TWI639059B - Drawing apparatus, substrate processing system and drawing method - Google Patents

Abstract

In the substrate processing system of the present invention, a plurality of alignment marks on each drawing area of the substrate are photographed in the drawing device by controlling the imaging unit and the moving mechanism. The good or bad acquisition unit determines whether the position or deformation of each drawing area is good or bad based on the photographing result of the imaging unit. Furthermore, by controlling the drawing head and the moving mechanism, the circuit pattern is drawn only in the normal drawing area determined to be good. In this way, in the drawing device, it is determined whether each of the plurality of drawing regions on the substrate is good or not, and the determination result is used in the drawing of the circuit pattern immediately thereafter, thereby shortening the time required for the circuit pattern of the substrate. The time required to paint.

Description

Drawing device, substrate processing system, and drawing method

The present invention relates to a drawing device and a drawing method for drawing a circuit pattern by irradiating a substrate with light, and the present invention also relates to a substrate processing system including the drawing device.

Conventionally, when manufacturing a multi-layer substrate in which a multi-face unit substrate (ie, a component) is provided on a working substrate like a packaging substrate, marks or marks are marked on the components found to be defective during the intermediate inspection so that the defects can be identified in subsequent steps component.

For example, Japanese Patent Laid-Open No. 2007-48868 (Document 1) discloses a pattern manufacturing system in which a circuit pattern is formed on a plurality of components on a work substrate. The pattern manufacturing system includes: a direct-exposure type exposure device that exposes a pattern on a resist material laminated on a substrate; a developing device that develops the exposed resist to form a resist pattern; an etching device To form a circuit pattern by etching a copper foil on a substrate on which a resist pattern is formed; and an image recognition device that uses a charge-coupled device (CCD, Charge-coupled Device) camera to photograph the circuit pattern formed by etching , And determine whether the circuit pattern is good or not. The pattern manufacturing system is used for manufacturing a laminated substrate in which a working substrate for external decoration is laminated on a working substrate for internal decoration. In the pattern manufacturing system, the defective information indicating the position of the defective component judged to be defective by the image recognition device is guaranteed during the manufacture of the working substrate for interior decoration. Save. Furthermore, when manufacturing a working substrate for external decoration, in the exposure device, according to the defective information, a component that indicates a defect is exposed on a component of the working substrate for external decoration corresponding to the defective component of the working substrate for internal decoration.

In addition, like the exposure device of Document 1, in a direct drawing type pattern drawing device that scans modulated light and draws a pattern, the pattern (so-called substrate) that has been formed on the substrate or each component on the substrate is deformed. In this case, the pattern is corrected in conjunction with the deformation when drawing on the part where the deformation occurs. However, if the deformation of a part is larger than a certain degree, even if the pattern is corrected and drawn, the part is judged to be a defective part that cannot be used in a product after inspection by the inspection device. That is, the pattern drawing device renders the drawing of defective parts useless, and the time required for drawing becomes longer.

The invention is suitable for a drawing device for drawing a circuit pattern by irradiating a substrate with light, and the purpose thereof is to shorten the time required for drawing a circuit pattern.

A drawing device according to the present invention includes: a substrate holding unit that holds a substrate having a plurality of drawing areas set thereon; and an imaging unit that shoots a plurality of alignment marks set in each drawing area; The good or bad acquisition unit, for each of the drawing regions, obtains the positions of the plurality of alignment marks on the substrate based on the photographing results of the imaging unit, and determines the positions based on the positions of the plurality of alignment marks. The position of the drawing area or the deformation is good; the drawing head irradiates the substrate with modulated light; and the moving mechanism moves the substrate and the substrate holding portion relative to the drawing head together to move the substrate from The irradiated area of the light of the drawing head is scanned on the substrate; and the drawing control section controls the drawing head and the moving mechanism, thereby only using the good or bad acquisition section. The drawing area determined to be good, that is, the normal drawing area, draws the circuit pattern. According to this drawing device, the time required for drawing a circuit pattern can be shortened.

Another drawing device of the present invention includes: a substrate holding unit that holds a substrate having a plurality of drawing regions set thereon; an imaging unit that shoots a plurality of alignment marks set in each drawing region; a good or bad acquisition unit , Which is detected as a defective drawing area in the previous step, that is, the alignment mark of the defective drawing area or its surrounding pattern is changed, and according to the photographing result of the imaging section, the quality of each drawing area is obtained; the drawing head To irradiate the substrate with modulated light; a moving mechanism that moves the substrate and the substrate holding portion relative to the drawing head together to move the irradiation area of the light from the drawing head on the substrate And a drawing control section that controls the drawing head and the moving mechanism, thereby drawing the circuit pattern only in the normal drawing area, which is the normal drawing area that is confirmed to be good in the good or bad acquisition section. The drawing device can also shorten the time required for drawing a circuit pattern.

In a preferred embodiment of the present invention, the drawing control unit controls the drawing head and the moving mechanism, and thereby draws a defective drawing area designated as a defective drawing area, which is a defective drawing area, in the good or bad acquisition unit to draw. A defective display pattern indicating the meaning of defective.

More preferably, the defective category of the defective drawing area is also specified in the defective obtaining section, and the defective display pattern includes information indicating the defective category.

In addition, the defective display pattern is arranged in a plurality of alignment marks in the defective drawing area, and in the apparatus of the subsequent step, the first alignment mark that is first photographed or the periphery of the first alignment mark is photographed.

Or, the above-mentioned defective display pattern is a whole-surface coating pattern or a mesh shadow pattern of a predetermined area.

In another preferred embodiment of the present invention, a defective information output unit is further provided, and the defective information output unit outputs a defective drawing region, which is a defective drawing region, which is specified as a defective in the good or bad acquisition unit, on the substrate. Location information.

The present invention is also suitable for a substrate processing system for processing a substrate. The substrate processing system is provided with: the drawing device; a developing device that performs development processing on the substrate on which the circuit pattern is drawn in the normal drawing area by the drawing device; and an etching device that applies the development device. The substrate subjected to the development process is subjected to an etching process; and a processing device that performs predetermined processing only on the normal drawing region of the substrate after the etching process among the plurality of drawing regions of the substrate.

The present invention is also suitable for a method of drawing a circuit pattern by irradiating light to a substrate.

The above-mentioned objects and other objects, features, aspects, and advantages will be made clear by the following detailed description of the present invention with reference to the accompanying drawings.

1‧‧‧ depicting device

3‧‧‧Processing device

9‧‧‧ substrate

10‧‧‧ Substrate Processing System

12‧‧‧ substrate holding section

13‧‧‧ Camera Department

14‧‧‧ depicting the head

15‧‧‧ mobile agency

16‧‧‧Control Department

21‧‧‧Developing device

22‧‧‧ Etching device

80‧‧‧ Original image

81‧‧‧Circuit pattern

82‧‧‧ Bad display pattern

91‧‧‧ (Top of substrate 9)

92‧‧‧Drawing area

92a‧‧‧Normal drawing area

92b‧‧‧ Bad drawing area

93‧‧‧Alignment mark

141‧‧‧light source

142‧‧‧Spatial light modulation device

151‧‧‧ holding unit moving mechanism

152‧‧‧head moving mechanism

161‧‧‧Control Department

162‧‧‧Good or bad acquisition department

163‧‧‧Memory Department

164‧‧‧Drawing Control Department

165‧‧‧Defective information output department

S11 ~ S19, S21 ~ S24, S31 ~ S34‧‧‧step

FIG. 1 is a diagram showing a configuration of a substrate processing system according to an embodiment.

FIG. 2 is a diagram showing a configuration of a drawing device.

FIG. 3 is a diagram showing a part of the original image.

FIG. 4 is a plan view showing a part of the substrate.

Fig. 5 is a block diagram showing the functions of the control section.

FIG. 6 is a diagram showing a processing flow of a substrate.

FIG. 7 is a diagram showing a processing flow of a substrate.

FIG. 8 is a plan view showing a part of the substrate.

FIG. 9 is a plan view showing a part of the substrate.

FIG. 10 is a plan view showing a part of the substrate.

FIG. 1 is a diagram showing a configuration of a substrate processing system 10 according to an embodiment of the present invention. The substrate processing system 10 is a system that processes a printed wiring board (hereinafter, simply referred to as a "substrate"). The substrate processing system 10 includes a drawing device 1, a developing device 21, an etching device 22, and a processing device 3.

The drawing device 1 is a direct drawing device (a so-called direct drawing device) that draws a circuit pattern by irradiating a modulated film of light onto a resist film on a substrate, and scanning the irradiation area of the light on the substrate. The resist film is formed on a copper layer provided on a substrate by a photosensitive material. The developing device 21 performs a developing process on a substrate on which a circuit pattern is drawn by the drawing device 1. The etching device 22 forms a copper wiring pattern corresponding to the circuit pattern by performing an etching process on the substrate on which the developing device 21 is subjected to the development process. The processing device 3 performs a predetermined process on the substrate after the etching process. In the processing device 3, for example, an inspection process for inspecting a wiring pattern on a substrate after the etching process is performed.

FIG. 2 is a diagram showing the configuration of the drawing device 1. The drawing device 1 includes a substrate holding section 12, an imaging section 13, a drawing head 14, and a moving mechanism 15. The substrate holding portion 12 holds the substrate 9 from the lower side.

FIG. 3 is a diagram showing a part of the original image 80 including a predetermined plurality of circuit patterns 81 drawn on the substrate 9. The plurality of circuit patterns 81 are respectively drawn on a plurality of drawing regions 92 set on the substrate 9. In Figure 3, a two-point chain line table The substrate 9 and the drawing area 92 are shown. The plurality of drawing regions 92 are arranged apart from each other in a matrix shape, for example. Each drawing area 92 is, for example, a substantially rectangular shape.

FIG. 4 is a plan view showing a part of the substrate 9. The plurality of drawing regions 92 described above are set on one main surface of the substrate 9 (hereinafter, referred to as the "upper surface 91"). A plurality of alignment marks 93 are set in each drawing area 92. The alignment mark 93 is a mark provided on the substrate 9 to indicate the position of the drawing area 92. The alignment mark 93 is, for example, a solid circle. In the example shown in FIG. 4, an alignment mark 93 is set on the vertex of each drawing area 92. Furthermore, in FIG. 4, the drawing area 92 is surrounded by a solid line, but on the actual substrate 9, a line surrounding the drawing area 92 is not provided (the same is true in FIGS. 8 to 10).

On the substrate 9, unlike the original image 80, the alignment mark 93 is self-designed due to the deformation of the substrate 9, the deformation of the pattern (so-called base) already formed in each drawing area 92, or the position shift. The configured position is the case where the reference position is shifted. In FIG. 4, when the alignment mark 93 is shifted from the reference position, the reference position is indicated by a dotted circle. The position of the design drawing area 92 is indicated by a two-dot chain line.

The imaging unit 13 shown in FIG. 2 photographs the upper surface 91 of the substrate 9. A plurality of alignment marks 93 (see FIG. 4) set in each drawing area 92 are captured by the imaging unit 13. The drawing head 14 irradiates the substrate 9 with modulated light. The drawing head 14 includes a light source 141 that emits laser light, and a spatial light modulation device 142 that guides light from the light source 141. The spatially modulated light by the spatial light modulation device 142 is guided to the substrate 9 on the substrate holding portion 12. As the spatial light modulation device 142, for example, a digital micro-mirror device (registrar), which is an optical element that arranges a number of tiny mirrors that can individually change their orientation on a plane, is a digital micro-mirror device. Superscript)).

The moving mechanism 15 moves the substrate 9 together with the substrate holding portion 12 relative to the drawing head 14. Thereby, the irradiation area of the light from the drawing head 14 is scanned on the substrate 9. In the example shown in FIG. 2, the moving mechanism 15 includes a holding unit moving mechanism 151 and a head moving mechanism 152. The holding portion moving mechanism 151 moves the substrate 9 and the substrate holding portion 12 together in a direction perpendicular to the paper surface in FIG. 2, that is, the main scanning direction. The head moving mechanism 152 moves the drawing head 14 and the imaging unit 13 together in the left-right direction, that is, the sub-scanning direction in FIG. 2. Furthermore, the substrate 9 can also be rotated in the horizontal plane by the moving mechanism 15.

In the drawing device 1, the substrate 9 is irradiated with light that is spatially adjusted by the drawing head 14, and on the other hand, the substrate 9 is moved in the main scanning direction by the holding portion moving mechanism 151 to perform the substrate 9 Its depiction. Then, the drawing head 14 moves only a predetermined distance in the sub-scanning direction by the head moving mechanism 152, and once again irradiates the substrate 9 with spatially modulated light, on the one hand, moves the substrate 9 in the main scanning direction to This performs drawing of the substrate 9. In this manner, the drawing device 1 repeatedly moves the substrate 9 in the main scanning direction and moves the drawing head 14 in the sub-scanning direction, thereby drawing a circuit pattern on the substrate 9.

In the drawing device 1, the substrate 9 is moved in the main scanning direction by the holding portion moving mechanism 151, and the imaging unit 13 is moved in the sub-scanning direction by the head moving mechanism 152, whereby the imaging portion 13 is located on the substrate 9. Above each position. In the drawing device 1, the imaging unit 13 can photograph a desired position on the upper surface 91 of the substrate 9.

The drawing device 1 further includes a control unit that controls each configuration such as the imaging unit 13, the drawing head 14, and the moving mechanism 15. FIG. 5 is a block diagram showing the functions of the control unit 16 of the device 1. The control unit 16 becomes a unit that will perform various arithmetic processes. A central processing unit (CPU), a read only memory (ROM) that stores basic programs, and a random access memory (RAM) that stores various information are connected to the bus The composition of a general computer system. FIG. 5 also illustrates other configurations of the drawing device 1 connected to the control unit 16.

The control unit 16 includes an imaging control unit 161, a good or bad acquisition unit 162, a memory unit 163, a rendering control unit 164, and a failure information output unit 165. The imaging control unit 161 obtains an image of the upper surface 91 of the substrate 9 by controlling the imaging unit 13 and the moving mechanism 15. In the drawing device 1, for example, for each of the alignment marks 93 on the substrate 9, an image at a position where the alignment marks 93 are arranged on the design, that is, a reference position and the vicinity thereof is acquired. The imaging result of the imaging section 13 is transmitted to the good or bad acquisition section 162.

The good or bad acquisition unit 162 determines or obtains a good or bad drawing region 92 for each of the drawing regions 92 on the substrate 9 based on the imaging result of the imaging unit 13. Specifically, the positions of the plurality of alignment marks 93 on the substrate 9 are obtained for each drawing area 92 from the above-mentioned imaging results. Next, based on the positions of the plurality of alignment marks 93 obtained for each drawing area 92, it is determined whether the position or deformation of each drawing area 92 is good. Further, information indicating whether or not the alignment mark 93 has been changed is obtained for each drawing area 92 from the above-mentioned photographing result, and the quality of each drawing area 92 is obtained based on the information.

For example, in the six drawing areas 92 in FIG. 4, regarding the drawing area 92 on the left side of the upper section, the four alignment marks 93 have not changed, and the positions of the four alignment marks 93 overlap with the reference position, so the good or bad acquisition unit The judgment of 162 is good (ie, confirmed to be good). The good or bad acquisition unit 162 also determines that the drawing area 92 is good when the deviation of each of the alignment marks 93 from the reference position in the drawing area 92 is within an allowable range.

In the drawing area 92 on the right side of the upper section in FIG. 4, the drawing area 92 The overall rotation is large, and the position from the design is larger than the allowable range. The good or bad acquisition unit 162 specifies the position of the drawing area 92 as bad. Although not shown in FIG. 4, when the drawing area 92 is moved more widely in the up-down direction or left-right direction than the allowable range without deformation, the position of the drawing area 92 is specified as defective, as described above.

In the drawing area 92 on the left side of the middle section in FIG. 4, the upper left alignment mark 93 is largely shifted from the reference position. Therefore, the upper left portion of the drawing area 92 is deformed more than the allowable range. The degree of deformation of the drawing area 92 may be based on, for example, an angle formed by a straight line connecting two alignment marks 93 adjacent to each other in the up-down or left-right direction, and an angle formed by the straight line when the alignment mark 93 is at a reference position. Find it out. The good or bad acquisition unit 162 specifies the deformation of the drawing area 92 as bad.

In the drawing area 92 on the right side of the middle section in FIG. 4, the drawing area 92 as a whole is larger than the allowable range. The enlargement of the drawing area 92 is also one of the deformations of the drawing area 92. The good or bad acquisition unit 162 also specifies the deformation of the drawing area 92 as bad. Although not shown in FIG. 4, when the entire drawing area 92 is smaller than the allowable range, the deformation of the drawing area 92 is specified to be defective, as described above.

In the drawing area 92 on the left side of the lower part in FIG. 4, the upper left alignment mark 93 is deleted in the previous step and does not exist. In the drawing area 92 on the right side of the lower section, the upper left alignment mark 93 is deformed into a hollow circle shape. As such, the drawing area 92 in which the alignment mark 93 is changed (that is, deleted or deformed) is the drawing area 92 in which the defective is detected in the preceding step of the substrate processing system 10 described below. The alignment mark 93 is changed, for example, by a manual operation of an operator before the substrate 9 is carried into the substrate processing system 10. The change of the alignment mark 93 can also be performed by a device performing the foregoing steps.

Deletion of the alignment mark 93 in the drawing area 92 on the left side of the lower stage indicates, for example, a defect in a pattern that should not be formed in the drawing area 92 in the previous step. The deformation of the alignment mark 93 in the drawing area 92 on the right side of the lower stage indicates that, for example, the pattern formed in the drawing area 92 in the previous step is broken. The good or bad acquisition unit 162 determines that the two previous drawing regions 92 are defective in the previous steps.

Hereinafter, the drawing area 92 determined by the good or bad acquisition unit 162 as a good upper left is referred to as "normal drawing area 92a", and the other drawing area 92 designated as bad by the good or bad acquisition unit 162 is referred to as "bad drawing area 92b". In Fig. 4, these symbols 92a and 92b are also marked.

The good or bad acquisition unit 162 also specifies the bad type of the bad drawing area 92b. Specifically, in FIG. 4, the defect type of the defective drawing area 92b on the right side of the upper section is a rotation of the drawing area, and the defect type of the defective drawing area 92b on the left side of the middle section is a deformation of the drawing area. The bad type of the bad drawing area 92b on the right side of the middle section is one type of deformation of the drawing area, that is, enlargement. The defective category of the defective drawing area 92b on the left side of the lower stage is that no pattern was formed in the previous step, and the defective category of the defective drawing area 92b on the right side of the lower stage is the broken line of the pattern formed in the previous step.

The information obtained by the good or bad acquisition unit 162 for each drawing area 92 is stored in the memory unit 163 as bad information of the substrate 9. The defective information includes: information indicating whether the drawing regions 92 are good or bad; position information on the substrate 9 of each defective drawing region 92b; and information indicating the bad category of each defective drawing region 92b. As described below, the bad information stored in the memory unit 163 is used in the drawing of the circuit pattern 81 of the drawing device 1. The defective information is output to the processing device 3 (see FIG. 1) through the defective information output unit 165 and is also used in the processing of the processing device 3.

Next, referring to FIGS. 6 and 7, the processing flow of the substrate 9 by the substrate processing system 10 will be described. The substrate processing system 10 first transfers the substrate 9 (see FIG. 4) that has been processed in the previous step to the drawing device 1 (step S11) shown in FIG. 2. The substrate 9 is placed on the substrate holding portion 12 and is held. Thereby, the substrate 9 on which the plurality of drawing regions 92 are set on the upper surface 91 is prepared (step S12).

Then, the imaging control unit 161 (see FIG. 5) controls the imaging unit 13 and the moving mechanism 15 to capture a plurality of alignment marks 93 set in each drawing area 92 (step S13). The imaging result of the imaging section 13 is transmitted to the good or bad acquisition section 162.

The good or bad acquisition unit 162 determines or obtains the good or bad of each drawing area 92 based on the photographing result of step S13 (step S14). In step S14, the position information on the substrate 9 of each of the defective drawing areas 92b is acquired by the good or bad acquisition unit 162, and the defect type of each of the defective drawing areas 92b is also specified. Such information obtained by the good or bad acquisition unit 162 for each drawing area 92 is stored in the memory unit 163 as bad information of the substrate 9. The defective information is output to the processing device 3 through the defective information output unit 165 (step S15).

Next, the drawing control unit 164 controls the drawing head 14 and the moving mechanism 15 based on the bad information stored in the storage unit 163. Thereby, only the drawing area determined to be good by the good or bad acquisition unit 162 in step S14 (that is, the drawing area confirmed to be determined to be good), that is, the normal drawing area 92a is irradiated with the modulated light from the drawing head 14, and the The irradiated area of the light is scanned on the drawing area 92a. As a result, as shown in FIG. 8, the circuit pattern 81 is drawn only on the normal drawing area 92 a on the substrate 9 (steps S16 and S17). Further, in the defective drawing area 92b that is a defective drawing area designated as defective in the good or bad acquisition unit 162, a defective display pattern 82 indicating the meaning of the defective is drawn (steps S16, S18).

The defective display pattern 82 includes information indicating a defective type of the defective drawing area 92b. The information indicating the bad category is based on the above bad information. In the example shown in FIG. 8, a number surrounded by a rectangular frame is drawn as the defective display pattern 82 in the defective drawing area 92 b. This number also indicates the meaning that the drawing area is a defective drawing area 92b and the type of the failure. For example, when the defective display pattern 82 is "1", it indicates that the defective category is the rotation of the drawing area. In the case where the defective display pattern 82 is "2" to "5", the defective categories are: deformation of the drawing area, enlargement of the drawing area, no pattern formed in the previous step, and formed in the previous step. Disconnection of the pattern. In addition, the display of the defective category of the defective display pattern 82 does not necessarily need to be performed by numbers, and can be performed in various forms.

The defective display pattern 82 is arranged around the upper left alignment mark 93 or the upper left alignment mark 93 among the plurality of alignment marks 93 in each defective drawing area 92b. In the example shown in FIG. 8, the defective display pattern 82 is arranged around the upper left alignment mark 93 in the defective drawing area 92 b. The alignment mark 93 on the upper left of each defective drawing area 92b is the alignment mark 93 of each drawing area 92 when the registration mark 93 of each drawing area 92 is photographed in a device in a subsequent step (for example, the processing device 3 described below). The first alignment mark in the first photograph. As shown in the bad drawing area 92b on the left side of the lower part in FIG. 8, in the bad drawing area 92b in which the upper left alignment mark 93 (that is, the first alignment mark) is deleted, around the reference position of the first alignment mark Or, a defective display pattern 82 is arranged at the reference position.

Steps S16 to S18 are repeatedly performed until the drawing device 1 completes the pattern drawing of all the drawing areas 92 on the substrate 9 (step S19). Thereby, a circuit pattern 81 is drawn in all the normal drawing areas 92a, and a defective display pattern 82 is drawn in each of the defective drawing areas 92b.

The drawing device 1 draws a plurality of drawing areas 92 in a predetermined order, draws a circuit pattern 81 when the drawing area is a normal drawing area 92a, and draws a defective display pattern 82 when the drawing area is a defective drawing area 92b. . The drawing device 1 may also, for example, perform the drawing of the defective display patterns 82 of all the defective drawing areas 92b after the drawing of the circuit patterns 81 of all the normal drawing areas 92a is completed. Alternatively, after the defective display patterns 82 of all the defective drawing areas 92b have been drawn, the circuit patterns 81 of all the normal drawing areas 92a may be drawn.

When the drawing by the drawing device 1 is completed, the substrate 9 is carried out from the drawing device 1 and carried into the developing device 21 shown in FIG. 1 (step S21). In the developing device 21, a development process is performed on the substrate 9 on which the circuit pattern 81 is drawn in the normal drawing area 92a by the drawing device 1 (step S22). Then, the substrate 9 is carried into the etching apparatus 22 (step S23). In the etching device 22, an etching process is performed on the substrate 9 subjected to the development process by the developing device 21 (step S24). Thereby, a copper wiring pattern corresponding to the circuit pattern 81 is formed on the normal drawing area 92a. A copper display pattern corresponding to the defective display pattern 82 is formed on the defective drawing region 92b.

When the etching process is completed, the substrate 9 is carried out from the etching apparatus 22 and carried into the processing apparatus 3 (step S31). In the processing device 3, according to the defective information output from the defective information output section 165 of the drawing device 1 to the processing device 3 in step S15, the above is performed on only the normal drawing area 92a of the plurality of drawing areas 92 on the substrate 9 Inspection processing of wiring patterns (steps S32 to S34). Thereafter, the substrate 9 is carried out from the processing device 3, and the processing of the substrate 9 by the substrate processing system 10 is completed.

As described above, the substrate processing system 10 determines the position of each of the drawing regions 92 on the alignment mark 93 of each of the drawing regions 92 of the imaging substrate 9 in the drawing device 1. Good or not. Then, the drawing control unit 164 controls the drawing head 14 and the moving mechanism 15 so that the drawing of the circuit pattern 81 is performed only on the normal drawing area 92a judged to be good. In this way, in the drawing device 1, by determining the goodness of each of the plurality of drawing regions 92 on the substrate 9, and using the determination result in the drawing of the circuit pattern 81 immediately following, the substrate 9 can be shortened. The time required to draw the circuit pattern 81.

In addition, on the substrate 9, the alignment mark 93 of the defective drawing area 92b in which the defect was detected in the previous step is changed, and in the drawing device 1, the defective drawing area 92b is specified by the alignment mark 93 after the photography is changed. . With this, even if the position information of the defective drawing area 92b is not transmitted from the device in the previous step to the drawing device 1, the defective drawing area 92b can be easily identified, and the circuit pattern can be drawn only on the normal drawing area 92a. 81. As a result, the time required for drawing the circuit pattern 81 on the substrate 9 can be shortened.

In the previous step, the alignment mark 93 changed in the defective defective drawing area 92b where the defect is detected is preferably a plurality of alignment marks 93 in the defective drawing area 92b. The photographed alignment mark 93 is the first alignment mark. Thereby, the defective drawing area 92b can be easily and quickly specified in the drawing device 1.

Furthermore, in the previous step, it is not necessary to change the alignment mark 93 in the defective drawing area 92b where a defect is detected. When a pattern is already formed in the drawing area 92, the periphery of the alignment mark 93 may be changed. pattern. As a result, as described above, even if the position information of the defective drawing area 92b is not transmitted from the device in the previous step to the drawing device 1, the defective drawing area 92b can be easily identified, so that only the normal drawing area 92a can be specified. The circuit pattern 81 is depicted above. As a result, the time required for drawing the circuit pattern 81 on the substrate 9 can be shortened. Also, the changed pattern is better It is a pattern around the first alignment mark. Thereby, similarly to the above, in the drawing device 1, the defective drawing area 92b can be easily and quickly specified.

In the drawing device 1, a defective display pattern 82 is drawn on the defective drawing area 92b. Thereby, the drawing area 92 can be easily distinguished as a defective drawing area 92b. As a result, processing in subsequent steps can be easily performed. In addition, since the defective display pattern 82 includes information indicating a defective category, the defective category of the defective drawing area 92b can be easily identified. As a result, information such as the frequency of occurrence of each type of failure can be easily obtained. This information can be used for analysis of factors that cause problems.

As described above, the position information on the substrate 9 of the defective drawing area 92 b specified as defective in the good or bad acquisition unit 162 is output to the processing device 3 in the subsequent step by the defective information output unit 165. Thereby, in the subsequent steps, it is possible to easily realize the processing of the normal drawing regions 92a only in the subsequent steps without performing a good or bad judgment on the plurality of drawing regions 92 on the substrate 9 (that is, skipping the processing of the bad drawing regions 92b). ). As a result, the processing of the substrate 9 by the substrate processing system 10 can be performed quickly. In addition, since the defective information output unit 165 outputs the defective information to the processing device 3 (step S15), as long as it is executed after step S14 and executed before step S32, it is not necessarily executed immediately after step S14.

In the drawing device 1, the defective information output section 165 may be omitted from the control section 16 and the defective information to the processing device 3 may not be output. In this case, the processing device 3 photographs the alignment mark 93 (that is, the above-mentioned first alignment mark) on the upper left of each drawing area 92 of the substrate 9 and the vicinity thereof. When there is no alignment mark 93 on the upper left, the reference position of the alignment mark 93 and the vicinity thereof are photographed. When a defective display pattern 82 is arranged on the alignment mark 93 on the upper left of the drawing area 92 or around the alignment mark 93, the drawing area 92 is specified as a defective drawing. The drawing area 92b is not inspected. When a defective display pattern 82 is not arranged on the alignment mark 93 on the upper left of the drawing area 92 and around the alignment mark 93, it is determined that the drawing area 92 is a normal drawing area 92a, and the normal drawing area is determined. 92a performs inspection processing.

In this way, in the substrate processing system 10, the defective display pattern 82 is arranged in the plurality of alignment marks 93 in the defective drawing area 92b, and the alignment marks 93 initially photographed in each drawing area 92 in the processing device 3 in the subsequent step are disposed. That is, on or around the first alignment mark. Thereby, the defective drawing area 92b can be easily and quickly specified in the subsequent steps.

In the drawing device 1, the defective display pattern 82 displayed on the defective drawing area 92b does not necessarily include information indicating the type of the defect. The defective display pattern 82 on the substrate 9 may be, for example, a pattern on which the entire entire surface of each defective drawing area 92b is painted, as shown in FIG. 9. The defective display pattern 82 on the substrate 9 may also be, for example, a substantially hatched network line pattern extending over each defective drawing area 92b as shown in FIG. 10. The defective display pattern 82 shown in FIG. 9, that is, the entire surface coating pattern, does not necessarily need to be drawn over the entirety of the defective drawing area 92 b. For example, the defective display pattern 82 may be drawn on a predetermined area in the defective drawing area 92 b. Similarly, the defective display pattern 82 shown in FIG. 10, that is, the shadow pattern of the network line, can also be drawn on an area set in advance in the defective drawing area 92b. As described above, by drawing the entire surface coating pattern or the shadow pattern of the mesh line as the defective display pattern 82, the defective drawing region 92b can also be easily identified.

Various changes can be made to the substrate processing system 10.

For example, the alignment mark 93 provided as a mark on the substrate 9 may have various shapes other than a solid circle shape. The alignment mark 93 may be, for example, a cross shape. The alignment mark 93 may be a through hole formed in the substrate 9. Or, A part of the pattern already formed on the drawing area 92 is used as an alignment mark 93 photographed by the drawing device 1.

In the drawing device 1, the movement of the substrate 9 and the substrate holding section 12 by the moving mechanism 15 may be performed relative to the drawing head 14 and the imaging section 13. For example, the substrate 9 and the substrate holding section 12 may not be moved, and the drawing head 14 and the imaging section 13 may be moved in the main scanning direction and the sub-scanning direction. Alternatively, the head 14 and the imaging section 13 may not be drawn, and the substrate 9 and the substrate holding section 12 may be moved in the main scanning direction and the sub scanning direction.

The imaging unit 13 may be, for example, a line sensor that can capture images over the entire width in the sub-scanning direction of the substrate 9. In this case, the imaging section 13 is fixed above the substrate holding section 12, and the substrate 9 is moved in the main scanning direction by the holding section moving mechanism 151, so that the entire upper surface 91 of the substrate 9 is carried out by the imaging section 13. photography.

In the drawing device 1, if the circuit pattern 81 of the defective drawing area 92b is not drawn, it is not necessary to draw the defective display pattern 82 of the defective drawing area 92b.

The processing device 3 may perform various processes other than the above-mentioned inspection process. For example, in the plurality of drawing areas 92 of the substrate 9, on the normal drawing area 92a of the substrate 9 after the etching processing, mounting processing for mounting electronic components may also be performed. Alternatively, a new circuit pattern drawing process may be performed on only the normal drawing region 92a of the substrate 9 after the etching process.

The substrate 9 to be drawn in the drawing device 1 is not necessarily limited to a printed wiring board. In the drawing device 1, for example, circuit patterns such as a glass substrate for a flat panel display device such as a semiconductor substrate, a liquid crystal display device, or a plasma display device, a glass substrate for a photomask, and a substrate for a solar cell panel can be drawn. .

The configurations in the above-described embodiment and each modification may be appropriately combined within a limit that they do not contradict each other.

The invention has been described and described in detail, but the description has been described for illustration and not limitation. Therefore, it can be said that there can be multiple variations or aspects without departing from the scope of the present invention.

Claims (30)

A drawing device that irradiates a substrate with light to draw a circuit pattern, includes a substrate holding section that holds a substrate having a plurality of drawing areas set thereon, and an imaging section that holds a plurality of numbers set in each drawing area. The alignment marks are used for photography; the good or bad acquisition unit obtains the positions of the plurality of alignment marks on the substrate according to the imaging results of the imaging unit for each of the drawing areas, and uses the plurality of alignment marks. Whether the deviation of the position from the reference position on the design is within the allowable range to determine whether the position or deformation of each of the drawing areas is good; the drawing head irradiates the substrate with modulated light; and the moving mechanism is relative to the above The drawing head moves the substrate and the substrate holding section together to scan the irradiation area of the light from the drawing head on the substrate; and a drawing control section that controls the drawing head and the moving mechanism, In this way, the circuit is performed only in the normal drawing area, which is the drawing area determined to be good by the above-mentioned good or bad acquisition unit. It depicts the case. For example, the drawing device according to the first patent application scope, wherein the drawing control unit and the moving mechanism are controlled by the drawing control unit, whereby the defective drawing area, which is specified as a defective drawing area in the good or bad acquisition unit, is a defective drawing area. , And draw a bad display pattern that indicates the meaning of bad. For example, in the drawing device of the second patent application scope, in the good or bad acquisition section, the bad category of the bad painting area is also specified, and the bad display pattern includes information indicating the bad category. For example, the drawing device in the second scope of the patent application, wherein the above-mentioned defective display pattern is arranged in the plurality of alignment marks in the above-mentioned defective drawing area, on the first alignment mark that is first photographed in the device in the subsequent step, or Around the first alignment mark. For example, the drawing device of the third scope of the patent application, wherein the above-mentioned defective display pattern is arranged in the plurality of alignment marks in the above-mentioned defective drawing area, on the first alignment mark that is first photographed in the device in the subsequent step, or Around the first alignment mark. For example, the drawing device in the second scope of the patent application, wherein the above-mentioned defective display pattern is a pattern that is set in advance on the entire surface of the area or a shadow pattern of a network line. For example, the drawing device according to any one of claims 1 to 6, further includes a defective information output section that outputs a defective drawing area designated as defective in the above-mentioned good or bad acquisition section, that is, defective drawing. Location information of the area on the substrate. A drawing device that irradiates a substrate with light to draw a circuit pattern, includes a substrate holding section that holds a substrate having a plurality of drawing areas set thereon, and an imaging section that holds a plurality of numbers set in each drawing area. Whether the alignment mark or the surrounding pattern of the defective drawing area, which is a defective drawing area, is detected in the previous step according to the photographing result of the imaging section, To obtain the goodness of each of the drawing areas; a drawing head that irradiates the substrate with modulated light; a moving mechanism that relatively moves the substrate and the substrate holding portion relative to the drawing head together to thereby move The irradiated area of light from the drawing head is scanned on the substrate; and the drawing control section controls the drawing head and the moving mechanism, whereby only the drawing area confirmed as good in the good or bad acquisition section is a normal drawing area. Draw circuit patterns. For example, the drawing device in the eighth aspect of the patent application, wherein the drawing head and the moving mechanism are controlled by the drawing control unit, whereby a defective drawing area, which is specified as a defective drawing area in the good or bad acquisition unit, is a defective drawing area. , And draw a bad display pattern that indicates the meaning of bad. For example, in the drawing device of the scope of the patent application, the defective category of the defective drawing area is also specified in the good or bad acquisition unit, and the defective display pattern includes information indicating the defective category. For example, the drawing device of the ninth scope of the application for a patent, wherein the above-mentioned defective display pattern is arranged in the plurality of alignment marks in the above-mentioned defective drawing area, on the first alignment mark that is first photographed in the device in the subsequent step, or Around the first alignment mark. For example, the drawing device of the scope of application for the patent, wherein the above-mentioned defective display pattern is arranged in the plurality of alignment marks in the above-mentioned defective drawing area, on the first alignment mark that is first photographed in the device in the subsequent step, or Around the first alignment mark. For example, the drawing device in the ninth scope of the application for a patent, wherein the above-mentioned defective display pattern is a whole-surface coating pattern or a network line shadow pattern of a preset area. For example, the drawing device of any one of items 8 to 13 of the scope of patent application further includes a defective information output section that outputs a defective drawing area that is specified as defective in the above-mentioned good or bad acquisition section, that is, defective drawing. Location information of the area on the substrate. A substrate processing system is a processor for processing a substrate. The substrate processing system is provided with: a drawing device that irradiates light to a substrate provided with a plurality of drawing regions and draws a circuit pattern only in a normal drawing region; and a developing device that Development processing is performed on the substrate on which the circuit pattern is drawn in the normal drawing area by the drawing device; an etching device performs an etching treatment on the substrate on which the development processing is performed by the development device; and a processing device that Among the plurality of drawing areas of the substrate, a predetermined process is performed only in the normal drawing area of the substrate after the etching process; and the drawing device includes: a substrate holding section that holds the substrate; and imaging A part for photographing a plurality of alignment marks set in each of the plurality of drawing areas, and a good or bad obtaining part for each of the drawing areas to obtain the above-mentioned on the substrate based on the photographing result of the imaging unit The positions of the plurality of alignment marks, and by using the plurality of alignment marks Whether the deviation of the position from the reference position in the design is within the allowable range to determine whether the position or deformation of each of the drawing areas is good; the drawing head irradiates the substrate with modulated light; the moving mechanism, which is relatively The drawing head moves the substrate and the substrate holding section together to scan the irradiation area of the light from the drawing head on the substrate; and a drawing control section that controls the drawing head and the moving mechanism. Therefore, the circuit pattern is drawn only in the normal drawing area, which is the drawing area determined to be good by the above-mentioned good or bad acquisition unit. A substrate processing system is a processor for processing a substrate. The substrate processing system is provided with: a drawing device that irradiates light to a substrate provided with a plurality of drawing regions and draws a circuit pattern only in a normal drawing region; and a developing device that Development processing is performed on the substrate on which the circuit pattern is drawn in the normal drawing area by the drawing device; an etching device performs an etching treatment on the substrate on which the development processing is performed by the development device; and a processing device that Among the plurality of drawing regions of the substrate, a predetermined process is performed only in the normal drawing region of the substrate after the etching process; and the drawing device is provided with a substrate holding section that holds the substrate; The imaging section photographs a plurality of alignment marks set in each of the plurality of drawing areas. The good or bad acquisition section is based on the imaging results of the imaging section and is detected in the previous steps. Whether the defective drawing area is the alignment mark of the defective drawing area or its surrounding pattern Change to obtain the goodness of each of the drawing areas; a drawing head that irradiates the substrate with modulated light; a moving mechanism that relatively moves the substrate and the substrate holding portion relative to the drawing head together, thereby Scanning the irradiation area of the light from the drawing head on the substrate; and a drawing control section that controls the drawing head and the moving mechanism, whereby only the drawing area confirmed as being good in the good or bad obtaining section is the normal. The drawing area draws the circuit pattern. A drawing method is a person who draws a circuit pattern by irradiating light to a substrate. The drawing method includes the following steps: a) preparing a substrate having a plurality of drawing areas set; b) pairing a plurality of pairs set in each drawing area Quasi-marking for photography; c) for each of the above-mentioned drawing areas, obtain the positions of the plurality of alignment marks on the substrate according to the photography results in step b) above, and use the positions of the plurality of alignment marks and Whether the deviation of the reference position in the design is within the allowable range to determine whether the position or deformation of the above-mentioned drawing areas is good; d) on the one hand, the modulated light is irradiated to the substrate, and on the other hand, the irradiation area of the light is in the Scanning is performed on the substrate, whereby the circuit pattern is drawn only in the normal drawing area determined as the good drawing area performed in the step c). For example, the drawing method in the scope of patent application No. 17 further includes the following steps: In step c) above, a defective display pattern indicating the meaning of the defect is drawn in the defective drawing region designated as the defective drawing region, that is, the defective drawing region. . For example, in the method of drawing 18 in the scope of patent application, in the step c), the defect category of the defective drawing area is also specified, and the defect display pattern includes information indicating the defect category. For example, the drawing method of the 18th scope of the patent application, wherein the above-mentioned defective display pattern is arranged in the plurality of alignment marks in the above-mentioned defective drawing area, on the first alignment mark that is initially photographed in the subsequent step, or the first alignment mark 1Align around the mark. For example, the drawing method of the 19th scope of the patent application, wherein the above-mentioned defective display pattern is arranged in the plurality of alignment marks in the above-mentioned defective drawing area, on the first alignment mark which is first photographed in the subsequent step, or on the first alignment mark. 1Align around the mark. For example, the drawing method of the scope of patent application No. 18, wherein the above-mentioned defective display pattern is a pattern that is set in advance on the entire surface of the area or a shadow pattern of a network line. If the drawing method according to any one of claims 17 to 22 is applied, it further includes the following steps: outputting the drawing area specified as defective in the step c), that is, the drawing area on the substrate described above as the defective drawing area. Location information. A drawing method is a person who draws a circuit pattern by irradiating light to a substrate. The drawing method includes the following steps: a) preparing a substrate having a plurality of drawing areas set; b) pairing a plurality of pairs set in each drawing area Quasi-marking for photographing; c) according to the photographing result in step b) above, and by detecting the defective drawing area in the previous step before step a) above, that is, the alignment mark of the defective drawing area or its mark Whether the surrounding pattern has been changed to obtain the goodness of each of the above-mentioned drawing areas; d) on the one hand, the modulated light is irradiated to the substrate, and on the other hand, the area irradiated with the light is scanned on the substrate, so that only the c In the step), the circuit pattern is drawn in the normal drawing area, which is the normal drawing area. For example, the drawing method in the scope of the patent application No. 24 further includes the following steps: In step c) above, a defective display pattern that indicates the meaning of the defect is drawn in the defective drawing region that is designated as the defective drawing region. . For example, in the method of drawing 25 in the scope of patent application, in step c) above, the defective category of the defective drawing area is also specified, and the defective display pattern includes information indicating the defective category. For example, the drawing method of the scope of patent application No. 25, wherein the above-mentioned defective display pattern is arranged in the plurality of alignment marks of the above-mentioned defective drawing area, on the first alignment mark that is first photographed in the subsequent step, or the above-mentioned first alignment mark 1Align around the mark. For example, the drawing method of the 26th aspect of the patent application, wherein the above-mentioned defective display pattern is arranged in the plurality of alignment marks in the above-mentioned defective drawing area, on the first alignment mark that is initially photographed in the subsequent step, or on the first alignment mark. 1Align around the mark. For example, the method of drawing in the scope of application for the patent No. 25, wherein the above-mentioned defective display pattern is a pattern that is set in advance on the entire surface of the area or a shadow pattern of the network line. If the drawing method of any one of the scope of application for patents Nos. 24 to 29, it further includes the following steps: outputting the drawing area specified as defective in the step c), that is, the drawing area on the substrate of the defective drawing area. Location information.