TWI633683B - Light-emitting element having a plurality of light-emitting structures - Google Patents
Light-emitting element having a plurality of light-emitting structures Download PDFInfo
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Abstract
一發光元件,包含:一第一半導體層;一第一發光結構、一第二發光結構以及一第三發光結構,位於第一半導體層之上,其中第一半導體層為連續的;一第一溝槽,位於第一發光結構與第二發光結構之間,曝露第一半導體層之一上表面;一第二溝槽,位於第二發光結構與第三發光結構之間,曝露第一半導體層之上表面;一第三溝槽,位於些發光結構其中之一之中,曝露第一半導體層,其中第三溝槽隨著一第一延伸方向延伸,第一延伸方向平行於第一半導體層;一絕緣橋接部,位於第一溝槽及第二溝槽中,連接些發光結構;一第一電極,位於第三溝槽中,且電性連接第一半導體層;以及一第二電極,包含一第二打線部,位於些發光結構其中之一之上,以及一第二延伸部,延伸自第二打線部;其中第二延伸部位於絕緣橋接部上,且延伸至些發光結構。 a light emitting device comprising: a first semiconductor layer; a first light emitting structure, a second light emitting structure, and a third light emitting structure over the first semiconductor layer, wherein the first semiconductor layer is continuous; a trench between the first light emitting structure and the second light emitting structure, exposing an upper surface of the first semiconductor layer; a second trench between the second light emitting structure and the third light emitting structure, exposing the first semiconductor layer a third trench, in one of the light emitting structures, exposing the first semiconductor layer, wherein the third trench extends along a first extending direction, the first extending direction is parallel to the first semiconductor layer An insulating bridge portion is disposed in the first trench and the second trench to connect the light emitting structures; a first electrode is disposed in the third trench and electrically connected to the first semiconductor layer; and a second electrode is A second wire bonding portion is disposed on one of the light emitting structures, and a second extending portion extends from the second wire bonding portion; wherein the second extending portion is located on the insulating bridge portion and extends to the light emitting structures.
Description
本發明關於一種發光元件,特別是關於一種具有複數個發光結構之發光元件。 The present invention relates to a light-emitting element, and more particularly to a light-emitting element having a plurality of light-emitting structures.
如第1A圖所示,光電元件,例如發光二極體1(Light-emitting Diode;LED),目前已經廣泛地使用在光學顯示裝置、交通號誌、資料儲存裝置、通訊裝置、照明裝置與醫療器材上。此外,上述之LED1可與其他元件組合連接以形成一發光裝置。第1B圖為習知之發光裝置結構示意圖,如第1B圖所示,一發光裝置10包含一具有一電路120之次載體(submount)12;一焊料14(solder)位於上述次載體12上,藉由此焊料14將LED1固定於次載體12上並使LED 1與次載體12上之電路120形成電連接;以及一電性連接結構16,以電性連接LED 1之電極11/13與次載體12上之電路120;其中,上述之次載體12可以是導線架(lead frame)或大尺寸鑲嵌基底(mounting substrate)。 As shown in FIG. 1A, a photovoltaic element, such as a light-emitting diode (LED), has been widely used in optical display devices, traffic signs, data storage devices, communication devices, lighting devices, and medical devices. On the equipment. Further, the LED 1 described above may be combined with other components to form a light-emitting device. FIG. 1B is a schematic view showing the structure of a conventional light-emitting device. As shown in FIG. 1B, a light-emitting device 10 includes a submount 12 having a circuit 120; a solder 14 is located on the sub-carrier 12, The solder 14 thus fixes the LED 1 to the sub-carrier 12 and electrically connects the LED 1 to the circuit 120 on the sub-carrier 12; and an electrical connection structure 16 for electrically connecting the electrode 11/13 of the LED 1 with the sub-carrier The circuit 120 of 12; wherein the secondary carrier 12 can be a lead frame or a large mounting substrate.
一發光元件,包含:一第一半導體層;一第一發光結構、一第二發光結構以及一第三發光結構,位於第一半導體層之上,其中第一半導體層為連續的;一第一溝槽,位於第一發光結構與第二發光結構之間,曝露 第一半導體層之一上表面;一第二溝槽,位於第二發光結構與第三發光結構之間,曝露第一半導體層之上表面;一第三溝槽,位於些發光結構其中之一之中,曝露第一半導體層,其中第三溝槽隨著一第一延伸方向延伸,第一延伸方向平行於第一半導體層;一絕緣橋接部,位於第一溝槽及第二溝槽中,連接些發光結構;一第一電極,位於第三溝槽中,且電性連接第一半導體層;以及一第二電極,包含一第二打線部,位於些發光結構其中之一之上,以及一第二延伸部,延伸自第二打線部;其中第二延伸部位於絕緣橋接部上,且延伸至些發光結構。 a light emitting device comprising: a first semiconductor layer; a first light emitting structure, a second light emitting structure, and a third light emitting structure over the first semiconductor layer, wherein the first semiconductor layer is continuous; a trench between the first light emitting structure and the second light emitting structure, exposed An upper surface of the first semiconductor layer; a second trench between the second light emitting structure and the third light emitting structure, exposing the upper surface of the first semiconductor layer; and a third trench located in one of the light emitting structures The first semiconductor layer is exposed, wherein the third trench extends along a first extending direction, the first extending direction is parallel to the first semiconductor layer; and the insulating bridge is located in the first trench and the second trench Connecting a light emitting structure; a first electrode is disposed in the third trench and electrically connected to the first semiconductor layer; and a second electrode includes a second wire portion disposed on one of the light emitting structures, And a second extending portion extending from the second wire-bonding portion; wherein the second extending portion is located on the insulating bridge portion and extends to the light-emitting structures.
1‧‧‧LED 1‧‧‧LED
10‧‧‧發光裝置 10‧‧‧Lighting device
11、13‧‧‧電極 11, 13‧‧‧ electrodes
12‧‧‧次載體 12‧‧‧ times carrier
120‧‧‧電路 120‧‧‧ Circuitry
14‧‧‧焊料 14‧‧‧ solder
16‧‧‧電性連接結構 16‧‧‧Electrical connection structure
2、2’、3、3’、4、4’、5、5’、6‧‧‧發光元件 2, 2', 3, 3', 4, 4', 5, 5', 6‧‧ ‧ light-emitting elements
20‧‧‧基板 20‧‧‧Substrate
200‧‧‧圖案化上表面 200‧‧‧ patterned upper surface
21‧‧‧第一電極 21‧‧‧First electrode
21A‧‧‧第一打線部 21A‧‧‧The first line department
21B‧‧‧第一延伸部 21B‧‧‧First Extension
22‧‧‧發光疊層 22‧‧‧Lighting laminate
220‧‧‧第一半導體層 220‧‧‧First semiconductor layer
221‧‧‧第一上表面 221‧‧‧ first upper surface
222‧‧‧主動層 222‧‧‧ active layer
223‧‧‧第一側邊 223‧‧‧ first side
224‧‧‧第二半導體層 224‧‧‧Second semiconductor layer
225‧‧‧第二側邊 225‧‧‧ second side
23‧‧‧第二電極 23‧‧‧second electrode
23A‧‧‧第二打線部 23A‧‧‧Second Line Department
23B‧‧‧第二延伸部 23B‧‧‧Second extension
24‧‧‧透明導電層 24‧‧‧Transparent conductive layer
25、41、50、60‧‧‧第一溝槽 25, 41, 50, 60‧‧‧ first trench
27、43、62‧‧‧第二溝槽 27, 43, 62‧‧‧ second trench
30、40、54‧‧‧第一橋接部 30, 40, 54‧‧‧ first bridge
31、45、52‧‧‧第三溝槽 31, 45, 52‧‧‧ third trench
32‧‧‧電絕緣層 32‧‧‧Electrical insulation
33‧‧‧第四溝槽 33‧‧‧fourth trench
42‧‧‧第二橋接部 42‧‧‧Second Bridge
431‧‧‧第一區 431‧‧‧First District
432‧‧‧第二區 432‧‧‧Second District
451‧‧‧第三區 451‧‧‧ Third District
452‧‧‧第四區 452‧‧‧Fourth District
47、64‧‧‧曝露部 47, 64‧‧‧ Exposure
51‧‧‧第一連接線 51‧‧‧First cable
53‧‧‧第二連接線 53‧‧‧second cable
7‧‧‧燈泡 7‧‧‧Light bulb
71‧‧‧燈罩 71‧‧‧shade
72‧‧‧透鏡 72‧‧‧ lens
73‧‧‧載體 73‧‧‧ Carrier
74‧‧‧照明模組 74‧‧‧Lighting module
75‧‧‧燈座 75‧‧‧ lamp holder
76‧‧‧散熱槽 76‧‧‧heat sink
77‧‧‧連結部 77‧‧‧Connecting Department
78‧‧‧電連結器 78‧‧‧Electrical connector
〔第1A圖〕繪示習知LED之上視示意圖。。 [Fig. 1A] is a schematic top view of a conventional LED. .
〔第1B圖〕繪示習知之發光裝置結構示意圖。 [Fig. 1B] is a schematic view showing the structure of a conventional light-emitting device.
〔第2A圖〕繪示本申請案一實施例之發光元件之上視示意圖。 [Fig. 2A] is a top plan view of a light-emitting element according to an embodiment of the present application.
〔第2B圖〕繪示第2A圖繪示之發光元件之剖面示意圖。 [Fig. 2B] is a schematic cross-sectional view showing the light-emitting element shown in Fig. 2A.
〔第2C至2D圖〕繪示本申請案另一實施例之發光元件之製造流程圖。 [2C to 2D] is a flow chart showing the manufacture of a light-emitting element according to another embodiment of the present application.
〔第2E圖〕標示本申請案實施例之發光元件與習知LED之效率。 [Fig. 2E] shows the efficiency of the light-emitting element of the embodiment of the present application and the conventional LED.
〔第3A圖〕繪示本申請案另一實施例之發光元件之上視示意圖。 [Fig. 3A] is a top plan view showing a light-emitting element of another embodiment of the present application.
〔第3B圖〕繪示本申請案另一實施例之發光元件之上視示意圖。 [Fig. 3B] is a top plan view showing a light-emitting element of another embodiment of the present application.
〔第4A圖〕繪示本申請案另一實施例之發光元件之上視示意圖。 [Fig. 4A] is a top plan view showing a light-emitting element of another embodiment of the present application.
〔第4B圖〕繪示本申請案另一實施例之發光元件之上視示意圖。 [Fig. 4B] is a top plan view showing a light-emitting element of another embodiment of the present application.
〔第4C圖〕繪示本申請案另一實施例之發光元件之上視示意圖。 [Fig. 4C] is a top plan view showing a light-emitting element of another embodiment of the present application.
〔第5A圖〕繪示本申請案另一實施例之發光元件之上視示意圖。 [Fig. 5A] is a top plan view showing a light-emitting element of another embodiment of the present application.
〔第5B圖〕繪示本申請案另一實施例之發光元件之上視示意圖。 [Fig. 5B] is a top plan view showing a light-emitting element of another embodiment of the present application.
〔第6圖〕繪示本申請案另一實施例之發光元件之上視示意圖。 [Fig. 6] Fig. 6 is a top plan view showing a light-emitting element of another embodiment of the present application.
〔第7圖〕繪示本申請案本申請案一實施例之燈泡分解示意圖。 [Fig. 7] is a schematic exploded view of a light bulb according to an embodiment of the present application.
本發明之實施例會被詳細地描述,並且繪製於圖式中,相同或類似的部分會以相同的號碼在各圖式以及說明出現。 The embodiments of the present invention will be described in detail, and in the drawings, the same or the like
第2A圖繪示本申請案一實施例之發光元件之上視示意圖,第2B圖繪示沿第2A圖之AA剖面線所視之發光元件之剖面示意圖。如第2B圖所示,一發光元件2具有一基板20;一發光疊層22,位於基板20之上;以及一透明導電層24位於發光疊層22之上,其中發光疊層22具有一第一半導體層220、一主動層222與一第二半導體層224依序形成於基板20之上。一第一溝槽25形成於透明導電層24與發光疊層22之中,曝露第一半導體層220之一第一上表面221,使得第一半導體層220以上之發光疊層22與透明導電層24分離形成一第一發光結構X與一第二發光結構Y。換言之,第一發光結構X與第二發光結構Y具有共同的第一半導體層220,但在第一半導體層220不同的區域之上具有各自的主動層222、第二半導體層224與透明導電層24。如第2A圖所示,第二溝槽27分別形成於第一發光結構X與第二發光結構Y之中,曝露第一上表面221。第一電極21位於第二溝槽27之中的第一上表面221之上,第二電極23位於透明導電層24之上。第一溝槽25位於第一發光結構X與第二發光結構Y之間,第一電極21與第二電極23皆位於第一溝槽25之外,即無電極位於第一溝槽25之中,使電流可以分別均勻地於第一發光結構X與第二發光結構Y擴散,提升發光元件2的發光效率,如第2E圖所示。由上視圖觀之,第一發光結構X與第二發光結構Y具有相同的外觀圖案。以本實施例為例,相同的外觀圖案係具有相同尺寸的長方形結構,以及相同 的電極設計與對稱的電極放置位置,有利於電流平均分佈以及後續打線製程的對位辨識。 2A is a top view of a light-emitting element according to an embodiment of the present application, and FIG. 2B is a schematic cross-sectional view of the light-emitting element taken along line AA of FIG. 2A. As shown in FIG. 2B, a light-emitting element 2 has a substrate 20; a light-emitting layer 22 is disposed on the substrate 20; and a transparent conductive layer 24 is disposed on the light-emitting layer 22, wherein the light-emitting layer 22 has a first A semiconductor layer 220, an active layer 222 and a second semiconductor layer 224 are sequentially formed on the substrate 20. A first trench 25 is formed in the transparent conductive layer 24 and the light emitting layer 22, exposing the first upper surface 221 of the first semiconductor layer 220, so that the light emitting layer 22 and the transparent conductive layer above the first semiconductor layer 220 24 separates to form a first light emitting structure X and a second light emitting structure Y. In other words, the first light emitting structure X and the second light emitting structure Y have a common first semiconductor layer 220, but have a respective active layer 222, a second semiconductor layer 224 and a transparent conductive layer over different regions of the first semiconductor layer 220. twenty four. As shown in FIG. 2A, the second trenches 27 are formed in the first light emitting structure X and the second light emitting structure Y, respectively, and expose the first upper surface 221. The first electrode 21 is located above the first upper surface 221 of the second trench 27, and the second electrode 23 is located above the transparent conductive layer 24. The first trench 21 is located between the first light emitting structure X and the second light emitting structure Y, and the first electrode 21 and the second electrode 23 are located outside the first trench 25, that is, the electrode is not located in the first trench 25 The current can be uniformly diffused uniformly to the first light emitting structure X and the second light emitting structure Y, respectively, to improve the light emitting efficiency of the light emitting element 2, as shown in FIG. 2E. Viewed from the top view, the first light emitting structure X and the second light emitting structure Y have the same appearance pattern. Taking this embodiment as an example, the same appearance pattern has a rectangular structure of the same size, and the same The electrode design and the symmetrical electrode placement position facilitate the average current distribution and the alignment of the subsequent wire bonding process.
第一電極21及/或第二電極23用以接受外部電壓,可由透明導電材料或金屬材料所構成。透明導電材料包含但不限於氧化銦錫(ITO)、氧化銦(InO)、氧化錫(SnO)、氧化鎘錫(CTO)、氧化銻錫(ATO)、氧化鋁鋅(AZO)、氧化鋅錫(ZTO)、氧化鎵鋅(GZO)、氧化銦鎢(IWO)、氧化鋅(ZnO)、砷化鋁鎵(AlGaAs)、氮化鎵(GaN)、磷化鎵(GaP)、砷化鎵(GaAs)、磷砷化鎵(GaAsP)、氧化銦鋅(IZO)或類鑽碳薄膜(DLC)。金屬材料包含但不限於鋁(Al)、鉻(Cr)、銅(Cu)、錫(Sn)、金(Au)、鎳(Ni)、鈦(Ti)、鉑(Pt)、鉛(Pb)、鋅(Zn)、鎘(Cd)、銻(Sb)、鈷(Co)或上述材料之合金等。第一電極21具有一第一打線部21A與自第一打線部21A延伸之複數個第一延伸部21B,第二電極23具有一第二打線部23A與自第二打線部23A延伸之複數個第二延伸部23B,其中第一打線部21A與第二打線部23A用以作為後續打線製程的打線位置,複數個第一延伸部21B與複數個第二延伸部23B用以傳導電流,增進電流擴散,提升發光元件2之發光效率。其中,至少一第一延伸部21B位於二第二延伸部23B之間,使電流均勻地擴散,避免電流聚集部分區域,減少發光的面積。第二半導體層224具有一第一側邊223與遠離第一側邊223之第二側邊225,其中第一打線部21A靠近第一側邊223,第二打線部23A靠近第二側邊225。第一打線部21A與第一側邊223之間具有一間距D,間距D約等於為第一打線部21A之尺寸。第一打線部21A之尺寸以圓形為例,D則為圓形之直徑大小,以長方型為例,間距D則約為長方形之長邊大小。因此,電流自第一打線部21A注入後可有效地擴散,提升發光元件2的發光效率。另一實施例中,間距D約為60微米至100微米。此外,至少一第一延伸部21B與其他第一延伸部21B延伸方向相異。以本實施例為例,一第一延伸部21B 向第一側邊223延伸,其他第一延伸部21B則向第二側邊225延伸,增進電流擴散,提升發光元件2之發光效率。 The first electrode 21 and/or the second electrode 23 are for receiving an external voltage and may be composed of a transparent conductive material or a metal material. Transparent conductive materials include, but are not limited to, indium tin oxide (ITO), indium oxide (InO), tin oxide (SnO), cadmium tin oxide (CTO), antimony tin oxide (ATO), aluminum zinc oxide (AZO), zinc tin oxide. (ZTO), gallium zinc oxide (GZO), indium tungsten oxide (IWO), zinc oxide (ZnO), aluminum gallium arsenide (AlGaAs), gallium nitride (GaN), gallium phosphide (GaP), gallium arsenide ( GaAs), phosphorus gallium arsenide (GaAsP), indium zinc oxide (IZO) or diamond-like carbon film (DLC). Metal materials include, but are not limited to, aluminum (Al), chromium (Cr), copper (Cu), tin (Sn), gold (Au), nickel (Ni), titanium (Ti), platinum (Pt), lead (Pb) , zinc (Zn), cadmium (Cd), antimony (Sb), cobalt (Co) or an alloy of the above materials. The first electrode 21 has a first wire bonding portion 21A and a plurality of first extending portions 21B extending from the first wire bonding portion 21A. The second electrode 23 has a second wire bonding portion 23A and a plurality of extending from the second wire bonding portion 23A. The second extending portion 23B, wherein the first wire bonding portion 21A and the second wire bonding portion 23A are used as the wire bonding position of the subsequent wire bonding process, and the plurality of first extending portions 21B and the plurality of second extending portions 23B are used for conducting current to increase current Diffusion enhances the luminous efficiency of the light-emitting element 2. The at least one first extending portion 21B is located between the two second extending portions 23B, so that the current is uniformly diffused, the current collecting portion is avoided, and the area of the light is reduced. The second semiconductor layer 224 has a first side 223 and a second side 225 away from the first side 223. The first wire portion 21A is adjacent to the first side 223, and the second wire portion 23A is adjacent to the second side 225. . The first wire bonding portion 21A and the first side edge 223 have a pitch D which is approximately equal to the size of the first wire bonding portion 21A. The size of the first wire-bonding portion 21A is exemplified by a circle, and D is a diameter of a circle. Taking a rectangular shape as an example, the pitch D is about the long side of the rectangle. Therefore, the current can be effectively diffused after being injected from the first wire bonding portion 21A, and the luminous efficiency of the light-emitting element 2 is improved. In another embodiment, the spacing D is from about 60 microns to about 100 microns. Further, at least one of the first extending portions 21B is different from the other first extending portions 21B. Taking this embodiment as an example, a first extension 21B Extending to the first side 223, the other first extending portion 21B extends toward the second side 225, thereby promoting current spreading and improving the luminous efficiency of the light-emitting element 2.
透明導電層24用以增加發光疊層22與第二電極23之間的歐姆接觸以及幫助電流擴散,以提升發光元件2之發光效率。透明導電層24對於發光疊層22所發之光為透明,其材料可為導電材料,包含但不限於氧化銦錫(ITO)、氧化銦(InO)、氧化錫(SnO)、氧化鎘錫(CTO)、氧化銻錫(ATO)、氧化鋁鋅(AZO)、氧化鋅錫(ZTO)、氧化鎵鋅(GZO)、氧化鋅(ZnO)、氧化鎂(MgO)、砷化鋁鎵(AlGaAs)、氮化鎵(GaN)、磷化鎵(GaP)或氧化銦鋅(IZO)。發光疊層22之材料可為半導體材料,包含一種以上之元素,此元素可選自鎵(Ga)、鋁(Al)、銦(In)、磷(P)、氮(N)、鋅(Zn)、鎘(Cd)與硒(Se)所構成之群組。第一半導體層220與第二半導體層224的電性相異,用以產生電子或電洞。另一實施例中,第二半導體層224具有一粗糙上表面,用以降低全反射,提升發光元件2之發光效率。主動層222可發出一種或多種色光,可為可見光或不可見光,其結構可為單異質結構、雙異質結構、雙側雙異質結構、多層量子井或量子點。 The transparent conductive layer 24 serves to increase the ohmic contact between the light-emitting layer 22 and the second electrode 23 and to facilitate current diffusion to improve the light-emitting efficiency of the light-emitting element 2. The transparent conductive layer 24 is transparent to the light emitted by the light-emitting layer 22, and the material thereof may be a conductive material, including but not limited to indium tin oxide (ITO), indium oxide (InO), tin oxide (SnO), and cadmium tin oxide ( CTO), antimony tin oxide (ATO), aluminum zinc oxide (AZO), zinc tin oxide (ZTO), gallium zinc oxide (GZO), zinc oxide (ZnO), magnesium oxide (MgO), aluminum gallium arsenide (AlGaAs) , gallium nitride (GaN), gallium phosphide (GaP) or indium zinc oxide (IZO). The material of the light-emitting layer 22 may be a semiconductor material containing more than one element selected from the group consisting of gallium (Ga), aluminum (Al), indium (In), phosphorus (P), nitrogen (N), and zinc (Zn). ), a group of cadmium (Cd) and selenium (Se). The first semiconductor layer 220 and the second semiconductor layer 224 are electrically different to generate electrons or holes. In another embodiment, the second semiconductor layer 224 has a rough upper surface for reducing total reflection and improving the luminous efficiency of the light-emitting element 2. The active layer 222 can emit one or more colored lights, which may be visible or invisible, and may be of a single heterostructure, a double heterostructure, a double-sided double heterostructure, a multilayer quantum well or a quantum dot.
基板20可用以支持位於其上之發光疊層22與其它層或結構,其材料可為透明材料或導電材料。透明材料包含但不限於藍寶石(Sapphire)、鑽石(Diamond)、玻璃(Glass)、環氧樹脂(Epoxy)、石英(Quartz)、壓克力(Acryl)、氧化鋁(Al2O3)、氧化鋅(ZnO)或氮化鋁(AlN)等。導電材料包含但不限於銅(Cu)、鋁(Al)、鉬(Mo)、錫(Sn)、鋅(Zn)、鎘(Cd)、鎳(Ni)、鈷(Co)、類鑽碳薄膜(Diamond Like Carbon;DLC)、石墨(Graphite)、碳纖維(Carbon fiber)、金屬基複合材料(Metal Matrix Composite;MMC)、陶瓷基複合材料(Ceramic Matrix Composite;CMC)、矽(Si)、磷化碘(IP)、硒化鋅(ZnSe)、砷化鎵(GaAs)、碳化矽(SiC)、磷化鎵(GaP)、磷砷化鎵(GaAsP)、硒化鋅(ZnSe)、 磷化銦(InP)、鎵酸鋰(LiGaO2)或鋁酸鋰(LiAlO2)。其中可用以成長發光疊層之材料例如為藍寶石、砷化鎵、碳化矽(SiC)或矽。基板20具有一圖案化上表面200,用以改善自基板20生長之磊晶的品質與散射發光疊層22所發之光,提升發光元件2之發光效率。 The substrate 20 can be used to support the light-emitting laminate 22 and other layers or structures thereon, the material of which can be a transparent material or a conductive material. Transparent materials include, but are not limited to, Sapphire, Diamond, Glass, Epoxy, Quartz, Acryl, Al2O3, Zinc Oxide (ZnO) ) or aluminum nitride (AlN) or the like. Conductive materials include, but are not limited to, copper (Cu), aluminum (Al), molybdenum (Mo), tin (Sn), zinc (Zn), cadmium (Cd), nickel (Ni), cobalt (Co), diamond-like carbon film (Diamond Like Carbon; DLC), Graphite, Carbon Fiber, Metal Matrix Composite (MMC), Ceramic Matrix Composite (CMC), Germanium (Si), Phosphating Iodine (IP), zinc selenide (ZnSe), gallium arsenide (GaAs), tantalum carbide (SiC), gallium phosphide (GaP), gallium arsenide (GaAsP), zinc selenide (ZnSe), Indium phosphide (InP), lithium gallate (LiGaO2) or lithium aluminate (LiAlO2). Materials in which the light-emitting laminate can be grown are, for example, sapphire, gallium arsenide, tantalum carbide (SiC) or tantalum. The substrate 20 has a patterned upper surface 200 for improving the quality of the epitaxial growth from the substrate 20 and the light emitted by the light-emitting layer 22, thereby improving the luminous efficiency of the light-emitting element 2.
第2C~2D圖繪示另一實施例之發光元件2’之製造流程圖。如第2C圖所示,基板20之上形成發光疊層22,移除部份第二半導體層224與主動層222,形成第一溝槽25與第二溝槽27,曝露第一半導體層220之第一上表面221,其中第一溝槽25將第二半導體層224與主動層222分隔為第一發光結構X與第二發光結構Y,二第二溝槽27分別位於第一發光結構X與第二發光結構Y之中。如第2D圖所示,形成透明導電層24於第二半導體層224之上,再形成第一電極21於第二溝槽27之中,以及第二電極23於透明導電層24之上,以形成發光元件2’。 2C to 2D are views showing a manufacturing flow chart of the light-emitting element 2' of another embodiment. As shown in FIG. 2C, a light-emitting layer 22 is formed on the substrate 20, and a portion of the second semiconductor layer 224 and the active layer 222 are removed to form a first trench 25 and a second trench 27 to expose the first semiconductor layer 220. a first upper surface 221, wherein the first trench 25 separates the second semiconductor layer 224 from the active layer 222 into a first light emitting structure X and a second light emitting structure Y, and the second trenches 27 are respectively located in the first light emitting structure X And the second light emitting structure Y. As shown in FIG. 2D, a transparent conductive layer 24 is formed on the second semiconductor layer 224, a first electrode 21 is formed in the second trench 27, and a second electrode 23 is over the transparent conductive layer 24. A light-emitting element 2' is formed.
第3A圖與第3B圖繪示另一實施例之發光元件3與3’之上視示意圖。如第3A圖所示,發光元件3具有發光元件2之類似結構,且更具有一第三溝槽31與一第四溝槽33,曝露第一上表面221,其中第三溝槽31與第四溝槽33不平行於第一溝槽25與第二溝槽27,所以第三溝槽31與第四溝槽33和第一溝槽25與第二溝槽27交錯,使得第一發光結構X與第二發光結構Y分別被分隔成複數個面積較小的發光區域。複數個第一橋接部30分別位於第一發光結構X與第二發光結構Y被分隔的複數個發光區域之間,且位於第三溝槽31與第四溝槽33之中,用以連接複數個發光區域,使得複數個第二延伸部23B可通過複數個第一橋接部30之上以延伸至複數個發光區域,將電流傳導至複數個發光區域。由於第一發光結構X與第二發光結構Y分別被分隔成複數個面積較小的發光區域,電流經由複數個第二延伸部23B傳導於每個發光區域,可於複數個面積較小的發光區域均勻地擴散,提升發光元件3的發 光效率。如第3B圖所示,發光元件3’具有發光元件2之類似結構,其中第二溝槽27將第一發光結構X與第二發光結構Y分別被分隔成複數個面積較小的發光區域,電絕緣層32形成於第二溝槽27之中與發光區域之上,遠離第一打線區21A,第二打線部23A形成於電絕緣層32之上,第二延伸部23B位於電絕緣層32之上且延伸至複數個發光區域。由於第一發光結構X與第二發光結構Y分別被分隔成複數個面積較小的發光區域,電流經由複數個第二延伸部23B傳導於每個發光區域,可於複數個面積較小的發光區域均勻地擴散,提升發光元件3’的發光效率。上述實施例中,第一橋接部30及/或電絕緣層32可電絕緣第二電極23與第一半導體層220,其材料可為電絕緣材料,例如為聚亞醯胺(PI)、苯并環丁烯(BCB)、過氟環丁烷(PFCB)、氧化鎂(MgO)、Su8、環氧樹脂(Epoxy)、丙烯酸樹脂(Acrylic Resin)、環烯烴聚合物(COC)、聚甲基丙烯酸甲酯(PMMA)、聚對苯二甲酸乙二酯(PET)、聚碳酸酯(PC)、聚醚醯亞胺(Polyetherimide)、氟碳聚合物(Fluorocarbon Polymer)、玻璃(Glass)、氧化鋁(Al2O3)、氧化矽(SiOx)、氧化鈦(TiO2)、氧化鉭(Ta2O5)、氮化矽(SiNx)、氟化鎂(MgF2)、旋塗玻璃(SOG)或四乙氧基矽烷(TEOS)。 3A and 3B are schematic top views of the light-emitting elements 3 and 3' of another embodiment. As shown in FIG. 3A, the light-emitting element 3 has a similar structure of the light-emitting element 2, and further has a third trench 31 and a fourth trench 33 exposing the first upper surface 221, wherein the third trench 31 and the third trench The four trenches 33 are not parallel to the first trenches 25 and the second trenches 27, so the third trenches 31 and the fourth trenches 33 and the first trenches 25 are interleaved with the second trenches 27 such that the first light emitting structure The X and the second light emitting structure Y are respectively separated into a plurality of light emitting regions having a small area. The plurality of first bridges 30 are respectively located between the plurality of light-emitting regions where the first light-emitting structure X and the second light-emitting structure Y are separated, and are located in the third trench 31 and the fourth trench 33 for connecting the plurality of The plurality of second extending portions 23B are extendable over the plurality of first bridging portions 30 to extend to the plurality of light emitting regions to conduct current to the plurality of light emitting regions. Since the first light emitting structure X and the second light emitting structure Y are respectively separated into a plurality of light emitting regions having a small area, current is conducted to each of the light emitting regions via the plurality of second extending portions 23B, and the plurality of small areas are illuminated. The area spreads evenly to enhance the emission of the light-emitting element 3 Light efficiency. As shown in FIG. 3B, the light-emitting element 3' has a similar structure of the light-emitting element 2, wherein the second trench 27 separates the first light-emitting structure X and the second light-emitting structure Y into a plurality of light-emitting regions having a small area, respectively. The electrically insulating layer 32 is formed in the second trench 27 and above the light emitting region, away from the first bonding region 21A, the second wiring portion 23A is formed on the electrically insulating layer 32, and the second extension portion 23B is located on the electrically insulating layer 32. It extends above and extends to a plurality of light-emitting areas. Since the first light emitting structure X and the second light emitting structure Y are respectively separated into a plurality of light emitting regions having a small area, current is conducted to each of the light emitting regions via the plurality of second extending portions 23B, and the plurality of small areas are illuminated. The region spreads evenly, improving the luminous efficiency of the light-emitting element 3'. In the above embodiment, the first bridging portion 30 and/or the electrically insulating layer 32 may electrically insulate the second electrode 23 and the first semiconductor layer 220, and the material thereof may be an electrically insulating material, such as polyiminamide (PI) or benzene. And cyclobutene (BCB), perfluorocyclobutane (PFCB), magnesium oxide (MgO), Su8, epoxy resin (Epoxy), acrylic resin (Acrylic Resin), cycloolefin polymer (COC), polymethyl Methyl acrylate (PMMA), polyethylene terephthalate (PET), polycarbonate (PC), polyetherimide, fluorocarbon polymer, glass, oxidation Aluminum (Al2O3), yttrium oxide (SiOx), titanium oxide (TiO2), lanthanum oxide (Ta2O5), tantalum nitride (SiNx), magnesium fluoride (MgF2), spin-on glass (SOG) or tetraethoxy decane ( TEOS).
第4A圖與第4B圖繪示另一實施例之發光元件4與4’之上視示意圖。一發光元件4之結構類似發光元件2,具有基板20;發光疊層22,位於基板20之上;以及透明導電層24位於發光疊層22之上,其中發光疊層22具有第一半導體層220、主動層222與第二半導體層224依序形成於基板20之上。如第4A圖所示,一第一溝槽41形成於透明導電層24與發光疊層22之中,曝露第一上表面221,使得第一半導體層220以上之發光疊層22與透明導電層24大致分離形成第一發光結構X與第二發光結構Y。本實施例中,形成第一溝槽41時未完全移除發光疊層22與透明導電層24,保留部分發光疊 層22與透明導電層24以形成一第一橋接部40,用以連接第一發光結構X與第二發光結構Y。第一電極21形成於第一溝槽41之中;第二電極23形成於第一橋接部40之上,將電流傳導至第一發光結構X與第二發光結構Y,因為第一發光結構X與第二發光結構Y之間具有較小的發光疊層面積,電流可分別均勻地擴散第一發光結構X與第二發光結構Y,提升發光元件4的發光效率。由上視圖觀之,第一發光結構X與第二發光結構Y具有相同的外觀圖案。以本實施例為例,相同的外觀圖案係具有具有相同尺寸的長方形結構,以及相同的電極設計與對稱的電極放置位置,有利於電流平均分佈以及後續打線製程的對位辨識。 4A and 4B are schematic top views of the light-emitting elements 4 and 4' of another embodiment. A light-emitting element 4 is similar in structure to the light-emitting element 2, having a substrate 20; a light-emitting layer 22 on top of the substrate 20; and a transparent conductive layer 24 on the light-emitting layer 22, wherein the light-emitting layer 22 has a first semiconductor layer 220 The active layer 222 and the second semiconductor layer 224 are sequentially formed on the substrate 20. As shown in FIG. 4A, a first trench 41 is formed in the transparent conductive layer 24 and the light emitting laminate 22, exposing the first upper surface 221 such that the light emitting layer 22 and the transparent conductive layer above the first semiconductor layer 220 24 is substantially separated to form the first light emitting structure X and the second light emitting structure Y. In this embodiment, the light-emitting layer 22 and the transparent conductive layer 24 are not completely removed when the first trench 41 is formed, and a partial light-emitting stack is retained. The layer 22 and the transparent conductive layer 24 are formed to form a first bridge portion 40 for connecting the first light emitting structure X and the second light emitting structure Y. The first electrode 21 is formed in the first trench 41; the second electrode 23 is formed on the first bridge portion 40 to conduct current to the first light emitting structure X and the second light emitting structure Y because the first light emitting structure X There is a small light-emitting layer area between the second light-emitting structure Y and the second light-emitting structure Y, and the current can uniformly diffuse the first light-emitting structure X and the second light-emitting structure Y, respectively, and improve the light-emitting efficiency of the light-emitting element 4. Viewed from the top view, the first light emitting structure X and the second light emitting structure Y have the same appearance pattern. Taking this embodiment as an example, the same appearance pattern has a rectangular structure having the same size, and the same electrode design and symmetric electrode placement position are favorable for the current average distribution and the alignment identification of the subsequent wire bonding process.
如第4B圖所示,發光元件4’具有發光元件4之類似結構,且更具有一第二溝槽43與一第三溝槽45,曝露第一上表面221,其中第二溝槽43與第三溝槽45不平行於第一溝槽41,所以第二溝槽43與第三溝槽45和第一溝槽41交錯,使得第一發光結構X與第二發光結構Y分別被分隔成複數個面積較小的發光區域。複數個第二橋接部42位於第一發光結構X與第二發光結構Y被分隔的複數個發光區域之間,且分別位於第二溝槽43與第三溝槽45之中,用以連接複數個發光區域。第二溝槽43被複數個第二橋接部42分成一第一區431與一第二區432,第二橋接部42位於第一區431與第二區432之間。第三溝槽45被複數個第二橋接部42分成一第三區451與一第四區452,第二橋接部42位於第三區451與第四區452之間。本實施例中,形成第二溝槽43與第三溝槽45時未完全移除發光疊層22與透明導電層24,保留部分發光疊層22與透明導電層24以形成複數個第二橋接部42。複數個第二延伸部23B可通過複數個第二橋接部42之上以延伸至複數個發光區域,將電流傳導至複數個發光區域。由於第一發光結構X與第二發光結構Y分別被分隔成複數個面積較小的發光區域,電流經由複數個第二延伸部23B傳導於每個 發光區域,可於複數個面積較小的發光區域均勻地擴散,提升發光元件4’的發光效率。如第4C圖所示,發光元件4”,具有發光元件4之類似結構,更具有一曝露部47圍繞第一發光結構X與第二發光結構Y而形成,曝露第一上表面221,其中部分曝露部47不平行於第一溝槽41,另一部分曝露部47平行於第一溝槽41。第二電極23形成於第一橋接部40、第一發光結構X與第二發光結構Y之上,第一電極21形成於曝露部47之中,複數個第一延伸部21B沿曝露部47延伸,電流可分別均勻地擴散第一發光結構X與第二發光結構Y,提升發光元件4”的發光效率。 As shown in FIG. 4B, the light-emitting element 4' has a similar structure of the light-emitting element 4, and further has a second trench 43 and a third trench 45 exposing the first upper surface 221, wherein the second trench 43 is The third trench 45 is not parallel to the first trench 41, so the second trench 43 is interleaved with the third trench 45 and the first trench 41 such that the first light emitting structure X and the second light emitting structure Y are respectively separated into A plurality of light-emitting areas having a small area. The plurality of second bridge portions 42 are located between the plurality of light-emitting regions where the first light-emitting structure X and the second light-emitting structure Y are separated, and are respectively located in the second trench 43 and the third trench 45 for connecting the plurality of the plurality of light-emitting regions Light-emitting areas. The second trench 43 is divided into a first region 431 and a second region 432 by a plurality of second bridge portions 42 , and the second bridge portion 42 is located between the first region 431 and the second region 432 . The third trench 45 is divided by the plurality of second bridges 42 into a third region 451 and a fourth region 452, and the second bridge portion 42 is located between the third region 451 and the fourth region 452. In this embodiment, the light-emitting layer 22 and the transparent conductive layer 24 are not completely removed when the second trench 43 and the third trench 45 are formed, and the partial light-emitting layer 22 and the transparent conductive layer 24 are left to form a plurality of second bridges. Part 42. The plurality of second extensions 23B may extend over the plurality of second bridges 42 to extend to the plurality of illumination regions to conduct current to the plurality of illumination regions. Since the first light emitting structure X and the second light emitting structure Y are respectively divided into a plurality of light emitting regions having a small area, current is conducted to each of the plurality of second extending portions 23B. The light-emitting region can be uniformly diffused in a plurality of light-emitting regions having a small area to enhance the light-emitting efficiency of the light-emitting element 4'. As shown in FIG. 4C, the light-emitting element 4" has a similar structure of the light-emitting element 4, and an exposed portion 47 is formed around the first light-emitting structure X and the second light-emitting structure Y to expose the first upper surface 221, wherein a portion thereof The exposed portion 47 is not parallel to the first trench 41, and the other portion of the exposed portion 47 is parallel to the first trench 41. The second electrode 23 is formed on the first bridge portion 40, the first light emitting structure X and the second light emitting structure Y The first electrode 21 is formed in the exposed portion 47, and the plurality of first extending portions 21B extend along the exposed portion 47, and the current can uniformly diffuse the first light emitting structure X and the second light emitting structure Y, respectively, to enhance the light emitting element 4" Luminous efficiency.
第5A圖與第5B圖繪示另一實施例之發光元件5與5’之上視示意圖。如第5A圖所示,發光元件5具有發光元件2之類似結構,一第一溝槽50形成於透明導電層24與發光疊層22之中,曝露第一上表面221,使得第一半導體層220以上之發光疊層22與透明導電層24大致分離形成第一發光結構X與第二發光結構Y。本實施例中,形成第一溝槽50時未完全移除發光疊層22與透明導電層24,保留部分發光疊層22與透明導電層24以形成一第一橋接部54,用以連接第一發光結構X與第二發光結構Y。第二溝槽27分別形成於第一發光結構X與第二發光結構Y之中,曝露第一上表面221。第一電極21位於第二溝槽27之中的第一上表面221之上,第二電極23位於透明導電層24之上。一第三溝槽52形成於透明導電層24與發光疊層22之中,曝露第一上表面221,其中第三溝槽52不平行於第一溝槽50,所以第三溝槽52和第一溝槽50交錯。一第一連接線51形成於第三溝槽52之中,電連接分別位於第一發光結構X與第二發光結構Y之第一打線部21A。一第二連接線53形成於第一橋接部54、第一發光結構X與第二發光結構Y之上,電連接分別位於第一發光結構X與第二發光結構Y之第二打線部23A。第一連接線51與第二連接線53分別電連接位於第一發光結構X與第二發光結構Y之第一打線部21A 與第二打線部23A,導致電流均勻地分佈於第一發光結構X與第二發光結構Y,提升發光元件5的發光效率。由上視圖觀之,第一發光結構X與第二發光結構Y具有相同的外觀圖案。以本實施例為例,相同的外觀圖案係具有相同尺寸的長方形結構,以及相同的電極設計與對稱的電極放置位置,有利於電流平均分佈以及後續打線製程的對位辨識。如第5B圖所示,發光元件5’具有發光元件5之類似結構,第三溝槽52形成於第一發光結構X與第二發光結構Y,且靠近第一側邊223,減少形成第三溝槽52所需移除的發光疊層22,避免減少發光區域的面積。 5A and 5B are schematic top views of the light-emitting elements 5 and 5' of another embodiment. As shown in FIG. 5A, the light-emitting element 5 has a similar structure of the light-emitting element 2, and a first trench 50 is formed in the transparent conductive layer 24 and the light-emitting layer 22 to expose the first upper surface 221 such that the first semiconductor layer The light-emitting layer 22 of 220 or more is substantially separated from the transparent conductive layer 24 to form the first light-emitting structure X and the second light-emitting structure Y. In this embodiment, the light-emitting layer 22 and the transparent conductive layer 24 are not completely removed when the first trench 50 is formed, and the partial light-emitting layer 22 and the transparent conductive layer 24 are left to form a first bridge portion 54 for connecting A light emitting structure X and a second light emitting structure Y. The second trenches 27 are respectively formed in the first light emitting structure X and the second light emitting structure Y to expose the first upper surface 221. The first electrode 21 is located above the first upper surface 221 of the second trench 27, and the second electrode 23 is located above the transparent conductive layer 24. A third trench 52 is formed in the transparent conductive layer 24 and the light emitting laminate 22 to expose the first upper surface 221, wherein the third trench 52 is not parallel to the first trench 50, so the third trench 52 and the A groove 50 is staggered. A first connecting line 51 is formed in the third trench 52, and is electrically connected to the first wiring portion 21A of the first light emitting structure X and the second light emitting structure Y, respectively. A second connecting line 53 is formed on the first bridge portion 54, the first light emitting structure X and the second light emitting structure Y, and is electrically connected to the second light emitting portion 23A of the first light emitting structure X and the second light emitting structure Y, respectively. The first connecting line 51 and the second connecting line 53 are electrically connected to the first wiring portion 21A of the first light emitting structure X and the second light emitting structure Y, respectively. With the second wire bonding portion 23A, current is uniformly distributed in the first light emitting structure X and the second light emitting structure Y, and the light emitting efficiency of the light emitting element 5 is improved. Viewed from the top view, the first light emitting structure X and the second light emitting structure Y have the same appearance pattern. Taking this embodiment as an example, the same appearance pattern has a rectangular structure of the same size, and the same electrode design and symmetrical electrode placement position are favorable for the current average distribution and the alignment identification of the subsequent wire bonding process. As shown in FIG. 5B, the light-emitting element 5' has a similar structure of the light-emitting element 5, and the third trench 52 is formed on the first light-emitting structure X and the second light-emitting structure Y, and is close to the first side 223, and is reduced to form a third The light-emitting laminate 22 to be removed by the trenches 52 avoids reducing the area of the light-emitting region.
第6圖繪示另一實施例之發光元件6之上視示意圖。如第6圖所示,發光元件6具有發光元件2之類似結構,一第一溝槽60形成於透明導電層24與發光疊層22之中,曝露第一上表面221,使得第一半導體層220以上之發光疊層22與透明導電層24大致分離形成第一發光結構X與第二發光結構Y。第二溝槽62分別形成於第一發光結構X與第二發光結構Y之中,曝露第一上表面221。一曝露部64圍繞第一發光結構X與第二發光結構Y而形成,曝露第一上表面221,其中部分曝露部64不平行於第一溝槽60,另一部分曝露部64平行於第一溝槽60。第二電極23形成於第一發光結構X與第二發光結構Y之上,第一打線部21A形成於曝露部64之上,複數個第一延伸部21B沿曝露部64與第一溝槽60延伸,電流可分別均勻地擴散第一發光結構X與第二發光結構Y,提升發光元件6整體的發光效率。由上視圖觀之,第一發光結構X與第二發光結構Y具有相同的外觀圖案。以本實施例為例,相同的外觀圖案係具有具有相同尺寸的長方形結構,以及相同的電極設計與對稱的電極放置位置,有利於電流平均分佈以及後續打線製程的對位辨識。 FIG. 6 is a schematic top view of a light-emitting element 6 of another embodiment. As shown in FIG. 6, the light-emitting element 6 has a similar structure of the light-emitting element 2, and a first trench 60 is formed in the transparent conductive layer 24 and the light-emitting layer 22, exposing the first upper surface 221 so that the first semiconductor layer The light-emitting layer 22 of 220 or more is substantially separated from the transparent conductive layer 24 to form the first light-emitting structure X and the second light-emitting structure Y. The second trenches 62 are respectively formed in the first light emitting structure X and the second light emitting structure Y to expose the first upper surface 221 . An exposed portion 64 is formed around the first light emitting structure X and the second light emitting structure Y, exposing the first upper surface 221, wherein the partial exposed portion 64 is not parallel to the first trench 60, and the other portion of the exposed portion 64 is parallel to the first trench Slot 60. The second electrode 23 is formed on the first light emitting structure X and the second light emitting structure Y. The first wire drawing portion 21A is formed on the exposed portion 64, and the plurality of first extending portions 21B are along the exposed portion 64 and the first groove 60. The current can uniformly diffuse the first light emitting structure X and the second light emitting structure Y, respectively, to improve the luminous efficiency of the entire light emitting element 6. Viewed from the top view, the first light emitting structure X and the second light emitting structure Y have the same appearance pattern. Taking this embodiment as an example, the same appearance pattern has a rectangular structure having the same size, and the same electrode design and symmetric electrode placement position are favorable for the current average distribution and the alignment identification of the subsequent wire bonding process.
第7圖係繪示出一燈泡分解示意圖,一燈泡7具有一燈罩71;一透鏡72,置於燈罩71之中;一照明模組74,位於透鏡72之下;一燈座75,具 有一散熱槽76,用以承載照明模組74;一連結部77;以及一電連結器78,其中連結部77連結燈座75與電連結器78。照明模組74具有一載體73;以及複數個前述任一實施例之發光元件70,位於載體73之上。 Figure 7 is a schematic exploded view of a bulb, a bulb 7 having a lamp cover 71; a lens 72 disposed in the lamp cover 71; a lighting module 74 located below the lens 72; a lamp holder 75 having There is a heat sink 76 for carrying the lighting module 74; a connecting portion 77; and an electrical connector 78, wherein the connecting portion 77 connects the socket 75 and the electrical connector 78. The illumination module 74 has a carrier 73; and a plurality of the light-emitting elements 70 of any of the foregoing embodiments are located above the carrier 73.
惟上述實施例僅為例示性說明本申請案之原理及其功效,而非用於限制本申請案。任何本申請案所屬技術領域中具有通常知識者均可在不違背本申請案之技術原理及精神的情況下,對上述實施例進行修改及變化。因此本申請案之權利保護範圍如後述之申請專利範圍所列。 However, the above embodiments are merely illustrative of the principles and effects of the present application, and are not intended to limit the present application. Modifications and variations of the above-described embodiments can be made without departing from the spirit and scope of the invention. Therefore, the scope of protection of the present application is as set forth in the scope of the patent application described below.
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