TWI627707B - Cutting device - Google Patents

Abstract

An object of the present invention is to provide a cutting device which can easily achieve both the key operation and the work of maintaining the warpage of the package substrate. The solution is that the cutting device includes a chuck table that can hold the workpiece, a cutting mechanism that can cut and hold the workpiece on the chuck table by the cutter, a control mechanism, and an input mechanism. The input mechanism is a touch panel provided on the entire display surface of the display mechanism. The input mechanism has a suction start button for causing suction to occur on the holding surface of the chuck table. The control mechanism is provided with a timer for setting the time until the operator OP operates the suction start button until the suction action is generated on the holding surface of the chuck table.

Description

Cutting device Field of invention

The invention relates to a cutting device.

Background of the invention

A processing method in which a plate-shaped workpiece represented by a package substrate is cut by a cutting device and divided into individual device wafers is known. Since the package substrate has a thermal shrinkage relationship with the resin, warpage may occur in many cases. Since the warpage may cause the package substrate to be attracted and held on the chuck table, the solution is as follows: the package is taped. The substrate is fixed to the annular frame and is held by the tape, or for the purpose of reducing the tape as the consumable material, and the package substrate is directly fixed in the processing method of the chuck table, the package substrate is mounted on one side. The suction is held while being pressed against the chuck table to prevent warpage (see, for example, Patent Document 1).

Prior technical literature Patent literature

Patent Document 1: Japanese Patent Laid-Open No. 2011-049193

Summary of invention

When the operator performs suction and holding while pressing the package substrate with the hand, it is necessary to perform a key operation while holding and holding the package substrate, and thus there is a problem that the operation is difficult. Further, when the package substrate is a plurality of sheets, it is virtually impossible to press each of the package substrates with one hand and perform a key operation.

The present invention has been made in view of the above, and it is an object of the invention to provide a cutting device which can easily achieve both a key operation and a work for maintaining warpage of a package substrate.

In order to solve the above problems, and to achieve the object, the cutting apparatus of the present invention is provided with a chuck table capable of sucking a workpiece in a plate shape by a holding surface, and a workpiece that can be cut and held by the chuck table by a cutting blade a cutting mechanism, a control mechanism capable of controlling each component, and an input mechanism connected to the control mechanism and operable to perform a button operation by the operator; the cutting device is characterized in that the input mechanism has an attraction start button for attracting The action is generated on the holding surface of the chuck table; the control mechanism has a timer for setting the time after the operator operates the attraction start button until the attraction is generated on the holding surface of the chuck table And, it is possible to perform an attraction assisting operation of pressing the workpiece on the holding surface by the operator who has operated the suction start key before the suction action of the holding surface occurs.

Further, in the above cutting apparatus, it is preferable that the workpiece is disposed in each of the regions defined by the plurality of predetermined dividing lines. a warping package substrate having a device, wherein the chuck stage forms an undercut groove corresponding to the cutting blade that divides a predetermined line on the holding surface of the holding package substrate, and is divided by the undercut groove A suction hole is arranged in the middle.

Further, in the above cutting apparatus, preferably, the chuck table can hold a plurality of workpieces.

Since the cutting device of the present invention generates the suction function after the operation of the suction start key and after the time set by the timer, the button operation and the warpage of the package substrate can be eliminated and maintained. The combination of homework becomes easy and feasible.

1‧‧‧Cutting device

2‧‧‧ device body

3‧‧‧ Column Department

10‧‧‧ chuck table

11‧‧‧First holding station

11a‧‧‧First holding surface

12‧‧‧Second holding station

12a‧‧‧second holding surface

13‧‧‧Attraction hole

14‧‧‧Attraction

15‧‧‧Unslot

16‧‧‧vacuum attraction path

17‧‧‧Vacuum suction source

18‧‧‧ switch valve

19‧‧‧Rotating table

20‧‧‧ cutting mechanism

21‧‧‧ shaft

X, Y, Z‧‧ Direction

22‧‧‧Cutter

30‧‧‧ camera organization

40‧‧‧Y-axis moving mechanism

50‧‧‧Z-axis moving mechanism

90‧‧‧Control agency

91‧‧‧Timer

100‧‧‧ input institutions

101‧‧‧Display agency

102‧‧‧Attraction start button

D‧‧‧ device

L‧‧‧ dividing line

OP‧‧‧Operators

S‧‧‧Resin Sealing Department

W‧‧‧Processed objects

ST1, ST2, ST3, ST4‧‧‧ steps

Fig. 1 is a view showing an example of the configuration of a cutting device according to an embodiment.

2 is a view showing an example of the configuration of a chuck table of the cutting device according to the embodiment.

3 is an example of a flow chart at the start of machining of the control mechanism of the cutting device according to the embodiment.

(a) of FIG. 4 is a side view showing a state in which the workpiece is placed facing the chuck table at the start of processing, and FIG. 4(b) is a view showing the cutting device of the embodiment at the start of processing. (a) is a side view showing a state in which the workpiece is pressed against the chuck table, and FIG. 4(c) is a side view showing a state in which the cutting device holds the workpiece at the start of machining in the cutting device according to the embodiment. Wait.

Form for implementing the invention

The embodiment (embodiment) for carrying out the invention will be described in detail with reference to the drawings. The present invention is not limited by the contents described in the following embodiments. Further, the constituent elements described below include those that can be easily conceived by those skilled in the art and are substantially the same. Further, the configurations described below can be combined as appropriate. Further, various omissions, substitutions, and changes may be made without departing from the scope of the invention.

Fig. 1 is a view showing an example of the configuration of a cutting device according to an embodiment. 2 is a view showing an example of the configuration of a chuck table of the cutting device according to the embodiment. Fig. 3 is a view showing an example of a flow chart at the start of machining of the control mechanism of the cutting device according to the embodiment. Fig. 4 (a) is a side view showing a state in which the workpiece is placed facing the chuck table at the start of machining in the cutting device according to the embodiment. Fig. 4 (b) is a side view showing a state in which the workpiece is pressed against the chuck table at the start of machining in the cutting device according to the embodiment. (c) of FIG. 4 is a side view showing a state in which the workpiece of the cutting apparatus of the embodiment is held by the chuck table.

The cutting device 1 of the present embodiment is a device for cutting a workpiece W by relatively moving the cutting mechanism 20 having the cutting blade 22 and the chuck table 10 holding the workpiece W. As shown in FIG. 1, the cutting apparatus 1 has a chuck table 10 that holds a workpiece W by holding surfaces 11a and 12a, a cutting mechanism 20, an image pickup mechanism 30, an input mechanism 100, and a control mechanism 90. Further, the cutting apparatus 1 includes at least an X-axis moving mechanism (not shown) for moving the chuck table 10 in the X-axis direction, and the cutting mechanism 20 is perpendicular to the X-axis direction. The Y-axis moving mechanism 40 that moves in the Y-axis direction intersects, and the Z-axis moving mechanism 50 that moves the cutting mechanism 20 in the Z-axis direction that intersects the X-axis direction and the Y-axis direction perpendicularly. Further, the cutting device 1 is provided with a gate-shaped column portion 3 on the device body 2.

Here, the workpiece W is a plate-shaped workpiece, and is cut. In the present embodiment, as shown in FIG. 2, the object to be processed by the cutting device 1 is a package substrate having predetermined contents in respective regions divided by a plurality of predetermined dividing lines L that intersect perpendicularly to each other. The electrode D or the like is provided with the device D sealed by the resin sealing portion S. In order to seal a plurality of devices D by the resin sealing portion S made of a resin, warpage occurs during molding of the resin sealing portion S, and the package substrate as the workpiece W is warped. By the relative movement of the chuck table 10 and the cutting mechanism 20 having the cutting blade 22 by the cutting device 1, the cutting process is applied to the dividing line L, and the package substrate as the workpiece W can be divided into individual pieces. Device D.

The cutting mechanism 20 is capable of being held by the cutting blade 22 The mechanism of the workpiece W on the chuck table 10. The cutting mechanism 20 is provided on the column portion 3 via the Y-axis moving mechanism 40, the Z-axis moving mechanism 50, and the like, and is provided to be movable in the Y-axis direction by the Y-axis moving mechanism 40, and by the Z-axis. The moving mechanism 50 is disposed to be freely movable in the Z-axis direction.

The cutting mechanism 20 is included, and the axial direction is respectively opposite to the Y-axis direction (equivalent to The indexing conveyance direction is configured to match the rotating shaft 21 and the cutting blade 22 provided at the front end of the rotating shaft 21. The rotating shaft 21 is rotatably supported by a cylindrical casing (not shown), and is coupled to a blade (not shown) housed in the casing. Drive source. The cutting blade 22 is an extremely thin cutting stone having a substantially ring shape, and is detachably attached to the rotating shaft 21. The cutter 22 is driven to rotate by a rotational force generated by a knife drive source.

The image pickup mechanism 30 is capable of photographing being held on the chuck table 10 The mechanism of the cutting area of the workpiece W. The imaging mechanism 30 is attached to the cutting mechanism 20, and is moved integrally with the cutting mechanism 20 by the Y-axis moving mechanism 40 and the Z-axis moving mechanism 50 in the Y-axis direction and the Z-axis direction.

As shown in FIG. 1, the chuck table 10 is included and has a first holding surface. a first holding stage 11 of 11a (corresponding to a holding surface), a second holding stage 12 having a second holding surface 12a (corresponding to a holding surface) on the same plane as the first holding surface 11a, and a rotary table 19 Composition.

The first holding stage 11 and the second holding stage 12 are respectively The holding surfaces 11a and 12a are placed on the workpiece W, and are sucked by the suction holes 13 (shown in FIG. 2) provided on the holding surfaces 11a and 12a to attract the holding table of the workpiece W by vacuum suction. . In this manner, the chuck table 10 can hold the workpiece W by the first holding stage 11 and the second holding stage 12, respectively, so as to hold a plurality of (two in the present embodiment) workpiece W.

The planar shape of the first holding stage 11 and the second holding stage 12 They are formed into rectangles, respectively. Each of the first holding stage 11 and the second holding stage 12 has a suction portion 14 having a square shape in which the holding surfaces 11a and 12a are provided on the upper surface and corresponds to the resin sealing portion S of the workpiece W. The suction portion 14 is formed with the undercut groove 15 corresponding to the cutting blade 22 of the division planned line L on the holding faces 11a and 12a that hold the package substrate as the workpiece W, and is in the undercut groove 15 A suction hole 13 is disposed in the divided area. The undercut groove 15 is disposed in parallel with the X-axis direction and the Y-axis direction, and the first holding stage 11 and the second holding stage 12 are disposed in parallel.

As shown in FIG. 4, the suction hole 13 is formed by a vacuum suction path. The diameter 16 is connected to the vacuum suction source 17, and the workpiece W is held by the vacuum suction source 17 to hold the workpiece W on the holding surfaces 11a and 12a. Further, an on-off valve 18 is provided on the vacuum suction path 16. When the on-off valve 18 is opened, the suction of the vacuum suction source 17 is generated on the holding faces 11a, 12a, and when the on-off valve 18 is closed, the suction of the vacuum suction source 17 is not generated on the holding faces 11a, 12a.

The rotary table 19 is formed in a disk shape and supports the first holding stage 11 And the second holding stage 12, and the first holding stage 11 and the second holding stage 12 are integrally rotated about an axis (not parallel to the Z-axis direction) which is not shown in the figure perpendicular to the holding faces 11a, 12a.

The input mechanism 100 is connected to the control mechanism 90 and is provided with a display A display mechanism 101 showing the state of the machining operation. The display unit 101 is configured by a display panel or the like such as a liquid crystal display or an organic EL display. The display mechanism 101 can display information such as characters, graphics, images, and the like corresponding to the signals input by the control mechanism 90. The input mechanism 100 is a mechanism that allows an operator OP (shown in FIG. 1) to perform a button operation, and is configured by a touch panel or the like provided on the entire display surface of the display unit 101. The input mechanism 100 can input a signal corresponding to the received operation to the control mechanism 90. The input mechanism 100 has a suction start key 102 that can open the on-off valve 18 in the operation of the vacuum suction source 17, so that the suction action is generated on the holding surface of the chuck table 10. 11a, 12a. The attraction start key 102 is placed in a predetermined area of the display surface of the display unit 101.

The control mechanism 90 is capable of separately controlling the formation of the cutting device 1 The organization that describes the elements. The control mechanism 90 is a mechanism that can perform a machining operation with respect to the workpiece W on the cutting device 1. Further, the control unit 90 is mainly constituted by a microprocessor (not shown) having a calculation processing device such as a CPU or the like, a ROM, a RAM, and the like. Further, the control unit 90 has a timer 91 for setting, after the operator OP operates the suction start key 102, to cause the suction action to be generated on the holding faces 11a, 12a of the chuck table 10. Time. The control unit 90 is connected to the display unit 101 or the input unit 101 or the like used when the operator OP registers the processed content information or the like.

Next, the machining operation of the cutting device 1 of the present embodiment Be explained. First, when the operator OP registers the processing content information and has an instruction to start the machining operation, the machining operation is started. In the machining operation, first, the control mechanism 90 implements the flowchart shown in FIG. In the machining operation, the control unit 90 sets the time after the operation of the suction start key 102 by the timer 91 to the time for causing the suction action to be generated on the holding faces 11a and 12a of the chuck table 10, and determines whether or not The attraction start key 102 has been operated (step ST1). When the control unit 90 determines that the aforementioned time has not been set by the timer 91 or that the suction start key 102 has not been operated (step ST1: No), the step ST1 is repeated. That is, the control unit 90 will set the time before the timer 91 is set and the suction start key 102 is operated. Step ST1 is repeated.

When the control unit 90 determines that the aforementioned time is set by the timer 91, When the suction start key 102 has been operated (step ST1: Yes), the vacuum suction source 17 is actuated in a state where the on-off valve 18 is closed (step ST2). Further, the control unit 90 determines whether or not the time set by the timer 91 has elapsed after the suction start key 102 has been operated (step ST3). When the control unit 90 determines that the set time has not elapsed (step ST3: No), step ST3 is repeated. That is, the control unit 90 repeats the step ST3 until the time set by the timer 91 has elapsed.

During the period before the time set by the timer 91, such as As shown in Fig. 4(a), after the resin sealing portion S of the workpiece W faces the holding faces 11a and 12a of the holding stages 11, 12, the operator OP will process the workpiece W as shown in Fig. 4(b). The resin sealing portion S is placed on the holding faces 11a and 12a of the holding stages 11 and 12. Further, before the suction action of the holding faces 11a, 12a occurs, the operator OP who has operated the suction start key 102 can press the workpiece W on each of the holding faces 11a, 12a. In this way, the cutting device 1 can perform the suction assisting operation of the operator OP who has operated the suction start key 102 to press the workpiece W on the holding faces 11a and 12a before the suction action of the holding faces 11a and 12a occurs. .

And, when the control mechanism 90 determines that it has passed the set At the time (step ST3: Yes), as shown in FIG. 4(c), the on-off valve 18 is opened, and the vacuum suction source 17 is attracted from the suction hole 13, and the suction action is generated on the holding faces 11a, 12a. The flow chart shown in FIG. 3 is completed by sucking and holding the workpiece W on the holding faces 11a and 12a.

Moreover, the control mechanism 90 can hold the chuck of the workpiece W The stage 10 is moved to the machining start position in the X-axis direction, and the image pickup mechanism 30 causes the two workpieces W held by the chuck table 10 to be imaged, and the image obtained by the shooting is output to the control mechanism 90. The control mechanism 90 performs image processing such as pattern matching to adjust the relative position of the workpiece W held on the chuck table 10 and the cutting mechanism 20, which is used for holding the clip. The planned dividing line L of the workpiece W on the headstock 10 is aligned with the position of the cutting blade 21 of the cutting mechanism 20.

Moreover, the control mechanism 90 appropriately according to the processing content information. Each of the moving mechanisms 40 and 50, the rotating shaft 21 of the cutting mechanism 20, the rotating table 19, and the like are driven to cut the workpiece W along the dividing line L, and is divided into a plurality of devices D. The control mechanism 90 can release the suction holding of the chuck table 10 after cutting all the division planned lines L and retracting the chuck table 10 from below the cutting mechanism 20. Further, the operator OP can remove a plurality of divided devices D and the like from the chuck table 10, and at the same time, place the workpiece W before cutting on the chuck table 10, and repeat the above steps. In order to divide the workpiece W into individual devices D.

As described above, the cutting device 1 of the present embodiment is operated After the start key 102 is attracted, and after the time set by the timer 91 has elapsed, the attraction is exerted on the holding faces 11a, 12a. Therefore, the cutting apparatus 1 can be made to allow the operator OP to be pressed while being pressed in the case where the chuck table 10 holds a plurality of workpieces W, after the key operation and before the set time elapses. The object W can be warped at the same time, and the workpiece W can be positioned at a predetermined position. Therefore, cutting equipment In the case of setting 1, the operation of attracting the start key 102 and the work of holding the warpage of the package substrate W as the workpiece W can be easily achieved.

Further, the cutting device 1 is operated at the suction start key 102. Thereafter, the vacuum suction source 17 is actuated to open the on-off valve 18 when the set time elapses, so that the suction action can be immediately generated on the holding faces 11a, 12a when the set time elapses. Further, since the cutting device 1 closes the switching valve 18 before the set time is elapsed after the suction start key 102 is operated, it is possible to prevent the suction action from being generated on the holding surface before the time set by the timer 9 is passed. The situation on 11a, 12a.

Further, the cutting device 1 is formed with an undercut groove 15 in the chuck table 10. Therefore, the cutting device 1, in particular, the package substrate which is likely to be warped, can be reliably held on the holding faces 11a and 12a as the workpiece W. Further, in the cutting apparatus 1, since the chuck table 10 holds a plurality of workpieces W, it is possible to allow the operator OP to press the workpiece W while the button operation and before the set time elapses. It is easy to achieve both the operation of attracting the start key 102 and the work of holding the warpage of the package substrate of the workpiece W while maintaining the warpage.

Furthermore, the present invention is not limited to the above embodiment. That is, various modifications can be made without departing from the spirit and scope of the invention.

Claims (3)

A cutting device comprising: a chuck table capable of sucking a workpiece in a plate shape by a holding surface; a cutting mechanism capable of cutting a workpiece held on the chuck table by a cutter; and controlling each component a control mechanism, and an input mechanism connected to the control mechanism and operable by an operator; the input mechanism has an attraction start button for causing an attraction to be generated on the holding surface of the chuck table; the control mechanism has a timer for setting a time after the operator operates the attraction start key until the suction action is generated on the holding surface of the chuck table; and the cutting device can be implemented before the attraction of the holding surface is generated The operator who has operated the suction start button presses the workpiece to the suction assisting operation on the holding surface. The cutting device according to claim 1, wherein the workpiece is a warped package substrate in which each device is divided by a plurality of predetermined lines, and the chuck table holds the package substrate. An undercut groove corresponding to the cutting blade that divides the predetermined line is formed on the holding surface, and a suction hole is disposed in a region defined by the undercut groove. The cutting device according to claim 1 or 2, wherein the aforementioned chuck table can hold a plurality of workpieces.