TWI613742B - Flexible circuit connection architecture with display interface and manufacturing method thereof - Google Patents

Description

Flexible circuit connection architecture with display interface and manufacturing method thereof

The invention relates to a flexible circuit board, in particular to a flexible circuit connection structure with a display interface and a manufacturing method thereof.

Flexible Printed Circuit (FPC), also known as flexible printed circuit board, flexible circuit board, flexible board, etc., is printed on a flexible substrate and used as a transmission medium for electronic product signals. The utility model has the advantages of light weight, thin thickness, softness and flexibility, and is widely used in mobile phones, notebook computers, PDAs, digital cameras, liquid crystal displays and the like.

A flexible printed circuit board and touch screen panel apparatus having the same, which includes a transparent substrate, a plurality of sensing electrodes, a front side surface pad unit, a non-sensing electrode, and a a rear surface spacer unit and a flexible printed circuit board, the transparent substrate includes a first surface and a second surface opposite to the first surface, the sensing electrodes are disposed on the first surface, the front side a surface pad unit is connected to the sensing electrodes, the non-sensing electrode is disposed on the second surface, the back side surface pad unit is connected to the non-sensing electrode, and the flexible printed circuit board includes a connection a first gasket unit of the front side surface gasket unit, and a second gasket unit connected to the rear side surface gasket unit.

Although flexible circuit boards are widely used in electronics-related industries, when they are connected to other electronic components, such as display panels, touch panels, and driver boards, they tend to occur at the joints due to their flexible structural characteristics. The fracture or electrical connection is incomplete, and the component is not working properly. Therefore, how to prevent the joint at the joint from breaking is the goal of the relevant industry.

The main object of the present invention is to solve the problem that the contact between the flexible circuit board and other components is easily broken or the electrical connection is incomplete.

To achieve the above objective, the present invention provides a flexible circuit connection structure with a display interface, comprising a transparent flexible substrate, a transparent conductive layer, a liquid crystal layer, a patterned metal conductive layer, an arithmetic processing component, and a power supply member. The transparent conductive layer is disposed on one side of the transparent flexible substrate, and includes a display portion and a patterned circuit connecting portion adjacent to the display portion, the liquid crystal layer is disposed on the transparent conductive layer away from the transparent flexible One side of the substrate and corresponding to the display portion, the patterned metal conductive layer is disposed on a side of the transparent conductive layer away from the transparent flexible substrate and has a shape corresponding to the patterned circuit connection portion, and the operation processing element is electrically connected The patterned metal conductive layer is electrically connected to the patterned metal conductive layer.

To achieve the above objective, the present invention further provides a method for fabricating a flexible circuit connection architecture with a display interface, comprising the following steps:

S1: sequentially forming a transparent conductive layer and a metal conductive layer on a transparent flexible substrate, the transparent conductive layer comprising a display portion and a circuit connecting portion adjacent to the display portion;

S2: etching the metal conductive layer on the display portion to expose the display portion, and etching the circuit connection portion and the metal conductive layer on the circuit connection portion to make the circuit connection portion and the metal The conductive layers respectively form a patterned circuit connection portion and a patterned metal conductive layer;

S3: forming a liquid crystal layer on the display portion, and electrically connecting an arithmetic processing component and a power supply member to the patterned metal conductive layer;

In summary, the transparent conductive layer is directly formed on the transparent flexible substrate, and the patterned metal conductive layer is directly formed on the transparent conductive layer, so that the adhesion between the transparent conductive layer is strong. Moreover, there is no occurrence of a contact, and therefore, the problem that the patterned metal conductive layer or the transparent conductive layer is broken and the component cannot be used when the invention is bent can be prevented.

The detailed description and technical content of the present invention will now be described as follows:

Referring to FIG. 1A, FIG. 1B and FIG. 2, the present invention is a flexible circuit connection structure with a display interface, comprising a transparent flexible substrate 10, a transparent conductive layer 20, and a liquid crystal layer 30. a patterned metal conductive layer 41, an arithmetic processing element 60, and a power supply member 70. The transparent flexible substrate 10 may be made of polyimide (PI) or polyethylene terephthalate. (Polyethylene terephthalate, abbreviated as PET), polycarbonate (Polycarbonate, PC for short), Triacetyl cellulose (TAC), Cyclic Olefin Copolymer (COC, Cyclic Olefin Polymer, COP for short) Polyethylene naphthalate (PEN), glass or a combination thereof, and the transparent conductive layer 20 is disposed on one side of the transparent flexible substrate 10 and includes a display portion 21 and an adjacent portion The patterning circuit connecting portion 23 of the display portion 21 may be made of a metal oxide such as indium tin oxide, zinc oxide, tin oxide oxide, aluminum zinc oxide, zinc gallium oxide, or a combination thereof.

The liquid crystal layer 30 is disposed on a side of the transparent conductive layer 20 away from the transparent flexible substrate 10 and corresponds to the display portion 21 . The patterned metal conductive layer 41 is disposed on the transparent conductive layer 20 away from the transparent flexible substrate 10 . One of the side and shape corresponds to the patterning circuit connecting portion 23, and the material thereof may be a conductive metal such as copper, and the arithmetic processing element 60 is electrically connected to the patterned metal conductive layer 41, and the power supply member 70 is The patterned metal conductive layer 41 is electrically connected to provide the required power. Thereby, the transparent conductive layer 20 is directly formed on the transparent flexible substrate 10 and the patterned metal conductive layer 41 is directly formed on the transparent conductive layer 20, and no contact can be formed, thereby preventing the bending. The patterned metal conductive layer 41 or the transparent conductive layer 20 is broken to make the component unusable.

In this embodiment, the liquid crystal layer 30 has a plurality of liquid crystals 31, and each of the liquid crystals 31 has a black display portion 312 and a white display portion 311, and in actual assembly, the liquid crystal layer 30 is further away from the The transparent flexible substrate 10 is provided with an electrode layer (not shown), thereby generating an electric field corresponding to the transparent conductive layer 20, so that the liquid crystals 31 are turned over at corresponding positions. When operating, the power supply member 70 provides the same. Power, the operation processing component 60 is operated to transmit a signal, and the transparent conductive layer 20 and the electrode layer receive the signal to generate a corresponding electric field, thereby causing the liquid crystals 31 to be flipped at corresponding positions. A number or symbol corresponding to the signal, and so on.

Continuing with the reference to FIG. 3 and FIG. 4A to FIG. 4D, the manufacturing process of the present embodiment is as follows. The material of each component is as described above, and will not be further described herein. The manufacturing steps of this embodiment are as follows:

S1: As shown in FIG. 4A and FIG. 4B, a transparent conductive layer 20 is formed on a transparent flexible substrate 10, and then a metal conductive layer 40 is formed on the transparent conductive layer 20. The conductive layer 20 includes a display portion 21 and a circuit connecting portion 22 adjacent to the display portion 21. Specifically, the metal conductive layer 40 may be copper, and the transparent conductive layer 20 is indium tin oxide. In this embodiment, copper is directly formed on the indium tin oxide, that is, the metal conductive layer 40 is directly formed on the transparent conductive layer 20 without any buffer material.

S2: First, the metal conductive layer 40 on the display portion 21 is etched to expose the display portion 21, and then the circuit connecting portion 22 and the circuit connecting portion 22 are disposed as shown in FIG. 4C. The metal conductive layer 40 is etched to form a patterned circuit connecting portion 23 and a patterned metal conductive layer 41, and the patterned circuit connecting portion 23 and the pattern are respectively formed by the circuit connecting portion 22 and the metal conductive layer 40. Corresponding to the shape of the metal conductive layer 41, the patterned metal conductive layer 41 increases the conductivity when the circuit extends outside the display portion 21, thereby preventing the electrical conduction of the circuit connecting portion 22 from being transparent conductive material. The problem of excessive resistance is too large.

S3: As shown in FIG. 4D, a liquid crystal layer 30 is formed on the display portion 21. The liquid crystal layer 30 has a plurality of liquid crystals 31, and each of the liquid crystals 31 has a black display portion 312 and a white display portion 311. An arithmetic processing component 60 and a power supply member 70 (shown in FIG. 1A) are electrically connected to the patterned metal conductive layer 41.

Referring to FIG. 5 and FIG. 6 , the application embodiment of the present invention, after the step S3 described above, further includes the following steps:

S4: A protective member 91 is formed on one side of the transparent flexible substrate 10 away from the transparent conductive layer 20, and a display window 93 of the protective member 91 corresponds to the display portion 21. In actual assembly, another protection member (not shown) may be additionally disposed at a position relative to the protection member 91, that is, the present invention is disposed between the protection member 91 and another protection member, and can be further protected. this invention.

In addition, as shown in FIG. 6, the protective member 91 further includes a recess 92 for receiving the transparent flexible substrate 10, so that the thickness of the embodiment of the application can be reduced.

The display window 93 can also be disposed on another protection member and corresponding to the display portion 21, if the liquid crystal layer 30 is disposed away from the side of the transparent flexible substrate 10 to be transparent. The invention can be applied to fields such as electronic paper, credit cards, and the like. It should be specially noted that when applied to a credit card and when swiping on the network, the liquid crystal layer 30 displays a set of numbers. In addition to the general input of the password, the cardholder must input the number on the relevant device. It is only possible to swipe the card successfully and improve the security of the card.

In summary, the present invention has the following characteristics:

1. Forming the metal conductive layer or the transparent conductive layer by directly forming the transparent conductive layer and the patterned metal conductive layer to avoid electrical contact between the display element and the flexible circuit board to prevent bending The problem that the layer is broken and the component is unusable, and can be applied to fields such as electronic paper and credit cards.

Second, by the arrangement of the protection member, the present invention can be further protected, such as preventing moisture erosion and the like, and improving the service life.

3. The transparent flexible substrate can be accommodated by the arrangement of the groove to reduce the thickness.

Therefore, the present invention is highly progressive and conforms to the requirements of the invention patent application, and the application is filed according to law, and the praying office grants the patent as soon as possible.

The present invention has been described in detail above, but the foregoing is only a preferred embodiment of the present invention, and is not intended to limit the scope of the invention. That is, the equivalent changes and modifications made by the scope of the present application should remain within the scope of the patent of the present invention.

10: transparent flexible substrate 20: transparent conductive layer 21: display portion 22: circuit connection portion 23: patterning circuit connection portion 30: liquid crystal layer 31: liquid crystal 311: white display portion 312: black display portion 40: metal conductive layer 41 : patterned metal conductive layer 60: arithmetic processing element 70: power supply member 80: auxiliary flexible substrate 91: protective member 92: groove 93: display window S1 ~ S4: steps

1A is a top plan view of a preferred embodiment of the present invention. Figure 1B is a cross-sectional view of the A-A of Figure 1A of the present invention. 2 is a functional block diagram of a preferred embodiment of the present invention. FIG. 3 is a schematic flow chart of a preferred embodiment of the present invention. 4A to 4D are schematic diagrams showing the structure of a manufacturing process according to a preferred embodiment of the present invention. FIG. 5 is a schematic diagram of a first application according to a preferred embodiment of the present invention. FIG. 6 is a schematic diagram of a second application of a preferred embodiment of the present invention.

10: transparent flexible substrate 20: transparent conductive layer 21: display portion 23: patterning circuit connecting portion 30: liquid crystal layer 31: liquid crystal 311: white display portion 312: black display portion 41: patterned metal conductive layer 60: arithmetic processing element

Claims (9)

A flexible circuit connection structure with a display interface, comprising: a transparent flexible substrate; a transparent conductive layer disposed on one side of the transparent flexible substrate, comprising a display portion and a pattern adjacent to the display portion a circuit connecting portion; a liquid crystal layer disposed on a side of the transparent conductive layer away from the transparent flexible substrate and corresponding to the display portion; a transparent conductive layer disposed on a side of the transparent flexible substrate and having a shape corresponding to a patterned metal conductive layer of the patterning circuit connection portion; an arithmetic processing element electrically connected to the patterned metal conductive layer; and a power supply member electrically connected to the patterned metal conductive layer. The flexible circuit connection structure with a display interface according to claim 1, wherein the transparent flexible substrate is made of a material selected from the group consisting of polyimide, polyethylene terephthalate, polycarbonate, a group consisting of cellulose triacetate, a cyclic olefin copolymer, polyethylene naphthalate, and glass. The transparent conductive layer is made of a material selected from the group consisting of indium tin oxide, zinc oxide, and tin fluoride oxide. A group consisting of aluminum zinc oxide, zinc gallium oxide, and combinations thereof, the patterned metal conductive layer is made of copper. The flexible circuit connection structure with a display interface as described in claim 1, further comprising a protection member disposed on a side of the transparent flexible substrate away from the transparent conductive layer, the protection member having a corresponding The display window of the display unit. The flexible circuit connection structure with a display interface as described in claim 3, wherein the protection member has a first recess for receiving the transparent flexible substrate. The flexible circuit connection structure with a display interface according to claim 1, wherein the liquid crystal layer has a plurality of liquid crystals, and each of the liquid crystals has a black display portion and a white display portion. A method for fabricating a flexible circuit connection structure with a display interface includes the following steps: S1: sequentially forming a transparent conductive layer and a metal conductive layer on a transparent flexible substrate, the transparent conductive layer including a display portion and a circuit connecting portion adjacent to the display portion; S2: etching the metal conductive layer on the display portion to expose the display portion, and electrically conductive the circuit connecting portion and the metal on the circuit connecting portion Etching, the circuit connecting portion and the metal conductive layer respectively form a patterned circuit connecting portion and a patterned metal conductive layer; and S3: forming a liquid crystal layer on the display portion, and an arithmetic processing component and A power supply member is electrically connected to the patterned metal conductive layer. The method for fabricating a flexible circuit connection structure with a display interface according to claim 6, wherein after step S3, the method further comprises the following steps: S4: forming a protection member on the transparent flexible substrate away from the transparent conductive One side of the layer, and one of the display members of the protection member corresponds to the display portion. The method for fabricating a flexible circuit connection structure with a display interface according to claim 6, wherein in the step S3, the liquid crystal layer has a plurality of liquid crystals, and each of the liquid crystals has a black display portion and a white display portion. . The method for fabricating a flexible circuit connection structure with a display interface according to claim 6, wherein in the step S1, the material of the transparent flexible substrate is selected from the group consisting of poly(imine) and poly(terephthalic acid). a group consisting of ethylene diester, polycarbonate, cellulose triacetate, cycloolefin copolymer, polyethylene naphthalate and glass, the transparent conductive layer is selected from the group consisting of indium tin oxide, oxidation A group consisting of zinc, tin oxide, aluminum zinc oxide, zinc gallium oxide, and combinations thereof, the metal conductive layer being made of copper.