TWI616659B - Damping component and integrated-circuit testing apparatus using the same - Google Patents

Abstract

One embodiment of the present invention provides a cushioning component comprising a housing, at least one slider, a fluid, and at least one elastomer. The housing has at least one opening. The slider slidably closes the opening and is partially exposed outside the opening. Further, an accommodation space is formed in the casing. The fluid fills the accommodating space. The elastic body is disposed in the accommodating space.

Description

Damping element and wafer testing device using same

The present disclosure relates to a damper element, and more particularly to a damper element of a wafer testing apparatus.

As the popularity and demand for electronic products increase, so does the output of electronic components used in electronic products. In particular, semiconductor components such as wafers used in most electronic products today. As the demand for semiconductor components increases, the traditional semiconductor component production lines are gradually becoming automated, and manufacturing processes such as wafer fabrication and packaging are automated one by one. However, in the process of automating the testing of semiconductor components, the bonding of the finer external contacts of the semiconductor components to the connection points of the test platform is often affected by the vibration of the testing machine. Therefore, in order to avoid affecting the quality of the bonding of the semiconductor component test, the vibration of the semiconductor component during the testing process is often slowed down by the fixed bracket structure, thereby preventing the vibration from colliding into the test system and affecting the semiconductor. The bonding of the component to the test platform. However, even if the amplitude of the vibration is reduced, the vibration will be extinguished for a while, which will easily increase the wear of the components in the test machine and reduce the life of the components in the test machine. Or even, the components in the test machine need to be overhauled. The shorter cycle makes the operating costs of using the test machine increase. Therefore, in order to reduce the loss of the test machine and the time and cost of the repair test system, there is a need for the general knowledge to propose improvements in the relevant fields to make up for the deficiencies of the existing architecture.

One aspect of the present invention relates to a damper member that receives an external stress by a slider and transmits it between a fluid in the housing and at least one elastomer, and then transmits a damping different from the elastomer through the slider. The coefficient creates a damped oscillation so that the amplitude of the oscillation generated by the stress is quickly absorbed as time passes, thereby achieving the effect of damping.

According to one or more embodiments of the present invention, a damper element includes a housing, at least one slider, a fluid, and at least one elastomer. The housing has at least one opening. The slider slidably closes the opening and is partially exposed outside the opening. Further, an accommodation space is formed in the casing. The fluid fills the accommodating space. The elastic body is disposed in the accommodating space.

In one or more embodiments of the present invention, the elastic body is spherical.

In one or more embodiments of the present invention, the shock absorbing element further includes a plurality of elastic bodies, and the elastic coefficients of the elastic bodies are different.

In one or more embodiments of the present invention, the plurality of elastomers include at least one first elastomer and at least one second elastomer. The first elastomer has a modulus of elasticity greater than the modulus of elasticity of the second elastomer, and the second elastomer is located between the opening and the first elastomer.

In one or more embodiments of the present invention, the shock absorbing element further includes two sliding members and two second elastic bodies. The housing further has two openings. Each second elastomer is located between the first elastomer and the corresponding opening.

In one or more embodiments of the invention, the fluid described above is an incompressible fluid.

Another aspect of the present invention relates to a wafer testing apparatus that uses a slider of a damper element to receive stress generated by a wafer testing apparatus, such as vibration when the wafer gripping apparatus moves, and transmits stress to Between the fluid in the housing of the seismic element and at least one of the elastomers, a damping coefficient is created by a different damping coefficient of the sliding member and the elastic body, so that the amplitude of the oscillation generated by the stress is quickly absorbed with time. In this way, the time and amplitude of the oscillating duration of the wafer test rig and the wafer gripping device can be reduced, and the wear of the components in the wafer testing device by the repeated testing can be further reduced to reduce the cost of the wafer testing device for wafer testing.

In accordance with one or more embodiments of the present invention, a wafer testing apparatus includes at least one shock absorbing element, a wafer test station, and a wafer grasping device. The shock absorbing element includes a housing, at least one slider, a fluid, and at least one elastomer. The housing has at least one opening. The slider slidably closes the opening and is partially exposed outside the opening. Further, an accommodation space is formed in the casing. The fluid fills the accommodating space. The elastic body is disposed in the accommodating space. The wafer test stand is coupled to the slider. The wafer grabbing device is disposed above the wafer test station. The wafer grabber is configured to receive the wafer to bring the wafer into contact with the wafer test station.

In one or more embodiments of the present invention, the elastic body is spherical.

In one or more embodiments of the present invention, the wafer testing apparatus further includes a plurality of elastomers, and the elastic coefficients of the elastomers are different.

In one or more embodiments of the present invention, the plurality of elastomers include at least one first elastomer and at least one second elastomer. The first elastomer has a modulus of elasticity greater than the modulus of elasticity of the second elastomer, and the second elastomer is located between the opening and the first elastomer.

In one or more embodiments of the present invention, the shock absorbing element further includes two sliding members and two second elastic bodies. The housing further has two openings. Each second elastomer is located between the first elastomer and the corresponding opening.

In one or more embodiments of the invention, the fluid described above is an incompressible fluid.

In one or more embodiments of the present invention, the wafer testing apparatus may further include a base disposed on the fixed plane. The base is connected to the damping element.

In one or more embodiments of the present invention, the wafer testing apparatus may further include a first transmission link connected between the base and the damper element.

In one or more embodiments of the present invention, the wafer testing apparatus described above further includes a plurality of damping elements. The wafer testing device can further include a second drive link coupled between the damping elements.

In one or more embodiments of the present invention, the above wafer testing apparatus may further comprise a movable device, which is compatible with the wafer grasping device and the wafer test bench. connection. The movable device is configured to adjust the height of the wafer grabbing device to bring the wafer into contact with the wafer test station.

100‧‧‧Vibration element

110‧‧‧shell

112‧‧‧ openings

114‧‧‧ accommodating space

120‧‧‧Sliding parts

130‧‧‧ fluid

140‧‧‧ Elastomers

142‧‧‧First Elastomer

144‧‧‧Second elastomer

200‧‧‧ wafer tester

210‧‧‧Chassis extension block

220‧‧‧ wafer grabbing device

230‧‧‧ wafer test bench

232‧‧‧foot table

240‧‧‧Chassis

250‧‧‧Front frame

260‧‧‧Removable devices

270‧‧‧Base

280‧‧‧First transmission link

290‧‧‧Second transmission link

300‧‧‧ wafer

400‧‧‧Fixed plane

A‧‧‧dotted box

D‧‧‧Swing direction

X/Y/Z‧‧ Direction

1 is a schematic view showing a damping element according to various embodiments of the present invention; FIG. 2 is a side view showing a wafer testing device according to various embodiments of the present invention; and FIG. 3 is a view showing more according to the present invention. A partial enlarged view of a wafer testing apparatus of one embodiment.

The embodiments of the present invention are disclosed in the following drawings, and the details of However, it should be understood that these practical details are not intended to limit the invention. That is, in some embodiments of the invention, these practical details are not necessary. In addition, some of the conventional structures and elements are shown in the drawings in a simplified schematic manner in order to simplify the drawings.

The use of the terms first, second, and third, etc., is used to describe various elements, components, regions, layers and/or blocks. However, these elements, components, regions, layers and/or blocks should not be limited by these terms. These terms are only used to identify a single element, component, region, layer, and/or block. Therefore, in the following a first component, component, zone A domain, layer, and/or block may also be referred to as a second element, component, region, layer, and/or block, without departing from the spirit of the invention.

1 is a simplified schematic diagram of a damper element 100 in accordance with various embodiments of the present invention. As shown in FIG. 1 , in various embodiments, the damper element 100 includes a housing 110 , a slider 120 , a fluid 130 , and at least one elastomer 140 . In various embodiments, the housing 110 has at least one opening 112. The slider 120 slidably closes the opening 112 and is partially exposed outside the opening 112. Further, an accommodation space 114 is formed in the casing 110. In various embodiments, the slider 120 is movable in the housing 110 in the sliding direction D. The fluid 130 fills the accommodating space 114. In various embodiments, the fluid 130 is an incompressible fluid. In various embodiments, the fluid 130 can be a lubricious fluid such as oil or other suitable fluid. The elastic body 140 is disposed in the accommodating space 114. In various embodiments, the elastomer 140 can be spherical to uniformly receive pressure changes of the fluid 130. In various embodiments, the elastomer 140 can be a damping ball.

As stress acts on the slider 120, the slider 120 pushes the fluid 130 and transfers the stress into the fluid 130, which is transmitted through the fluid 130 to the elastomer 140 such that the stress acting on the cushioning element 100 is absorbed by the fluid 130. The elastomer 140 absorbs and cancels, thereby reducing or avoiding the continued transmission of stress to other components that are coupled to the cushioning element 100. More specifically, the damping coefficient of the fluid 130 and the elastomer 140 are different. Therefore, a combined damping oscillation is generated, so that the amplitude of the oscillation generated by the stress in the damper element 100 gradually decreases with time. As a result, the stress transmitted to the damper element 100 by other components can be absorbed by the damper element 100.

In various embodiments, the cushioning element 100 can further include a plurality of elastomers 140, and the elastic coefficients of the elastomers 140 are different. In various embodiments, the plurality of elastomers 140 can include at least one first elastomer 142 and at least one second elastomer 144. The modulus of elasticity of the first elastomer 142 is greater than the modulus of elasticity of the second elastomer 144. In various embodiments, the second elastomer 144 can be located between the opening 112 and the first elastomer 142. As a result, when the stress is transmitted to the first elastic body 142 and the second elastic body 144 having different elastic coefficients, the amplitude of the combined damping oscillation generated by the damper element 100 is gradually lowered more gradually with time. For example, the combination of the first elastic body 142 and the second elastic body 144 may cause the damping element 100 to undergo an under damping phenomenon, a critical damping phenomenon or an over damping after receiving the stress ( Over damping phenomenon, etc., so that the oscillation amplitude generated by the stress in the damper element 100 is quickly converged, thereby absorbing the stress in the system more quickly.

In various embodiments, the damper element 100 can further include two sliders 120 and two second elastomers 144. The housing 110 further has two openings 112. In various embodiments, the second elastomer 144 can be positioned between the first elastomer 142 and the corresponding opening 112. It should be noted that the position of the opening 112, the sliding direction D of the slider 120, and the shape and number of the elastic body 140 are merely examples, which are not intended to limit the present invention. For example, the openings 112 may also be in opposite positions, while the sliding direction D of the slider 120 is opposite to each other. For example, the extension of the edge of the opening 112 can also be angled and the slider 120 slides in the direction of the opening 112. For example, the housing 110 can also have three or more openings 112, and the slider 120 slides in the direction of the opening 112 to have no Same sliding direction. For example, the cushioning element 100 can also include more elastomers 140. For example, the elastomer 140 can also be elliptical or the like. It is to be understood that a person skilled in the art can make a modest modification or substitution without departing from the spirit and scope of the disclosure, as long as the slider 120 can transmit stress to the fluid 130 and the elastomer 140. And the fluid 130 and the elastomer 140 can absorb stress.

2 is a side elevational view of a wafer testing apparatus 200 in accordance with various embodiments of the present invention. 3 is a partially enlarged top plan view of a portion of the wafer testing device 200 in the dashed frame A of FIG. 2, in accordance with various embodiments of the present invention. Referring to FIGS. 2 and 3 , in various embodiments, wafer testing apparatus 200 can include damping element 100 , chassis 240 , wafer test station 230 , and wafer capture device 220 . The chassis 240 can include a chassis extension 210. The wafer test station 230 is coupled to the snubber element 100. More specifically, in various embodiments, the wafer test station 230 can be coupled to the chassis extension block 210 and coupled to the slider 120 of the snubber element 100 through the chassis extension block 210. The slider 120 is for receiving stress from the chassis extension block 210 and transmitting the stress to the fluid 130 and the elastic body 140, but is not limited thereto.

In various embodiments, the wafer grabbing device 220 is disposed above the wafer test station 230. The wafer grabbing device 220 is configured to receive the wafer 300 and is configured to contact the wafer 300 with the pin 232 of the wafer test station 230. In various embodiments, the wafer testing device 200 can further include a movable device 260 coupled to the wafer grabbing device 220 and the chassis extension block 210. The movable device 260 can be used to move the wafer grabbing device 220 in the XYZ direction to adjust the horizontal position and height of the wafer grabbing device 220 relative to the wafer test station 230 such that the wafer 300 It can be in contact with the wafer test station 230. The stress generated during the movement of the wafer gripping device 220 and the wafer 300 by the movable device 260 can be transmitted to the slider 120 of the damper element 100 through the chassis extension 210. In other embodiments, the stress generated by the wafer gripping device 220 moving may also be transmitted to the slider 120 through the outer frame 250, the chassis 240, the chassis extension 210, and the like.

Since the stress generated by the wafer grasping device 220 when moving the wafer 300 is transmitted into the fluid 130 through the slider 120, or even transmitted through the slider 120 to the composite of the fluid 130 and the elastomer 140, the stress is caused by the fluid. 130 and elastomer 140 absorb and offset. More specifically, since the damping coefficient of the fluid 130 and the elastic body 140 are different, the stress transmitted to the damper member 100 is damped and oscillated between the fluid 130 and the elastic body 140, and is rapidly reduced over time. The amplitude of the oscillations generated within the seismic element 100, in turn, can more quickly absorb stress within the system of the wafer testing device 200. As a result, the stress can be reduced or prevented from continuing to be transmitted to other components of the wafer testing apparatus 200, such as the wafer testing station 230, thereby increasing the stability of the wafer 300 in contact with the pin 232 of the wafer testing station 230. Moreover, during repeated test passes, the wear caused by the stress on the wafer test apparatus 200 is further reduced to extend the life of the components in the wafer test apparatus 200, resulting in reduced maintenance costs for the wafer test apparatus 200.

As shown in FIG. 2, in various embodiments, wafer testing apparatus 200 can also include a base 270. The base 270 can be disposed on the fixed plane 400. The base 270 is coupled to the damper element 100. In various embodiments, the wafer testing device 200 can further include a first transmission link 280 coupled to the base 270 and the shock absorbing element Between pieces 100. In this way, the damping element 100 can be further stabilized through the base 270 to achieve better stability of the wafer testing device 200.

Referring also to FIGS. 2 and 3, in various embodiments, wafer testing apparatus 200 further includes a plurality of damping elements 100. The wafer testing device 200 can also include a second drive link 290 coupled between the damping elements 100. In this way, the forces in the directions of the plane in which the parallel chassis extension block 230 is located can be transmitted between the damper elements 100 through the second transmission link 290, so that the damper element 100 can absorb the directions in all directions on the plane. stress.

In summary, the present invention provides a shock absorbing element comprising a housing, at least one sliding member, a fluid, and at least one elastic body. The housing has at least one opening. The slider slidably closes the opening and is partially exposed outside the opening. Further, an accommodation space is formed in the casing. The fluid fills the accommodating space. The elastic body is disposed in the accommodating space. The sliding member receives the external stress to generate vibration between the fluid in the casing and the at least one elastic body, and then generates a damping oscillation through a different damping coefficient of the sliding member and the elastic body, so that the amplitude of the oscillation generated by the stress rapidly changes with time. Reduced and absorbed.

The present invention further provides a wafer testing apparatus comprising at least one shock absorbing element, a wafer testing station, and a wafer grasping device. The shock absorbing element includes a housing, at least one slider, a fluid, and at least one elastomer. The housing has at least one opening. The slider slidably closes the opening and is partially exposed outside the opening. Further, an accommodation space is formed in the casing. The fluid fills the accommodating space. The elastic body is disposed in the accommodating space. The wafer test stand is coupled to the slider. The wafer grabbing device is disposed above the wafer test station. The wafer grabber is configured to receive the wafer to bring the wafer into contact with the wafer test station. Receiving wafer capture by the slider of the damping element The stress generated by the device transmits stress to the fluid in the housing of the damper element and oscillates between the at least one elastic body, and then dampens the oscillating vibration through the damping coefficient of the sliding member and the elastic body, so that the stress is oscillated The amplitude is quickly absorbed as time decreases. In this way, the stability of the wafer test bench and the wafer gripping device can be increased.

Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention, and the present invention can be modified and modified without departing from the spirit and scope of the present invention. The scope is subject to the definition of the scope of the patent application attached.

Claims (12)

A damper element comprising: a housing having at least one opening; at least one sliding member slidably closing the opening and partially exposed outside the opening to form an accommodating space in the housing; a fluid filling the accommodating space; and at least one first elastic body and at least one second elastic body disposed in the accommodating space, the first elastic body having a modulus of elasticity greater than a modulus of elasticity of the second elastic body, And the second elastic body is located between the opening and the first elastic body. The shock absorbing element of claim 1, wherein the first elastic body is spherical. The shock absorbing member according to claim 1, further comprising two the sliding member and two second elastic bodies, wherein the housing further has two openings, wherein each of the second elastic bodies Located between the first elastomer and the corresponding opening. The shock absorbing element of claim 1, wherein the fluid is an incompressible fluid. A wafer testing device comprising: at least one damping component, comprising: a housing having at least one opening; At least one sliding member slidably closing the opening and partially exposed outside the opening to form an accommodating space in the casing; a fluid filling the accommodating space; and at least one first elastic body And the at least one second elastic body is disposed in the accommodating space, the elastic modulus of the first elastic body is greater than the elastic modulus of the second elastic body, and the second elastic body is located at the opening and the first elastic body a wafer test station coupled to the slider; and a wafer capture device disposed above the wafer test station and coupled to the slider, wherein the wafer capture device is configured to receive a wafer, The wafer is brought into contact with the wafer test station. The wafer testing device of claim 5, wherein the first elastomer is spherical. The wafer testing device of claim 5, wherein the damping element further comprises two of the sliding members and two of the second elastic bodies, wherein the housing further has two of the openings, wherein each of the The second elastomer is located between the first elastomer and the corresponding opening. The wafer testing device of claim 5, wherein the fluid is an incompressible fluid. The wafer testing device according to claim 5, further comprising: A base is disposed on a fixed plane, wherein the base is coupled to the damper element. The wafer testing device of claim 9, further comprising: a first transmission link connected between the base and the damper element. The wafer testing device of claim 5, further comprising a plurality of the damping elements, the wafer testing device further comprising: a second transmission link connected between the damping elements. The wafer testing device of claim 5, further comprising: a movable device coupled to the wafer grasping device and the damper member, wherein the movable device is configured to adjust the wafer gripping device The horizontal position is relative to the height of the wafer test station to bring the wafer into contact with the wafer test station.