TWI614057B - Gas purifier - Google Patents

Gas purifier Download PDF

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Publication number
TWI614057B
TWI614057B TW106120647A TW106120647A TWI614057B TW I614057 B TWI614057 B TW I614057B TW 106120647 A TW106120647 A TW 106120647A TW 106120647 A TW106120647 A TW 106120647A TW I614057 B TWI614057 B TW I614057B
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purification
gas
chamber
purification chamber
air inlet
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TW106120647A
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Chinese (zh)
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TW201904646A (en
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陳武成
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友達光電股份有限公司
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Priority to TW106120647A priority Critical patent/TWI614057B/en
Priority to CN201710726195.1A priority patent/CN107519729B/en
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Publication of TW201904646A publication Critical patent/TW201904646A/en

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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01DSEPARATION
    • B01D53/00Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols
    • B01D53/02Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols by adsorption, e.g. preparative gas chromatography
    • B01D53/04Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols by adsorption, e.g. preparative gas chromatography with stationary adsorbents
    • B01D53/0407Constructional details of adsorbing systems
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01DSEPARATION
    • B01D47/00Separating dispersed particles from gases, air or vapours by liquid as separating agent
    • B01D47/06Spray cleaning

Abstract

一種氣體淨化裝置包含殼體、第一淨化室、第一承接槽、第二淨化室、第二承接槽、多孔性組件、第一淨化材、第一噴淋裝置、第二淨化材及第二噴淋裝置。殼體包含進氣口及排氣口。第一淨化室外側、第一承接槽及殼體間形成第一排風道。第一淨化室的頂部及底部分別連通進氣口及第一排風道。第二淨化室外側、第二承接槽及殼體間形成第二排風道。第二淨化室的頂部及底部分別連通第一排風道及第二排風道,第二排風道連通排氣口。多孔性組件設置於第二淨化室頂部。第一噴淋裝置及第一淨化材位於第一淨化室、第二噴淋裝置及第二淨化材位於第二淨化室。A gas purification device includes a housing, a first purification chamber, a first receiving tank, a second purification chamber, a second receiving tank, a porous component, a first purification material, a first spraying device, a second purification material, and a second Spraying device. The housing includes an air inlet and an air outlet. A first exhaust duct is formed between the first purification outdoor side, the first receiving groove, and the casing. The top and bottom of the first purification chamber are connected to the air inlet and the first exhaust duct, respectively. A second exhaust duct is formed between the second purification outdoor side, the second receiving groove and the casing. The top and bottom of the second purification chamber are connected to the first exhaust duct and the second exhaust duct, respectively, and the second exhaust duct is connected to the exhaust port. The porous component is disposed on the top of the second purification chamber. The first spray device and the first purification material are located in the first purification room, and the second spray device and the second purification material are located in the second purification room.

Description

氣體淨化裝置Gas purification device

本發明涉及氣體淨化領域,尤其是一種氣體淨化裝置。 The invention relates to the field of gas purification, in particular to a gas purification device.

在工業的場域中,隨著對於產品的規格越來越精密,對於製程環境的要求也越來越嚴格。製程環境的空氣也是影響製程品質的一個因素。因此,在製程環境中通常會設置氣體淨化裝置以維持製程環境的空氣品質。氣體淨化裝置可以降低空氣中懸浮微顆粒的濃度、氣體中的含有酸鹼值等不利於製程或是工安的因素。 In the field of industry, as the specifications of products become more and more precise, the requirements for the process environment are becoming stricter. The air in the process environment is also a factor that affects the quality of the process. Therefore, a gas purification device is usually installed in the process environment to maintain the air quality of the process environment. The gas purification device can reduce factors such as the concentration of suspended fine particles in the air and the acid-base value in the gas that are not conducive to the process or industrial safety.

一般而言,淨化氣體的方式是將待處理的氣體通入氣體淨化裝置中含有吸附材料的腔室中,並進行噴灑清洗,透過清洗及吸附來淨化氣體。如果待處理氣體通入腔室的風速過快或過慢、流量過大或過小,都可能影響了吸附材料的位置、或是吸附效果。例如,當通入待處理氣體的風速過快,吸附材料若受到氣流的擾動而導致偏移,從而使得吸附材料各處受到的氣體壓力不均,影響了氣流的流通、進而影響了吸附效應及後續的產品品質。 Generally speaking, the way to purify the gas is to pass the gas to be processed into the chamber containing the adsorbent material in the gas purification device, and perform spray cleaning to purify the gas through washing and adsorption. If the wind speed of the gas to be processed into the chamber is too fast or too slow, the flow rate is too large or too small, it may affect the position of the adsorption material or the adsorption effect. For example, when the wind speed of the gas to be processed is too fast, if the adsorbent material is disturbed by the airflow, it will cause deviation, so that the pressure of the gas received across the adsorbent material is uneven, which affects the flow of the airflow, and then affects the adsorption effect and Follow-up product quality.

另外,吸附材料本身的孔隙也影響了吸附的效果,例如,若是吸附材料過度潮濕,水氣會殘存於吸附材料的孔隙之中,降低了吸附材料的孔隙率降低,造成氣體不易通過,從而減少了吸附材料的吸附能力,更降低了氣體淨化的效果。 In addition, the porosity of the adsorbent material also affects the adsorption effect. For example, if the adsorbent material is excessively wet, water vapor will remain in the pores of the adsorbent material, which reduces the porosity of the adsorbent material, making it difficult for gas to pass through, thereby reducing The adsorption capacity of the adsorption material is reduced, and the effect of gas purification is further reduced.

本案揭示的一態樣關於一種氣體淨化裝置。氣體淨化裝置 包含殼體、第一淨化室、第一承接槽、第二淨化室、第二承接槽、多孔性組件、第一淨化材、第一噴淋裝置、第二淨化材、以及第二噴淋裝置。殼體包含進氣口及排氣口。第一淨化室位於殼體中,第一淨化室的頂部連通進氣口,第一淨化室底部具有第一通孔。第一承接槽位於殼體中,且位於第一淨化室的下方。第一淨化室的外側、第一承接槽、及殼體之間形成第一排風道,第一淨化室通過第一通孔連通第一排風道。第二淨化室位於殼體中,第二淨化室的頂部連通第一排風道,第二淨化室的底部包含第二通孔。第二承接槽位於殼體中,且位於第二淨化室的下方。第二淨化室的外側、第二承接槽、及殼體之間形成第二排風道,第二淨化室通過第二通孔連通第二排風道,第二排風道連通排氣口。多孔性組件設置於第二淨化室的頂部。第一淨化材位於第一淨化室中。第一噴淋裝置位於第一淨化室中,且位於進氣口與第一淨化材之間。第二淨化材位於第二淨化室中。第二噴淋裝置位於第二淨化室中,且位於多孔性組件與第二淨化材之間。 One aspect disclosed in this case relates to a gas purification device. Gas purification device Containing a housing, a first purification chamber, a first receiving tank, a second cleaning chamber, a second receiving tank, a porous component, a first purification material, a first spraying device, a second purification material, and a second spraying device . The housing includes an air inlet and an air outlet. The first purification chamber is located in the casing, the top of the first purification chamber is connected to the air inlet, and the bottom of the first purification chamber has a first through hole. The first receiving groove is located in the casing and is located below the first purification chamber. A first exhaust duct is formed between the outside of the first purification chamber, the first receiving groove, and the casing, and the first purification chamber communicates with the first exhaust duct through a first through hole. The second purification chamber is located in the casing, the top of the second purification chamber is connected to the first exhaust duct, and the bottom of the second purification chamber includes a second through hole. The second receiving tank is located in the casing and is located below the second purification chamber. A second exhaust duct is formed between the outside of the second purification chamber, the second receiving groove, and the casing. The second purification chamber communicates with the second exhaust duct through the second through hole, and the second exhaust duct communicates with the exhaust port. The porous component is disposed on the top of the second purification chamber. The first purification material is located in the first purification chamber. The first spraying device is located in the first purification chamber and is located between the air inlet and the first purification material. The second purification material is located in the second purification chamber. The second spraying device is located in the second purification chamber and is located between the porous component and the second purification material.

綜上所述,本發明實施例的氣體淨化裝置,其適用於連續性淨化氣體,並且其能透過多孔性組件調整進氣的風量及風速,藉以均勻淨化材(第一淨化材或/和第二淨化材)受到的氣體壓力平均並且減少氣流擾動,從而能夠維持淨化材不易偏移。此外,在本發明實施例的氣體淨化裝置中,待處理氣體進入各淨化室(第一淨化室和第二淨化室)的進氣方向與洗滌液的噴淋方向一致,能使各淨化室中淋洗後的洗滌液順利排出淨化材,以使淨化材易於乾燥,從而避免淨化材的孔隙中殘存洗滌液而降低吸附效果。 In summary, the gas purification device of the embodiment of the present invention is suitable for continuously purifying gas, and it can adjust the air volume and speed of the intake air through the porous component to uniformly purify the material (the first purification material or / and the first Two purification materials) average the pressure of the gas and reduce the disturbance of the air flow, so that the purification materials can be kept from being easily displaced. In addition, in the gas purification device of the embodiment of the present invention, the intake direction of the gas to be processed into each purification chamber (the first purification chamber and the second purification chamber) is consistent with the spraying direction of the washing liquid, so that After washing, the washing liquid is smoothly discharged from the purification material, so that the purification material is easy to dry, thereby avoiding the residual washing liquid in the pores of the purification material and reducing the adsorption effect.

1‧‧‧氣體淨化裝置 1‧‧‧Gas purification device

10‧‧‧殼體 10‧‧‧shell

11‧‧‧進氣口 11‧‧‧air inlet

13‧‧‧排氣口 13‧‧‧ exhaust port

15‧‧‧第一排風道 15‧‧‧The first exhaust duct

17‧‧‧第二排風道 17‧‧‧Second Exhaust Duct

20‧‧‧第一淨化室 20‧‧‧The first clean room

21‧‧‧第一淨化材 21‧‧‧The first purification material

23‧‧‧第一噴淋裝置 23‧‧‧The first spray device

25‧‧‧第一通孔 25‧‧‧First through hole

30‧‧‧第一承接槽 30‧‧‧The first receiving trough

40‧‧‧第二淨化室 40‧‧‧Second Purification Room

41‧‧‧第二淨化材 41‧‧‧Second purification material

43‧‧‧第二噴淋裝置 43‧‧‧Second spray device

45‧‧‧第二通孔 45‧‧‧Second through hole

50‧‧‧第二承接槽 50‧‧‧Second receiving trough

60‧‧‧多孔性組件 60‧‧‧ porous component

60’‧‧‧多孔性組件 60’‧‧‧ porous component

61‧‧‧多孔性板材 61‧‧‧ porous sheet

63‧‧‧多孔性風道 63‧‧‧Porous air duct

65‧‧‧孔隙 65‧‧‧ Pore

67‧‧‧導流件 67‧‧‧ Guide

71‧‧‧控制閥 71‧‧‧Control Valve

73‧‧‧抽水閥 73‧‧‧pump valve

80‧‧‧承載板 80‧‧‧carrying plate

85‧‧‧第三通孔 85‧‧‧Third through hole

90‧‧‧預熱單元 90‧‧‧ preheating unit

110‧‧‧第三淨化室 110‧‧‧The third purification room

111‧‧‧第三淨化材 111‧‧‧Third purification material

113‧‧‧第三噴淋裝置 113‧‧‧Third spray device

115‧‧‧通孔 115‧‧‧through hole

117‧‧‧第三排風道 117‧‧‧ Third Exhaust Duct

120‧‧‧第三承接槽 120‧‧‧ Third receiving trough

DL‧‧‧噴淋方向 DL‧‧‧Spray direction

D1‧‧‧第一進氣方向 D1‧‧‧First intake direction

D2‧‧‧第二進氣方向 D2‧‧‧Second intake direction

D3‧‧‧第三進氣方向 D3‧‧‧Third intake direction

G1‧‧‧待處理氣體 G1‧‧‧Gas to be processed

G2‧‧‧淨化氣體 G2‧‧‧purified gas

L‧‧‧洗滌液 L‧‧‧washing liquid

通過參照附圖進一步詳細描述本發明的示例性實施例,本發明的上述和其他示例性實施例,優點和特徵將變得更加清楚,其中: 圖1為氣體淨化裝置第一實施例的剖面示意圖;圖2為氣體淨化裝置第二實施例的剖面示意圖;圖3為氣體淨化裝置第三實施例的剖面示意圖;圖4為氣體淨化裝置第四實施例的剖面示意圖;以及圖5為氣體淨化裝置第四實施例的剖面示意圖。 The above-mentioned and other exemplary embodiments of the present invention will have more advantages and features that will become more clear by describing the exemplary embodiments of the present invention in further detail with reference to the drawings, in which: Fig. 1 is a schematic sectional view of a first embodiment of a gas purification device; Fig. 2 is a schematic sectional view of a second embodiment of a gas purification device; Fig. 3 is a schematic sectional view of a third embodiment of a gas purification device; A schematic cross-sectional view of the embodiment; and FIG. 5 is a schematic cross-sectional view of the fourth embodiment of the gas purification device.

圖1為氣體淨化裝置第一實施例的剖面示意圖。如圖1所示,氣體淨化裝置1包含殼體10、第一淨化室20、複數個第一淨化材21、第一噴淋裝置23、第一承接槽30、第二淨化室40、複數個第二淨化材41、第二噴淋裝置43、第二承接槽50、以及多孔性組件60。 FIG. 1 is a schematic cross-sectional view of a first embodiment of a gas purification device. As shown in FIG. 1, the gas purification device 1 includes a casing 10, a first purification chamber 20, a plurality of first purification materials 21, a first spraying device 23, a first receiving tank 30, a second purification chamber 40, and a plurality of The second purification material 41, the second shower device 43, the second receiving tank 50, and the porous module 60.

殼體10包含進氣口11及排氣口13。第一淨化室20位於殼體10中。第一淨化材21位於第一淨化室20中。第一噴淋裝置23位於第一淨化室20中,且位於進氣口11與第一淨化材21之間。第一淨化室20的頂部連通進氣口11,且第一淨化室20的底部具有複數個第一通孔25。第一承接槽30位於殼體10中,且位於第一淨化室20的下方。第一淨化室20的外側、第一承接槽30上方的空間、及殼體10之間相互連通形成第一排風道15。第一淨化室20通過第一通孔25連通第一排風道15。 The casing 10 includes an air inlet 11 and an air outlet 13. The first purification chamber 20 is located in the casing 10. The first purification material 21 is located in the first purification chamber 20. The first spraying device 23 is located in the first purification chamber 20 and is located between the air inlet 11 and the first purification material 21. The top of the first purification chamber 20 communicates with the air inlet 11, and the bottom of the first purification chamber 20 has a plurality of first through holes 25. The first receiving groove 30 is located in the casing 10 and is located below the first purification chamber 20. The outside of the first purification chamber 20, the space above the first receiving groove 30, and the casing 10 communicate with each other to form a first exhaust duct 15. The first purification chamber 20 communicates with the first exhaust duct 15 through a first through hole 25.

第二淨化室40位於殼體10中。第二淨化室40的頂部連通第一排風道15,第二淨化室40的底部包含第二通孔45。第二淨化材41位於第二淨化室40中。第二噴淋裝置43位於第二淨化室40中,且位於多孔性組件60與第二淨化材41之間。第二承接槽50位於殼體10中,且位於第二淨化室40的下方。第二淨化室40的外側、第二承接槽30上方的空間、及殼體10之間相互連通形成第二排風道17。第二淨化室40通過第二通孔45連通第二排風道17,又第二排風道17連通排氣口13。 The second purification chamber 40 is located in the casing 10. The top of the second purification chamber 40 communicates with the first exhaust duct 15, and the bottom of the second purification chamber 40 includes a second through hole 45. The second purification material 41 is located in the second purification chamber 40. The second spraying device 43 is located in the second purification chamber 40 and between the porous component 60 and the second purification material 41. The second receiving tank 50 is located in the casing 10 and is located below the second purification chamber 40. The outside of the second purification chamber 40, the space above the second receiving groove 30, and the casing 10 communicate with each other to form a second exhaust duct 17. The second purification chamber 40 communicates with the second exhaust duct 17 through the second through hole 45, and the second exhaust duct 17 communicates with the exhaust port 13.

多孔性組件60設置於第二淨化室40的頂部。於此,多孔性組件60用以調整通入之待處理氣體G1的風速及風量,以避免第二淨化材41偏移導致淨化效率的降低。在一些實施例中,多孔性組件60具有連通第一排風道15與第二淨化室40的複數個孔隙65,以供待處理氣體G1由第一排風道15進入第二淨化室40。 The porous module 60 is provided on the top of the second purification chamber 40. Here, the porous component 60 is used to adjust the wind speed and air volume of the gas G1 to be processed to prevent the second purification material 41 from shifting and reducing the purification efficiency. In some embodiments, the porous component 60 has a plurality of pores 65 connecting the first exhaust duct 15 and the second purification chamber 40 for the gas G1 to be processed to enter the second purification chamber 40 from the first exhaust duct 15.

在淨化過程中,待處理氣體G1經由進氣口11進入殼體10的第一淨化室20,以由第一淨化材21吸附待處理氣體G1中雜質。第一淨化材21處理後的待處理氣體G1經由第一通孔25進入第一排風道15,沿著第一排風道15流至多孔性組件60,並經由多孔性組件60的孔隙65進入第二淨化室40。進入第二淨化室40的待處理氣體G1由第二淨化材41再次吸附待處理氣體G1中雜質,以形成淨化氣體G2。淨化氣體G2經由第二通孔45進入第二排風道17,沿著第二排風道17流至排氣口13,並從排氣口13排出。換言之,在淨化過程中,待處理氣體G1由進氣口11通入,並且依序經過第一淨化室20、第一排風道15、多孔性組件60、第二淨化室40,以淨化成淨化氣體G2。淨化氣體G2再經由第二排風道17及排氣口13排出。 During the purification process, the gas to be processed G1 enters the first purification chamber 20 of the casing 10 through the air inlet 11 to adsorb impurities in the gas G1 to be processed by the first purification material 21. The gas G1 to be processed processed by the first purification material 21 enters the first exhaust duct 15 through the first through hole 25, flows along the first exhaust duct 15 to the porous component 60, and passes through the pore 65 of the porous component 60. Enter the second purification chamber 40. The gas to be processed G1 entering the second purification chamber 40 is adsorbed again by the second purification material 41 to impurities in the gas to be processed G1 to form a purified gas G2. The purified gas G2 enters the second exhaust duct 17 through the second through hole 45, flows along the second exhaust duct 17 to the exhaust port 13, and is discharged from the exhaust port 13. In other words, during the purification process, the gas G1 to be processed passes in through the air inlet 11 and sequentially passes through the first purification chamber 20, the first exhaust duct 15, the porous component 60, and the second purification chamber 40 to purify it into Purge gas G2. The purified gas G2 is then discharged through the second exhaust duct 17 and the exhaust port 13.

在淨化過程中,第一噴淋裝置23會朝第一淨化室20內部噴灑洗滌液L,以淋洗待處理氣體G1,致使待處理氣體G1中較大的粒子沉降。淋洗後的洗滌液L經由第一淨化室20底部的第一通孔25落入第一承接槽30。換言之,第一承接槽30能承接來自第一淨化室20的洗滌液L,然後承接到的洗滌液L經由管線排出。同樣地,第二噴淋裝置43會朝第二淨化室40內部噴灑洗滌液L,以淋洗待處理氣體G1。淋洗後的洗滌液L經由第二淨化室40底部的第二通孔45落入第一承接槽30。進一步地,第一噴淋裝置23及第二噴淋裝置43所噴淋的洗滌液L也使得淨化材(第一淨化材21及第二淨化材41)改質再生。 During the purification process, the first spraying device 23 sprays the washing liquid L toward the inside of the first purification chamber 20 to rinse the gas G1 to be processed, causing the larger particles in the gas G1 to settle. After washing, the washing liquid L falls into the first receiving tank 30 through the first through hole 25 at the bottom of the first purification chamber 20. In other words, the first receiving tank 30 can receive the washing liquid L from the first purification chamber 20, and then the received washing liquid L is discharged through the pipeline. Similarly, the second spraying device 43 sprays the washing liquid L toward the inside of the second purification chamber 40 to rinse the gas G1 to be processed. After washing, the washing liquid L falls into the first receiving tank 30 through the second through hole 45 at the bottom of the second purification chamber 40. Further, the washing liquid L sprayed by the first spraying device 23 and the second spraying device 43 also reforms and regenerates the purification materials (the first purification material 21 and the second purification material 41).

在一些實施例中,第一淨化室20可由隔板與殼體10內部連接而圍設出。在一些實施例中,第二淨化室40可由隔板與殼體10內部連接而圍設出。 In some embodiments, the first clean room 20 may be enclosed by a partition and connected to the interior of the casing 10. In some embodiments, the second clean room 40 may be enclosed by a partition and connected to the interior of the casing 10.

在一些實施例中,第一淨化材21及第二淨化材41為多孔性的材質,例如,活性碳、多孔性石墨、多孔性氧化鋁、多孔性氧化鋯等、也可以在上述各種淨化材(第一淨化材21及第二淨化材41)的表面上形成有奈米銀、奈米鈦等塗層。於此,淨化材(第一淨化材21及第二淨化材41)藉由多孔性的特性提供較多的接觸面積以與待處理氣體G1接觸。當待處理氣體G1通入時,淨化材能吸附待處理氣體G1中的雜質、或是與待處理氣體G1中的雜質反應,藉以淨化待處理氣體G1。在一些實施例中,淨化材所吸附的雜質可以為懸浮微粒子、或是酸鹼性物質等。 In some embodiments, the first purification material 21 and the second purification material 41 are porous materials, for example, activated carbon, porous graphite, porous alumina, porous zirconia, etc. The first purification material 21 and the second purification material 41 are formed with a coating layer such as nano silver or nano titanium. Here, the purification materials (the first purification material 21 and the second purification material 41) provide a large contact area for contact with the gas G1 to be processed due to the porous property. When the gas to be processed G1 is passed in, the purification material can adsorb impurities in the gas to be processed G1 or react with the impurities in the gas to be processed G1 to purify the gas to be processed G1. In some embodiments, the impurities adsorbed by the purification material may be suspended fine particles or acid-base substances.

如圖1所示,在一些實施例中,第一噴淋裝置23噴淋洗滌液L的噴淋方向DL與待處理氣體G1通過第一淨化室20的第一進氣方向D1實質上相同,以及第二噴淋裝置43噴淋洗滌液L的噴淋方向DL與待處理氣體G1通過第二淨化室40的第二進氣方向D2實質上相同。換言之,處理氣體G1是由上往下通入淨化室(第一淨化室20或第二淨化室40),洗滌液L是由上往下噴灑,而待處理氣體G1也是由上往下通入淨化室。並且,噴淋方向DL與進氣方向(第一進氣方向D1及第二進氣方向D2)是表示整個氣流及水流的流通方向,而不是單一股氣流的通入或單一噴嘴的噴灑方向,在此僅為示例,而不限於此。 As shown in FIG. 1, in some embodiments, the spray direction DL of the first spray device 23 spraying the washing liquid L is substantially the same as the first intake direction D1 of the gas G1 to be processed through the first purification chamber 20. And the spraying direction DL of the second spraying device 43 spraying the washing liquid L is substantially the same as the second intake direction D2 of the gas G1 to be processed through the second purification chamber 40. In other words, the processing gas G1 is passed into the purification chamber (the first purification chamber 20 or the second purification chamber 40) from the top, the washing liquid L is sprayed from the top, and the gas G1 to be processed is also passed from the top to the bottom. Clean room. In addition, the spray direction DL and the air intake direction (the first air intake direction D1 and the second air intake direction D2) represent the flow direction of the entire air flow and water flow, rather than the flow direction of a single air flow or a single nozzle spray direction, This is only an example and is not limited to this.

由於噴淋方向DL與第一進氣方向D1實質上相同,因此第一淨化材21的孔隙中的洗滌液L能被快速地帶出,而避免洗滌液L殘留於第一淨化材21的孔隙中而影響到吸附的效果。同樣地,由於噴淋方向DL與第二進氣方向D2實質上相同,因此第二淨化材41的孔隙中的洗滌液L能被 快速地帶出,而避免洗滌液L殘留於第二淨化材41的孔隙中而影響到吸附的效果。 Since the spray direction DL is substantially the same as the first intake direction D1, the washing liquid L in the pores of the first purification material 21 can be quickly taken out, and the washing liquid L is prevented from remaining in the pores of the first purification material 21 And affect the effect of adsorption. Similarly, since the spray direction DL is substantially the same as the second intake direction D2, the washing liquid L in the pores of the second purification material 41 can be cleaned. Take it out quickly to avoid the washing liquid L remaining in the pores of the second purification material 41 and affect the adsorption effect.

在一些實施例中,第一噴淋裝置23及第二噴淋裝置43分別透過管線連接控制閥71。控制閥71與洗滌液供應槽連接(圖中未示),以提供洗滌液L給第一噴淋裝置23及第二噴淋裝置43進行噴灑。 In some embodiments, the first spraying device 23 and the second spraying device 43 are respectively connected to the control valve 71 through a pipeline. The control valve 71 is connected to a washing liquid supply tank (not shown), so as to provide the washing liquid L to the first spraying device 23 and the second spraying device 43 for spraying.

在一些實施例中,第一承接槽30及第二承接槽50分別透過管線連接至抽水閥73。抽水閥73將第一承接槽30及第二承接槽50中的洗滌液L抽出。更進一步地,抽水閥73還可以與控制閥71連接,將抽出的洗滌液L再回送,以循環利用洗滌液L。 In some embodiments, the first receiving tank 30 and the second receiving tank 50 are respectively connected to the pumping valve 73 through a pipeline. The suction valve 73 extracts the washing liquid L from the first receiving tank 30 and the second receiving tank 50. Furthermore, the pumping valve 73 may be connected to the control valve 71 to return the extracted washing liquid L to recycle the washing liquid L.

在一些實施例中,待處理氣體G1由進氣口11經第一淨化材21與第二淨化材41至排氣口13的氣體停留時間介於1s~3s。在一些實施例中,氣體淨化裝置1的內部平均風速介於0.2~1m/s之間。可以理解地,此較佳實施例僅作為示例,而不限於此。可以依據氣體淨化裝置1的體積大小、第一淨化材21、第二淨化材41的含量、第一淨化室20及第二淨化室40的空間進行調配。 In some embodiments, the residence time of the gas to be processed G1 from the air inlet 11 through the first purification material 21 and the second purification material 41 to the exhaust port 13 is between 1 s and 3 s. In some embodiments, the average internal wind speed of the gas purification device 1 is between 0.2 and 1 m / s. Understandably, this preferred embodiment is merely an example, and is not limited thereto. It can be adjusted according to the volume of the gas purification device 1, the content of the first purification material 21 and the second purification material 41, and the space of the first purification room 20 and the second purification room 40.

在一些實施例中,氣體淨化裝置1還包含複數個承載板80。承載板80位於第一淨化室20的底部與第一淨化材21之間,以及位於第二淨化室40的底部與第二淨化材41之間。各承載板80包含複數個第三通孔85。進一步地,第三通孔85的孔徑小於第一通孔25的孔徑及第二通孔45的孔徑。承載板80用以承載第一淨化材21或第二淨化材41,避免第一淨化材21或第二淨化材41磨損後產生的碎屑堵塞第一通孔25或第二通孔45。例如,承載板80可以為網板或篩板,在此僅為示例,而不限於此。 In some embodiments, the gas purification device 1 further includes a plurality of carrier plates 80. The carrier plate 80 is located between the bottom of the first purification chamber 20 and the first purification material 21, and between the bottom of the second purification chamber 40 and the second purification material 41. Each carrier plate 80 includes a plurality of third through holes 85. Further, the diameter of the third through hole 85 is smaller than the diameter of the first through hole 25 and the diameter of the second through hole 45. The carrier plate 80 is used to carry the first purification material 21 or the second purification material 41 to prevent debris generated after the first purification material 21 or the second purification material 41 is worn away from blocking the first through hole 25 or the second through hole 45. For example, the carrier plate 80 may be a mesh plate or a sieve plate, which is merely an example and is not limited thereto.

於此,多孔性組件60能調整風速、風量,避免風量過大、或是不均勻,避免第二淨化材41受到過大風量、或是不均的風向而偏移, 進而造成氣體淨化的不平均。 Here, the porous component 60 can adjust the wind speed and air volume, avoid excessive air volume or unevenness, and prevent the second purification material 41 from being offset by excessive air volume or uneven wind direction. This causes uneven gas purification.

圖2為氣體淨化裝置第二實施例的剖面示意圖。在一些實施例中,多孔性組件60為多孔性板材61,如圖1所示,但不限於此。於此,可透過調整多孔性板材61的孔隙65的大小來調整通入的入風量及風速。在另一些實施例中,多孔性組件60為多孔性風道63,如圖2所示。多孔性風道63包含孔隙65以及導流件67,且孔隙65形成於導流件67上。於此,可透過孔隙65及導流件67可以改變入風的方向、風量、以及風速。 FIG. 2 is a schematic cross-sectional view of a second embodiment of a gas purification device. In some embodiments, the porous component 60 is a porous plate 61, as shown in FIG. 1, but is not limited thereto. Here, by adjusting the size of the pores 65 of the porous plate material 61, the amount of incoming air and the wind speed can be adjusted. In other embodiments, the porous component 60 is a porous air duct 63, as shown in FIG. 2. The porous air duct 63 includes a pore 65 and a flow guide 67, and the pore 65 is formed in the flow guide 67. Here, the direction, the amount of wind, and the wind speed can be changed through the aperture 65 and the air guide 67.

如圖1所示,在一些實施例中,進氣口11及排氣口13分別位於殼體10的頂部與底部,然此僅為示例,並不限於此。 As shown in FIG. 1, in some embodiments, the air inlet 11 and the air outlet 13 are respectively located at the top and the bottom of the casing 10, but this is merely an example and is not limited thereto.

圖3為氣體淨化裝置第三實施例的剖面示意圖。如圖3所示,在另一些實施例中,氣體淨化裝置1的進氣口11是位於左上側,而排氣口13是位於右下側,但此僅為示例,而不限於此,實際上可以依據風速、風量及進氣的位置進行調整。 FIG. 3 is a schematic cross-sectional view of a third embodiment of the gas purification device. As shown in FIG. 3, in other embodiments, the air inlet 11 of the gas purification device 1 is located on the upper left side, and the air outlet 13 is located on the lower right side, but this is only an example and is not limited to this. It can be adjusted according to the wind speed, air volume and the position of the intake air.

在一些實施例中,第一淨化室20與第二淨化室40可為上下設置的排列方式,如圖1及圖2所示。於此些實施例中,換言之,第一淨化室20與第二淨化室40大致呈縱向垂直的方式設置,但不限於位於同一鉛直線上的排列方式。在另一些實施例中,第一淨化室20與第二淨化室40可為左右設置的排列方式,如圖3所示。換言之,第一淨化室20與第二淨化室40大致水平排列,但不限於同一水平高度。 In some embodiments, the first clean room 20 and the second clean room 40 may be arranged vertically, as shown in FIGS. 1 and 2. In other words, in other words, the first purification chamber 20 and the second purification chamber 40 are arranged substantially vertically, but are not limited to the arrangement on the same lead line. In other embodiments, the first purification chamber 20 and the second purification chamber 40 may be arranged left and right, as shown in FIG. 3. In other words, the first clean room 20 and the second clean room 40 are arranged substantially horizontally, but are not limited to the same horizontal height.

上述圖1-3中第一淨化室20、第二淨化室40的排列方式僅為示例,並非用以限制。然而,無論是哪種排列方式,都須使得待處理氣體G1通過第一淨化室20的第一進氣方向D1與通過第二淨化室40的第二進氣方向D2均與其洗滌液L的噴淋方向DL同向。如此能避免因為氣流阻礙水流排出造成淨化材無法充分乾燥(淨化材的孔隙被洗滌液L所填滿)而 影響第一淨化材21及第二淨化材41吸附待處理氣體G1中的效果。 The arrangement of the first clean room 20 and the second clean room 40 in the above FIGS. 1-3 is merely an example, and is not intended to be limiting. However, regardless of the arrangement, the gas G1 to be processed must pass through the first intake direction D1 of the first purification chamber 20 and the second intake direction D2 through the second purification chamber 40, as well as the spray of the washing liquid L thereof. The direction of the DL is the same. In this way, it can be avoided that the purification material cannot be fully dried because the air flow hinders the discharge of the water (the pores of the purification material are filled with the washing liquid L), and It affects the effect of the first purification material 21 and the second purification material 41 on the gas G1 to be processed.

在一些實施例中,於第一淨化室20與第二淨化材41為左右設置的排列方式時,第一承接槽30、第二承接槽50可以由隔板與殼體10的內部共同圍設出,如圖3所示。 In some embodiments, when the first purification chamber 20 and the second purification material 41 are arranged side by side, the first receiving tank 30 and the second receiving tank 50 may be jointly surrounded by a partition and the inside of the casing 10 Out, as shown in Figure 3.

在一些實施例中,第一淨化室20的頂部的寬度較進氣口11的口徑寬。藉由此結構設計,待處理氣體G1進入第一淨化室20後風速會降低,可以避免風量過大及過於集中,能避免因為衝擊造成對第一淨化材21的偏移,而造成淨化的效率降低,或是淨化的不平均。 In some embodiments, the width of the top of the first purification chamber 20 is wider than the diameter of the air inlet 11. With this structural design, the wind speed of the gas G1 to be processed after entering the first purification chamber 20 is reduced, which can avoid excessive air volume and excessive concentration, and can avoid the deviation of the first purification material 21 caused by the impact, resulting in a reduction in purification efficiency , Or uneven purification.

在一些實施例中,如圖3所示,氣體淨化裝置1更包含另一多孔性組件60’。多孔性組件60’設置於第一淨化室20的頂部,且位於進氣口11與第一噴淋裝置之23間。於此,雖然以圖3示範性圖示設置於第一淨化室20的頂部的多孔性組件60’,但淨化室的排列方式並非本發明之限制,例如,在圖1、2所示的上下設置的排列方式之氣體淨化裝置1中,第一淨化室20的頂部與進氣口11之間也可以增設另一多孔性組件60’,以調整由進氣口11進入第一淨化室20的風速及風量。 In some embodiments, as shown in FIG. 3, the gas purification device 1 further includes another porous component 60 '. The porous component 60 'is disposed on the top of the first purification chamber 20, and is located between the air inlet 11 and the first spray device 23. Here, although the porous components 60 ′ provided on the top of the first purification chamber 20 are exemplarily shown in FIG. 3, the arrangement of the purification chambers is not limited by the present invention. For example, In the arranged gas purification device 1, another porous component 60 ′ may also be added between the top of the first purification chamber 20 and the air inlet 11 to adjust the entry of the first purification room 20 from the air inlet 11. Wind speed and volume.

在一些實施例中,此多孔性組件60’能調整風速、風量,避免風量過大、或是不均勻,避免第一淨化材21到過大風量、或是不均的風向而偏移,進而造成氣體淨化的不平均。在一些實施例中,此多孔性組件60’可為多孔性板材(如圖3所示)或多孔性風道(例如,應用圖2中的多孔性風道60於多孔性組件60’處)。 In some embodiments, the porous component 60 ′ can adjust the wind speed and air volume, avoid excessive or uneven air volume, and prevent the first purification material 21 from shifting to an excessively large air volume or uneven wind direction, thereby causing gas. Uneven purification. In some embodiments, the porous component 60 ′ may be a porous plate (as shown in FIG. 3) or a porous air duct (for example, the porous air duct 60 in FIG. 2 is applied at the porous component 60 ′). .

圖4為氣體淨化裝置第四實施例的剖面示意圖。雖然圖1-3示範性圖示氣體淨化裝置1包含二個淨化室(第一淨化室20及第二淨化室40),然而,若場域的空間許可,氣體淨化裝置1可包含三個或更多個淨化室。換言之,第一淨化室20及第二淨化室40之間可進一步設置一個或多 個第三淨化室110如圖4所示。在一些實施例中,如圖4所示,氣體淨化裝置1可更包含第三淨化室110、第三承接槽120、複數個第三淨化材111、第三噴淋裝置113以及多孔性組件60。第三淨化室110及第三承接槽120位於殼體10中,且位於第一淨化室20與第二淨化室40之間。同樣地,第三淨化室110位於殼體10中。第三淨化室110的底部包含通孔115。第三淨化材111位於第三淨化室111中。第三噴淋裝置113位於第三淨化室111中,且位於多孔性組件60與第三淨化材111之間。第三承接槽120位於殼體10中,且位於第三淨化室110的下方。多孔性組件60設置於第三淨化室110的頂部,用以調整通入之待處理氣體G1的風速及風量,以避免第三淨化材111偏移導致淨化效率的降低。 FIG. 4 is a schematic cross-sectional view of a fourth embodiment of the gas purification device. Although FIGS. 1-3 exemplarily show that the gas purification device 1 includes two purification rooms (the first purification room 20 and the second purification room 40), if space of the field permits, the gas purification device 1 may include three or More clean rooms. In other words, one or more may be further provided between the first purification chamber 20 and the second purification chamber 40. Three third purification chambers 110 are shown in FIG. 4. In some embodiments, as shown in FIG. 4, the gas purification device 1 may further include a third purification chamber 110, a third receiving tank 120, a plurality of third purification materials 111, a third spraying device 113, and a porous component 60. . The third purification chamber 110 and the third receiving tank 120 are located in the casing 10, and are located between the first purification chamber 20 and the second purification chamber 40. Similarly, the third clean room 110 is located in the casing 10. The bottom of the third purification chamber 110 includes a through hole 115. The third purification material 111 is located in the third purification chamber 111. The third shower device 113 is located in the third purification chamber 111 and is located between the porous component 60 and the third purification material 111. The third receiving tank 120 is located in the casing 10 and is located below the third purification chamber 110. The porous component 60 is disposed on the top of the third purification chamber 110, and is used to adjust the wind speed and volume of the gas G1 to be processed to prevent the third purification material 111 from shifting and reducing the purification efficiency.

在一些實施例中,如圖4所示,第三淨化室110透過第一排風道15與第一淨化室20的底部連通、又第三淨化室110的外側、第二承接槽120上方的空間、及殼體10之間相互連通形成第三排風道117。第三淨化室110通過通孔115連通第三排風道117,又第二淨化室40的頂端及底端分別連通第三排風道117及第二排風道17連通排氣口13。以上僅為示例,氣體淨化裝置1也可設置更多的淨化室及承接槽。 In some embodiments, as shown in FIG. 4, the third purification chamber 110 communicates with the bottom of the first purification chamber 20 through the first exhaust duct 15, and is outside the third purification chamber 110 and above the second receiving groove 120. The space and the casing 10 communicate with each other to form a third exhaust duct 117. The third purification chamber 110 communicates with the third exhaust duct 117 through the through hole 115, and the top and bottom ends of the second purification chamber 40 communicate with the third exhaust duct 117 and the second exhaust duct 17 communicate with the exhaust port 13 respectively. The above is merely an example, and the gas purification device 1 may be provided with more purification chambers and receiving tanks.

在一些實施例中,第一淨化室20、第三淨化室110與第二淨化室40是採上下設置的排列方式依序配置(如圖4所示),然而,此僅為示例,而不限於此。例如,第一淨化室20、第三淨化室110與第二淨化室40也可以如圖3之實施例採左右設置的排列方式依序配置。唯,待處理氣體G1通入各淨化室的進氣方向,例如,通入第一淨化室20的第一進氣方向D1、通入第二淨化室40的第二進氣方向D2以及通入第三淨化室20的第三進氣方向D3,都需與其中洗滌液L的噴淋方向DL同向。 In some embodiments, the first clean room 20, the third clean room 110, and the second clean room 40 are sequentially arranged in an arranged manner (as shown in FIG. 4), however, this is only an example, and not Limited to this. For example, the first clean room 20, the third clean room 110, and the second clean room 40 may also be sequentially arranged in an arrangement manner arranged left and right as in the embodiment of FIG. However, the intake direction of the gas G1 to be processed into each purification chamber, for example, the first intake direction D1 to the first purification chamber 20, the second intake direction D2 to the second purification chamber 40, and the intake direction The third intake direction D3 of the third purification chamber 20 needs to be in the same direction as the spray direction DL of the washing liquid L therein.

圖5為氣體淨化裝置第五實施例的剖面示意圖。在一些實施 例中,如圖5所示,氣體淨化裝置1可更包含預熱單元90。預熱單元90位於進氣口11,並且用以預熱經由進氣口11通入第一淨化室20的待處理氣體G1。預熱單元90可以減少待處理氣體G1的濕度,進一步地,預熱後的待處理氣體G1能用以烘乾第一淨化材21、第二淨化材41。如此,能使殘存於第一淨化材21或第二淨化材41中孔隙中的洗滌液L受熱揮發,以加速淨化材的乾燥,進而提升了吸附效果。圖5所示之氣體淨化裝置1僅為示例預熱單元90的設置位置,換言之,預熱單元90亦可安裝於圖1至圖4所示之氣體淨化裝置1的進氣口11。 FIG. 5 is a schematic cross-sectional view of a fifth embodiment of a gas purification device. In some implementations For example, as shown in FIG. 5, the gas purification device 1 may further include a preheating unit 90. The preheating unit 90 is located at the air inlet 11 and is used for preheating the gas G1 to be processed that is passed into the first purification chamber 20 through the air inlet 11. The preheating unit 90 can reduce the humidity of the gas G1 to be processed. Further, the preheated gas G1 can be used to dry the first purification material 21 and the second purification material 41. In this way, the washing liquid L remaining in the pores in the first purification material 21 or the second purification material 41 can be heated and volatilized to accelerate the drying of the purification material, thereby improving the adsorption effect. The gas purification device 1 shown in FIG. 5 is only an example of the installation position of the preheating unit 90. In other words, the preheating unit 90 may also be installed at the air inlet 11 of the gas purification device 1 shown in FIGS. 1 to 4.

以上各實施例的氣體淨化裝置,透過維持處理氣體的進氣方向與洗滌液的噴淋方向一致,能避免洗滌液殘存於淨化材的孔隙中,而提升了吸附效果。此外,氣體淨化裝置透過設置多孔性組件來調整進入第二淨化室的風量,避免氣流擾動,從而能夠維持第一淨化材、第二淨化材不易偏移,並使受到的氣體壓力平均,也使得吸附及淨化效果能更為均勻。 The gas purification devices of the above embodiments can prevent the washing liquid from remaining in the pores of the purification material by maintaining the intake direction of the processing gas and the spraying direction of the washing liquid to improve the adsorption effect. In addition, the gas purification device adjusts the amount of air entering the second purification chamber by setting a porous component to avoid disturbance of the air flow, so that the first purification material and the second purification material can not be easily shifted, and the pressure of the gas received is evened. The adsorption and purification effect can be more uniform.

雖然已經結合目前被認為是實用的示例性實施例描述了本發明,但是應當理解,本發明不限於所公開的實施例,而是相反,旨在適用於各種修改和等同佈置包括在所附權利要求的精神和範圍內。 Although the invention has been described in connection with exemplary embodiments that are presently considered to be practical, it should be understood that the invention is not limited to the disclosed embodiments, but rather, is intended to be applicable to various modifications and equivalent arrangements included in the appended claims Within the spirit and scope required.

1‧‧‧氣體淨化裝置 1‧‧‧Gas purification device

10‧‧‧殼體 10‧‧‧shell

11‧‧‧進氣口 11‧‧‧air inlet

13‧‧‧排氣口 13‧‧‧ exhaust port

15‧‧‧第一排風道 15‧‧‧The first exhaust duct

17‧‧‧第二排風道 17‧‧‧Second Exhaust Duct

20‧‧‧第一淨化室 20‧‧‧The first clean room

21‧‧‧第一淨化材 21‧‧‧The first purification material

23‧‧‧第一噴淋裝置 23‧‧‧The first spray device

25‧‧‧第一通孔 25‧‧‧First through hole

30‧‧‧第一承接槽 30‧‧‧The first receiving trough

40‧‧‧第二淨化室 40‧‧‧Second Purification Room

41‧‧‧第二淨化材 41‧‧‧Second purification material

43‧‧‧第二噴淋裝置 43‧‧‧Second spray device

45‧‧‧第二通孔 45‧‧‧Second through hole

50‧‧‧第二承接槽 50‧‧‧Second receiving trough

60‧‧‧多孔性組件 60‧‧‧ porous component

61‧‧‧多孔性板材 61‧‧‧ porous sheet

65‧‧‧孔隙 65‧‧‧ Pore

71‧‧‧控制閥 71‧‧‧Control Valve

73‧‧‧抽水閥 73‧‧‧pump valve

80‧‧‧承載板 80‧‧‧carrying plate

85‧‧‧第三通孔 85‧‧‧Third through hole

DL‧‧‧噴淋方向 DL‧‧‧Spray direction

D1‧‧‧第一進氣方向 D1‧‧‧First intake direction

D2‧‧‧第二進氣方向 D2‧‧‧Second intake direction

G1‧‧‧待處理氣體 G1‧‧‧Gas to be processed

G2‧‧‧淨化氣體 G2‧‧‧purified gas

L‧‧‧洗滌液 L‧‧‧washing liquid

Claims (11)

一種氣體淨化裝置,包含: 一殼體,包含一進氣口及一排氣口; 一第一淨化室,位於該殼體中,該第一淨化室的頂部連通該進氣口,該第一淨化室底部具有複數個第一通孔; 一第一承接槽,位於該殼體中,且位於該第一淨化室的下方,其中該第一淨化室的外側、該第一承接槽、及該殼體之間形成一第一排風道,該第一淨化室通過該等第一通孔連通該第一排風道; 一第二淨化室,位於該殼體中,該第二淨化室的頂部連通該第一排風道,該第二淨化室的底部包含複數個第二通孔; 一第二承接槽,位於該殼體中,且位於該第二淨化室的下方,其中該第二淨化室的外側、該第二承接槽、及該殼體之間形成一第二排風道,該第二淨化室通過該等第二通孔連通該第二排風道,該第二排風道連通該排氣口; 一多孔性組件,設置於該第二淨化室的頂部; 複數個第一淨化材,位於該第一淨化室中; 一第一噴淋裝置,位於該第一淨化室中,且位於該進氣口與該等第一淨化材之間; 複數個第二淨化材,位於該第二淨化室中;以及 一第二噴淋裝置,位於該第二淨化室中,且位於該多孔性組件與該等第二淨化材之間。A gas purification device includes: a casing including an air inlet and an exhaust port; a first purification chamber located in the casing; the top of the first purification chamber communicates with the air inlet, and the first The bottom of the clean room has a plurality of first through holes; a first receiving groove is located in the housing and is located below the first clean room, wherein the outside of the first clean room, the first receiving groove, and the A first exhaust duct is formed between the casings, and the first purification chamber communicates with the first exhaust duct through the first through holes; a second purification chamber is located in the casing, and the second purification chamber The top communicates with the first exhaust duct, and the bottom of the second purification chamber includes a plurality of second through holes; a second receiving groove is located in the housing and is located below the second purification chamber, wherein the second A second air exhaust duct is formed between the outside of the clean room, the second receiving groove, and the casing. The second clean room communicates with the second air exhaust channel through the second through holes, and the second air exhaust A passage communicates with the exhaust port; a porous component is disposed on the top of the second purification chamber; a plurality of A first purification material is located in the first purification room; a first spraying device is located in the first purification room and between the air inlet and the first purification materials; a plurality of second purification materials Is located in the second purification chamber; and a second spraying device is located in the second purification chamber and between the porous component and the second purification materials. 如請求項1所述之氣體淨化裝置,其中該第一噴淋裝置及該第二噴淋裝置噴淋一洗滌液的一噴淋方向與一待處理氣體進入該第一淨化室的一第一進氣方向、以及該待處理氣體進入該第二淨化室的一第二進氣方向實質上相同,該洗滌液通過該等第一淨化材及該等第一通孔進入該第一承接槽,且通過該等第二淨化材及該等第二通孔進入該第二承接槽,該待處理氣體由該進氣口通過依序經過該第一淨化室、該第一排風道、該多孔性組件、該第二淨化室、該第二排風道,由該排氣口排出。The gas purification device according to claim 1, wherein the first spraying device and the second spraying device spray a spraying direction of a washing liquid and a first The air inlet direction and a second air inlet direction of the gas to be processed entering the second purification chamber are substantially the same, and the washing liquid enters the first receiving tank through the first purification materials and the first through holes, And enters the second receiving tank through the second purification materials and the second through holes, and the gas to be processed passes through the first purification chamber, the first exhaust duct, the perforation through the air inlet in order. The exhaust module, the second purification chamber, and the second exhaust duct are discharged from the exhaust port. 如請求項2所述之氣體淨化裝置,其中該待處理氣體由該進氣口經該第一淨化材至該第二淨化材至該排氣口氣體停留時間介於1s~3s,且內部平均風速介於0.2~1m/s之間。The gas purification device according to claim 2, wherein the gas to be processed passes from the air inlet through the first purification material to the second purification material to the exhaust gas, and the gas residence time is between 1s and 3s, and the internal average The wind speed is between 0.2 ~ 1m / s. 如請求項1所述之氣體淨化裝置,更包含複數個承載板,該等承載板位於該第一淨化室的底部與該等第一淨化材之間,以及該第二淨化室的底部與該等第二淨化材之間,且各該承載板包含複數個第三通孔。The gas purification device according to claim 1, further comprising a plurality of carrier plates, the carrier plates are located between the bottom of the first purification chamber and the first purification material, and the bottom of the second purification chamber and the Waiting between the second purification materials, and each of the carrier plates includes a plurality of third through holes. 如請求項4所述之氣體淨化裝置,其中該等第三通孔的孔徑小於該等第一通孔及該等第二通孔。The gas purification device according to claim 4, wherein the diameters of the third through holes are smaller than the first through holes and the second through holes. 如請求項1所述之氣體淨化裝置,其中該多孔性組件為一多孔性板材。The gas purification device according to claim 1, wherein the porous component is a porous plate. 如請求項1所述之氣體淨化裝置,其中該多孔性組件為一多孔性風道。The gas purification device according to claim 1, wherein the porous component is a porous air duct. 如請求項1所述之氣體淨化裝置,更包含另一多孔性組件,設置於該第一淨化室的頂部,位於該進氣口與該第一噴淋裝置之間。The gas purification device according to claim 1, further comprising another porous component, which is disposed on the top of the first purification chamber and is located between the air inlet and the first spray device. 如請求項1所述之氣體淨化裝置,其中該第一淨化室及該第二淨化室為上下設置。The gas purification device according to claim 1, wherein the first purification room and the second purification room are arranged vertically. 如請求項1所述之氣體淨化裝置,其中該第一淨化室及該第二淨化室為左右設置。The gas purification device according to claim 1, wherein the first purification room and the second purification room are arranged left and right. 如請求項1所述之氣體淨化裝置,更包含一預熱單元,該預熱單元位於該進氣口且用以預熱經由該進氣口通入該第一淨化室的一待處理氣體。The gas purification device according to claim 1, further comprising a pre-heating unit, which is located at the air inlet and is used to pre-heat a gas to be processed that flows into the first purification chamber through the air inlet.
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