TWI524171B - A circuit with a replacement type storage system - Google Patents

Description

Circuit with a replaceable chargeable wafer system

The present invention relates to a circuit having a replaceable power storage chip system, and more particularly to a dual-chip power supply structure using a replaceable battery chip and an electrical device circuit chip, The electrical energy is stored and provided by the dual layer wafer power supply structure to provide the power required for the operation of the circuit wafer to operate an electrical device circuit wafer without the need for additional battery devices or power supply devices.

According to the current era of oil shortages and high oil prices, the cost of using petroleum-related energy has increased substantially. At the same time, in order to avoid the drastic changes in the environment caused by excessive carbon dioxide emissions from the use of oil, all parties have advocated energy conservation. Carbon related practices. Among them, the way in which innovative electrical devices use power supply equipment can also be a specific practice of energy saving and carbon reduction.

The use of electrical devices (such as portable devices or handheld devices: notebook computers, tablets, smart phones, etc.) internal circuit chip power, please refer to Figure 1, mainly using the general chip system of electrical devices 01 is electrically connected to one of the electrical devices, the battery 02 (rechargeable battery), and the external power source is stored in the battery 02 via a rectifier 03, and the battery 02 is further provided for the operation of each circuit chip in the general wafer system 01. Power supply. As shown in FIG. 2, an electrical device supplies a general wafer via a battery 02. System 01 internal CPU chip 010 (CPU chip) and general circuit chip 011, general circuit chip 012, general circuit chip 013, general circuit chip 014 (such as: memory chip, graphics chip, peripheral control chip, etc.) Required power supply.

Generally, electrical devices such as portable devices or handheld devices are designed to be "light, thin, short, and small". On the one hand, they can save product material costs (energy saving and carbon reduction) and improve product technology standards. On the other hand, they can also cater to the needs. Use demand and increase consumer willingness. However, power supply equipment (batteries) often used in electrical installations often occupy a considerable space of electrical equipment, so that it is impossible to achieve a light and short design requirement; or, users of electrical equipment must always prepare bulky power supply equipment (batteries) and also cause electrical The inconvenience of using the device. Therefore, how to innovate the way in which electrical devices use power supply equipment has become the research direction and goal of various electrical device manufacturers.

In view of the shortcomings arising from the above prior art, the creator of the case was improved and innovated by the singer, and after painstaking research, he finally succeeded in research and development of a "circuit with a replaceable storable wafer system".

The purpose of the invention is to provide an electrical device, a novel circuit chip power supply circuit that utilizes a replaceable battery cell for power storage, which provides power and power required for operation of the circuit chip of the electrical device. Referring to Fig. 3, the concept is to provide an electrical storage chip system 11 in an electrical device. The rechargeable silicon wafer system 11 is electrically connected to a power source external to the electrical device via a rectifier 03. The rechargeable battery system 11 is internally provided with a replaceable battery chip, which is combined with an electrical device circuit chip disposed inside the power storage chip system 11 to form a two-layer wafer power supply structure; the battery chip can be externally received. Electric power supply As electrical energy storage, the stored electrical energy provides power supply power required for operation of the electrical device circuit wafer via a two-layer wafer power supply structure. In this way, an electrical device can be powered by an internal replaceable battery chip that is used by the circuit chip without the need for additional battery or power supply equipment.

For the above purposes, the technical means of the invention is to provide an electricity storage chip system in an electrical device (such as a portable device or a handheld device: a notebook computer, a tablet computer, a smart phone, etc.). A central processing battery chip, a plurality of high-speed storage circuit chips, and a plurality of low-speed storage circuit chips are disposed in the power storage chip system, wherein the central processing battery chip is composed of an upper battery chip (central processing battery chip) And a lower layer central processor circuit chip (CPU chip) constitutes a two-layer central processor chip power supply structure, the high speed storage circuit chip comprises an upper battery chip (high speed battery chip) and a lower high speed circuit chip (general high speed circuit The wafer, such as a memory chip, a graphics wafer, etc., constitutes a two-layer high-speed chip power supply structure, and the low-speed power storage circuit chip comprises an upper battery chip (low-speed battery chip) and a lower-level low-speed circuit chip (generally low-speed circuit chip) For example, the peripheral control chip constitutes a double-layer low-speed wafer power supply structure. The central processor storage circuit chip of the electrical storage chip system is electrically connected to the plurality of high speed storage circuit chips and the plurality of low speed storage circuit chips, so that the central processing circuit chip can be used for the plurality of high speed circuits The chip and the plurality of low-speed circuit chips are signal-controlled (executing the function of the electrical device).

The upper battery chip of the dual-layer central processor chip power supply structure can receive power sources (such as: mains, mobile power, etc.) external to the electrical device and convert it into DC power for power storage (central processor battery chip storage). The upper battery chip and store it The power is directly and stably supplied to the underlying central processor circuit chip via the dual layer central processor chip power supply structure (powered by the central processor battery chip). In addition, the upper battery chip and the lower central processing circuit chip can be mechanically and electrically connected for direct storage of the battery chip (direct storage of the central processor battery chip) and power supply, the upper battery chip and the lower central processing circuit chip. It can also be mechanically separated and electrically separated for indirect battery cell storage (indirect storage of the central processor battery chip) or for battery chip replacement (the central processor battery chip can be replaced).

The upper layer battery chip of the double-layer high-speed chip power supply structure can also receive power supply external to the electrical device and convert it into DC power for power storage (high-speed battery chip storage), and the upper battery chip also stores its electric energy through the double The layer high-speed chip power supply structure directly and stably supplies power to the lower layer high-speed circuit chip (high-speed battery chip power supply). In addition, the upper battery chip and the lower high-speed circuit chip can be mechanically and electrically connected for direct storage of the battery chip (direct storage of the high-speed battery chip) and power supply, and the upper battery chip and the lower high-speed circuit chip can be mechanically separated and electrically connected. Separation is used for indirect battery cell storage (high-speed battery chip indirect storage) or high-speed battery wafer replacement (high-speed battery wafer replacement).

Furthermore, the upper layer battery chip of the double-layer low-speed chip power supply structure can also receive power supply external to the electrical device and convert it into DC power for power storage (low-speed battery chip storage), and the upper battery chip also stores power. The power is directly and stably supplied to the underlying low speed circuit chip (powered by the low speed battery chip) via the double low speed wafer power supply structure. In addition, the upper battery chip and the lower low-speed circuit chip can be mechanically and electrically connected for direct storage of the battery chip (direct storage of the low-speed battery chip) and power supply, the upper battery chip The lower-level low-speed circuit chip can also be mechanically separated and electrically separated for indirect battery cell storage (indirect storage of low-speed battery chips) or low-speed battery chip replacement (low-speed battery wafer replacement).

Thus, the central processor power storage circuit chip can be used for power storage (the central processing unit battery chip storage power supply) by using the dual-layer central processor chip power supply structure, and the plurality of high-speed storage circuit chips utilize the double-layer high-speed chip power supply structure. It can also be used for power storage (high-speed battery pack wafer storage and power supply), and the plurality of low-speed storage circuit chips can also be used for power storage (low-speed battery pack chip storage and power supply) by using the double-layer low-speed chip power supply structure, and thus, the invention is applied. The "circuit with a replaceable power storage chip system" is created to enable an electrical device to be powered by an internal replaceable battery chip for use in a circuit chip that does not require additional battery equipment or power supply equipment ( Such as: battery, etc.).

Please refer to the following detailed description of a preferred embodiment of the present invention for "circuits with a replaceable power storage chip system" and the accompanying drawings, which will further understand the technical content of the creation and its purpose and effect:

01‧‧‧General wafer system

010‧‧‧Central Processor Circuit Wafer

011‧‧‧General circuit chip

012‧‧‧General circuit chip

013‧‧‧General circuit chip

014‧‧‧General circuit chip

02‧‧‧Battery

03‧‧‧Rectifier

11‧‧‧Power storage chip system

110‧‧‧Central processor storage circuit chip

1101‧‧‧Upper central processing unit battery chip

1102‧‧‧lower central processor circuit chip

111‧‧‧ Large high-speed storage circuit chip

1111‧‧‧Upper first high speed battery chip

1112‧‧‧Lower large-scale high-speed circuit chip

112‧‧‧ Large low-speed storage circuit chip

1121‧‧‧Upper first low-speed battery chip

1122‧‧‧Lower large low-speed circuit chip

113‧‧‧Small high-speed storage circuit chip

1131‧‧‧Upper second high speed battery chip

1132‧‧‧Lower small high speed circuit chip

114‧‧‧Small low-speed storage circuit chip

1141‧‧‧Upper second low speed battery chip

1142‧‧‧Lower small low-speed circuit chip

Figure 1 is a diagram showing the relationship between the use of external battery devices (batteries) for a typical wafer system.

Figure 2 is a block diagram and connection diagram of an external battery device (battery) for a general wafer system.

Fig. 3 is a schematic view showing the creation of a rechargeable wafer system without using an external battery device (battery) according to the present invention.

Figure 4 is a block diagram showing the internal structure of a preferred embodiment of the present invention. With the connection diagram.

FIG. 5 is a schematic diagram showing the internal structure of a central processing circuit of a central processing unit of a preferred embodiment of the present invention.

Figure 6 is a schematic view showing the internal structure of a large-scale high-speed storage circuit chip according to a preferred embodiment of the present invention.

FIG. 7 is a schematic diagram showing the internal structure of a large-sized low-speed storage circuit chip according to a preferred embodiment of the present invention.

FIG. 8 is a schematic diagram showing the internal structure of a small high-speed power storage circuit chip according to a preferred embodiment of the present invention.

FIG. 9 is a schematic diagram showing the internal structure of a small low-speed power storage circuit chip according to a preferred embodiment of the present invention.

A "circuit with a replaceable power storage chip system" provided by the present invention, as shown in FIGS. 3 and 4, is an electric device capable of storing a power storage wafer system 11 (electrical device storage) The power storage device and the signal processing device are provided with a central processing circuit chip 110, a large high-speed storage circuit chip 111, a large low-speed storage circuit chip 112, and a small high-speed storage circuit chip 113. The small-sized low-speed storage circuit chip 114 is electrically connected to the large-sized high-speed storage circuit chip 111 and the small-sized high-speed storage circuit chip 113 (high-speed chip signal control), and the central processing battery chip 110 is also The signal is electrically connected to the large low-speed storage circuit chip 112 and the small low-speed storage circuit chip 114 (low-speed wafer signal control), so that the central processing circuit chip 110 can be used for a plurality of high-speed circuit chips and a plurality of low-speed circuit chips. General signal control is performed to perform the functions of the electrical device.

Referring to FIG. 5, the CPU of the CPU circuit 110 is composed of an upper layer central processing unit battery chip 1101 (storage chip) and a lower layer central processing circuit chip 1102 (CPU chip). And the upper layer of the central processing unit battery chip 1101 is electrically connected to the lower layer of the central processing unit circuit 1102 via the dual-layer chip power supply structure of the central processing battery chip 110 (power supply) Electrical connections). The upper central processing unit battery chip 1101 can receive the power source (mains, mobile power) external to the central processing circuit chip 110 and convert it into DC power for power storage (central processing unit battery chip storage), the upper layer The central processing unit battery chip 1101 and the stored electric energy thereof are directly connected (the power supply is electrically connected) to the lower central processing circuit chip 1102 via the central processing circuit 110. Battery pack wafer power supply). In addition, the upper central processing unit battery chip 1101 and the lower central processing unit circuit 1102 can be mechanically and electrically connected to directly store and supply battery chips (direct storage of the central processing battery chip), and the upper layer is processed centrally. The battery pack wafer 1101 and the lower layer central processor circuit chip 1102 can also be mechanically separated and electrically separated for indirect battery cell storage (indirect storage of the central processing unit battery chip), or mechanically separated and electrically separated for use as a battery. Group wafer replacement (central processor battery pack wafers are replaceable).

Referring to FIG. 6, the large high-speed power storage circuit chip 111 is composed of an upper first high-speed battery chip 1111 (storage chip) and a lower large-scale high-speed circuit chip 1112 (generally high-speed circuit chip). a wafer power supply physics and circuit structure, wherein the upper first high speed battery chip 1111 passes through the large high speed power storage circuit chip 111 The inside of the two-layer wafer power supply structure can be electrically connected to the lower large-scale high-speed circuit chip 1112 (electrical connection of the power source). The upper first high-speed battery chip 1111 can receive the power source (mains, mobile power) outside the large-speed high-speed storage circuit chip 111 and convert it into DC power for power storage (the first high-speed battery chip storage), the upper layer A high-speed battery cell wafer 1111 and the stored electric energy thereof are passed through the large-scale high-speed storage circuit wafer 111 in a two-layer wafer power supply structure, directly (power supply electrical connection) and stably supplied to the lower large-scale high-speed circuit wafer 1112 (first high-speed battery pack) Wafer powered). In addition, the upper first high-speed battery chip 1111 and the lower large-sized high-speed circuit chip 1112 can be mechanically and electrically connected to directly store and supply the battery wafer (the first high-speed battery wafer directly stores power), the upper layer The first high-speed battery chip 1111 and the lower large-sized high-speed circuit chip 1112 can also be mechanically separated and electrically separated to indirectly be used for battery chip storage (indirect storage of the first high-speed battery chip), or mechanically separated and electrically separated. Battery pack wafer replacement (the first high speed battery chip can be replaced).

In addition, as shown in FIG. 8, the small high-speed power storage circuit chip 113 is internally composed of an upper second high-speed battery chip 1131 (storage chip) and a lower-layer small high-speed circuit chip 1132 (generally high-speed circuit chip). The high-speed chip power supply physical and circuit structure, wherein the upper second high-speed battery cell wafer 1131 is electrically connected to the lower-layer small high-speed circuit chip 1132 via the double-layer wafer power supply structure of the small high-speed power storage circuit chip 113 (electrical connection of the power supply) ). The upper second high-speed battery cell wafer 1131 can receive the power source (mains, mobile power) outside the small high-speed storage circuit chip 113 and convert it into DC power for power storage (second high-speed battery chip storage), the upper layer Two high-speed battery cell wafer 1131 and its stored electric energy via the small high-speed storage circuit chip 113 double-layer wafer power supply structure Internally, direct (power supply electrical connection) and stable power supply to the lower small high speed circuit chip 1132 (second high speed battery chip power supply). In addition, the upper second high speed battery chip 1131 and the lower small high speed circuit chip 1132 can be mechanically and electrically connected to directly store and supply the battery wafer (the second high speed battery wafer directly stores power), the upper second high speed The battery cell wafer 1131 and the lower layer small high speed circuit chip 1132 can also be mechanically separated and electrically separated to indirectly perform battery cell wafer storage (second high speed battery chip wafer indirect storage), or can be mechanically separated and electrically separated for use as a battery chip. Replacement (second high speed battery pack wafer can be replaced).

Referring to FIG. 7, the large low-speed power storage circuit chip 112 is internally composed of an upper first low-speed battery cell wafer 1121 (storage chip) and a lower-layer large low-speed circuit chip 1122 (generally low-speed circuit chip). The wafer-powered physical and circuit structure, wherein the upper first low-speed battery chip 1121 is electrically connected to the lower-sized large-speed low-speed circuit chip 1122 via the double-layer wafer power supply structure of the large low-speed storage circuit chip 112 (electrical connection of the power source) . The upper first low-speed battery chip 1121 can receive the power source (mains, mobile power) outside the large-sized low-speed storage circuit chip 112 and convert it into DC power for power storage (the first low-speed battery chip storage), the upper layer A low-speed battery cell wafer 1121 and its stored electrical energy is passed through the large low-speed storage circuit chip 112 in a two-layer wafer power supply structure, directly (power supply electrical connection) and stably supplied to the lower large-scale low-speed circuit chip 1122 (first low-speed battery pack) Wafer powered). In addition, the upper first low-speed battery chip 1121 and the lower large-sized low-speed circuit chip 1122 can be mechanically and electrically connected to directly store and supply the battery wafer (the first low-speed battery wafer directly stores power), the upper layer The first low speed battery chip 1121 and the lower large low speed circuit chip 1122 can also be mechanically separated and electrically divided. The battery is indirectly stored as a battery (indirect storage of the first low-speed battery chip), or mechanically separated and electrically separated for replacement of the battery (the first low-speed battery can be replaced).

Furthermore, as shown in FIG. 9, the small low-speed power storage circuit chip 114 is internally composed of an upper second low-speed battery cell wafer 1141 (storage chip) and a lower-layer small low-speed circuit chip 1142 (generally low-speed circuit chip). The layered small low-speed chip power supply physical and circuit structure, wherein the upper second low-speed battery cell wafer 1141 is electrically connected to the lower-layer small low-speed circuit chip 1142 via the dual-layer wafer power supply structure of the small low-speed storage circuit chip 114 ( Power supply electrical connection). The upper second low-speed battery chip 1141 can receive the power source (mains, mobile power) outside the small low-speed storage circuit chip 114 and convert it into DC power for power storage (second low-speed battery chip storage), the upper layer The second low-speed battery pack wafer 1141 and the stored electric energy thereof are directly connected to the lower-layer small-sized low-speed circuit wafer 1142 via the small-sized low-speed storage circuit wafer 114 in the double-layer wafer power supply structure (second low-speed battery pack) Wafer powered). In addition, the upper second low-speed battery cell wafer 1141 and the lower-layer small low-speed circuit chip 1142 can be mechanically and electrically connected to directly store and supply power to the battery chip (the second low-speed battery chip directly stores power), and the upper second low speed The battery chip 1141 and the lower small-sized low-speed circuit wafer 1142 can also be mechanically separated and electrically separated to indirectly be used for battery chip storage (second low-speed battery chip indirect storage), or mechanically separated and electrically separated for use as a battery chip. Replacement (the second low-speed battery pack wafer can be replaced).

Thus, the present invention proposes that an electrical device can be provided with an storable wafer system 11 such that the central processor storage circuit wafer 110 within the storable wafer system 11 utilizes The dual-layer central processor chip power supply structure can be used for power storage (central processor battery pack wafer storage, central processor battery pack wafer power supply to central processor circuit chip), the large high-speed storage circuit chip 111, the small high-speed storage circuit The wafer 113 can also be used for power storage (high-speed battery cell wafer storage, high-speed battery chip power supply to the high-speed circuit wafer) by using the double-layer high-speed wafer power supply structure, and the large low-speed storage circuit chip 112 and the small low-speed storage circuit wafer 114 are utilized. The dual-layer low-speed chip power supply structure can also be used for power storage (low-speed battery pack chip storage, low-speed battery chip power supply to low-speed circuit chips). Thus, by using the "circuit with a replaceable power storage chip system" created by the present invention, an electrical device can be powered by an internal replaceable battery chip to a circuit chip, and the circuit of the electrical device does not need to be used. Battery equipment or power supply equipment, so that the power supply equipment frequently used in electrical installations does not occupy a considerable space of the electrical equipment, so that the requirements of lightness and thinness cannot be achieved, or the users of the electrical equipment often prepare bulky power supply equipment, resulting in the use of electrical equipment. Convenient and so on.

The detailed description above is a detailed description of the possible embodiments of the present invention, but the embodiments are not intended to limit the scope of the invention, and the equivalent implementation or modification of the inventive concept is not deviated from the spirit of the invention. For example, equivalent embodiments of variations, etc., should be included in the scope of the patent of the present invention.

03‧‧‧Rectifier

11‧‧‧Power storage chip system

110‧‧‧Central processor storage circuit chip

111‧‧‧ Large high-speed storage circuit chip

112‧‧‧ Large low-speed storage circuit chip

113‧‧‧Small high-speed storage circuit chip

114‧‧‧Small low-speed storage circuit chip

Claims (6)

A circuit having a replaceable power storage chip system, comprising: an energy storage chip system disposed in an electrical device, wherein the power storage chip system is a power storage and signal processing device inside the electrical device; and a central processor power storage circuit a chip, disposed in the power storage chip system, the central processor power storage circuit chip is a power storage power supply of the power storage chip system and a central processor circuit chip component device, the central processor power storage circuit chip has a double layer central processing unit a wafer power supply structure; a large-scale high-speed storage circuit chip disposed in the power storage chip system, the large-scale high-speed storage circuit chip is a power storage power supply of the power storage chip system and a large-scale high-speed circuit chip component device, the large-scale high-speed storage circuit chip The utility model has a double-layer large-scale high-speed chip power supply structure, wherein the central processor storage circuit chip is electrically connected to the large-scale high-speed storage circuit chip signal for high-speed wafer signal control; and a small high-speed storage circuit chip is disposed in the power storage chip system. Small high-speed storage circuit chip for this A power storage and small high-speed circuit chip component device of a wafer system having a double-layer small high-speed wafer power supply structure, the central processor power storage circuit chip being electrically connected to the small high-speed power storage circuit chip signal for high-speed wafer Signal control; a large low-speed power storage circuit chip disposed in the power storage chip system, the large low-speed power storage circuit chip is a power storage power supply of the power storage chip system and a large low-speed circuit chip component device, the large low-speed storage circuit chip has Double-layer large low-speed chip power supply structure, The central processor power storage circuit chip is electrically connected to the large low speed power storage circuit chip signal for low speed wafer signal control; and a small low speed power storage circuit chip is disposed in the power storage chip system, wherein the small low speed power storage circuit chip is capable of storing electricity One of the wafer system power storage and small low-speed circuit chip device, the small low-speed power storage circuit chip has a double-layer small low-speed wafer power supply structure, and the central processor power storage circuit chip is electrically connected to the small low-speed storage circuit chip signal for low-speed wafer Signal control; thereby, the central processor power storage circuit chip inside the power storage chip system can be used for power storage and power supply to the central processor circuit chip by using the double-layer central processor chip power supply structure, the large high-speed storage circuit chip, The small high-speed power storage circuit chip can also be used for power storage and high-speed circuit chip by using the double-layer high-speed chip power supply structure, and the large low-speed power storage circuit chip and the small low-speed power storage circuit chip can also be used for power storage by using the double-layer low-speed chip power supply structure. Power supply to low speed power Wafer; thus, with the circuit of the present invention having a replaceable rechargeable wafer system, an electrical device can be powered by an internal storage circuit chip for use in a circuit wafer that does not require additional battery equipment or Power supply equipment. The circuit of the circuit-capable storage battery system of claim 1, wherein the internal processing circuit of the central processing unit is composed of an upper central processing unit battery chip, that is, a power storage chip and a lower central processing circuit chip, that is, a CPU chip. a dual-layer central processor chip power supply structure, wherein the upper central processing unit battery chip is electrically connected to the lower central processing circuit chip power supply via the dual-layer wafer power supply structure of the central processing circuit chip; the upper layer The central processor battery pack chip can accept external power supply and turn The DC power is stored for power storage, that is, the central processing unit battery chip is stored, and the upper central processing unit battery chip and the stored electric energy thereof are directly and stably supplied through the central processing circuit of the central processing battery chip double-layer chip power supply structure. The lower central processing unit circuit chip is powered by the central processing unit battery chip; in addition, the upper central processing unit battery chip and the lower central processing unit circuit are mechanically and electrically connected to directly store and power the battery chip. The central processing unit battery chip is directly stored, and the upper central processing unit battery chip and the lower central processing circuit chip are mechanically separated and electrically separated to indirectly perform battery storage of the battery unit to indirectly store the central processing unit battery chip. Alternatively, mechanical separation and electrical separation for battery pack wafer replacement allows the central processor battery pack wafer to be replaced. The circuit of claim 1, wherein the large-scale high-speed storage circuit chip comprises an upper-layer first high-speed battery chip, that is, a power storage chip, and a lower-layer large-speed high-speed circuit chip, that is, a general high-speed circuit chip. a double-layer large-scale high-speed wafer power supply structure, wherein the upper first high-speed battery chip is electrically connected to the lower-layer large-speed high-speed circuit chip power supply via the double-layer wafer power supply structure of the large-sized high-speed storage circuit chip; The battery pack wafer can receive external power supply and convert it into DC power for power storage, that is, the first high-speed battery pack wafer is stored, and the upper first high-speed battery pack wafer and the stored electric energy thereof pass through the large-scale high-speed storage circuit wafer double-layer wafer. The power supply structure directly and stably supplies power to the lower large-scale high-speed circuit chip, that is, the first high-speed battery chip is used for power supply; in addition, the upper first high-speed battery chip and the lower large-sized high-speed circuit chip are mechanically and electrically connected directly Battery pack wafer storage and power supply make the first high speed The battery chip directly stores electricity, and the upper first high speed battery chip The lower-level large-scale high-speed circuit chip can also be mechanically separated and electrically separated to indirectly charge the battery of the battery pack to indirectly store the first high-speed battery chip, or can be mechanically separated and electrically separated for replacement of the battery wafer to make the first high-speed battery. The group wafer can be replaced. The circuit of claim 1, wherein the small high-speed power storage circuit chip is composed of an upper second high-speed battery chip, that is, a power storage chip, and a lower-layer small high-speed circuit chip, that is, a general high-speed circuit chip. a double-layer small high-speed wafer power supply structure, wherein the upper second high-speed battery chip is electrically connected to the lower-sized small-speed high-speed circuit chip power supply via the double-layer wafer power supply structure of the small high-speed power storage circuit chip; the upper second high speed The battery chip can receive an external power source and convert it into DC power for power storage, that is, the second high-speed battery chip is stored, and the upper second high-speed battery chip and the stored power thereof pass through the small high-speed storage circuit wafer double-layer wafer. The power supply structure directly and stably supplies power to the lower small-sized high-speed circuit chip, that is, the second high-speed battery chip is used for power supply; in addition, the upper second high-speed battery chip and the lower small-sized high-speed circuit chip are mechanically and electrically connected directly Battery pack wafer storage and power supply for the second high speed The battery cell wafer is directly stored, and the upper second high-speed battery chip and the lower small-sized high-speed circuit chip are mechanically separated and electrically separated to indirectly operate as a battery chip to indirectly store the second high-speed battery chip, or mechanically separate. And electrical separation for battery chip replacement allows the second high speed battery wafer to be replaced. The circuit of claim 1, wherein the internal circuit of the large-sized low-speed storage circuit is composed of an upper first low-speed battery chip, that is, a power storage chip, and a lower-level large-speed low-speed circuit chip, that is, a general low-speed circuit chip. a double-layer large low-speed wafer power supply structure, wherein the upper first low-speed battery chip passes the large low-speed storage circuit chip The double-layer wafer power supply structure can be electrically connected to the lower-level large-scale low-speed circuit chip power supply; the upper first low-speed battery chip can receive an external power supply and convert it into DC power for power storage, that is, the first low-speed battery chip. Charging, the upper first low-speed battery chip and storing the stored electric energy through the large low-speed storage circuit wafer double-layer wafer power supply structure, directly and stably supplying power to the lower large-scale low-speed circuit chip to use the first low-speed battery chip to supply power; In addition, the upper first low-speed battery chip and the lower large-sized low-speed circuit chip are mechanically and electrically connected to directly store and supply the battery of the battery, and the first low-speed battery chip is directly stored. The upper first low-speed battery chip The lower-level large-scale low-speed circuit chip can also be mechanically separated and electrically separated to indirectly charge the battery of the battery pack to indirectly store the first low-speed battery chip, or can be mechanically separated and electrically separated for replacement of the battery chip to make the first low-speed battery. The group wafer can be replaced. The circuit of claim 1, wherein the small low-speed power storage circuit chip is internally composed of an upper second low-speed battery chip, that is, a power storage chip, and a lower-sized small low-speed circuit chip, that is, a general low-speed circuit chip. The double-layer small low-speed chip power supply structure, wherein the upper second low-speed battery chip is electrically connected to the lower-layer small-speed circuit chip power supply via the double-layer wafer power supply structure of the small low-speed power storage circuit chip; the upper second low speed The battery chip can receive an external power source and convert it into DC power for power storage, that is, the second low-speed battery chip, and the upper second low-speed battery chip and store the stored energy through the small low-speed storage circuit wafer double-layer wafer The power supply structure directly and stably supplies power to the lower small-sized low-speed circuit chip to be powered by the second low-speed battery chip; further, the upper second low-speed battery chip is mechanically and electrically connected to the lower small-sized low-speed circuit chip directly Battery pack wafer storage and supply The second low-speed battery chip is electrically stored, and the upper second low-speed battery chip and the lower small-sized low-speed circuit chip are mechanically separated and electrically separated to indirectly operate as a battery chip to indirectly store the second low-speed battery chip. Alternatively, mechanical separation and electrical separation for battery chip replacement allows the second low speed battery wafer to be replaced.