TWI613943B - Method for manufacturing wafer fixed structure - Google Patents

Description

Method for manufacturing wafer fixed structure

The present invention relates to the manufacture of a circuit board, and more particularly to a method of fabricating a wafer fixing structure.

As the resolution of displays has increased, the industry has proposed using a light-emitting diode as a pixel of a display. However, each pixel requires a light-emitting diode of three colors of red, blue, and green, and the higher the resolution, the higher the pixel density of the display. Therefore, for a high-resolution display, a very high-density light emission is required. Diode array.

In the face of such a high-density LED array used in a light-emitting diode array, how to produce a circuit board in an efficient manner has been an urgent problem to be solved in the art.

In view of the above-described deficiencies, it is an object of the present invention to provide a means of efficiently manufacturing a circuit board.

To achieve the above object, a method of fabricating a wafer fixing structure of the present invention comprises the following steps: First, a circuit board is provided. The circuit board includes a substrate, a plurality of conductive pads, and a plurality of insulating blocks. The conductive pads and the insulating blocks are formed on the substrate. The insulating blocks are located between the adjacent conductive pads. Next, a peelable film is formed on the surface of the substrate, the conductive pads, and the insulating blocks. Then, a plurality of openings are formed. The openings penetrate the peelable film and are connected to the conductive pads one-to-one. Then, a plurality of conductive blocks are formed. The conductive blocks are connected to the conductive pads and are located in the openings. Finally, the peelable film is removed.

Therefore, the method of fabricating the wafer fixing structure of the present invention can efficiently form corresponding conductive blocks on the conductive pads of the circuit board.

Detailed steps and features of the method for fabricating the wafer fixing structure provided by the present invention will be described in the detailed description of the subsequent embodiments. However, in the present invention The detailed description and specific examples of the invention are intended to be illustrative of the invention and are not intended to limit the scope of the invention.

10‧‧‧ boards

11‧‧‧Substrate

13‧‧‧Electrical gasket

15‧‧‧Insulation block

20‧‧‧ peelable film

17‧‧‧ openings

30‧‧‧Electrical block

50‧‧‧Conductive adhesive

70‧‧‧ Dispenser

1A-1E is a flow chart showing a method of manufacturing the wafer fixing structure of the present invention.

Figure 2 is a schematic view showing the formation of the conductive blocks.

Figure 3 is a schematic diagram of the formation of the conductive blocks.

Hereinafter, the steps and the achievement of the method for manufacturing the wafer fixing structure of the present invention will be described with reference to the preferred embodiments of the drawings. The components, components, dimensions, and appearance of the circuit boards in the various figures are only used to illustrate the technical features of the present invention, and are not intended to limit the present invention.

1A to 1E are flowcharts showing a method of manufacturing the wafer fixing structure of the present invention, and the steps of the method of manufacturing the wafer fixing structure of the present invention are described in detail later.

As shown in FIG. 1A, first, a circuit board 10 is provided. The circuit board 10 includes a substrate 11, a plurality of conductive pads 13, and a plurality of insulating blocks 15. The substrate may be hard or flexible, and the material of the substrate may be glass, acrylic, etc., but not limited thereto. The conductive pads and the insulating blocks are formed on a circuit board. The insulating blocks are formed between the adjacent conductive pads.

As shown in FIG. 1B, a peelable film 20 is formed on the surface of the substrate 11, the conductive pads 13, and the insulating blocks 15. The peelable film 20 is attached to the substrate 11, the conductive pads 13, and the surfaces of the insulating blocks 15. The peelable film 20 may be a spin-on photoresist or a variety of polymeric materials.

As shown in Fig. 1C, a plurality of openings 17 are then formed. The openings 17 are formed through the peelable film 20 and communicate with the conductive pads 13 one-to-one. In this embodiment, the opening 17 is formed using laser processing. The processing equipment is a high-speed scanning device for high-speed scanning, and a laser beam with a repetition rate above the MHz level to increase the rate at which the laser beam is processed.

As shown in FIG. 1D, next, a plurality of conductive blocks 30 are formed, the conductive blocks 30. The conductive pads 13 are connected and located in the openings 17. Finally, as shown in FIG. 1E, the peelable film 20 is removed to form the wafer holding structure of the present invention. The shape of the conductive block 30 is not limited to the figure.

Thus, the conductive pad 30 is formed on the conductive pad 13 of the circuit board 10, and then the light emitting diode (LED) wafer can be fixed on the conductive block 30 by transfer or the like to make the LED chip and the conductive pad 13 Form an electrical connection.

Although the foregoing method of forming the opening is performed by laser light, it is also advantageous to expose the developing method, that is, to use a photomask having a pattern of a conductive pad corresponding to the circuit board, and irradiating the mask with UV light. Corresponding openings are formed on the peelable film. In addition, the manner in which the openings are formed is not limited to these two methods.

The manner in which the conductive blocks are formed is described in two ways, namely, FIG. 2 and FIG. 3, respectively, and the steps of forming are detailed later.

As shown in FIG. 2, first, a conductive paste 50 is applied to the surface of the peelable film 20. Next, the conductive paste 50 is pushed to cause the conductive paste 50 to flow into the openings 17; finally, the conductive paste 50 forms the conductive blocks in the openings 17. Wherein, the conductive paste 50 is pushed to cause the conductive paste 50 to flow into the respective openings 17 by the doctor blade 60.

As shown in FIG. 3, the conductive blocks may also be formed by dispensing. The dispensing method refers to the use of a dispenser 70, and the openings 17 are filled with a conductive paste 50, and the conductive paste 50 is at the openings 17 The conductive blocks are formed therein.

Due to the peelable film, when any kind of glue is filled into the opening, the conductive adhesive remaining on the surface of the peelable film can be separated from the circuit board after being removed, and does not remain on the circuit board to affect its electricity. Sexual function.

The conductive paste can naturally form a solid state at a normal temperature environment. The conductive paste includes a resin and nano conductive particles. The composite resin means an epoxy resin or the like. The nano conductive particles refer to particles or powders that can be electrically conductive, and may be at least one of gold, silver, copper, aluminum, zinc, iron, nickel, and graphite, that is, the nano conductive particles may be a single material metal. Granular or composite metal particles. In short, the conductive paste may be silver glue, gold glue, aluminum glue or the like, and the conductive glue includes a hardener, a catalyst and the like in addition to the above two main components.

Thus, the method of fabricating the wafer fixing structure of the present invention can efficiently be in the circuit A conductive block is formed on the conductive sheet of the board to subsequently secure the wafer to the conductive block.

Finally, it is emphasized that the constituent elements disclosed in the foregoing embodiments are merely illustrative and are not intended to limit the scope of the present invention. The alternatives or variations of other equivalent elements are also covered by the scope of the patent application of the present application. .

10‧‧‧ boards

11‧‧‧Substrate

13‧‧‧Electrical gasket

15‧‧‧Insulation block

30‧‧‧Electrical block

Claims (8)

A method for manufacturing a wafer fixing structure, comprising the steps of: providing a circuit board, the circuit board comprising a substrate, a plurality of conductive pads and a plurality of insulating blocks, wherein the conductive pads and the insulating blocks are formed on the substrate The insulating blocks are located between the adjacent conductive pads; a peelable film is formed on the surface of the substrate, the conductive pads and the insulating blocks; and a plurality of openings are formed, the openings are The peelable film is connected to the conductive pads one-to-one; a plurality of conductive blocks are formed, the conductive blocks are connected to the conductive pads, and are located in the openings; and the peelable film is removed. The method of manufacturing a wafer fixing structure according to claim 1, wherein the openings are formed by one of laser light and exposure development. The method for manufacturing a wafer fixing structure according to claim 1, wherein the forming the conductive blocks comprises the steps of: applying a conductive paste on a surface of the peelable film; pushing the conductive paste to cause the conductive adhesive to flow in And the conductive paste forms the conductive blocks in the openings. The method of manufacturing a wafer fixing structure according to claim 3, wherein the conductive paste comprises a resin and nano conductive particles. The method for manufacturing a wafer fixing structure according to claim 1, wherein the forming the conductive blocks comprises: filling the openings with a conductive paste, and the conductive paste forms the conductive blocks in the openings; The method of manufacturing a wafer fixing structure according to claim 5, wherein the conductive paste comprises a resin and nano conductive particles. The method for manufacturing a wafer fixing structure according to claim 4 or 6, wherein The rice conductive particles include at least one of gold, silver, copper, aluminum, zinc, iron, nickel, and graphite. The method of manufacturing a wafer fixing structure according to claim 1, wherein the substrate is flexible.