TWI605440B - Replaceable light-emitting wafer system - Google Patents
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本項發明創作係關於一種「置換式可發光晶片系統」電路，尤指一種利用一可置換式發光晶片與一電氣裝置電路晶片結合成雙層晶片供電發光結構，以該電路晶片作電能供電並經由雙層晶片供電發光結構提供該發光晶片工作所需之電源電能，使一電氣裝置液晶顯示工作無需額外之背光設備的新式液晶顯示背光發光電路者。 The invention relates to a "displacement illuminable wafer system" circuit, in particular to a two-layer wafer-powered light-emitting structure using a replaceable luminescent wafer and an electrical device circuit chip, and the circuit chip is used for power supply and The two-layer wafer-powered light-emitting structure provides the power of the power required for the operation of the light-emitting chip, so that an electrical device liquid crystal display operates a new liquid crystal display backlight light-emitting circuit that does not require an additional backlight device.
按，在現今石油供應來源不穩、油價起伏不定的時代，石油相關能源的使用成本皆大幅提高；同時，為了地球環境考量，避免因使用石油過度排放二氧化碳而造成環境的劇烈改變，各方均倡導節能減碳的相關做法。其中，創新電氣裝置液晶顯示使用背光設備之方式，也可以是節能減碳的一種具體做法。 According to the current era of unstable oil supply and fluctuating oil prices, the cost of using petroleum-related energy has increased substantially. At the same time, for the sake of the global environment, to avoid drastic changes in the environment caused by excessive carbon dioxide emissions from oil use, Advocate energy conservation and carbon reduction related practices. Among them, the innovative electric device liquid crystal display uses a backlight device, which can also be a specific practice of energy saving and carbon reduction.
習用電氣裝置(如可攜式裝置或手持裝置：平板電腦、智慧型手機等)使用液晶顯示之方式，請參閱第1圖所示，主要係利用電氣裝置之一般晶片系統01與電氣裝置之一背光模組電路02(發光裝置)電氣連接，該背光模組電路02再提供一液晶顯示器03工作所需之發光來源。如第2圖所示，一電氣裝置經由一般晶片系統01內部之中央處理器電路晶片010(CPU晶片)控制背光模組電路02及液晶顯示器03，使得背光 模組電路02可提供液晶顯示器03之發光來源，該一般晶片系統01內部另包含一般電路晶片011、一般電路晶片012、一般電路晶片013、一般電路晶片014(如：記憶體晶片、繪圖晶片、週邊控制晶片等)。 The use of liquid crystal display in conventional electrical devices (such as portable devices or handheld devices: tablet computers, smart phones, etc.), as shown in Figure 1, is mainly one of the general wafer system 01 and electrical devices using electrical devices. The backlight module circuit 02 (lighting device) is electrically connected, and the backlight module circuit 02 further provides a source of illumination required for the operation of the liquid crystal display 03. As shown in FIG. 2, an electrical device controls the backlight module circuit 02 and the liquid crystal display 03 via a central processor circuit chip 010 (CPU chip) inside the general wafer system 01, so that the backlight The module circuit 02 can provide a light source of the liquid crystal display 03. The general wafer system 01 further includes a general circuit chip 011, a general circuit chip 012, a general circuit chip 013, and a general circuit chip 014 (eg, a memory chip, a drawing chip, Peripheral control wafers, etc.).
一般電氣裝置如可攜式裝置或手持裝置均講求「輕、薄、短、小」之整體設計，一方面可以節省產品材料成本(節能減碳)、提高產品技術水準，另一方面也可以迎合使用需求、提升消費意願。然而，由於電氣裝置液晶顯示經常使用之背光設備(如：背光模組電路)往往佔據電氣裝置相當空間，以致不易達成輕薄短小之設計要求。因此，如何創新電氣裝置液晶顯示使用背光發光之方式，成為各個電氣裝置製造廠商新的研究方向與努力目標。 Generally, electrical devices such as portable devices or handheld devices are designed to be "light, thin, short, and small". On the one hand, they can save product material costs (energy saving and carbon reduction) and improve product technology standards. On the other hand, they can also cater to the needs. Use demand and increase consumer willingness. However, backlight devices (such as backlight module circuits) that are often used in liquid crystal displays of electrical devices tend to occupy a considerable space of electrical devices, so that it is difficult to achieve a light and thin design requirement. Therefore, how to innovate the liquid crystal display of the electrical device using the backlight illumination method has become a new research direction and efforts of various electrical device manufacturers.
鑑於上述先前技術所衍生的各項缺點，本案創作人乃亟思加以改良創新，並經苦心孤詣潛心研究後，終於成功研發完成本案之一種「置換式可發光晶片系統」電路。 In view of the shortcomings arising from the above prior art, the creator of the case was improved and innovated by the philosopher, and after painstaking research, he finally succeeded in developing and developing a "displacement illuminable chip system" circuit of the present case.
本項發明創作之目的，在於提供一電氣裝置液晶顯示一種利用電路晶片作電能供電，此供電電能再提供一可置換式發光晶片工作所需電源電能之新式背光發光電路。請參閱第3圖所示，其概念係在一電氣裝置設一發光晶片系統11，該發光晶片系統11與一液晶顯示器03電氣連接。該發光晶片系統11內部設有可置換式發光晶片，該發光晶片與電氣裝置內部原有之電路晶片結合成雙層晶片供電發光結構；該電路晶片可接受外部之電力電源作電能供電，此供電電能經由雙層晶片供電發光結構內部提供該發光晶片工作所需之電源電能。如此，令一電氣裝置即能以內部可 置換之發光晶片發光予液晶顯示使用，該電氣裝置液晶顯示工作無需額外之背光設備。 The purpose of the invention is to provide an electrical device liquid crystal display using a circuit chip for power supply, which supplies a new type of backlight illumination circuit for the power supply required for the operation of the replaceable light-emitting chip. Referring to FIG. 3, the concept is to provide an illuminating wafer system 11 in an electrical device. The illuminating wafer system 11 is electrically connected to a liquid crystal display 03. The illuminating wafer system 11 is internally provided with a replaceable illuminating chip, which is combined with an original circuit chip inside the electric device to form a two-layer wafer power supply illuminating structure; the circuit chip can receive an external power source for power supply, and the power supply The electrical energy is supplied to the interior of the light-emitting structure via a two-layer wafer to provide power for the operation of the light-emitting chip. In this way, an electrical device can be internally The replaced illuminating chip emits light for use in a liquid crystal display, and the liquid crystal display operation of the electric device does not require an additional backlight device.
為達上述之目的，本項發明創作之技術手段在於，在一電氣裝置(如可攜式裝置或手持裝置：平板電腦、智慧型手機等)設一發光晶片系統，該發光晶片系統內部設有一中央處理器電路發光晶片、多個大型電路發光晶片及多個小型電路發光晶片。該中央處理器電路發光晶片由一上層發光晶片(中央處理器發光晶片)及一下層中央處理器電路晶片(CPU晶片)組成一雙層中央處理器晶片供電發光結構，該大型電路發光晶片由一上層發光晶片(大型發光晶片)及一下層大型電路晶片(一般大型電路晶片，如：記憶體晶片、繪圖晶片等)組成一雙層大型晶片供電發光結構，而該小型電路發光晶片由一上層發光晶片(小型發光晶片)及一下層小型電路晶片(一般小型電路晶片，如：週邊控制晶片)組成一雙層小型晶片供電發光結構。該電氣裝置發光晶片系統之中央處理器電路發光晶片與該多個大型電路發光晶片、該多個小型電路發光晶片分別以信號電氣連接，使得中央處理器電路晶片可對多個大型電路晶片、多個小型電路晶片作信號控制(執行該電氣裝置之功能)。 For the above purposes, the technical means of the invention is to provide an illuminating wafer system in an electrical device (such as a portable device or a handheld device: a tablet computer, a smart phone, etc.), and the illuminating wafer system is internally provided with a The central processing unit emits a light emitting chip, a plurality of large circuit light emitting chips, and a plurality of small circuit light emitting chips. The central processing unit illuminating chip comprises an upper layer illuminating chip (central processing unit illuminating chip) and a lower layer central processing unit circuit chip (CPU chip) comprising a double layer central processing unit chip power supply illuminating structure, the large circuit illuminating chip comprises The upper layer of the light-emitting chip (large-sized light-emitting chip) and the lower-layer large-sized circuit chip (generally a large-sized circuit chip, such as a memory chip, a drawing chip, etc.) constitute a double-layer large-scale wafer-powered light-emitting structure, and the small-sized circuit light-emitting chip is illuminated by an upper layer The wafer (small light emitting chip) and the lower layer small circuit chip (generally a small circuit chip such as a peripheral control chip) constitute a two-layer small wafer power supply light-emitting structure. The central processor circuit light-emitting chip of the electrical device light-emitting chip system and the plurality of large-sized circuit light-emitting chips and the plurality of small-sized circuit light-emitting chips are respectively electrically connected by signals, so that the central processor circuit chip can be used for a plurality of large-scale circuit chips, A small circuit chip is used for signal control (functioning the electrical device).
該雙層中央處理器晶片供電發光結構之下層中央處理器電路晶片可接受電氣裝置外部之電力電源(如：市電、行動電源等)以作電能供電(中央處理器電路晶片供電)，該下層中央處理器電路晶片並將其供電電能經由雙層中央處理器晶片供電發光結構內部直接並穩定地供電予上層發光晶片使用(中央處理器發光晶片發光)。此外，該上層發光晶片與該下層中央處理器電路晶片可機械連接及電氣連接以作發光晶片供電使 用(中央處理器發光晶片發光)，該上層發光晶片與該下層中央處理器電路晶片亦可機械分離及電氣分離以作發光晶片更換(中央處理器發光晶片可置換)。 The dual-layer central processor chip-powered light-emitting structure underlying central processor circuit chip can receive electrical power (such as: commercial power, mobile power, etc.) external to the electrical device for power supply (central processor circuit chip power supply), the lower central The processor circuit chip and its power supply power are directly and stably supplied to the upper layer of the light-emitting chip via the dual-layer central processor chip-powered light-emitting structure (the central processing unit emits light from the substrate). In addition, the upper layer of the light emitting chip and the lower layer of the central processing unit circuit are mechanically and electrically connected for powering the light emitting chip. The upper layer of the light-emitting wafer and the lower layer of the central processing unit circuit can also be mechanically separated and electrically separated for use as a light-emitting wafer replacement (the central processing unit can be replaced by a light-emitting chip).
該雙層大型晶片供電發光結構之下層大型電路晶片亦可接受電氣裝置外部之電力電源作電能供電(下層大型電路晶片供電)，該下層大型電路晶片亦將其供電電能經由雙層大型晶片供電發光結構內部直接並穩定地供電予上層發光晶片使用(大型發光晶片發光)。此外，該上層發光晶片與該下層大型電路晶片可機械連接及電氣連接以作發光晶片供電使用(大型發光晶片發光)，該上層發光晶片與該下層大型電路晶片亦可機械分離及電氣分離以作發光晶片更換(大型發光晶片可置換)。 The large-scale circuit chip under the double-layer large-scale wafer-powered light-emitting structure can also be powered by an electric power source external to the electrical device (powered by a large-scale large-scale circuit chip), and the lower-level large-scale circuit chip also supplies power to the light via a double-layer large-scale wafer. The inside of the structure is directly and stably supplied with power to the upper layer of the light-emitting chip (large-sized light-emitting wafer light-emitting). In addition, the upper layer of the light-emitting chip and the lower layer of the large-sized circuit chip can be mechanically and electrically connected for use as a light-emitting chip for power supply (large-sized light-emitting chip light-emitting), and the upper-layer light-emitting chip and the lower-layer large-sized circuit chip can also be mechanically separated and electrically separated for use. Light-emitting wafer replacement (large-sized light-emitting wafers can be replaced).
再者，該雙層小型晶片供電發光結構之下層小型電路晶片亦可接受電氣裝置外部之電力電源作電能供電(下層小型電路晶片供電)，該下層小型電路晶片亦將其供電電能經由雙層晶片供電發光結構內部直接並穩定地供電予上層發光晶片使用(小型發光晶片發光)。此外，該上層發光晶片與該下層小型電路晶片可機械連接及電氣連接以作發光晶片供電使用(小型發光晶片發光)，該上層發光晶片與該下層小型電路晶片亦可機械分離及電氣分離以作發光晶片更換(小型發光晶片可置換)。 Furthermore, the small-sized circuit chip under the double-layer small-chip power-on-light-emitting structure can also be powered by an electric power source external to the electrical device (powered by a lower-sized small-circuit circuit chip), and the lower-sized small-sized circuit chip also supplies power to the double-layer chip. The power supply light-emitting structure directly and stably supplies power to the upper-layer light-emitting chip (small-sized light-emitting chip light-emitting). In addition, the upper layer of the light-emitting chip and the lower layer of the small-sized circuit chip can be mechanically and electrically connected for use as a light-emitting chip for power supply (small-sized light-emitting chip light-emitting), and the upper-layer light-emitting chip and the lower-layer small-sized circuit chip can be mechanically separated and electrically separated for use. Light-emitting wafer replacement (small light-emitting wafers can be replaced).
由此，該中央處理器電路發光晶片利用其雙層中央處理器晶片供電發光結構可作發光照明(中央處理器發光晶片發光)、該多個大型電路發光晶片利用其雙層大型晶片供電發光結構亦可作發光照明(大型發光晶片發光)、該多個小型電路發光晶片利用其雙層小型晶片供電發光結構則亦可作發光照明(小型發光晶片發光)，如此，運用本項發明創作之「置 換式可發光晶片系統」，令一電氣裝置即能以內部可置換之發光晶片發光予液晶顯示使用，該電氣裝置液晶顯示工作無需額外之背光設備(如：背光模組電路等)。 Thus, the central processing unit illuminating chip can be used for illuminating illumination (central processing unit illuminating wafer illuminating) by using its two-layer central processing unit wafer-powered light-emitting structure, and the plurality of large-scale circuit illuminating wafers use the double-layer large-scale wafer-powered light-emitting structure It can also be used for illuminating illumination (large-sized illuminating wafer illuminating), and the plurality of small-sized circuit illuminating wafers can also be used for illuminating illumination (small-sized illuminating wafer illuminating) by using the double-layer small-wafer-powered light-emitting structure, and thus, using the invention of the invention Set The interchangeable illuminable wafer system enables an electrical device to illuminate an internally replaceable illuminating wafer for use in a liquid crystal display. The liquid crystal display operation of the electrical device does not require an additional backlight device (eg, a backlight module circuit, etc.).
請參閱以下有關於本項發明創作「置換式可發光晶片系統」電路一較佳實施例之詳細說明及其附圖，將可進一步瞭解本創作之技術內容及其目的與功效： Please refer to the following detailed description of a preferred embodiment of the circuit of the "displacement illuminable chip system" of the present invention and its accompanying drawings, which will further understand the technical content of the creation and its purpose and effect:
01‧‧‧一般晶片系統 01‧‧‧General wafer system
010‧‧‧中央處理器電路晶片 010‧‧‧Central Processor Circuit Wafer
011‧‧‧一般電路晶片 011‧‧‧General circuit chip
012‧‧‧一般電路晶片 012‧‧‧General circuit chip
013‧‧‧一般電路晶片 013‧‧‧General circuit chip
014‧‧‧一般電路晶片 014‧‧‧General circuit chip
02‧‧‧背光模組電路 02‧‧‧Backlight module circuit
03‧‧‧液晶顯示器 03‧‧‧LCD display
11‧‧‧發光晶片系統 11‧‧‧Lighting wafer system
110‧‧‧中央處理器電路發光晶片 110‧‧‧Central processor circuit light-emitting chip
1101‧‧‧上層中央處理器發光晶片 1101‧‧‧Upper central processing unit light-emitting chip
1102‧‧‧下層中央處理器電路晶片 1102‧‧‧lower central processor circuit chip
111‧‧‧第一大型電路發光晶片 111‧‧‧The first large-scale circuit light-emitting chip
1111‧‧‧上層第一大型發光晶片 1111‧‧‧The first large-scale light-emitting chip in the upper layer
1112‧‧‧下層第一大型電路晶片 1112‧‧‧Lower first large circuit chip
112‧‧‧第二大型電路發光晶片 112‧‧‧Second large-scale circuit light-emitting chip
1121‧‧‧上層第二大型發光晶片 1121‧‧‧The second large-scale light-emitting chip
1122‧‧‧下層第二大型電路晶片 1122‧‧‧Lower second large circuit chip
113‧‧‧第一小型電路發光晶片 113‧‧‧First small circuit light-emitting chip
1131‧‧‧上層第一小型發光晶片 1131‧‧‧Upper first small light-emitting chip
1132‧‧‧下層第一小型電路晶片 1132‧‧‧Lower first small circuit chip
114‧‧‧第二小型電路發光晶片 114‧‧‧Second small circuit light-emitting chip
1141‧‧‧上層第二小型發光晶片 1141‧‧‧Upper second small light-emitting chip
1142‧‧‧下層第二小型電路晶片 1142‧‧‧Lower second small circuit chip
第1圖為一般晶片系統使用背光模組電路與液晶顯示器之關係圖。 Figure 1 is a diagram showing the relationship between a backlight module circuit and a liquid crystal display in a general wafer system.
第2圖為一般晶片系統之內部結構方塊圖與連接圖。 Figure 2 is a block diagram and connection diagram of the internal structure of a general wafer system.
第3圖為本項發明創作發光晶片系統無使用背光模組電路之示意圖。 Fig. 3 is a schematic view showing the circuit of the non-use backlight module of the light-emitting chip system of the present invention.
第4圖為本項發明創作發光晶片系統一較佳實施例之內部結構方塊圖與連接圖。 4 is a block diagram and a connection diagram of an internal structure of a preferred embodiment of the illuminating wafer system of the present invention.
第5圖為本項發明創作發光晶片系統一較佳實施例之中央處理器電路發光晶片內部結構示意圖。 FIG. 5 is a schematic diagram showing the internal structure of a central processor circuit light-emitting chip according to a preferred embodiment of the present invention.
第6圖為本項發明創作發光晶片系統一較佳實施例之第一大型電路發光晶片內部結構示意圖。 FIG. 6 is a schematic view showing the internal structure of a first large-sized circuit light-emitting chip according to a preferred embodiment of the present invention.
第7圖為本項發明創作發光晶片系統一較佳實施例之第二大型電路發光晶片內部結構示意圖。 FIG. 7 is a schematic view showing the internal structure of a second large-sized circuit light-emitting chip according to a preferred embodiment of the present invention.
第8圖為本項發明創作發光晶片系統一較佳實施例之第一小型電路發光晶片內部結構示意圖。 FIG. 8 is a schematic view showing the internal structure of a first small-sized circuit light-emitting chip according to a preferred embodiment of the present invention.
第9圖為本項發明創作發光晶片系統一較佳實施例之第二小型電路發光 晶片內部結構示意圖。 Figure 9 is a second small circuit illumination of a preferred embodiment of the luminescent wafer system of the present invention. Schematic diagram of the internal structure of the wafer.
本項發明創作所提供之一種「置換式可發光晶片系統」電路，請參閱第3圖及第4圖所示，其係在一電氣裝置設一發光晶片系統11(電氣裝置之發光照明設備、信號處理設備)，該發光晶片系統11內部設有一中央處理器電路發光晶片110、一第一大型電路發光晶片111、一第二大型電路發光晶片112及一第一小型電路發光晶片113、一第二小型電路發光晶片114。該中央處理器電路發光晶片110與該第一大型電路發光晶片111、該第二大型電路發光晶片112以信號電氣連接(大型晶片信號控制)，該中央處理器電路發光晶片110亦與該第一小型電路發光晶片113、該第二小型電路發光晶片114以信號電氣連接(小型晶片信號控制)，使得該中央處理器電路發光晶片110可對多個大型電路晶片、多個小型電路晶片作一般信號控制以執行該電氣裝置之功能。 A "displacement illuminable wafer system" circuit provided by the present invention, as shown in FIGS. 3 and 4, is an illuminating wafer system 11 (electrical device illuminating device, a signal processing device, the illuminating chip system 11 is internally provided with a central processing unit illuminating chip 110, a first large circuit illuminating chip 111, a second large circuit illuminating chip 112, and a first small circuit illuminating chip 113, a first Two small circuit light emitting chips 114. The central processing unit light emitting chip 110 is electrically connected to the first large circuit light emitting chip 111 and the second large circuit light emitting chip 112 (large chip signal control), and the central processing circuit light emitting chip 110 is also associated with the first The small circuit light emitting chip 113 and the second small circuit light emitting chip 114 are electrically connected by signals (small wafer signal control), so that the central processing circuit light emitting chip 110 can perform general signals on a plurality of large circuit chips and a plurality of small circuit chips. Control to perform the function of the electrical device.
請參閱第5圖所示，該中央處理器電路發光晶片110內部係由一上層中央處理器發光晶片1101(發光晶片)及一下層中央處理器電路晶片1102(CPU晶片)組成一雙層中央處理器晶片供電發光結構，其中，該上層中央處理器發光晶片1101經由該中央處理器電路發光晶片110之雙層晶片供電發光結構內部，可與該下層中央處理器電路晶片1102電氣連接(電源電氣連接)。該下層中央處理器電路晶片1102可接受該中央處理器電路發光晶片110外部之電力電源(市電、行動電源)以作電能供電(中央處理器電路晶片供電)，該下層中央處理器電路晶片1102並將其供電電能經由該中央處理器電路發光晶片110雙層晶片供電發光結構內部，直接並穩定 地供電予上層中央處理器發光晶片1101使用(中央處理器發光晶片發光)。除此之外，該上層中央處理器發光晶片1101與該下層中央處理器電路晶片1102可機械連接及電氣連接以作發光晶片供電使用(中央處理器發光晶片發光)，該上層中央處理器發光晶片1101與該下層中央處理器電路晶片1102亦可機械分離及電氣分離以作發光晶片更換(中央處理器發光晶片可置換)。 Referring to FIG. 5, the internal processing circuit of the central processing unit 110 is composed of an upper layer central processing unit, a light emitting chip 1101 (light emitting chip) and a lower layer central processing unit circuit 1102 (CPU chip). The upper-layer central processing unit 1101 is electrically connected to the lower-layer central processing unit circuit 1102 via the dual-layer wafer-powered light-emitting structure of the central processing unit illuminating wafer 110 (electrical connection of the power supply) ). The lower layer central processor circuit chip 1102 can receive the power source (commercial power, mobile power source) outside the central processor circuit illuminating chip 110 for power supply (central processor circuit chip power supply), and the lower layer central processor circuit chip 1102 Directly and stably powering the power supply through the central processor circuit illuminating wafer 110 double-layer wafer power supply structure The ground power is applied to the upper central processing unit light emitting chip 1101 (the central processing unit emits light to emit light). In addition, the upper central processing unit light emitting chip 1101 and the lower central processing unit circuit 1102 can be mechanically and electrically connected for use as a light emitting chip power supply (central processing unit light emitting chip illumination), the upper layer central processing unit light emitting chip 1101 and the lower layer central processing unit circuit 1102 can also be mechanically separated and electrically separated for illuminating wafer replacement (the central processing unit illuminating wafer can be replaced).
請參閱第6圖所示，該第一大型電路發光晶片111內部係由一上層第一大型發光晶片1111(發光晶片)及一下層第一大型電路晶片1112(一般大型電路晶片)組成一雙層大型晶片供電發光結構，其中，該上層第一大型發光晶片1111經由該第一大型電路發光晶片111之雙層晶片供電發光結構內部，可與該下層第一大型電路晶片1112電氣連接(電源電氣連接)。該下層第一大型電路晶片1112可接受該第一大型電路發光晶片111外部之電力電源(市電、行動電源)以作電能供電(第一大型電路晶片供電)，該下層第一大型電路晶片1112並將其供電電能經由該第一大型電路發光晶片111雙層晶片供電發光結構內部，直接並穩定地供電予上層第一大型發光晶片1111使用(第一大型發光晶片發光)。除此之外，該上層第一大型發光晶片1111與該下層第一大型電路晶片1112可機械連接及電氣連接以作發光晶片供電使用(第一大型發光晶片發光)，該上層第一大型發光晶片1111與該下層第一大型電路晶片1112亦可機械分離及電氣分離以作發光晶片更換(第一大型發光晶片可置換)。 Referring to FIG. 6, the first large-sized circuit light-emitting chip 111 is internally composed of an upper-layer first large-sized light-emitting chip 1111 (light-emitting chip) and a lower-layer first large-sized circuit chip 1112 (generally large-sized circuit chip). The large-scale wafer-powered light-emitting structure, wherein the upper first large-sized light-emitting chip 1111 is electrically connected to the lower-layer first large-sized circuit wafer 1112 via the double-layer wafer-powered light-emitting structure of the first large-sized circuit light-emitting chip 111 (electrical connection of the power source) ). The lower first large circuit chip 1112 can receive the power source (mains, mobile power) outside the first large circuit light emitting chip 111 for power supply (first large circuit chip power supply), and the lower first large circuit chip 1112 The power supply power is supplied to the inside of the light-emitting structure via the double-layer wafer of the first large-sized circuit light-emitting chip 111, and is directly and stably supplied to the upper first large-sized light-emitting chip 1111 (the first large-sized light-emitting chip emits light). In addition, the upper first large-sized light-emitting chip 1111 and the lower first large-sized circuit wafer 1112 can be mechanically and electrically connected for use as a light-emitting chip for power supply (first large-sized light-emitting chip light-emitting), and the upper first large-sized light-emitting chip 1111 and the lower first large circuit wafer 1112 can also be mechanically separated and electrically separated for illuminating wafer replacement (the first large luminescent wafer can be replaced).
請參閱第7圖所示，該第二大型電路發光晶片112內部係由一上層第二大型發光晶片1121(發光晶片)及一下層第二大型電路晶片 1122(一般大型電路晶片)組成一雙層大型晶片供電發光結構，其中，該上層第二大型發光晶片1121經由該第二大型電路發光晶片112之雙層晶片供電發光結構內部，可與該下層第二大型電路晶片1122電氣連接(電源電氣連接)。該下層第二大型電路晶片1122可接受該第二大型電路發光晶片112外部之電力電源(市電、行動電源)以作電能供電(第二大型電路晶片供電)，該下層第二大型電路晶片1122並將其供電電能經由該第二大型電路發光晶片112雙層晶片供電發光結構內部，直接並穩定地供電予上層第二大型發光晶片1121使用(第二大型發光晶片發光)。除此之外，該上層第二大型發光晶片1121與該下層第二大型電路晶片1122可機械連接及電氣連接以作發光晶片供電使用(第二大型發光晶片發光)，該上層第二大型發光晶片1121與該下層第二大型電路晶片1122亦可機械分離及電氣分離以作發光晶片更換(第二大型發光晶片可置換)。 Referring to FIG. 7, the second large-sized circuit light-emitting chip 112 is internally composed of an upper second large-sized light-emitting chip 1121 (light-emitting chip) and a second large-sized circuit chip. 1122 (generally a large-scale circuit chip) constituting a double-layer large-scale wafer-powered light-emitting structure, wherein the upper second large-sized light-emitting chip 1121 is powered by the double-layer wafer of the second large-sized circuit light-emitting chip 112, and the lower layer Two large circuit chips 1122 are electrically connected (power supply electrical connection). The lower second large circuit chip 1122 can receive the power source (commercial power, mobile power) outside the second large circuit light emitting chip 112 for power supply (second large circuit chip power supply), and the lower second large circuit chip 1122 The power supply power is supplied to the inside of the light-emitting structure via the double-layer wafer of the second large-sized circuit light-emitting chip 112, and is directly and stably supplied to the upper second large-sized light-emitting chip 1121 (the second large-sized light-emitting chip emits light). In addition, the upper second large-sized light-emitting chip 1121 and the lower second large-sized circuit chip 1122 can be mechanically and electrically connected for use as a light-emitting chip for power supply (second large-sized light-emitting chip light-emitting), and the upper second large-sized light-emitting chip 1121 and the lower second large circuit wafer 1122 can also be mechanically separated and electrically separated for luminescent wafer replacement (the second large luminescent wafer can be replaced).
另外請參閱第8圖所示，該第一小型電路發光晶片113內部係由一上層第一小型發光晶片1131(發光晶片)及一下層第一小型電路晶片1132(一般小型電路晶片)組成一雙層小型晶片供電發光結構，其中，該上層第一小型發光晶片1131經由該第一小型電路發光晶片113之雙層晶片供電發光結構內部，可與該下層第一小型電路晶片1132電氣連接(電源電氣連接)。該下層第一小型電路晶片1132可接受該第一小型電路發光晶片113外部之電力電源(市電、行動電源)以作電能供電(第一小型電路晶片供電)，該下層第一小型電路晶片1132並將其供電電能經由該第一小型電路發光晶片113雙層晶片供電發光結構內部，直接並穩定地供電予上層第一小型發光晶片1131使用(第一小型發光晶片發光)。除此之外，該上層 第一小型發光晶片1131與該下層第一小型電路晶片1132可機械連接及電氣連接以作發光晶片供電使用(第一小型發光晶片發光)，該上層第一小型發光晶片1131與該下層第一小型電路晶片1132亦可機械分離及電氣分離以作發光晶片更換(第一小型發光晶片可置換)。 In addition, as shown in FIG. 8, the first small-sized circuit light-emitting chip 113 is internally composed of an upper first small-sized light-emitting chip 1131 (light-emitting chip) and a lower-layer first small-sized circuit chip 1132 (generally small-sized circuit chip). a small-scale wafer-powered light-emitting structure, wherein the upper first small-sized light-emitting chip 1131 is electrically connected to the lower-layer first small-sized circuit chip 1132 via the double-layer wafer-powered light-emitting structure of the first small-sized circuit light-emitting chip 113 (power supply electrical connection). The lower first small circuit chip 1132 can receive the power source (mains, mobile power) outside the first small circuit light emitting chip 113 for power supply (first small circuit chip power supply), and the lower first small circuit chip 1132 The power supply power is supplied to the inside of the light-emitting structure via the first small-sized circuit light-emitting chip 113, and is directly and stably supplied to the upper first small-sized light-emitting chip 1131 (the first small-sized light-emitting chip emits light). In addition to this, the upper layer The first small-sized light-emitting chip 1131 and the lower-layer first small-sized circuit chip 1132 are mechanically and electrically connected for use as a light-emitting chip for power supply (first small-sized light-emitting chip light-emitting), and the upper first small-sized light-emitting chip 1131 and the lower layer are first small The circuit die 1132 can also be mechanically separated and electrically separated for illuminating wafer replacement (the first small luminescent wafer can be replaced).
再者，請參閱第9圖所示，該第二小型電路發光晶片114內部係由一上層第二小型發光晶片1141(發光晶片)及一下層第二小型電路晶片1142(一般小型電路晶片)組成一雙層小型晶片供電發光結構，其中，該上層第二小型發光晶片1141經由該第二小型電路發光晶片114之雙層晶片供電發光結構內部，可與該下層第二小型電路晶片1142電氣連接(電源電氣連接)。該下層第二小型電路晶片1142可接受該第二小型電路發光晶片114外部之電力電源(市電、行動電源)以作電能供電(第二小型電路晶片供電)，該下層第二小型電路晶片1142並將其供電電能經由該第二小型電路發光晶片114雙層晶片供電發光結構內部，直接並穩定地供電予上層第二小型發光晶片1141使用(第二小型發光晶片發光)。除此之外，該上層第二小型發光晶片1141與該下層第二小型電路晶片1142可機械連接及電氣連接以作發光晶片供電使用(第二小型發光晶片發光)，該上層第二小型發光晶片1141與該下層第二小型電路晶片1142亦可機械分離及電氣分離以作發光晶片更換(第二小型發光晶片可置換)。 Furthermore, as shown in FIG. 9, the second small-sized circuit light-emitting chip 114 is internally composed of an upper second small-sized light-emitting chip 1141 (light-emitting chip) and a lower-layer second small-sized circuit chip 1142 (generally small-sized circuit chip). a two-layer small-chip power-emitting structure, wherein the upper second small-sized light-emitting chip 1141 is electrically connected to the lower-layer second small-sized circuit wafer 1142 via the two-layer wafer-powered light-emitting structure of the second small-sized circuit light-emitting chip 114 ( Power supply electrical connection). The lower second small circuit chip 1142 can receive an electric power source (mains, mobile power) external to the second small circuit light emitting chip 114 for power supply (second small circuit wafer power supply), and the lower second small circuit chip 1142 The power supply power is supplied to the inside of the light-emitting structure via the second small-sized circuit light-emitting chip 114, and is directly and stably supplied to the upper second small-sized light-emitting chip 1141 (the second small-sized light-emitting chip emits light). In addition, the upper second small-sized light-emitting chip 1141 and the lower second small-sized circuit wafer 1142 can be mechanically and electrically connected for use as a light-emitting chip for power supply (second small-sized light-emitting chip light-emitting), and the upper second small-sized light-emitting chip 1141 and the lower second small circuit wafer 1142 can also be mechanically separated and electrically separated for illuminating wafer replacement (second small luminescent wafer replaceable).
由此，本項發明創作提出一電氣裝置可設一發光晶片系統11，使得該發光晶片系統11內部之該中央處理器電路發光晶片110利用其雙層中央處理器晶片供電發光結構可作發光照明(中央處理器電路晶片供電、中央處理器發光晶片發光)，該第一大型電路發光晶片111、該第二大 型電路發光晶片112利用其雙層大型晶片供電發光結構亦可作發光照明(大型電路晶片供電、大型發光晶片發光)，而該第一小型電路發光晶片113、該第二小型電路發光晶片114利用其雙層小型晶片供電發光結構則亦可作發光照明(小型電路晶片供電、小型發光晶片發光)。如此，運用本項發明創作之「置換式可發光晶片系統」，令一電氣裝置即能以內部可置換之發光晶片發光予液晶顯示使用，該電氣裝置液晶顯示工作無需額外之背光設備，因而不致於發生電氣裝置經常使用之背光設備佔據電氣裝置相當空間，以致無法達成輕薄短小設計要求之情形。 Thus, the present invention proposes that an electrical device can be provided with an illuminating wafer system 11 such that the central processing unit illuminating wafer 110 inside the illuminating wafer system 11 can be used for illuminating illumination by using a dual-layer central processor chip-powered light-emitting structure. (Central processor circuit chip power supply, central processing unit light emitting chip illumination), the first large circuit light emitting chip 111, the second largest The circuit board illuminating chip 112 can also be used for illuminating illumination (large circuit chip power supply, large illuminating chip illuminating) by using the double-layer large-scale chip-powered light-emitting structure, and the first small-sized circuit illuminating chip 113 and the second small-sized circuit illuminating chip 114 are utilized. The dual-layer small-chip power-on-emitting structure can also be used for illuminating illumination (small circuit chip power supply, small illuminating chip illuminating). Thus, by using the "displacement illuminable wafer system" created by the invention, an electrical device can be illuminated by an internally replaceable luminescent wafer for use in a liquid crystal display, and the liquid crystal display operation of the electrical device does not require additional backlighting, thereby failing to Backlighting devices that are often used in electrical installations occupy considerable space in electrical installations, so that thin, short, and short design requirements cannot be achieved.
上列詳細說明係針對本項發明創作之可行實施例的具體說明，惟該等實施例並非用以限制本創作之專利範圍，凡未脫離本項發明創作技藝精神所為之等效實施或變更，例如：等變化之等效性實施例，均應包含於本創作之專利範圍中。 The detailed description above is a detailed description of the possible embodiments of the present invention, but the embodiments are not intended to limit the scope of the invention, and the equivalent implementation or modification of the inventive concept is not deviated from the spirit of the invention. For example, equivalent embodiments of variations, etc., should be included in the scope of the patent of the present invention.
03‧‧‧液晶顯示器 03‧‧‧LCD display
11‧‧‧發光晶片系統 11‧‧‧Lighting wafer system
110‧‧‧中央處理器電路發光晶片 110‧‧‧Central processor circuit light-emitting chip
111‧‧‧第一大型電路發光晶片 111‧‧‧The first large-scale circuit light-emitting chip
112‧‧‧第二大型電路發光晶片 112‧‧‧Second large-scale circuit light-emitting chip
113‧‧‧第一小型電路發光晶片 113‧‧‧First small circuit light-emitting chip
114‧‧‧第二小型電路發光晶片 114‧‧‧Second small circuit light-emitting chip
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW293941B (en) * | 1996-03-08 | 1996-12-21 | United Microelectronics Corp | Integrated circuit structure of multi-chip module |
| CN1290968A (en) * | 1999-09-30 | 2001-04-11 | 富士电机株式会社 | Semiconductor structure and its producing method |
| TW200729124A (en) * | 2005-11-18 | 2007-08-01 | Cree Inc | Solid state lighting panels with variable voltage boost current sources |
| US8018424B2 (en) * | 2006-10-19 | 2011-09-13 | Au Optronics Corporation | Backlight device with zone control |
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2015
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Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW293941B (en) * | 1996-03-08 | 1996-12-21 | United Microelectronics Corp | Integrated circuit structure of multi-chip module |
| CN1290968A (en) * | 1999-09-30 | 2001-04-11 | 富士电机株式会社 | Semiconductor structure and its producing method |
| TW200729124A (en) * | 2005-11-18 | 2007-08-01 | Cree Inc | Solid state lighting panels with variable voltage boost current sources |
| US8018424B2 (en) * | 2006-10-19 | 2011-09-13 | Au Optronics Corporation | Backlight device with zone control |
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