TWI616636B - Heat dissipation apparatus - Google Patents

Heat dissipation apparatus Download PDF

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Publication number
TWI616636B
TWI616636B TW105123891A TW105123891A TWI616636B TW I616636 B TWI616636 B TW I616636B TW 105123891 A TW105123891 A TW 105123891A TW 105123891 A TW105123891 A TW 105123891A TW I616636 B TWI616636 B TW I616636B
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Taiwan
Prior art keywords
heat
working fluid
heat insulating
opening
accommodating
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TW105123891A
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Chinese (zh)
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TW201804124A (en
Inventor
鄭丞佑
廖文能
謝錚玟
柯召漢
王勇智
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宏碁股份有限公司
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Priority to TW105123891A priority Critical patent/TWI616636B/en
Priority to US15/482,042 priority patent/US20180031328A1/en
Publication of TW201804124A publication Critical patent/TW201804124A/en
Application granted granted Critical
Publication of TWI616636B publication Critical patent/TWI616636B/en

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/025—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes having non-capillary condensate return means
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/06—Control arrangements therefor
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F9/00—Casings; Header boxes; Auxiliary supports for elements; Auxiliary members within casings
    • F28F9/02—Header boxes; End plates
    • F28F9/026—Header boxes; End plates with static flow control means, e.g. with means for uniformly distributing heat exchange media into conduits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2270/00—Thermal insulation; Thermal decoupling

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Sustainable Development (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

一種散熱裝置，適於對一熱源進行散熱。散熱裝置包括一容置槽、一隔熱單元以及一管體。容置槽具有一出口端、一入口端以及一容置空間，其中容置槽適於由下方自熱源接收熱量。隔熱單元配置於容置槽的容置空間中，且隔熱單元包括一隔熱噴嘴。隔熱噴嘴具有一第一開口、一第二開口以及一頸縮部，其中第一開口連通入口端，而第二開口連通容置空間，且頸縮部鄰近第二開口。管體連接出口端與入口端而與容置槽形成一封閉循環迴路。A heat sink is adapted to dissipate heat from a heat source. The heat sink includes a receiving groove, a heat insulating unit and a tube body. The accommodating groove has an outlet end, an inlet end and an accommodating space, wherein the accommodating groove is adapted to receive heat from the lower self-heat source. The heat insulating unit is disposed in the accommodating space of the accommodating groove, and the heat insulating unit includes a heat insulating nozzle. The heat insulating nozzle has a first opening, a second opening and a necking portion, wherein the first opening communicates with the inlet end, and the second opening communicates with the accommodating space, and the necked portion is adjacent to the second opening. The tubular body connects the outlet end and the inlet end to form a closed loop with the accommodating groove.

Description

散熱裝置Heat sink

本發明是有關於一種散熱裝置，且特別是有關於一種配置於可攜式電子裝置內的散熱裝置。The present invention relates to a heat dissipating device, and more particularly to a heat dissipating device disposed in a portable electronic device.

一般散熱裝置的單循環是將熱源置於容置槽的下方，液態的工作流體流入容置槽後，被熱源加熱沸騰成氣態而流出容置槽，而氣態的工作流體流到冷凝器時再冷卻凝結變為液態而回到容置槽，以完成單循環。但是，若當熱源所產生的溫度過高時，液態的工作流體在回到容置槽之前即沸騰成氣態，則使得單循環失敗，進而無法使散熱裝置有效地散熱。此外，工作流體僅藉由其自身的相變化而在容置槽與導管所構成的封閉迴路中流動，其流動效果較差且容置槽內不一定有足夠的工作流體來進行反應，故散熱裝置的散熱效果有限。Generally, the single cycle of the heat dissipating device places the heat source under the accommodating groove, and the liquid working fluid flows into the accommodating groove, and is heated and boiled into a gaseous state by the heat source to flow out of the accommodating groove, and the gaseous working fluid flows to the condenser. The cooling condenses into a liquid state and returns to the accommodating tank to complete a single cycle. However, if the temperature generated by the heat source is too high, the liquid working fluid will boil into a gaseous state before returning to the accommodating tank, which causes a single cycle to fail, thereby failing to effectively dissipate heat from the heat sink. In addition, the working fluid flows only in the closed loop formed by the accommodating groove and the conduit by its own phase change, and the flow effect is poor, and there is not necessarily enough working fluid in the accommodating groove to react, so the heat sink The heat dissipation effect is limited.

本發明提供一種散熱裝置，其具有較佳的散熱效能。The invention provides a heat dissipating device which has better heat dissipation performance.

本發明的散熱裝置，適於對一熱源進行散熱。散熱裝置包括一容置槽、一隔熱單元以及一管體。容置槽具有一出口端、一入口端以及一容置空間，其中容置槽適於由下方自熱源接收熱量。隔熱單元配置於容置槽的容置空間中，且隔熱單元包括一隔熱噴嘴。隔熱噴嘴具有一第一開口、一第二開口以及一頸縮部，其中第一開口連通入口端，而第二開口連通容置空間，且頸縮部鄰近第二開口。管體連接出口端與入口端而與容置槽形成一封閉循環迴路。一工作流體由容置槽的入口端進入隔熱單元，且從隔熱噴嘴的第一開口流至頸縮部，並經由頸縮部加速使工作流體由第二開口噴出至容置空間內。位於容置空間中的工作流體能吸收來自於熱源的熱而從液態轉變成氣態而由出口端進入管體內。The heat dissipation device of the present invention is adapted to dissipate heat from a heat source. The heat sink includes a receiving groove, a heat insulating unit and a tube body. The accommodating groove has an outlet end, an inlet end and an accommodating space, wherein the accommodating groove is adapted to receive heat from the lower self-heat source. The heat insulating unit is disposed in the accommodating space of the accommodating groove, and the heat insulating unit includes a heat insulating nozzle. The heat insulating nozzle has a first opening, a second opening and a necking portion, wherein the first opening communicates with the inlet end, and the second opening communicates with the accommodating space, and the necked portion is adjacent to the second opening. The tubular body connects the outlet end and the inlet end to form a closed loop with the accommodating groove. A working fluid enters the heat insulating unit from the inlet end of the accommodating groove, and flows from the first opening of the heat insulating nozzle to the neck portion, and accelerates the working fluid from the second opening into the accommodating space via the neck portion. The working fluid located in the accommodating space can absorb heat from the heat source and change from a liquid state to a gas state to enter the tube body from the outlet end.

在本發明的一實施例中，上述的熱源與隔熱單元於一水平面上的正投影不完全重疊。In an embodiment of the invention, the heat source and the orthographic projection of the thermal insulation unit on a horizontal surface do not completely overlap.

在本發明的一實施例中，上述的散熱裝置更包括一冷凝器，配置於管體的下方，以協助將管體內氣態的工作流體冷卻成液態並流回至入口端。In an embodiment of the invention, the heat sink further includes a condenser disposed below the tube body to assist in cooling the gaseous working fluid in the tube to a liquid state and flowing back to the inlet end.

在本發明的一實施例中，上述的散熱裝置更包括多個流道，配置於容置槽的容置空間中，且連通隔熱噴嘴的第二開口。In an embodiment of the invention, the heat dissipating device further includes a plurality of flow channels disposed in the accommodating space of the accommodating groove and communicating with the second opening of the heat insulating nozzle.

在本發明的一實施例中，上述的散熱裝置更包括：多個凸柱，分散配置於容置槽的容置空間中，該些凸柱與隔熱單元於一水平面上的正投影不重疊。In an embodiment of the present invention, the heat dissipating device further includes: a plurality of protrusions disposed in the accommodating space of the accommodating groove, the protrusions and the orthographic projection of the heat insulating unit on a horizontal surface do not overlap .

在本發明的一實施例中，上述的管體的材質為金屬。In an embodiment of the invention, the pipe body is made of metal.

在本發明的一實施例中，上述的隔熱單元的材質包括電木、塑膠、玻璃纖維、陶瓷或鐵氟龍。In an embodiment of the invention, the material of the heat insulation unit comprises bakelite, plastic, fiberglass, ceramic or Teflon.

在本發明的一實施例中，上述的容置槽包括一第一卡扣部，而隔熱單元更包括一第二卡扣部，第一卡扣部與第二卡扣部相互卡扣，以將隔熱單元固定於容置槽內。In an embodiment of the present invention, the accommodating groove includes a first zipper portion, and the heat insulating unit further includes a second zipper portion, and the first latching portion and the second latching portion are mutually buckled. The fixing unit is fixed in the accommodating groove.

在本發明的一實施例中，上述的工作流體為冷媒。In an embodiment of the invention, the working fluid is a refrigerant.

在本發明的一實施例中，上述的熱源包括一熱管、一晶片或一處理器。In an embodiment of the invention, the heat source comprises a heat pipe, a wafer or a processor.

基於上述，由於本發明的散熱裝置具有隔熱單元，而隔熱單元具有隔熱的效果，可避免工作流體在進入容置槽的入口端時就立即汽化，造成後方工作流體進入容置槽的障礙，而可以減低工作流體循環流動的阻力，提高循環效率與散熱效率。此外，本發明的隔熱單元的具有頸縮部而成噴嘴狀，因此工作流體可以藉由頸縮部的設計加速離開隔熱單元而進入容置空間並佈滿容置槽，可減少容置槽內部份區域乾化現象的發生，維持工作流體與容置槽的接觸面積，維持熱交換效率。簡言之，本發明的散熱裝置可有效避免工作流體在進入容置槽前被熱源所產生的熱汽化，且可確保容置槽內具有足夠的工作流體。故，本發明的散熱裝置可具有較佳的散熱效能，且適於應用於高瓦數的電子產品中。Based on the above, since the heat dissipating device of the present invention has a heat insulating unit, and the heat insulating unit has an insulating effect, the working fluid can be prevented from vaporizing immediately upon entering the inlet end of the accommodating groove, thereby causing the rear working fluid to enter the accommodating groove. Obstacles, which can reduce the resistance of circulating fluid flow, improve cycle efficiency and heat dissipation efficiency. In addition, the heat insulating unit of the present invention has a neck portion formed into a nozzle shape, so that the working fluid can be accelerated away from the heat insulating unit by the design of the neck portion to enter the accommodating space and fill the accommodating groove, thereby reducing the accommodating. The occurrence of the drying phenomenon in the inner portion of the tank maintains the contact area between the working fluid and the accommodating tank, and maintains the heat exchange efficiency. In short, the heat dissipating device of the present invention can effectively prevent the working fluid from being vaporized by the heat source before entering the accommodating tank, and can ensure sufficient working fluid in the accommodating tank. Therefore, the heat sink of the present invention can have better heat dissipation performance and is suitable for use in high wattage electronic products.

為讓本發明的上述特徵和優點能更明顯易懂，下文特舉實施例，並配合所附圖式作詳細說明如下。The above described features and advantages of the invention will be apparent from the following description.

圖1A繪示為本發明的一實施例的一種散熱裝置的俯視示意圖。圖1B繪示為圖1A的散熱裝置的容置槽與隔熱單元的立體示意圖。請同時參考圖1A與圖1B，本實施例的散熱裝置100A適於對一熱源10進行散熱，其中熱源10例如是一電子裝置內的一晶片或一處理器等發熱元件，或是熱管，能夠從其他發熱元件吸熱並將熱量傳遞給本發明之散熱裝置。換言之，本實施例的散熱裝置100A適用於電子裝置，例如是筆記型電腦等可攜式電子裝置，而散熱裝置100A可配置於電子裝置的機殼之內，可藉由結構上的熱接觸效果而讓電子裝置內的熱源10所產生熱能傳送至機殼並因此散逸，以達到散熱的效果。FIG. 1A is a schematic top view of a heat sink according to an embodiment of the invention. FIG. 1B is a perspective view of the accommodating groove and the heat insulating unit of the heat sink of FIG. 1A . Referring to FIG. 1A and FIG. 1B, the heat dissipating device 100A of the present embodiment is adapted to dissipate heat from a heat source 10. The heat source 10 is, for example, a chip or a processor or the like in an electronic device, or a heat pipe. Heat is absorbed from other heat generating components and transfers heat to the heat sink of the present invention. In other words, the heat dissipation device 100A of the present embodiment is applicable to an electronic device, such as a portable electronic device such as a notebook computer, and the heat dissipation device 100A can be disposed in the casing of the electronic device, and can be thermally contacted by the structure. The heat generated by the heat source 10 in the electronic device is transmitted to the casing and thus dissipated to achieve the heat dissipation effect.

詳細來說，本實施例的散熱裝置100A包括一容置槽110、一隔熱單元120以及一管體130。容置槽110具有一出口端112、一入口端114以及一容置空間116，其中熱源10配置於容置槽110的下方，使容置槽110適於由下方接收來自於熱源10的熱量。隔熱單元120配置於容置槽110的容置空間116中，且隔熱單元120包括一隔熱噴嘴122。隔熱噴嘴122具有一第一開口121、一第二開口123以及一頸縮部125，其中第一開口121連通入口端114，而第二開口123連通容置空間116，且頸縮部125鄰近第二開口123。在圖1A與圖1B所繪示的實施例中，頸縮部125的截面積小於第一開口121與第二開口123的截面積，然而，在另一可能的實施例中，第二開口可能緊鄰於頸縮部，而使第二開口具有與頸縮部相同或相近的截面尺寸。管體130連接出口端112與入口端114而與容置槽110形成一封閉循環迴路（如圖1A中的箭頭所示）。一工作流體（未繪示）由容置槽110的入口端114進入隔熱單元120，且從隔熱噴嘴122的第一開口121流至頸縮部125，並經由頸縮部125加速使工作流體由第二開口123噴出至容置空間116內。位於容置空間116中的工作流體因吸收來自於熱源的熱而從液態轉變成氣態而由出口端112進入管體130內。In detail, the heat dissipation device 100A of the embodiment includes a receiving groove 110, a heat insulating unit 120, and a tube body 130. The accommodating slot 110 has an outlet end 112, an inlet end 114 and an accommodating space 116. The heat source 10 is disposed below the accommodating slot 110, so that the accommodating slot 110 is adapted to receive heat from the heat source 10 from below. The heat insulating unit 120 is disposed in the accommodating space 116 of the accommodating groove 110, and the heat insulating unit 120 includes a heat insulating nozzle 122. The heat insulating nozzle 122 has a first opening 121, a second opening 123 and a necking portion 125, wherein the first opening 121 communicates with the inlet end 114, and the second opening 123 communicates with the accommodating space 116, and the necking portion 125 is adjacent to The second opening 123. In the embodiment illustrated in FIG. 1A and FIG. 1B , the cross-sectional area of the neck portion 125 is smaller than the cross-sectional area of the first opening 121 and the second opening 123 . However, in another possible embodiment, the second opening may be Adjacent to the necked portion, the second opening has the same or similar cross-sectional dimension as the necked portion. The tube body 130 connects the outlet end 112 and the inlet end 114 to form a closed loop with the accommodating groove 110 (as indicated by the arrow in FIG. 1A). A working fluid (not shown) enters the heat insulating unit 120 from the inlet end 114 of the accommodating groove 110, and flows from the first opening 121 of the heat insulating nozzle 122 to the neck portion 125, and is accelerated by the neck portion 125 to work. The fluid is ejected from the second opening 123 into the accommodating space 116. The working fluid located in the accommodating space 116 is converted from the liquid state to the gaseous state by absorbing heat from the heat source and enters the tubular body 130 from the outlet end 112.

請再參考圖1A，熱源10位於容置槽110的正下方且與容置槽110直接接觸，其中熱源10與隔熱單元120於一水平面上的正投影不完全重疊。也就是說，熱源10與隔熱單元120於水平面上的正投影可完全不重疊（如圖1A所示）或部分重疊（未繪示），於此並不加以限制。此處，隔熱單元120的材質例如是絕緣且低熱傳導率的材質，如電木、塑膠、玻璃纖維、陶瓷或鐵氟龍。由於本實施例的散熱裝置100A具有隔熱單元120，其中隔熱單元120具有隔熱的效果，因而可避免工作流體在入口端附近受到過度加熱而立即汽化，使得工作流體在進入容置槽110之前仍維持液態。Referring to FIG. 1A again, the heat source 10 is directly under the accommodating groove 110 and is in direct contact with the accommodating groove 110, wherein the heat source 10 and the orthographic projection of the heat insulating unit 120 on a horizontal surface do not completely overlap. That is to say, the orthographic projection of the heat source 10 and the thermal insulation unit 120 on the horizontal plane may not overlap at all (as shown in FIG. 1A) or partially overlap (not shown), and is not limited herein. Here, the material of the heat insulating unit 120 is, for example, an insulating and low thermal conductivity material such as bakelite, plastic, fiberglass, ceramic or Teflon. Since the heat dissipating device 100A of the present embodiment has the heat insulating unit 120, wherein the heat insulating unit 120 has an insulating effect, the working fluid can be prevented from being vaporized immediately after being excessively heated near the inlet end, so that the working fluid enters the accommodating groove 110. It remained liquid before.

再者，為了有效固定隔熱單元120，本實施例的容置槽110還包括一第一卡扣部118，而隔熱單元120更包括一第二卡扣部124，其中第一卡扣部118與第二卡扣部124相互卡扣，以將隔熱單元120固定於容置槽110內。此外，本實施例的散熱裝置100A可更包括一冷凝器140，例如是金屬鰭片，配置於管體130的下方，以協助散熱而將管體130內氣態的工作流體冷卻成液態並流回至入口端114。此處，管體130的材質例如為金屬，如銅，而工作流體例如為冷媒。In addition, in order to effectively fix the heat insulating unit 120, the accommodating groove 110 of the embodiment further includes a first fastening portion 118, and the heat insulating unit 120 further includes a second fastening portion 124, wherein the first fastening portion The second latching portion 124 and the second latching portion 124 are fastened to each other to fix the heat insulating unit 120 in the receiving slot 110. In addition, the heat dissipating device 100A of the present embodiment may further include a condenser 140, such as a metal fin, disposed under the tube body 130 to assist in heat dissipation to cool the gaseous working fluid in the tube body 130 into a liquid state and flow back. To the inlet end 114. Here, the material of the pipe body 130 is, for example, a metal such as copper, and the working fluid is, for example, a refrigerant.

如圖1A所示，容置槽110與管體130相互連接而形成封閉循環迴路（如圖1A中的箭頭所示），而工作流體填充於封閉循環迴路中。當熱源10所產生的熱傳遞至容置槽110時，會加熱其內的工作流體，使工作流體由液態轉變成氣態，因而流動於封閉循環迴路中。而，氣態的工作流體透過蒸氣壓推動的方式流經管體130與冷凝器140時，冷卻而轉變成液態，並沿著封閉循環迴路而回到容置槽110的入口端114。如此一來，工作流體可在封閉循環迴路中產生循環式的相變（即液態轉變成氣態，再由氣態轉變成液態），而本實施例的散熱裝置100A可藉由上述的設計而對熱源10進行散熱。As shown in FIG. 1A, the accommodating groove 110 and the tube body 130 are connected to each other to form a closed loop (as indicated by an arrow in FIG. 1A), and the working fluid is filled in the closed loop. When the heat generated by the heat source 10 is transferred to the accommodating tank 110, the working fluid therein is heated, and the working fluid is converted from a liquid state to a gaseous state, thereby flowing in the closed loop. On the other hand, when the gaseous working fluid flows through the pipe body 130 and the condenser 140 by means of vapor pressure, it is cooled and converted into a liquid state, and returns to the inlet end 114 of the accommodating groove 110 along the closed circulation circuit. In this way, the working fluid can generate a cyclic phase change in the closed loop (ie, the liquid state is converted into a gaseous state, and then converted from a gaseous state to a liquid state), and the heat sink 100A of the embodiment can be used for the heat source by the above design. 10 for heat dissipation.

特別是，由於本實施例的隔熱單元120具有隔熱噴嘴122，其中隔熱噴嘴122具有頸縮部125，因此當由第一開口121進入隔熱噴嘴122的工作流體流向頸縮部125時，頸縮部125的設計可使得工作流體被擠壓且以加速的方式由第二開口123離開隔熱噴嘴122而進入至容置空間116內。在加速噴射的狀態下，液態的工作流體可佈滿整個容置空間116，而使得容置槽110內具有足夠的工作流體，減少或避免容置槽內局部區域乾化現象的發生。此外，由於隔熱噴嘴122的頸縮部125可使得工作流體的流速變快，因而可使工作流體吸收熱源10所產生的熱而從液態轉變成氣態時得以單方向流入管體130內，可有效地維持工作流體在封閉循環迴路中的單方向驅動特性。In particular, since the heat insulating unit 120 of the present embodiment has the heat insulating nozzle 122, wherein the heat insulating nozzle 122 has the necking portion 125, when the working fluid entering the heat insulating nozzle 122 from the first opening 121 flows toward the necking portion 125 The neck portion 125 is designed such that the working fluid is squeezed and exits the insulating nozzle 122 from the second opening 123 into the accommodating space 116 in an accelerated manner. In the state of accelerated injection, the liquid working fluid can fill the entire accommodating space 116, so that there is enough working fluid in the accommodating groove 110 to reduce or avoid the occurrence of localized drying in the accommodating groove. In addition, since the necking portion 125 of the heat insulating nozzle 122 can make the flow velocity of the working fluid faster, the working fluid can be absorbed into the tubular body 130 in a single direction when the heat generated by the heat source 10 is absorbed from the liquid state to the gaseous state. Effectively maintains the unidirectional drive characteristics of the working fluid in the closed loop.

簡言之，由於本實施例的散熱裝置100A具有隔熱單元120，而隔熱單元120具有隔熱的效果，可避免或減少熱源10直接對入口端114附近的工作流體加熱，以使得工作流體在進入容置槽110內時仍維持液態。此外，本實施例的隔熱單元120的隔熱噴嘴122具有頸縮部125，因此工作流體可以藉由頸縮部125的設計加速離開隔熱單元120而進入容置空間116並佈滿容置槽110，提高或維持容置槽110與工作流體的接觸面積。如此一來，本實施例的散熱裝置100A可有效增進散熱效能，且適於應用於高瓦數的電子產品中。In short, since the heat sink 100A of the present embodiment has the heat insulating unit 120, and the heat insulating unit 120 has an insulating effect, the heat source 10 can be prevented from being directly heated to the working fluid near the inlet end 114, so that the working fluid The liquid state is maintained while entering the accommodating groove 110. In addition, the heat insulating nozzle 122 of the heat insulating unit 120 of the embodiment has a neck portion 125, so that the working fluid can be accelerated away from the heat insulating unit 120 by the design of the neck portion 125 to enter the accommodating space 116 and be filled. The groove 110 increases or maintains the contact area of the accommodating groove 110 with the working fluid. In this way, the heat dissipating device 100A of the embodiment can effectively improve the heat dissipation performance, and is suitable for being applied to a high wattage electronic product.

在此必須說明的是，下述實施例沿用前述實施例的元件標號與部分內容，其中採用相同的標號來表示相同或近似的元件，並且省略了相同技術內容的說明。關於省略部分的說明可參考前述實施例，下述實施例不再重複贅述。It is to be noted that the following embodiments use the same reference numerals and parts of the above-mentioned embodiments, and the same reference numerals are used to refer to the same or similar elements, and the description of the same technical content is omitted. For the description of the omitted portions, reference may be made to the foregoing embodiments, and the following embodiments are not repeated.

圖2繪示為本發明的另一實施例的一種散熱裝置的俯視示意圖。請參考圖2，本實施例的散熱裝置100B與圖1A的散熱裝置100A相似，惟二者主要差異之處在於：本實施例的散熱裝置100B更包括多個流道150，其中流道150配置於容置槽110的容置空間116中，是由容置槽110中的多個凸肋將容置槽110分隔而成，流道150分布並連接於隔熱噴嘴122的第二開口123與容置槽的出口端112，自第二開口123漸擴，並於末端向出口端112漸縮。此處，流道150設置的目的在於使容置槽110內的工作流體可具有較大的熱交換面積，並導引工作流體向出口端匯集，提高散熱效率。2 is a schematic top view of a heat sink according to another embodiment of the present invention. Referring to FIG. 2, the heat dissipating device 100B of the present embodiment is similar to the heat dissipating device 100A of FIG. 1A, but the main difference is that the heat dissipating device 100B of the embodiment further includes a plurality of flow channels 150, wherein the flow channel 150 is configured. In the accommodating space 116 of the accommodating groove 110, the accommodating groove 110 is separated by a plurality of ribs in the accommodating groove 110. The flow channel 150 is distributed and connected to the second opening 123 of the heat insulating nozzle 122. The outlet end 112 of the receiving groove tapers from the second opening 123 and tapers toward the outlet end 112 at the end. Here, the purpose of the flow channel 150 is to enable the working fluid in the accommodating groove 110 to have a large heat exchange area, and to guide the working fluid to be collected toward the outlet end, thereby improving heat dissipation efficiency.

圖3繪示為本發明的另一實施例的一種散熱裝置的俯視示意圖。請參考圖3，本實施例的散熱裝置100C與圖1A的散熱裝置100A相似，惟二者主要差異之處在於：本實施例的散熱裝置100C更包括多個凸柱160，分散配置於容置槽110的容置空間116中，且凸柱160與隔熱單元120在水平面上的投影不重疊。此處，凸柱160設置的目的在於使容置槽110內的工作流體可具有較大的熱交換面積，藉此增加熱交換的時間，以提高散熱效率。3 is a schematic top view of a heat sink according to another embodiment of the present invention. Referring to FIG. 3, the heat dissipating device 100C of the present embodiment is similar to the heat dissipating device 100A of FIG. 1A, but the main difference is that the heat dissipating device 100C of the embodiment further includes a plurality of studs 160, and is dispersedly disposed in the receiving device. In the accommodating space 116 of the groove 110, the projections of the stud 160 and the heat insulating unit 120 on the horizontal surface do not overlap. Here, the purpose of the stud 160 is to allow the working fluid in the accommodating groove 110 to have a large heat exchange area, thereby increasing the time of heat exchange to improve heat dissipation efficiency.

綜上所述，由於本發明的散熱裝置具有隔熱單元，而隔熱單元具有隔熱的效果，可避免熱源直接加熱工作流體，有降低工作流體的溫度的效果。此外，本發明的隔熱單元的隔熱噴嘴具有頸縮部，因此工作流體可以藉由頸縮部的設計加速離開隔熱單元而進入容置空間並佈滿容置槽，可確保容置槽內具有足夠的工作流體。簡言之，本發明的散熱裝置可有效避免工作流體在進入容置槽前被熱源所產生的熱汽化，且可確保容置槽內具有足夠的工作流體。故，本發明的散熱裝置可具有較佳的散熱效能，且適於應用於高瓦數的電子產品中。In summary, since the heat sink of the present invention has a heat insulating unit, and the heat insulating unit has a heat insulating effect, the heat source can be prevented from directly heating the working fluid, and the temperature of the working fluid can be lowered. In addition, the heat insulating nozzle of the heat insulating unit of the present invention has a neck portion, so that the working fluid can be accelerated away from the heat insulating unit by the design of the neck portion to enter the accommodating space and fill the accommodating groove, thereby ensuring the accommodating groove. There is enough working fluid inside. In short, the heat dissipating device of the present invention can effectively prevent the working fluid from being vaporized by the heat source before entering the accommodating tank, and can ensure sufficient working fluid in the accommodating tank. Therefore, the heat sink of the present invention can have better heat dissipation performance and is suitable for use in high wattage electronic products.

雖然本發明已以實施例揭露如上，然其並非用以限定本發明，任何所屬技術領域中具有通常知識者，在不脫離本發明的精神和範圍內，當可作些許的更動與潤飾，故本發明的保護範圍當視後附的申請專利範圍所界定者為準。Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention, and any one of ordinary skill in the art can make some changes and refinements without departing from the spirit and scope of the present invention. The scope of the invention is defined by the scope of the appended claims.

10：熱源 100A、100B、100C：散熱裝置 110：容置槽 112：出口端 114：入口端 116：容置空間 118：第一卡扣部 120：隔熱單元 121：第一開口 122：隔熱噴嘴 123：第二開口 124：第二卡扣部 125：頸縮部 130：管體 140：冷凝器 150：流道 160：凸柱10: heat source 100A, 100B, 100C: heat sink 110: accommodating slot 112: outlet end 114: inlet end 116: accommodating space 118: first snap portion 120: insulation unit 121: first opening 122: heat insulation Nozzle 123: second opening 124: second fastening portion 125: necking portion 130: tube body 140: condenser 150: flow channel 160: protruding column

圖1A繪示為本發明的一實施例的一種散熱裝置的俯視示意圖。 圖1B繪示為圖1A的散熱裝置的容置槽與隔熱單元的立體示意圖。 圖2繪示為本發明的另一實施例的一種散熱裝置的俯視示意圖。 圖3繪示為本發明的又一實施例的一種散熱裝置的俯視示意圖。FIG. 1A is a schematic top view of a heat sink according to an embodiment of the invention. FIG. 1B is a perspective view of the accommodating groove and the heat insulating unit of the heat sink of FIG. 1A . 2 is a schematic top view of a heat sink according to another embodiment of the present invention. 3 is a schematic top plan view of a heat sink according to still another embodiment of the present invention.

Claims (10)

一種散熱裝置，適於對一熱源進行散熱，該散熱裝置包括：一容置槽，具有一出口端、一入口端以及一容置空間，其中該容置槽適於由下方自熱源接收熱量；一隔熱單元，配置於該容置槽的該容置空間中，該隔熱單元包括一隔熱噴嘴，而該隔熱噴嘴具有一第一開口、一第二開口以及一頸縮部，其中該第一開口連通該入口端，而該第二開口連通該容置空間，且該頸縮部鄰近該第二開口；以及一管體，連接該出口端與該入口端而與該容置槽形成一封閉循環迴路，其中一工作流體由該容置槽的該入口端進入該隔熱單元，而位於該隔熱單元的該工作流體為液態，且該工作流體從該隔熱噴嘴的該第一開口流至該頸縮部，並經由該頸縮部加速使該工作流體由該第二開口噴出至該容置空間內，而位於該容置空間中的該工作流體能吸收來自於該熱源的熱而從液態轉變成氣態而由該出口端進入該管體內。 The heat dissipating device is adapted to dissipate heat from a heat source, and the heat dissipating device comprises: a receiving groove having an outlet end, an inlet end and an accommodating space, wherein the accommodating groove is adapted to receive heat from the lower self-heating source; An insulating unit is disposed in the accommodating space of the accommodating groove, the heat insulating unit includes a heat insulating nozzle, wherein the heat insulating nozzle has a first opening, a second opening and a necking portion, wherein The first opening communicates with the inlet end, and the second opening communicates with the accommodating space, and the neck portion is adjacent to the second opening; and a tube body connecting the outlet end and the inlet end and the accommodating groove Forming a closed circulation loop, wherein a working fluid enters the thermal insulation unit from the inlet end of the accommodating tank, and the working fluid located in the thermal insulation unit is in a liquid state, and the working fluid is from the thermal insulation nozzle An opening flows to the neck portion, and the working fluid is ejected from the second opening into the accommodating space through the neck portion, and the working fluid located in the accommodating space can absorb the heat source from the heat source Heat from liquid to Into a gaseous body into the tube by the end of the outlet. 如申請專利範圍第1項所述的散熱裝置，其中該熱源與該隔熱單元於一水平面上的正投影不完全重疊。 The heat sink according to claim 1, wherein the heat source does not completely overlap with the orthographic projection of the heat insulating unit on a horizontal surface. 如申請專利範圍第1項所述的散熱裝置，更包括：一冷凝器，配置於該管體的下方，以協助將該管體內氣態的該工作流體冷卻成液態並流回至該入口端。 The heat dissipating device of claim 1, further comprising: a condenser disposed below the tube body to assist in cooling the gaseous working fluid in the tube to a liquid state and flowing back to the inlet end. 如申請專利範圍第1項所述的散熱裝置，更包括： 多個流道，配置於該容置槽的該容置空間中，且連通該隔熱噴嘴的該第二開口。 The heat sink device of claim 1, further comprising: A plurality of flow passages are disposed in the accommodating space of the accommodating groove and communicate with the second opening of the heat insulating nozzle. 如申請專利範圍第1項所述的散熱裝置，更包括：多個凸柱，分散配置於該容置槽的該容置空間中，該些凸柱與該隔熱單元於一水平面上的正投影不重疊。 The heat dissipating device of claim 1, further comprising: a plurality of protrusions disposed in the accommodating space of the accommodating groove, the pillars and the heat insulating unit being positive on a horizontal surface The projections do not overlap. 如申請專利範圍第1項所述的散熱裝置，其中該管體的材質為金屬。 The heat dissipating device according to claim 1, wherein the tube body is made of metal. 如申請專利範圍第1項所述的散熱裝置，其中該隔熱單元的材質包括電木、塑膠、玻璃纖維、陶瓷或鐵氟龍。 The heat dissipating device according to claim 1, wherein the material of the heat insulating unit comprises bakelite, plastic, fiberglass, ceramic or Teflon. 如申請專利範圍第1項所述的散熱裝置，其中該容置槽包括一第一卡扣部，而該隔熱單元更包括一第二卡扣部，該第一卡扣部與該第二卡扣部相互卡扣，以將該隔熱單元固定於該容置槽內。 The heat dissipation device of claim 1, wherein the accommodating groove comprises a first fastening portion, and the heat insulating unit further comprises a second fastening portion, the first fastening portion and the second The buckle portions are buckled with each other to fix the heat insulating unit in the receiving groove. 如申請專利範圍第1項所述的散熱裝置，其中該工作流體為冷媒。 The heat dissipating device of claim 1, wherein the working fluid is a refrigerant. 如申請專利範圍第1項所述的散熱裝置，其中該熱源包括一熱管、一晶片或一處理器。The heat sink of claim 1, wherein the heat source comprises a heat pipe, a wafer or a processor.
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