TWI625023B - DC power wireless chip - Google Patents

Abstract

The invention belongs to a novel power supply concept of a DC electrical device circuit chip, which mainly uses a replaceable coil wafer and an electrical device circuit chip to form a two-layer wafer power supply structure, and the coil wafer can be used as a power supply outside the circuit chip. Inductive power, which provides the power required to operate the circuit wafer via a two-layer wafer power supply structure, so that the DC electrical device circuit wafer operation does not require additional DC to DC conversion circuitry or power wiring. The invention provides a coil wafer system in a DC electrical device. The coil wafer system is internally provided with a central processor circuit coil chip, a plurality of high speed circuit coil chips and a plurality of low speed circuit coil chips, wherein the central processor circuit coil The wafer consists of a top layer coil chip and a lower layer central processor circuit chip to form a two-layer central processor chip power supply structure. The high speed circuit coil chip is composed of an upper layer coil chip and a lower layer high speed circuit chip to form a double layer high speed wafer power supply structure. The low-speed circuit coil chip is composed of an upper layer coil chip and a lower layer low-speed circuit chip to form a double-layer low-speed chip power supply structure. The upper layer coil wafer of each double-layer wafer power supply structure can receive the power supply outside the circuit chip for power induction (coil wafer sensing) and convert it into DC power, and the upper layer coil wafer directly and stably supplies DC power to the inside through the double-layer chip power supply structure. The lower layer circuit wafer is used (coil wafer power supply); in addition, the upper layer coil wafer and the lower layer circuit wafer are mechanically and electrically connected For coil wafer sensing and power supply, the upper coil wafer and the lower layer circuit wafer can also be mechanically separated and electrically separated for coil wafer replacement. Thus, the "DC power wireless chip" created by the invention enables the DC electrical device to be powered by an internal coil wafer for use in a circuit wafer that does not require an additional DC to DC conversion circuit or power wiring. .

Description

DC power wireless chip

The invention relates to a "DC power wireless chip" circuit, in particular to a two-layer wafer power supply structure using a replaceable coil wafer and a DC device circuit chip, and the coil wafer is used for electric energy induction and via a double The layer wafer power supply structure provides the power required for the operation of the circuit wafer to enable an electrical device circuit wafer to operate without the need for additional DC to DC conversion circuitry or power supply wiring for the new circuit chip power supply circuit.

According to the current era of unstable oil supply and fluctuating oil prices, the cost of using petroleum-related energy has increased substantially. At the same time, for the sake of the global environment, to avoid drastic changes in the environment caused by excessive carbon dioxide emissions from oil use, Advocate energy conservation and carbon reduction related practices. Among them, the innovative electrical device uses the power supply method, which can also be a specific method of energy saving and carbon reduction.

For the use of DC electric devices (such as internal computer), the circuit chip is electrically connected. Please refer to Figure 1. The general wafer system 01 inside the electrical device is electrically connected to the DC conversion circuit 02, and the DC power outside the electrical device. The DC-to-DC conversion circuit 02 supplies the electric energy required for the operation of each of the circuit chips in the general wafer system 01. As shown in FIG. 2, an electrical device supplies a central processing unit circuit 010 (ie, a CPU chip), a high-speed circuit chip 011, and a high-speed circuit chip 013 inside the general wafer system 01 via a DC to DC conversion circuit 02. (such as: memory chip, graphics wafer, etc.) and low-speed circuit chip 012, low-speed circuit chip 014 (such as: peripheral control chip, etc.) work required electrical energy.

Electrical installations such as general computers are all about "light, thin, short and small". Design, on the one hand, can save product material costs (energy saving and carbon reduction), improve product technology standards, on the other hand, it can also cater to the needs of use and increase consumer willingness. However, DC-to-DC conversion circuits and power supply wiring, which are often used in DC electrical devices, often occupy a considerable space inside the electrical device, so that it is difficult to achieve the design requirements of the light and thin electrical devices. Therefore, how to innovate the way in which electrical devices use power and power has become the research direction and goal of various electrical device manufacturers.

In view of the shortcomings arising from the above prior art, the creator of the case was improved and innovated by the philosopher, and after painstaking research, he finally successfully developed a "DC power wireless chip" circuit for the case.

The purpose of the invention is to provide a new type of circuit chip power supply circuit that utilizes a replaceable coil wafer for power induction, which in turn provides electrical energy required for the operation of the circuit chip of the electrical device. Referring to FIG. 3, the concept is to provide a coil wafer system 11 in a DC electrical device. The coil wafer system 11 is electrically connected to DC power external to the electrical device via an inverter 03. The coil wafer system 11 is internally provided with a replaceable coil wafer, which is combined with an electrical device circuit chip provided inside the coil wafer system 11 to form a two-layer wafer power supply structure; the coil wafer can receive power from outside the circuit chip for power Inductively, the inductive power provides electrical energy required for operation of the electrical device circuit wafer via a dual layer wafer powering structure. In this way, the DC electrical device can be powered by the internal coil chip to the circuit chip. In use, the electrical device circuit wafer operation does not require additional DC to DC conversion circuitry or power wiring.

For the above purposes, the technical means of the invention is to The DC electrical device (for example, inside the computer) is provided with a coil wafer system, wherein the coil wafer system is internally provided with a central processor circuit coil chip, a plurality of high speed circuit coil chips and a plurality of low speed circuit coil chips, wherein the central processor circuit The coil wafer is composed of an upper layer coil chip (central processing unit coil wafer) and a lower layer central processing unit circuit chip (CPU chip), which is composed of a double layer central processing unit wafer power supply structure, and the high speed circuit coil wafer is composed of an upper layer coil wafer (high speed coil). Wafer) and lower layer high speed circuit chips (generally high speed circuit chips, such as memory chips, graphics chips, etc.) constitute a two-layer high-speed chip power supply structure, and the low-speed circuit coil chip is composed of an upper layer coil chip (low-speed coil chip) and The lower layer low speed circuit chips (generally low speed circuit chips, such as peripheral control chips) form a double layer low speed chip power supply structure. The central processor circuit coil chip of the electrical device coil wafer system and the plurality of high speed circuit coil chips and the plurality of low speed circuit coil wafers are electrically connected by signals, respectively, such that the central processor circuit chip can be used for the plurality of high speed circuits The chip and the plurality of low-speed circuit chips are signal-controlled (executing the function of the electrical device).

The double layer central processor chip power supply structure upper layer coil wafer can receive electricity The DC power external to the gas device is inverted by the inverter and then converted into DC power. The upper coil wafer directly and stably supplies DC power to the lower central processor circuit chip via the dual-layer central processor chip power supply structure ( Central processor coil wafer power supply). In addition, the upper coil wafer and the lower central processor circuit wafer can be mechanically and electrically connected for power supply to the coil wafer, and the upper coil wafer and the lower central processor circuit wafer can also be mechanically separated and electrically separated. For coil wafer replacement (central processor coil wafer can be replaced).

The double layer high speed wafer power supply structure upper layer coil wafer can accept high speed circuit The power supply external to the chip (ie, the central processor coil chip is inductively powered) is used for power induction (high-speed coil wafer sensing power) and converted into DC power. The upper coil wafer also directs DC power directly and stably through the double-layer high-speed chip power supply structure. Power is supplied to the lower layer high speed circuit chip (high speed coil wafer power supply). In addition, the upper coil chip and the lower layer high speed circuit chip can be mechanically and electrically connected for coil wafer sensing (high speed coil wafer sensing) and power supply, and the upper coil wafer and the lower layer high speed circuit wafer can also be mechanically separated and electrically separated for coil wafer replacement. (High speed coil wafers can be replaced).

Furthermore, the upper layer coil wafer of the double-layer low-speed wafer power supply structure can also be accepted low. The power supply external to the speed circuit chip (ie, high-speed coil chip induction power supply) is used for power induction (low-speed coil wafer induction power) and converted into DC power. The upper layer coil wafer also directly and stably DC power through the double-layer low-speed chip power supply structure. Power is supplied to the underlying low speed circuit die (powered by low speed coil die). In addition, the upper coil chip and the lower layer low speed circuit chip can be mechanically and electrically connected for coil wafer sensing (low speed coil wafer sensing) and power supply, and the upper coil wafer and the lower layer low speed circuit wafer can also be mechanically separated and electrically separated for coil wafer replacement. (Low speed coil wafers can be replaced).

Thus, the central processor circuit coil wafer utilizes its dual layer central processor The wafer power supply structure accepts DC power supplied by the inverter and is powered by a central processing circuit chip that utilizes its two-layer high-speed chip power supply structure to receive inductive power supply (central processor coil wafer inductive power supply) and Powered by high-speed circuit chips, the low-speed circuit coils are also capable of receiving inductive power (high-speed coils) using their dual-layer low-speed chip power supply structure. The chip is inductively powered and powered by a low speed circuit chip. Thus, the "DC power wireless chip" created by the invention enables the DC electrical device to be powered by an internal coil wafer for use in a circuit wafer that does not require an additional DC to DC conversion circuit or power wiring. .

Please refer to the following detailed description of a preferred embodiment of the "DC power wireless chip" circuit of the present invention and its accompanying drawings, which will further understand the technical content of the creation and its purpose and effect:

01‧‧‧General wafer system

010‧‧‧Central Processor Circuit Wafer

011‧‧‧High speed circuit chip

012‧‧‧Low speed circuit chip

013‧‧‧High speed circuit chip

014‧‧‧Low speed circuit chip

02‧‧‧DC to DC conversion circuit

03‧‧‧Inverter

11‧‧‧ coil wafer system

110‧‧‧Central Processing Circuit Coil Wafer

1101‧‧‧Upper central processor coil wafer

1102‧‧‧lower central processor circuit chip

111‧‧‧ Large high speed circuit coil wafer

1111‧‧‧Upper first high speed coil wafer

1112‧‧‧Lower large-scale high-speed circuit chip

112‧‧‧ Large low-speed circuit coil wafer

1121‧‧‧Upper first low speed coil wafer

1122‧‧‧Lower large low-speed circuit chip

113‧‧‧Small high-speed circuit coil wafer

1131‧‧‧Upper second high speed coil wafer

1132‧‧‧Lower small high speed circuit chip

114‧‧‧Small low-speed circuit coil wafer

1141‧‧‧Upper second low speed coil wafer

1142‧‧‧Lower small low-speed circuit chip

Figure 1 is a schematic diagram of the use of external DC power for a typical wafer system.

Figure 2 is a block diagram and connection diagram of the use of external DC power for a typical wafer system.

Figure 3 is a schematic diagram of the use of external DC power for the coil wafer system of the present invention.

Figure 4 is a block diagram and a connection diagram of the internal structure of a preferred embodiment of the coil wafer system of the present invention.

FIG. 5 is a schematic diagram showing the internal structure of a central processor circuit coil wafer according to a preferred embodiment of the present invention.

Figure 6 is a schematic view showing the internal structure of a large-scale high-speed circuit coil wafer according to a preferred embodiment of the present invention.

Figure 7 is a schematic view showing the internal structure of a large low-speed circuit coil wafer according to a preferred embodiment of the present invention.

Figure 8 is a schematic view showing the internal structure of a small high-speed circuit coil wafer according to a preferred embodiment of the present invention.

Figure 9 is a schematic view showing the internal structure of a small low-speed circuit coil wafer according to a preferred embodiment of the present invention.

A "DC power wireless chip" circuit provided by the present invention, as shown in FIG. 3 and FIG. 4, is a coil wafer system 11 in a DC electrical device (induction power supply, signal processing of electrical devices) The coil wafer system 11 is internally provided with a central processing circuit coil wafer 110, a large high speed circuit coil wafer 111, a large low speed circuit coil wafer 112, a small high speed circuit coil wafer 113, and a small low speed circuit coil wafer 114. The central processing unit coil wafer 110 is electrically connected to the large high speed circuit coil wafer 111 and the small high speed circuit coil wafer 113 (high speed wafer signal control), and the central processing circuit coil wafer 110 is also associated with the large low speed circuit. The coil wafer 112 and the small low-speed circuit coil wafer 114 are electrically connected by signals (low-speed wafer signal control), so that the central processing circuit coil wafer 110 can perform general signal control on a plurality of high-speed circuit chips and a plurality of low-speed circuit chips to perform The function of the electrical device.

Referring to FIG. 5, the central processing unit coil wafer 110 is internally composed of an upper layer central processing unit coil chip 1101 (sensing chip) and a lower layer central processing unit circuit chip 1102 (CPU chip). The chip-powered physical and circuit structure, wherein the upper-layer central processor coil chip 1101 is electrically connected to the lower-layer central processor circuit chip 1102 via the dual-layer chip power supply structure of the central processing circuit coil wafer 110 (to the power supply electrical connection). The upper central processing unit coil wafer 1101 can receive DC power external to the electrical device and then convert it into DC power by inverter 03, and the upper central processing unit coil 1101 passes DC power through the central processing circuit coil wafer 110. Double layer chip power supply Inside the structure, power is directly and stably supplied to the lower layer central processing unit circuit 1102 (powered by the central processing unit coil chip 1101). In addition, the upper central processing unit coil chip 1101 and the lower central processing unit circuit 1102 can be mechanically and electrically connected to supply power to the coil, and the upper central processing unit coil 1101 and the lower central processing circuit 1102 can also be used. Mechanical separation and electrical separation for coil wafer replacement (ie, central processor coil wafer 1101 can be replaced).

Referring to FIG. 6, the inside of the large high-speed circuit coil wafer 111 is An upper first high speed coil wafer 1111 (inductive wafer) and a lower large high speed circuit wafer 1112 (generally high speed circuit wafer) constitute a double layer large high speed wafer power supply physical and circuit structure, wherein the upper first high speed coil wafer 1111 passes through the The double-layer wafer power supply structure of the large high-speed circuit coil wafer 111 can be electrically connected to the lower large-sized high-speed circuit chip 1112 (electrically connected by a power source). The upper first high speed coil wafer 1111 can receive power from the outside of the large high speed circuit coil wafer 111 (ie, the central processing unit coil wafer 1101 is powered) (electrical induction by the first high speed coil wafer 1111) and converted into direct current power. The upper first high-speed coil wafer 1111 directly and stably supplies power to the lower large-sized high-speed circuit wafer 1112 (the first high-speed coil wafer 1111 is supplied with power) via the large-sized high-speed coil wafer 111 in the double-layer wafer power supply structure. In addition, the upper first high speed coil wafer 1111 and the lower large high speed circuit wafer 1112 can be mechanically and electrically connected for coil wafer sensing (first high speed coil wafer 1111 sensing) and power supply, the upper first high speed coil The wafer 1111 and the lower large-sized high-speed circuit wafer 1112 can also be mechanically separated and electrically separated for coil wafer replacement (ie, the first high-speed coil wafer 1111 can be replaced).

In addition, please refer to FIG. 8 , the inside of the small high-speed circuit coil wafer 113 The upper layer second high speed coil wafer 1131 (sensing wafer) and the lower layer small high speed circuit chip 1132 (general high speed circuit wafer) are composed of a double layer small high speed wafer power supply physical and circuit structure, wherein the upper second high speed coil wafer 1131 The low-layer high-speed circuit chip 1132 can be electrically connected to the lower-layer small-speed high-speed circuit chip 1132 (electrically connected by a power source) via the small-layer wafer power supply structure of the small high-speed circuit coil wafer 113. The upper second high speed coil wafer 1131 can receive power from the outside of the small high speed circuit coil chip 113 (ie, the central processing unit coil chip 1101 inductively supplies power) for power induction (the second high speed coil wafer 1131 inductive power) and converts it into DC power. The upper second high-speed coil wafer 1131 directly and stably supplies power to the lower small-sized high-speed circuit wafer 1132 via the small-sized high-speed coil wafer 113 in the double-layer wafer power supply structure (the second high-speed coil wafer 1131 supplies power). In addition, the upper second high speed coil wafer 1131 and the lower small high speed circuit wafer 1132 can be mechanically and electrically connected for coil wafer sensing (second high speed coil wafer 1131 sensing) and power supply, and the upper second high speed coil wafer 1131 and The lower small high speed circuit chip 1132 can also be mechanically separated and electrically separated for coil wafer replacement (ie, the second high speed coil wafer 1131 can be replaced).

Referring to FIG. 7, the inside of the large low-speed circuit coil wafer 112 is An upper first low speed coil wafer 1121 (inductive wafer) and a lower layer large low speed circuit wafer 1122 (generally low speed circuit wafer) constitute a double layer large low speed wafer power supply physical and circuit structure, wherein the upper first low speed coil wafer 1121 passes through the The double-layer wafer power supply structure of the large low-speed circuit coil wafer 112 can be electrically connected to the lower-layer large-scale low-speed circuit chip 1122 (electrically connected by a power source). The upper first low speed coil wafer 1121 can receive power supply external to the large low speed circuit coil wafer 112 (ie, the first high speed coil wafer 1111 is inductively supplied) for electric energy induction (first low speed coil wafer 1121 inductive power) and converted into direct current power. The upper first low speed The coil wafer 1121 directly and stably supplies power to the lower large-sized low-speed circuit wafer 1122 (powered by the first low-speed coil wafer 1121) via the large-sized low-speed circuit coil wafer 112 inside the double-layer wafer power supply structure. In addition, the upper first low speed coil wafer 1121 and the lower large low speed circuit wafer 1122 can be mechanically and electrically connected for coil wafer sensing (first low speed coil wafer 1121 sensing) and power supply, the upper first low speed coil. The wafer 1121 and the lower large-sized low-speed circuit wafer 1122 can also be mechanically separated and electrically separated for coil wafer replacement (ie, the first low-speed coil wafer 1121 can be replaced).

Furthermore, please refer to FIG. 9 , the small low speed circuit coil wafer 114 The internal system consists of an upper second low-speed coil wafer 1141 (inductive wafer) and a lower-layer small low-speed circuit wafer 1142 (generally low-speed circuit wafer) to form a double-layer small low-speed wafer power supply physical and circuit structure, wherein the upper second low-speed coil wafer 1141 is electrically connected to the lower layer small low-speed circuit wafer 1142 via the dual-layer wafer power supply structure of the small low-speed circuit coil wafer 114 (electrically connected by a power source). The upper second low speed coil wafer 1141 can receive power supply external to the small low speed circuit coil wafer 114 (ie, the second high speed coil wafer 1131 is inductively supplied) for power induction (the second low speed coil wafer 1141 inductive energy) and convert it into DC power. The upper second low speed coil wafer 1141 directly and stably supplies power to the lower small low speed circuit wafer 1142 (powered by the second low speed coil wafer 1141) via the small low speed circuit coil 114 in the double layer wafer power supply structure. In addition, the upper second low speed coil wafer 1141 and the lower small low speed circuit wafer 1142 are mechanically and electrically connected for coil wafer sensing (second low speed coil wafer 1141 sensing) and power supply, and the upper second low speed coil wafer 1141 and The lower layer small low speed circuit wafer 1142 can also be mechanically separated and electrically separated for coil wafer replacement (ie, the second low speed coil wafer 1141 can be replaced).

Therefore, the creation of the invention proposes that a coil device can be provided for the current electrical device. System 11 such that the central processor circuit coil wafer 110 within the coil wafer system 11 can be powered by its dual layer central processor chip power supply structure (the central processor coil wafer is powered to the central processor circuit chip), which is a large high speed The circuit coil wafer 111 and the small high-speed circuit coil wafer 113 can be used for inductive power supply (high-speed coil wafer induction power, high-speed coil wafer power supply to high-speed circuit wafer) by using the double-layer high-speed chip power supply structure, and the large low-speed circuit coil wafer 112, The small low-speed circuit coil wafer 114 can also be used for inductive power supply using its dual-layer low-speed wafer power supply structure (low-speed coil wafer induction power, low-speed coil wafer power supply to low-speed circuit wafers). Thus, by using the "DC power wireless chip" created by the invention, the DC device can be powered by the internal coil chip, which does not require an additional DC-to-DC conversion circuit or power supply wiring. Therefore, the DC-to-DC conversion circuit and the power supply wiring frequently used in the DC electric device do not occupy a considerable space inside the electric device.

The detailed description above is for a possible embodiment of the inventive creation It is to be understood that the examples are not intended to limit the scope of the invention, and that equivalents or equivalents, such as equivalent variations, should be included in the embodiments of the invention. The scope of this creation patent.

Claims (6)

An electrical device using a DC power wireless chip, comprising: a coil wafer system disposed in the electrical device, the coil wafer system being an inductive power supply and signal processing device for the internal wafer of the electrical device, the coil wafer system comprising: a central a processor circuit coil chip, a large high speed circuit coil chip, a small high speed circuit coil chip, a large low speed circuit coil chip, and a small low speed circuit coil chip; wherein the central processor circuit coil chip is disposed on the coil wafer system The central processing circuit coil wafer is an inductive power supply and a central processing circuit chip component device of a coil wafer system having a dual layer central processor chip power supply structure and external to the electrical device DC power; the large high-speed circuit coil chip is disposed in the coil wafer system, and the large high-speed circuit coil chip is an inductively-receiving and large-scale high-speed circuit chip component device of the coil wafer system, and the large-scale high-speed circuit coil wafer has a double-layer large-scale High speed wafer for The central processing circuit coil chip and the large high-speed circuit coil wafer are electrically connected by signals for high-speed wafer signal control; the small high-speed circuit coil wafer is disposed in the coil wafer system, and the small high-speed circuit coil wafer is a coil wafer One of the systems is an inductively-receiving and small-sized high-speed circuit chip device having a dual-layer small high-speed chip power supply structure, and the central processing circuit coil chip is electrically connected to the small high-speed circuit coil wafer as a high-speed chip signal. Controlling; the large low-speed circuit coil chip is disposed in the coil wafer system, and the large low-speed circuit coil chip is one of a coil wafer system for inductively receiving power and a large low-speed circuit chip component The large low-speed circuit coil chip has a double-layer large-scale low-speed chip power supply structure, and the central processing circuit coil chip and the large low-speed circuit coil chip are electrically connected by signals for low-speed wafer signal control; the small low-speed circuit coil chip is disposed on In the coil wafer system, the small low-speed circuit coil chip is an inductively-receiving and small-sized low-speed circuit chip component device of a coil wafer system having a double-layer small low-speed wafer power supply structure, the central processor circuit coil chip Signaling electrical connection to the small low speed circuit coil wafer for low speed wafer signal control; thereby enabling the central processor circuit coil wafer within the coil wafer system to be powered to the central processor using its dual layer central processor chip power supply structure The circuit chip, the large high-speed circuit coil chip, the small high-speed circuit coil chip can be used for inductively receiving power and supplying power to the high-speed circuit chip by using the double-layer high-speed chip power supply structure, and the large low-speed circuit coil chip and the small low-speed circuit coil wafer are utilized. The double-layer low-speed chip power supply structure can also be used for inductively receiving power and supplying power to the low-speed circuit chip; thus, using the coil wafer system created by the invention, an electrical device can be inductively supplied to the circuit chip inside the electrical device, which Electrical device circuit wafer operation does not require additional DC to DC conversion circuitry or power wiring. An electrical device using a DC power wireless chip as claimed in claim 1, wherein the central processing circuit coil wafer is internally composed of an upper layer central processor coil chip and a lower layer central processor circuit chip. a circuit structure, wherein the upper central processing unit coil chip is electrically connected to the lower central processing circuit chip via a power supply structure of the dual-layer chip power supply structure of the central processing circuit coil; the upper layer The central processing unit coil chip can receive DC power external to the electrical device and then convert it into DC power by an inverter, and the upper central processing unit coil wafer transmits DC power through the central processing circuit coil wafer double-layer chip power supply structure. Internally, directly and stably supplying power to the lower central processing unit circuit; in addition, the upper central processing unit coil chip is mechanically and electrically connected to the lower central processing unit circuit to supply power to the coil wafer, the upper layer central processing unit The coil wafer and the lower central processor circuit chip can also be mechanically separated and electrically separated for coil wafer replacement. An electrical device using a DC power wireless chip as claimed in claim 1, wherein the large high-speed circuit coil wafer is composed of an upper layer first high speed coil chip and a lower layer large high speed circuit chip to form a double layer large high speed chip power supply physical and circuit structure. The upper first high speed coil chip can be electrically connected to the lower large high speed circuit chip via a double layer wafer power supply structure of the large high speed circuit coil chip; the upper first high speed coil chip can accept the large high speed circuit The power supply external to the coil wafer is electrically sensed and converted into DC power. The upper first high speed coil wafer passes DC power through the large high-speed circuit coil wafer double-layer chip power supply structure, and directly and stably supplies power to the lower large-scale high-speed circuit chip. In addition, the upper first high speed coil chip and the lower large high speed circuit chip are mechanically and electrically connected for coil chip sensing and power supply, and the upper first high speed coil chip and the lower large high speed circuit chip are also mechanically separated and Electrical separation for coil crystal Tablet replacement. An electrical device using a DC power wireless chip as claimed in claim 1, wherein the small high-speed circuit coil wafer is composed of an upper second high-speed coil chip and a lower-layer small high-speed circuit chip to form a double-layer small high-speed chip power supply physical and circuit structure. Among them, the upper second is high The speed coil chip is electrically connected to the lower small high speed circuit chip via a power supply structure of the small high speed circuit coil chip; the upper second high speed coil chip can receive the power supply outside the small high speed circuit coil chip The electric energy is induced and converted into DC electric energy, and the upper second high-speed coil wafer directly and stably supplies power to the lower small-sized high-speed circuit chip through the small high-speed circuit coil wafer double-layer chip power supply structure; in addition, the upper layer The two high-speed coil chips are mechanically and electrically connected to the lower-layer small high-speed circuit chip for sensing and supplying power to the coil wafer, and the upper second high-speed coil wafer and the lower small-sized high-speed circuit wafer are also mechanically separated and electrically separated for use as a coil wafer. replace. An electrical device using a DC power wireless chip as claimed in claim 1, wherein the large low-speed circuit coil wafer is composed of an upper layer first low-speed coil chip and a lower-layer large-speed low-speed circuit chip to form a double-layer large-scale low-speed chip power supply physical and circuit structure. The upper first low speed coil chip can be electrically connected to the lower large-sized low-speed circuit chip via the double-layer wafer power supply structure of the large low-speed circuit coil chip; the upper first low-speed coil chip can accept the large low-speed circuit The power supply external to the coil wafer is electrically sensed and converted into DC power. The upper first low speed coil wafer passes DC power through the large low speed circuit coil wafer double layer chip power supply structure, and directly and stably supplies power to the lower large low speed circuit chip. In addition, the upper first low speed coil chip and the lower large low speed circuit chip are mechanically and electrically connected for coil wafer sensing and power supply, and the upper first low speed coil chip and the lower large low speed circuit chip are mechanically separated and Electrical separation for coil crystal Tablet replacement. An electrical device using a DC power wireless chip as claimed in claim 1, wherein the small low-speed circuit coil wafer is composed of an upper second low-speed coil chip and a lower-layer small low-speed circuit chip to form a double-layer small low-speed chip power supply physical and circuit structure. The upper second low speed coil chip can be electrically connected to the lower layer small low speed circuit chip via the double layer wafer power supply structure of the small low speed circuit coil chip; the upper second low speed coil chip can accept the small low speed circuit. The power supply external to the coil wafer is electrically sensed and converted into DC power. The upper second low speed coil wafer passes DC power through the small low speed circuit coil wafer double layer chip power supply structure, and directly and stably supplies power to the lower layer small low speed circuit chip. In addition, the upper second low speed coil chip is mechanically and electrically connected to the lower layer small low speed circuit chip for coil chip sensing and power supply, and the upper second low speed coil chip and the lower layer small low speed circuit chip are also mechanically separated and Electrical separation for coil crystal Tablet replacement.