TWI626322B - 鈦銅箔、延展銅產品、電子設備部件以及自動調焦攝影機模組 - Google Patents

鈦銅箔、延展銅產品、電子設備部件以及自動調焦攝影機模組 Download PDF

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Publication number
TWI626322B
TWI626322B TW106111227A TW106111227A TWI626322B TW I626322 B TWI626322 B TW I626322B TW 106111227 A TW106111227 A TW 106111227A TW 106111227 A TW106111227 A TW 106111227A TW I626322 B TWI626322 B TW I626322B
Authority
TW
Taiwan
Prior art keywords
copper foil
titanium copper
rolling
titanium
solder
Prior art date
Application number
TW106111227A
Other languages
English (en)
Chinese (zh)
Other versions
TW201736610A (zh
Inventor
Kazutaka AOSHIMA
Original Assignee
Jx Nippon Mining & Metals Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jx Nippon Mining & Metals Corp filed Critical Jx Nippon Mining & Metals Corp
Publication of TW201736610A publication Critical patent/TW201736610A/zh
Application granted granted Critical
Publication of TWI626322B publication Critical patent/TWI626322B/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/64—Imaging systems using optical elements for stabilisation of the lateral and angular position of the image
    • G02B27/646—Imaging systems using optical elements for stabilisation of the lateral and angular position of the image compensating for small deviations, e.g. due to vibration or shake
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
    • G02B7/04—Mountings, adjusting means, or light-tight connections, for optical elements for lenses with mechanism for focusing or varying magnification
    • G02B7/09—Mountings, adjusting means, or light-tight connections, for optical elements for lenses with mechanism for focusing or varying magnification adapted for automatic focusing or varying magnification
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/28—Systems for automatic generation of focusing signals
    • G02B7/282—Autofocusing of zoom lenses
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B13/00—Viewfinders; Focusing aids for cameras; Means for focusing for cameras; Autofocus systems for cameras
    • G03B13/32—Means for focusing
    • G03B13/34—Power focusing
    • G03B13/36—Autofocus systems

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Conductive Materials (AREA)
  • Lens Barrels (AREA)
  • Non-Insulated Conductors (AREA)
TW106111227A 2016-03-31 2017-03-31 鈦銅箔、延展銅產品、電子設備部件以及自動調焦攝影機模組 TWI626322B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2016073347A JP6391621B2 (ja) 2016-03-31 2016-03-31 チタン銅箔、伸銅品、電子機器部品およびオートフォーカスカメラモジュール

Publications (2)

Publication Number Publication Date
TW201736610A TW201736610A (zh) 2017-10-16
TWI626322B true TWI626322B (zh) 2018-06-11

Family

ID=60003791

Family Applications (1)

Application Number Title Priority Date Filing Date
TW106111227A TWI626322B (zh) 2016-03-31 2017-03-31 鈦銅箔、延展銅產品、電子設備部件以及自動調焦攝影機模組

Country Status (4)

Country Link
JP (1) JP6391621B2 (ko)
KR (1) KR101959620B1 (ko)
CN (1) CN107267798B (ko)
TW (1) TWI626322B (ko)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6780187B2 (ja) 2018-03-30 2020-11-04 三菱マテリアル株式会社 電子・電気機器用銅合金、電子・電気機器用銅合金板条材、電子・電気機器用部品、端子、及び、バスバー
CN209803439U (zh) * 2018-07-25 2019-12-17 台湾东电化股份有限公司 驱动机构
JP6650987B1 (ja) * 2018-11-09 2020-02-19 Ｊｘ金属株式会社 チタン銅箔、伸銅品、電子機器部品及びオートフォーカスカメラモジュール
JP6953465B2 (ja) * 2019-03-27 2021-10-27 Ｊｘ金属株式会社 チタン銅箔及びチタン銅箔の製造方法
JP6907282B2 (ja) * 2019-09-25 2021-07-21 Ｊｘ金属株式会社 ベーパーチャンバー用チタン銅合金板及びベーパーチャンバー
JP6878541B2 (ja) * 2019-09-25 2021-05-26 Ｊｘ金属株式会社 ベーパーチャンバー用チタン銅合金板及びベーパーチャンバー

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200806811A (en) * 2006-06-12 2008-02-01 Nippon Mining & Amp Metals Co Ltd Rolled copper or copper alloy foil with roughened surface and method of roughening rolled copper or copper alloy foil
TW201410886A (zh) * 2012-07-19 2014-03-16 Jx Nippon Mining & Metals Corp 高強度鈦銅箔及其製造方法
TW201542047A (zh) * 2014-03-31 2015-11-01 Jx Nippon Mining & Metals Corp 附載體之銅箔、印刷配線板、積層體、電子機器及印刷配線板之製造方法
TW201546302A (zh) * 2013-10-04 2015-12-16 Jx Nippon Mining & Metals Corp 壓延銅箔、使用其之覆銅積層板、印刷配線板、電子機器、電路連接構件之製造方法及電路連接構件

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5723849A (en) 1980-07-18 1982-02-08 Matsushita Electric Ind Co Ltd Gas detector and its manufacture
JP4068413B2 (ja) 2002-08-16 2008-03-26 日鉱金属株式会社 Ｃｕ−Ｔｉ合金およびその製造方法
JP5961371B2 (ja) * 2011-12-06 2016-08-02 Ｊｘ金属株式会社 Ｎｉ−Ｃｏ−Ｓｉ系銅合金板
JP6289804B2 (ja) * 2012-09-04 2018-03-07 大日本印刷株式会社 板バネの製造方法
US9405089B2 (en) * 2014-05-22 2016-08-02 Texas Instruments Incorporated High-temperature isotropic plasma etching process to prevent electrical shorts
JP6073268B2 (ja) * 2014-08-29 2017-02-01 Ｊｘ金属株式会社 高強度チタン銅箔及びその製造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200806811A (en) * 2006-06-12 2008-02-01 Nippon Mining & Amp Metals Co Ltd Rolled copper or copper alloy foil with roughened surface and method of roughening rolled copper or copper alloy foil
TW201410886A (zh) * 2012-07-19 2014-03-16 Jx Nippon Mining & Metals Corp 高強度鈦銅箔及其製造方法
TW201546302A (zh) * 2013-10-04 2015-12-16 Jx Nippon Mining & Metals Corp 壓延銅箔、使用其之覆銅積層板、印刷配線板、電子機器、電路連接構件之製造方法及電路連接構件
TW201542047A (zh) * 2014-03-31 2015-11-01 Jx Nippon Mining & Metals Corp 附載體之銅箔、印刷配線板、積層體、電子機器及印刷配線板之製造方法

Also Published As

Publication number Publication date
KR20170113408A (ko) 2017-10-12
TW201736610A (zh) 2017-10-16
KR101959620B1 (ko) 2019-03-18
CN107267798A (zh) 2017-10-20
JP2017179566A (ja) 2017-10-05
JP6391621B2 (ja) 2018-09-19
CN107267798B (zh) 2019-07-05

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