TWI630668B - Wafer inspection equipment cleaning device - Google Patents

Abstract

A cleaning device for a wafer inspection device, comprising a pedestal having a sump having a first water inlet hole and a first water outlet hole in the sump, and a drum pivotally connected to the pedestal sink. Thereby, after the wafer is detected, the roller brushing can surely reduce the chance of residual liquid remaining on the back surface of the wafer.

Description

Wafer inspection equipment cleaning device

The present invention relates to a wafer inspection apparatus, and more particularly to a cleaning apparatus for a wafer inspection apparatus.

For wafer back scribe inspection, the technique of the Republic of China Application No. 101147513 has overcome the problem of image unclearness, which uses the refractive index of the immersion liquid and the refractive index matching of the blue film to achieve a clear image. . In addition, the technique of the Republic of China Application No. 102119748 allows the testing machine to have sufficient immersion liquid at the time of detection and to discharge excess immersion liquid.

However, after the detection machine using the above technology detects the wafer from the back side of the wafer, since there is still possibility of residual immersion liquid on the back side of the wafer, it is necessary to add a cleaning device for the detection machine, thereby reducing the residual liquid on the back side of the wafer. Opportunity to avoid contamination of the next process with dust.

In view of the foregoing problems, it is an object of the present invention to provide a cleaning apparatus for a wafer inspection apparatus that reduces the chance of remaining liquid on the back side of the wafer on the wafer under test.

In order to achieve the above object, the present invention provides a cleaning apparatus for a wafer inspection apparatus, comprising: a pedestal having a sump; the pedestal having a first water inlet hole and a first water outlet hole in the sump, and a a drum pivotally connected to the base, the drum portion being immersed in the sump.

It is worth mentioning that the drum has a roller shaft and a brush cylinder, and the roller shaft is pivotally connected to the base, and the brush cylinder is sleeved on the roller to facilitate replacement of the brush cylinder. In addition, the brush is made of a sponge, or the brush is made by bristles on the periphery.

More preferably, a first squeegee is disposed on the pedestal, and the first squeegee is located above the sump. Further, the first squeegee has a slope which is inclined toward the drum direction, thereby guiding the flow direction of the liquid on the first squeegee.

In addition, the sump separates the first sub-sink and the second sub-sink, the pedestal has the first water inlet and the first water outlet in the first sub-sink; the pedestal is The second sub-tank has a second water outlet hole; the drum portion is immersed in the first sub-sink; the first scraper is located above the second sub-sink.

In addition, a third sump is further disposed under the first sub-sink and the second sub-sink, and the liquid collected by the first sub-sink and the second sub-sink is collected.

A water deflector may also be disposed between the first squeegee and the drum, the top surface of the water deflector being inclined toward the first squeegee to assist in guiding the liquid sprayed from the first squeegee.

In addition, a second squeegee and a wind knives are further disposed, so that the remaining liquid on the back surface of the wafer is scraped off through the second squeegee, and the remaining liquid on the back surface of the wafer is blown through the air knives.

11‧‧‧Base

111‧‧‧First sump

112‧‧‧Second auxiliary sump

113‧‧‧First water inlet

114‧‧‧First water outlet

115‧‧‧Second outlet

12‧‧‧Roller

121‧‧‧roller

122‧‧‧ brush tube

13‧‧‧First Scraper

131‧‧‧Bevel

14‧‧‧Water deflector

15‧‧‧ Third trough

16‧‧‧second scraper

17‧‧‧Air knife

18‧‧‧ sink

1 is a perspective view of a first embodiment of the present invention; and FIG. 2 is a perspective view of a second embodiment of the present invention; 3 is a side view of a second embodiment of the present invention; FIG. 4 is a perspective view of a third embodiment of the present invention; FIG. 5 is a perspective view of a third embodiment of the present invention; A partial perspective view showing the removal of the water deflector; and a seventh perspective view of the fourth embodiment of the present invention showing the second squeegee and the air knife.

Referring to FIG. 1 , a cleaning apparatus for a wafer inspection apparatus according to a first embodiment of the present invention includes a base 11 and a drum 12 .

The pedestal 11 is used in the present embodiment to carry a cleaning device and is combined with a wafer inspection machine. The susceptor 11 has a sump 18 having a first water inlet 113 and a first The water outlet hole 114 is configured such that the water collection tank 18 externally connects the water source to the first water inlet hole 113, and then drains the water from the first water outlet hole 114 to maintain the cleanliness of the water in the water collection tank 18.

The drum 12 is pivotally connected to the base 11, and the drum 12 is partially immersed in the sump 18. It should be noted that, in this embodiment, the roller 12 has a roller 121 and a brush cylinder 122. The roller 121 is pivotally connected to the base 11. The brush cylinder 122 is sleeved on the roller 121, and the roller 121 The material of the brush tube 122 is a sponge. In addition to the sponge, bristles may be provided on the periphery of the brush tube 122 for cleaning the back side of the wafer.

When the wafer inspection machine equipped with the cleaning device provided by the present invention is used, the detected wafer first passes through the roller 12, and at this time, the roller 12 contacts the wafer and is driven by the wafer. Turn, thus scrubbing the back side of the wafer to remove the liquid remaining on the back side of the wafer. At this time, the flowing water enters the sump 18 from the first water inlet hole 113, and then flows out of the sump 18 from the first water outlet hole 114, and because the portion of the drum 12 continues to be immersed in the sump 18, the water will wash the water. The drum 12 maintains the cleaning of the drum 12.

Thereby, after the detection of the wafer to be tested, the brush 12 can be scrubbed, thereby reducing the chance of residual liquid remaining on the back side of the wafer, and preventing the backside of the wafer from contaminating the next process.

Referring to FIG. 2-3, a cleaning apparatus for a wafer inspection apparatus according to a second embodiment of the present invention is different from the first embodiment in that a first squeegee 13 is added in the embodiment. As shown in FIG. 2, the first squeegee 13 is disposed on the pedestal 11. The first squeegee 13 is located above the sump 18. In the embodiment, the first squeegee 13 has a slope 131. The inclined surface 131 is inclined toward the drum 12, and can guide the liquid on the first squeegee 13 to flow in the same direction.

Therefore, after the detection of the wafer to be tested, in addition to the brushing of the roller 12, the first squeegee 13 can scrape off the remaining liquid on the back side of the wafer to prevent the backside of the wafer from contaminating the next process.

Referring to FIG. 4-7, a third embodiment of the present invention provides a cleaning apparatus for a wafer inspection apparatus, which is different from the second embodiment in that the sump 18 separates a first sub-sink 111 and A second sub-tank 112. As shown in FIG. 6, the pedestal 11 has a first water inlet 113 and a first water outlet 114 in the first sub-sink 111, so that the first sub-sink 111 is externally connected to the water source. The first water inlet hole 113 discharges water from the first water outlet hole 114 to maintain the cleanliness of the water in the first sub-sump 111. In addition, the pedestal 11 has a second water outlet 115 in the second sub sump 112, and the second sub sump 112 is discharged by guiding the liquid in the second sub sump 112.

The drum 12 is partially immersed in the first sub sump 111. In addition, in this embodiment, as shown in FIG. 7, a water deflector 14 may be disposed between the first squeegee 13 and the drum 12, and the top surface of the water deflector 14 is adjacent to the first A squeegee 13 is inclined in the direction. It is possible to assist in collecting the liquid splashed from the first squeegee 13 and flowing into the second sub sump 112.

It should be noted that, in this embodiment, a third sump 15 may be further disposed under the first sub-sink 111 and the second sub-sink 112 for receiving the first sub-sink. The liquid that is not received or overflowed by the 111 and the second sub-sump 112 prevents the liquid from overflowing.

In addition, FIG. 7 further discloses a fourth embodiment of the present invention, which is different from the third embodiment in that a second squeegee 16 and a wind blade 17 are further provided, and the second squeegee 16 is used to scrape the test wafer again. The remaining liquid on the back side of the wafer, the air knife blows off the remaining liquid on the back side of the wafer.

When the wafer inspection machine equipped with the cleaning device provided by the present invention is used, the detected wafer first passes through the roller, and at this time, the roller 12 contacts the wafer and is driven to rotate by the wafer, thereby scrubbing the back of the wafer. The back side of the wafer is used to remove liquid remaining on the back side of the wafer. At this time, the flowing water enters the first sub-sink 111 from the first water inlet hole 113, and then flows out of the first sub-sump 111 from the first water outlet hole 114, and because the drum 12 portion continues to immerse in the first sub-set Inside the sink 111, water will wash the drum 12, maintaining the cleaning of the drum 12. Subsequently, the wafer contacts the first squeegee 13 to scrape the remaining liquid on the back surface of the wafer to the second sub sump 112. Finally, the remaining liquid is scraped again through the second squeegee 16, and the air knife 17 blows the wafer.

Therefore, the present embodiment increases the chance of removing the remaining liquid on the back side of the wafer by providing the second squeegee 16 and the sealing knives 17.

Claims (9)

A cleaning device for a wafer inspection device, comprising: a pedestal having a sump; the pedestal having a first water inlet hole and a first water outlet hole in the sump; a first squeegee disposed at the a susceptor, the first squeegee is located above the sump; and a roller pivotally connected to the pedestal, the roller portion being immersed in the sump. The cleaning device for a wafer inspection apparatus according to claim 1, wherein the roller has a roller and a brush cylinder, the roller pivotally connects the base, and the brush cylinder is sleeved on the roller. The cleaning device for a wafer inspection apparatus according to claim 2, wherein the brush is made of a sponge. The cleaning device of the wafer inspection apparatus according to claim 2, wherein the brush is provided with bristles on the periphery thereof. A cleaning apparatus for a wafer inspection apparatus according to claim 1, wherein the first squeegee has a slope which is inclined toward the cylinder. The cleaning device of the wafer inspection apparatus according to claim 1, wherein the sump separates the first sub-sump and the second sub-sink, the pedestal having the first sub-sink a water inlet hole and the first water outlet hole; the base has a second water outlet hole in the second auxiliary sump; the drum portion is immersed in the first sub sump; the first squeegee is located in the second sub sump Above the sink. The cleaning device for a wafer inspection device according to claim 1, wherein a third sump is further disposed below the sump. The cleaning device of the wafer inspection apparatus of claim 1, wherein a water guiding plate is disposed between the first squeegee and the roller, and the top surface of the water guiding plate is inclined toward the first squeegee. A cleaning device for a wafer inspection apparatus according to claim 1, wherein a second squeegee and a wind knives are further provided.