JP2015138808A - Cutting device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a cutting device easily capable of both a key operation and the retention of a package board by canceling a warp thereof.SOLUTION: A cutting device 1 includes: a chuck table 10 for holding a work piece W; cutting means 20 for cutting the work piece W held by the chuck table 10 with a cut blade 22; control means 90; and input means 100. The input means 100 is a touch-panel prepared on the whole display surface of display means 101. The input means 100 includes a suction initiation key 102 for causing the suction action of retention surfaces 11a and 12a of the chuck table 10. The control means 90 includes a timer 91 for setting a time to cause the suction action of the retention surfaces 11a and 12a of the chuck table 10, after an operator OP operates the suction initiation key 102.

Description

  The present invention relates to a cutting apparatus.

  A processing method is known in which a plate-like workpiece as represented by a package substrate is cut by a cutting device and divided into individual device chips. The package substrate is often warped due to the heat shrinkage of the resin, and the warpage is less likely to be sucked and held by the chuck table. As a solution, the package substrate is fixed to the annular frame with tape. However, in the processing method of directly fixing the package substrate to the chuck table for the purpose of sucking and holding through the tape or reducing the tape as a consumable material, the package substrate is directly pressed against the chuck table to eliminate the warp. There is a method such as sucking and holding (see, for example, Patent Document 1).

JP 2011-049193 A

  When the operator holds the package substrate while sucking and holding it by hand, there is a problem that the operation is difficult because it is necessary to perform a suction and holding key operation while pressing the package substrate. In addition, when there are a plurality of package substrates, it is practically impossible to simultaneously operate keys while holding each package substrate by hand.

  The present invention has been made in view of the above, and an object of the present invention is to provide a cutting device that can easily achieve both key operation and the elimination and holding of the warpage of the package substrate.

  In order to solve the above-described problems and achieve the object, a cutting apparatus according to the present invention includes a chuck table for sucking and holding a plate-like workpiece on a holding surface, and a workpiece held on the chuck table. A cutting apparatus comprising: a cutting means for cutting with a cutting blade; a control means for controlling each component; and an input means connected to the control means and operated by a key of an operator, wherein the input means includes the chuck A suction start key for generating a suction action on the holding surface of the table; and the control means determines a time until the suction action is generated on the holding surface of the chuck table after the operator operates the suction start key. A timer for setting, and before the suction action of the holding surface occurs, an operator who operates the suction start key can perform a suction assisting operation to press the workpiece against the holding surface. That.

  In the cutting apparatus, the workpiece is a package substrate having a warp in which a device is disposed in each region partitioned by a plurality of division lines, and the chuck table holds the package substrate. It is preferable that a relief groove of the cutting blade corresponding to the division line is formed on the holding surface, and a suction hole is provided in a region defined by the relief groove.

  In the cutting apparatus, the chuck table preferably holds a plurality of workpieces.

  In the cutting device of the present invention, since the suction action occurs after the time set by the timer has elapsed after the operation of the suction start key, both the key operation and the warping of the package substrate are eliminated and held. Can be easily achieved.

Drawing 1 is a figure showing the example of composition of the cutting device concerning an embodiment. FIG. 2 is a diagram illustrating a configuration example of a chuck table of the cutting apparatus according to the embodiment. FIG. 3 is an example of a flowchart at the start of machining by the control means of the cutting apparatus according to the embodiment. FIG. 4A is a side view showing a state in which the workpiece is opposed to the chuck table at the start of machining of the cutting apparatus according to the embodiment, and FIG. 4B is a diagram of the cutting apparatus according to the embodiment. FIG. 4C is a side view illustrating a state in which the workpiece is pressed against the chuck table at the start of processing, and FIG. 4C illustrates a state in which the chuck table holds the workpiece at the start of processing of the cutting apparatus according to the embodiment. It is a side view.

  DESCRIPTION OF EMBODIMENTS Embodiments (embodiments) for carrying out the present invention will be described in detail with reference to the drawings. The present invention is not limited by the contents described in the following embodiments. The constituent elements described below include those that can be easily assumed by those skilled in the art and those that are substantially the same. Furthermore, the structures described below can be combined as appropriate. Various omissions, substitutions, or changes in the configuration can be made without departing from the scope of the present invention.

  Drawing 1 is a figure showing the example of composition of the cutting device concerning an embodiment. FIG. 2 is a diagram illustrating a configuration example of a chuck table of the cutting apparatus according to the embodiment. FIG. 3 is an example of a flowchart at the start of machining by the control means of the cutting apparatus according to the embodiment. Fig.4 (a) is a side view etc. which show the state by which the to-be-processed object was made to oppose the chuck table at the time of the processing start of the cutting device which concerns on embodiment. FIG. 4B is a side view showing a state in which the workpiece is pressed against the chuck table at the start of machining of the cutting apparatus according to the embodiment. FIG. 4C is a side view showing a state in which the chuck table holds the workpiece when machining of the cutting apparatus according to the embodiment is started.

  The cutting apparatus 1 according to the present embodiment cuts the workpiece W by relatively moving the cutting means 20 having the cutting blade 22 and the chuck table 10 holding the workpiece W. As shown in FIG. 1, the cutting apparatus 1 includes a chuck table 10 that sucks and holds a workpiece W with holding surfaces 11 a and 12 a, a cutting unit 20, an imaging unit 30, an input unit 100, and a control unit 90. It is equipped with. The cutting apparatus 1 includes an X-axis moving unit (not shown) that moves the chuck table 10 in the X-axis direction, a Y-axis moving unit 40 that moves the cutting unit 20 in the Y-axis direction orthogonal to the X-axis direction, and a cutting unit. It includes at least Z-axis moving means 50 for moving 20 in the Z-axis direction orthogonal to the X-axis direction and the Y-axis direction. The cutting device 1 is provided with a gate-shaped column portion 3 on the device main body 2.

  Here, the workpiece W is a plate-like workpiece and is a workpiece to be machined by the cutting device 1. In the present embodiment, as shown in FIG. This is a package substrate in which a device D having a predetermined electrode or the like and sealed by a resin sealing portion S is disposed in each region partitioned by a line L. Since the package substrate as the workpiece W is sealed by the resin sealing portion S in which the plurality of devices D are made of resin, warpage occurs during molding of the resin sealing portion S, Has warping. The package substrate as the workpiece W is applied to each device by causing the cutting apparatus 1 to relatively move the chuck table 10 and the cutting means 20 having the cutting blade 22 to perform cutting on the division line L. Divided into D.

  The cutting means 20 is for cutting the workpiece W held on the chuck table 10 with the cutting blade 22. The cutting means 20 is provided on the column portion 3 via the Y-axis moving means 40, the Z-axis moving means 50, etc., and is provided so as to be movable in the Y-axis direction by the Y-axis moving means 40 and by the Z-axis moving means 50. It is provided so as to be movable in the Z-axis direction.

  The cutting means 20 includes a spindle 21 whose axial direction coincides with the Y-axis direction (corresponding to the indexing direction), and a cutting blade 22 attached to the tip of the spindle 21. The spindle 21 is rotatably supported by a cylindrical housing (not shown) and is connected to a blade driving source (not shown) housed in the housing. The cutting blade 22 is an extremely thin cutting grindstone having a substantially ring shape, and is detachably attached to the spindle 21. The cutting blade 22 is rotationally driven by the rotational force generated by the blade drive source.

  The imaging unit 30 images a region to be cut of the workpiece W held on the chuck table 10. The imaging unit 30 is attached to the cutting unit 20 and is moved in the Y-axis direction and the Z-axis direction by the Y-axis moving unit 40 and the Z-axis moving unit 50 integrally with the cutting unit 20.

  As shown in FIG. 1, the chuck table 10 includes a first holding table 11 having a first holding surface 11a (corresponding to a holding surface) and a second holding surface on the same plane as the first holding surface 11a. A second holding table 12 having a holding surface 12a (corresponding to a holding surface) and a rotary table 19 are included.

  The first holding table 11 and the second holding table 12 place the workpiece W on the holding surfaces 11a and 12a, respectively, and suction holes 13 (shown in FIG. 2) provided in the holding surfaces 11a and 12a. The workpiece W is sucked and held by a negative pressure. As described above, the chuck table 10 holds the workpieces W on the first holding table 11 and the second holding table 12, thereby allowing a plurality (two in this embodiment) of workpieces W to be processed. Hold.

  Each of the first holding table 11 and the second holding table 12 has a rectangular planar shape. The first holding table 11 and the second holding table 12 are each provided with a rectangular suction part 14 provided with holding surfaces 11a and 12a on the upper surface and corresponding to the resin sealing part S of the workpiece W. . The suction part 14 is formed with relief grooves 15 of the cutting blade 22 corresponding to the division lines L on the holding surfaces 11 a and 12 a that hold the package substrate as the workpiece W, and suction is performed in a region partitioned by the relief grooves 15. One hole 13 is provided. The escape groove 15 is provided in parallel with the X-axis direction and the Y-axis direction, and the first holding table 11 and the second holding table 12 are arranged in parallel.

  As shown in FIG. 4, the suction hole 13 is connected to a vacuum suction source 17 via a vacuum suction path 16, and is sucked by the vacuum suction source 17, so that the workpiece W is placed on the holding surfaces 11 a and 12 a. Hold. The vacuum suction path 16 is provided with an open / close valve 18. When the on-off valve 18 is opened, the suction action of the vacuum suction source 17 is generated on the holding surfaces 11a and 12a. When the on-off valve 18 is closed, the suction action of the vacuum suction source 17 is not generated on the holding surfaces 11a and 12a.

  The rotary table 19 is formed in a disk shape, supports the first holding table 11 and the second holding table 12, and rotates around an axis (not shown) orthogonal to the holding surfaces 11 a and 12 a (parallel to the Z-axis direction). The holding table 11 and the second holding table 12 can be rotated together.

  The input unit 100 is connected to the control unit 90 and is provided in the display unit 101 that displays the state of the machining operation. The display unit 101 includes a display panel such as a liquid crystal display or an organic EL display. The display unit 101 displays information such as characters, figures, images, and the like in accordance with signals input from the control unit 90. The input unit 100 is operated by the operator OP (shown in FIG. 1) and is composed of a touch panel provided on the entire display surface of the display unit 101. The input unit 100 inputs a signal corresponding to the accepted operation to the control unit 90. The input means 100 has a suction start key 102 that generates a suction action on the holding surfaces 11a and 12a of the chuck table 10 by opening the on-off valve 18 while the vacuum suction source 17 is operating. The suction start key 102 is provided in a predetermined area on the display surface of the display unit 101.

  The control means 90 controls each of the above-described components constituting the cutting device 1. The control means 90 causes the cutting device 1 to perform a machining operation on the workpiece W. Note that the control unit 90 is configured mainly by a microprocessor (not shown) including an arithmetic processing unit configured by a CPU or the like, a ROM, a RAM, or the like. Further, the control means 90 includes a timer 91 for setting a time for generating a suction action on the holding surfaces 11 a and 12 a of the chuck table 10 after the operator OP operates the suction start key 102. The control unit 90 is connected to the display unit 101, the input unit 101 used when the operator OP registers processing content information, and the like.

  Next, the machining operation of the cutting device 1 according to this embodiment will be described. First, when the operator OP registers the machining content information and receives an instruction to start the machining operation, the machining operation is started. In the machining operation, the control means 90 first implements the flowchart shown in FIG. In the machining operation, the control means 90 sets a time for generating a suction action on the holding surfaces 11a and 12a of the chuck table 10 after operating the suction start key 102 by the timer 91, and whether or not the suction start key 102 is operated. Is determined (step ST1). When it is determined that the above-mentioned time is not set by the timer 91 or the suction start key 102 is not operated (step ST1: No), the control unit 90 repeats step ST1. That is, the control unit 90 repeats step ST1 until the above-described time is set by the timer 91 and the suction start key 102 is operated.

  When it is determined that the above-described time is set by the timer 91 and the suction start key 102 is operated (step ST1: Yes), the control unit 90 operates the vacuum suction source 17 with the on-off valve 18 closed (step ST1). Step ST2). Then, the control means 90 determines whether or not the time set by the timer 91 has elapsed after the suction start key 102 has been operated (step ST3). When determining that the set time has not elapsed (step ST3: No), the control unit 90 repeats step ST3. That is, the control means 90 repeats step ST3 until the time set by the timer 91 elapses.

  Until the time set by the timer 91 elapses, the operator OP, as shown in FIG. 4A, holds the resin sealing portion of the workpiece W on the holding surfaces 11a and 12a of the holding tables 11 and 12, respectively. After making S relative, as shown in FIG. 4 (b), the resin sealing portion S of the workpiece W is placed on the holding surfaces 11 a and 12 a of the holding tables 11 and 12. Then, before the suction action of the holding surfaces 11a and 12a occurs, the operator OP operating the suction start key 102 presses the workpiece W against the holding surfaces 11a and 12a. As described above, the cutting device 1 performs the suction assisting operation in which the operator OP who operates the suction start key 102 presses the workpiece W against the holding surfaces 11a and 12a before the suction action of the holding surfaces 11a and 12a occurs. Can be implemented.

  Then, when the control means 90 determines that the set time has elapsed (step ST3: Yes), as shown in FIG. 4C, the control means 90 opens the on-off valve 18, and the vacuum suction source 17 passes through the suction hole 13. Suction is performed to generate a suction action on the holding surfaces 11a and 12a, the workpiece W is sucked and held on the holding surfaces 11a and 12a, and the flowchart shown in FIG. 3 is completed.

  Then, the control unit 90 moves the chuck table 10 holding the workpiece W in the X-axis direction to the processing start position, causes the imaging unit 30 to image the two workpieces W held on the chuck table 10, The control unit 90 outputs an image obtained by imaging. The control means 90 executes image processing such as pattern matching for aligning the division line L of the workpiece W held on the chuck table 10 with the cutting blade 21 of the cutting means 20, and the chuck table. The relative position between the workpiece W held by 10 and the cutting means 20 is adjusted.

  Then, the control means 90 appropriately drives the moving means 40, 50, the spindle 21 of the cutting means 20, the rotary table 19 and the like on the basis of the machining content information to divide the workpiece W along the scheduled division line L. Cutting and dividing into a plurality of devices D. After cutting all the planned division lines L, the control means 90 retracts the chuck table 10 from below the cutting means 20 and then releases the suction holding of the chuck table 10. Then, the operator OP removes the plurality of devices D and the like divided from the chuck table 10, places the workpiece W before cutting again on the chuck table 10, and repeats the above-described steps to process the workpiece. The object W is divided into individual devices D.

  As described above, in the cutting device 1 according to the present embodiment, after the time set by the timer 91 has elapsed after the operation of the suction start key 102, a suction action is generated on the holding surfaces 11a and 12a. For this reason, even when the chuck table 10 holds a plurality of workpieces W, the cutting apparatus 1 allows the operator OP to wait until a set time elapses after the key operation. While pressing W, the warp can be eliminated and the workpiece W can be positioned at a predetermined position. Therefore, the cutting device 1 can easily enable both the key operation of the suction start key 102 and the hold of the package substrate as the workpiece W to be eliminated.

  Further, when the suction start key 102 is operated, the cutting device 1 activates the vacuum suction source 17, and the opening / closing valve 18 opens when the set time elapses. Therefore, immediately after the set time elapses, the holding surface 11a. , 12a can generate a suction action. Furthermore, since the on-off valve 18 is closed until the time set by operating the suction start key 102 elapses, the cutting device 1 holds the holding surfaces 11a and 12a until the time set by the timer 9 elapses. It is possible to prevent the suction action from occurring.

  Further, in the cutting device 1, a clearance groove 15 is formed in the chuck table 10. For this reason, in particular, the cutting apparatus 1 can reliably hold the package substrate that is likely to be warped as the workpiece W on the holding surfaces 11a and 12a. Further, since the chuck table 10 holds the plurality of workpieces W in the cutting apparatus 1, the operator OP warps while pressing the workpiece W until a set time elapses after the key operation. Therefore, it is possible to easily satisfy both the key operation of the suction start key 102 and the warp of the package substrate as the workpiece W to be held.

  The present invention is not limited to the above embodiment. That is, various modifications can be made without departing from the scope of the present invention.

1 Cutting device 10 Chuck table 11a First holding surface (holding surface)
12a Second holding surface (holding surface)
DESCRIPTION OF SYMBOLS 13 Suction hole 15 Escape groove 20 Cutting means 22 Cutting blade 90 Control means 91 Timer 100 Input means 102 Suction start key D Device L Scheduled line W Workpiece

Claims (3)

A chuck table for sucking and holding a plate-like workpiece with a holding surface, a cutting means for cutting the workpiece held on the chuck table with a cutting blade, a control means for controlling each component, and the control means A cutting device comprising: an input means that is connected to the key and operated by an operator;
The input means is:
A suction start key for generating a suction action on the holding surface of the chuck table;
The control means includes
A timer for setting a time until the suction action is generated on the holding surface of the chuck table after the operator operates the suction start key;
A cutting apparatus capable of performing a suction assisting operation in which an operator who operates the suction start key presses a workpiece against the holding surface before the suction action of the holding surface occurs. The workpiece is a package substrate having a warp in which a device is disposed in each region partitioned by a plurality of division lines.
The chuck table is formed with a relief groove of the cutting blade corresponding to the division line on the holding surface for holding a package substrate, and a suction hole is provided in a region defined by the relief groove. The cutting apparatus according to 1.   The cutting apparatus according to claim 1, wherein the chuck table holds a plurality of workpieces.

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