TWI623432B - Resin film forming sheet - Google Patents

Abstract

A sheet for forming a resin film which can suppress occurrence of a curl in the resin film forming layer when it is wound into a roll shape.

In the sheet for forming a resin film of the present invention, the support sheet, the resin film forming layer, and the release film are laminated in this order, and the thickness of the release film is 50 μm or more.

Description

Resin film forming sheet

According to the present invention, a resin film having a high adhesion strength can be efficiently formed on a wafer, and a resin film forming sheet of a semiconductor device having high reliability can be manufactured.

After the semiconductor wafer manufactured in a state of a large diameter is cut and separated into small pieces (semiconductor wafer), the bonding step is moved to the next step. At this time, the semiconductor wafer is subjected to each step of cutting, washing, drying, expanding, and picking up in a state of being adhered to the sheet, and then transferred to the joining step of the next step.

Among these steps, in order to simplify the process of the pick-up step and the bonding step, there are various cuts that can simultaneously have both the wafer fixing function and the die bonding function. Proposal for a die sheet for die bonding. For example, by using the above-mentioned bonding sheet, a semiconductor wafer having an adhesive layer on the back surface can be obtained, which can be used as a direct die bonding of an organic substrate-wafer, a lead frame-wafer, a wafer-wafer, and the like.

Patent Document 1 (JP-A-2005-350520) is described as cutting. The die sheet for die bonding has an adhesive sheet in which the base material, the adhesive layer, the adhesive layer, and the base film are sequentially laminated.

Further, in recent years, the fabrication of semiconductor devices has been carried out using a so-called "face down" mode of fabrication. In the face-down mode, a semiconductor wafer having an electrode such as a bump on a circuit surface (hereinafter, simply referred to as a "wafer") is used, and the electrode is bonded to the substrate. Therefore, the electricity with the wafer The surface on the opposite side of the road surface (the back side of the wafer) is exposed.

The exposed wafer back surface is protected by an organic film. Conventionally, a wafer having a protective film composed of the organic film is obtained by applying a liquid resin to a back surface of a wafer by a spin coating method, drying it, and curing the film together with the wafer. However, since the thickness precision of the protective film thus formed is not sufficient, there is a case where the yield of the product is lowered.

In order to solve the problem, the dicing tape with an adhesive layer formed on the dicing tape on the dicing tape is described in Patent Document 2 (JP-A-2012-33557), and the adhesive layer is used as an adhesive surface. A film for manufacturing a semiconductor device in which a predetermined interval is laminated on an isolator.

[Previous Technical Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open Publication No. 2005-350520

[Patent Document 2] Japanese Patent Laid-Open Publication No. 2012-33557

The sheet for forming a resin film used for the wafer to which the adhesive layer or the protective film is adhered, which is described in Patent Document 1 or Patent Document 2, is rolled into a roll shape after being used. The state of the state of storage. When the release film (release substrate or separator) does not have a sufficient thickness, when the resin film-forming sheet is wound into a roll shape, the occurrence of the resin film formation in the adhesive layer or the protective film may be considered to cause the formation of the resin film. The reason for the step difference of the portion of the plate having uneven thickness.

When a flaw is formed in the adhesive layer, the thickness of the adhesive layer is lowered, the air is trapped when the adhesive layer is adhered to the wafer, or the semiconductor wafer is attached to the wafer mounting portion (substrate or other wafer) via the adhesive layer. The decrease in the adhesion of the time or the cause of the occurrence of voids. As a result, it is difficult to obtain a semiconductor device of excellent reliability.

Further, in the case where a wrinkle is formed in the protective film, there is a cause of poor appearance in addition to the above.

The present invention has been accomplished in view of the prior art as described above. In other words, it is an object of the present invention to provide a sheet for forming a resin film which can prevent a curl from occurring in a resin film forming layer when wound into a roll.

The present invention includes the following points.

[1] A sheet for forming a resin film, which is formed by laminating a supporting sheet, a resin film forming layer, and a release film in this order, and the thickness of the release film is 50 μm or more.

[2] The sheet for forming a resin film according to [1], wherein the peeling film is formed on the surface side of the resin film layer, and the cut portion is formed along the outer periphery of the resin film forming layer, and the cut depth of the cut portion is the peeling film. 1/2 or more of the thickness.

[3] The sheet for forming a resin film according to [2], wherein the diameter of the supporting sheet is larger than the diameter of the resin film forming layer, and the peeling film forms a cut along the outer surface of the supporting sheet from the side of the supporting sheet side. The plunging depth of the cut portion formed along the outer circumference of the resin film forming layer The cut-in depth of the cut portion formed by the outer periphery of the support sheet is equal to or greater than the cut-in depth.

[4] The sheet for forming a resin film according to [3], wherein the cut-in portion formed along the outer periphery of the support sheet has a depth of cut of 3/5 or less of the thickness of the release film.

According to the sheet for forming a resin film of the present invention, even if it is wound into a roll shape, it is possible to prevent the resin film forming layer from being wound.

10‧‧‧Plastic film forming sheet

11‧‧‧Support board

12‧‧‧ resin film forming layer

13‧‧‧Release film

D1‧‧‧cutting department

D2‧‧‧cutting department

Fig. 1 is a plan view showing a sheet for forming a resin film of the present invention.

Fig. 2 is a schematic cross-sectional view showing the sheet for forming a resin film shown in Fig. 1 taken along line A-A (a sheet for forming a resin film according to a first aspect).

Fig. 3 is a view showing a sheet for forming a resin film in a second aspect.

Fig. 4 is a view showing a sheet for forming a resin film according to a third aspect.

Fig. 5 is a view showing a sheet for forming a resin film according to a fourth aspect.

Fig. 6 is a view showing a series of steps of the operation of adhering the laminate of the support sheet 11 and the resin film forming layer 12 to the semiconductor wafer 32.

Fig. 6b is a view showing a series of steps of the operation of adhering the laminate of the support sheet 11 and the resin film forming layer 12 to the semiconductor wafer 32.

Fig. 6 is a view showing a series of steps of the operation of adhering the laminate of the support sheet 11 and the resin film forming layer 12 to the semiconductor wafer 32.

Fig. 6 is a view showing a series of steps of the operation of bonding the laminate of the support sheet 11 and the resin film forming layer 12 to the semiconductor wafer 32.

Figure 7 is a laminate of a support sheet and a resin film forming layer. A series of steps of the process of bonding to the semiconductor wafer 32.

Hereinafter, details of the sheet for forming a resin film of the present invention will be described.

Fig. 1 is a plan view showing a first aspect of the resin film-forming sheet 10 of the present invention, and Fig. 2 is a view showing the resin film-forming sheet 10 shown in Fig. 1 taken along the line AA. Profile view. As shown in FIG. 1 and FIG. 2, the resin film-forming sheet 10 of the present invention has a configuration in which a supporting sheet 11, a resin film forming layer 12, and a peeling film 13 are laminated in this order.

Further, the support sheet 11 and the resin film forming layer 12 are cut into a desired planar shape and partially laminated on the release film 13. Here, the desired planar shape of the laminate composed of the support sheet 11 and the resin film forming layer 12 is not particularly limited as long as it is a shape in which the laminate portion is laminated on the release film 13 . It is preferable to have a shape conforming to the planar shape of a workpiece such as a semiconductor wafer, for example, a circular shape, a slightly circular shape, a quadrangular shape, a pentagon shape, a hexagonal shape, an octagonal shape, or a wafer shape (a part of a circumference of a circle is a straight line shape) Etc. It is easier to shape the semiconductor wafer. Among them, in order to reduce excess portions other than the portion adhered to the semiconductor wafer, it is preferable to have a circular shape or a wafer shape.

(release film)

The thickness of the release film is 50 μm or more, preferably 50 to 200 μm. When the peeling film is less than 50 μm, when the resin film forming sheet is wound into a roll shape, a curl is formed in the resin film forming layer. When the resin film forming layer is wound, the thickness of the resin film forming layer is lowered, and the air is trapped when the resin film is formed on the wafer, or the method of manufacturing the semiconductor device described later is used to reduce the semiconductor. The adhesion of the wafer to the wafer mounting portion (substrate or other wafer) via the resin film formation layer and the cause of the void. As a result, it is difficult to obtain a semiconductor device having excellent reliability. Further, when the resin film forming layer is used as a protective film for protecting the back surface of the wafer, the curl of the resin film forming layer may cause a defect in appearance other than the above.

In the sheet for forming a resin film of the present invention, the above problem can be eliminated by making the thickness of the release film in the above range.

The release film is used as a carrier film when a sheet for forming a resin film is used, and for example, a polyethylene film, a polypropylene film, a polybutene film, a polybutadiene film, a polymethylpentene film, or the like can be used. Polyvinyl chloride film, vinyl chloride copolymer film, polyethylene terephthalate film, polyethylene naphthalate film, polybutylene terephthalate film, polyurethane film, ethylene vinyl acetate Copolymer film, ionomer resin film, ethylene. (Meth)acrylic copolymer film, ethylene. (Meth) acrylate copolymer film, polystyrene film, polycarbonate film, polyimide film, fluororesin film, and the like. In addition, such bridging films can also be used. Furthermore, it may be such a laminated film.

The surface tension of the surface of the resin film forming layer to be peeled off from the film is preferably 40 mN/m or less, more preferably 37 mN/m or less, and particularly preferably 35 mN/m or less. The lower limit is usually about 25 mN/m. Such a peeling film having a low surface tension can be obtained by appropriately selecting a material, or can be obtained by applying a release agent to the surface of the release film and performing a release treatment.

The release agent used for the release treatment may be an alkyd type, an anthrone type, a fluorine type, an unsaturated polyester type, a polyolefin type, a wax type or the like, and particularly an alkyd type, an anthrone type, or a fluorine type stripper. It has good heat resistance.

The surface of the film or the like which is the base of the release film is subjected to a release treatment by using the above-mentioned release agent, and the release agent can be directly diluted with a solvent or diluted with a solvent or by a latex, by a gravure coater or a meter bar coater. The air knife coating machine, the roll coater, and the like may be applied, and the release sheet coated with the release agent may be supplied at a normal temperature or under heating, or may be cured by electron beam to form a release agent layer.

Further, the surface tension of the release film may be adjusted by lamination of the film by wet lamination or dry lamination, hot melt lamination, melt extrusion lamination, coextrusion processing or the like. In other words, the surface tension of at least one of the surfaces of the surface which is in contact with the resin film forming layer of the release film is such that the surface is in contact with the resin film forming layer, and the surface is formed. A laminate of other thin film layers is used as a release film.

(resin film forming layer)

At least the functions required for the resin film forming layer are (1) sheet shape maintenance, (2) initial adhesion, and (3) hardenability.

The resin film forming layer can be provided with (1) sheet shape dimensional properties and (3) hardenability, and a binder component, and a polymer component (A) and a curable component (B) can be used by adding a binder component. The first binder component or the second binder component containing the curable polymer component (AB) having the properties of the components (A) and (B).

Further, the (2) initial adhesion which is temporarily followed by the function of the workpiece until the resin film formation layer is cured may be pressure-sensitive adhesiveness or may be followed by thermal softening. (2) The initial adhesion property can be controlled by the characteristics of the binder component or the adjustment of the blending amount of the inorganic filler (C) to be described later.

(first binder component)

The first binder component is formed by providing the polymer film (A) and the curable component (B) to form a layer shape maintaining property and curability of the resin film. Further, in order to facilitate the distinction between the first binder component and the second binder component, the curable polymer component (AB) is not contained.

(A) polymer component

The polymer component (A) is added to the resin film forming layer for the main purpose of imparting shape characteristics to the resin film forming layer sheet.

In order to achieve the above object, the weight average molecular weight (Mw) of the polymer component (A) is usually 20,000 or more, preferably 20,000 to 3,000,000. The value of the weight average molecular weight (Mw) is a value measured by gel permeation chromatography (GPC) (polystyrene standard). For the measurement by this method, for example, the high-speed GPC device "HLC-8120GPC" manufactured by TOSO Corporation is used, and the high-speed column "TSK gurd column H _XL -H", "TSK Gel GMH _XL ", and "TSK Gel G2000" are used. H _XL ” (above, all manufactured by TOSO), in this order, the column temperature: 40 ° C, infusion speed: 1.0 mL / min, with the detector as a differential refractometer.

Further, in order to facilitate the distinction from the curable polymer (AB) to be described later, the polymer component (A) does not have a curing functional group to be described later.

As the polymer component (A), an acrylic polymer, a polyester, or a phenoxy resin (for convenience of being distinguished from a curable polymer (AB) to be described later, and being limited to those having no epoxy group) can be used. Ester, polyether, polyurethane, polyoxyalkylene, rubber-based polymer, and the like. Further, it may be an acrylic urethane resin obtained by reacting an acrylic polyol having a propylene polymer having a hydroxyl group with a urethane prepolymer having an isocyanate group at a molecular terminal, etc., for example, such as two or more kinds of bonds. . again A polymer containing two or more types of bonds may be used in combination of two or more kinds.

(A1) acrylic polymer

As the polymer component (A), the acrylic polymer (A1) can be preferably used. The glass transition temperature (Tg) of the acrylic polymer (A1) is preferably -60 to 50 ° C, more preferably -50 to 40 ° C, and further preferably in the range of -40 to 30 ° C. When the glass transition temperature of the acrylic polymer (A1) is too high, the adhesion of the resin film forming layer is lowered, and the film may not be transferred to the workpiece, or the resin film forming layer may be formed after the transfer or the resin film forming layer may be cured. The obtained resin film may be abnormally peeled off from the workpiece. In addition, when the glass transition temperature of the acrylic polymer (A1) is too low, the peeling force of the resin film forming layer and the support sheet is increased, and the transfer failure of the resin film forming layer may occur.

The weight average molecular weight of the acrylic polymer (A1) is preferably from 100,000 to 1,500,000. When the weight average molecular weight of the acrylic polymer (A1) is too high, the adhesion of the resin film forming layer is lowered, and the film may not be transferred to the workpiece, or the resin film forming layer or the resin film may be peeled off from the workpiece after the transfer. Anomaly. In addition, when the weight average molecular weight of the acrylic polymer (A1) is too low, the adhesion between the resin film forming layer and the support sheet is high, and the transfer failure of the resin film forming layer may occur.

The acrylic polymer (A1) contains at least a (meth) acrylate, at least a constituent monomer.

The (meth) acrylate may, for example, be a (meth) acrylate having an alkyl group having an alkyl group having 1 to 18 carbon atoms, and specific examples thereof include methyl (meth)acrylate and ethyl (meth)acrylate. Propyl methacrylate, butyl (meth)acrylate, 2-ethyl (meth)acrylate a hexyl ester or the like; a (meth) acrylate having a cyclic skeleton, and specific examples thereof include a cycloalkyl (meth)acrylate, a benzyl (meth)acrylate, an isobornyl (meth)acrylate, and a (meth) group. Dicyclopentyl acrylate, dicyclopentenyl (meth)acrylate, dicyclopenteneoxyethyl (meth)acrylate, quinone imine (meth) acrylate, and the like. In addition, among the monomers having a hydroxyl group, a monomer having a carboxyl group, and a monomer having an amine group, which will be described later, may be exemplified as (meth)acrylate.

Further, in the present specification, (meth)acrylic acid is used in the sense of containing both acrylic acid and methacrylic acid.

As the monomer constituting the acrylic polymer (A1), a monomer having a hydroxyl group can also be used. By using such a monomer, a hydroxyl group can be introduced into the acrylic polymer (A1), and when the resin film forming layer further contains the energy ray-curable component (B2), the compatibility with the acrylic polymer (A1) can be improved. . The monomer having a hydroxyl group may be a (meth) acrylate having a hydroxyl group such as 2-hydroxyethyl (meth)acrylate or 2-hydroxypropyl (meth)acrylate; N-hydroxymethyl (methyl) Acrylamide and the like.

As the monomer constituting the acrylic polymer (A1), a monomer having a carboxyl group can also be used. By using such a monomer, a carboxyl group can be introduced into the acrylic polymer (A1), and when the resin film forming layer further contains the energy ray-curable component (B2), the compatibility with the acrylic polymer (A1) can be improved. . The monomer having a carboxyl group may have a carboxyl group such as 2-(meth)acryloyloxyethyl isophthalate or 2-(meth)acryloxypropyl isophthalate. Acrylate; (meth)acrylic acid, maleic acid, fumaric acid, isaconic acid, and the like. When the epoxy-based thermosetting component is used as the curable component (B) to be described later, since the carboxyl group reacts with the epoxy group in the epoxy-based thermosetting component, the amount of the monomer having a carboxyl group is preferably small.

The monomer constituting the acrylic polymer (A1) may also have an amine Base monomer. Examples of such a monomer include an amino group-containing (meth) acrylate such as monoethylamino group (meth) acrylate.

As the monomer constituting the acrylic polymer (A1), other vinyl acetate, styrene, ethylene, α-olefin or the like can be used.

The acrylic polymer (A1) can also be bridged. The bridging, the acrylic polymer (A1) in front of the bridging bridge has a bridging functional group such as a hydroxyl group, and a bridging agent, a bridging functional group and a bridging agent are added to the composition for forming the resin film forming layer. The functional group reaction is bridged. The resin film forming layer cohesive force can be adjusted by bridging the acrylic polymer (A1).

The bridging agent may, for example, be an organic polyvalent isocyanate compound or an organic polyvalent quinone imine compound.

The organic polyvalent isocyanate compound may, for example, be an aromatic polyvalent isocyanate compound, an aliphatic polyvalent isocyanate compound, an alicyclic polyvalent isocyanate compound, a terpolymer of the organic polyvalent isocyanate compound, and the organic polyvalent isocyanate. A terminal isocyanate prepolymer obtained by reacting a compound with a polyol compound or the like.

The organic polyvalent isocyanate compound may specifically be 2,4-toluene diisocyanate, 2,6-toluene diisocyanate, 1,3-xylene diisocyanate, 1,4-dimethylbenzene diisocyanate or diphenylmethane-4. , 4'-diisocyanate, diphenylmethane-2,4'-diisocyanate, 3-methyldiphenylmethane diisocyanate, hexamethylene diisocyanate, isophorone diisocyanate, dicyclohexylmethane- 4,4'-diisocyanate, dicyclohexylmethane-2,4'-diisocyanate, lysine isocyanate, and such polyol adducts.

Organic polyvalent quinone imine compound, specifically, N, N'-diphenyl Methane-4,4'-bis(1-aziridine carboxamide), trimethylolpropane-tri-beta-aziridine propionate, tetramethylolethane-tri-beta-aziridine Propionate and N,N'-toluene-2,4-bis(1-aziridinecarboxamide) triethylene melamine and the like.

The bridging agent is usually 0.01 to 20 parts by mass of the acrylic polymer (A1) before bridging, preferably 0.1 to 10 parts by mass, and more preferably 0.5 to 5 parts by mass.

In the aspect of the present invention, when the content of the component constituting the resin film forming layer is determined based on the content of the polymer component (A), when the polymer component (A) is a bridging acrylic polymer, the standard is used as a reference. The content of the acrylic polymer before bridging.

(A2) non-acrylic resin

Further, the polymer component (A) may be selected from polyesters and phenoxy resins (for the purpose of facilitating the discrimination of the curable polymer (AB) described later, it is limited to those having no epoxy group), polycarbonate, polyether. One type or a combination of two or more types selected from the group consisting of a polyurethane, a polysiloxane, a rubber polymer, and a non-acrylic resin (A2). Such a resin is preferably a weight average molecular weight of 20,000 to 100,000, more preferably 20,000 to 80,000.

The glass transition temperature of the non-acrylic resin (A2) is preferably -30 to 150 ° C, more preferably -20 to 120 ° C.

When a non-acrylic resin (A2) is used in combination with the acrylic polymer (A1), a sheet for forming a resin film is used, and when a resin film is formed on a workpiece, the support sheet and the resin film can be easily formed. When the layers of the layers are peeled off, the resin film forming layer can follow the transfer surface to suppress the occurrence of voids and the like.

Non-acrylic resin (A2), and the above acrylic polymer When the (A1) is used in combination, the content of the non-acrylic resin (A2) is the mass ratio (A2: A1) of the non-acrylic resin (A2) to the acrylic polymer (A1), and is usually 1:99 to 60:40. It is better to range from 1:99 to 30:70. By setting the content of the non-acrylic resin (A2) in this range, the above effects can be obtained.

(B) hardening ingredients

The curable component (B) is added to the resin film forming layer for the main purpose of imparting layer hardenability to the resin film. As the curable component (B), a thermosetting component (B1) or an energy ray-curable component (B2) can be used. In addition, these uses can also be combined. The thermosetting component (B1) contains at least a compound which can be reacted by heating. In addition, the energy ray-curable component (B2) is a compound (B21) containing a functional group reactive by irradiation with an energy ray, and is polymerized and cured by irradiation with an energy ray such as an ultraviolet ray or an electron beam. The functional groups based on the curable components react with each other to form a three-dimensional network structure to achieve hardening. Since the curable component (B) is used in combination with the polymer component (A), the weight average is generally suppressed from the viewpoint of suppressing the viscosity of the coating composition for forming the resin film forming layer and improving the handleability. The molecular weight (Mw) is 10,000 or less, preferably 100 to 10,000.

(B1) thermosetting component

The thermosetting component is preferably an epoxy thermosetting component, for example.

The epoxy-based thermosetting component is preferably a compound (B11) having an epoxy group and a compound (B11) having an epoxy group and a thermosetting agent (B12).

(B11) a compound having an epoxy group

Compound having an epoxy group (B11) (hereinafter, referred to as "epoxy compound" (B11)" situation. ), the prior learners can be used. Specifically, a polyfunctional epoxy resin, bisphenol A diglycidyl ether or a hydrogenated product thereof, an o-cresol novolac epoxy resin, a dicyclopentadiene type epoxy resin, a biphenyl type epoxy resin, and a double A phenol A type epoxy resin, a bisphenol F type epoxy resin, a phenylene skeleton type epoxy resin, etc. have a bifunctional or more epoxy compound in a molecule. These may be used alone or in combination of two or more.

When the epoxy compound (B11) is used, the resin film forming layer is preferably one part by mass of the epoxy resin compound (B11) in an amount of from 1 to 1,500 parts by mass, and more preferably from 3 to 1200 parts by mass. When the amount of the epoxy compound (B11) is small, there is a tendency that the adhesion of the resin film forming layer after curing is lowered. Further, when the amount of the epoxy compound (B11) is large, the peeling force of the resin film forming layer and the supporting sheet is increased, and the transfer failure of the resin film forming layer may occur.

(B12) Thermal hardener

The heat hardener (B12) acts as a hardener for the epoxy compound (B11). A preferred thermosetting agent is a compound having two or more functional groups reactive with an epoxy group in one molecule. The functional group may, for example, be a phenolic hydroxyl group, an alcoholic hydroxyl group, an amine group, a carboxyl group or an acid anhydride. Among these, a phenolic hydroxyl group, an amine group, an acid anhydride, etc. are preferable, and a phenolic hydroxyl group and an amine group are more preferable.

Specific examples of the phenolic curing agent include a polyfunctional phenol resin, a bisphenol, a novolac phenol resin, a dicyclopentadiene phenol resin, a neophenolic phenol resin, and an aralkyl phenol resin.

Specific examples of the amine-based curing agent include DICY (dicyandiamide).

These may be used alone or in combination of two or more.

The content of the heat hardener (B12) is 100% for the epoxy compound (B11) The quantity is preferably 0.1 to 500 mass parts, and more preferably 1 to 200 mass parts. When the content of the heat curing agent is small, the adhesion after curing tends to decrease.

(B13) hardening accelerator

The hardening accelerator (B13) may also be used to adjust the heat hardening rate of the resin film forming layer. In particular, when an epoxy-based thermosetting component is used, it is preferable to use a curing accelerator (B13) as the thermosetting component (B1).

Preferred hardening accelerators include tertiary amines such as triethylenediamine, benzyldimethylamine, triethanolamine, dimethylaminoethanol, and tris(dimethylaminomethyl)phenol; 2-methylimidazole, 2-phenylimidazole, 2-phenyl-4-methylimidazole, 2-phenyl-4,5-dihydroxymethylimidazole, 2-phenyl4-methyl 5-hydroxymethyl Imidazoles such as imidazole; organophosphines such as tributylphosphine, diphenylphosphine, triphenylphosphine; tetraphenylborate such as tetraphenylphosphonium tetraphenyl borate or triphenylphosphine tetraphenyl borate Wait. These may be used alone or in combination of two or more.

The curing accelerator (B13) is preferably contained in an amount of 0.01 to 10 parts by mass in total of 100 parts by mass of the epoxy compound (B11) and the thermosetting agent (B12), and more preferably in an amount of 0.1 to 1 part by mass. By containing the hardening accelerator (B13) in an amount within the above range, it has excellent adhesion even when exposed to high temperature and high humidity, and high reliability can be achieved even when exposed to severe tempering conditions. By adding the hardening accelerator (B13), the adhesion of the resin film forming layer after hardening can be improved. The more the content of the hardening accelerator (B13), the stronger the effect.

(B2) energy line hardening component

Since the resin film forming layer contains the energy ray-curable component, the resin film forming layer can be cured without requiring a large amount of energy and a long-term heat curing step. Thereby, the manufacturing cost can be reduced.

As the energy ray-curable component, a compound (B21) having a functional group reactive by irradiation with an energy ray can be used alone, but a compound (B21) having a functional group reactive by irradiation with an energy ray is used and photopolymerization is used. The initiator (B22) is preferred.

(B21) a compound having a functional group reactive by irradiation of an energy ray

A compound (B21) having a functional group which is reacted by irradiation with an energy ray (hereinafter referred to as "energy ray-reactive compound (B21)"), specifically, trimethylolpropane triacrylate , pentaerythritol triacrylate, isoamyl alcohol tetraacrylate, diisopentaerythritol monohydroxy pentaacrylate, diisopentaerythritol hexaacrylate or 1,4-butanediol diacrylate, 1, An acrylate-based compound such as 6-hexanediol diacrylate, and examples thereof include oligoester acrylate, urethane acrylate oligomer, epoxy acrylate, polyether acrylate, and itaconic acid oligomerization. An acrylate compound having a polymer structure such as an acrylate compound or the like, and having a relatively low molecular weight. Such a compound has at least one polymerizable double bond bond in the molecule.

When the energy ray-reactive compound (B21) is used, the resin film-forming layer preferably contains 1 to 1500 parts by mass of the energy ray-reactive compound (B21) per 100 parts by mass of the polymer component (A), and contains 3 to 1200 masses. Better department.

(B22) Photopolymerization initiator

By combining the photopolymerization initiator (B21) with the photopolymerization-reactive compound (B21), the polymerization hardening time can be shortened, and the amount of light irradiation can be reduced.

Such a photopolymerization initiator (B22), specifically, benzophenone, acetophenone, benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, Benzoin isobutyl ether, benzoin benzoic acid, benzoin benzoate methyl ester, benzoin dimethyl ketal, 2,4-diethyl thioxanthone, α-hydroxycyclohexyl benzophenone, benzyl diphenyl sulfide, sulfurized tetramethyl Kiryulam, azobisisobutyronitrile, benzoin, diphenylene, diacetyl, 1,2-diphenylmethane. 2-hydroxy-2-methyl-1-[4-(1-methylvinyl)phenyl]acetone, 2,4,6-trimethylbenzoin diphenylphosphine oxide and β-chloropurine Wait. The photopolymerization initiator (B22) may be used alone or in combination of two or more.

The blending ratio of the photopolymerization initiator (B22) is preferably 0.1 to 10 parts by mass, and more preferably 1 to 5 parts by mass, based on 100 parts by mass of the energy ray-reactive compound (B21).

When the blending ratio of the photopolymerization initiator (B22) is less than 0.1 parts by mass, the photopolymerization is insufficient and the curable property cannot be satisfied. When the blending ratio exceeds 10 parts by mass, the residue is not contributed to photopolymerization. Will become the cause of the anomaly.

(2nd adhesive component)

The second binder component is provided with a curable polymer component (AB) to form a layer shape maintaining property and curability of the resin film.

(AB) hardenable polymer component

The curable polymer component is a polymer having a functional group of a hardening function. The hardening functional group is a functional group which can react with each other to form a three-dimensional network structure, and may be a functional group which is reacted by heating or a functional group which is reacted by an energy ray.

The hardening functional group may be added to the unit of continuous structure which becomes the skeleton of the curable polymer (AB), and may be added to the terminal. When the functional group of the curing function is added to a unit of a continuous structure which becomes a skeleton of the curable polymer component (AB), the functional group of the curing function may be added to the side chain or may be directly added to the main chain. The weight average molecular weight (Mw) of the curable polymer component (AB) The viewpoint of the purpose of the shape-dimensional property of the sheet of the lipid film formation layer is usually 20,000 or more.

The epoxy group can be mentioned by heating the functional group of the reaction. The epoxy group-containing curable polymer component (AB) may be a high molecular weight epoxy group-containing compound or a phenoxy resin having an epoxy group. A high molecular weight compound containing an epoxy group is disclosed, for example, in JP-A-2001-261789.

Further, the polymer similar to the above acrylic polymer (A1) may be a monomer polymerized with an epoxy group-containing monomer (an epoxy group-containing acrylic polymer). The monomer having an epoxy group may, for example, be a glycidyl group-containing (meth) acrylate such as glycidyl (meth)acrylate.

When an acrylic polymer containing an epoxy group is used, the preferred aspect is the same as the acrylic polymer (A1) except for the alkoxy group.

When a curable polymer component (AB) having an epoxy group is used, a thermosetting agent (B12) or a curing accelerator may be used in the same manner as in the case where an epoxy-based thermosetting component is used as the curable component (B). (B13).

The functional group based on the energy ray reaction may, for example, be a (meth) acrylonitrile group. The curable polymer component (AB) having a functional group reactive by an energy ray is an acrylate-based compound having a polymerization structure such as polyether acrylate, and the like, and a high molecular weight can be used.

Further, for example, a base polymer having a functional group X having a hydroxyl group or the like in a side chain and a functional group Y capable of reacting with the functional group X (for example, when the functional group X is a hydroxyl group, an isocyanate group or the like) may be used. And a polymer prepared by reacting a low molecular compound having a functional group by an energy ray irradiation reaction.

In this case, the base polymer conforms to the above acrylic polymer (A1). The preferred aspect of the base polymer is the same as that of the acrylic polymer (A1).

When the curable polymer component (AB) having a functional group reactive by an energy ray is used, a photopolymerization initiator (B22) may be used in the same manner as in the case of using the energy ray-curable component (B2).

The second binder component may contain the polymer component (A) or the curable component (B) together with the curable polymer component (AB).

The resin film forming layer may contain the following components in addition to the binder component.

(C) inorganic filler

The resin film forming layer may further contain an inorganic filler (C). By blending the inorganic filler (C) with the resin film forming layer, the coefficient of thermal expansion in the cured resin film can be adjusted, and the thermal expansion coefficient of the cured resin film can be optimized for the workpiece, thereby improving the semiconductor device. Reliability. Further, the moisture absorption rate of the resin film after hardening can also be reduced.

In addition, when the resin film obtained by curing the resin film forming layer of the present invention acts as a protective film for a workpiece or a wafer in which a workpiece is formed, an inorganic filler (C) is applied to the protective film by laser marking. The portion exposed in the laser light is exposed to a white color due to the diffusion of the reflected light. Thereby, when the resin film forming layer contains the coloring agent (D) to be described later, the difference between the laser marking portion and the other portions can be obtained, and the lettering can be made conspicuous.

Preferred inorganic fillers include powders of cerium oxide, aluminum oxide, talc, calcium carbonate, titanium oxide, iron oxide, cerium carbide, boron nitride, etc., and spheroidized beads, single crystal fibers, and the like. Glass fiber, etc. Among these, a cerium oxide filler and an alumina filler are preferred. The above inorganic filler (C) can It can be used individually or in mixture of 2 or more types.

In order to obtain the above effect, the range of the content of the inorganic filler (C) accounts for 100 parts by mass of the total solid content of the resin film forming layer, preferably 1 to 80 parts by mass, and 20 to 75 parts by mass. Better, especially good at 40~70 quality.

(D) colorant

In the resin film forming layer, the coloring agent (D) can be adjusted. When the semiconductor device is incorporated into the device by blending the colorant, it is possible to prevent the semiconductor device from being erroneous due to infrared rays or the like generated by the surrounding device. Further, when marking the resin film by means of a laser mark or the like, there is an effect that the marks such as characters and symbols are easily recognized. In other words, in a semiconductor device or a semiconductor wafer on which a resin film is formed, a product number or the like is usually printed on the surface of the resin film by a laser marking method (a method of performing printing by cutting off the surface of the protective film by laser light). By containing the colorant (D) in the resin film, the contrast difference between the portion of the resin film that is removed by the laser light and the portion that is not removed can be sufficiently obtained, and the visibility can be improved.

As the colorant, organic or inorganic pigments and dyes can be used. Among these, black pigment is preferred in terms of electromagnetic wave or infrared shielding. As the black pigment, carbon black, iron oxide, manganese dioxide, aniline black, activated carbon, or the like can be used, but it is not limited thereto. From the viewpoint of improving the reliability of the semiconductor device, carbon black is particularly preferable. The coloring agent (D) may be used alone or in combination of two or more.

The blending amount of the coloring agent (D) is preferably 0.1 to 35 parts by mass, more preferably 0.5 to 25 parts by mass, and particularly preferably 1 to 15 parts by mass to 100 parts by mass of the total solid content of the resin film forming layer.

(E) coupling agent

A coupling agent (E) having a functional group reactive with an inorganic substance and a functional group reactive with an organic functional group can be used for improving adhesion, adhesion, and/or cohesiveness of a resin film to a workpiece of a resin film forming layer. . Further, by using the coupling agent (E), the heat resistance of the resin film obtained by curing the resin film forming layer can be improved without impairing the water resistance. Examples of such a coupling agent include a titanate coupling agent, an aluminate coupling agent, and a decane coupling agent. Among these, a decane coupling agent is preferred.

The decane coupling agent is preferably used, and the functional group reactive with the organic functional group is a group reactive with a functional group of the polymer (A), the thermosetting component (B) or the curable polymer component (AB). A decane coupling agent.

Examples of the decane coupling agent include γ-glycidylpropyltrimethoxydecane, γ-glycidylpropylmethyldiethoxydecane, and β-(3,4-epoxycyclohexyl)ethyl. Trimethoxydecane, γ-(methacryloxypropyl)trimethoxydecane, γ-aminopropyltrimethoxydecane, N-6-(aminoethyl)-γ-aminopropyltrimethyl Oxydecane, N-6-(aminoethyl)-γ-aminopropylmethyldiethoxydecane, N-phenyl-γ-aminopropyltrimethoxydecane, γ-urethane Triethoxy decane, γ-mercaptopropyltrimethoxydecane, γ-mercaptopropylmethyldimethoxydecane, bis(3-triethoxydecylpropyl)tetrasulfide, A Trimethoxy decane, methyl triethoxy decane, vinyl trimethoxy decane, vinyl triethoxy decane, imidazolium, and the like. These may be used alone or in combination of two or more.

The decane coupling agent has a total mass of 100 parts by mass of the polymer (A), the curable component (B), and the curable polymer component (AB), and is usually 0.1 to 20 parts by mass, preferably 0.2 to 10 parts by mass. The ratio of 0.3 to 5 mass parts is better included. When the content of the decane coupling agent is less than 0.1 part by mass, the above effect may not be obtained, and if it exceeds 20 parts by mass, the degassing may occur.

(F) general purpose additives

The resin film forming layer may be blended with various additives as necessary in addition to the above. Examples of the various additives include a smoothing agent, a plasticizer, a charge preventing agent, an oxidation preventing agent, an ion scavenger, a gas scavenger, a chain shifting agent, and a release agent.

The resin film-forming layer can be obtained, for example, by a composition obtained by mixing the above components in an appropriate ratio (a composition for forming a resin film). The resin film-forming composition can be diluted with a solvent in advance, or a solvent can be added during mixing. Further, when a composition for forming a resin film is used, it may be diluted with a solvent.

Examples of the solvent include ethyl acetate, methyl acetate, diethyl ether, dimethyl ether, acetone, methyl ethyl ketone, acetonitrile, hexane, cyclohexane, toluene, heptane and the like.

The resin film forming layer has initial adhesion and hardenability, and can be easily adhered to the workpiece at normal temperature or under heating in an uncured state. Further, the resin film forming layer may be heated while being pressed. Then, a resin film having high impact resistance can be finally provided by hardening, and then the strength is excellent, and sufficient reliability can be maintained under severe high temperature and high humidity conditions. Further, the resin film forming layer may have a single layer structure or a multilayer structure.

The thickness of the resin film forming layer is preferably 1 to 100 μm, more preferably 2 to 90 μm, and particularly preferably 3 to 80 μm. By setting the thickness of the resin film forming layer to the above range, the resin film forming layer can function as a highly reliable protective film or adhesive.

(support board)

The resin film forming layer as described above is laminated on the support sheet in a peelable manner.

Support sheet, which can be used with the film mentioned above The same film. Furthermore, as shown in Fig. 3, an adhesive sheet can also be used as the support sheet.

Fig. 3 is a schematic cross-sectional view showing a sheet 10 for forming a resin film in a second aspect. When a desired process such as dicing is applied to the workpiece on the sheet for forming a resin film, as shown in Fig. 3, an adhesive sheet on which the adhesive layer 11b can be formed on the substrate 11a is used as the support sheet 11. In this case, the resin film forming layer 12 is laminated on the adhesive layer 11b provided on the support sheet 11. The substrate 11a to which the sheet is adhered can be exemplified as the above-mentioned film as a release sheet. As the adhesive layer 11b, a weak adhesive having an adhesive strength to the extent that the resin film forming layer can be peeled off can be used, and an energy ray hardening property in which the adhesive force is lowered by energy ray irradiation can be used.

The adhesive layer 11b can be obtained by various conventional adhesives (for example, a general-purpose adhesive such as a rubber-based, acrylic-based, anthrone-based, urethane-based, or vinyl ether-based adhesive, or an adhesive having irregularities on the surface, It is formed by an energy ray-curable adhesive, an adhesive containing a thermal expansion component, or the like.

In the configuration of the sheet for forming a resin film, the sheet for forming a resin film can function as a dicing sheet for supporting the workpiece in the cutting step, and the density between the supporting sheet and the resin film forming layer can be maintained. The property is in the cutting step, and the effect of peeling off the wafer with the resin film forming layer by the supporting sheet is suppressed. The sheet for forming a resin film functions as a dicing sheet for supporting a workpiece in the dicing step, and the step of manufacturing the semiconductor device can be simplified without separately attaching the dicing sheet to the workpiece having the resin film forming layer in the dicing step.

The sheet for forming a resin film is obtained by adhering a resin film forming layer to various workpieces after removing the peeling film, and then, depending on the situation, The required processing such as cutting. Then, the resin film forming layer is fixed to the workpiece, and the supporting sheet is peeled off. That is, it is used in a process including a step of transferring a resin film forming layer from a supporting sheet to a workpiece.

In the present invention, the material to be applied is not limited, and examples thereof include various materials such as a semiconductor wafer, a glass substrate, a ceramic substrate, an organic material substrate such as FPC, and a metal material such as a precision component.

The resin film forming layer as described above can be used as a film-like adhesive for fixing a wafer in which a workpiece is formed to a substrate or another wafer. Such a film-like adhesive has been used in the die bonding step of wafers in recent years. The film-form adhesive is preferably formed by forming a film for forming a resin film containing an epoxy-based thermosetting component, and is formed on the support sheet by peeling, and the sheet for forming a resin film of the present invention can be obtained.

In addition, the sheet for forming a resin film of the present invention may also have a workpiece fixing function when cutting a crystal grain and a cutting function of a grain subsequent function at the time of die bonding. The die bond is used as a sheet. At this time, by forming the film-like adhesive into an adhesive property or a property of being adhered to the workpiece by softening by heating, the workpiece can be held in the cutting step or the wafer can be sliced. Then, at the time of die bonding, it acts as an adhesive for fixing the wafer. In the following, the film-form adhesive which is a component of the resin film formation sheet is also called an adhesive layer. The subsequent layer is cut together with the workpiece at the time of cutting to form an adhesive layer having the same shape as the cut wafer. After the dicing is completed, the wafer is picked up, and the adhesive layer is peeled off from the support sheet together with the wafer. The wafer with the adhesive layer is placed on a mounting portion such as a substrate or another wafer, and heated, and the wafer and the wafer mounting portion are then bonded via an adhesive layer. So cut. crystal The pellet bonding sheet is formed on the supporting sheet to form an adhesive layer having both a workpiece fixing function and a die attach function.

Further, the resin film forming layer of the resin film-forming sheet of the present invention may also function as a protective film for a workpiece or a wafer in which a workpiece is formed. At this time, for example, the workpiece is adhered to the resin film forming layer, and the resin film forming layer is cured into a resin film. Thereafter, the workpiece and the resin film are cut to obtain a wafer having a resin film functioning as a protective film. The sheet for forming such a protective film has an adhesive resin film forming layer which serves as a protective film on the supporting sheet. The resin film forming layer which is a protective film contains, for example, a binder component (the first binder component and/or the second binder component), and may contain an inorganic filler (C) or a colorant (D) as necessary. )Wait.

In addition, as shown in FIG. 2 and FIG. 3, the resin film forming sheet 10 is formed on the surface of the resin film forming layer on the peeling film 13 along the outer periphery of the resin film forming layer 12, and the cut portion D1 is formed. The cutting depth d1 of the cut portion D1 is preferably 1/2 or more of the thickness of the peeling film.

When the resin film forming sheet is wound into a roll shape, the resin film forming layer is prevented from being wound, and when the thickness of the peeling film is 50 μm or more, the toughness of the peeling film tends to be strong, and it tends to be difficult to bend. Further, the toughness of the general resin film forming layer tends to be weaker than that of the peeling film. Therefore, in the step of adhering the resin film forming sheet to the workpiece, the peeling sheet 64 shown in Fig. 6 is brought into contact with the peeling film 13 of the resin film forming sheet, and the peeling film 13 is not applied to the peeling sheet 64. When the side is bent at an acute angle, it is difficult to form a peeling starting point at the interface between the resin film forming layer and the release film, and it is difficult to feed the resin film forming layer. However, in the peeling film of 50 μm or more, it is difficult to sharpen the side of the peeling plate 64 due to the thickness thereof. The corner is bent, and it is difficult to feed the resin film forming layer as shown in Fig. 7.

In the present invention, the cut portion D1 is formed in the release film 13, and the above problem can be eliminated by making the cut depth d1 of the cut portion D1 1/2 or more of the peeling film. In other words, as shown in Fig. 6(b), even in the peeling film of 50 μm or more, the peeling film can be bent at an acute angle by using the cut portion D1 as a starting point, and the peeling starting point can be easily formed at the interface between the resin film forming layer and the peeling film.

Further, when the peeling film 13 is formed into the cut portion D1 having a predetermined depth, the resin film forming layer can be surely cut into a predetermined shape together with the supporting sheet. In addition, when the thickness of the peeling film is 50 μm or more, the sheet for forming a resin film is easily wound into a roll shape, and the storage property at the time of storage is excellent.

Further, as shown in Fig. 6, the step of adhering the resin film forming sheet to the workpiece causes the peeling film to be subjected to stress in the longitudinal direction (flow direction). When the cut portion D1 is not formed in the release film, the stress propagates in the resin film formation layer, and the resin film formation layer extends in the flow direction. The deformation (extension) of the resin film forming layer reduces the thickness precision. As a result, the reliability of the semiconductor device obtained by using the resin film forming layer can be lowered. By forming the cut-in portion having a predetermined depth in the release film, the stress applied to the resin film-forming layer can be alleviated, and deformation of the resin film-forming layer can be suppressed.

Further, the sheet for forming a resin film of the present invention may be in the following third or fourth aspect. Hereinafter, various aspects of the sheet for forming a resin film will be described using the drawings.

In the third aspect and the fourth aspect, as shown in FIGS. 4 and 5, the diameter of the supporting sheet 11 is larger than the diameter of the resin film forming layer 12, and the peeling film is formed. 13. The cut-in portion D2 is formed along the outer surface of the support sheet 11 in addition to the cut-in portion D1, and the cut-in depth d1 of the cut-in portion D1 is equal to or greater than the cut-in depth d2 of the cut-in portion D2.

In the third aspect and the fourth aspect, the depths d1 and d2 may be the same, and the depth d2 is larger than the depth d1. However, since the toughness of the supporting sheet is stronger than that of the resin film, it is easy to support the board. The viewpoint of the peeling starting point of the interface between the sheet and the release film is made; the viewpoint of the abrasion of the die which cuts the peeling film partially by cutting the support sheet is suppressed; the removal step (cutting step) of the unnecessary portion after the die is easier When the depth of the cut-in depth d2 is too large, the support sheet is cut into a predetermined amount due to the pressure of the die, and since the laminated portion of the support sheet and the resin film-forming layer is thicker than the portion cut into the support sheet, From the viewpoint of the pressure of the resin film forming layer and the deformation of the resin film forming layer, the cutting depth d2 of the cut portion D2 is preferably smaller than the cutting depth d1 of the cut portion D1, and further 3/5 or less of the thickness of the peeling film. Preferably, it is preferably 1/2 or less, and particularly preferably 1/4 or less.

Further, a peripheral portion between the support sheet 11 and the resin film forming layer 12 may be interposed between the release film 13 and the resin film forming layer 12, or between the release film 13 and the support sheet 11, and a jig may be provided. Then the layer. The jig adhesive layer may be an adhesive member composed of a single adhesive layer, an adhesive member composed of a substrate and an adhesive layer, or a double-sided adhesive member having a core material.

The jig attachment layer, for example, has a ring shape (ring shape), has a cavity portion (internal opening), and has a size that can be fixed to a jig of a ring frame or the like. Specifically, the inner diameter of the ring frame is smaller than the outer diameter of the adhesive layer. Furthermore, the inner diameter of the ring frame is slightly larger than the inner diameter of the adhesive layer. Furthermore, the ring frame is usually metal or plastic. Shaped body.

When the adhesive member composed of the adhesive layer monomer is used as the adhesive layer of the jig, the adhesive for forming the adhesive layer is not particularly limited, and for example, it is preferably composed of an acrylic adhesive, a rubber adhesive or an anthrone adhesive. Among these, in view of the removability of the ring frame, an acrylic adhesive is preferred. Further, the above-mentioned adhesive may be used singly or in combination of two or more.

The thickness of the adhesive layer constituting the adhesive layer of the jig is preferably 2 to 20 μm, more preferably 3 to 15 μm, and particularly preferably 4 to 10 μm. When the thickness of the adhesive layer is less than 2 μm, sufficient adhesion cannot be exhibited. When the thickness of the adhesive layer exceeds 20 μm, when the ring frame is peeled off, the residue of the adhesive remains in the ring frame, which contaminates the ring frame.

When the adhesive member composed of the substrate and the adhesive layer serves as a bonding layer of the jig, the annular frame is adhered to the adhesive layer constituting the adhesive member.

The adhesive forming the adhesive layer is the same as the adhesive forming the adhesive layer in the adhesive member composed of the above-mentioned adhesive layer monomers. Furthermore, the thickness of the adhesive layer is also the same.

The substrate constituting the adhesive layer of the jig is not particularly limited, and is, for example, a polyethylene film, a polypropylene film, or ethylene. Vinyl acetate copolymer film, ethylene. (Meth)acrylic copolymer film, ethylene. A (meth) acrylate copolymer film, a polyolefin film such as an ionomer resin film, a polyvinyl chloride film, a polyethylene terephthalate film, or the like. Among these, in view of expandability, a polyethylene film and a polyvinyl chloride film are preferred, and a polyvinyl chloride film is more preferable.

The thickness of the substrate constituting the adhesive layer of the jig is preferably 15 to 200 μm, more preferably 30 to 150 μm, still more preferably 40 to 100 μm.

Further, when the double-sided adhesive member having the core material is used as the jig adhesive layer, the double-sided adhesive member is fixed by the core material, the layer of the adhesive layer formed on one surface thereof, and the surface formed on the other surface. Made up of an adhesive layer. The adhesive layer for lamination is a step of adhering a resin film forming layer of a sheet for forming a resin film to a wafer, and the resin sheet forming sheet of the first aspect and the second aspect is a resin. In the case of the film formation layer of the third aspect and the fourth aspect, the film formation layer is an adhesive layer on the side where the support sheet is adhered. Further, the fixing adhesive layer is an adhesive layer adhered to the side of the ring frame in the above-described pasting step.

The core material of the double-sided adhesive member may be the same as the base material of the above-mentioned adhesive member. Among these, in view of expandability, a polyolefin film and a plasticizable polyvinyl chloride film are preferred.

The thickness of the core material is usually 15 to 200 μm, preferably 30 to 150 μm, and more preferably 40 to 100 μm.

The adhesive layer for the adhesion of the two-sided adhesive member and the adhesive layer for fixing may be a layer composed of the same adhesive or a layer composed of different adhesives. It is preferable to select the adhesion force of the fixing adhesive layer and the ring frame to be smaller than the adhesion force of the resin film forming layer or the supporting sheet and the laminating adhesive layer. Examples of such an adhesive include an acrylic adhesive, a rubber adhesive, and an anthrone adhesive. Among these, in view of the removability of the ring frame, an acrylic adhesive is preferred. The adhesive for forming the fixing adhesive layer may be used singly or in combination of two or more. The same applies to the adhesive layer for lamination.

The thickness of the layering adhesive layer and the fixing adhesive layer is the same as the thickness of the adhesive layer of the above-mentioned adhesive member.

By providing the jig adhesive layer, the laminated body composed of the support sheet 11 and the resin film forming layer 12 is easily attached to a jig such as a ring frame.

The shape of the sheet for forming a resin film is a strip shape in which a laminate composed of a support sheet and a resin film forming layer is laminated on a long release film, and this can be wound up. In particular, it is preferable that a laminate comprising a support sheet and a resin film forming layer which are cut in a desired shape is detachably laminated on a long release film at a predetermined interval. Further, the shape of the sheet for forming a resin film may be formed into a shape of a leaf.

A laminated body composed of a supporting sheet and a resin film forming layer which are cut in a desired shape and which can be peeled off and laminated on a long peeling film at a predetermined interval, may be laminated on a support sheet. The portion of the sheet and the resin film forming layer and the portion where the supporting sheet and the resin film forming layer are not laminated have a thickness unevenness of the sheet for forming a resin film. When such a sheet for forming a resin film having uneven thickness is wound into a roll shape, the thickness is not uniform and the crimping becomes uneven, which may cause collapse of the roll. Therefore, in the sheet for forming a resin film of such a form, it is preferable to make the thickness uniform. Therefore, as shown in Fig. 1, the support sheet and the resin film forming layer which are cut in a desired shape are placed along the both sides 15 in the short side direction of the long peeling film 13 with a small space therebetween. It is preferable to adhere the peripheral tape 14 having the same thickness as the laminate of the support sheet and the resin film forming layer. Here, the interval between the laminate of the support sheet and the resin film forming layer and the peripheral tape 14 is preferably from 1 to 20 mm, particularly preferably from 2 to 10 mm. By the peripheral belt 14, the thickness unevenness is eliminated, and the above abnormality is easily avoided.

(Manufacture of sheet for forming a resin film)

Then, a laminate formed of a support sheet and a resin film-forming layer which are cut in a desired shape, and a resin film-forming sheet which is detachably laminated on a long release film with a predetermined space therebetween The manufacturing method of the sheet is as shown in Fig. 4, and the third aspect is taken as an example. However, the sheet for forming a resin film of the present invention is not limited to those obtained by such a production method.

First, the resin film forming layer on the release film is half-cut into a desired shape.

Specifically, it is prepared to have a resin between two long release films (hereinafter referred to as a first long release film and a second long release film. The second long release film is a release film 13 of Fig. 4). A laminate of film forming layers. A resin film forming layer formed into a film in advance may be formed by sandwiching two long strips of the film, and a resin film forming composition for forming a resin film forming layer may be used as one of the long stripping films. Coating, drying, and laminating the other long stripping film on the coating film to form a laminate.

Then, the first long release film and the resin film formation layer are completely cut into a desired shape to reach the second long release film 13 , and the first long release film and the resin film are formed into a layer die (half cut). The die is carried out by a general-purpose device or method such as die cutting. In this case, the thickness of the first long stripping film and the thickness of the resin film forming layer and the cut-in are formed by completely cutting the first long stripping film and the resin film forming layer to form the cut portion D1 having the depth of cut d1. The depth of the total depth of the depth d1 is cut. Therefore, the cut portion D1 having the cut depth d1 is formed on the surface of the second long strip peeling film. The cutting depth d1 of the second long release film is preferably 1/2 or more of the thickness of the second long release film, and more preferably 3/5 or more. Specifically, when the thickness of the second long strip film is 50 μm, the cut is The depth d1 is preferably 25 μm or more, more preferably 30 μm or more. The thickness of the second long strip release film is 100 μm, and the depth of cut is d1, preferably 50 μm or more, more preferably 60 μm or more. The upper limit of the depth d1 is cut so that the portion where the cutting blade completely penetrates the second release film is not required, and the thickness of the second release film is preferably 4/5 or less.

Then, the adhesive tape for peeling is adhered to the longitudinal direction of the first release film, and the first release film of the die is bonded. Then, the peeling adhesive tape is removed, and the resin film forming layer 12 having a desired shape remains on the second long stripping film 13, and the remaining resin film forming layer is removed together with the first long stripping film. The residual portion other than the resin film forming layer of the desired shape is continuous. Therefore, when the interface between the second long stripping film and the resin film forming layer is used as the peeling starting point, the resin film forming layer in the remaining portion is removed together with the first long peeling film, and the resin film forming layer 12 having a desired shape is formed. It remains on the second strip peeling film 13. As a result, a laminate of the resin film forming layers 12 having a desired shape can be arranged on the second strip peeling film 13.

Then, the second long release film 13 and the resin film formation layer 12 are adhered to the surface of the resin film formation layer 12 having the second long release film 13 .

Then, the support sheet is slightly circularly punched into the inner diameter of the annular frame and below the outer diameter. At this time, the center point of the resin film forming layer 12 is punched in conformity with the center point of the slightly circular support sheet piece 11 after the die. Further, since the depth of the cut is completely cut into the support sheet and the cut portion D2 is cut into the depth d2, the thickness of the support sheet is cut to the total depth of the cut depth d2. Therefore, the cut portion D2 having the cut depth d2 is formed on the surface of the second long strip peeling film.

The plunging depth d2 of the second strip peeling film may be the same as the plunging depth d1 of the cut portion D1, or may be larger than the plunging depth d1, and the plunging depth d2 of the second strip peeling film may be smaller than the plunging depth d1 of the cut portion D1. It is also small. The cutting depth d2 of the second elongate release film is smaller than the incision depth d1 of the incision portion D1, and is preferably 3/5 or less of the thickness of the second elongate release film, and the thickness of the second elongate film is peeled off. It is better to be 1/2 or less, and further preferably 1/4 or less. Specifically, when the thickness of the second long release film is 50 μm, the depth of cut is d2, preferably 30 μm or less, more preferably 25 μm or less, and still more preferably 12 μm or less. When the thickness of the second elongate release film is 100 μm, the depth of cut is d2, preferably 60 μm or less, more preferably 50 μm or less, and still more preferably 25 μm or less.

Next, the substantially circular support sheet 11 is left on the second elongated release film 13 to remove the remaining support sheets. As a result, a resin film forming layer having a desired shape on the second long strip peeling film 13 and a support sheet 11 having a substantially circular shape and a sheet for forming a resin film of the third aspect can be obtained.

Furthermore, in the above, when the die for supporting the sheet is formed, the support sheet is cut into a circular shape, and the outer side of the slightly circular support sheet 11 is slightly spaced by the support sheet. It is preferable that the support sheet is left as the peripheral tape 14 in the short side direction of the second long strip film along the both side portions 15. Thereafter, the support plate 11 and the peripheral tape 14 which are slightly rounded are left on the second elongated release film 13, and the remaining support sheets are removed to obtain a slightly circular support plate 11 and a desired shape. The laminated body of the resin film forming layer 12 and the peripheral tape 14 are continuously adhered to the resin film forming sheet 10 in the form of the long release film 5.

(Method of Manufacturing Semiconductor Device)

Next, the method of using the sheet for forming a resin film of the present invention will be described by way of an example in which the sheet for forming a resin film according to the first aspect shown in Fig. 1 is applied to a semiconductor device.

In the method of manufacturing a semiconductor device according to the first aspect of the present invention, the resin film forming layer including the sheet is adhered to a workpiece, and the workpiece is cut into a wafer to form a layer of the resin film. The step of remaining on the wafer is carried out by the support sheet, and the step of placing the wafer on the die pad portion or another wafer via the resin film forming layer is preferred.

Hereinafter, an example in which a tantalum wafer is used as a workpiece will be described.

The circuit formation on the surface of the wafer can be performed by various methods including the etching method, the lift-off method, and the like, which have been conventionally used. Next, the opposing surface (back surface) of the circuit surface of the semiconductor wafer is ground. The grinding method is not particularly limited, and the grinding can be carried out by a conventional means such as a grinder. In the back grinding, in order to protect the surface of the circuit, an adhesive sheet called a surface protection sheet is adhered to the circuit surface. In the back grinding, the circuit surface side of the wafer (that is, the surface protection sheet side) is fixed by a suction pad or the like, and the back side on which the circuit is not formed is ground by a grinder. The thickness of the wafer after grinding is not particularly limited, and is usually about 50 to 500 μm.

Thereafter, the crushed layer generated at the time of back grinding is removed as necessary. The removal of the fracture layer can be performed by chemical etching or plasma etching.

Then, the circuit is formed and the back surface is ground, and a resin film forming layer of the resin film forming sheet is adhered to the back surface of the wafer. The bonding method is not particularly limited. For example, in the step shown in Fig. 6, the resin film forming layer is adhered to the semiconductor wafer.

The sixth (a) to (d) drawings are a series of steps for performing a process of adhering the laminate of the support sheet 11 and the resin film forming layer 12 to the semiconductor wafer 32. As shown in Fig. 6(a), the resin film forming sheet 10, the release film 13 functions as a carrier film, supported by two rolls 62 and 66, and a peeling plate 64, one end of which is connected to a cylindrical core. The state of 44 is wound to form the first reel 42, and the second reel 52 is wound in a state in which the cylindrical core 54 is connected to the other end. Then, a core driving motor (not shown) that rotates the winding core 54 is connected to the winding core 54 of the second reel 52, and the laminated body of the supporting sheet 11 and the resin film forming layer 12 is peeled off. The release film 13 is wound at a predetermined speed.

First, when the core driving motor is rotated, the winding core 54 of the second reel 52 is rotated, and the resin film forming sheet 10 wound around the winding core 44 of the first reel 42 is pulled out of the first reel 42. The outside. Then, the stretched resin film forming sheet 10 is guided to the disk-shaped semiconductor wafer 32 disposed on the movable stage and the annular frame 34 which is disposed to surround the disk.

Next, a laminate composed of the support sheet 11 and the resin film forming layer 12 is peeled off from the release film 13. At this time, as shown in Fig. 6(b), the peeling film 13 is abutted against the peeling film 64 from the side of the peeling film 13 of the resin film forming sheet 10, and the peeling film 13 is bent at an acute angle from the side of the peeling plate 64 with the cut portion D1 as a starting point. A peeling origin is formed between the peeling film 13 and the laminate of the support sheet 11 and the resin film forming layer 12. Further, in order to effectively obtain the peeling starting point, the boundary between the peeling film 13 and the laminated sheet composed of the supporting sheet 11 and the resin film forming layer 12 may be blown.

After the peeling starting point is formed between the laminated body composed of the peeling film 13 and the supporting sheet 11 and the resin film forming layer 12, as shown in Fig. 6(c) As shown in the above, the laminate of the support sheet 11 and the resin film forming layer 12 is adhered, and the resin film forming layer 12 is adhered to the ring frame 34 and the semiconductor wafer 32. At this time, the laminate of the support sheet 11 and the resin film forming layer 12 is pressure-bonded to the semiconductor wafer 32 by the reel 68. Then, as shown in Fig. 6(d), the laminate of the support sheet 11 and the resin film forming layer 12 is adhered to the semiconductor wafer 32 to obtain a semiconductor wafer with a laminate.

The above process can be continuously performed in an automated step to support the adhesion of the laminate of the sheet 11 and the resin film forming layer 12 to the semiconductor wafer 32. For example, a device such as a RAD-2500 (trade name) manufactured by Lintec Co., Ltd., which is a device for supporting the adhesion of the laminate of the support sheet 11 and the resin film forming layer 12 to the semiconductor wafer 32, may be used.

Then, when the laminate of the support sheet 11 and the resin film forming layer 12 is adhered to the semiconductor wafer 32 by such a step, the resin film forming sheet for forming the cut portion D1 by the release film 13 is formed. In the sheet 10, when the outer periphery of the resin film forming layer 12 reaches the tip end portion of the peeling sheet, the peeling film 13 can be bent at an acute angle with the cut portion D1 as a starting point even with a thick peeling film, and the peeling film 13 and the supporting sheet 11 are easily formed. A peeling starting point is formed between the laminates composed of the resin film forming layer 12. As a result, it is possible to sufficiently suppress the occurrence of peeling failure of the laminate of the support sheet 11 and the resin film forming layer 12 by the release film 13.

When the resin film forming layer has no viscosity at room temperature, it may be appropriately heated (not limited, it is preferably 40 to 80 ° C).

When the energy ray-curable component (B2) is blended as the curable component (B) in the resin film forming layer, the resin film forming layer is irradiated with the support sheet side. In the measuring wire, the resin layer forming layer is preliminarily hardened to increase the cohesive force of the resin film forming layer, and the adhesion between the resin film forming layer and the supporting sheet may be lowered.

Thereafter, the semiconductor wafer is cut by using a cutting means such as a dicing saw to obtain a semiconductor wafer. In this case, the depth of cut is the sum of the thickness of the semiconductor wafer and the thickness of the resin film forming layer, and the depth of the worn portion of the dicing saw.

Furthermore, the energy line irradiation may be performed at any stage before the peeling (pick-up) of the semiconductor wafer after the semiconductor wafer is pasted, for example, after the cutting, or may be performed after the expansion step described below. It is preferable to perform the cutting before bonding the semiconductor wafer. Furthermore, the energy line illumination can also be divided into a plurality of times.

Then, if the sheet for forming a resin film is expanded as necessary, the semiconductor wafer is expanded at intervals, and the semiconductor wafer can be picked up more easily. At this time, a shift occurs between the resin film forming layer and the supporting sheet, and the adhesion between the resin film forming layer and the supporting sheet is reduced, and the pick-up property of the semiconductor wafer is improved. When the semiconductor wafer is picked up as described above, the cut resin film forming layer can be adhered to the back surface of the semiconductor wafer and peeled off from the support sheet.

Next, the semiconductor wafer is placed on the die pad of the lead frame or the surface of another semiconductor wafer (lower wafer) via the resin film forming layer (hereinafter, the die pad or the lower wafer surface on which the wafer is placed is described as "wafer mounting" unit").

The pressure at the time of mounting is usually from 1 kPa to 200 MPa. Further, the wafer mounting portion may be heated before being placed on the semiconductor wafer or heated after being placed. Heating temperature, usually 80~200°C, preferably 100~180°C, heating time pass It is usually 0.1 seconds to 5 minutes, preferably 0.5 seconds to 3 minutes.

After the semiconductor wafer is placed on the wafer mounting portion, it can be further heated as necessary. The heating condition at this time is in the range of the above heating temperature, and the heating time is usually from 1 to 180 minutes, preferably from 10 to 120.

Further, the resin film forming layer may be cured by heating in a resin package which is usually performed by packaging and manufacturing, without performing heat treatment after mounting. By performing the above steps, the resin film forming layer is cured, whereby a semiconductor device in which the semiconductor wafer and the wafer mounting portion are strongly adhered can be obtained. Since the resin film forming layer is fluidized under the grain bonding conditions, the unevenness of the wafer mounting portion can be sufficiently buried, and the occurrence of voids can be prevented, and the reliability of the semiconductor device can be improved.

In the method of manufacturing a semiconductor device according to the second aspect of the invention, the resin film forming layer of the resin film forming sheet is adhered to the back surface of the semiconductor wafer having the surface forming circuit, and then the semiconductor having the resin film on the back surface is obtained. The chip is better. This resin film is a protective film of a semiconductor wafer. Further, in the method of manufacturing a semiconductor device of the present invention, it is preferable to further include the following steps (1) to (3), and the steps (1) to (3) are performed in an arbitrary order.

Step (1): forming a resin film forming layer or a resin film, and supporting the sheet, peeling; Step (2): curing the resin film forming layer to obtain a resin film; Step (3): semiconductor wafer, and cutting resin film Forming a layer or a resin film to cut.

First, a resin film forming layer of a sheet for forming a resin film is adhered to the back surface of the semiconductor wafer. This step is the same as the pasting step in the method of manufacturing the first semiconductor device described above.

Thereafter, steps (1) to (3) are performed in an arbitrary order. For example, Steps (1) to (3) in the order of steps (1), (2), (3); steps (2), (1), (3); steps (2), (3), (1) Steps (3), (2), (1) or steps (3), (1), (2) are performed in any order. Details of the process are as described in Japanese Laid-Open Patent Publication No. 2002-280329. An example of this is described in the order of steps (1), (2), and (3).

First, a resin film forming layer of a sheet for forming a resin film is adhered to the back surface of the semiconductor wafer on which the circuit is formed. Next, the support sheet is peeled off from the resin film forming layer to obtain a laminate of the semiconductor wafer and the resin film forming layer.

Next, the resin film forming layer is cured to form a resin film over the entire surface of the wafer. When the thermosetting component (B1) is used as the curable component (B) in the resin film forming layer, the resin film forming layer is cured by thermal curing. When the energy ray-curable component (B2) is blended as the curable component (B), the resin film-forming layer can be cured by energy ray irradiation, and the thermosetting component (B1) and the energy ray-curable component (B2) can be used. When it is heated, it can be hardened by heating and energy ray irradiation at the same time, or it can be carried out one by one. The energy beam to be irradiated may be ultraviolet (UV) or electron beam (EB), and ultraviolet rays are preferred. As a result, a resin film composed of a hardened resin is formed on the back surface of the wafer, and the strength can be improved as compared with the case of the wafer alone, so that the damage of the thinned wafer at the time of processing can be reduced. Furthermore, the coating liquid for the direct resin film is applied to the back surface of the wafer or wafer. The thickness uniformity of the resin film is superior to that of the overcoat coating method.

Thereafter, the laminate of the semiconductor wafer and the resin film is cut into each circuit formed on the surface of the wafer. The cutting is performed by cutting the wafer together with the resin film. Wafer dicing can be performed by the usual method of using a dicing sheet. As a result, a semiconductor wafer having a resin film on the back surface can be obtained.

Then, you can also laser engraving on the resin film. The laser engraving can be performed by laser marking, and the surface of the protective film is removed by irradiation of laser light, and the article number is marked on the protective film. Further, the laser engraving may be performed before the resin film forming layer is hardened.

Finally, the diced wafer is picked up by a general purpose such as a chuck to obtain a semiconductor wafer having a resin film on the back surface. Then, the semiconductor wafer is mounted on a predetermined stage in a face-down mode to fabricate a semiconductor device. Further, the semiconductor device can be manufactured by a semiconductor wafer having a resin film on the back surface, and then on a die pad portion or another member such as a semiconductor wafer (on the wafer mounting portion). According to the present invention as described above, the resin film having a high thickness uniformity can be easily formed on the back surface of the wafer, and cracks are less likely to occur after the cutting step or the package.

Further, after the resin film forming layer of the resin film forming sheet is pasted on the back surface of the semiconductor wafer, the step of performing the step (3) before the step (1), the resin film forming sheet can function as a cutting sheet. . That is, it can be used as a sheet for supporting a semiconductor wafer as a cutting step. In this case, the semiconductor wafer is adhered to the inner peripheral portion of the resin film-forming sheet via the resin film forming layer, and the outer peripheral portion of the resin film-forming sheet is bonded to another jig such as a ring frame to adhere to the semiconductor. The sheet for forming a resin film of the wafer is fixed to the device to perform cutting.

Further, in the case of the steps (3), (1), and (2), the semiconductor wafer having the resin film forming layer on the back surface may be used after being mounted on a predetermined stage in a face-down mode. The resin film forming layer is hardened by the heating of the resin package which is usually performed by the package manufacturing.

Claims (3)

A sheet for forming a resin film, which is formed by laminating a support sheet, a resin film forming layer, and a release film having a thickness of 50 μm or more, and the release film is adjacent to the resin film forming layer. A first cut-in portion is formed on the surface, and the peeling film is cut along the outer periphery of the resin film forming layer, and the depth of the first cut portion is 1/2 or more of the thickness of the peeling film. The sheet for forming a resin film according to the first aspect of the invention, wherein the support sheet has a diameter larger than a diameter of the resin film forming layer, and the peeling film has a second cut portion formed on a surface adjacent to the support sheet The second cut-in portion cuts the peeling film along the outer circumference of the support sheet, and the depth of cut of the first cut portion formed along the outer circumference of the resin film forming layer is formed along the outer circumference of the support sheet The second incision portion has a depth of cut or more. The sheet for forming a resin film according to the second aspect of the invention, wherein the second cut portion formed along the outer circumference of the support sheet has a depth of cut of 3/5 or less of the thickness of the release film.