化物、氧化物,及此等之組合。
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