TWI632647B - Packaging process and package substrate for use in the process - Google Patents

Abstract

A package substrate system includes a dielectric layer, a first circuit layer provided on the dielectric layer, and a support plate coupled to the dielectric layer and the first circuit layer through an insulating layer to pass the insulation through The layer has the property of recovering the viscosity after being soaked in a solvent, so after the packaging substrate completes the packaging process, the supporting board and the insulating layer can be reused to avoid wasting the supporting board.

Description

Packaging process and packaging substrate used therefor

The present invention relates to a packaging process, and more particularly to a packaging process and a packaging substrate that save resources.

With the vigorous development of the electronics industry, electronic products are gradually moving towards the trend of multifunctional and high performance. In order to improve the wiring accuracy of multi-layer circuit boards, the industry has developed a build-up technology, that is, multiple layers of dielectric are stacked alternately on the two surfaces of a core board using line build-up technology. Layer and circuit layer, and a conductive via is provided in the dielectric layer for electrical connection between upper and lower layers. Further, in order to meet the needs of miniaturization, a coreless packaging technology has been developed.

FIG. 1 is a schematic cross-sectional view of a conventional coreless package substrate 1. As shown in FIG. 1, the package substrate 1 includes a dielectric layer 10, a first circuit layer 11 and a second circuit layer 12 formed on the dielectric layer 10 and a lower side thereof, and a dielectric layer formed on the dielectric layer 10. 10 and a solder mask layer 13 on the second circuit layer 12, wherein a plurality of conductive blind holes 100 are formed in the dielectric layer 10 to electrically connect the first and second circuit layers 11 and 12, and A plurality of openings 130 are formed in the solder resist layer 13 to expose the electrical contact pads 120 of the second circuit layer 12.

Since the package substrate 1 has no core layer, its plate thickness is relatively thin. Therefore, problems such as difficulty in transportation and warpage of the board are easy to occur before the packaging process (that is, setting the wafer). Therefore, process consumables (that is, a hard board 3 with a copper layer 30, such as a copper foil substrate) and a conductive layer 110 used to make the first circuit layer 11 are reserved on the lower side of the package substrate 1 to increase the package substrate. The structural strength of 1 prevents the package substrate 1 from being difficult to transport, warping or cracking.

However, it is known that after the packaging substrate 1 is packaged, the copper layer 30 is removed to separate the hard board 3 from the packaging substrate 1. Therefore, the separated hard board 3 needs to be discarded, thus causing the hard board 3 to be wasted. problem.

Therefore, how to overcome the problems of the above-mentioned conventional technologies has become an urgent problem to be solved.

In view of the various shortcomings of the above-mentioned conventional technologies, the present invention provides a package substrate including: a dielectric layer having a first surface and a second surface opposite to each other; and a first circuit layer provided in a first layer of the dielectric layer. A surface; and a support plate, which is bonded to the first surface of the dielectric layer through an insulating layer.

The present invention further provides a packaging process, which includes: providing a packaging substrate as described above; bonding at least one electronic component to a second surface of the dielectric layer; and supporting the support plate and the insulating layer from the dielectric layer. Separated on the first surface.

In the aforementioned packaging process, the manufacturing method of the packaging substrate includes: providing A carrier of the first circuit layer is formed on the surface; the dielectric layer is formed on the carrier and the first circuit layer, wherein the dielectric layer is bonded to the carrier by its first surface; and The supporting plate is bonded to the first surface of the dielectric layer by using the insulating layer.

In the aforementioned packaging process, the electronic component is an active component, a passive component, or a combination thereof.

In the aforementioned packaging process, the electronic component is bonded to the second surface through a plurality of conductive components.

In the aforementioned packaging process, the method further includes separating the supporting plate from the dielectric layer, and then bonding the supporting plate to another dielectric layer. For example, the insulating layer is immersed in a solvent to make the insulating layer tacky to bind the other dielectric layer.

In the aforementioned packaging substrate and packaging process, the surface of the first circuit layer is flush or lower than the first surface of the dielectric layer.

In the aforementioned packaging substrate and packaging process, the material forming the supporting plate is a paper substrate, a composite substrate, or a FR-4 substrate.

In the aforementioned packaging substrate and packaging process, the material forming the insulating layer is gel, and the material forming the insulating layer is elastomer.

In the aforementioned packaging substrate and packaging process, the packaging substrate further includes a second circuit layer disposed on the second surface of the dielectric layer. The package substrate further includes a plurality of conductive blind holes formed in the dielectric layer, so as to electrically connect the first and second circuit layers through the conductive blind holes. The package substrate further includes an insulation protection layer, which is disposed on the second surface of the dielectric layer and the second circuit layer, and the second circuit layer is partially exposed on the insulation protection layer.

It can be known from the above that, in the packaging substrate and the packaging process of the present invention, the design of the insulating layer allows the insulating layer to recover its viscosity after being soaked in a solvent, so the present invention can reuse the The support plate and the insulation layer are used to avoid the problem of wasting caused by the conventional use of the support plate and discarding it.

1,2‧‧‧package substrate

10,20,20’‧‧‧Dielectric layer

100,200‧‧‧ conductive blind hole

11,21‧‧‧First circuit layer

110‧‧‧ conductive layer

12,22‧‧‧Second circuit layer

120,220‧‧‧electric contact pad

13‧‧‧Solder Mask

130,230‧‧‧opening

20a‧‧‧first surface

20b‧‧‧Second surface

23‧‧‧Insulation protective layer

24‧‧‧ support plate

240‧‧‧ Insulation

3‧‧‧ rigid board

30‧‧‧ Copper

4‧‧‧ Bearing

40‧‧‧metal layer

40’‧‧‧ copper foil

9‧‧‧electronic package structure

90‧‧‧Electronic components

91‧‧‧ conductive element

Figure 1 is a schematic sectional view of a conventional packaging substrate; Figures 2A to 2E are schematic sectional views of a method for manufacturing a packaging substrate of the present invention; and Figures 3A to 3C are schematic sectional views of a packaging process of the present invention .

The following describes the implementation of the present invention through specific embodiments. Those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification.

It should be noted that the structures, proportions, sizes, etc. shown in the drawings in this specification are only used to match the content disclosed in the specification for the understanding and reading of those skilled in the art, and are not intended to limit the implementation of the present invention. The limited conditions are not technically significant. Any modification of the structure, change of the proportional relationship, or adjustment of the size should still fall within the scope of this invention without affecting the effects and goals that can be achieved by the present invention. The technical content disclosed by the invention can be covered. At the same time, the terms such as "upper", "first", "second", and "one" cited in this specification are only for the convenience of description, and are not intended to limit the scope of the present invention. Changes or adjustments in their relative relationships shall be considered to be the scope of the present invention without substantial changes in the technical content.

Figures 2A to 2E are schematic cross-sectional views of a method for manufacturing a package substrate 2 according to the present invention.

As shown in FIG. 2A, a supporting member 4 is provided. The supporting member 4 is an insulating plate, a ceramic plate, a copper foil substrate, a glass plate, or the like.

In this embodiment, the carrier 4 is a copper foil substrate, a copper foil 40 'is provided on the upper and lower surfaces, and a metal layer 40 is formed on each of the copper foils 40' as a conductive layer. The thickness of the metal layer 40 is 2 micrometers (μm), and the thickness of the copper foil 40 'is 18 micrometers (μm).

As shown in FIG. 2B, a first circuit layer 21 is formed by electroplating on the metal layer 40 above and below the carrier 4.

As shown in FIG. 2C, a dielectric layer 20 is formed on the carrier 4 and the first circuit layer 21, and the dielectric layer 20 has a first surface 20a and a second surface 20b opposite to each other, so that the dielectric The first surface 20 a of the layer 20 is in contact with the metal layer 40, and the first circuit layer 21 is embedded in the dielectric layer 20. Next, a second circuit layer 22 is formed on the second surface 20 b of the dielectric layer 20, and a plurality of conductive blind holes 200 are formed in the dielectric layer 20 to electrically connect the first and second circuit layers 21. ,twenty two.

In this embodiment, the material of the dielectric layer 20 is a prepreg, and the second circuit layer 22 has a plurality of electrical contact pads 220.

Furthermore, an insulating protection layer 23 is formed on the second surface 20b of the dielectric layer 20 and the second circuit layer 22, and the insulating protection layer 23 is formed with a plurality of openings 230 so that each of the electrical contact pads 220 is exposed at each of the openings 230.

As shown in FIG. 2D, the carrier 4 and its metal layer 40 and copper foil 40 'are removed, and the first surface 20a of the dielectric layer 20 and the first circuit layer 21 are exposed.

As shown in FIG. 2E, a supporting plate 24 is bonded to the first surface 20 a of the dielectric layer 20 and the first circuit layer 21 by using an insulating layer 240.

In this embodiment, the material forming the support plate 24 is a polymer, for example, polyethylene, polypropylene, polyethylene terephthalate (PET for short), a paper substrate, a composite substrate, or FR-4 substrate, and the material forming the insulating layer 240 is a colloid or an elastomer (for example, nitrile rubber (NBR), neoprene, or a silicone rubber compound) ). Specifically, the supporting plate 24 may be PET, and the insulating layer 240 may be a silicone rubber elastomer.

In the subsequent packaging process, the packaging substrate 2 shown in FIG. 2E is used to perform the packaging process of the present invention shown in FIGS. 3A to 3C.

As shown in FIG. 3A, at least one electronic component 90 is coupled to the electrical contact pads 220 through a plurality of conductive components 91, and then a packaging gel (not shown) for fixing the electronic component 90 is formed to form an electronic package. Structure 9.

In this embodiment, the conductive component 91 is, for example, a copper pillar or a solder bump, and the electronic component 90 is an active component, a passive component, or a combination of both. The active component is, for example, a semiconductor wafer, and the passive component is The components are, for example, resistors, capacitors, and inductors.

As shown in FIG. 3B, the insulating layer 240 is detached from the first surface 20a of the dielectric layer 20 mechanically or physically, so that the supporting plate 24 and the insulation layer 240 are separated from the first surface 20a of the dielectric layer 20, that is, the support plate 24 and the electronic packaging structure 9 are separated.

As shown in FIG. 3C, the support plate 24 and the insulation layer 240 are recovered, and the support plate 24 and the insulation layer 240 are reused.

In this embodiment, the separated insulating layer 240 is immersed in a solvent to restore the viscosity of the insulating layer 240 so that the supporting plate 24 can be bonded to another dielectric layer 20 'through the insulating layer 240. on.

In this embodiment, the type of the solvent can be matched with the insulating layer 240 to restore the viscosity of the insulating layer 240. Therefore, the solvent can be a non-polar organic solvent, such as gasoline (Gasoline). , Motor oil, Diesel fuel, Benzene, or Toluene.

The present invention provides a package substrate 2 including: a dielectric layer 20, a first circuit layer 21 and a support plate 24.

The dielectric layer 20 has a first surface 20a and a second surface 20b opposite to each other.

The first circuit layer 21 is disposed on the first surface 20 a of the dielectric layer 20, and its surface is flush or lower than the first surface 20 a of the dielectric layer 20.

The supporting plate 24 has an insulating layer 240 to be bonded to the first surface 20 a of the dielectric layer 20 and the first circuit layer 21, and the material forming the insulating layer 240 is gel.

In one embodiment, the material forming the supporting plate 24 is a paper substrate, a composite substrate or a FR-4 substrate.

In one embodiment, the package substrate 2 further includes a dielectric layer 20. The second circuit layer 22 on the second surface 20b. The package substrate 2 further includes a plurality of conductive blind holes 200 formed in the dielectric layer 20 to electrically connect the first and second circuit layers 21 and 22. The package substrate 2 further includes an insulating protection layer 23 disposed on the second surface 20b of the dielectric layer 20 and the second circuit layer 22, and the insulating protection layer 23 is formed with a plurality of exposed portions of the second circuit layer. 22 的 开孔 230。 22 of the opening 230.

In summary, in the packaging substrate and the packaging process of the present invention, the design of the insulating layer is mainly used to restore the viscosity of the insulating layer after soaking the solvent, so the supporting board and the insulating layer can be reused to Avoid the problem of waste caused by discarding after using the support plate.

The above embodiments are used to exemplify the principle of the present invention and its effects, but not to limit the present invention. Anyone skilled in the art can modify the above embodiments without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the rights of the present invention should be listed in the scope of patent application described later.

Claims (20)

A package substrate includes: a dielectric layer having a first surface and a second surface opposite to each other; a first circuit layer provided on the first surface of the dielectric layer; and a support plate provided by an immersion After passing through a non-polar organic solvent, the insulating layer capable of restoring viscosity can be bonded to the first surface of the dielectric layer, wherein the insulating layer is a rubber polymer. The package substrate according to item 1 of the scope of patent application, wherein the surface of the first circuit layer is flush or lower than the first surface of the dielectric layer. The package substrate according to item 1 of the scope of the patent application, wherein the material forming the support plate is a paper substrate, a composite substrate or a FR-4 substrate. The package substrate according to item 1 of the scope of patent application, wherein the material forming the insulating layer is gel. The package substrate according to item 1 of the scope of patent application, wherein the material forming the insulating layer is an elastomer. The package substrate according to item 1 of the patent application scope, further comprising a second circuit layer provided on the second surface of the dielectric layer. The package substrate according to item 6 of the patent application scope, further comprising a plurality of conductive blind holes formed in the dielectric layer, so as to electrically connect the first and second circuit layers through the conductive blind holes. The package substrate according to item 6 of the scope of patent application, which includes an insulating protection layer, is provided on the second surface of the dielectric layer and the second circuit layer, and the second circuit layer system is partially exposed to the insulation. The protective layer. A packaging process includes: providing a packaging substrate as described in item 1 of the scope of patent application; bonding at least one electronic component to a second surface of the dielectric layer; and the supporting plate and the insulating layer from the The first surface of the dielectric layer is separated. The packaging process according to item 9 of the scope of patent application, wherein the manufacturing method of the package substrate includes: providing a carrier with the first circuit layer formed on the surface; forming the dielectric layer on the carrier and the first On a circuit layer, wherein the dielectric layer is bonded to the carrier with its first surface; the carrier is removed; and the support plate is bonded to the first surface of the dielectric layer through the insulating layer. The packaging process according to item 9 of the scope of patent application, wherein the surface of the first circuit layer is flush or lower than the first surface of the dielectric layer. According to the encapsulation process described in item 9 of the scope of patent application, wherein the material forming the support plate is a paper substrate, a composite substrate, or a FR-4 substrate. The encapsulation process according to item 9 of the scope of the patent application, wherein the material forming the insulating layer is gel. The packaging process as described in item 9 of the scope of patent application, wherein the material forming the insulating layer is an elastomer. The packaging process according to item 9 of the scope of patent application, wherein the package substrate further includes a second circuit layer disposed on the second surface of the dielectric layer. The packaging process according to item 15 of the scope of patent application, wherein the package substrate further comprises a plurality of conductive blind holes formed in the dielectric layer, so as to electrically connect the first and second via the conductive blind holes. Line layer. According to the encapsulation process described in claim 15 of the patent application scope, the package substrate further includes an insulation protection layer, which is disposed on the second surface of the dielectric layer and the second circuit layer, and the second circuit layer is partially exposed. On the insulation protection layer. The packaging process according to item 9 of the scope of patent application, wherein the electronic component is an active component, a passive component, or a combination thereof. The packaging process according to item 9 of the scope of patent application, wherein the electronic component is bonded to the second surface by a plurality of conductive components. According to the encapsulation process described in item 9 of the scope of patent application, the method further includes separating the supporting plate from the dielectric layer, and then bonding the supporting plate to another dielectric layer.