TWI616026B - Electronic device - Google Patents

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Publication number
TWI616026B
TWI616026B TW106105205A TW106105205A TWI616026B TW I616026 B TWI616026 B TW I616026B TW 106105205 A TW106105205 A TW 106105205A TW 106105205 A TW106105205 A TW 106105205A TW I616026 B TWI616026 B TW I616026B
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Taiwan
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side cover
dual
electronic device
conductive surface
radiation block
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TW106105205A
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Chinese (zh)
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TW201832414A (en
Inventor
吳建逸
柯慶祥
吳正雄
吳朝旭
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和碩聯合科技股份有限公司
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Priority to TW106105205A priority Critical patent/TWI616026B/en
Priority to CN201710935647.7A priority patent/CN108459660B/en
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Publication of TWI616026B publication Critical patent/TWI616026B/en
Publication of TW201832414A publication Critical patent/TW201832414A/en

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    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/1613Constructional details or arrangements for portable computers
    • G06F1/1633Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
    • G06F1/1684Constructional details or arrangements related to integrated I/O peripherals not covered by groups G06F1/1635 - G06F1/1675
    • G06F1/1698Constructional details or arrangements related to integrated I/O peripherals not covered by groups G06F1/1635 - G06F1/1675 the I/O peripheral being a sending/receiving arrangement to establish a cordless communication link, e.g. radio or infrared link, integrated cellular phone
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00Details of, or arrangements associated with, antennas
    • H01Q1/12Supports; Mounting means
    • H01Q1/22Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/2258Supports; Mounting means by structural association with other equipment or articles used with computer equipment
    • H01Q1/2266Supports; Mounting means by structural association with other equipment or articles used with computer equipment disposed inside the computer

Abstract

電子裝置包含第一側蓋、第二側蓋、導電擋牆及至少一雙頻迴路饋體。第一側蓋與第二側蓋組合成機殼,第一側蓋具有第一導電面,第二側蓋具有第二導電面。導電擋牆豎直地耦接第一導電面及第二導電面以共同形成腔體。雙頻迴路饋體與導電擋牆平行設置且立於第一導電面及第二導電面之間。雙頻迴路饋體於腔體能夠共振以提供第一頻帶訊號及第二頻帶訊號。The electronic device includes a first side cover, a second side cover, a conductive blocking wall, and at least one dual-frequency loop feed. The first side cover and the second side cover are combined into a casing. The first side cover has a first conductive surface, and the second side cover has a second conductive surface. The conductive retaining wall is vertically coupled to the first conductive surface and the second conductive surface to form a cavity together. The dual-frequency loop feed is arranged in parallel with the conductive retaining wall and stands between the first conductive surface and the second conductive surface. The dual-frequency loop feed can resonate in the cavity to provide a first-band signal and a second-band signal.

Description

電子裝置Electronic device

本發明係有關於一種電子裝置,特別係一種支援雙頻訊號的電子裝置。The invention relates to an electronic device, in particular to an electronic device supporting dual-frequency signals.

隨著使用者對網路通訊的需求益增,電子產品常需支援不同標準的網路傳輸協定,也因此常需要不同的天線模組來對應不同類型的網路訊號。例如,電子產品需要支援第三代行動通訊技術(3G)、藍芽(Bluetooth)及無線保真(Wi-Fi)等無線通訊,由於各個無線通訊的頻段各有差異,因此即可能需要不同的天線來收發訊號。As users' demands for network communications increase, electronic products often need to support different standards for network transmission protocols, and therefore often require different antenna modules to correspond to different types of network signals. For example, electronic products need to support wireless communications such as third-generation mobile communication technology (3G), Bluetooth, and Wi-Fi. Since the frequency bands of different wireless communications are different, different wireless communications may be required. Antenna to send and receive signals.

然而,隨著使用者對於電子產品的可攜性有越來越高的要求,電子產品也被要求能夠達到輕量化及薄型化,這使得功能日益繁複的電子產品難以提供大量的空間來容置天線。在嚴格的空間限制下,天線的設計及設置都變得更加困難。舉例來說,當第三代行動通訊技術的天線空間受到限制時,可能會使低頻訊號會難以共振,而無法提供匹配的頻寬,導致天線之電壓駐波比(Voltage Standing Wave Ratio)的效能以及天線效率(Antenna Efficiency)低落。However, as users have higher and higher requirements for the portability of electronic products, electronic products are also required to be lightweight and thin, which makes it increasingly difficult for electronic products with increasingly complex functions to provide a lot of space to accommodate them. antenna. Under strict space constraints, the design and setup of the antenna becomes more difficult. For example, when the antenna space of the third-generation mobile communication technology is limited, it may make it difficult for low-frequency signals to resonate and fail to provide a matching bandwidth, resulting in the antenna ’s Voltage Standing Wave Ratio performance And the antenna efficiency (Antenna Efficiency) is low.

本發明之一實施例提供一種電子裝置,電子裝置包含第一側蓋、第二側蓋、導電擋牆及至少一雙頻迴路饋體。An embodiment of the present invention provides an electronic device. The electronic device includes a first side cover, a second side cover, a conductive retaining wall, and at least one dual-frequency loop feed.

第一側蓋具有第一導電面,第二側蓋具有第二導電面。第二側蓋相對於第一側蓋設置,並可與第一側蓋組合成機殼。導電擋牆豎直地耦接第一導電面及第二導電面以共同形成腔體。至少一雙頻迴路饋體與導電擋牆平行設置且立於第一導電面及第二導電面之間。每一雙頻迴路饋體包含饋入端、接地端、第一輻射區塊、第二輻射區塊、第三輻射區塊及第四輻射區塊。The first side cover has a first conductive surface, and the second side cover has a second conductive surface. The second side cover is disposed opposite to the first side cover and can be combined with the first side cover to form a cabinet. The conductive retaining wall is vertically coupled to the first conductive surface and the second conductive surface to form a cavity together. At least one dual-frequency loop feed is arranged in parallel with the conductive retaining wall and stands between the first conductive surface and the second conductive surface. Each dual-frequency loop feed includes a feed terminal, a ground terminal, a first radiation block, a second radiation block, a third radiation block, and a fourth radiation block.

接地端耦接於第二導電面。第一輻射區塊具有饋入點耦接於饋入端。第二輻射區塊一端耦接於第一輻射區塊。第三輻射區塊相對於第一輻射區塊設置,耦接於第二輻射區塊的另一端及接地端之間。第四輻射區塊相對於第二輻射區塊設置,耦接於第一輻射區塊及第三輻射區塊之間。第一輻射區塊、第二輻射區塊、第三輻射區塊及第四輻射區塊圍繞成具有槽縫之矩形饋體。The ground terminal is coupled to the second conductive surface. The first radiation block has a feeding point coupled to the feeding end. One end of the second radiation block is coupled to the first radiation block. The third radiation block is disposed relative to the first radiation block, and is coupled between the other end of the second radiation block and the ground end. The fourth radiation block is disposed relative to the second radiation block, and is coupled between the first radiation block and the third radiation block. The first radiating block, the second radiating block, the third radiating block and the fourth radiating block are surrounded to form a rectangular feed with a slot.

其中雙頻迴路饋體於腔體共振以提供第一頻帶訊號及第二頻帶訊號。The dual-frequency loop feedstock resonates in the cavity to provide a first-band signal and a second-band signal.

第1圖為本發明一實施例之電子裝置100的示意圖。電子裝置100包含第一側蓋110、第二側蓋120、第三側蓋130、第四側蓋140、接地導電片150、導電擋牆160、同軸傳輸線170、至少一雙頻迴路饋體180及匹配電路190。FIG. 1 is a schematic diagram of an electronic device 100 according to an embodiment of the present invention. The electronic device 100 includes a first side cover 110, a second side cover 120, a third side cover 130, a fourth side cover 140, a ground conductive sheet 150, a conductive retaining wall 160, a coaxial transmission line 170, and at least one dual-frequency loop feed 180. And matching circuit 190.

第一側蓋110具有第一導電面112,第二側蓋120具有第二導電面122,且第二側蓋120可相對於第一側蓋110設置,亦即第二側蓋120與第一側蓋110可以共同組合成電子裝置的機殼。第三側蓋130具有第三導電面,第三側蓋130連接於第一側蓋110及/或第二側蓋120。第四側蓋140可相對於第三側蓋130設置,且與第三側蓋130組合成另一機殼。The first side cover 110 has a first conductive surface 112, the second side cover 120 has a second conductive surface 122, and the second side cover 120 can be disposed relative to the first side cover 110, that is, the second side cover 120 and the first The side covers 110 can be combined together to form a casing of an electronic device. The third side cover 130 has a third conductive surface, and the third side cover 130 is connected to the first side cover 110 and / or the second side cover 120. The fourth side cover 140 may be disposed relative to the third side cover 130 and combined with the third side cover 130 to form another casing.

在本發明的部分實施例中,電子裝置100可供筆記型電腦使用,舉例來說,在第1圖中,第一側蓋110可為筆記型電腦的金屬下背蓋,而第二側蓋120則可為包含鍵盤的金屬側蓋,兩者可以組合成筆記型電腦的底座機殼。此外,第三側蓋130可為筆記型電腦的金屬上背蓋,而第四側蓋140則可為包含螢幕的金屬側蓋,兩者可以組合成筆記型電腦的上蓋機殼。也就是說,第一側蓋110及第二側蓋120的導電面112及122可為第一側蓋110及第二側蓋120對應的金屬下背蓋及包含鍵盤的金屬側蓋所包含的金屬面。第三側蓋130及第四側蓋140也可包含導電面,第三側蓋130及第四側蓋140的導電面可為第三側蓋130及第四側蓋140所對應之金屬上背蓋及包含螢幕的金屬側蓋的導電面。In some embodiments of the present invention, the electronic device 100 can be used by a notebook computer. For example, in FIG. 1, the first side cover 110 can be a metal lower cover of the notebook computer, and the second side cover 120 can be a metal side cover containing a keyboard, and the two can be combined into a base chassis of a notebook computer. In addition, the third side cover 130 may be a metal upper back cover of the notebook computer, and the fourth side cover 140 may be a metal side cover including a screen, and the two may be combined into an upper case of the notebook computer. That is, the conductive surfaces 112 and 122 of the first side cover 110 and the second side cover 120 may be included in the metal lower back cover corresponding to the first side cover 110 and the second side cover 120 and the metal side cover including the keyboard. Metal surface. The third side cover 130 and the fourth side cover 140 may also include conductive surfaces, and the conductive surfaces of the third side cover 130 and the fourth side cover 140 may be metal upper backs corresponding to the third side cover 130 and the fourth side cover 140. The conductive surface of the cover and the metal side cover containing the screen.

然而,在本發明的部分實施例中,第一側蓋110、第二側蓋120、第三側蓋130及第四側蓋140主要亦可由非導體材質製成,並另外設置導電材料,例如導電布,作為第一側蓋110、第二側蓋120、第三側蓋130及第四側蓋140的導電面。However, in some embodiments of the present invention, the first side cover 110, the second side cover 120, the third side cover 130, and the fourth side cover 140 may also be mainly made of a non-conductive material, and a conductive material is additionally provided, such as The conductive cloth serves as a conductive surface of the first side cover 110, the second side cover 120, the third side cover 130, and the fourth side cover 140.

導電擋牆160可豎直地耦接第一導電面112及第二導電面122以共同形成腔體CVT。The conductive blocking wall 160 may be vertically coupled to the first conductive surface 112 and the second conductive surface 122 to form a cavity CVT together.

雙頻迴路饋體180與導電擋牆160平行設置且雙頻迴路饋體180立於第一導電面112及第二導電面122之間。雙頻迴路饋體180及腔體CVT可形成共振以提供第一頻帶訊號及第二頻帶訊號。換言之,本發明的電子裝置100可利用機殼與金屬擋牆形成腔體CVT,並搭配雙頻迴路饋體180形成一完整的天線架構,以增加天線的共振面積,進而降低電壓駐波比(Voltage Standing Wave Ratio)及提升能天線效率(Antenna Efficiency)。The dual-frequency loop feed 180 is arranged in parallel with the conductive retaining wall 160 and the dual-frequency loop feed 180 stands between the first conductive surface 112 and the second conductive surface 122. The dual-frequency loop feed 180 and the cavity CVT can form resonance to provide a first-band signal and a second-band signal. In other words, the electronic device 100 of the present invention can form a cavity CVT by using a casing and a metal retaining wall, and form a complete antenna structure with the dual-frequency loop feed 180 to increase the resonance area of the antenna, thereby reducing the voltage standing wave ratio ( Voltage Standing Wave Ratio) and Antenna Efficiency.

第2圖為本發明一實施例之雙頻迴路饋體180的示意圖,雙頻迴路饋體180可與腔體CVT共振以提供雙頻訊號,在本發明的部分實施例中,第一頻帶訊號的頻譜範圍為2.4G~2.5G赫茲,而第二頻帶訊號之頻譜範圍為4.9G~5.9G赫茲。FIG. 2 is a schematic diagram of a dual-frequency loop feed 180 according to an embodiment of the present invention. The dual-frequency loop feed 180 can resonate with a cavity CVT to provide a dual-frequency signal. In some embodiments of the present invention, the first frequency band signal The frequency range of the signal is 2.4G ~ 2.5G Hz, while the frequency range of the second frequency band signal is 4.9G ~ 5.9G Hz.

雙頻迴路饋體180包含饋入端、一接地端、第一輻射區塊181、第二輻射區塊182、第三輻射區塊183及第四輻射區塊184。其中接地端耦接於第二導電面122。舉例而言,電路板20可使用一同軸傳輸線(Coaxial Line) 170其包含訊號正端及訊號負端,其中訊號正端作為饋入端,而訊號負端作為接地端,再者,本實施例的接地端更包含一接地導電片150,接地導電片150可貼附於第二側蓋120的第二導電面122,同軸傳輸線170的饋入端耦接至雙頻迴路饋體180,而同軸傳輸線170的接地端耦接於接地導電片150,使得同軸傳輸線170的接地端能夠透過接地導電片150耦接於第二導電面122。在本發明的部分實施例中,接地導電片150可為銅箔。The dual-frequency loop feed 180 includes a feed end, a ground end, a first radiation block 181, a second radiation block 182, a third radiation block 183, and a fourth radiation block 184. The ground terminal is coupled to the second conductive surface 122. For example, the circuit board 20 may use a coaxial transmission line 170 including a positive signal end and a negative signal end, wherein the positive signal end is used as a feed-in terminal and the negative signal end is used as a ground terminal. Furthermore, in this embodiment, The grounding terminal further includes a grounding conductive sheet 150. The grounding conductive sheet 150 can be attached to the second conductive surface 122 of the second side cover 120. The feed end of the coaxial transmission line 170 is coupled to the dual-frequency loop feed 180, and the coaxial The ground terminal of the transmission line 170 is coupled to the ground conductive sheet 150 so that the ground terminal of the coaxial transmission line 170 can be coupled to the second conductive surface 122 through the ground conductive sheet 150. In some embodiments of the present invention, the ground conductive sheet 150 may be a copper foil.

第一輻射區塊181具有饋入點FP,饋入點FP耦接於同軸傳輸線170的饋入端。第二輻射區塊182的一端耦接於第一輻射區塊181。第三輻射區塊183相對於第一輻射區塊181設置,並耦接於第二輻射區塊182的另一端及接地導電片150之間。第四輻射區塊184相對於第二輻射區塊182設置,並耦接於第一輻射區塊181及第三輻射區塊183之間。其中,第一輻射區塊181、第二輻射區塊182、第三輻射區塊183及第四輻射區塊184可圍繞形成具有槽縫A之矩形饋體。The first radiation block 181 has a feeding point FP, and the feeding point FP is coupled to a feeding end of the coaxial transmission line 170. One end of the second radiation block 182 is coupled to the first radiation block 181. The third radiation block 183 is disposed relative to the first radiation block 181 and is coupled between the other end of the second radiation block 182 and the ground conductive sheet 150. The fourth radiation block 184 is disposed relative to the second radiation block 182, and is coupled between the first radiation block 181 and the third radiation block 183. The first radiating block 181, the second radiating block 182, the third radiating block 183, and the fourth radiating block 184 may form a rectangular feed with a slot A.

雙頻迴路饋體180可透過輻射區塊181、182及183連接接地導電片150以提供一輻射路徑,並透過輻射區塊181、184及183連接接地導電片150以提供另一輻射路徑。The dual-frequency loop feed 180 can be connected to the grounded conductive sheet 150 through the radiation blocks 181, 182, and 183 to provide a radiation path, and connected to the grounded conductive sheet 150 through the radiation blocks 181, 184, and 183 to provide another radiation path.

同軸傳輸線170的饋入端可經由匹配電路190耦接至饋入點FP。透過匹配電路190能夠減少訊號反彈,進而降低電子裝置100的天線電壓駐波比,其中對於頻譜範圍為2.4G~2.5G赫茲的第一頻帶訊號的改善效果尤為明顯。更詳細地說,匹配電路190設置於槽縫A內,其中匹配電路190可包含互相串聯的電容192及電感194,其中同軸傳輸線170的饋入端耦接電感194,電感194以串聯方式耦接電容192,電容192耦接位於第一輻射區塊181的饋入點FP。The feeding end of the coaxial transmission line 170 may be coupled to the feeding point FP via the matching circuit 190. The matching circuit 190 can reduce signal bounce, thereby reducing the antenna voltage standing wave ratio of the electronic device 100, and the effect of improving the first frequency band signal with a frequency range of 2.4G to 2.5G Hz is particularly obvious. In more detail, the matching circuit 190 is disposed in the slot A. The matching circuit 190 may include a capacitor 192 and an inductor 194 connected in series with each other. The feeding end of the coaxial transmission line 170 is coupled with the inductor 194, and the inductor 194 is coupled in series The capacitor 192 is coupled to the feeding point FP of the first radiation block 181.

請一併參考第8圖為本發明一實施例之電子裝置之電壓駐波比對頻率的變化圖。在第8圖中,曲線810為電子裝置100不包含匹配電路190時的情況,而曲線820則為電子裝置100包含匹配電路190時的情況。根據第8圖可以得知,匹配電路190可以降低電子裝置100的電壓駐波比,尤其在頻譜範圍2.4G~2.5G赫茲的部分具有明顯的改善效果。Please refer to FIG. 8 together for a variation chart of the voltage standing wave ratio of the electronic device according to an embodiment of the present invention. In FIG. 8, a curve 810 is a case when the electronic device 100 does not include the matching circuit 190, and a curve 820 is a case when the electronic device 100 includes the matching circuit 190. According to FIG. 8, it can be known that the matching circuit 190 can reduce the voltage standing wave ratio of the electronic device 100, and particularly has a significant improvement effect in a part of the frequency range of 2.4G to 2.5G Hz.

此外,第3圖為本發明另一實施例之雙頻迴路饋體280的示意圖。雙頻迴路饋體280與雙頻迴路饋體180的結構相似,雙頻迴路饋體280同樣包含第一輻射區塊281、第二輻射區塊282、第三輻射區塊283及第四輻射區塊284,第3圖的雙頻迴路饋體280與第2圖的雙頻迴路饋體180的相同之處不再贅述,現針對差異處做說明,第3圖的雙頻迴路饋體280還包含連接部285。連接部設置於槽縫A內,且連接部285耦接於第一輻射區塊281及第二輻射區塊282之間,透過連接部285將槽縫A分隔為一第一子槽縫A1及一第二子槽縫A2,亦即第一輻射區塊281、連接部285、第二輻射區塊282、第三輻射區塊283及第四輻射區塊284圍繞形成該第一子槽縫A1,而第一輻射區塊281、連接部285及第二輻射區塊282圍繞形成第二子槽縫A2。 透過連接部285將槽縫A分隔為第一子槽縫A1及第二子槽縫A2的方式能夠進一步改善第一頻帶訊號及第二頻帶訊號的阻抗匹配,其中對於頻譜範圍為4.9G~5.9G赫茲的第二頻帶訊號的改善效果尤為明顯。In addition, FIG. 3 is a schematic diagram of a dual-frequency loop feed 280 according to another embodiment of the present invention. The structure of the dual-frequency loop feed 280 is similar to that of the dual-frequency loop feed 180. The dual-frequency loop feed 280 also includes a first radiation block 281, a second radiation block 282, a third radiation block 283, and a fourth radiation region. Block 284. The similarities between the dual-frequency loop feed 280 in FIG. 3 and the dual-frequency loop feed 180 in FIG. 2 are not described again. The differences are described below. The dual-frequency loop feed 280 in FIG. Contains a connecting portion 285. The connecting portion is disposed in the slot A, and the connecting portion 285 is coupled between the first radiating block 281 and the second radiating block 282. The connecting portion 285 separates the slot A into a first sub-slot A1 and A second sub-slot A2, that is, the first radiating block 281, the connection portion 285, the second radiating block 282, the third radiating block 283, and the fourth radiating block 284 surrounds the first sub-slot A1. The second radiating block 281, the connecting portion 285, and the second radiating block 282 form a second sub-slot A2. The method of dividing the slot A into the first sub-slot A1 and the second sub-slot A2 through the connecting portion 285 can further improve the impedance matching of the first frequency band signal and the second frequency band signal. The improvement effect of the second-band signal of G Hz is particularly obvious.

第9圖為本發明一實施例之電子裝置之電壓駐波比對頻率的變化圖。在第9圖中,曲線910為電子裝置在具有匹配電路190的情況下,利用雙頻迴路饋體180時的電壓駐波比,而曲線920則電子裝置在具有匹配電路190的情況下,利用雙頻迴路饋體280時的電壓駐波比。根據第9圖可以得知當利用雙頻迴路饋體280,亦即在槽縫A中區隔出第一子槽縫A1及第二子槽縫A2時,可進一步降低電子裝置100的頻譜範圍為2.4G~2.5G赫茲的電壓駐波比及頻譜範圍為4.9G~5.9G赫茲的電壓駐波比,尤其在頻譜範圍4.9G~5.9G赫茲的部分具有明顯的改善效果。FIG. 9 is a graph of a voltage standing wave ratio versus frequency of an electronic device according to an embodiment of the present invention. In FIG. 9, curve 910 is the voltage standing wave ratio of the electronic device with the matching circuit 190 when the dual-frequency loop feed 180 is used, and curve 920 is the electronic device with the matching circuit 190. Voltage standing wave ratio for dual-frequency loop feed 280. According to FIG. 9, it can be known that when the dual-frequency loop feed 280 is used, that is, the first sub-slot A1 and the second sub-slot A2 are separated in the slot A, the frequency range of the electronic device 100 can be further reduced. The voltage standing wave ratio of 2.4G ~ 2.5G Hertz and the voltage standing wave ratio of 4.9G ~ 5.9G Hertz, especially in the frequency range of 4.9G ~ 5.9G Hertz, have obvious improvement effects.

此外,第2圖所示之槽縫A,以及第3圖所示之第一子槽縫A1及第二子槽縫A2是為方便說明所提供的示意圖,在本發明的其他實施例中,設計者也可根據系統實際的量測的情況,調整槽縫A、第一子槽縫A1及第二子槽縫A2的形狀以達到更佳阻抗匹配效果。In addition, the slot A shown in FIG. 2 and the first sub slot A1 and the second sub slot A2 shown in FIG. 3 are schematic diagrams provided for convenience of description. In other embodiments of the present invention, The designer can also adjust the shapes of slot A, first sub slot A1, and second sub slot A2 according to the actual measurement of the system to achieve a better impedance matching effect.

第4圖為電子裝置100的局部放大圖。在第4圖中,雙頻迴路饋體180的第一輻射區塊181與第一導電面112之間具有間隙g1,而雙頻迴路饋體180的第二輻射區塊182與第二導電面122之間具有間隙g2。在本發明的部分實施例中,若雙頻迴路饋體180的長邊L1為40毫米且寬邊W1為5毫米,則雙頻迴路饋體180的第一輻射區塊181與第一導電面112之間的間隙g1為0.5mm,而雙頻迴路饋體180的第二輻射區塊182與第二導電面122之間的間隙g2為0.5mm。由於間隙g1及g2可能會影響到低頻天線的共振頻率,因此設計者亦可根據實際上的使用狀況調整間隙g1及g2的寬度數值。FIG. 4 is a partially enlarged view of the electronic device 100. In FIG. 4, there is a gap g1 between the first radiation block 181 and the first conductive surface 112 of the dual-frequency loop feed 180, and the second radiation block 182 and the second conductive surface of the dual-frequency loop feed 180 There is a gap g2 between 122. In some embodiments of the present invention, if the long side L1 of the dual-frequency loop feed 180 is 40 mm and the wide side W1 is 5 mm, the first radiation block 181 and the first conductive surface of the dual-frequency loop feed 180 The gap g1 between 112 is 0.5mm, and the gap g2 between the second radiation block 182 and the second conductive surface 122 of the dual-frequency loop feed 180 is 0.5mm. Since the gaps g1 and g2 may affect the resonance frequency of the low-frequency antenna, the designer can also adjust the width values of the gaps g1 and g2 according to the actual use situation.

此外,在第4圖中,雙頻迴路饋體180於平行第三輻射區塊183的設置方向的輻射區塊長度大於接地導電片150耦接第三輻射區塊183的長度。在不改變雙頻迴路饋體180之側邊L2的情況下,接地導電片150耦接第三輻射區塊183的長度會影響到低頻訊號的頻譜範圍。舉例來說,接地導電片150耦接第三輻射區塊183的長度較長時,第一頻帶訊號的頻譜範圍可能會偏向2.5G赫茲,而接地導電片150耦接第三輻射區塊183的長度較短時,第一頻帶訊號的頻譜範圍可能會偏向2.3G赫茲。因此,設計者可根據電子裝置100的實際使用情形調整接地導電片150耦接第三輻射區塊183的長度,以配合所需的頻譜範圍。In addition, in FIG. 4, the length of the radiation block of the dual-frequency loop feed 180 in the direction parallel to the arrangement of the third radiation block 183 is greater than the length of the ground conductive sheet 150 coupled to the third radiation block 183. Without changing the side L2 of the dual-frequency loop feed 180, the length of the ground conductive sheet 150 coupled to the third radiation block 183 will affect the frequency range of the low-frequency signal. For example, when the length of the ground conductive sheet 150 coupled to the third radiating block 183 is long, the spectrum range of the first frequency band signal may be biased to 2.5G Hz, and the ground conductive sheet 150 is coupled to the third radiating block 183. When the length is short, the spectrum range of the first frequency band signal may be biased toward 2.3G Hz. Therefore, the designer can adjust the length of the grounding conductive sheet 150 coupled to the third radiation block 183 according to the actual use situation of the electronic device 100 to fit the required spectrum range.

再者,雙頻迴路饋體180之饋入點FP與第一導電面112之間的距離g3小於或大於饋入點FP與第二導電面122之間的距離g4。在本發明的部分實施例中,饋入點FP與第一導電面112之間的距離g3(或饋入點FP與第二導電面122之間的距離g4)會影響電子裝置100收發第一頻帶訊號或第二頻帶訊號的天線效率。舉例來說,饋入點FP與第一導電面112之間的距離g3小於饋入點FP與第二導電面122之間的距離g4時,可提升收發第二頻帶訊號(高頻訊號)的天線效率;相對地,饋入點FP與第一導電面112之間的距離g3大於饋入點FP與第二導電面122之間的距離g4時,則可提升收發第一頻帶訊號(低頻訊號)的天線效率。在第4圖的實施例中,電子裝置100在高頻訊號的部分可能表現較差,因此可優先考慮將饋入點FP設置於第一輻射區塊181中較靠近第一導電面112的位置,以縮短饋入點FP與第一導電面112之間的距離g3,達到提升收發第二頻帶訊號(高頻訊號)的效率。然而在其他實施例中,設計者仍可以根據實際上的使用狀況,調整饋入點FP與第一導電面112之間的距離g3(或饋入點FP與第二導電面122之間的距離g4),以提高整體的天線效率。Furthermore, the distance g3 between the feeding point FP of the dual-frequency loop feed 180 and the first conductive surface 112 is smaller than or greater than the distance g4 between the feeding point FP and the second conductive surface 122. In some embodiments of the present invention, the distance g3 between the feeding point FP and the first conductive surface 112 (or the distance g4 between the feeding point FP and the second conductive surface 122) may affect the electronic device 100 to transmit and receive the first Antenna efficiency of a band signal or a second band signal. For example, when the distance g3 between the feed point FP and the first conductive surface 112 is smaller than the distance g4 between the feed point FP and the second conductive surface 122, the transmission and reception of signals in the second frequency band (high-frequency signals) can be improved. Antenna efficiency; in contrast, when the distance g3 between the feed point FP and the first conductive surface 112 is greater than the distance g4 between the feed point FP and the second conductive surface 122, the first frequency band signal (low frequency signal) can be improved. ) Antenna efficiency. In the embodiment of FIG. 4, the electronic device 100 may perform poorly in the high-frequency signal portion. Therefore, it may be preferred to set the feeding point FP in the first radiation block 181 closer to the first conductive surface 112. In order to shorten the distance g3 between the feeding point FP and the first conductive surface 112, the efficiency of transmitting and receiving signals in the second frequency band (high-frequency signals) is improved. However, in other embodiments, the designer can still adjust the distance g3 between the feed point FP and the first conductive surface 112 (or the distance between the feed point FP and the second conductive surface 122) according to the actual use situation. g4) to improve overall antenna efficiency.

第4圖的實施例是以第2圖所示的雙頻迴路饋體180來實施,然亦可選擇利用第3圖所示的雙頻迴路饋體280來實施,並可根據前述的方式配置於電子裝置100。The embodiment of FIG. 4 is implemented by the dual-frequency loop feed 180 shown in FIG. 2, but it can also be implemented by using the dual-frequency loop feed 280 shown in FIG. 3, and can be configured according to the foregoing manner.于 电子 装置 100。 In the electronic device 100.

第5圖為電子裝置100之腔體CVT的局部剖面圖,在第5圖中,雙頻迴路饋體180與導電擋牆160之間具有間隙g5。由於雙頻迴路饋體180與導電擋牆160之間的間隙g5不論對高頻或低頻的天線效率都有明顯的影響,因此設計者一般需保留較大的間隙來提升天線效率。舉例來說,若雙頻迴路饋體180的長邊L1為40毫米且寬邊W1為5毫米,則雙頻迴路饋體180與導電擋牆160之間的間隙g5可大於14.5毫米。FIG. 5 is a partial cross-sectional view of the cavity CVT of the electronic device 100. In FIG. 5, there is a gap g5 between the dual-frequency loop feed 180 and the conductive retaining wall 160. Since the gap g5 between the dual-frequency loop feed 180 and the conductive retaining wall 160 has a significant effect on the antenna efficiency at high or low frequencies, designers generally need to maintain a large gap to improve antenna efficiency. For example, if the long side L1 of the dual-frequency loop feed 180 is 40 mm and the wide side W1 is 5 mm, the gap g5 between the dual-frequency loop feed 180 and the conductive retaining wall 160 may be greater than 14.5 mm.

此外,在第5圖中,電子裝置100的腔體CVT可容置音箱V,音箱V可由導電擋牆160支撐,而雙頻迴路饋體180與音箱V之間則具有間隙g6。舉例來說,音箱V的長度L3可為12.5毫米,而雙頻迴路饋體180與導電擋牆160之間的間隙g5可為15毫米,則雙頻迴路饋體180與音箱V之間的間隙g6即約為2.5毫米。In addition, in FIG. 5, the cavity CVT of the electronic device 100 can accommodate the speaker V, the speaker V can be supported by the conductive blocking wall 160, and there is a gap g6 between the dual-frequency loop feed 180 and the speaker V. For example, the length L3 of the speaker V may be 12.5 mm, and the gap g5 between the dual-frequency loop feed 180 and the conductive retaining wall 160 may be 15 mm. The gap between the dual-frequency loop feed 180 and the speaker V may be g6 is about 2.5 mm.

在本發明的部分實施例中,導電擋牆160可包含導電布162、支撐結構164、166及168,支撐結構164、168可為導電緩衝墊圈,而支撐結構166可將音箱V嵌入其中並加以固定,另外導電布162則可設置於支撐結構166的外層,並可與支撐結構164及168相耦接而形成導電擋牆160的導電部分。然而本發明並不以此為限,在本發明的其他實施例中,設計者亦可根據需求設計其他樣式的導電擋牆160。In some embodiments of the present invention, the conductive retaining wall 160 may include a conductive cloth 162, support structures 164, 166, and 168. The support structures 164, 168 may be conductive cushion washers, and the support structure 166 may embed the speaker V therein and apply It can be fixed. In addition, the conductive cloth 162 can be disposed on the outer layer of the support structure 166 and can be coupled to the support structures 164 and 168 to form a conductive portion of the conductive retaining wall 160. However, the present invention is not limited to this. In other embodiments of the present invention, the designer can also design other types of conductive retaining walls 160 according to requirements.

在第1圖的實施例中,為有效利用機殼中有限的空間,雙頻迴路饋體180可直立地依附於於第一側蓋110及第二側蓋120的接縫部分X。在此情況下,當使用者掀開筆記型電腦的上蓋機殼,亦即掀開由第三側蓋130及第四側蓋140所組成的上蓋機殼時,雙頻迴路饋體180與腔體CVT共振以提供第一頻帶訊號及第二頻帶訊號,且第一頻帶訊號及第二頻帶訊號朝接縫部分X的方向輸出,並藉由三側蓋130及第四側蓋140將第一頻帶訊號及第二頻帶訊號向外反射,因此可進一步增加電子裝置100的天線效率。此外,為確保雙頻迴路饋體180能夠收發訊號,雙頻迴路饋體180所依附之接縫部分X應選用非導體材質,例如塑膠。In the embodiment of FIG. 1, in order to effectively utilize the limited space in the cabinet, the dual-frequency loop feed 180 can be erected on the joint portion X of the first side cover 110 and the second side cover 120 upright. In this case, when the user opens the upper case of the notebook computer, that is, the upper case composed of the third side cover 130 and the fourth side cover 140, the dual-frequency loop feed 180 and the cavity The body CVT resonates to provide the first frequency band signal and the second frequency band signal, and the first frequency band signal and the second frequency band signal are outputted in the direction of the seam portion X, and the first side signal is passed through the three side covers 130 and the fourth side cover 140. The frequency band signal and the second frequency band signal are reflected outward, so that the antenna efficiency of the electronic device 100 can be further increased. In addition, in order to ensure that the dual-frequency loop feed 180 can transmit and receive signals, the joint portion X to which the dual-frequency loop feed 180 is attached should be made of a non-conductive material, such as plastic.

由於電子裝置100可以利用機殼上的導電面112及122與導電擋牆160形成腔體CVT,並且可以與雙頻迴路饋體180產生共振而能夠提供相異頻率範圍的第一頻帶訊號及第二頻帶訊號,再者由於電子裝置100的設計而能夠在空間極為有限的情況下,降低電壓駐波比,並提高天線效率。此外,由於雙頻迴路饋體180可以直立於第一側蓋110及第二側蓋120之間,因此也增加了設計者在擺放天線饋體時的彈性。Since the electronic device 100 can use the conductive surfaces 112 and 122 on the chassis to form a cavity CVT with the conductive retaining wall 160, and can resonate with the dual-frequency loop feed 180, it can provide first-frequency signals and first-frequency signals of different frequency ranges. The two-band signal, because of the design of the electronic device 100, can reduce the voltage standing wave ratio and improve the efficiency of the antenna when the space is extremely limited. In addition, since the dual-frequency loop feed 180 can stand upright between the first side cover 110 and the second side cover 120, the designer's flexibility when placing the antenna feed is also increased.

第6圖為本發明一實施例之電子裝置300的示意圖。電子裝置300與電子裝置100具有相似的結構,然而電子裝置300可包含第一側蓋310、第二側蓋320、第三側蓋330、第四側蓋340、接地片350及350’、導電擋牆360、饋線370及370’及匹配電路390及390’ ,與前述實施例的差異在於至少一雙頻迴路饋體為二雙頻迴路饋體,即第一雙頻迴路饋體380、第二雙頻迴路饋體380’。FIG. 6 is a schematic diagram of an electronic device 300 according to an embodiment of the present invention. The electronic device 300 has a similar structure to the electronic device 100. However, the electronic device 300 may include a first side cover 310, a second side cover 320, a third side cover 330, a fourth side cover 340, ground plates 350 and 350 ', and a conductive structure. The retaining wall 360, the feeders 370 and 370 ', and the matching circuits 390 and 390' differ from the foregoing embodiments in that at least one dual-frequency loop feed is two dual-frequency loop feeds, that is, the first dual-frequency loop feed 380, the first Two dual frequency loop feeds 380 '.

第二雙頻迴路饋體380’可與第一雙頻迴路饋體380獨立設置,並可與導電擋牆360平行設置且立於第一導電面312及第二導電面322之間。第二雙頻迴路饋體380’與第一雙頻迴路饋體380可具有相同之結構。舉例來說,第二雙頻迴路饋體380’及第一雙頻迴路饋體380可選擇利用第2圖所示的雙頻迴路饋體180來實施,或是選擇利用第3圖所示的雙頻迴路饋體280來實施,並可根據前述的方式與其他元件相耦接。The second dual-frequency loop feed 380 'may be independently provided from the first dual-frequency loop feed 380, and may be disposed in parallel with the conductive blocking wall 360 and stands between the first conductive surface 312 and the second conductive surface 322. The second dual-frequency loop feed 380 'and the first dual-frequency loop feed 380 may have the same structure. For example, the second dual-frequency loop feed 380 ′ and the first dual-frequency loop feed 380 may be selected to be implemented by the dual-frequency loop feed 180 shown in FIG. 2, or may be selected by using the dual-frequency loop feed 180 shown in FIG. 3. The dual-frequency loop feed 280 is implemented, and can be coupled with other components according to the aforementioned manner.

此外,為了減少第二雙頻迴路饋體380’與第一雙頻迴路饋體380在操作過程中彼此相干擾,在第6圖中,第二雙頻迴路饋體380’及第一雙頻迴路饋體380可以鏡射對稱的方式直立設置於第一導電面312及第二導電面322之間以提升第二雙頻迴路饋體380’與第一雙頻迴路饋體380之間的隔離度。舉例來說,第一雙頻迴路饋體380耦接至接地片350的部分會靠近第二雙頻迴路饋體380’耦接至接地片350’的部分。In addition, in order to reduce the interference between the second dual-frequency loop feed 380 'and the first dual-frequency loop feed 380 during operation, in FIG. 6, the second dual-frequency loop feed 380' and the first dual-frequency feed The loop feed 380 can be erected in a mirror-symmetric manner between the first conductive surface 312 and the second conductive surface 322 to improve the isolation between the second dual-frequency loop feed 380 ′ and the first dual-frequency loop feed 380. degree. For example, a portion of the first dual-frequency loop feed 380 that is coupled to the ground plate 350 will be close to a portion of the second dual-frequency loop feed 380 'that is coupled to the ground plate 350'.

在第6圖中,電子裝置300還包含導體件362,導體件362豎直地耦接第一導電面312及第二導電面322,並耦接於導體擋牆360,導體件362可設置於第一雙頻迴路饋體380及第二雙頻迴路饋體380’之間,以將導電擋牆360、第一導電面312及第二導電面322所共同形成的腔體CVT區隔成兩個小腔體CVT’。然而在本發明的部分實施例中,亦可將導體件362省略,而第一雙頻迴路饋體380及第二雙頻迴路饋體380’則可共用相同的腔體CVT。In FIG. 6, the electronic device 300 further includes a conductive member 362. The conductive member 362 is vertically coupled to the first conductive surface 312 and the second conductive surface 322 and is coupled to the conductive retaining wall 360. The conductive member 362 may be disposed on Between the first dual-frequency loop feed 380 and the second dual-frequency loop feed 380 ', the cavity CVT formed by the conductive retaining wall 360, the first conductive surface 312 and the second conductive surface 322 is divided into two. Small cavity CVT '. However, in some embodiments of the present invention, the conductor 362 may be omitted, and the first dual-frequency loop feed 380 and the second dual-frequency loop feed 380 'may share the same cavity CVT.

在第6圖的實施例中,為有效利用機殼中有限的空間,雙頻迴路饋體380及380’可直立地依附於於第一側蓋310及第二側蓋320的接縫部分X。在此情況下,當使用者掀開筆記型電腦的上蓋機殼,亦即由掀開第三側蓋330及第四側蓋340所組成的上蓋機殼時,雙頻迴路饋體380於腔體CVT共振以提供第一頻帶訊號及第二頻帶訊號,且第一頻帶訊號及第二頻帶訊號朝接縫部分X的方向輸出,並藉由三側蓋130及第四側蓋140將第一頻帶訊號及第二頻帶訊號向外反射,因此可進一步增加電子裝置300的天線效率。In the embodiment of FIG. 6, in order to effectively use the limited space in the cabinet, the dual-frequency loop feeds 380 and 380 ′ can be vertically attached to the joint portion X of the first side cover 310 and the second side cover 320. . In this case, when the user opens the upper case of the notebook computer, that is, the upper case formed by opening the third side cover 330 and the fourth side cover 340, the dual-frequency loop feed 380 is in the cavity. The body CVT resonates to provide the first frequency band signal and the second frequency band signal, and the first frequency band signal and the second frequency band signal are outputted in the direction of the seam portion X, and the first side signal is passed through the three side covers 130 and the fourth side cover 140. The frequency band signal and the second frequency band signal are reflected outward, so that the antenna efficiency of the electronic device 300 can be further increased.

第10圖為電子裝置300的頻率隔離度示意圖。在第10圖中,第一頻帶訊號的隔離度可對應至圖中B1所框選之頻譜範圍之的隔離度,第二頻帶訊號的隔離度可對應至圖中B2所框選之頻率範圍之的隔離度。從第10圖可知,電子裝置300在第一頻帶訊號的頻譜範圍(即2.4G~2.5G赫茲)及第二頻帶訊號之頻譜範圍(即4.9G~5.9G赫茲)的隔離度都可維持在-15dB以下。FIG. 10 is a schematic diagram of frequency isolation of the electronic device 300. In Figure 10, the isolation of the first frequency band signal can correspond to the isolation of the frequency range selected by B1 in the figure, and the isolation of the second frequency band signal can correspond to the frequency range of the frequency selected by B2 in the figure. Isolation. It can be seen from FIG. 10 that the isolation of the electronic device 300 in the frequency range of the first frequency band signal (that is, 2.4G to 2.5G Hz) and the frequency range of the second frequency band signal (that is, 4.9G to 5.9GHz) can be maintained at Below -15dB.

在本發明的部分實施例中,在第一側蓋310之導電面312、第二側蓋320之導電面322及導電擋牆360已能共同形成腔體CVT的情況下,第三側蓋330及第四側蓋340亦可能不包含導電面,而改由非導體材質製造,又或是僅有第三側蓋330包含導體面,而第四側蓋340可不包含導體面。甚至在本發明的部分實施例中,亦可將本發明之電子裝置運用在平板電腦中,此時電子裝置亦可不包含第三側蓋及第四側蓋。In some embodiments of the present invention, when the conductive surface 312 of the first side cover 310, the conductive surface 322 of the second side cover 320, and the conductive retaining wall 360 can collectively form a cavity CVT, the third side cover 330 And the fourth side cover 340 may not include a conductive surface, and may instead be made of a non-conductive material, or only the third side cover 330 includes a conductive surface, and the fourth side cover 340 may not include a conductive surface. Even in some embodiments of the present invention, the electronic device of the present invention can be used in a tablet computer. At this time, the electronic device does not include a third side cover and a fourth side cover.

第7圖為本發明一實施例之電子裝置400的示意圖。電子裝置400與電子裝置300具有相似的結構,電子裝置400可包含第一側蓋410、第二側蓋420、接地片350及350’、導電擋牆360、饋線370及370’、第一雙頻迴路饋體380、第二雙頻迴路饋體380’及匹配電路390及390’。換言之,電子裝置400與第6圖的電子裝置300的主要差別在於,第7圖的電子裝置400僅包含第一側蓋410及第二側蓋420,而第6圖的電子裝置300則包含第一側蓋310、第二側蓋320、第三側蓋330及第四側蓋340。FIG. 7 is a schematic diagram of an electronic device 400 according to an embodiment of the present invention. The electronic device 400 and the electronic device 300 have a similar structure. The electronic device 400 may include a first side cover 410, a second side cover 420, ground plates 350 and 350 ', a conductive retaining wall 360, feeders 370 and 370', and a first double The frequency loop feed 380, the second dual-frequency loop feed 380 ', and the matching circuits 390 and 390'. In other words, the main difference between the electronic device 400 and the electronic device 300 in FIG. 6 is that the electronic device 400 in FIG. 7 includes only the first side cover 410 and the second side cover 420, and the electronic device 300 in FIG. 6 includes the first side cover 410 and the second side cover 420. The side cover 310, the second side cover 320, the third side cover 330, and the fourth side cover 340.

電子裝置400可供平板電腦使用,舉例來說,第一側蓋410可為平板電腦的金屬底座,而第二側蓋420則可為包含螢幕的金屬上蓋,也就是說,第一側蓋410的第一導電面412可為第一側蓋410之金屬底座的金屬面,而第二側蓋420之第二導電面422則可為第二側蓋420之金屬上蓋的金屬面。在此情況下,金屬擋牆360、第一導電面412及第二導電面422可共同形成腔體CVT,並與第一雙頻迴路饋體380及第二雙頻迴路饋體380’產生共振以提供第一頻帶訊號及第二頻帶訊號。The electronic device 400 may be used by a tablet computer. For example, the first side cover 410 may be a metal base of the tablet computer, and the second side cover 420 may be a metal upper cover including a screen, that is, the first side cover 410 The first conductive surface 412 may be a metal surface of a metal base of the first side cover 410, and the second conductive surface 422 of the second side cover 420 may be a metal surface of a metal upper cover of the second side cover 420. In this case, the metal retaining wall 360, the first conductive surface 412, and the second conductive surface 422 may form a cavity CVT together and resonate with the first dual-frequency loop feed 380 and the second dual-frequency loop feed 380 '. To provide a first frequency band signal and a second frequency band signal.

綜上所述,本發明之實施例所提供的電子裝置可以利用機殼上的導電面與導電擋牆形成腔體,並且可以與雙頻迴路饋體產生共振而能夠提供相異頻率範圍的頻帶訊號,因此可以在空間極為有限的情況下,降低電子裝置的電壓駐波比,並提高天線效率。此外,由於雙頻迴路饋體可以直立設置於機殼內,因此也增加了設計者在擺放天線饋體時的彈性。 以上所述僅為本發明之較佳實施例,凡依本發明申請專利範圍所做之均等變化與修飾,皆應屬本發明之涵蓋範圍。In summary, the electronic device provided by the embodiment of the present invention can form a cavity by using the conductive surface on the casing and the conductive retaining wall, and can resonate with the dual-frequency loop feed to provide frequency bands of different frequency ranges. Signal, it is possible to reduce the voltage standing wave ratio of the electronic device and improve the antenna efficiency in the case of extremely limited space. In addition, because the dual-frequency loop feed can be set upright in the casing, it also increases the flexibility of the designer when placing the antenna feed. The above description is only a preferred embodiment of the present invention, and all equivalent changes and modifications made in accordance with the scope of patent application of the present invention shall fall within the scope of the present invention.

100、300、400‧‧‧電子裝置
110、120、130、140、310、320、330、340、410、420‧‧‧側蓋
112、122、312、322、412、422‧‧‧導電面
150、350、350’‧‧‧接地片
160、360‧‧‧導電擋牆
CVT、CVT’‧‧‧腔體
362‧‧‧導體件
170、370、370’‧‧‧饋線
180、280、380、380’‧‧‧雙頻迴路饋體
190、390、390’‧‧‧匹配電路
181、182、183、184、281、282、283、284‧‧‧輻射區塊
285‧‧‧連接部
A‧‧‧槽縫
A1‧‧‧第一子槽縫
A2‧‧‧第二子槽縫
FP‧‧‧饋入點
192‧‧‧電容
194‧‧‧電感
L1、L2、L3、W1‧‧‧邊
g1、g2、g3、g4、g5、g6‧‧‧間隙
162‧‧‧導電布
164、166、168‧‧‧支撐結構
V‧‧‧音箱
X‧‧‧接縫
B1、B2‧‧‧頻譜範圍
810、820、910、920‧‧‧曲線
100, 300, 400‧‧‧ electronic devices
110, 120, 130, 140, 310, 320, 330, 340, 410, 420‧‧‧ side cover
112, 122, 312, 322, 412, 422‧‧‧ conductive surface
150, 350, 350'‧‧‧ ground plate
160、360‧‧‧Conductive retaining wall
CVT, CVT'‧‧‧ Cavity
362‧‧‧Conductor
170, 370, 370'‧‧‧ feeder
180, 280, 380, 380'‧‧‧ dual frequency loop feed
190, 390, 390'‧‧‧ matching circuits
181, 182, 183, 184, 281, 282, 283, 284‧‧‧ radiated blocks
285‧‧‧Connection Department
A‧‧‧Slot
A1‧‧‧First child slot
A2‧‧‧Second child slot
FP‧‧‧feed point
192‧‧‧Capacitor
194‧‧‧Inductance
L1, L2, L3, W1‧‧‧ side
g1, g2, g3, g4, g5, g6‧‧‧ clearance
162‧‧‧Conductive cloth
164, 166, 168‧‧‧ support structure
V‧‧‧Speaker
X‧‧‧Seams
B1, B2‧‧‧‧Spectral range
810, 820, 910, 920‧‧‧ curves

第1圖為本發明一實施例之電子裝置的示意圖。 第2圖為本發明一實施例之雙頻迴路饋體的示意圖。 第3圖為本發明另一實施例之雙頻迴路饋體的示意圖。 第4圖為第1圖之電子裝置的局部放大圖。 第5圖為第1圖之電子裝置之腔體的局部剖面圖。 第6圖為本發明另一實施例之電子裝置的示意圖。 第7圖為本發明另一實施例之電子裝置的示意圖。 第8圖為本發明一實施例之電子裝置之電壓駐波比對頻率的變化圖。 第9圖為本發明一實施例之電子裝置之電壓駐波比對頻率的變化圖。 第10圖為第6圖之電子裝置的頻率隔離度示意圖。FIG. 1 is a schematic diagram of an electronic device according to an embodiment of the present invention. FIG. 2 is a schematic diagram of a dual-frequency loop feed according to an embodiment of the present invention. FIG. 3 is a schematic diagram of a dual-frequency loop feed according to another embodiment of the present invention. FIG. 4 is a partially enlarged view of the electronic device of FIG. 1. FIG. 5 is a partial cross-sectional view of the cavity of the electronic device of FIG. 1. FIG. 6 is a schematic diagram of an electronic device according to another embodiment of the present invention. FIG. 7 is a schematic diagram of an electronic device according to another embodiment of the present invention. FIG. 8 is a graph of a voltage standing wave ratio versus frequency of an electronic device according to an embodiment of the present invention. FIG. 9 is a graph of a voltage standing wave ratio versus frequency of an electronic device according to an embodiment of the present invention. FIG. 10 is a schematic diagram of the frequency isolation of the electronic device in FIG. 6.

300‧‧‧電子裝置 300‧‧‧ electronic device

310、320、330、340‧‧‧側蓋 310, 320, 330, 340‧‧‧ side cover

312、322‧‧‧導電面 312, 322‧‧‧ conductive surface

350、350’‧‧‧接地片 350, 350’‧‧‧ grounding lug

360‧‧‧導電擋牆 360‧‧‧Conductive retaining wall

362‧‧‧導體件 362‧‧‧Conductor

370、370’‧‧‧饋線 370, 370’‧‧‧ feeder

380、380’‧‧‧雙頻迴路饋體 380, 380’‧‧‧ dual-frequency loop feed

390、390’‧‧‧匹配電路 390, 390’‧‧‧ matching circuit

CVT、CVT’‧‧‧腔體 CVT, CVT’‧‧‧ Cavity

X‧‧‧接縫 X‧‧‧Seams

Claims (16)

一種電子裝置,包含: 一第一側蓋,具有一第一導電面; 一第二側蓋,具有一第二導電面,該第二側蓋係相對於該第一側蓋設置,用以與該第一側蓋組合成一機殼; 一導電擋牆,豎直地耦接該第一導電面及該第二導電面以共同形成一腔體;及 至少一雙頻迴路饋體,與該導電擋牆平行設置且立於該第一導電面及該第二導電面之間,每一雙頻迴路饋體包含: 一饋入端; 一接地端,耦接於該第二導電面; 一第一輻射區塊,具有一饋入點耦接於該饋入端; 一第二輻射區塊,一端耦接於該第一輻射區塊; 一第三輻射區塊,相對於該第一輻射區塊設置,耦接於該第二輻射區塊的另一端及該接地端之間;及 一第四輻射區塊,相對於該第二輻射區塊設置,耦接於該第一輻射區塊及該第三輻射區塊之間,其中該第一輻射區塊、該第二輻射區塊、該第三輻射區塊及該第四輻射區塊係圍繞形成具有一槽縫之一矩形饋體, 其中該雙頻迴路饋體於該腔體共振以提供一第一頻帶訊號及一第二頻帶訊號。An electronic device includes: a first side cover having a first conductive surface; a second side cover having a second conductive surface; the second side cover is disposed opposite to the first side cover and used to communicate with the first side cover; The first side cover is combined into a casing; a conductive retaining wall is vertically coupled to the first conductive surface and the second conductive surface to form a cavity together; and at least one dual-frequency loop feed body is connected to the conductive body. The retaining wall is arranged in parallel and stands between the first conductive surface and the second conductive surface. Each dual-frequency loop feed includes: a feeding end; a grounding end coupled to the second conductive surface; a first A radiation block having a feeding point coupled to the feeding end; a second radiation block having one end coupled to the first radiation block; a third radiation block opposite to the first radiation block Block arrangement, coupled between the other end of the second radiation block and the ground; and a fourth radiation block, which is disposed relative to the second radiation block, is coupled to the first radiation block and Between the third radiation block, wherein the first radiation block, the second radiation block, and the third radiation block And the fourth radiation block is formed around a rectangular feed with a slot, wherein the dual-frequency loop feed resonates in the cavity to provide a first-band signal and a second-band signal. 如請求項1所述之電子裝置,另包含一匹配電路,該匹配電路係設置於該槽縫內,其中該饋入端係經由該匹配電路耦接至該饋入點。The electronic device according to claim 1, further comprising a matching circuit disposed in the slot, wherein the feeding end is coupled to the feeding point via the matching circuit. 如請求項2所述之電子裝置,其中該匹配電路包含一電感及一電容,該電感耦接於該饋入端,及該電容耦接於該電感及該饋入點。The electronic device according to claim 2, wherein the matching circuit includes an inductor and a capacitor, the inductor is coupled to the feeding terminal, and the capacitor is coupled to the inductor and the feeding point. 如請求項1所述之電子裝置,其中該雙頻迴路饋體另包含一連接部,該連接部設置於該槽縫,且耦接於該第一輻射區塊及該第二輻射區塊之間,透過該連接部將該槽縫分隔為一第一子槽縫及一第二子槽縫。The electronic device according to claim 1, wherein the dual-frequency loop feed further includes a connecting portion, the connecting portion is disposed in the slot, and is coupled to the first radiation block and the second radiation block. The slot is divided into a first sub slot and a second sub slot by the connecting portion. 如請求項4所述之電子裝置,其中該第一輻射區塊、該連接部、該第二輻射區塊、該第三輻射區塊及該第四輻射區塊係圍繞形成該第一子槽縫,而該第一輻射區塊、該第二輻射區塊及該連接部圍繞形成該第二子槽縫。The electronic device according to claim 4, wherein the first radiation block, the connection part, the second radiation block, the third radiation block, and the fourth radiation block surround the first sub-slot. And the first radiating block, the second radiating block, and the connecting portion surround the second sub-slot. 如請求項1所述之電子裝置,其中該雙頻迴路饋體與該第一導電面之間具有一間隙。The electronic device according to claim 1, wherein there is a gap between the dual-frequency loop feed and the first conductive surface. 如請求項1或6所述之電子裝置,其中該雙頻迴路饋體與該第二導電面之間具有一間隙。The electronic device according to claim 1 or 6, wherein there is a gap between the dual-frequency loop feed and the second conductive surface. 如請求項1所述之電子裝置,其中該雙頻迴路饋體與該導電擋牆之間具有一間隙。The electronic device according to claim 1, wherein there is a gap between the dual-frequency loop feed and the conductive retaining wall. 如請求項1所述之電子裝置,其中該饋入點與該第一導電面之間的一距離小於該饋入點與該第二導電面之間的一距離。The electronic device according to claim 1, wherein a distance between the feeding point and the first conductive surface is smaller than a distance between the feeding point and the second conductive surface. 如請求項1所述之電子裝置,其中該雙頻迴路饋體於平行該第三輻射區塊的設置方向的輻射區塊的長度大於該接地端耦接該第三輻射體的長度。The electronic device according to claim 1, wherein a length of the radiation block of the dual-frequency loop feed in a direction parallel to the setting direction of the third radiation block is greater than a length of the ground terminal coupled to the third radiator. 如請求項1所述之電子裝置,該至少一雙頻迴路饋體為二雙頻迴路饋體,該二雙頻迴路饋體以鏡射方式設置且與該導電擋牆平行設置且立於該第一導電面及該第二導電面之間。According to the electronic device of claim 1, the at least one dual-frequency loop feed is a two-dual-frequency loop feed, and the two-dual-frequency loop feed is arranged in a mirrored manner and is arranged in parallel with the conductive retaining wall and stands on the Between the first conductive surface and the second conductive surface. 如請求項11所述之電子裝置,另包含一導體件,豎直地耦接該第一導電面及該第二導電面,且該導體件耦接於該導體擋牆,並設置於該二雙頻迴路饋體之間。The electronic device according to claim 11, further comprising a conductive member, which is vertically coupled to the first conductive surface and the second conductive surface, and the conductive member is coupled to the conductive retaining wall and disposed on the two Between dual-frequency loop feeds. 如請求項1所述之電子裝置,另包含一第三側蓋,具有一第三導電面,該第三側蓋連接於該第一側蓋及/或該第二側蓋。The electronic device according to claim 1, further comprising a third side cover having a third conductive surface, and the third side cover is connected to the first side cover and / or the second side cover. 如請求項13所述之電子裝置,另包含一第四側蓋,具有一第四導電面,該第四側蓋係相對於該第三側蓋設置,且與該第三側蓋組合成另一機殼。The electronic device according to claim 13, further comprising a fourth side cover having a fourth conductive surface, the fourth side cover is disposed opposite to the third side cover, and combined with the third side cover to form another A case. 如請求項1所述之電子裝置,其中該第一頻帶訊號之一頻譜範圍係位於2.4G~2.5G赫茲,及該第二頻帶訊號之一頻譜範圍係位於4.9G~5.9G赫茲。The electronic device according to claim 1, wherein one of the frequency bands of the first frequency band signal is located at 2.4G ~ 2.5G Hz, and one of the frequency bands of the second frequency band signal is located at 4.9G ~ 5.9G Hz. 如請求項1所述之電子裝置,其中該饋入點與該第一導電面之間的一距離大於該饋入點與該第二導電面之間的一距離。The electronic device according to claim 1, wherein a distance between the feeding point and the first conductive surface is greater than a distance between the feeding point and the second conductive surface.
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