TWI640816B - Flexible electronic device and method of use thereof - Google Patents

Abstract

The invention discloses a flexible electronic device and a method of using the same. According to the embodiment of the present invention, the flexible electronic device includes a substrate and a bending structure, which can be used to improve the bending degree of the flexible electronic device and protect the substrate, so that the substrate can be more easily performed. The folding and curling of the dimensions further increases the ease of use and application range of the flexible electronic device.

Description

Flexible electronic device and method using flexible electronic device

The present invention generally relates to electronic devices; in particular, the present invention relates to flexible electronic devices.

The currently developed flexible electronic devices can only bend with limited curvature, and cannot flex as flexibly as the actual paper, and can only achieve a single dimension of folding, and the folding angle is limited. This is because the curvature of the substrate at the fold line generated by the over-angle folding becomes smaller, and the multi-dimensional folding is more likely to cause the substrate dead angle. These broken lines and dead angles are likely to cause damage to the substrate, and may also cause component failure or line damage on the components provided thereon, thereby limiting the applicability of the flexible electronic device. Therefore, it is urgent to solve the problem of component failure or line damage caused by broken lines and dead ends.

The present invention provides a flexible electronic device that can flex more flexibly and even achieve multi-dimensional folding.

An embodiment of the invention provides a flexible electronic device including a substrate and a first support. The substrate includes a first bending zone, wherein the first surface of the first bending zone has a first minimum radius of curvature. The first support member is located on the first surface, and the first support member has a second minimum radius of curvature. The first minimum radius of curvature is greater than or equal to the second minimum radius of curvature.

An embodiment of the invention provides a flexible electronic device including a substrate, a first support member and a second support member. The substrate includes a bend zone. The first support member is located on the first surface of the bending region. The second support member is located on the first surface, and the second support member is spaced apart from the first support member by a distance.

An embodiment of the present invention provides a method of using a flexible electronic device, including: receiving a substrate, the substrate including a bending region; bending the bending region of the substrate to obtain a portion to the bending region a first minimum radius of curvature of a surface; a second minimum radius of curvature is obtained from the first minimum radius of curvature; and a first support member is placed on the first surface of the bending region, the first support member The second minimum radius of curvature.

An embodiment of the present invention provides a flexible electronic device including: an outer frame configured to be bent; and a screen disposed in the outer frame, wherein the outer frame is covered when the outer frame is bent At least part of the screen.

According to the present invention, it is possible to provide a flexible folding scheme of the flexible electronic device, which makes the flexible electronic device easy to be folded and curled at a large angle and in multiple dimensions, thereby making the electronic device foldable and easier to store.

100, 200, 300, 400, 500, 600, 800, 900, 1000, 1100, 1200‧‧‧ flexible electronic devices

101, 201, 301, 401, 501, 601, 801, 901, 1001‧‧‧ substrates

102, 202, 302, 303, 402, 403, 502, 602, 802 ‧ ‧ support

110, 210, 310, 410, 510, 610, 910, 920, 1010, 1020, 1030, 1040‧‧‧ bending zone

111, 112, 211, 311, 312, 411, 412, 511, 512, 611, 612‧‧‧ surface

110a, 110b‧‧‧ Boundary boundary

Sections 111-1, 111-2‧‧‧

113‧‧‧ plane

220‧‧‧Area

530‧‧‧ Groove

603, 703‧‧‧Flexible material layer

Sections 603A, 603B, 703A, 703B‧‧‧

Sections 801A, 801B, 801C‧‧‧

803, 804‧‧‧ bends

FF‧‧‧ bend zone staggered

G‧‧‧ spacing

H‧‧‧thickness

L1, L2‧‧‧ size

P‧‧‧ Space

1102, 1202‧‧‧ frame

1103, 1206‧‧‧ surrounding areas

1104, 1204‧‧‧ screen

1106, 1108, 1110‧‧‧

1106A, 1108A‧‧‧ end

1206A, 1206B, 1206C‧‧‧ Section

1A and FIG. 1B are schematic diagrams of a flexible electronic device according to an embodiment of the present invention; FIG. 1C, FIG. 1D and FIG. 1E are schematic diagrams of a flexible electronic device according to an embodiment of the present invention; FIG. 2A and FIG. 2C is a schematic view of a flexible electronic device according to an embodiment of the present invention; FIG. 2D and FIG. 2E are schematic views of a flexible electronic device according to an embodiment of the present invention; FIG. 3A and FIG. 3B are schematic views of a flexible electronic device according to an embodiment of the present invention; A schematic diagram of a flexible electronic device according to an embodiment of the present invention; and FIG. 4A and FIG. 4B are schematic diagrams of a flexible electronic device according to an embodiment of the present invention; 5A and FIG. 5B are schematic diagrams of a flexible electronic device according to an embodiment of the present invention; FIG. 6A and FIG. 6B are schematic diagrams of a flexible electronic device according to an embodiment of the present invention; FIG. 7A and FIG. FIG. 8A and FIG. 8B, FIG. 8C and FIG. 8D are schematic diagrams of a flexible electronic device according to an embodiment of the present invention; FIGS. 9A, 9B and 9C are flexible embodiments according to an embodiment of the present invention; FIG. 10A, FIG. 10B and FIG. 10C are schematic diagrams of a flexible electronic device according to an embodiment of the present invention; FIG. 11A and FIG. 11B are schematic diagrams of a flexible electronic device according to an embodiment of the present invention; and FIG. 12A and FIG. 12B is a schematic diagram of a flexible electronic device according to an embodiment of the present invention.

Although the invention has been described and illustrated by reference to the particular embodiments of the invention, It will be appreciated by those skilled in the art that various changes and alternatives may be made without departing from the true spirit and scope of the invention as defined by the appended claims.

The present invention provides a flexible electronic device that can be flexibly folded, so that the electronic device can be folded in a variety of ways like the art of origami. In order to improve the folding performance of electronic devices, the present invention proposes various solutions.

Through the description of the embodiments of the present invention, it can be found that the improvement of the mechanical structure of the flexible electronic device is an economical and efficient method, which does not affect the design of various components inside the existing device, and can effectively solve the problem of folding dead angle.

1A shows a schematic diagram of a flexible electronic device 100 of an embodiment, and FIG. 1B shows an exemplary embodiment of the flexible electronic device 200 of FIG. 1A folded. The flexible electronic device 100 can be a display, a handheld electronic device, a sensor, a solar battery device, a touch device, and a communication device. Electronic devices such as standby and wearable electronic devices. In one embodiment, the flexible electronic device 100 is a display device including a plurality of components, such as one of the following: a light emitting diode, an organic light emitting diode, a pixel electrode, a liquid crystal display unit, and a touch electrode. , sensing electrodes, various sensing elements (eg, light sensing elements, capacitive sensing elements, pressure sensing elements, etc.), drive electrodes, thin film transistor (TFT) elements, organic thin film transistors (OTFT) elements, solar energy Battery components and more.

The flexible electronic device 100 includes a substrate 101 and a support member 102. In an embodiment, the substrate 101 may be a carrier of an electronic device, such as a substrate of a touch circuit; a substrate of components of each layer in the display device, such as an electronic circuit such as a liquid crystal layer substrate, a light-emitting layer substrate, a polarizer, a driving circuit, or the like Substrate; protective layer and/or cover lens, and the like. In another embodiment, the substrate 101 can be a package substrate. In some embodiments, the substrate 101 is a flexible substrate that can be bent at an angle by an external force and still function properly. The substrate 101 may have different bending ability depending on its constituent material and formation structure. In addition, in some embodiments, a conductive line, an electronic component, a liquid crystal cell, a display component, a light emitting component, a sensing component, a touch component, and/or a driving component, etc. (not shown) may be formed on the substrate 101.

As shown in FIG. 1B, in which the substrate 101 can conform to the support member 102 at a predetermined bending region 110, the first surface 111 is bent into two portions 111-1 and 111-2 which face each other with the support member 102 as a fulcrum. One of the functions provided by the support member 102 is to prevent the bending portion 110 from being excessively bent to prevent the substrate 101 from being broken due to excessive stress concentration. The first surface 111 has a first curvature at the bend region 110 when bent. The first surface 111 has a first radius of curvature R1 corresponding to the first curvature, and in an embodiment, the first radius of curvature R1 is the reciprocal of the first curvature. In addition, the second surface 112 of the bending zone 110 also has a second curvature and a second radius of curvature R2 corresponding to the second curvature due to the bending. In some embodiments, surface 112 is the opposite surface of first surface 111. In an embodiment, the second radius of curvature R2 is the reciprocal of the second curvature.

The minimum radius of curvature that the first surface 111 can tolerate in the bend region 110 is R _t . When the radius of curvature of the bend region 110 is less than R _t , the first surface 111 or other regions of the substrate 101 will have defects. In some embodiments, the minimum radius of curvature R _t of the first surface 111 is measured when the portions 111-1 and 111-2 are in full or only partial contact with each other (or to a designer's design standard value) ( As shown in Figure 1E). In some embodiments, when the first surface 111 produces a minimum radius of curvature _Rt , the contact areas of the portions 111-1 and 111-2 need to be greater than 50% of the respective surface area.

In one embodiment, the radius of curvature of the substrate 110 can also be defined as a function of the radius of curvature of each of the surfaces 111 or 112, such as an arithmetic mean of the respective radii of curvature of the surface 111 or 112. In an embodiment, the radius of curvature of the bend region 110 may be defined as a linear average of the respective radii of curvature of the surface 111 or 112. In an embodiment, the radius of curvature of the bend region 110 can be defined as the geometric mean of the respective radii of curvature of the surface 111 or 112.

In another embodiment, the radius of curvature of the bend region 110 can be otherwise defined. Referring to FIG. 1C, a plane 113 between the surfaces 111 and 112 and substantially parallel to the surface 111 or 112 may be defined, and the radius of curvature of the bend region 110 may be defined as the plane 113 is bent (as shown in FIG. 1D). ) has a radius of curvature.

In some embodiments, the bending ability of the bend zone 110 can be measured by its bend index T. As can be seen from FIG. 1D, in the case where the fracture region 110 is not broken, the substrate 101 is bent so that the portions 101-1, 101-2 are opposite to each other due to bending and substantially parallel, and portions 101-1 which are parallel to each other 101-2 has a pitch G. The bending index T can be defined as the ratio of the pitch G to the thickness H of the substrate 101, that is, T=G/H. The smaller the bending index T is, the better the bending ability of the substrate 101 is. In an embodiment, when the pitch G is substantially zero or lower than the measurement accuracy, it indicates that the substrate 101 has reached the optimum bending state.

In some embodiments, the bending ability of the bend zone 110 can be measured by its fit index F. Reference Referring to FIG. 1E, the substrate 101 is bent so that the portions 101-1, 101-2 are opposed to each other and in contact with each other. At this time, the substrate 101 forms a hollow closed space P, and the space P is surrounded by the substrate 101 and defined. In this embodiment, portions 101-1, 101-2 of the substrate 101 are contacted or even bonded in the X direction. In an embodiment, the X-direction fitting index Fx of the substrate 101 may be defined as a ratio of the dimension L1 of the space P to the thickness H of the substrate 101, that is, Fx=L1/H, wherein the dimension L1 is along the portions 101-1, 101. -2 contact surface (X direction) measured. In another embodiment, the Y-direction fitting index Fy of the substrate 101 may be defined as a ratio of the dimension L2 of the space P to the thickness H of the substrate 101, that is, Fy=L2/H, wherein the dimension L2 is along the portion 101-1. The contact surface of 101-2 is measured in a substantially vertical direction (Y direction). The smaller the fitting index Fx or Fy, the better the bending ability of the substrate 101. In an embodiment, when the fitting index Fx or Fy is substantially zero or lower than the measurement accuracy, it indicates that the substrate 101 has reached the optimum bending state.

Referring to FIG. 1A, the support member 102 is disposed on the substrate 101. In an embodiment, the support member 102 is disposed on the first surface 111 of a predetermined bending region 110 of the substrate 101. The extent of the bend zone 110 can be determined by user preferences, while in Figure 1A the two dashed lines 110a and 110b are used to indicate their boundaries. The dashed lines 110a and 110b may be boundaries that are visible or invisible to the naked eye.

In an embodiment, the support member 102 can be positioned adjacent the middle of the two boundaries 110a, 110b (i.e., as shown in Figure 1A). In an embodiment, the geometric center or center of gravity of the support member 102 is generally located near the middle of the two dashed lines 110a, 110b. However, in some cases, the geometric center or center of gravity of the support member 102 is generally located intermediate the two boundaries 110a, 110b. In an embodiment, the support member 102 can be disposed at a location that is approximately central but slightly demarcated 110a or 110b.

As shown in FIG. 1B, when the user bends (or even folds) the flexible electronic device 100, the support member 102 supports the substrate 101 at the bending region 110, so that the substrate 101 is bent in conformity with the curved surface of the support member 102, Making the components on the flexible electronic device 100 not cause the substrate to be in the bending zone due to folding Cracks cause component failure.

The support member 102 has a minimum radius of curvature R _s . In some embodiments, starting from the geometric center of the support member 102 and ending with any surface of the support member 102 in contact with the outside world, and in all lines connecting the start point and the end point, the smallest distance is defined It is the minimum radius of curvature R _s of the support member 102. Taking FIG. 1B as an example, if the support member 102 is a uniform sphere, the minimum radius of curvature R _{s is} the radius of the sphere. If the support member 102 is a cylinder, the minimum radius of curvature R _{s is} the radius of the smallest section of the cylinder. In certain embodiments, a virtual circle formed by all endpoints support member 102, which is a virtual circle having a radius defined as the minimum radius of curvature of the support member of R _s 102.

In some embodiments, the minimum radius of curvature R _t and the minimum radius of curvature R _s are related to each other. In some embodiments, the minimum radius of curvature R _t may be determined by a minimum radius of curvature R _s . In one embodiment, the minimum radius of curvature R _t is approximately equal to the minimum radius of curvature R _s. In an embodiment, the minimum radius of curvature R _{t is} greater than the minimum radius of curvature R _s . In some embodiments, a correspondence between the minimum radius of curvature R _t and the minimum radius of curvature R _s is represented by the following equation (1): R _s = α R _t + C (1).

Where α is a coefficient and C is a constant. In certain embodiments, α is a constant ranging between 0 and 1. In certain embodiments, α is a constant between 0 and 0.2. In certain embodiments, α is between a constant between 0.2 and 0.4. In certain embodiments, α is between a constant between 0.4 and 0.6. In certain embodiments, α is a constant between 0.6 and 0.8. In certain embodiments, α is between a constant between 0.8 and 1.0. In certain embodiments, α can be greater than one.

In one embodiment, the coefficient α Young's modulus (Young's Modulus) of the substrate 101 E may be determined. If the substrate 101 is a multilayer composite stack, E represents the overall effective Young's Modulus of the substrate 101. In some embodiments, the smaller the E value, the smaller the alpha . A correspondence between E and α can be expressed by the following equation (2): E = β α ^γ + D (2)

Wherein β , γ, or D can be a constant. In an embodiment, γ is greater than or equal to 1.

In one embodiment, R _t may be less than 10 millimeters (mm), for example, be 5mm, 2mm, 1mm, 0.5mm, 0.1mm, or even 0.01mm. The support member 102 may be permanently adhered to the first surface 111 of the substrate 101, or may be attached to the substrate by other clamping members. In some embodiments, the support member 102 can be attached to the substrate 101 by applying an adhesive coating or by other non-contact forces such as the magnetic force generated by the magnet.

In some embodiments, a method of using flexible electronic device 100 includes receiving substrate 101 that includes a bend region 110. Next, the bending region 110 of the substrate 101 is bent to obtain a first minimum radius of curvature R _t of the first surface 111 of the bending region 110. The minimum radius of curvature R _{s of} the support member 102 can be determined from the minimum radius of curvature R _t . Then, the support member 102 disposed on the first surface 111 of the bent region 110, the support member 102 the minimum radius of curvature R _s.

In some embodiments, the first support member 102 is a multi-layer structure to provide better ductility. In some embodiments, the first support 102 has a porous material. In some embodiments, the first support member 102 can comprise at least one of the following: metal, piezoelectric material, silicone, polyimide, PI, polyethylene terephthalate ( PET), polypropylene (PP), polyethylene naphthalate (PEN), polycarbonate (PC), polyester (PES), cyclic olefin copolymer (COC) and composites thereof.

The design of the support member 102 can be varied in geometry in addition to the minimum radius of curvature and the Young's modulus of the material described above. The support member 102 may be, for example, a spherical body, an elliptical spherical body, a cone, a cylindrical body, or the like, as shown in FIGS. 1A and 1B. In other embodiments, The support member 102 may be a semi-spherical body, a semi-elliptical spherical body, a semi-cylindrical body or a similarly shaped structure such that one of the arcuate surfaces faces the substrate 101.

In the appearance configuration, in addition to the outer design of the single component as shown in FIGS. 1A and 1B, as shown in FIGS. 2A to 2E, a plurality of support members that are connected or not connected to each other may be employed. 2A is a schematic diagram of a flexible electronic device 200 according to another embodiment, and FIG. 2B is a schematic view showing the flexible electronic device 200 of FIG. 2A being folded. 2A and FIG. 2B have a structure similar to that of FIG. 1A and FIG. 1B, that is, a substrate 201 of the flexible electronic device 200 and at least one support member 202, and the support member 202 is disposed within the bending region 210 of the substrate 201.

In an embodiment, as shown in FIGS. 2A and 2B, the support member 202 has at least one inclined surface, which may be a polygonal sphere, a polygonal ellipsoidal sphere, a polygonal diamond cylinder or the like, or a combination of a curved surface and a sloped surface. Aspect. When stress is applied to bend the flexible electronic device 200, the predetermined maximum bending angle (or predetermined minimum radius of curvature) of the flexible electronic device 200 will determine the most suitable corner and/or side length of the support member 202, ie, support. The corners or sides of the member 202 are determined by the minimum radius of curvature or maximum bend angle of the substrate 201.

2C is an enlarged view of the area surrounding the area 220 in FIG. 2A. In this embodiment, two hexagonal supports 202 adjacent to each other are taken as an example for illustration. The support member 202a and the support member 202b each have six vertices. When the substrate 201 has not been bent and deformed, the support member 202a has a distance d from the support member 202b. In the present embodiment, the pitch d is substantially the distance between the apex of the support member 202a and the support member 202b which are closest to each other.

The minimum value of the spacing d may be zero, that is, the support member 202a and the support member 202b are in contact with each other at the apex closest to each other. In one embodiment, the size of the pitch d is related to the Young's modulus of the substrate 201. When the Young's modulus of the substrate 201 is smaller, the pitch d is larger. In another embodiment, the larger the Young's modulus of the substrate 201, the larger the pitch d.

In one embodiment, the size of the spacing d is related to the shape of the support member 202a or the support member 202b, assuming that the support member 202a or the support member 202b is an n-sided shape, where n is a positive integer. The larger the n is, the smaller the pitch d is. The n-gon can be a regular n-sided shape of equal length on each side, or an n-sided shape of equal length on each side.

The n-sided design allows the area of the contact surface 211 of the support member and the substrate 201 to be adjusted according to the needs of use. For example, when the substrate 201 is bent as shown in FIG. 2B, by adjusting the contact range with the surface 211, the tensile stress or compressive stress generated by the bending can be effectively offset or dispersed without causing the support 202b in FIG. 2C. The surface 211 of the substrate 201 is peeled off.

In Fig. 2C, there is an angle θ which is the angle between the corresponding faces of two adjacent supports. When the substrate 201 is bent, the corresponding faces will approach each other, or even become the surface that first contacts each other during the bending process. In an embodiment, as θ is smaller, the spacing d may also decrease.

In the embodiment of Figure 2A, six supports 202 are sequentially arranged to provide a support function. However, the support member 202 can have other embodiments of the number or arrangement. In the embodiment of the plurality of support members 202, the total lay length of the integral support member 202 will be related to the minimum radius of curvature R _t that the flexible electronic device 200 can tolerate, that is, the R _{t of the} substrate 201 depends on the support member 202. The way. As described above, the provision of the plurality of supports 202 provides more flexibility in the setting, and the support 202 can be increased or decreased as needed, providing the convenience of producing and protecting the substrate 201.

See Figure 2A again. In an embodiment, when the spacing d is substantially equal to zero, the adjacent support member 202 forms a triangular, polygonal or other shaped spacing 230 with the first surface 211, and the spacing 230 is squeezed at the substrate 201 or adjacent support 202. The buffer space is provided during pressing and stretching to prevent the substrate 201 or the support member 202 from being subjected to excessive stress.

2D is another embodiment of the flexible electronic device 200, and FIG. 2E shows the flexible type of FIG. 2D. The electronic device 200 is folded over an exemplary embodiment. Referring to Figure 2D, wherein the four supports 202 are in contact with each other or have a spacing 240, the spacing 240 can have a spacing d. In the embodiment of the four support members 202 described above, the support members 202 on both sides are spaced apart from the two support members 202 in the intermediate position, and the two support members 202 in the intermediate position are in contact with each other or adjacent to each other. Without contact. Further, the spacing between the supports 202 may be uniform or different, that is, the spacing d between adjacent supports 202 may be inconsistent. 2D and 2E are merely exemplary embodiments, and the support member 202 may have other embodiments in which the support arrangements are arranged.

The spacing 240 between the supports 202 as shown in Figure 2D can be suitably adjusted to match the effective illumination area of the substrate 201. The support member 202 is disposed at a position avoiding the effective light-emitting area of the substrate 201, so that the light emitted by the substrate 201 can be emitted outward through the space 240 between the support members 202, thereby increasing the light-emitting area. In this way, not only the stress when the substrate 201 is bent can be supported, but also the effective light-emitting area of the substrate 201 can be fully utilized.

3A shows a schematic diagram of a flexible electronic device 300 of an embodiment, and FIG. 3B shows a schematic view of the flexible electronic device 300 of FIG. 3A. 3A shows that the flexible electronic device 300 includes a substrate 301 having a predetermined bending region 310, and a first support member 302 is disposed on the first surface 311 of the bending region 310 of the substrate 301. The definition of the bending zone and other details are similar to those of FIG. 1A and will not be described herein. When the flexible electronic device 300 is bent by stress, the substrate 301 can be bent along the first support member 302 at the bending region 310. For example, when the user folds the flexible electronic device 300, the support member 302 is supported by the bending region 310, and the size of the first support member 302 and the minimum radius of curvature that can be tolerated by the bending region 310 is R _t . Reference is made to the related description of the support member 102 in FIGS. 1A and 1B. In various embodiments, the minimum radius of curvature R _{t of the} bend region 310 can be less than 10 mm, such as 5 mm, 2 mm, 1 mm, 0.5 mm, 0.1 mm, or even 0.01 mm.

The flexible electronic device 300 can further include a second support member 303. The second support member 303 is disposed on the second surface 312 of the opposite side of the bending region 310 relative to the first surface 311. When the flexible electronic device 300 is folded in the folded region 310 such that the two ends of the first surface 311 are close to each other, the first support member 302 can be used to provide the first folded support point. Next, the substrate 301 can be folded in half along the bending region 310 with the second support member 303 as a fulcrum, so that the two sides of the second surface 312 are close to or in contact with each other. In this case, the second support member 303 can provide a supporting function for the second folding, so that the components on the flexible electronic device 300 can avoid component failure caused by multiple folds. The second support member 303 may have a curved mechanical structure, such as a spherical body, an elliptical spherical body, a cone, a cylindrical body, a polygonal sphere, a polygonal ellipsoidal sphere, a polygonal diamond cylinder, a circular or elliptical prism or A structure resembling a shape. The first support member 302 and the second support member 303 may have the same shape and material, and different shapes or materials may be used. For example, as shown in FIG. 3A, the second support member 303 has a different shape from the first support member 302. The first support member 302 and the second support member 303 may be disposed in alignment with each other on both sides of the substrate 301 or may be staggered with each other. In an embodiment, the substrate 301 can have a second bending zone (not shown). The first support member 302 and the second support member 303 can be respectively located in different bending regions. In an embodiment, the different bend zones may be offset from one another without overlapping. In another embodiment, different bend zones may partially overlap.

In an embodiment, the second support member 303 is a one-piece structure, such as a square or a gasket structure having an arc-shaped pattern. Compared with the first support member 302, the second support member 303 has a larger contact area with the substrate 301, and the first support member 302 and the second support member 303 are disposed on opposite sides of the same bent portion 310. In an embodiment, the second support 303 has greater ductility than the first support 302. In an embodiment, the second support 303 has greater ductility than the substrate 301. When the substrate 301 is bent inside the first surface 311, the substrate 301 is subjected to compressive stress near the first surface 311 and tensile stress near the second surface 312. second The support member 303 can have better ductility by dispersing or absorbing the tensile stress of the bending region 310 in the substrate 301 near the second surface 302 by better ductility.

In some embodiments, the first support 302 or the second support 303 has a Young's modulus of less than 20. In some embodiments, the first support 302 or the second support 303 has a Young's modulus of less than or equal to five. In some embodiments, the first support 302 or the second support 303 has a Young's modulus that is less than or equal to one. In some embodiments, the first support member 302 or the second support member 303 has characteristics that are resistant to high temperature processes, such as processes that can withstand high temperatures up to 100 °C.

In some embodiments, the Young's modulus of the first support 302 is about 1-2.5 times the Young's modulus of the second support 303. In some embodiments, the Young's modulus of the first support 302 is greater than the Young's modulus of the second support 303, between about 1.25 and 3 times.

In some embodiments, the first support 302 or the second support 303 is a multi-layer structure to provide better ductility. In some embodiments, the first support 302 or the second support 303 has a porous material. In some embodiments, the material of the first support member 302 or the second support member 303 may include at least one of the following: metal, piezoelectric material, silicone, polyimide, PI, poly Ethylene terephthalate (PET), polypropylene (PP), polyethylene naphthalate (PEN), polycarbonate (PC), polyester (PES), cyclic olefin copolymer (COC) and Its composite material.

4A and 4B show an embodiment of a flexible electronic device 400 having a substrate 401. A first support member 402 is provided on the first surface 411 of the bent portion 410 of the substrate 401, which is made of a flexible material. Further, a second support member 403 is disposed on the second surface 412 of the bent portion 410 of the substrate 401. When the flexible electronic device 400 is bent by stress, the first support member 402 can be bent along the substrate 401 in the bending region 410, and the second support member 403 is also bent in the same direction as the substrate 401. In this embodiment, the first support member 402 may have a gasket structure of a specific shape according to design requirements, such as a sheet-like structure having a circular arc plane, or a layered structure having a curved surface. The flaky knot The structure or layer structure extends along the surface 411 to both sides of the bending region 410, so that when the substrate 401 is bent, the minimum radius of curvature of the bendable portion may also be related to the thickness of the first support member 402. The first support member 402 can have a thickness such that the substrate has a minimum radius of curvature of less than 10 mm, and the thickness or the minimum radius of curvature can be, for example, 5 mm, 2 mm, 1 mm, 0.5 mm, 0.1 mm, or even 0.01 mm.

In an embodiment, the first support member 402 can be a coating layer and can be formed on the substrate 401 by coating. In other embodiments, the first support member 402 can be formed from a semiconductor material as a raw material, and the first support member 402 is formed on the substrate 401 in a deposition manner or other process technology matured in a semiconductor manufacturing method. In some embodiments, the first support member 402 is formed in the same process as the substrate 401.

In an embodiment, the second support member 403 may have a curved mechanical structure, such as a spherical body, an ellipsoidal body, a cone, a cylinder or the like, or may be a sheet or layer structure. In an embodiment, the second support 403 may have the same or a different configuration than the first support 402. The second support member 403 is made of a flexible material and may be the same as or different from the material from which the first support member 402 is made.

FIG. 5A shows a schematic diagram of a flexible electronic device 500 of an embodiment, and FIG. 5B shows a schematic view of the flexible electronic device 500 of FIG. 5A. The flexible electronic device 500 includes a substrate 501 and a support member 502, and the support member 502 is disposed on the substrate 501. In one embodiment, the support member 502 is disposed on the first surface 511 of a bending region 510 of the substrate 501, wherein the substrate 501 is bendable toward the first surface 511 in the bending region 510 conforming to the support member 502.

Compared with FIG. 2A and FIG. 2B , the substrate 501 is further provided with a groove 530 on the second surface 512 opposite to the first surface 511 , and the groove 530 is located in the range of the bending region 510 . In an embodiment, the recess 530 has a length and a depth, and the length or depth may depend on the hardness characteristics of the substrate 501 or the application. Determined by the required radius of curvature. As illustrated in the foregoing embodiment, when the substrate 501 is bent inside the first surface 511, the substrate 501 is subjected to compressive stress near the first surface 511 and tensile stress near the second surface 512. Moreover, the material of the substrate 501 near the second surface 512 has a radius of curvature near the surface of the second surface 512 that is greater than the radius of curvature of the inner layer, and thus the surface material adjacent to the second surface 512 is stretched. The stress will be larger than the inner material. Therefore, the moderate thinning of the bending zone 510 can correspondingly reduce the overall effective radius of curvature of the bending zone 510, thereby reducing the tensile stress of the bending zone and reducing the possibility of damage to the substrate.

As shown in FIG. 5B, when the flexible electronic device 500 is bent by stress, the first support member 502 can be bent according to the bending of the substrate 501, and the substrate 501 can be flexibly bent near the groove 530. Moreover, the material that is subjected to the maximum tensile stress at the second surface 512 has been reduced, so that the substrate 501 can be more effectively protected.

Another embodiment is provided below. In the manufacturing process of the flexible electronic device, the bending properties of the various layers of the electronic device manufacturing process can be improved. FIG. 6A shows a schematic diagram of a flexible electronic device 600 of an embodiment, and FIG. 6B shows a schematic view of the flexible electronic device 600 of FIG. 6A. The flexible electronic device 600 includes a substrate 601, a support 602, and a flexible material layer 603. 6A is substantially similar to the structure illustrated in FIGS. 3A and 5A, and thus the details thereof will not be described again. The flexible material layer 603 functions similarly to the second support 303 of FIG. 3 or the second support 403 of FIG. However, one of the differences between FIG. 6A and the previous embodiment is that the flexible material layer 603 is at least partially disposed within the substrate 601. As shown in FIG. 6A, the substrate 601 has a recess at the bend region 610, and a portion of the flexible material layer 603 is disposed within the recess. In some embodiments, the layer of flexible material 603 extends outwardly from the interior of the substrate 601, for example, having a portion that covers the second surface 612. In an embodiment, the layer of flexible material 603 can act as a support to provide support protection when the substrate 601 is bent, similar to the second support 403.

The substrate 601 and the flexible material layer 603 can be made of different materials. The substrate 601 is made of a first flexible material, and the flexible material layer 603 is made of a second flexible material, wherein the second flexible material has a Young's modulus of less than 10. In some embodiments, the first flexible material has a Young's modulus of less than 5. In some embodiments, the second flexible material has a Young's modulus of less than one. In some embodiments, the second flexible material has a Young's modulus of less than 0.1.

It can be seen from the foregoing description that the greater the degree of bending, the smaller the corresponding radius of curvature. Therefore, if the ductility of the substrate in the predetermined bending region is insufficient, wrinkles, local deformation or breakage may occur, and even components or circuits on the substrate may be caused. The damage. According to the description of the embodiment disclosed in FIGS. 3A, 3B, 5A and 5B, the composite substrate 601 disclosed in FIGS. 6A and 6B can improve the ductility of the bending region 610 and avoid damage of components or circuits on the substrate. Since the composite substrate 601 has a reduced thickness and/or length of the first flexible material in the bending region 610, and the second flexible material replaces the material at the maximum bending point, the original first scratch is not reduced. The possibility that the material is damaged by tensile stress, and the second flexible material having greater ductility improves the effect of the original groove, and it is expected to further improve the bending zone 610 of the substrate 601 when bent. Tolerance of large angle bends. In addition, the flexible material layer 603 further covers the second surface 612 near the recess of the substrate 610 to provide better support and ductility.

In one embodiment, the layer of flexible material 603 can be made of the same material as the supports 202, 302, etc., in the previous embodiments. In further embodiments, the second flexible material comprises at least one of the following: anthrone, polyimine, PET, PP, PEN, PC, PES, COC, and composites thereof. In one embodiment, the flexible material layer 603 is a composite material in which a mixture of polyimine and anthrone is mixed, for example, 10-40% of polyimine and 60%-90% of anthrone are mixed in a predetermined ratio. It is formed by a laminate structure of polyimine and anthrone, and it is possible that a film of a plurality of layers of polyimide and anthrone forms a flexible material layer 603 in a sandwich laminate structure.

In some embodiments, the layer of flexible material 603 has a first portion 603A located within the substrate 601 and a second portion 603B protruding over the second surface 612 or covering a portion of the second surface 612. The first portion 603A and the second portion 603B may have the same shape or structure. In some embodiments, the first portion 603A may have a greater thickness or length than the second portion 603B, while in other embodiments, the first portion 603A may have a smaller thickness or length than the second portion 603B. 7A and 7B are schematic diagrams showing another embodiment of a flexible electronic device 600 according to an embodiment. The flexible electronic device 600 includes a layer of flexible material 703 having a first portion 703A located within the substrate 601 and a second portion 703B located on the second surface 612. In contrast to Figures 6A and 6B, the first portion 703A of the flexible material layer 703 of Figures 7A and 7B has a smaller thickness than the second portion 703B and has a greater length than the second portion 703B.

Other embodiments of the present invention also provide a flexible electronic device having multiple bending functions. 8A and 8B are schematic diagrams showing different bending modes of the flexible electronic device 800 of an embodiment. The flexible electronic device 800 includes a substrate 801, a support member 802, and a bent portion 803. The structure and material of the substrate 801 are similar to those of the above-described embodiments (for example, the substrates 101, 201, 801, etc.), and the structure and material of the support member 802 are the same as those described in the foregoing embodiments. Similar to the finished material (for example, the support members 102, 202, 302, 303, etc.) will not be described herein.

The bent portion 803 is located in the substrate 801 for connecting different portions of the substrate 801. In an embodiment, the bent portion 803 is used to make the substrate 801 have a fixed angle and a direction after being bent by an external force, and does not directly return to the original position after the external force is removed. The bending angle and the orientation of the bent portion are adjusted by an external force, and the substrate 801 is bent and can be divided into different portions. Referring to FIGS. 8A and 8B, the substrate 801 can be divided into portions 801A, 801B, and 801C, wherein the portion 801A can serve as a base, and the portions 801B and 801C have different angles to face the user due to different bending angles. In some embodiments, different portions of the different viewing angles described above may be used for different purposes of the display device, such as Portion 801B can serve as an input interface and portion 801C can serve as a display interface. Fixing the input interface to the display interface increases the user's convenience without the need to maintain the posture of the flexible electronic device 800 by hand or other fixed equipment.

The bent portion 803 has a material composition or structure similar to that of the bent portion 110. The bent portion 803 may also have a display function or a light emitting function. In an embodiment, the bent portion 803 has a flexible substrate. The bent portion 803 can be combined with the substrate 801 to form an enlarged substrate to provide a display function or a light-emitting function. In an embodiment, the bend 803 includes a linkage mechanism to assist in its bending function, such as a joint, gear, ratchet, shaft, hinge, linkage, combinations thereof, or the like. In addition, the flexible electronic device 800 can have other connection components to join the connection structure to the substrate 801, such as a fixing material or mechanism such as an adhesive or a screw.

In the embodiment shown in FIG. 8A, the bent portion 803 divides the substrate 801 into at least two portions 801B and 801C, that is, the bent portion 803 is exposed from the surface of the flexible electronic device 800. In another embodiment, the substrate 801 covers the surface of the flexible electronic device 800 and is not separated by the bent portion 803, that is, the portion 801B and the portion 801C are integrally connected to each other, and the bent portion 803 is covered with Below the substrate 801 or inside the flexible electronic device 800.

Furthermore, the support members (e.g., support members 102, 202, 302, 402, 403, 502, 602, 603, and 703) or recess 530 designs mentioned in the previous embodiments may also be combined with the current embodiment support member 802. The bending capability and the supporting effect of the flexible electronic device 800 are improved.

8C and 8D show schematic diagrams of another different embodiment of the flexible electronic device 800. Referring to FIG. 8C and FIG. 8A, it can be seen that the flexible electronic device 800 is not provided with a support member in FIG. 8C, but two bent portions are provided, wherein the first bent portion 803 is disposed at the portion 801B and the portion 801C. Meanwhile, the second bent portion 804 is disposed between the portion 801B and the portion 801A. Since the second bent portion 804 is also similar to the first bent portion 803, it has its own fixing mechanism and is not removed by external force removal. Back, so the auxiliary function of the support is not necessarily required. In one embodiment, the substrate 801 covers the surface of the flexible electronic device 800 and is not separated by the second bent portion 804, that is, the portion 801A and the portion 801B are integrally connected to each other, and the second bent portion 804 is Covered under the substrate or inside the flexible electronic device 800.

It can be seen from the above description that the flexible electronic device 800 can be used to flatten the substrate 801 on the table top or the hand as a full-surface display device or bend the substrate 801 by using the supporting member and the bending portion. The folding portion allows the flexible electronic device 800 to stand on the table or the lap, and it is more convenient to provide a variety of viewing angle selection and display modes.

The flexible electronic device disclosed in the present invention can also improve the performance of multiple folding, for example, the spirit of the above single bending zone can be applied to a plurality of staggered bending zones to achieve the goal of multi-folding at the same point. FIG. 9A is a schematic diagram of a flexible electronic device 900 according to an embodiment. The flexible electronic device 900 includes a substrate 901. The substrate has a first bending zone 910 and a second bending zone 920, wherein the first bending zone 910 and the second bending zone 920 are interlaced with each other. In an embodiment, the first bend zone 910 and the second bend zone 920 are staggered at about 90° or other angles from one another. The structure and material of the substrate 901 are similar to those of the foregoing embodiments (for example, the substrates 101, 201, 801, etc.), and will not be described herein.

9B shows a schematic view of the flexible electronic device 900 of FIG. 9A after the substrate 901 is folded along the first bending zone 910, wherein the bending zone 901 has a single folding effect and has a first minimum radius of curvature F1. 9C shows a schematic diagram of the flexible electronic device 900 of FIG. 9B after the second folding of the substrate 910 along the second folding area 902, wherein the bending area 920 and the bending area 910 are double-folded at the point FF ( Or a cross-fold, which has a second minimum radius of curvature F2. In an embodiment, the second minimum radius of curvature F2 is greater than the first minimum radius of curvature F1. In an embodiment, the first minimum radius of curvature F1 is greater than the thickness of the substrate 901.

Furthermore, the support members (e.g., support members 102, 202, 302, 402, 403, 502, 602, 603, and 703) or groove design 530 referred to in the foregoing description may also be combined with the present embodiment to improve flexibility. The bending ability and supporting effect of the electronic device 900.

In one embodiment, the substrate 901 includes a multi-layer structure (not shown), for example, having a panel layer, an encapsulation layer, and a back sheet. When the substrate 901 is designed to be foldable, the thickness of the panel layer is approximately equal to the sum of the thicknesses of the encapsulation layer and the backsheet. In an embodiment, the panel layer has a thickness of about 100 nm or less. In an embodiment, the panel layer has a thickness greater than about 100 nanometers.

The flexible electronic device disclosed in the present disclosure can also use more staggered bending regions to achieve the same folding and folding. FIG. 10A is a schematic diagram of a flexible electronic device 1000 according to an embodiment, which includes a substrate 1001. The structure and material of the substrate 1001 are similar to those of the foregoing embodiments (for example, the substrates 101, 201, 801, etc.), and will not be described herein. The substrate 1001 has four bend regions 1010, 1020, 1030, and 1040 that are staggered from each other and have a common staggered point 1002 at a center point of the substrate 1001. FIG. 10B and FIG. 10C are schematic diagrams showing the flexible electronic device 1000 of FIG. 10A after being bent. As can be seen from the figure, with the design change of the bending zone, the flexible electronic device 1000 can present more different bending modes and display areas, while other different bending zones modify and adjust the embodiment, such as more bending. The folding zone and other interlacing manners and the like are all within the scope of the present invention.

As previously mentioned, the support members (e.g., supports 102, 202, 302, 402, 403, 502, 602, 603, and 703) or groove designs 530 referred to herein may also be combined with this embodiment. The bending ability and the supporting effect of the flexible electronic device 1000 are improved.

11A and 11B are schematic views of a flexible electronic device 1100 according to an embodiment of the present invention. The flexible electronic device 1100 can be a display device or a wearable device, such as augmented reality. (Augmented Reality, AR) device, Virtual Reality (VR) device, or Mixed Reality (MR) device. In an embodiment, the flexible electronic device 1100 can be a flexible electronic device 100, 200, 300, 400, 500, or 600. Referring to FIG. 11A, the flexible electronic device 1100 has a frame 1102 and a screen 1104. The outer frame 1102 is for holding the screen 1104, and the screen 1104 is for displaying the visual content to the user. The outer frame 1102 can be made of a flexible material or a non-flexible material, wherein the flexible material can be selected, for example, from a metal, a piezoelectric material, a silicone, a polyimide (PI), a polyparaphenylene. Ethylene dicarboxylate (PET), polypropylene (PP), polyethylene naphthalate (PEN), polycarbonate (PC), polyester (PES), cyclic olefin copolymer (COC) and their composites material. In one embodiment, the outer frame 1102 has an arc that can be determined based on the curvature of the human head. In an embodiment, the outer frame 1102 has a peripheral region 1103 extending in the direction of the user to be more conformable to the user's face for enhancing the shading effect without causing fatigue or discomfort due to excessive background illumination. In one embodiment, the outer frame 1102 can be a box, and the screen 1104 faces the user by one of the openings of the box.

The screen 1104 is placed inside the outer frame 1102 at the center of the bottom of the box. The screen 1104 can include a lens, a display panel, a projection device, and the like. The screen 1104 can comprise a flexible substrate made of a flexible material such as a metal, a piezoelectric material, a silicone, a polyimide, a polyethylene terephthalate or a polyethylene terephthalate (polyethylene terephthalate). PET), polypropylene (PP), polyethylene naphthalate (PEN), polycarbonate (PC), polyester (PES), cyclic olefin copolymer (COC) and composites thereof. In an embodiment, the screen 1104 includes a flexible substrate, such as a substrate 101, 201, 301, 401, 501, 601, 801, 901, or 1001. Since the screen 1104 is made of a flexible material, it can be bent with the folding of the outer frame 1102. In an embodiment, the screen 1104 includes a non-planar screen (eg, a curved screen) to match the curved surface of the outer frame 1102.

In this embodiment, as shown in FIG. 11B, the outer frame 1102 has a foldable characteristic to facilitate Storage. On the other hand, the foldable outer frame 1102 can also protect the screen 1104 from damage or soiling after folding. Referring to Figure 11B, the outer frame 1102 has a portion 1106, a portion 1108, and a portion 1110. In one embodiment, at least one of the portion 1106, the portion 1108, and the portion 1110 is made of a flexible material. When the flexible electronic device 1100 is in use (Fig. 11A), the outer frame 1102 is deployed, and the portion 1106 is in parallel with the portion 1108 and the ends 1106A and 1108A are furthest from each other. The screen 1104 can be deployed and the portion 1106 can be placed at approximately parallel angles to the portion 1108 for viewing by the user. As shown in Figures 11A and 6B, portion 1110 is at least partially connected to portions 1106 and 1108 and overlaps portion 1106 or 1108 when outer frame 1102 is deployed. In another embodiment, when the outer frame 1102 is folded, the portion 1110 is partially overlapped with the portions 1106 and 1108 via the outer side, and is completely overlapped with the portion 1106 or 1108 when the outer frame 1102 is unfolded. In another embodiment, the portion 1110 is part of the portion 1106 or 1108 and is made of a flexible material that is stretched or compressed with its flexibility to accommodate the folded deformation of the outer frame 1102. In one embodiment, the portion 1110 is made of a flexible material for joining portions 1106 and 1108 made of a non-bendable material. In one embodiment, the portion 1110 has the same material and configuration as the previously described bend regions (e.g., bend regions 110, 210, etc.). In an embodiment, the portion 1110 can be made of a flexible metal, an elastic member, or a plastic. In one embodiment, due to the bendable nature of the screen 1104, the curvature formed by the portion 1106, the portion 1108, and the portion 1110 does not cause the screen 1104 to break or be damaged.

When the flexible electronic device 1100 is stowed (Fig. 11B), the outer frame 1102 is folded, and the portion 1106 and the portion 1108 are bent from the portion 1110 such that the end portion 1106A of the portion 1106 and the end portion 1108A of the portion 1108 are close to each other. Or meet. At this time, the screen 1104 is covered inside the outer frame 1102, and thus its visible range is partially or completely covered by the outer frame 1102. Since the screen 1104 is flexible, its display function can be bent and operated normally after the outer frame 1102 is completely folded. The portion 1106 can be nearly parallel to the portion 1108 but its respective ends 1106A, 1108A are close to each other. At this time part 1110 One side is exposed between the portions 1106 and 1108. In one embodiment, when the outer frame 1102 is folded in half, the portions of the portion 1106 and the portion 1108 that are opposite each other are in close contact with each other and may partially overlap.

12A and 12B are schematic views of a flexible electronic device 1200 according to an embodiment of the invention. The flexible electronic device 1200 can be an AR device, a VR device, or an MR device. In an embodiment, the flexible electronic device 1100 can be a flexible electronic device 100, 200, 300, 400, 500, or 600. Referring to FIG. 12A, the flexible electronic device 1200 has an outer frame 1202 and a screen 1204. The outer frame 1202 is for holding the screen 1204, and the screen 1204 is for displaying the visual content to the user. The outer frame 1202 is made of a flexible material such as a metal, a piezoelectric material, a silicone, a polyimide, a polyethylene terephthalate (PET), a polypropylene (a polyethylene). PP), polyethylene naphthalate (PEN), polycarbonate (PC), polyester (PES), cyclic olefin copolymer (COC) and composites thereof. In an embodiment, the outer frame 1202 includes a flexible substrate, such as substrate 101, 201, 301, 401, 501, 601, 801, 901, or 1001.

In one embodiment, the outer frame 1202 can be a box having a peripheral region 1206 as a box edge, and the screen 1204 faces the user by an opening of the box. The screen 1204 is placed inside the outer frame 1202 and is located at the center of the bottom of the case. The screen 1204 can include a lens, a display panel, a projection device, and the like. In an embodiment, the screen 1104 includes a flexible substrate, such as a substrate 101, 201, 301, 401, 501, 601, 801, 901, or 1001.

In an embodiment, the peripheral region 1206 of the outer frame 1202 has an arc that can be determined based on the curvature of the human head. In an embodiment, the outer frame 1202 extends in the direction of the user via the peripheral region 1206, and is more conformable to the user's face for enhancing the shading effect without causing fatigue or discomfort due to excessive background illumination.

Referring to Figure 12B, the outer frame 1202 is flexible. In the present embodiment, when the flexible electronic device 1200 is stored, the outer frame peripheral region 1206 can have elasticity, and thus can be folded or compressed to be reduced. The thickness occupied by the outer frame 1202. In the present embodiment, the outer frame 1202 has a portion 1206A, a portion 1206B, and a portion 1206C, wherein the portions are connected to each other. When the flexible electronic device 1200 is in use (Fig. 12A), the peripheral region 1206 of the outer frame 1206 is in a fully deployed state, and the portions 1206A, 1206B, and 1206C are joined to each other such that the peripheral region 1206 surrounds the screen 1204 and forms a first thickness. . Due to the flexible nature of the outer frame 1206, the portions where the portions 1206A, 1206B, and 1206C meet each other can be joined without being broken.

When the flexible electronic device 1200 is stowed (Fig. 12B), the outer frame 1202 can be folded in a zigzag manner, and the portion 1206C is bent or folded along the inside of the case and covers the visible range of the portion of the screen 1204. The portion 1206B can be further bent or folded along the interior of the casing and cover a wider portion of the screen 1204. Next, the portion 1206A is bent or folded along the interior of the casing and covers the visible range of more portions of the screen 1204. The peripheral region 1206 is compressed but still surrounds the screen 1204 and forms a second thickness, the second thickness being less than the first thickness. Due to the flexible nature of the outer frame 1202, portions of the portions 1206A, 1206B, and 1206C that are bent relative to one another can flex without breaking. In the present embodiment, the flexible electronic device 1200 can achieve a flat compressed state, effectively reducing its thickness, and can be adapted to different carrying or storage requirements.

The present invention provides a variety of improved flexible electronic devices that can be combined in any combination to optimize the deflection of the flexible device. The construction and configuration of the structures and methods as shown in the various exemplary embodiments are merely illustrative. Accordingly, all such modifications are intended to be included within the scope of the present invention. The order or sequence of any program or method steps may be changed or re-sequenced according to alternative embodiments. Other substitutions, modifications, changes and omissions may be made in the design, operation, and configuration of the example embodiments without departing from the scope of the invention.

Claims (15)

A flexible electronic device includes: a substrate including a first bending zone, wherein a first surface of the first bending zone has a first minimum radius of curvature; and a first support member located at the a first bending portion attached to the first surface, the first support member having a second minimum radius of curvature greater than or equal to the second minimum radius of curvature, wherein the first support member is configured As the fulcrum of the substrate when the substrate is bent, the substrate is bent in conformity with the first support. The flexible electronic device of claim 1, wherein the second minimum radius of curvature is a starting point of a geometric center of the first supporting member, and the first supporting member contacts the first surface as an end point at the starting point The smallest of the linear distances between the endpoints. The flexible electronic device of claim 1, wherein the first support member is a spherical body or an ellipsoidal body. The flexible electronic device of claim 1, further comprising a second support member, the second support member and the first support member being spaced apart from each other. The flexible electronic device of claim 1, wherein the first minimum radius of curvature is 10 mm. The flexible electronic device of claim 1, further comprising a second support member on the second surface of the first bending region, the second surface being located on the opposite side of the first surface. The flexible electronic device of claim 1, further comprising a recess located in a second surface of the first bend region, the second surface being located on an opposite side of the first surface. The flexible electronic device of claim 7, further comprising a layer of flexible material that fills the recess. The flexible electronic device of claim 1, wherein the substrate further comprises a second bending zone interlaced with the first bending zone at an interlaced point. The flexible electronic device of claim 9, wherein the substrate has a third minimum radius of curvature when bent twice at the staggered point, the third minimum radius of curvature being greater than the first minimum radius of curvature, and the first The minimum radius of curvature is greater than the thickness of the substrate. A flexible electronic device comprising: a substrate comprising a bending zone; a first support member on the first surface of the bending region; and a second support member on the first surface The second support member is spaced apart from the first support member by a distance. The flexible electronic device of claim 11, wherein the first support has a first Young's modulus and the second support has a second Young's modulus that is less than the first Young's coefficient. A method for using a flexible electronic device, comprising: receiving a substrate, the substrate comprising a bending region and a support member attached to a surface of the bending region, wherein the support member has a first minimum radius of curvature; And bending the substrate to conform to the support with the support as a fulcrum of the substrate to obtain a second minimum radius of curvature of the surface, wherein the first minimum radius of curvature is less than or equal to the second minimum radius of curvature. The method of claim 13, wherein the first minimum radius of curvature is based on a geometric center of the support and ends at a point where the support contacts the surface, in a linear distance between the starting point and the end points The smallest. A flexible electronic device includes: an outer frame configured to be bent; and a screen disposed in the outer frame, wherein the outer frame is bent to cover at least a portion of the screen.