TW201705602A - Communication device - Google Patents

Abstract

A communication device has a first cover, circuit board, and first conductive body. The first cover has a first conductive area, a non-conductive area, and a second conductive area, wherein the non-conductive area is disposed between the first conductive area and the second conductive area. The circuit board is disposed parallel with the first cover, wherein the circuit board has a signal processing unit, a ground area, and a first radiating unit. The ground area is coupled to the second conductive area, and the first radiating unit corresponds to the projection area of the non-conductive area. An end of the first radiating unit is coupled to the signal processing unit and the first conductive area. A side of the first conductive body is adjacent to the first radiating unit, wherein the first conductive body is disposed in the projection area of the first conductive area.

Description

Communication device

The present invention relates to a communication device; in particular, the present invention relates to a communication device having a radiating antenna excitation slot.

With the evolution of technology, human technology in wireless communication has continued to progress and develop rapidly. The development direction of many communication devices has tended to reduce the design of products within the product to create more space in the communication device to increase the other. Product Features. Due to the rapid development of wireless communication, mobile communication devices are gradually moving toward multi-frequency and multi-function applications, and larger camera modules and complex input/output components have greatly reduced the space available for the antenna. In addition, the increasing demand for unique metal designs has resulted in the design of a combination of mechanisms and antennas.

In general, multi-band antennas use multiple different metal paths to control the low, medium, and high frequency bands of the sky, supplemented by parasitic coupling, residual segment matching, etc., and adjust the antenna pair by single feed or multiple feed. Matching of the overall system. However, such an antenna design must have sufficient clearance area and also be away from internal metal components, making it difficult to adapt to metal housing communication devices.

The antenna structure of the communication device of the metal casing can adopt a slot structure, such as TW201427172. However, the size of the slot of this design is limited and it is not easy to have satisfactory efficiency. In addition, when the mobile communication device includes a large pair of front/rear camera modules, the above-mentioned slot structure length will be more limited. In addition, if other auxiliary antennas (such as GPS or wireless network WiFi antennas) are included in the design considerations, the integrity of the appearance of the original metal needs to be destroyed to avoid the metal appearance from interfering with the normal operation of the auxiliary antennas. The problem of isolation between adjacent antennas.

It is an object of the present invention to provide a communication device that utilizes a three-dimensional slot structure to create a multi-band modality.

Another object of the present invention is to provide a communication device in which the three-dimensional slot structure provides a small size and space requirement.

The communication device of the present invention comprises a first cover, a circuit board and a first electrical conductor. The first cover has a first conductive region, a non-conductive region and a second conductive region, and the non-conductive region is disposed between the first conductive region and the second conductive region; the circuit board is disposed in parallel with the first cover, wherein the circuit board The signal processing unit, the connection area and the first radiation unit are coupled to the second conductive area, and the first radiation unit corresponds to a projection range of the non-conductive area, and one end of the first radiation unit is coupled to the signal processing unit and the first a conductive region; and one side of the first electrical conductor is adjacent to the first radiating element, wherein the first electrical conductor is disposed in a projection range of the first conductive region.

G‧‧‧Contact area

G1‧‧‧Connection Bridge

L‧‧‧ Groove

P‧‧‧ convex

SC1‧‧‧ circuit line

SC2‧‧‧ circuit line

SI‧‧‧Feeding point

SI2‧‧‧Feeding point

1‧‧‧ bumps

2‧‧‧ bumps

12‧‧‧ screen

13‧‧‧First cover

14‧‧‧ boards

15‧‧‧First conductor

16‧‧‧ Back shell

100‧‧‧Communication device

101‧‧‧First Radiation Unit

102‧‧‧second radiating element

103‧‧‧non-conductive area

123‧‧‧ Grounding feet

125‧‧‧ Grounding feet

126‧‧‧Conducting unit

131‧‧‧First conductive area

132‧‧‧Second conductive area

141‧‧‧Signal Processing Unit

151‧‧‧First conductor

152‧‧‧Second conductor

1 is a schematic view of an embodiment of the communication device of the present invention; FIG. 2 is a front view of FIG. 1; FIG. 3A is a view of another embodiment of the communication device of FIG. 4A is a schematic view of another embodiment of FIG. 1; FIG. 4B is a schematic view of an embodiment of the back surface of FIG. 4A; FIG. 5 is a schematic view of an embodiment of a non-conductive area of FIG. 4A; and FIG. 6A and FIG. A schematic representation of the frequency bands that the device can use.

The present invention provides a communication device. In the preferred embodiment, the communication device of the present invention can be applied to electronic products such as mobile phones, smart phones, notebook computers, tablet computers, etc.; but is not limited thereto. In order to clearly describe the characteristics of the communication device of the present case, the communication device of the present case will be described as a smart phone.

FIG. 1 is an exemplary diagram of the communication device 100 of the present invention. As shown in FIG. 1 , in the present embodiment, the communication device 100 includes a screen 12 , a first cover 13 , a circuit board 14 , a first electrical conductor 15 , and a back shell 16 . Specifically, in the embodiment, the first cover 13 is a housing that forms a smart phone with the back cover 16, that is, the circuit board 14 and the first conductive body 15 are sandwiched between the first cover 13 and the back. Between the shells 16, as shown in Figure 1. The screen 12 of the communication device 100 can include a liquid crystal display, an organic light-emitting diode display, and an active-matrix organic light-emitting diode display. Or any other suitable display panel. The circuit board 14 may include components such as a signal processing unit 141, a connection area G, a radiation unit 101, a central processing unit, a memory, an input/output interface port, an auxiliary antenna, and the like (some elements are not shown); however, it is not limited thereto.

In the embodiment, the first cover body i3 has a first conductive region 131, a non-conductive region 103, and a second conductive region 132. Specifically, the first conductive region 131 and the second conductive region 132 of the first cover 13 are preferably formed of a metal material or other conductive materials, and the non-conductive region 103 is preferably formed of a non-metal material. For example, plastic or wood. The non-conductive region 103 is preferably electrically isolated from the first conductive region 131 and the second conductive region 132. The back shell 16 may be made of a metal material or other material that shields the antenna signal, but a partial non-conductive region is required to avoid the first The radiation unit 101 is shielded by metal. As shown in FIG. 1 , in the embodiment, the non-conductive region 103 is disposed between the first conductive region 131 and the second conductive region 132 . The circuit board 14 is disposed in parallel with the first cover 13 and includes at least a signal processing unit 141, a connection area G, and a first radiation unit 101.

As shown in FIG. 1 , when the circuit board 14 is combined between the first cover 13 and the back cover 16 , the connection region G of the circuit board 14 is coupled to the second conductive region 132 of the first cover 13 . Specifically, in the embodiment, the connection region G of the circuit board 14 includes a connection bridge G1. As shown in FIG. 1, the connection bridge G1 is disposed on one side of the circuit board 14 and falls into the first cover. Within the projection range of the second conductive region 132 of the body 13. The bridge G1 is preferably formed of a metal conductive material and protrudes from the side of the circuit board 14 toward the second conductive region 132. With this design, when the first cover 13 and the circuit board 14 are combined, the connection region G of the circuit board 14 can be connected via the connection bridge by the connection bridge G1 contacting the second conductive region 132 of the first cover 13 G1 is electrically coupled to the second conductive region 132.

As shown in FIG. 1 , in the embodiment, the circuit board 14 has a first radiating unit 101 , wherein one end of the first radiating unit 101 adjacent to the side of the connecting bridge G1 is coupled to the signal processing unit 141 and the first The first conductive region 131 of the cover body 13. Specifically, one end of the first radiating element 101 adjacent to the long side of the circuit board 14 is electrically connected to the signal feeding point SI, and the signal processing unit 141 is connected to the signal feeding point SI via a circuit line SC1. In the present embodiment, as shown in FIG. 1 , the feed point S1 is formed of a metal material and is adjacent to one end of the first cover unit 13 from the circuit board 14 facing away from the first cover 13 . In addition, the circuit line SC1 is preferably surrounded by an electrically insulating material to avoid interference with the operation of the first radiating element 101 when transmitting signals, and the circuit line SC1 may be additionally made of wires on the circuit board 14. Therefore, as shown in FIG. 1 , since the signal feeding point SI is electrically connected to the circuit line SC1 and the first conductive region 131 of the first cover 13 at the same time, the connection between the circuit line SC1 and the feeding point SI is achieved. The signal processing unit 141 can feed the signal generated by the signal processing unit 141 to the first radiation unit 101.

When the signal is fed to the first radiating element 101 via the feed point SI, the first radiating element 101 excites the first cover 13 to collectively form a first frequency band mode. Specifically, the non-conductive region 103 of the first cover 13 is disposed between the first conductive region 131 and the second conductive region 132. The first conductive region 131 and the second conductive region 132 are electrically isolated. As shown in FIG. 1 , in this embodiment, since the non-conductive region 103 is sandwiched between the first conductive region 131 and the second conductive region 132 and is preferably formed into a strip shape, The conductive region 103 is formed as a structure of a slot antenna. Therefore, when the signal processing unit 141 on the circuit board 14 transmits a signal to the first radiating element 101, and along the direction of the first radiating element 101 from the adjacent feeding point SI to the opposite side of the circuit board 14 The above-mentioned slot structure of the first cover 13 (the structure of the non-conductive region 103 formed by sandwiching the first conductive region 131 and the second conductive region 132) is excited by parasitic coupling to be common with the first radiating element. 101 generates a first band mode. In other words, in the present embodiment, the slot structure of the first radiating element 101 formed between the first conductor 15 and the circuit board 14 forms a three-dimensional slot antenna with the non-conductor 103 of the first cover 13.

2 is an embodiment of the front view of FIG. 1 (perspective view of the first cover 13). As shown in FIGS. 1 and 2, in the present embodiment, the position of the first radiating element 101 of the circuit board 14 is a projection range corresponding to the non-conductive area 103 of the first cover 13. Specifically, the first radiating element 101 is formed between the first electrical conductor 15 and the circuit board 14, and the non-conductive area 103 at least partially overlaps the first radiating element 101 in the vertical projection range of the circuit board 14; or first The vertical projection range of the radiating element 101 on the first cover 13 at least partially overlaps the non-conductive area 103. In the present embodiment, the first radiating element 101 in FIG. 2 substantially falls within the projection range of the non-conductive region 103, but part of the first radiating element 101 may be located outside the projected range of the non-conductive region 103 according to design requirements. However, in order to produce an optimum radiation effect, the first radiating element 101 preferably falls within the projection range of the non-conductive region 103 of the first cover 13.

FIG. 3A is an embodiment of the first radiating element 101 of the circuit board 14. As shown in FIG. 3A, in the embodiment, the first radiating element 101 is preferably formed as a slot structure by the side of the first conductor 15 and the circuit board 14 adjacent to the first conductor 15. In this embodiment, the first electrical conductor 15 includes an image capturing device or any other component module formed of metal, for example Camera module. As shown in FIG. 3A, the first electrical conductor 15 is disposed coplanar with the circuit board 14 on the side of the circuit board 14. The slot structure having a stripe shape having a pitch width between the first conductor 15 and the circuit board 14 is the first radiating element 101. When the signal arrives at the first radiating element 101 from the feed point SI, the signal will be along the side of the circuit board 14 in the slot structure (that is, the circuit board formed as the inner side of the slot structure of the first radiating element 101). Pass on the side of 14). In this case, as shown in FIGS. 1 and 3A, since the first conductor 15 has a conductive effect, when the signal is transmitted along the side of the circuit board 14 in the slot structure, the slot structure of the first radiating element 101 It will be excited to produce the radiation effect of the antenna and thereby excite the first cover 13 to collectively produce a first frequency band modality.

3C is another embodiment of FIG. 3A; as shown in FIG. 3C, in the embodiment, the circuit board 14 can extend out a convex portion P, in which case the circuit board 14 faces the first cover 13 and is adjacent to The first radiating element 101 has a first grounding leg 123 connected to the first electrical conductor 15 . When combined, the first grounding leg 123 of the circuit board 14 is connected to the first electrical conductor 15 and electrically coupled to the grounding region G, and the first electrical conductor 15 will partially contact the first cover 13 through the bump 1 The first conductive region 131, the bump 1 is also coupled to the connection region G. In this embodiment, for example, if the first electrical conductor 15 is a self-timer camera module facing the user in the smart phone, a portion of the first electrical conductor 15 facing the first cover 13 and the first conductive region 131 contacts. In other words, the first grounding leg 123 can electrically connect the circuit board 14 to the first conductive region 131 via the first electrical conductor 15 as a signal isolation of the first radiating element 101. Specifically, when the signal is fed from the feed point SI to the first radiating element 101, the signal travels along the side of the circuit board 14 in the slot structure formed by the first radiating element 101 as described above. In this case, in order to ensure that the signal does not travel in a random manner, the first grounding pin 123 is disposed adjacent to the other side of the first radiating element 101 with respect to the feeding point SI to prevent the above-mentioned signal from traveling. The bump 2 can also be coupled to the first conductive region 131 and also have the effect of signal isolation. The ground bump 2 is also coupled to the ground region G.

4A is another embodiment of the present invention, and FIG. 4B is a rearward embodiment of FIG. 4A. As shown in FIG. 4A, in the embodiment, the communication device 100 further includes a second radiating unit 102 for exciting the first cover 13 to jointly form a second frequency end mode. Specifically, as shown in FIG. 4A and FIG. 4B, in the present embodiment, the second radiating element 102 of the circuit board 13 is parallel to the first radiating element 101, and the second radiating element 102 is formed on the side of the circuit board 14. The opening on the side and falls within the projection range of the non-conductive region 103 of the first cover 13.

As shown in FIGS. 4A and 4B, the first conductor 151 and the first radiating element 101 function the same as the first conductor 15 and the first radiating element 101 mentioned in the foregoing embodiments. In this embodiment, the second conductive body 152 is disposed adjacent to the second radiating element 102, wherein the second conductive body 152 is disposed in a projection range of the first conductive region 131 of the first cover 13. As shown in FIG. 4A and FIG. 4B, one end of the second radiating element 102 has a second feeding point SI2, wherein the second feeding point SI2 is electrically coupled to the signal processing unit 141 via the circuit line SC2. In other words, the second radiating element 102 is electrically connected to the signal processing unit 141 on the circuit board 14 via the second feeding point SI2.

Further, as shown in FIGS. 4A and 4B, a second grounding leg 125 is provided adjacent to the second conductor 152 at the other end adjacent to the second radiating element 102. For example, if the second electrical conductor 152 is a backward camera module (ie, a camera facing the back cover 16), the second grounding leg 125 is preferably formed on the circuit board 14 facing away from the first cover 13 One side is located adjacent one end of the second radiating element 152 away from the second feeding point SI2, wherein the second grounding leg 125 is connected to the second electric conductor 152. In this embodiment, a portion of the second electrical conductor 152 facing the first cover 13 is in contact with the first conductive region 131 of the first cover 13. Therefore, the second grounding leg 125 can provide signal isolation for the second radiating element 102 as the first grounding leg 123. In other words, since the second grounding leg 125 passes The second conductive body 152 is electrically connected to the first conductive region 131, and the current fed to the second radiating unit 102 is transmitted along the side of the circuit board 14 and flows to the second conductive region 131 via the second grounding leg 125. Avoid the phenomenon of signal turbulence.

In addition, as shown in FIG. 4A and FIG. 4B , a portion of the circuit board 14 of the convex portion P between the first conductive body 151 and the second conductive body 152 may also be provided with a conductive unit 126 facing the first cover 13 . Specifically, the conductive unit 126 is electrically connected to the connection region G of the circuit board 14 and the first conductive region 131 of the first cover 13 . This is intended to prevent the signal of the second radiating element 102 from leaking along the side of the circuit board 14 to the first conductive body 151 and the first radiating element 101. In other words, the conductive unit 126 is isolated as another signal to prevent the signal of the second radiating element 102 from interfering with the first radiating element 101.

Fig. 5 is a front view (front view) of Figs. 4A and 4B. As shown in FIG. 5, the first radiating element 101 and the second radiating element 102 of the circuit board 14 are disposed in parallel with each other, and are non-conductive regions 103 corresponding to the first cover 13. In the present embodiment, the first radiating element 101 and the second radiating element 102 are projection ranges that completely fall into and parallel to the non-conductive region 103. By this design, the distance between the first radiating element 101 and the second radiating element 102 and the non-conductive region 103 is reduced, and the first radiating unit 101 and the second radiating unit 102 can be respectively excited to excite the non-conductive region 103. The slot structure is used to jointly produce the effects of the first and second frequency band modes. However, in other different embodiments, the positions of the first radiating unit 101 and the second radiating unit 102 may be adjusted according to design requirements, for example, the partial first radiating unit 101 and/or the second radiating unit 102 may fall in the non-conductive region 103. Outside the projection range.

In the present embodiment, as shown in FIGS. 4A and 5, the length of the first radiating element 101 is preferably equal to or smaller than the second radiating element 102. In this embodiment, the length of the second radiating element 102 is about one quarter of the wavelength of the second frequency band. Specifically, the first frequency band mode jointly generated by the first radiating unit 101 and the first cover 13 may include a low frequency band, such as the North American GSM standard. The low frequency band of 850 MHz; the second frequency band mode jointly generated by the second radiating element 102 and the first cover 13 may include a high frequency band, for example, a high frequency band of 1,800 or 1,900 MHz in the North American GSM standard. However, in other different embodiments, the length of the first radiating element 101 and/or the second radiating element 102 can be adjusted according to design requirements, for example, the European GSM/WCDMA/LTE band standard can be achieved, and the low frequency band (791-960 MHz can be achieved). ), the middle frequency band (1710~2170MHz) and the high frequency band (2500~2690MHz).

Please refer to Figures 6A and 6B. Figures 6A and 6B show the results of the frequency range that can be used for actual testing of the present invention. FIG. 6A is a frequency band range that can be covered by the frequency band mode generated by the first radiation unit 101 and the first cover body 13; FIG. 6B is a frequency band mode generated by the second radiation unit 102 and the first cover body 13 The range of frequencies that can be covered. As shown in FIGS. 6A and 6B, the stereoscopic slot antenna of the present invention can be designed to cover 0.791 GHz to 0.96 GHz, 1.71 GHz to 2.484 GHz, 2.5 GHz to 2.69 GHz, and 5.15 GHz to 5.825 GHz. However, these results are only experimental test results. In practical applications, the length or shape of the first radiating element 101, the second radiating element 102, and/or the non-conductive region 103 can be adjusted according to design requirements. For example, the non-conductive region 103 can also be formed in a "T" shape to produce a range of different frequency bands.

The present invention has been described by the above-described related embodiments, but the above embodiments are merely examples for implementing the present invention. It must be noted that the disclosed embodiments do not limit the scope of the invention. On the contrary, modifications and equivalents of the spirit and scope of the invention are included in the scope of the invention.

G‧‧‧Contact area

G1‧‧‧Connection Bridge

SC1‧‧‧ circuit line

SI‧‧‧Feeding point

12‧‧‧ screen

13‧‧‧First cover

14‧‧‧ boards

15‧‧‧First conductor

16‧‧‧ Back shell

100‧‧‧Communication device

101‧‧‧First Radiation Unit

103‧‧‧non-conductive area

131‧‧‧First conductive area

132‧‧‧Second conductive area

141‧‧‧Signal Processing Unit

Claims (10)

A communication device includes: a first cover body having a first conductive region, a non-conductive region and a second conductive region, the non-conductive region being disposed between the first conductive region and the second conductive region; a circuit The board is disposed in parallel with the first cover body, the circuit board includes: a signal processing unit; a connection region is coupled to the second conductive region; and a first radiation unit corresponding to a projection range of the non-conductive region, One end of the first radiating unit is coupled to the signal processing unit and the first conductive region; and one side of the first conductive body is adjacent to the first radiating unit, and the first conductive body is disposed in the first conductive region Projection range. The communication device of claim 1, wherein the first radiating element falls parallel to a projection range of the non-conductive region and is formed in an opening on one side of the circuit board. The communication device of claim 1, wherein the first radiating element excites the first cover to jointly form a first frequency band mode. The communication device of claim 1, wherein the circuit board further comprises a second radiating unit, the second radiating unit is parallel to the first radiating unit, and the second radiating unit is formed on the circuit board. The opening on the side and falls within the projection range of the non-conductive area. For example, the communication device described in claim 4 of the patent scope further includes: a second conductor, one side of the second conductor is adjacent to the second radiating unit, and the second conductor is disposed in a projection range of the first conductive region, wherein one end of the second radiating unit is electrically connected To the signal processing unit and the first conductive region, the second radiating unit excites the first cover to jointly form a second frequency band mode. The communication device of claim 5, wherein a portion of the circuit board is disposed between the first electrical conductor and the second electrical conductor, and the first electrical conductor and the second electrical conductor are electrically connected to the connection region. The communication device of claim 5, wherein the second radiating element has a length of about one quarter of a wavelength of the second frequency band. The communication device of claim 5, wherein a first grounding leg is disposed adjacent to the first radiating unit and coupled to the signal processing unit, the first grounding leg is electrically connected to the first conductive region. The circuit board is provided with a second grounding leg adjacent to one end of the second radiating element, and the second grounding leg is electrically connected to the first conductive region. The communication device of claim 8, wherein the first grounding leg and the second grounding pin are coupled to two sides corresponding to the first conductive region. The communication device of claim 1, further comprising a screen, wherein the non-conductive area is an elongated strip, and one side of the screen is disposed adjacent to the non-conductive area.