CN111584557B - Display panel and display device - Google Patents
Display panel and display device Download PDFInfo
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- CN111584557B CN111584557B CN202010378872.7A CN202010378872A CN111584557B CN 111584557 B CN111584557 B CN 111584557B CN 202010378872 A CN202010378872 A CN 202010378872A CN 111584557 B CN111584557 B CN 111584557B
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/301—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements flexible foldable or roll-able electronic displays, e.g. thin LCD, OLED
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/17—Passive-matrix OLED displays
- H10K59/179—Interconnections, e.g. wiring lines or terminals
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
Abstract
The invention provides a display panel and a display device. The display panel comprises a substrate layer, a display layer and a first driving circuit. The first driving circuit is arranged on the substrate layer and connected with the display panel. The first driving circuit is provided with a first wiring area, a plurality of first wirings are distributed in the first wiring area, and each first wiring is provided with a first connecting line and a second connecting line. The first connection line is vertically connected to the second connection line.
Description
Technical Field
The invention relates to the field of display devices, in particular to a display panel and a display device.
Background
In a panel structure of an Active-matrix organic light-emitting diode (AMOLED), a panel is bent from a previous SF (solid state bend) to a DF (dynamic bend) to a current cross bend technology, and the cross bend belongs to a new leading edge technology.
However, in the panel with the cross-shaped bend, the Bending radian of the Bending part of the substrate layer in the PAD bonding area of the panel is too large, and the generated stress is also too large, so that the phenomena such as cracking and the like are easily generated, the stability of the panel is seriously influenced, and the service life of the panel is shortened.
Disclosure of Invention
The invention aims to provide a display panel and a display device, and aims to solve the problems that in the prior art, the Bending radian of a Bending part of a PAD bonding area is too large, the generated stress is too large, the phenomena of cracking and the like are easily generated, the stability of the panel is seriously influenced, the service life of the panel is shortened, and the like.
In order to achieve the above object, the present invention provides a display panel. The display panel is provided with a display area, a binding area connected with the display area and a first bending area arranged in the display area and the binding area.
The display panel comprises a substrate layer, a display layer and a first driving circuit. The substrate layer covers the display area and the binding area and is provided with a bending opening, and the bending opening corresponds to the first bending area. The display layer is arranged on the substrate layer in the display area. The first driving circuit is arranged on the substrate layer in the binding area and connected with the display panel. The first driving circuit is provided with a first wiring area, part of the first wiring area is superposed with the first bending area, and the first wiring area is positioned between the bending opening and the display panel. A plurality of first wires are arranged in the first wire routing area, and each first wire has a first connecting wire and a second connecting wire. The first connection line is vertically connected to the second connection line. The second connecting line is parallel to the display layer.
Furthermore, the first driving circuit further comprises a first chip, and the first chip is arranged on the substrate layer. The first wire further comprises a third connecting wire, one end of the third connecting wire is connected with the second connecting wire, and the other end of the third connecting wire is connected with the first chip.
Further, the display panel further comprises a second driving circuit. The second driving circuit is arranged on the substrate layer in the binding region and is located on the same side of the display layer with the first driving circuit.
The second driving circuit comprises a second chip and a second wiring area. The second chip is arranged on the substrate layer. And a plurality of second wires are arranged in the second wire area and are connected with the first chip and the display layer.
Furthermore, each second wire has a fourth connecting line and a fifth connecting line. One end of the fourth connecting line is connected with the display layer, and the other end of the fourth connecting line is connected with the fifth connecting line. One end of the fifth connecting line is connected with the fourth connecting line, and the other end of the fifth connecting line is directly or indirectly connected with the second chip.
Further, when the fifth connecting line is indirectly connected to the second chip, the second trace further has a sixth connecting line, one end of the sixth connecting line is connected to the fifth connecting line, and the other end of the sixth connecting line is connected to the second chip.
The fifth connecting line is parallel to the display layer, and the fourth connecting line is perpendicular to the fifth connecting line.
Furthermore, each of the first traces and/or the second traces has a plurality of openings, and the openings are uniformly arranged on the first traces and/or the second traces.
Further, two adjacent first wires are parallel to each other.
Furthermore, each of the first traces and/or the second traces has a plurality of openings, and the openings are uniformly arranged on the first traces and/or the second traces.
Further, the line width of the first trace and/or the second trace is 2-20 micrometers. The aperture of the opening is 1-15 microns. The distance between two adjacent openings is 1-15 microns.
Furthermore, the display panel is also provided with a second bending area which is perpendicular to the first bending area and is combined with the first bending area to form a cross-shaped bending area structure.
The invention also provides a display device, which comprises the display panel.
The invention has the advantages that:
according to the display panel and the display device provided by the invention, the display panel is provided with the bending opening, so that the stress generated by the substrate layer in the binding area during bending is relieved, and the substrate layer is prevented from cracking and falling off during bending. Meanwhile, the resistance of the first wiring to bending stress is strengthened through the design of the right-angle folding line, the first wiring is prevented from being broken due to bending, and the stability of the display panel and the service life of the display device are improved.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
Fig. 1 is a bent perspective view of a display device in embodiment 1 or 2 of the present invention;
FIG. 2 is a top view of the display panel of embodiment 1 of the present invention;
FIG. 3 is an enlarged schematic view of an area A of the display panel in embodiment 1 of the present invention;
FIG. 4 is an enlarged schematic view of a region B of the display panel in embodiment 1 of the present invention;
fig. 5 is a schematic structural diagram of the first trace or the second trace in embodiment 1 or 2 of the present invention;
FIG. 6 is a top view of a display panel in embodiment 2 of the present invention;
FIG. 7 is an enlarged schematic view of an area A of a display panel in embodiment 2 of the present invention;
fig. 8 is an enlarged schematic view of a region B of the display panel in embodiment 2 of the present invention.
The components in the figure are identified as follows:
a display panel 100;
a display area 101; a binding region 102;
a first bending zone 103; a second bending region 104;
a first bend centerline 105; a second bend centerline 106;
a substrate layer 110; a bending opening 111;
a display layer 120; a first drive circuit 130;
a first chip 131; a first routing area 132;
a first trace 133; a first connection line 1331;
a second connection line 1332; a third connection line 1333;
a second drive circuit 140; a second chip 141;
a second routing area 142; a second trace 143;
a fourth connection line 1431; a fifth connecting line 1432;
a sixth connecting line 1433; an opening 150.
Detailed Description
The preferred embodiments of the present invention will be described below with reference to the accompanying drawings, which are included to demonstrate that the invention can be practiced, and to provide those skilled in the art with a complete description of the invention so that the technical content thereof will be more clear and readily understood. The present invention may be embodied in many different forms of embodiment and the scope of the invention is not limited to the embodiments set forth herein.
In the drawings, structurally identical elements are represented by like reference numerals, and structurally or functionally similar elements are represented by like reference numerals throughout the several views. The size and thickness of each component shown in the drawings are arbitrarily illustrated, and the present invention is not limited to the size and thickness of each component. The thickness of the components has been exaggerated in some places in the drawings where appropriate for clarity of illustration.
Furthermore, the following description of the various embodiments of the invention refers to the accompanying drawings that illustrate specific embodiments of the invention, by which the invention may be practiced. Directional phrases used in this disclosure, such as, for example, "upper," "lower," "front," "rear," "left," "right," "inner," "outer," "side," and the like, refer only to the orientation of the appended drawings and are, therefore, used herein for better and clearer illustration and understanding of the invention, and do not indicate or imply that the device or element so referred to must have a particular orientation, be constructed and operated in a particular orientation, and are therefore not to be considered limiting of the invention. Furthermore, the terms "first," "second," "third," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
When certain components are described as being "on" another component, the components can be directly on the other component; there may also be an intermediate member disposed on the intermediate member and the intermediate member disposed on the other member. When an element is referred to as being "mounted to" or "connected to" another element, they may be directly "mounted to" or "connected to" the other element or indirectly "mounted to" or "connected to" the other element through an intermediate element.
Example 1
In an embodiment of the present invention, as shown in fig. 1, the display device is a flexible AMOLED (Active-Matrix Organic Light-Emitting Diode) display device, which has a display panel 100, and the display panel 100 is used for providing a display screen for the display device. The display device can be any product or component with a display function, such as a mobile phone, a tablet computer, a notebook computer and the like.
As shown in fig. 2, the display panel 100 has a display area 101 and a binding area 102 connected to the display area 101. The display panel 100 further has a substrate layer 110, a display layer 120, a first driving circuit 130 and a second driving circuit 140.
The substrate layer 110 covers the display area 101 and the binding area 102, which is a flexible substrate layer 110. The display layer 120 is disposed on the substrate layer 110, corresponds to the display area 101, and is rectangular, and the binding area 102 is located on a side of the rectangular display layer 120 with a shorter side length. The display layer 120 is used for providing a display screen. The first driving circuit 130 and the second driving circuit 140 are disposed side by side on a side of the rectangular display layer 120 with a shorter side length, and are both connected to the display layer 120. The first driving circuit 130 and the second driving circuit 140 are bound on the substrate layer 110, and are folded together with the substrate layer 110 in the binding region 102 onto a surface of the substrate layer 110 in the display region 101 away from the display layer 120.
The first driving circuit 130 has a first chip 131 and a first wiring region 132. The first chip 131 is disposed on the substrate layer 110 of the bonding region 102, and the first routing region 132 is located between the first chip 131 and the display layer 120. As shown in fig. 3, a plurality of first traces 133 are disposed inside the first traces 133, and two adjacent first traces 133 are parallel to each other. Each of the first traces 133 has a first connection line 1331, a second connection line 1332 and a third connection line 1333. One end of the first connection line 1331 is connected to the display layer 120, and the other end thereof is connected to the second connection line 1332, and the first connection line 1331 is perpendicular to the second connection line 1332, thereby forming a right-angled fold line design. One end of the second connection line 1332 is connected to the first connection line 1331, the other end thereof is connected to the third connection line 1333, and the second connection line 1332 and the display panel 100 are parallel to each other. One end of the third connection line 1333 is connected to the second connection line 1332, and the other end thereof is connected to the first chip 131, and the third connection line 1333 is also perpendicular to the second connection line 1332.
The second driving circuit 140 has a second chip 141 and a second routing area 142. The second chip 141 is disposed on the substrate layer 110 of the bonding region 102, and the second routing region 142 is located between the second chip 141 and the display layer 120. As shown in fig. 4, a plurality of second traces 143 are arranged inside the second traces 143, and two adjacent second traces 143 are parallel to each other. Each of the second traces 143 has a fourth connection line 1431, a fifth connection line 1432 and a sixth connection line 1433. One end of the fourth connection line 1431 is connected to the display layer 120, the other end thereof is connected to the fifth connection line 1432, and the fourth connection line 1431 is perpendicular to the fifth connection line 1432. One end of the fifth connection line 1432 is connected to the fourth connection line 1431, the other end thereof is connected to the sixth connection line 1433, and the fifth connection line 1432 and the display panel 100 are parallel to each other. One end of the sixth connection line 1433 is connected to the fifth connection line 1432, and the other end thereof is connected to the second chip 141, and the sixth connection line 1433 is also perpendicular to the fifth connection line 1432.
The first chip 131 and the second chip 141 are configured to control a display image of the display layer 120, and the first trace 133 and the second trace 143 are configured to transmit a driving signal.
As shown in fig. 5, the first trace 133 and the second trace 143 have a plurality of openings 150, and the openings 150 are uniformly spaced along the extending direction of the first trace 133 and the second trace 143. The opening 150 can reduce the stress received by the wire when the wire is bent, and prevent the metal wire from cracking and breaking failure. In the first trace 133 and the second trace 143, a line width of each trace is 2 to 20 micrometers, a distance between two adjacent traces is 10 to 20 micrometers, an aperture of the opening 150 is 1 to 15 micrometers, and a distance between two adjacent openings 150 is 1 to 15 micrometers.
As shown in fig. 2, the display panel 100 further has a first bending region 103 and a second bending region 104. The first bending region 103 has a first bending central line 105, the first bending region 103 bends around the first bending central line 105, and the first bending central line 105 is perpendicular to a shorter side of the display layer 120. The second bending region 104 has a second bending center line 106, the second bending region 104 bends around the second bending center line 106, and the second bending center line 106 is perpendicular to the first bending center line 105, so that the first bending region 103 and the second bending region 104 are perpendicularly crossed to form a cross-shaped bending region structure. The display panel 100 may be bent by the first bending region 103, or may be bent by the second bending region 104. Wherein, the bending angle of the first bending area 103 is 90-150 degrees.
The first bending region 103 is located between the first chip 131 and the second chip 141, and the substrate layer 110 has a bending opening 111 corresponding to the first bending region 103, the bending opening 111 is also located between the first chip 131 and the second chip 141, and an opening 150 of the bending opening 111 faces away from the display layer 120 toward the outside of the display panel 100. The bending opening 111 is one of a "U" shape, a "V" shape, and a "︺" shape, and a preferred embodiment of the present invention employs the "U" bending opening 111. The shortest distance between the groove wall of the bending opening 111 and the first driving circuit 130 or the second driving circuit 140 is 1000-5000 microns. The bending opening 111 can relieve stress generated when the substrate layer 110 of the binding region 102 is bent, and prevent the film layer from cracking and falling off.
As shown in fig. 3, a portion of the first routing area 132 of the first driving circuit 130 overlaps with the first bending area 103. In the overlapping region, the first connection line 1331 is parallel to the first bending center line 105 of the first bending region 103, and the second connection line 1332 is perpendicular to the first bending center line 105. When the display panel 100 is bent through the first bending region 103, the first connection line 1331 is subjected to a small bending stress because it is parallel to the first bending central line 105; the length of the second connection line 1332 falling into the first bending region 103 is smaller than that of the inclined routing line in the prior art, and the length of the bending stress is less, so that the bending stress is more favorably resisted.
According to the display panel 100 provided in the embodiment of the present invention, the bending opening 111 is provided, so as to relieve stress generated by the substrate layer 110 in the binding region 102 during bending, and prevent the substrate layer 110 from cracking and falling off during bending. Meanwhile, the first wire 133 adopts a right-angle fold line design, so that the first connection line 1331 is parallel to the first bending central line 105, and the second connection line 1332 is parallel to the display layer 120, when the display panel 100 is bent, the second connection line 1332 parallel to the display panel 100 can better resist stress generated during bending, thereby preventing the first wire 133 from being broken due to bending, improving the stability of the display panel 100, and prolonging the service life of the display device.
Example 2
In an embodiment of the present invention, as shown in fig. 1, the display device is a flexible AMOLED (Active-Matrix Organic Light-Emitting Diode) display device, which has a display panel 100, and the display panel 100 is used for providing a display screen for the display device. The display device can be any product or component with a display function, such as a mobile phone, a tablet computer, a notebook computer and the like.
As shown in fig. 6, the display panel 100 has a display area 101 and a binding area 102 connected to the display area 101. The display panel 100 further has a substrate layer 110, a display layer 120, a first driving circuit 130 and a second driving circuit 140.
The substrate layer 110 covers the display area 101 and the binding area 102, which is a flexible substrate layer 110. The display layer 120 is disposed on the substrate layer 110, corresponds to the display area 101, and is rectangular, and the binding area 102 is located on a side of the rectangular display layer 120 where the side length is longer. The display layer 120 is used for providing a display screen. The first driving circuit 130 and the second driving circuit 140 are disposed side by side on a longer side of the rectangular display layer 120, and are both connected to the display layer 120. The first driving circuit 130 and the second driving circuit 140 are bound on the substrate layer 110, and are folded together with the substrate layer 110 in the binding region 102 onto a surface of the substrate layer 110 in the display region 101 away from the display layer 120.
The first driving circuit 130 has a first chip 131 and a first wiring region 132. The first chip 131 is disposed on the substrate layer 110 of the bonding region 102, and the first routing region 132 is located between the first chip 131 and the display layer 120. As shown in fig. 7, a plurality of first traces 133 are disposed inside the first traces 133, and two adjacent first traces 133 are parallel to each other. Each of the first wires 133 has a first connection line 1331, a second connection line 1332 and a third connection line 1333. One end of the first connection line 1331 is connected to the display layer 120, and the other end thereof is connected to the second connection line 1332, and the first connection line 1331 is perpendicular to the second connection line 1332, thereby forming a right-angled folding line design. One end of the second connection line 1332 is connected to the first connection line 1331, the other end thereof is connected to the third connection line 1333, and the second connection line 1332 and the display panel 100 are parallel to each other. One end of the third connection line 1333 is connected to the second connection line 1332, and the other end thereof is connected to the first chip 131, and the third connection line 1333 is also perpendicular to the second connection line 1332.
The second driving circuit 140 has a second chip 141 and a second routing area 142. The second chip 141 is disposed on the substrate layer 110 of the bonding region 102, and the second routing region 142 is located between the second chip 141 and the display layer 120. As shown in fig. 8, the second trace 143 is designed to be an inclined trace, a plurality of second traces 143 are disposed inside the second trace 143, and each second trace 143 has a fourth connection line 1431 and a fifth connection line 1432. One end of the fourth connection line 1431 is connected to the display layer 120, and the other end thereof is connected to the fifth connection line 1432. One end of the fifth connection line 1432 is connected to the fourth connection line 1431, and the other end thereof is connected to the second chip 141, and an extension line of the fifth connection line 1432 is perpendicular to the display layer 120.
The first chip 131 and the second chip 141 are configured to control a display image of the display layer 120, and the first trace 133 and the second trace 143 are configured to transmit a driving signal.
As shown in fig. 5, the first trace 133 and the second trace 143 have a plurality of openings 150 thereon, and the openings 150 are uniformly spaced along the extending direction of the first trace 133 and the second trace 143. The opening 150 can reduce the stress received by the wire when the wire is bent, and prevent the metal wire from cracking and breaking failure. In the first trace 133 and the second trace 143, a line width of each trace is 2 to 20 micrometers, a distance between two adjacent traces is 10 to 20 micrometers, an aperture of the opening 150 is 1 to 15 micrometers, and a distance between two adjacent openings 150 is 1 to 15 micrometers.
As shown in fig. 6, the display panel 100 further has a first bending region 103 and a second bending region 104. The first bending region 103 has a first bending central line 105, the first bending region 103 bends around the first bending central line 105, and the first bending central line 105 is perpendicular to the longer side of the display layer 120. The second bending region 104 has a second bending center line 106, the second bending region 104 bends around the second bending center line 106, and the second bending center line 106 is perpendicular to the first bending center line 105, so that the first bending region 103 and the second bending region 104 are perpendicularly crossed to form a cross-shaped bending region structure. The display panel 100 may be bent by the first bending region 103, and may also be bent by the second bending region 104. Wherein the bending angle of the first bending region 103 is 90-150 °.
The first bending region 103 is located between the first chip 131 and the second chip 141, and the substrate layer 110 has a bending opening 111 corresponding to the first bending region 103, the bending opening 111 is also located between the first chip 131 and the second chip 141, and an opening 150 of the bending opening 111 faces away from the display layer 120 toward the outside of the display panel 100. The bending opening 111 is one of a "U" shape, a "V" shape, and a "︺" shape, and a preferred embodiment of the present invention employs the "U" bending opening 111. The shortest distance between the groove wall of the bending opening 111 and the first driving circuit 130 or the second driving circuit 140 is 1000-5000 microns. The bending opening 111 can relieve stress generated when the substrate layer 110 of the bonding region 102 is bent, and prevent the film layer from cracking and falling off.
As shown in fig. 7, a portion of the first routing area 132 of the first driving circuit 130 overlaps with the first bending area 103. In the overlapping region, the first connection line 1331 is parallel to the first bending central line 105 of the first bending region 103, and the second connection line 1332 is perpendicular to the first bending central line 105. When the display panel 100 is bent through the first bending region 103, the first connection line 1331 is subjected to a small bending stress because it is parallel to the first bending central line 105; the length of the second connection line 1332 falling into the first bending region 103 is smaller than that of the inclined routing line in the prior art, and the length of the bending stress is smaller, so that the bending stress is more favorably resisted.
According to the display panel 100 provided in the embodiment of the present invention, the bending opening 111 is provided, so as to relieve stress generated by the substrate layer 110 in the binding region 102 during bending, and prevent the substrate layer 110 from cracking and falling off during bending. Meanwhile, the first wire 133 adopts a right-angled fold line design, so that the first connection line 1331 is parallel to the first bending central line 105, and the second connection line 1332 is parallel to the display layer 120, when the display panel 100 is bent, the second connection line 1332 parallel to the display panel 100 can better resist stress generated during bending, prevent the first wire 133 from being broken due to bending, improve the stability of the display panel 100, and prolong the service life of the display device.
Although the invention herein has been described with reference to particular embodiments, it is to be understood that these embodiments are merely illustrative of the principles and applications of the present invention. It is therefore to be understood that numerous modifications may be made to the illustrative embodiments and that other arrangements may be devised without departing from the spirit and scope of the present invention as defined by the appended claims. It should be understood that features described in different dependent claims and herein may be combined in ways different from those described in the original claims. It is also to be understood that features described in connection with individual embodiments may be used in other described embodiments.
Claims (10)
1. A display panel is characterized by comprising a display area, a binding area connected with the display area and a first bending area arranged in the display area and the binding area;
the display panel includes:
the substrate layer covers the display area and the binding area and is provided with a bending opening, and the bending opening corresponds to the first bending area;
the display layer is arranged on the substrate layer in the display area;
the first driving circuit is arranged on the substrate layer in the binding region and connected with the display panel;
the first driving circuit is provided with a first wiring area, part of the first wiring area is superposed with the first bending area, and the first wiring area is positioned between the bending opening and the display panel;
a plurality of first wires are distributed in the first wire distribution area, and each first wire is provided with a first connecting wire and a second connecting wire;
the first connecting line is vertically connected to the second connecting line; the second connecting line is parallel to the display layer;
in the overlapping area of the first wiring area and the first bending area, the first connecting line is parallel to a first bending central line of the first bending area, and the second connecting line is perpendicular to the first bending central line.
2. The display panel according to claim 1, wherein the first driver circuit further comprises:
the first chip is arranged on the substrate layer;
the first wire further comprises a third connecting wire, one end of the third connecting wire is connected with the second connecting wire, and the other end of the third connecting wire is connected with the first chip.
3. The display panel according to claim 1, further comprising:
the second driving circuit is arranged on the substrate layer in the binding region and is positioned on the same side of the display layer with the first driving circuit;
the second drive circuit includes:
the second chip is arranged on the substrate layer;
and a plurality of second wires are distributed in the second wire routing area, and the second wires are connected with the second chip and the display layer.
4. The display panel of claim 3,
each second wire is provided with a fourth connecting line and a fifth connecting line;
one end of the fourth connecting line is connected with the display layer, and the other end of the fourth connecting line is connected with the fifth connecting line;
one end of the fifth connecting line is connected with the fourth connecting line, and the other end of the fifth connecting line is directly or indirectly connected with the second chip.
5. The display panel according to claim 4, wherein when the fifth connecting line is indirectly connected to the second chip, the second trace further has a sixth connecting line, one end of the sixth connecting line is connected to the fifth connecting line, and the other end of the sixth connecting line is connected to the second chip;
the fifth connecting line is parallel to the display layer, and the fourth connecting line is perpendicular to the fifth connecting line.
6. The display panel of claim 1, wherein two adjacent first traces are parallel to each other.
7. The display panel according to claim 3, wherein each of the first traces and/or the second traces has a plurality of openings, and the openings are uniformly arranged on the first traces and/or the second traces.
8. The display panel according to claim 7, wherein the line width of the first trace and/or the second trace is 2-20 μm; the aperture of the opening is 1-15 microns; the distance between two adjacent openings is 1-15 microns.
9. The display panel of claim 1, further comprising a second bending region perpendicular to the first bending region, and combined with the first bending region to form a cross-shaped bending region structure.
10. A display device characterized by comprising the display panel according to any one of claims 1 to 9.
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| CN202010378872.7A CN111584557B (en) | 2020-05-07 | 2020-05-07 | Display panel and display device |
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| CN202010378872.7A CN111584557B (en) | 2020-05-07 | 2020-05-07 | Display panel and display device |
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| CN111584557B true CN111584557B (en) | 2022-09-27 |
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| KR101904969B1 (en) * | 2016-07-29 | 2018-10-10 | 삼성디스플레이 주식회사 | Display device |
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