TWI620267B - Non contact wafer table - Google Patents

Abstract

A non-contact wafer table, comprising: a body; a plurality of suction holes, which are disposed on the table body; a negative pressure unit coupled to the suction holes; at least one blow hole, Provided in the base body; and a positive pressure unit coupled to the at least one blow hole. The positive pressure unit provides a positive pressure gas, and the blow holes blow a positive pressure gas toward a central region of the wafer, and the positive pressure gas system forms a supporting force. This supporting force prevents the central region of the wafer from being depressed.

Description

Non-contact wafer station

A non-contact wafer fab, especially a device that enables the central portion of the wafer to be in a depressed state and that allows the wafer to fit snugly to the wafer table.

In recent years, with the rapid advancement of electronic products, the existing wafer processing system has been trending towards thinning. However, in the existing wafer process, the wafer is used to fix the wafer, so that the wafer can be transferred to the next process.

The existing wafer table has two arc-shaped bodies or a ring-shaped body, and each of the arc-shaped bodies or the annular body has a plurality of suction holes, and the suction holes are coupled to a negative pressure device. The vacuum device can be a vacuum device. The suction holes form a vacuum adsorption zone with the curved body or the annular system.

A wafer system is placed on the wafer table, and the negative pressure device provides a negative pressure to the suction holes, and the suction holes generate vacuum suction to adsorb the wafer. That is, the vacuum adsorption zone generates a vacuum suction to adsorb the wafer.

Although the above structure can adsorb the wafer, the wafer must have a predetermined thickness, but the trend of the wafer toward the thin wafer is developed, so when the thin wafer is placed on the wafer table, the structural force of the thin wafer Slightly insufficient, the central position of the thin wafer is affected by gravity, and it sag or sag, which causes the thin wafer to be leaked by the position where the suction holes are attracted.

The above leakage, if further explained, because the vacuum adsorption zone is located at the periphery of the thin wafer, the center of the vacuum adsorption zone is not in contact with the thin wafer, so the thin wafer only has its peripheral edge in contact with the vacuum adsorption zone, and the thin wafer is There is no support at the central position, so thin crystal The unsupported position of the circle can cause sag, which in turn causes leakage at the contact position between the thin wafer and the vacuum adsorption zone. If the thickness of the thin wafer is too large, the vacuum adsorption region will not be able to adsorb and fix the thin wafer.

The above leakage system makes it impossible to create airtightness between the thin wafer and the wafer table, which causes the wafer table to be unable to adsorb the thin wafer, so how to enable the wafer stage to adsorb the thin wafer and have a good airtight effect. It is an issue that can be discussed by various manufacturers.

In view of the above problems, an object of the present invention is to provide a non-contact wafer stage. When a wafer is placed on a stage, a blow hole located at a central position of the stage provides a positive pressure gas to the wafer facing the body. On one side, the wafer cannot be sagged, and the wafer is in close contact with the stage, and no leakage can occur.

In order to achieve the above object, the technical means of the present invention is to provide a non-contact wafer table, comprising: a body; a plurality of suction holes, which are disposed on the table body; a negative pressure unit, which is coupled Connecting the suction holes; at least one blowing hole is disposed on the table body; and a positive pressure unit coupled to the at least one blowing hole.

In one embodiment, the at least one blowhole is located at a central location of the body.

In summary, the positive pressure unit provides a positive pressure gas, and the blow holes blow a positive pressure gas toward a central region of the wafer, and the positive pressure gas system forms a supporting force. This supporting force prevents the central region of the wafer from being depressed. With this supporting force, the leakage state cannot be generated.

10‧‧‧Table

100‧‧‧ support

11‧‧‧ suction hole

12‧‧‧Blow holes

13‧‧‧ positive pressure unit

14‧‧‧Negative pressure unit

20‧‧‧ wafer

Figure 1 is a schematic view of a non-contact wafer stage of the present invention.

The embodiments of the present invention are described below by way of specific embodiments, and those skilled in the art can readily understand the other advantages and advantages of the present invention.

Referring to FIG. 1 , the present invention is a non-contact wafer stage having a body 10 , a plurality of suction holes 11 , at least one blowing hole 12 , a positive pressure unit 13 and a negative pressure unit 14 . .

The base 10 has a support base 100. The support base 100 is a ring-shaped body or a plurality of curved bodies. A plurality of suction holes 11 are located in the support base 100. The suction hole 11 is coupled to the negative pressure unit 14. The negative pressure unit 14 is a negative air pressure generating device such as a vacuum machine.

The blow holes 12 are provided in the table body 10 and are located between the support bases 10. The blow hole 12 is coupled to the positive pressure unit 13. The positive pressure unit 13 is a positive air pressure generating device such as a blower. For example, the blow hole 12 is relative to a central position of the wafer 20 placed on the support base 10 or a central position of the stage body 10.

Please refer to FIG. 1 again, a wafer 20 is placed on the support base 100, and the support base 100 and the suction hole 11 form a vacuum adsorption zone. The negative pressure unit 14 provides a negative pressure to the suction hole 11 to cause the suction hole 11 to generate a vacuum suction force to adsorb the wafer 20. The wafer 20 is a thin wafer having a thickness of 4 to 8 mm. For example, the thickness of the wafer 20 is greater than or equal to 6 mm.

When the negative pressure unit 14 provides a negative pressure, the positive pressure unit 13 provides a positive pressure to the blow hole 12, and the blow hole 12 blows a gas toward the wafer 20. The gas system forms a supporting force on the central region of the wafer 20, whereby the central position of the wafer 20 cannot be depressed. At the same time, the position of the wafer 20 in contact with the support base 100 is flat on the top end of the support base 100, that is, the wafer 20 is flatly attached to the vacuum adsorption area to fix the wafer 20, and the wafer 20 is tightly attached to the top end of the support base 100. Combined, the leak state cannot be produced.

In summary, the present invention utilizes a positive pressure gas provided by the positive pressure unit 13 to blow the positive pressure gas toward the central region of the wafer 20, and the positive pressure gas system forms a supporting force. This supporting force prevents the central region of the wafer 20 from being in a depressed state. Therefore, by the supporting force, the vacuum adsorption region can adsorb the wafer 20, and the leak state cannot be generated.

The specific embodiments described above are only used to illustrate the features and functions of the present invention. The equivalents and modifications of the present invention, which are not intended to limit the scope of the present invention, should be The scope of the patent application is covered.

Claims (5)

A non-contact wafer table, comprising: a body; a plurality of suction holes, which are disposed on the table body; a negative pressure unit coupled to the suction holes; at least one blow hole, The at least one blowing hole is located at a central position of the table body; and a positive pressure unit coupled to the at least one blowing hole. The non-contact wafer fab as described in claim 1, wherein the table body further has a support seat, and the suction holes are located in the support base. The non-contact wafer fab as described in claim 2, wherein the support is a ring body or a plurality of arc bodies. The non-contact wafer stage according to claim 1, wherein the negative pressure unit is a negative air pressure generating device. The non-contact wafer stage according to claim 1, wherein the positive pressure unit is a positive air pressure generating device.