TWI598787B - Replacement wireless touch chip system - Google Patents

Description

Replacement wireless touch chip system

The invention relates to a "displacement wireless touch chip system" circuit, in particular to a dual-chip power supply sensing structure using a replaceable wireless sensing chip and an electrical device circuit chip, the wireless sensing The chip can be powered by the dual-layer chip power sensing structure and can receive control of the power of the circuit chip to receive and receive the wave for wireless touch, so that the liquid crystal display of an electrical device does not require the traditional touch screen device of the new liquid crystal display screen. Circuitry.

According to the current era of unstable oil supply and fluctuating oil prices, the cost of using petroleum-related energy may increase. At the same time, for the sake of the global environment, to avoid drastic changes in the environment caused by the excessive use of carbon dioxide, all parties advocate Energy conservation and carbon reduction related practices. Among them, the innovative electric device liquid crystal display using the touch device method can also be a specific practice of energy saving and carbon reduction.

The use of liquid crystal display methods for conventional electrical devices (such as portable devices or handheld devices: tablet computers, smart phones, smart watches, etc.), as shown in Figure 1, is mainly based on the general wafer system 01 of electrical devices. One of the electrical devices, the touch panel 02 (sensing device) is electrically connected, and the touch panel 02 further provides a sensing source required for the operation of the liquid crystal display 03. As shown in Figure 2, an electrical device is centrally processed via the internal wafer system 01. The circuit board 010 (CPU chip) controls the touch panel 02 and the liquid crystal display 03, so that the touch panel 02 can provide a sensing source of the liquid crystal display 03. The general wafer system 01 further includes a general circuit chip 011 and a general circuit chip 012. , a general circuit chip 013, a general circuit chip 014 (such as: memory chip, graphics chip, peripheral control chip, etc.).

In general, electrical devices such as portable devices or handheld devices are designed for "high cost performance" products. On the one hand, they save product material costs (energy saving and carbon reduction), improve product technology standards, and on the other hand cater to the needs of use and increase consumer willingness. However, touch devices (such as touch panels) that are often used in liquid crystal displays of electrical devices often occupy a considerable cost for electrical devices. In addition, direct touch of the liquid crystal display directly causes the user to be troubled by the use of the touch screen. Therefore, how to innovate the use of touch devices in the liquid crystal display of electrical devices has become a new research direction and goal of various electrical device manufacturers.

In view of the shortcomings arising from the above prior art, the creator of the case was improved and innovated by the singer, and after painstaking research, he finally successfully developed a "displacement wireless touch chip system" circuit of the present case.

The purpose of the invention is mainly to provide an electrical device liquid crystal display, a new type of touch screen circuit for transmitting and receiving electric waves for wireless touch using a wireless sensing chip. Referring to FIG. 3, the concept is to provide a wireless sensing wafer system 11 in an electrical device. The wireless sensing wafer system 11 is electrically connected to a liquid crystal display 03. The wireless sensing chip system 11 is internally provided with a replaceable wireless sensing chip, and the wireless sensing chip is combined with an original circuit chip inside the electrical device to form a two-layer wafer power sensing structure; the electrical device circuit chip is via a double layer The wafer power sensing structure provides wireless sensing of the power required for the operation of the wafer, the wireless sensing chip The power-sensing sensing structure via the dual-layer wafer can be controlled to transmit radio waves and receive radio waves for wireless touch use. In this way, an electrical device can use the internally replaceable wireless sensing chip for liquid crystal display for wireless touch operation, and the liquid crystal display operation of the electrical device does not require a conventional touch device.

For the above purposes, the technical means for creating the invention is to provide a wireless sensing chip system in an electrical device (such as a portable device or a handheld device: a tablet computer, a smart phone, a smart watch, etc.). The wireless sensing chip system is internally provided with a central processing unit circuit and a wireless sensing chip, a plurality of large circuit and wireless sensing chips, and a plurality of small circuit and wireless sensing chips. The central processing unit and the wireless sensing chip are composed of an upper layer wireless sensing chip (central processing unit wireless sensing chip) and a lower layer central processing unit circuit chip (CPU chip) to form a double layer central processing unit chip power sensing structure. The large-scale circuit and wireless sensing chip is composed of an upper layer wireless sensing chip (large wireless sensing chip) and a lower layer large circuit chip (generally a large circuit chip, such as a memory chip, a drawing chip, etc.). The chip power supply sensing structure, and the small circuit and wireless sensing chip is composed of an upper layer wireless sensing chip (small wireless sensing chip) and a lower layer small circuit chip (generally a small circuit chip such as a peripheral control chip) Layer small wafer power sensing structure. The central processor circuit and the wireless sensing chip of the electrical device wireless sensing chip system are electrically connected to the plurality of large circuit and wireless sensing chips, the plurality of small circuits and the wireless sensing chip, respectively, so that the central processing circuit The wafer can control a plurality of large circuit chips and a plurality of small circuit chips (executing the functions of the electrical device).

The dual-layer central processor chip power sensing structure underlying central processor circuit chip can receive power supply (such as: mains, mobile power, etc.) external to the electrical device for power supply (central processor circuit chip power supply), the lower central Processor circuit chip and power it The electrical energy is internally supplied to the upper wireless sensing wafer via the dual layer central processor chip power sensing structure; the upper wireless sensing wafer is internally controllable by the dual layer central processor chip power sensing structure to accept central processor circuit wafer control The transmitting wave and the receiving wave are used for wireless touch (the central processing unit wireless sensing chip transmits the wave and receives the wave). In addition, the upper wireless sensing chip and the lower central processing circuit chip are mechanically and electrically connected for wireless sensing wafer power supply (the central processing unit wireless sensing chip transmits radio waves, receives electric waves), and the upper layer wireless sensing The wafer and the lower central processing unit circuit can also be mechanically separated and electrically separated for wireless sensing wafer replacement (central processing unit wireless sensing wafer replaceable).

The large-scale circuit chip under the double-layer large-scale chip-powered sensing structure can also be powered by an electric power source external to the electrical device for power supply (powered by a large-scale large-scale circuit chip), and the lower-layer large-scale circuit chip also supplies power to the power supply via a double-layer large chip. The internal power supply of the sensing structure is used for the upper wireless sensing chip; the upper wireless sensing chip is controlled by the dual-layer large-scale chip-powered sensing structure to receive the central processor circuit chip to transmit the electric wave and receive the electric wave for wireless touch use ( Large wireless sensing chips transmit radio waves and receive radio waves). In addition, the upper wireless sensing chip and the lower large circuit chip are mechanically and electrically connected for wireless sensing wafer power supply (large wireless sensing chip transmits radio waves, receives electric waves), and the upper wireless sensing chip and the lower layer Large circuit chips can also be mechanically separated and electrically separated for wireless sensing wafer replacement (large wireless sensing wafers are replaceable).

Furthermore, the small-sized circuit chip under the double-layer small-chip power supply sensing structure can also be powered by an electric power source external to the electrical device for power supply (lower-sized small-circuit circuit chip power supply), and the lower-layer small-circuit circuit chip also supplies power to the power through the double layer. The small chip power sensing structure internally supplies power to the upper layer wireless sensing chip; the upper layer wireless sensing chip is supplied via a double layer small chip The inductance measuring structure can internally control the central processor circuit chip to transmit the electric wave and receive the electric wave for wireless touch use (the small wireless sensing chip transmits the electric wave and receives the electric wave). In addition, the upper layer wireless sensing chip and the lower layer small circuit chip are mechanically and electrically connected for wireless sensing chip power supply (small wireless sensing chip transmits radio waves, receives electric waves), and the upper layer wireless sensing chip and the lower layer Small circuit chips can also be mechanically separated and electrically separated for wireless sensing wafer replacement (small wireless sensing wafers are replaceable).

Therefore, the central processing unit and the wireless sensing chip can use the dual-layer central processing unit chip power supply sensing structure to perform wireless touch (the central processing unit wireless sensing chip transmits radio waves, receives electric waves), and the plurality of large-scale circuits The wireless sensing chip can also be used for wireless touch (large wireless sensing chip to transmit electric waves and receive electric waves) by using the double-layer large-scale chip power sensing structure, and the plurality of small circuit and wireless sensing chips use the double-layer small chip The inductive measurement structure can also be used for wireless touch (small wireless sensing chip to transmit radio waves and receive radio waves). Thus, using the "displacement wireless touch chip system" created by the present invention, an electrical device can be internally The replaceable wireless sensing chip is used for liquid crystal display for wireless touch operation, and the liquid crystal display operation of the electrical device does not require a conventional touch device (such as a touch panel or the like).

Please refer to the following detailed description of a preferred embodiment of the circuit of the "displaced wireless touch chip system" of the present invention and its accompanying drawings, which will further understand the technical content of the creation and its purpose and effect:

01‧‧‧General wafer system

010‧‧‧Central Processor Circuit Wafer

011‧‧‧General circuit chip

012‧‧‧General circuit chip

013‧‧‧General circuit chip

014‧‧‧General circuit chip

02‧‧‧Touch panel

03‧‧‧LCD display

11‧‧‧Wireless sensing chip system

110‧‧‧Central processor circuit and wireless sensing chip

1101‧‧‧Upper central processing unit wireless sensing chip

1102‧‧‧lower central processor circuit chip

111‧‧‧The first large circuit and wireless sensing chip

1111‧‧‧Upper first wireless sensing chip

1112‧‧‧Lower first large circuit chip

112‧‧‧Second large circuit and wireless sensing chip

1121‧‧‧Upper second wireless sensing chip

1122‧‧‧Lower second large circuit chip

113‧‧‧First small circuit and wireless sensing chip

1131‧‧‧Upper third wireless sensing chip

1132‧‧‧Lower first small circuit chip

114‧‧‧Second small circuit and wireless sensing chip

1141‧‧‧Upper fourth wireless sensing chip

1142‧‧‧Lower second small circuit chip

Figure 1 is a diagram showing the relationship between a touch panel and a liquid crystal display in a general wafer system.

Figure 2 is a block diagram and connection diagram of the internal structure of a general wafer system.

FIG. 3 is a schematic diagram of the wireless sensing wafer system of the present invention without using a touch panel.

4 is a block diagram and a connection diagram of an internal structure of a preferred embodiment of the wireless sensing chip system of the present invention.

FIG. 5 is a schematic diagram showing the internal structure of a central processing unit and a wireless sensing chip according to a preferred embodiment of the wireless sensing chip system of the present invention.

FIG. 6 is a schematic diagram showing the internal structure of a first large-scale circuit and a wireless sensing chip according to a preferred embodiment of the wireless sensing chip system of the present invention.

FIG. 7 is a schematic diagram showing the internal structure of a second large circuit and a wireless sensing chip according to a preferred embodiment of the wireless sensing chip system of the present invention.

FIG. 8 is a schematic diagram showing the internal structure of a first small circuit and a wireless sensing chip according to a preferred embodiment of the wireless sensing chip system of the present invention.

FIG. 9 is a schematic diagram showing the internal structure of a second small circuit and a wireless sensing chip according to a preferred embodiment of the wireless sensing chip system of the present invention.

A "displacement wireless touch chip system" circuit provided by the present invention, as shown in FIGS. 3 and 4, is a wireless sensing wafer system 11 (electrical device wireless device) in an electrical device. a touch sensing device, the wireless sensing chip system 11 is internally provided with a central processing circuit and a wireless sensing chip 110, a first large circuit and wireless sensing chip 111, a second large circuit and wireless sensing chip 112, and A first small circuit and wireless sensing chip 113, a second small circuit and wireless sensing chip 114. The central processing circuit and the wireless sensing chip 110 are electrically connected to the first large circuit and wireless sensing chip 111, the second large circuit and the wireless sensing chip 112 (large chip control), and the central processing circuit is cum Wireless sensing crystal The chip 110 is also electrically connected to the first small circuit and wireless sensing chip 113 and the second small circuit and wireless sensing chip 114 (small wafer control), so that the central processing circuit and the wireless sensing chip 110 can be A plurality of large circuit chips and a plurality of small circuit chips are generally controlled to perform the functions of the electrical device.

Referring to FIG. 5, the central processing unit and the wireless sensing chip 110 are internally composed of an upper layer central processing unit wireless sensing chip 1101 (sensing chip) and a lower layer central processing unit circuit chip 1102 (CPU chip). Forming a two-layer central processor chip power sensing structure, wherein the upper central processing unit wireless sensing chip 1101 is internally powered by the dual layer central processing unit chip and electrically coupled to the lower central processing unit circuit 1102 Connection (power supply, signal electrical connection). The lower layer central processor circuit chip 1102 can receive the power supply (mains, mobile power) external to the central processing circuit and the wireless sensing chip 110 for power supply (central processor circuit chip power supply), the lower layer central processor circuit chip 1102 and powering the power through the dual-layer central processor chip power sensing structure, and supplying power to the upper-layer central processing unit wireless sensing chip 1101. The upper layer central processing unit wireless sensing chip 1101 is controlled via the dual layer central processing unit chip power sensing structure to receive a central frequency circuit chip 1102 to transmit a specific frequency spherical wave (a central processing unit wireless sensing chip transmitting wave), The upper central processing unit wireless sensing chip 1101 can also be controlled by the central processing unit circuit 1102 via the dual layer central processing unit chip power sensing structure to receive the specific frequency reflected wave (the central processing unit wireless sensing chip receiving wave) ). In addition, the upper central processing unit wireless sensing chip 1101 and the lower central processing unit circuit 1102 can be mechanically and electrically connected for wireless sensing wafer power supply (the central processing unit wireless sensing chip transmits radio waves, receives The upper layer central processing unit wireless sensing chip 1101 and the lower layer central processing unit circuit 1102 are also Mechanical separation and electrical separation for wireless sensing wafer replacement (central processing unit wireless sensing wafer replaceable).

Referring to FIG. 6, the first large-scale circuit and wireless sensing chip 111 is internally composed of an upper first wireless sensing chip 1111 (sensing chip) and a lower first large circuit chip 1112 (generally large circuit chip). Forming a double-layer first large-scale wafer-powered sensing structure, wherein the upper-layer first wireless sensing wafer 1111 is electrically connected to the inner portion of the first large-sized circuit chip 1112 via the double-layer first large-sized wafer. Connection (power supply, signal electrical connection). The lower first large circuit chip 1112 can receive power supply (mains, mobile power) external to the first large circuit and wireless sensing chip 111 for power supply (first large circuit chip power supply), the lower first large circuit chip 1112 and powering the power through the double-layer first large-scale chip power sensing structure, and supplying power to the upper first wireless sensing chip 1111 for use. The upper first wireless sensing die 1111 is controlled by the dual-layer first large-scale wafer-powered sensing structure internal control central processor circuit chip 1102 to transmit a specific frequency spherical wave (first wireless sensing wafer transmitting wave), the upper layer The first wireless sensing die 1111 is also internally controllable by the central processor circuit die 1102 via the dual layer first large wafer power sensing structure to receive the specific frequency reflected wave (the first wireless sensing wafer receiving wave). In addition, the upper first wireless sensing die 1111 and the lower first large circuit die 1112 can be mechanically and electrically connected for wireless sensing wafer power supply (the first wireless sensing chip transmits radio waves, receives radio waves) The upper first wireless sensing wafer 1111 and the lower first large circuit wafer 1112 can also be mechanically separated and electrically separated for wireless sensing wafer replacement (first wireless sensing wafer replaceable).

Please refer to FIG. 7 , the second large circuit and wireless sensing chip 112 The system is composed of an upper second wireless sensing chip 1121 (sensing chip) and a lower second large circuit chip 1122 (generally large circuit chip) to form a double-layer second large-chip power supply sensing structure, wherein the upper layer The second wireless sensing chip 1121 is electrically connected to the lower second large circuit chip 1122 via the double-layer second large-sized chip power sensing structure (electrical power, signal electrical connection). The lower second large circuit chip 1122 can receive power supply (mains, mobile power) external to the second large circuit and wireless sensing chip 112 for power supply (second large circuit chip power supply), the lower second large circuit chip 1122 and powering the power through the double-layer second large-scale chip power sensing structure, and supplying power to the upper second wireless sensing chip 1121. The upper second wireless sensing wafer 1121 is controlled by the dual-layer second large-scale wafer-powered sensing structure internal control central processor circuit chip 1102 to transmit a specific frequency spherical wave (second wireless sensing wafer transmitting wave), the upper layer The second wireless sensing wafer 1121 can also be controlled by the central processor circuit chip 1102 via the dual-layer second large-scale chip-powered sensing structure to receive the specific frequency reflected wave (the second wireless sensing chip receives the wave). In addition, the upper second wireless sensing chip 1121 and the lower second large circuit chip 1122 can be mechanically and electrically connected for wireless sensing wafer power supply (the second wireless sensing chip transmits radio waves, receives radio waves) The upper second wireless sensing die 1121 and the lower second large circuit die 1122 can also be mechanically separated and electrically separated for wireless sensing wafer replacement (second wireless sensing wafer replaceable).

In addition, as shown in FIG. 8, the first small circuit and wireless sensing chip 113 is internally composed of an upper third wireless sensing chip 1131 (sensing chip) and a lower layer first small circuit chip 1132 (general small circuit). The wafer) constitutes a two-layer first small-chip power supply sensing structure, wherein the upper third wireless sensing wafer 1131 is powered via the double-layer first small chip The inside of the sensing structure is electrically connectable to the lower first small circuit chip 1132 (power supply, signal electrical connection). The lower first small circuit chip 1132 can receive power supply (mains, mobile power) external to the first small circuit and wireless sensing chip 113 for power supply (first small circuit chip power supply), the lower first small circuit chip 1132 and powering the power through the double-layer first small-chip power supply sensing structure, and supplying power to the upper third wireless sensing wafer 1131. The upper third wireless sensing wafer 1131 is controlled by the dual-layer first small-chip power-supply sensing structure internal control central processor circuit chip 1102 to transmit a specific frequency spherical wave (third wireless sensing wafer transmitting wave), the upper layer The third wireless sensing die 1131 is also internally controllable by the central processor circuit wafer 1102 via the dual layer first small chip power sensing structure to receive the specific frequency reflected wave (the third wireless sensing chip receiving wave). In addition, the upper third wireless sensing chip 1131 and the lower first small circuit chip 1132 can be mechanically and electrically connected for wireless sensing wafer power supply (the third wireless sensing chip transmits radio waves, receives radio waves) The upper third wireless sensing wafer 1131 and the lower first small circuit wafer 1132 can also be mechanically separated and electrically separated for wireless sensing wafer replacement (third wireless sensing wafer replaceable).

Furthermore, as shown in FIG. 9, the second small circuit and wireless sensing chip 114 is internally composed of an upper fourth wireless sensing chip 1141 (sensing chip) and a lower second small circuit chip 1142 (generally The small-sized circuit chip constitutes a double-layer second small-chip power-supply sensing structure, wherein the upper-layer fourth wireless sensing chip 1141 is powered inside the sensing structure via the double-layer second small-sized wafer, and the lower-layer second small-sized circuit The wafer 1142 is electrically connected (power supply, signal electrical connection). The lower second small circuit chip 1142 can receive the power supply (mains, mobile power) external to the second small circuit and wireless sensing chip 114 for power supply (second small The second type of small circuit chip 1142 is powered by the lower layer of the second small circuit chip 1142, and the power is supplied to the upper layer of the fourth wireless sensing chip 1141 via the double layer second small chip power sensing structure. The upper fourth wireless sensing wafer 1141 is controlled via the dual layer second small chip power sensing structure internal acceptable central processor circuit chip 1102 to transmit a specific frequency spherical wave (fourth wireless sensing wafer transmitting wave), the upper layer The fourth wireless sensing die 1141 is also internally controllable by the central processor circuit wafer 1102 via the dual layer second small chip power sensing structure to receive the specific frequency reflected wave (fourth wireless sensing wafer receiving wave). In addition, the upper fourth wireless sensing chip 1141 and the lower second small circuit chip 1142 can be mechanically and electrically connected for wireless sensing wafer power supply (fourth wireless sensing chip transmits radio waves, receives electric waves) The upper fourth wireless sensing wafer 1141 and the lower second small circuit wafer 1142 can also be mechanically separated and electrically separated for wireless sensing wafer replacement (fourth wireless sensing wafer replaceable).

Therefore, the present invention proposes that an electrical device can be provided with a wireless sensing chip system 11 . The central processing circuit chip 1102 inside the wireless sensing chip system 11 can control the central processing unit wireless sensing chip 1101. a wireless sensing chip 1111, the second wireless sensing chip 1121, the third wireless sensing chip 1131, and the fourth wireless sensing chip 1141 transmit a specific frequency spherical wave and receive the specific frequency reflected wave, the central processor The circuit chip 1102 can calculate and compare the central processing unit wireless sensing chip 1101, the first wireless sensing chip 1111, the second wireless sensing chip 1121, the third wireless sensing chip 1131, and the fourth wireless sensing. The chip 1141 individually receives the signal strength of the reflected wave of the specific frequency, so that the central processing circuit and the wireless sensing chip 110 inside the wireless sensing chip system 11 , the first large circuit and the wireless sensing chip 111 , and the second large circuit Wireless sensing chip 112, first small circuit cum The wireless sensing chip 113, the second small circuit and the wireless sensing chip 114 can be used for wireless touch (power supply of the circuit chip, wireless sensing of the wafer to transmit electric waves, reception of electric waves). Thus, the "displacement type wireless touch chip system" created by the invention enables an electrical device to use an internally replaceable wireless sensing chip for liquid crystal display for wireless touch operation, and the liquid crystal display operation of the electrical device does not require a conventional operation. The touch device does not cause the touch device that is often used in the liquid crystal display of the electrical device to take up the considerable cost of the electrical device, or the liquid crystal display of the electrical device directly touches the use and causes the touch screen to be defaced.

The detailed description above is a detailed description of the possible embodiments of the present invention, but the embodiments are not intended to limit the scope of the invention, and the equivalent implementation or modification of the inventive concept is not deviated from the spirit of the invention. For example, equivalent embodiments of variations, etc., should be included in the scope of the patent of the present invention.

03‧‧‧LCD display

11‧‧‧Wireless sensing chip system

110‧‧‧Central processor circuit and wireless sensing chip

111‧‧‧The first large circuit and wireless sensing chip

112‧‧‧Second large circuit and wireless sensing chip

113‧‧‧First small circuit and wireless sensing chip

114‧‧‧Second small circuit and wireless sensing chip

Claims (7)

A "displacement wireless touch chip system" circuit comprising: a wireless sensing chip system disposed in an electrical device, the wireless sensing chip system being a wireless touch device of the electrical device; and a central processor circuit a wireless sensing chip disposed in the wireless sensing chip system, the central processing circuit and the wireless sensing chip being one of the wireless sensing chip system, the wireless touch and the central processing circuit chip component device, the central processing unit The circuit and wireless sensing chip has a dual-layer central processor chip power sensing structure; a first large circuit and a wireless sensing chip are disposed in the wireless sensing chip system, and the first large circuit and wireless sensing chip is The wireless sensing chip system is a wireless touch and a large circuit chip component device. The first large circuit and wireless sensing chip has a double-layer large-scale chip power sensing structure, and the central processing circuit and the wireless sensing chip are The first large circuit and wireless sensing chip are electrically connected for wafer control; a second large circuit and wireless sensing chip are disposed in the wireless sense In the chip system, the second large circuit and wireless sensing chip is also a wireless touch and a large circuit chip component device of the wireless sensing chip system, and the second large circuit and wireless sensing chip also has a double layer large a chip-powered sensing structure, the central processing circuit and the wireless sensing chip are electrically connected to the second large circuit and the wireless sensing chip for wafer control; a first small circuit and a wireless sensing chip are disposed in the wireless sense In the measuring chip system, the first small circuit and wireless sensing chip is a wireless touch and a small circuit chip component device of the wireless sensing chip system, and the first small circuit and wireless sensing chip has a double layer small a chip-powered sensing structure, the central processing circuit and the wireless sensing chip are electrically connected to the first small circuit and the wireless sensing chip for wafer control; and a second small circuit and wireless sensing chip is disposed on the wireless In the sensing chip system, the second small circuit and wireless sensing chip is also a wireless touch and a small circuit chip component device of the wireless sensing chip system, and the second small circuit and wireless sensing chip also has a double a small-scale wafer-powered sensing structure, the central processing circuit and the wireless sensing chip being electrically connected to the second small-sized circuit and the wireless sensing chip for wafer control; thereby, the central portion of the wireless sensing wafer system The processor circuit and the wireless sensing chip can be used for wireless touch by using the double-layer central processing unit chip power supply sensing structure (the central processing circuit and the wireless sensing chip can transmit electric waves and can receive electric waves), the first large circuit cum The wireless sensing chip, the second large circuit and the wireless sensing chip can be used for wireless touch by using the double-layer large-scale chip power sensing structure (the first large circuit) The wireless sensing chip and the second large circuit and the wireless sensing chip can transmit an electric wave and receive the electric wave, and the first small circuit and the wireless sensing chip, the second small circuit and the wireless sensing chip utilize the double layer and the small The chip power sensing structure can be used for wireless touch (the first small circuit and the wireless sensing chip and the second small circuit and the wireless sensing chip can transmit radio waves and receive radio waves); thus, the "displacement type" created by the invention is used. The wireless touch chip system enables an electrical device to use an internally replaceable wireless sensing chip for liquid crystal display for wireless touch operation. The liquid crystal display operation of the electrical device does not require a conventional touch device. The "displacement wireless touch chip system" circuit according to claim 1, wherein the central processing circuit and the wireless sensing chip are internally processed by an upper layer central processing unit wireless sensing chip (sensing chip) and the lower layer central processing Circuit chip (CPU chip) constitutes a two-layer central processing The chip-powered sensing structure, wherein the upper-layer central processing unit wireless sensing chip is electrically connected to the lower-layer central processing unit circuit via the dual-layer central processing unit (the power supply and signal electrical connection) The lower layer central processor circuit chip can receive the power supply (mains, mobile power) external to the central processing circuit and the wireless sensing chip for power supply (power supply of the central processor circuit chip), the lower layer of the central processor circuit chip and Powering the power through the dual-layer central processor chip power sensing structure, and supplying power to the upper-layer central processing unit wireless sensing chip; the upper-layer central processing unit wireless sensing chip is powered by the dual-layer central processing unit chip The structure internally accepts central processor circuit wafer control to transmit a specific frequency spherical wave (central processing unit wireless sensing chip transmitting radio wave), and the upper layer central processing unit wireless sensing chip is internally powered via the dual layer central processing unit chip sensing structure Central processor circuit chip control is also acceptable to receive the particular frequency reflection Wave (the central processing unit wireless sensing chip receives the electric wave); in addition, the upper central processing unit wireless sensing chip is mechanically and electrically connected to the lower central processing unit circuit to be used for wireless sensing wafer power supply (central processing unit) The wireless sensing chip transmits the electric wave and receives the electric wave. The upper central processing unit wireless sensing chip and the lower central processing unit circuit are also mechanically separated and electrically separated for wireless sensing wafer replacement (central processing unit wireless sensing chip) Replaceable). The "displacement wireless touch chip system" circuit of claim 1, wherein the first large circuit and the wireless sensing chip are internally formed by an upper first wireless sensing chip (sensing chip) and a lower layer first large The circuit chip (generally a large circuit chip) constitutes a double-layer first large-scale chip power sensing structure, wherein the upper first wireless sensing chip is powered by the double-layer first large-sized chip, and the lower layer a large circuit chip electrical connection (power supply, signal electrical connection); the lower first large circuit chip can receive power supply (mains, mobile power) external to the first large circuit and wireless sensing chip for power supply (first large circuit chip power supply), a first large-sized circuit chip of the lower layer and supplying power thereto through the double-layer first large-scale chip power sensing structure, and supplying power to the upper first wireless sensing chip; the upper first wireless sensing chip is first through the double layer The large-scale wafer-powered sensing structure internally controls the central processor circuit wafer to transmit a specific frequency spherical wave (the first wireless sensing chip transmits the wave), and the upper first wireless sensing chip is powered by the double-layer first large chip The central processing circuit chip control is also accepted inside the measurement structure to receive the specific frequency reflected electric wave (the first wireless sensing wafer receives the electric wave); further, the upper first wireless sensing chip and the lower first large large circuit chip are mechanically Connection and electrical connection for wireless sensing wafer power supply (first wireless sensing chip transmits radio waves, receives electric waves), the upper layer A wireless chip and the sensing circuit layer of the first large-scale electrical and mechanical separation of the wafer can be separated in the wireless replace the sensor chip (sensor chip may be a first wireless substitution). The "displacement wireless touch chip system" circuit of claim 1, wherein the second large circuit and the wireless sensing chip are internally composed of an upper second wireless sensing chip (sensing chip) and a lower layer second large The circuit chip (generally a large circuit chip) constitutes a double-layer second large-scale chip power sensing structure, wherein the upper second wireless sensing chip is powered by the double-layer second large-sized chip, and the lower layer Two large circuit chip electrical connections (power supply, signal electrical connection); the second large circuit chip of the lower layer can receive power supply (mains, mobile power) external to the second large circuit and wireless sensing chip for power supply (second large Circuit chip power supply), the lower second large circuit chip and power it The inner portion of the sensing structure can be powered via the double-layer second large-sized wafer, and the power is supplied to the upper second wireless sensing wafer; the upper second wireless sensing chip is internally received via the double-layer second large-chip power sensing structure. The processor circuit chip controls to transmit a specific frequency spherical wave (the second wireless sensing chip transmits the electric wave), and the upper second wireless sensing chip further receives the central processor circuit via the double layer second large chip power sensing structure. The wafer is controlled to receive the specific frequency reflected wave (the second wireless sensing chip receives the wave); further, the upper second wireless sensing chip is mechanically and electrically connected to the lower second large circuit chip to be a wireless sensing chip The second wireless sensing chip and the lower second large circuit chip are also mechanically separated and electrically separated for wireless sensing wafer replacement (second wireless). The sensing wafer is replaceable). According to the "displacement wireless touch chip system" circuit of claim 1, the first small circuit and the wireless sensing chip are internally composed of an upper third wireless sensing chip (sensing chip) and a lower layer first small The circuit chip (generally a small circuit chip) constitutes a double-layer first small-chip power-supply sensing structure, wherein the upper third-level wireless sensing chip is powered by the double-layer first small-sized wafer, and the lower layer A small circuit chip electrical connection (power supply, signal electrical connection); the lower first small circuit chip can receive power supply (mains, mobile power) outside the first small circuit and wireless sensing chip for power supply (first small Powering the circuit chip, the lower first small circuit chip and supplying power thereto through the double-layer first small-chip power supply sensing structure, and supplying power to the upper third wireless sensing chip; the upper third wireless sensing chip A central processor circuit wafer control can be received via the dual layer first small wafer power sensing structure to transmit a specific frequency ball The surface acoustic wave (the third wireless sensing chip transmits the electric wave), the upper third wireless sensing chip is also controlled by the central processor circuit wafer to receive the specific frequency reflected wave via the double layer first small chip power sensing structure. (The third wireless sensing chip receives the electric wave); in addition, the upper third wireless sensing chip is mechanically and electrically connected to the lower first small circuit chip for wireless sensing wafer power supply (third wireless sensing chip) The upper third wireless sensing chip and the lower first small circuit chip may also be mechanically separated and electrically separated for wireless sensing wafer replacement (third wireless sensing wafer replaceable). The "Replacement Wireless Touch Wafer System" circuit of claim 1, wherein the second small circuit and the wireless sensing chip are internally formed by an upper fourth wireless sensing chip (sensing chip) and a second lower layer. The circuit chip (generally a small circuit chip) constitutes a double-layer second small-chip power-supply sensing structure, wherein the upper fourth-level wireless sensing chip is powered by the double-layer second small-chip wafer, and the lower layer Two small circuit chip electrical connections (power supply, signal electrical connection); the lower second small circuit chip can receive power supply (mains, mobile power) outside the second small circuit and wireless sensing chip for power supply (second small Powering the circuit chip, the lower second small circuit chip and supplying power thereto through the double-layer second small-chip power supply sensing structure, and supplying power to the upper fourth wireless sensing chip; the upper fourth wireless sensing chip A central processor circuit wafer control can be received via the dual layer second small chip power sensing structure to transmit a specific frequency spherical wave (fourth wireless sensing crystal Sending an electric wave), the upper fourth wireless sensing chip is further controlled by the central processor circuit wafer to receive the specific frequency reflected wave via the double layer second small chip power sensing structure (fourth wireless sensing chip receiving wave) ); In addition, the upper fourth wireless sensing chip and the lower second small circuit chip are mechanically and electrically connected for wireless sensing wafer power supply (the fourth wireless sensing chip transmits radio waves, receives electric waves), and the upper layer is fourth. The wireless sensing wafer and the lower second small circuit wafer can also be mechanically separated and electrically separated for wireless sensing wafer replacement (fourth wireless sensing wafer replaceable). The "displacement wireless touch chip system" circuit according to claim 1, wherein the central processing circuit and the wireless sensing chip inside the wireless sensing chip system are wirelessly sensed by an upper layer central processing unit and the lower layer The central processing unit circuit chip comprises a two-layer central processing unit chip power supply sensing structure, wherein the first large circuit and the wireless sensing chip are internally formed by an upper first wireless sensing chip and a lower first large circuit chip. a large-scale chip-powered sensing structure, wherein the second large-scale circuit and the wireless sensing chip are further composed of an upper-layer second wireless sensing chip and a lower-layer second large-sized circuit chip, and a double-layer large-scale chip power sensing structure, the first The small circuit and the wireless sensing chip are internally composed of an upper third wireless sensing chip and a lower first small circuit chip, and a double-layer small chip power sensing structure. The second small circuit and the wireless sensing chip are internally provided by an upper layer. The fourth wireless sensing chip and the lower second small circuit chip also form a double-layer small chip power sensing structure; the double layer central processing unit The lower layer central processing circuit chip of the wafer power supply sensing structure can control the upper layer central processing unit wireless sensing chip, the upper double layer large power supply sensing structure upper layer first wireless sensing chip, the upper second wireless sensing chip, Controlling the double-layer small-chip power-sensing structure, the third wireless sensing chip, the upper fourth wireless sensing chip, etc., transmitting the specific frequency spherical wave and receiving the specific frequency reflecting wave, the central processing circuit chip can calculate and Comparing the central processing unit wireless sensing chip, the first wireless sensing The chip, the second wireless sensing chip, the third wireless sensing chip, and the fourth wireless sensing chip individually receive the signal strength of the specific frequency reflected wave, so that the central processing circuit inside the wireless sensing chip system The wireless sensing chip, the first large circuit and the wireless sensing chip, the second large circuit and the wireless sensing chip, the first small circuit and the wireless sensing chip, the second small circuit and the wireless sensing chip can be used for wireless touch ( Wireless touch in different locations).