TWI639261B - Dye-sensitized photovoltaic cell, module, and manufacturing method thereof - Google Patents

Abstract

The present invention discloses a dye-sensitized photovoltaic cell, a module, and a method of fabricating the same, comprising: providing a working electrode, and providing a first trench on the working electrode to define a first region and a second region, the first region and the second region Providing at least one semiconductor layer; providing a counter electrode, and providing a second trench on the counter electrode to define a third region and a fourth region, wherein at least one catalytic layer is respectively disposed and respectively provided with at least one conductive line; The encapsulation layer is in the first region and the second region, and surrounds at least one of the semiconductor layer and the at least one semiconductor layer of the second region; filling the region around the encapsulation layer; filling the working electrode through the encapsulation layer; a counter electrode, the first region is opposite to the third region and the second region is opposite to the fourth region; and the first conductive layer and the second trench are electrically connected to the working conductive layer of the second region by the series conductive element The conductive line of the three areas.

Description

Dye-sensitized photovoltaic type battery, module and manufacturing method thereof

The present invention relates to a dye-sensitized photovoltaic cell, and more particularly to a dye-sensitized photovoltaic cell and a module thereof which are manufactured by a specific method.

Dye-Sensitized Photovoltaic Cell, also known as Dye-Sensitized Solar Cell (DSSC), is a new type of solar cell with raw material and manufacturing cost compared to traditional tantalum solar cells. It is much cheaper, so it has caused considerable concern in recent years. As the power supply requirements of devices such as IoT sensors and mobile devices gradually emerge, the application of DSSCs with excellent power conversion efficiency under low light sources will be more important.

In recent years, due to its light weight, flexibility, and wide range of applications, the soft DSSC has attracted the attention of battery-free IoT sensor users. Since the cell voltage of the DSSC is typically greater than or equal to 0.4V and less than or equal to 0.6V, if the cells are to be connected in series to boost the voltage, it is conventional to serially connect several independent flexible DSSC cells with wires. However, since each of the independent flexible DSSC units has its own package side, if the unit is connected in series by this method, the invalid area of the generated module will be very large.

Another method of connecting a flexible DSSC component is to place the working electrode on one side and The opposite electrode on the other side is connected in series by piercing and filling the hole with a conductive material. The hole runs through the entire DSSC unit and is protected by protective barriers on both sides to prevent electrolyte leakage and corrosion of the conductive material. If the protective barrier or the protective barrier is not damaged, the DSSC may be ineffective.

A disadvantage of the method of connecting in series through the perforations is that each DSSC unit needs to be drilled separately before filling the conductive material, and this step is time consuming and increases the manufacturing cost of the DSSC unit. In addition, in order to prevent the conductive materials used in series on each side from being corroded by the electrolyte, a protective barrier is required to protect the conductive material, and the coating and manufacturing process of the protective barrier also increases the cost of the DSSC unit.

In view of the above prior art problems, it is an object of the present invention to provide a method of fabricating a dye-sensitized photovoltaic cell to serially and package a DSSC cell. That is to say, the DSSC unit serial connection mode is changed by the pattern and shape design of the working electrode and the counter electrode substrate. Further, according to the manufacturing method of the present invention, it is not necessary to drill and fill the conductive materials for serial connection in each DSSC unit, and the coating process of the protective barrier is also eliminated, and the method of series and packaging can be large. The amplitude reduces the production time of the DSSC components and can further reduce the manufacturing cost of the DSSC. Further, according to the manufacturing method of the present invention, since the series connection is completed before the battery is packaged, the DSSC unit according to the present invention has a compact and thin structure, which greatly reduces the ineffective area due to the series connection of the external wires.

According to an aspect of the present invention, a method for fabricating a dye-sensitized photovoltaic cell can be provided. The dye-sensitized photovoltaic cell can include a working electrode and a counter electrode, and the working electrode can include a working substrate, a working conductive layer, and at least one semiconductor layer, and The counter electrode may include a counter substrate, a counter conductive layer, at least one catalytic layer, and at least one conductive line. The method can include the steps of: providing a working electrode and working on the working electrode a first trench is defined to define a first region and a second region, wherein the first region and the second region are respectively provided with at least one semiconductor layer; a counter electrode is provided, and a second trench is disposed on the counter electrode to define a third region And a fourth region, wherein the third region and the fourth region are respectively provided with at least one catalytic layer, and the third region and the fourth region are respectively provided with at least one conductive line; and the encapsulation layer is disposed on the first region and the second region of the working electrode And the encapsulation layer respectively surrounds at least one of the semiconductor layer and the at least one semiconductor layer of the second region; the electrolyte is filled in the region surrounding the encapsulation layer; and the working electrode and the counter electrode are connected through the encapsulation layer, wherein the first region is The working conductive layer of the second region and the conductive line of the third region are electrically connected to the third region with respect to the third region and the second region relative to the fourth region; and through the first trench or the second trench.

Preferably, after the filling of the electrolyte, the foregoing manufacturing method may further comprise placing the working electrode in a vacuum environment to remove air bubbles in the electrolyte.

Preferably, the foregoing manufacturing method may further comprise slitting the dye-sensitized photovoltaic cell and removing the ineffective region to form a dye-sensitized photovoltaic cell.

Preferably, the foregoing manufacturing method may further comprise sealing the packaged dye-sensitized photovoltaic type battery unit with an outer packaging film.

Preferably, the outer package film has a Water Vapor Transmission Rate (WVTR) of less than or equal to 1 g/m ² ‧day and greater than or equal to 1×10 ^-6 g/m ² ‧day, and/or The Oxygen Transmission Rate (OTR) of the encapsulating film is less than or equal to 1 cc/m ² ‧day and greater than or equal to 1×10 ^-6 cc/m ² ‧day

Preferably, at least one of the working conductive layer and the pair of conductive layers may be made of a transparent conductive material.

Preferably, the transparent conductive material may include indium tin oxide (ITO), fluorine-doped tin oxide (FTO), graphene, ZnO-Ca ₂ O ₃ , ZnO-Al ₂ O ₃ , SnO ₂ -Sb ₂ O ₃ or Its combination.

Preferably, one of the working conductive layer and the pair of conductive layers may be made of an opaque conductive material.

Preferably, the opaque conductive material may comprise a titanium plate, a stainless steel plate, a nickel-plated iron plate, a nickel-plated titanium plate, a titanium-coated iron plate, a titanium-plated steel plate or a stainless steel plastic composite plate.

Preferably, the conductive wire may be formed by printing an ink containing conductive particles on the counter electrode.

Preferably, the foregoing manufacturing method further includes providing a conductive line protective glue to cover the conductive lines on the opposite electrode, and the conductive line protective glue may be a polymer material resistant to electrolyte corrosion.

Preferably, the encapsulation layer may comprise an encapsulation material that is resistant to electrolyte corrosion.

Preferably, the conductive wire protective adhesive and the encapsulating layer respectively comprise a hot melt encapsulating film, an ultraviolet curable adhesive, a thermosetting encapsulant or a hot melt encapsulant, respectively.

Preferably, the encapsulation layer can surround but not contact the semiconductor layer.

Preferably, the series conductive elements may comprise silver, carbon, copper, graphene or a mixture of the above materials.

Preferably, the catalytic layer may comprise Pt, Ru, Pd, Rh, Ir, Os, WO ₃ , TiO ₂ , graphite or a mixture thereof.

Preferably, the electrolyte may be a liquid electrolyte, an ionic liquid electrolyte or a liquid polymer electrolyte.

According to another object of the present invention, a dye-sensitized photovoltaic type battery is proposed which can be manufactured by the aforementioned manufacturing method.

According to still another object of the present invention, a dye-sensitized photovoltaic cell is disclosed which can be formed by connecting a plurality of the aforementioned dye-sensitized photovoltaic cells in series or in parallel.

By implementing the present invention, the fabrication time of the DSSC component can be greatly reduced, and the manufacturing cost of the DSSC can be further reduced, so that the DSSC unit has a compact and thin structure.

The above and other objects, features and advantages of the present invention will become apparent from

1‧‧‧Dye-sensitized photovoltaic cells

100‧‧‧ opposite electrode

110‧‧‧on conductive layer

120‧‧‧catalytic layer

130‧‧‧Flexible wire

140‧‧‧Flexible protective glue

150‧‧‧Encapsulation layer

160‧‧‧ on the substrate

200‧‧‧Working electrode

210‧‧‧Working conductive layer

220‧‧‧ electrolyte

230‧‧‧Semiconductor layer

250‧‧‧Working substrate

300‧‧‧First trench

300’‧‧‧second trench

400‧‧‧Series of conductive elements

500‧‧‧outer encapsulation film

600‧‧‧Outer packaging adhesive

700‧‧‧Dye-sensitized photovoltaic cells

L‧‧‧Light

S1‧‧‧ first area

S2‧‧‧Second area

S3‧‧‧ third area

S4‧‧‧ fourth area

The above-described and/or other features and advantages of the present invention will become apparent to those skilled in the <RTIgt; A cross-sectional view of a dye-sensitized photovoltaic cell.

2A to 2C are schematic views showing a method of manufacturing a dye-sensitized photovoltaic cell according to an embodiment of the present invention.

Figure 3 is a schematic illustration of a dye-sensitized photovoltaic cell after cutting according to an embodiment of the present invention.

Exemplary embodiments of the present invention will be described more fully hereinafter with reference to the accompanying drawings; however, they may be present in different forms and should not be construed as being limited to the embodiments set forth herein. Rather, the embodiments are provided herein to make the disclosure more complete and complete, and to fully convey the scope of the invention to those skilled in the art.

In the following descriptions, "upper", "lower", "left", and "right" are used to describe the relative position of the component, not the absolute position of the component. In the schema, the dimensions of each layer and region may be Zoom in for the purpose of clear explanation. It is also understood that when a layer or component is referred to as being "on" another layer or substrate, it may be directly over the other layer or substrate, or an intermediate layer may be present. In addition, it should also be understood that when a layer is referred to as being "between" two layers, it may be a single layer between the two layers, or one or more intermediate layers may be present. The same element symbols in all figures represent the same elements.

The term "dye-sensitized photovoltaic cell, module, and method of manufacturing the same" as used in the specification refers to at least the process of completing the encapsulation of the working electrode, the counter electrode, the assembly, and the series connection of the dye-sensitized photovoltaic cell. More specifically, the term "dye-sensitized photovoltaic cell, module, and method of manufacturing the same" as used in this specification means at least a process of assembling a working electrode, a counter electrode, a series connection, and then using an outer package film to complete the encapsulation.

A dye-sensitized photovoltaic cell and a method of fabricating the same according to an exemplary embodiment of the present invention will now be described with reference to FIGS. 1 and 2A to 2C. 1 is a cross-sectional view of a dye-sensitized photovoltaic cell according to an exemplary embodiment, and a schematic view of a method of manufacturing a dye-sensitized photovoltaic cell shown in FIGS. 2A to 2C.

Referring to FIG. 1, there is shown a cross-sectional view of a dye-sensitized photovoltaic cell 1 according to an embodiment of the present invention. The dye-sensitized photovoltaic cell 1 can be flexible, that is, it can be a soft dye-sensitized photovoltaic cell, but is not limited thereto. The dye-sensitized photovoltaic cell 1 includes a counter electrode 100, a working electrode 200, a series-connected conductive element 400, an outer package film 500, and an outer encapsulant 600. The counter electrode 100 and the working electrode 200 are disposed opposite to each other and are connected by the encapsulating layer 150 to form a closed space inside the dye-sensitized photovoltaic cell 1 to accommodate the electrolyte 220.

The working electrode 200 includes a working conductive layer 210, a semiconductor layer 230, and a working substrate 250. The working conductive layer 210 may be disposed on either or both sides of the working substrate 250, and the semiconductor layer 230 is disposed on the working layer Above the working conductive layer 210.

The counter electrode 100 includes a counter substrate 160, a counter conductive layer 110, a catalytic layer 120, and a conductive line 130. In an embodiment, the conductive line protector 140 may be disposed on the conductive line 130 to cover the conductive line 130 and prevent the electrolyte 220 from eroding the conductive line 130. The catalytic layer 120 and the conductive line 130 are sequentially disposed on one surface of the conductive layer 110, that is, the semiconductor layer 230 is opposed to the catalytic layer 120 and the conductive line 130 via the electrolyte 220, and the conductive line protective colloid 140 covers the conductive line 130. The conductive line 130 is prevented from contacting the electrolyte 220.

In one embodiment, the working electrode 200 including the working substrate 250, the working conductive layer 210, and at least one of the counter electrodes 100 including the counter substrate 160 and the pair of conductive layers 110 are made of a transparent material and a transparent conductive material, so that The light L passes through to achieve the power generation function. That is to say, in one embodiment, the working electrode is made of a transparent material, and the light can pass through the working electrode to reach the semiconductor layer to generate electricity. In another embodiment, the counter electrode is made of a transparent material, and light can pass through the counter electrode to reach the semiconductor layer for power generation. In still another embodiment, the working electrode and the counter electrode are made of a transparent material, and the light can simultaneously pass through the working electrode and the counter electrode to reach the semiconductor layer to generate electricity.

In the embodiment shown in FIG. 1, the working conductive layer 210 may be made of a soft transparent conductive material, and the soft transparent conductive material used may include indium tin oxide (ITO), fluorine-doped tin oxide (FTO), graphene. ZnO-Ga ₂ O ₃ , ZnO-Al ₂ O ₃ , SnO ₂ -Sb ₂ O ₃ or a combination of the above may be used, and other conventional transparent conductive materials may be used, and are not limited by the examples cited. In another embodiment, one of the working conductive layer 210 and the pair of conductive layers 110 may be made of an opaque conductive material, which may include a flexible opaque conductive material. In a preferred embodiment, the opaque conductive material may include a titanium plate, a stainless steel plate, a nickel-plated iron plate, a nickel-plated titanium plate, a ferritic iron plate, a titanium-plated steel plate, and a stainless steel plastic composite plate, and other conventional materials may be used. Conductive materials that withstand electrolyte corrosion are not limited by the examples cited.

The semiconductor layer 230 may be a nanoporous film. In an embodiment, the material of the semiconductor layer 230 may include Ti, Nb, Zn, Sn, Ta, W, Ni, Fe, Cr, V, Pm, Zr, Sr, In, Ir, La, Mo, Mg, Al. a metal oxide of a metal such as Y, Sc, Sm or Ga, or a metal oxide of a mixture of the above metals. It is to be noted that the semiconductor layer 230 can adsorb the photosensitive dye, and the semiconductor layer 230 that adsorbs the photosensitive dye can release electrons after absorbing the light L to achieve a power generation effect. In one embodiment, the thickness of the semiconductor layer 230 is preferably greater than or equal to 0.01 micrometers and less than or equal to 1000 micrometers (μm), greater than or equal to 0.1 micrometers, and less than or equal to 500 micrometers or greater than or equal to 1 micrometers and less than or equal to 100 microns.

In an embodiment, the material of the catalytic layer 120 may include Pt, Ru, Pd, Rh, Ir, Os, WO ₃ , TiO ₂ , graphite, or a mixture of the above materials.

The material of the encapsulation layer 150 may be a hot melt encapsulation film, a UV curable adhesive, a thermosetting encapsulant, a hot melt encapsulant or other encapsulating material having strong anti-electrolyte corrosion properties. The thickness of the encapsulation layer 150 is preferably greater than or equal to 0.1 micron and less than or equal to 1000 micrometers, greater than or equal to 0.1 micrometers, and less than or equal to 500 micrometers or greater than or equal to 1 micrometer and less than or equal to 100 micrometers.

The material of the conductive line 130 may be silver, carbon, copper, graphene or other conductive material having electrical conductivity.

The material of the conductive adhesive 140 can be selected from a hot melt encapsulant film, a UV curable adhesive, a thermosetting encapsulant, a hot melt encapsulant or other encapsulating material having strong anti-electrolyte corrosion properties. The thickness of the conductive protective layer 140 is preferably greater than or equal to 0.1 micrometers and less than or equal to 1000 micrometers, greater than or equal to 0.1 micrometers, and less than or equal to 500 micrometers or greater than or equal to 1 micrometer and less than or equal to 100 micrometers.

The material of the series conductive element 400 may be silver, carbon, copper, graphene, tin or other conductive material having electrical conductivity.

The electrolyte 220 may be one of a liquid electrolyte, an ionic liquid electrolyte, and a liquid polymer electrolyte. Wherein, the liquid electrolyte may comprise an organic solvent such as an ester and a nitrile and an iodide additive; the ionic liquid electrolyte may comprise an ionic liquid such as a PMII and an iodide additive; and the liquid polymer electrolyte may comprise, for example, a polyethylene glycol added to the pentane An acetonitrile solution and an iodide additive for the aldehyde.

The substrate 160 and the working substrate 250 may include materials such as a polymer film, a metal thin plate, or a ceramic plate, and other materials that can withstand corrosion of the electrolyte may be used. Among them, the polymer film includes, but is not limited to, polyethylene terephthalate (PET) or polyethylene naphthalate (PEN); and the metal sheet includes, but not limited to, a titanium plate or a stainless steel plate.

The material of the outer encapsulating film 500 has a Water Vapor Transmission Rate (WVTR) of less than or equal to 1 g/m ² ‧day and greater than or equal to 1×10 ^-6 g/m ² ‧day, and/or oxygen transmission rate (Oxygen Transmission Rate, OTR) is less than or equal to 1 cc/m ² ‧ day and greater than or equal to 1 × 10 ^-6 cc / m ² ‧ day

The material of the outer encapsulant 600 can be selected from a hot melt encapsulation film, a UV curable adhesive, a thermosetting encapsulant, a hot melt encapsulant or other encapsulating material having high water resistance and gas barrier capability.

It should be noted that the structure of the dye-sensitized photovoltaic cell shown in FIG. 1 is merely exemplary, and the specific structure thereof is not limited to the drawings. For example, a metal gate and a protective layer can be additionally provided on the dye-sensitized photovoltaic cell.

In one embodiment, the dye-sensitized photovoltaic cell described in this specification can be fabricated in the following steps. The method includes the following steps: providing a working electrode, and providing a first trench on the working electrode to define a first region and a second region, wherein the first region and the second region are respectively provided with at least one semiconductor layer; A second trench is disposed on the counter electrode to define a third region and a fourth region, wherein the third region and the fourth region are respectively provided with at least one catalytic layer and the third region and the fourth region are respectively provided At least one conductive line; an encapsulation layer is disposed on the first region and the second region of the working electrode, and the encapsulation layer respectively surrounds at least one of the semiconductor layer and the at least one semiconductor layer of the second region; and the region surrounding the encapsulation layer Filling the electrolyte; connecting the working electrode and the counter electrode through the encapsulation layer, wherein the first region is opposite to the third region and the second region is opposite to the fourth region; and the first trench or the second trench is transmitted through the series to conduct electricity The component electrically connects the conductive layer of the second region to the conductive line of the third region.

Referring to FIGS. 2A-2C, a method of fabricating a dye-sensitized photovoltaic cell according to an embodiment of the present invention is illustrated. This method can be used to package and manufacture the dye-sensitized photovoltaic cell 1 of Fig. 1, but is not limited thereto. The dye-sensitized photovoltaic cell manufacturing method described in the present invention can be used to connect and package various dye-sensitized photovoltaic cells of different structures.

First, referring to FIGS. 1 and 2A, a working electrode 200 including a working substrate 250, a working conductive layer 210, and a semiconductor layer 230 is provided. An L-shaped first trench 300 may be disposed on the working electrode 200, and the first region S1 and the second region S2 may be defined according to the first trench 300, and the semiconductor layer 230 is respectively disposed in the first region S1 and the second region Area S2. It is to be noted that the semiconductor layers may be one, two, three or several, and the shape thereof is not limited. In the embodiment of FIG. 2A, the semiconductor layer is exemplified by three rectangular parallel arrangements, and is not limited thereto.

Next, referring to FIGS. 1 and 2B , a counter electrode 100 is provided, which includes a counter substrate 160 , a counter conductive layer 110 , a catalytic layer 120 , a conductive line 130 , and a conductive line protective adhesive 140 . A 1-shaped second trench 300' is disposed on the counter electrode 100, and a third region S3 and a fourth region S4 are defined by the second trench 300'. In the embodiment of FIG. 2B, the catalytic layer is fully coated on the conductive layer for illustrative purposes, and is not limited thereto.

Referring to FIG. 1 and FIG. 2A, a hermetic encapsulation layer 150 is disposed on the working conductive layer 210 of the first region S1 and the second region S2, so that the encapsulation layer 150 surrounds the outside of the semiconductor layer 230 to form a package. Closed space. The electrolyte 220 is filled inside the encapsulation layer 150, that is, the semiconductor layer 230, or half Above the conductive layer 230 and the working conductive layer 210, depending on whether the encapsulation layer 150 contacts the semiconductor layer 230. In this embodiment, the encapsulation layer 150 surrounds but does not contact the semiconductor layer 230. Therefore, the electrolyte 220 contacts the working conductive layer 210 in addition to the semiconductor layer 230.

Further, referring to FIGS. 1 and 2C, the counter electrode 100 is disposed on the encapsulation layer 150 such that the first region S1 is transmissive with respect to the third region S3 and the second region S2 with respect to the fourth region S4. Layer 150 connects working electrode 200 and counter electrode 100. That is, the working electrode 200 and the counter electrode 100 are bonded by the encapsulation layer 150, and the encapsulation layer 150 is cured.

Finally, using the first trench 300 or the second trench 300 ′ as a working space, the second region S2 of the working electrode 200 and the third region S3 of the counter electrode 100 are connected by the series conductive element 400 to electrically connect the second The working conductive layer 210 of the region S2 and the conductive line 130 of the third region S3 are connected in series.

In one embodiment, the completed tandem dye-sensitized photovoltaic cell can be slit along the dashed line and the dead zone removed as shown in FIG. 2C. In another embodiment, the dye-sensitized photovoltaic cell after slitting can further utilize the outer package film 500 and the outer package glue 600 to externally package the dye-sensitized photovoltaic battery that has been cut, that is, complete the first 3 shows a dye-sensitized photovoltaic cell unit 700 having a series structure.

In a preferred embodiment, before the working electrode 200 and the counter electrode 100 are connected, the working electrode 200 filled with the electrolyte 220 can be placed under a vacuum environment to remove bubbles in the electrolyte 220 and work under vacuum. The electrode 200 is bonded to the counter electrode 100 and the encapsulation layer 150 is cured to remove and avoid air bubbles generated by the encapsulation process.

In addition, in another preferred embodiment, a plurality of the above dye-sensitized photovoltaic cells can be connected in series or in parallel to form a dye-sensitized photovoltaic cell module to provide higher voltage or capacitance. the amount.

Although the encapsulation method of the above embodiment is performed from the working electrode, it is not limited thereto. In other embodiments of the invention, the working electrode and the counter electrode may be exchanged, that is, the package is first started from the counter electrode. For example, a counter electrode (including a pair of conductive layers) is first provided. Then, an encapsulation layer is disposed on the conductive layer, and the encapsulation layer defines a space on the conductive layer. Then, the working electrode is disposed on the encapsulation layer, and the encapsulation layer is connected to the counter electrode and the working electrode.

Exemplary embodiments of the present invention have been disclosed herein, although specific terms are used; however, they should be construed in a generic and descriptive sense, and without limitation. It will be apparent to those skilled in the art that various changes in the form and details may be made without departing from the spirit and scope of the invention as set forth in the appended claims.

Claims (19)

A method for manufacturing a dye-sensitized photovoltaic cell, the dye-sensitized photovoltaic cell comprising a working electrode and a pair of electrodes, the working electrode comprising a working substrate, a working conductive layer and at least one semiconductor layer, the pair of electrodes comprising For the substrate, the pair of conductive layers, the at least one catalytic layer, and the at least one conductive line, the method includes: providing the working electrode, and providing a first trench on the working electrode to define a first region and a second region The first region and the second region are respectively provided with the at least one semiconductor layer; the pair of electrodes are provided, and a second trench is disposed on the pair of electrodes to define a third region and a fourth region, wherein The third region and the fourth region are respectively provided with the at least one catalytic layer, and the third region and the fourth region are respectively provided with the at least one conductive line; an encapsulation layer is disposed on the first region of the working electrode and The second region, and the encapsulation layer respectively surrounds the at least one semiconductor layer of the first region and the at least one semiconductor layer of the second region; filling an area around the region surrounded by the encapsulation layer Connecting the working electrode and the pair of electrodes through the encapsulation layer, wherein the first region is opposite to the third region and the second region is opposite to the fourth region; and the first trench or the second region is transmitted through The trench electrically connects the working conductive layer of the second region and the conductive line of the third region with a series of conductive elements. The manufacturing method according to claim 1, wherein after filling the electrolyte, the working electrode is connected to the pair of electrodes in a vacuum environment, and the encapsulating layer is cured and the electrolyte is removed. Bubbles in. The manufacturing method according to claim 1, further comprising slitting the dye-sensitized photovoltaic cell and removing an ineffective region to form a dye-sensitized photovoltaic cell. The manufacturing method as described in claim 3, further comprising using an outer encapsulating film The dye-sensitized photovoltaic cell unit is encapsulated. The manufacturing method of claim 4, wherein the outer packaging film has a Water Vapor Transmission Rate (WVTR) of less than or equal to 1 g/m ² ‧day and greater than or equal to 1×10 ^-6 g /m ² ‧day, and/or the outer package film has an Oxygen Transmission Rate (OTR) of less than or equal to 1 cc/m ² ‧day and greater than or equal to 1×10 ^-6 cc/m ² ‧day The manufacturing method of claim 1, wherein at least one of the working conductive layer and the pair of conductive layers is made of a transparent conductive material. The manufacturing method according to claim 6, wherein the transparent conductive material comprises indium tin oxide (ITO), fluorine-doped tin oxide (FTO), graphene, ZnO-Ga ₂ O ₃ , ZnO-Al ₂ O. ₃ , SnO ₂ -Sb ₂ O ₃ or a combination thereof. The manufacturing method of claim 1, wherein the working conductive layer and one of the pair of conductive layers are made of an opaque conductive material. The manufacturing method according to claim 8, wherein the opaque conductive material comprises a titanium plate, a stainless steel plate, a nickel-plated iron plate, a nickel-plated titanium plate, a ferrotitanium plate, a titanium-plated steel plate or a stainless steel plastic composite plate. The manufacturing method according to claim 1, wherein the conductive wire is formed by printing an ink containing one of the conductive particles on the pair of electrodes. The manufacturing method of claim 1, further comprising providing a conductive line protective glue to cover the conductive line on the pair of electrodes, the conductive line protection glue comprising a polymer material resistant to corrosion of the electrolyte. The manufacturing method of claim 1, wherein the encapsulating layer comprises an encapsulating material resistant to corrosion of the electrolyte. The manufacturing method according to claim 11 or 12, wherein the conductive line protective glue and the encapsulating layer respectively comprise a hot melt encapsulating film, a UV curable adhesive, a thermosetting encapsulant or a hot melt encapsulant, respectively. The manufacturing method of claim 1, wherein the encapsulating layer surrounds but does not contact the semiconductor layer. The manufacturing method of claim 1, wherein the series conductive element comprises silver, carbon, copper, graphene or a mixture thereof. The manufacturing method according to claim 1, wherein the catalytic layer comprises Pt, Ru, Pd, Rh, Ir, Os, WO ₃ , TiO ₂ , graphite or a mixture thereof. The manufacturing method according to claim 1, wherein the electrolyte is a liquid electrolyte, an ionic liquid electrolyte or a liquid polymer electrolyte. A dye-sensitized photovoltaic cell manufactured by the manufacturing method of any one of claims 1 to 17. A dye-sensitized photovoltaic type battery module is obtained by connecting a plurality of dye-sensitized photovoltaic cells according to Item 18 of the patent application scope in series or in parallel.