TWI613078B - Used in laminated bodies for fabricating electronic parts, thin film sensors, and touch panel devices having thin film sensors - Google Patents

Used in laminated bodies for fabricating electronic parts, thin film sensors, and touch panel devices having thin film sensors Download PDF

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TWI613078B
TWI613078B TW103123620A TW103123620A TWI613078B TW I613078 B TWI613078 B TW I613078B TW 103123620 A TW103123620 A TW 103123620A TW 103123620 A TW103123620 A TW 103123620A TW I613078 B TWI613078 B TW I613078B
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layer
laminated body
hard coat
transparent conductive
light
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TW201515832A (en
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晝間祐介
小川善正
磯嶋征一
篠原誠司
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大日本印刷股份有限公司
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被使用在用以製作電子零件的積層體、薄膜感測器及具備薄膜感測器之觸控面板裝置 Used in laminated bodies for fabricating electronic parts, thin film sensors, and touch panel devices having thin film sensors

本發明係關於被使用在用以製作薄膜感測器等電子零件的積層體。此外本發明係關於薄膜感測器、及具備薄膜感測器的觸控面板裝置。 The present invention relates to a laminate used for fabricating electronic components such as thin film sensors. Furthermore, the present invention relates to a thin film sensor and a touch panel device having the same.

現今廣泛使用觸控面板裝置作為輸入手段。觸控面板裝置係包含有:薄膜感測器(觸控面板感測器)、檢測對薄膜感測器上的接觸位置的控制電路、配線及FPC(可撓性印刷基板)。觸控面板裝置在大部分的情形下係連同顯示裝置一起被使用作為對被組入液晶顯示器或電漿顯示器等顯示裝置的各種裝置等(例如票券販賣機、ATM裝置、行動電話、遊戲機)的輸入手段。在如上所示之裝置中,薄膜感測器被配置在顯示裝置的顯示面上,藉此,可進行對顯示裝置之極為直接的輸入。薄膜感測器之中與顯示裝置之顯示區域相對面的區域為透明,薄膜感測器的該區域構成可檢測接觸位置(接近位置)的有效區(active area)。 Touch panel devices are widely used as input means today. The touch panel device includes a thin film sensor (touch panel sensor), a control circuit for detecting a contact position on the thin film sensor, wiring, and an FPC (Flexible Printed Substrate). In most cases, the touch panel device is used together with the display device as various devices (such as ticket vending machines, ATM devices, mobile phones, game machines) that are incorporated into display devices such as liquid crystal displays or plasma displays. ) the means of input. In the device as shown above, the film sensor is disposed on the display surface of the display device, whereby extremely direct input to the display device can be performed. The area of the film sensor opposite the display area of the display device is transparent, and the area of the film sensor constitutes an active area where the contact position (proximity position) can be detected.

薄膜感測器等電子零件一般係由用以實現光學特性之層、或用以實現電特性之層等複數層所構成。以用以製作如上所示之電子零件的方法而言,已知一種先準備包含基材薄膜及透明導電層或含有金屬之遮光導電層等複數層的積層體,接著,將該積層體之任意層藉由光微影法等進行圖案化的方法。 Electronic components such as thin film sensors are generally composed of a plurality of layers such as a layer for realizing optical characteristics or a layer for realizing electrical characteristics. In the method for producing the electronic component as described above, it is known to prepare a laminate including a substrate film and a transparent conductive layer or a metal-containing light-shielding conductive layer, and then, any of the laminates A method in which a layer is patterned by photolithography or the like.

以製造積層體之方法之一而言,已知一種先準備基材薄膜,接著,使用濺鍍法或EB蒸鍍法等物理蒸鍍成膜法,在基材薄膜上積層透明導電層或遮光導電層的方法。例如在專利文獻1中係揭示製作在基材薄膜之其中一方之側依序設有緩衝層、功能層、透明導電層的積層體,使用該積層體來製造電阻膜方式的觸控面板感測器。 In one of the methods for producing a laminate, it is known to prepare a substrate film first, and then use a physical vapor deposition film formation method such as a sputtering method or an EB vapor deposition method to laminate a transparent conductive layer or a light-shielding film on the substrate film. A method of conducting a layer. For example, Patent Document 1 discloses a laminated body in which a buffer layer, a functional layer, and a transparent conductive layer are sequentially provided on one side of a base film, and a resistive film type touch panel sensing is manufactured using the laminated body. Device.

〔先前技術文獻〕 [Previous Technical Literature] 〔專利文獻〕 [Patent Document]

[專利文獻1]日本特開2012-91406號公報 [Patent Document 1] Japanese Patent Laid-Open Publication No. 2012-91406

近年來,觸控面板感測器等電子零件所被要求的特性日益形成為高度者。因此,電子零件的構造複雜化,伴隨此,被使用在用以製作電子零件的積層體的層構成亦複雜化。電子零件的構造或積層體的層構成複雜化意指製造工程伴隨此而複雜化,結果,在製造工程中構成積 層體之最表面的層受到損傷的機會變多。例如,當使用滾筒來搬送積層體時,在滾筒與積層體之間夾入某些異物,結果,會有在積層體的表面形成因異物而起的壓痕的情形。為防止形成如上所示之壓痕,較佳為在積層體係在基材薄膜的表面設有在積層體的表面不會殘留壓痕而可吸收來自異物之壓力之具有適當硬度的層。 In recent years, the required characteristics of electronic components such as touch panel sensors have become increasingly high. Therefore, the structure of the electronic component is complicated, and accordingly, the layer configuration used for the laminated body for producing the electronic component is complicated. The complication of the structure of the electronic component or the layer composition of the laminated body means that the manufacturing process is complicated by this, and as a result, the product is formed in the manufacturing process. The layer on the outermost surface of the layer has a greater chance of being damaged. For example, when a laminated body is conveyed by using a roller, some foreign matter is interposed between the roller and the laminated body, and as a result, an indentation due to foreign matter may be formed on the surface of the laminated body. In order to prevent the formation of the indentation as described above, it is preferable to provide a layer having a suitable hardness which can absorb the pressure from the foreign matter without leaving an indentation on the surface of the laminated body on the surface of the base film in the laminated system.

另一方面,如上述專利文獻1所揭示之被使用在用以製造電阻膜方式的觸控面板感測器的積層體,一般而言並非為被設計為具有可防止壓痕形成的程度的適當硬度者。其係基於電阻膜方式的觸控面板感測器係根據由筆或手指所被施加的壓力來檢測接觸位置者,因此,在基材薄膜與透明導電層之間被設在基材薄膜的表面的層係被要求一定程度的柔軟性之故。例如在專利文獻1中係揭示出當將透明導電層由積層體剝離時之功能層表面中的馬氏硬度為100N/mm2以下。 On the other hand, the laminated body used in the touch panel sensor for manufacturing a resistive film method as disclosed in the above Patent Document 1 is generally not designed to have a degree of preventing the formation of an indentation. Hardness. The touch panel sensor based on the resistive film method detects the contact position according to the pressure applied by the pen or the finger, and therefore is disposed on the surface of the base film between the substrate film and the transparent conductive layer. The layer system is required to have a certain degree of softness. For example, Patent Document 1 discloses that the Martens hardness in the surface of the functional layer when the transparent conductive layer is peeled off from the laminate is 100 N/mm 2 or less.

但是近年來基於在光學上較為明亮、具有設計性、構造容易、在功能上亦較為優異等理由,電容耦合方式的觸控面板感測器備受矚目。電容耦合方式的觸控面板感測器係利用因外部導體接觸或接近而起而發生寄生電容來檢測接觸位置者。因此,在電容耦合方式的觸控面板感測器並不需要如電阻膜方式的觸控面板感測器的情形下的柔軟性。但是,由於電阻膜方式的觸控面板感測器先普及,電容耦合方式的觸控面板感測器較慢普及的歷史上的經過,以用以製造電容耦合方式的觸控面板感測器的積層 體而言,以往主要使用與用以製造電阻膜方式的觸控面板感測器的積層體為相同或類似者。此時,由於在電容耦合方式的觸控面板感測器中未被特別要求的特性,亦即積層體的內層的柔軟性,可謂為在積層體的表面容易形成壓痕。 However, in recent years, capacitive coupling type touch panel sensors have attracted attention for reasons such as being optically bright, design-oriented, easy to construct, and excellent in function. A capacitively coupled touch panel sensor utilizes parasitic capacitance due to contact or proximity of an external conductor to detect a contact position. Therefore, the flexibility of the capacitive touch panel touch panel sensor does not require a touch panel sensor such as a resistive film type. However, since the touch panel sensor of the resistive film type is popular, the history of the capacitive coupling type touch panel sensor is slow, and the touch panel sensor for manufacturing the capacitive coupling method is used. Lamination In the past, it has been mainly used in the same manner as or similar to the laminated body of the touch panel sensor for manufacturing a resistive film method. At this time, since the characteristics of the capacitively coupled touch panel sensor are not particularly required, that is, the flexibility of the inner layer of the laminated body, it is easy to form an indentation on the surface of the laminated body.

本發明係考慮到如上所示之情形而研創者,目的在提供構成為可防止壓痕形成的積層體。此外本發明之目的在提供藉由將該積層體圖案化所得之薄膜感測器、及具備該薄膜感測器之觸控面板裝置。 The present invention has been made in view of the circumstances as described above, and it is an object of the invention to provide a laminated body which is configured to prevent formation of an indentation. Further, an object of the present invention is to provide a thin film sensor obtained by patterning the laminated body, and a touch panel device including the same.

本發明係一種積層體,其係被使用在用以製作觸控面板用的薄膜感測器的積層體,該積層體具有其中一方之側的面及另一方之側的面,該積層體係具備有:基材薄膜;被設在前述基材薄膜之其中一方之側的面上的第1硬塗層;及被設在前述第1硬塗層之其中一方之側的面上的第1表面層,前述第1表面層的厚度係小於1μm,前述第1表面層的厚度及前述第1硬塗層的厚度的合計係大於1μm,藉由由前述積層體之其中一方之側將維氏壓頭(Vickers indenter)壓入在前述積層體所測定的馬氏硬度在前述維氏壓頭的最大壓入量為1μm時成為270N/mm2以上。 The present invention is a laminated body which is used in a laminated body for producing a thin film sensor for a touch panel, the laminated body having a surface on one side and a side on the other side, the laminated system having a base film; a first hard coat layer provided on a surface of one side of the base film; and a first surface provided on a surface of one of the first hard coat layers In the layer, the thickness of the first surface layer is less than 1 μm, and the total thickness of the first surface layer and the thickness of the first hard coat layer is more than 1 μm, and the Vickers pressure is applied from one side of the laminated body. The Vickers indenter is pressed into the laminate to have a Martens hardness of 270 N/mm 2 or more when the maximum indentation amount of the Vickers indenter is 1 μm.

在本發明之積層體中,前述第1表面層亦可包含被設在前述第1硬塗層上的第1折射率匹配層。此 時,前述第1表面層亦可另外包含被設在前述第1折射率匹配層之其中一方之側且具有透光性及導電性的第1透明導電層。此外,前述第1表面層亦可另外包含被設在前述第1折射率匹配層與前述第1透明導電層之間,且由氧化矽所構成之第1氧化矽層。此外,前述第1表面層亦可另外包含被設在前述第1透明導電層之其中一方之側,且具有遮光性及導電性的第1遮光導電層。 In the laminate of the present invention, the first surface layer may include a first index matching layer provided on the first hard coat layer. this In addition, the first surface layer may further include a first transparent conductive layer which is provided on one side of the first refractive index matching layer and has translucency and conductivity. Further, the first surface layer may further include a first ruthenium oxide layer formed of ruthenium oxide provided between the first refractive index matching layer and the first transparent conductive layer. Further, the first surface layer may further include a first light-shielding conductive layer provided on one side of the first transparent conductive layer and having light-shielding properties and conductivity.

在本發明之積層體中,前述第1表面層亦可另外包含被設在前述第1硬塗層上,且由氧化矽所構成之第1氧化矽層。此時,前述第1表面層亦可另外包含被設在前述第1氧化矽層之其中一方之側,且具有透光性及導電性的第1透明導電層。此外,前述第1表面層亦可另外包含被設在前述第1透明導電層之其中一方之側,且具有遮光性及導電性的第1遮光導電層。 In the laminated body of the present invention, the first surface layer may further include a first ruthenium oxide layer which is provided on the first hard coat layer and is made of ruthenium oxide. In this case, the first surface layer may further include a first transparent conductive layer which is provided on one side of the first ruthenium oxide layer and has translucency and conductivity. Further, the first surface layer may further include a first light-shielding conductive layer provided on one side of the first transparent conductive layer and having light-shielding properties and conductivity.

在本發明之積層體中,較佳為前述第1硬塗層的厚度係成為0.8μm~7.0μm的範圍內。 In the laminate of the present invention, it is preferable that the thickness of the first hard coat layer is in the range of 0.8 μm to 7.0 μm.

在本發明之積層體中,前述第1表面層亦可至少包含具有透光性及導電性的第1透明導電層。此時,前述第1表面層亦可另外包含被設在前述第1透明導電層之其中一方之側,且具有遮光性及導電性的第1遮光導電層。 In the laminate of the present invention, the first surface layer may include at least a first transparent conductive layer having light transmissivity and conductivity. In this case, the first surface layer may further include a first light-shielding conductive layer provided on one side of the first transparent conductive layer and having light-shielding properties and conductivity.

本發明之積層體亦可另外具備有:被設在前述基材薄膜之另一方之側的面上的第2硬塗層;及被設在前述第2硬塗層之另一方之側的面上的第2表面層。此 時,前述第2表面層的厚度係小於1μm,前述第2表面層的厚度及前述第2硬塗層的厚度的合計係大於1μm,藉由由前述積層體之另一方之側將維氏壓頭壓入在前述積層體所測定的馬氏硬度在前述維氏壓頭的最大壓入量為1μm時成為270N/mm2以上。 The laminate of the present invention may further include: a second hard coat layer provided on the other side of the base film; and a surface provided on the other side of the second hard coat layer The second surface layer on the top. In this case, the thickness of the second surface layer is less than 1 μm, and the total thickness of the second surface layer and the thickness of the second hard coat layer is more than 1 μm, and the Vickers is formed by the other side of the laminate. When the maximum indentation amount of the Vickers indenter is 1 μm, the Martens hardness measured by the indentation of the laminate is 270 N/mm 2 or more.

本發明係一種薄膜感測器,其係具備有:基材薄膜;被設在前述基材薄膜之其中一方之側的面上的第1硬塗層;以預定的圖案設在第1硬塗層之其中一方之側,且具有透光性及導電性的第1透明導電圖案;及以預定的圖案設在第1透明導電圖案上,且具有遮光性及導電性的第1取出圖案,前述第1透明導電圖案及前取出圖案係藉由將上述記載之積層體的前述第1透明導電層及前述第1遮光導電層圖案化所得者。 The present invention relates to a film sensor comprising: a base film; a first hard coat layer provided on a side of one side of the base film; and a first hard coat set in a predetermined pattern a first transparent conductive pattern having a light transmissive property and a conductive property on one side of the layer; and a first extraction pattern provided on the first transparent conductive pattern in a predetermined pattern and having light blocking properties and conductivity; The first transparent conductive pattern and the front extraction pattern are obtained by patterning the first transparent conductive layer and the first light-shielding conductive layer of the laminated body described above.

本發明係一種觸控面板裝置,其係包含:薄膜感測器、及檢測對前述薄膜感測器上的接觸位置的控制電路的觸控面板裝置,其特徵為:前述薄膜感測器具備有上述記載之薄膜感測器。 The present invention relates to a touch panel device, comprising: a thin film sensor, and a touch panel device for detecting a control circuit on a contact position on the thin film sensor, wherein the thin film sensor is provided with The film sensor described above.

藉由本發明,積層體係構成為藉由由積層體之其中一方之側將維氏壓頭壓入在積層體所測定的馬氏硬度在維氏壓頭的最大壓入量為1μm時成為270N/mm2以上。因此,可抑制在製造工程中在積層體的表面形成壓痕的情形。 According to the present invention, the laminated system is configured such that the Martens hardness measured by pressing the Vickers indenter into the laminated body from one side of the laminated body becomes 270 N when the maximum pressing amount of the Vickers indenter is 1 μm. Mm 2 or more. Therefore, it is possible to suppress the formation of an indentation on the surface of the laminated body in the manufacturing process.

1‧‧‧積層體 1‧‧ ‧ laminated body

1a‧‧‧積層體1之其中一方之側的表面 1a‧‧‧ Surface of the side of one of the laminated bodies 1

1b‧‧‧積層體1之另一方之側的表面 1b‧‧‧ Surface of the other side of the laminated body 1

2‧‧‧基材薄膜 2‧‧‧Substrate film

2a‧‧‧設在基材薄膜2之其中一方之側的面 2a‧‧‧Side on the side of one of the base film 2

2b‧‧‧設在基材薄膜2之另一方的面 2b‧‧‧ is provided on the other side of the base film 2

3a、3b‧‧‧硬塗層 3a, 3b‧‧‧ hard coating

4a、4b‧‧‧高折射率層 4a, 4b‧‧‧ high refractive index layer

5a、5b‧‧‧低折射率層 5a, 5b‧‧‧ low refractive index layer

6a、6b‧‧‧氧化矽層 6a, 6b‧‧‧ yttrium oxide layer

7a、7b‧‧‧透明導電層 7a, 7b‧‧‧ transparent conductive layer

8a、8b‧‧‧遮光導電層 8a, 8b‧‧‧ shading conductive layer

10‧‧‧中間積層體 10‧‧‧Intermediate laminate

11a、11b‧‧‧折射率匹配層 11a, 11b‧‧‧index matching layer

12a、12b‧‧‧表面層 12a, 12b‧‧‧ surface layer

15‧‧‧積層體製造裝置 15‧‧‧Laminated manufacturing equipment

20‧‧‧放捲裝置 20‧‧‧ Unwinding device

21‧‧‧軸 21‧‧‧Axis

30‧‧‧成膜裝置 30‧‧‧ Film forming device

31‧‧‧第1區域 31‧‧‧1st area

31a‧‧‧排氣手段 31a‧‧‧Exhaust means

32a‧‧‧靶材 32a‧‧‧ Target

33‧‧‧第2區域 33‧‧‧2nd area

33a‧‧‧排氣手段 33a‧‧‧Exhaust means

35‧‧‧第3區域 35‧‧‧3rd area

35a‧‧‧排氣手段 35a‧‧‧Exhaust means

38‧‧‧搬送鼓輪 38‧‧‧Transport drum

39、59‧‧‧導引滾筒 39, 59‧‧‧ Guide roller

50‧‧‧收捲裝置 50‧‧‧ Winding device

51‧‧‧軸 51‧‧‧Axis

53‧‧‧臨近滾筒 53‧‧‧ Near roller

60‧‧‧觸控面板感測器 60‧‧‧Touch panel sensor

62a、62b‧‧‧透明導電圖案 62a, 62b‧‧‧ transparent conductive pattern

64a、64b‧‧‧取出圖案 64a, 64b‧‧‧ take out the pattern

65a、65b‧‧‧端子部 65a, 65b‧‧‧ Terminals

70‧‧‧維氏壓頭 70‧‧‧Vickers head

圖1係顯示本發明之實施形態中之積層體製造裝置的圖。 Fig. 1 is a view showing a laminated body manufacturing apparatus in an embodiment of the present invention.

圖2係顯示圖1所示之積層體製造裝置的成膜裝置的圖。 Fig. 2 is a view showing a film forming apparatus of the laminated body manufacturing apparatus shown in Fig. 1;

圖3係顯示圖1所示之積層體製造裝置的收捲裝置的圖。 Fig. 3 is a view showing a winding device of the laminated body manufacturing apparatus shown in Fig. 1;

圖4係顯示本發明之實施形態中之積層體的剖面圖。 Fig. 4 is a cross-sectional view showing a laminated body in an embodiment of the present invention.

圖5係顯示圖4所示之積層體的變形例的剖面圖。 Fig. 5 is a cross-sectional view showing a modification of the laminated body shown in Fig. 4;

圖6(a)(b)係用以說明測定積層體的馬氏硬度的方法的圖。 6(a) and 6(b) are views for explaining a method of measuring the Martens hardness of a laminate.

圖7係顯示算出維氏壓頭的最大壓入量為1μm時的馬氏硬度的方法之一例圖。 Fig. 7 is a view showing an example of a method of calculating the Martens hardness when the maximum pressing amount of the Vickers indenter is 1 μm.

圖8係顯示藉由將圖5所示之積層體圖案化所得之薄膜感測器的平面圖。 Fig. 8 is a plan view showing a film sensor obtained by patterning the laminated body shown in Fig. 5.

圖9係沿著圖8所示之薄膜感測器的線IX-IX的剖面圖。 Figure 9 is a cross-sectional view taken along line IX-IX of the film sensor shown in Figure 8.

圖10係顯示積層體之一變形例的剖面圖。 Fig. 10 is a cross-sectional view showing a modification of one of the laminated bodies.

圖11係顯示積層體之一變形例的剖面圖。 Fig. 11 is a cross-sectional view showing a modification of one of the laminated bodies.

圖12係顯示積層體之一變形例的剖面圖。 Fig. 12 is a cross-sectional view showing a modification of one of the laminated bodies.

圖13係顯示積層體之一變形例的剖面圖。 Fig. 13 is a cross-sectional view showing a modification of one of the laminated bodies.

圖14係顯示積層體之一變形例的剖面圖。 Fig. 14 is a cross-sectional view showing a modification of one of the laminated bodies.

圖15係顯示積層體之一變形例的剖面圖。 Fig. 15 is a cross-sectional view showing a modification of one of the laminated bodies.

圖16係顯示積層體之一變形例的剖面圖。 Fig. 16 is a cross-sectional view showing a modification of one of the laminated bodies.

圖17係顯示積層體之一變形例的剖面圖。 Fig. 17 is a cross-sectional view showing a modification of one of the laminates.

圖18係顯示積層體之一變形例的剖面圖。 Fig. 18 is a cross-sectional view showing a modification of one of the laminated bodies.

圖19係顯示積層體之一變形例的剖面圖。 Fig. 19 is a cross-sectional view showing a modification of one of the laminated bodies.

圖20(a)(b)係顯示試樣A1的積層體的表面所形成之壓痕的圖。 Fig. 20 (a) and (b) are views showing an indentation formed on the surface of the layered product of the sample A1.

圖21係顯示實施例之各試樣中的馬氏硬度及壓痕的密度的評估結果的圖。 Fig. 21 is a graph showing the results of evaluation of the Martens hardness and the density of the indentations in each of the samples of the examples.

以下參照圖1至圖7,說明本發明之實施形態。首先參照圖4,說明在本實施形態中所製造的積層體1。 Embodiments of the present invention will be described below with reference to Figs. 1 to 7 . First, the laminated body 1 manufactured in the present embodiment will be described with reference to Fig. 4 .

積層體 Laminated body

圖4係顯示積層體1的剖面圖。如圖4所示,積層體1係具備有:基材薄膜2、設在基材薄膜2之其中一方之側的面2a上的第1硬塗層3a、及設在第1硬塗層3a之其中一方之側的面上的第1表面層12a。以下分別說明基材薄膜2、第1硬塗層3a及第1表面層12a。 4 is a cross-sectional view showing the laminated body 1. As shown in FIG. 4, the laminated body 1 is provided with a base film 2, a first hard coat layer 3a provided on the surface 2a of one side of the base film 2, and a first hard coat layer 3a. The first surface layer 12a on the side of one of the sides. The base film 2, the first hard coat layer 3a, and the first surface layer 12a will be described below.

(基材薄膜) (substrate film)

以基材薄膜2而言,係使用具有充分透光性的薄膜。 以構成基材薄膜2的材料而言,列舉例如聚對苯二甲酸乙二酯(PET)、環烯烴聚合物(COP)、環烯烴共聚物(COC)、聚碳酸酯(PC)、三醋酸纖維素(TAC)、聚甲基丙烯酸甲酯(PMMA)等。基材薄膜2的厚度係成為例如25μm~200μm的範圍內。 In the case of the base film 2, a film having sufficient light transmittance is used. Examples of the material constituting the base film 2 include, for example, polyethylene terephthalate (PET), cycloolefin polymer (COP), cyclic olefin copolymer (COC), polycarbonate (PC), and triacetic acid. Cellulose (TAC), polymethyl methacrylate (PMMA), and the like. The thickness of the base film 2 is, for example, in the range of 25 μm to 200 μm.

(硬塗層) (hard coating)

第1硬塗層3a係為了防止擦傷等目的、或防止在層間的界面析出低分子聚合物(寡聚物(oligomer))而看起來白濁的目的而設之層。以第1硬塗層3a而言,係使用例如丙烯酸系樹脂等。其中亦可如圖4所示,在基材薄膜2之另一方的面2b上另外設有由與第1硬塗層3a為相同材料所構成的第2硬塗層3b。 The first hard coat layer 3a is a layer provided for the purpose of preventing scratching or the like, or preventing the appearance of a low molecular weight polymer (oligomer) at the interface between the layers and looking cloudy. For the first hard coat layer 3a, for example, an acrylic resin or the like is used. Further, as shown in FIG. 4, a second hard coat layer 3b made of the same material as the first hard coat layer 3a may be additionally provided on the other surface 2b of the base film 2.

(表面層) (surface layer)

在本實施形態中,「表面層」係被使用在用以總括稱呼設在比硬塗層3a、3b更為外側之層的用語。例如在圖4所示之例中,位於比第1硬塗層3a更為外側的複數層,亦即設在第1硬塗層3a之其中一方之側的複數層被總括稱為第1表面層12a。此外如後述圖5所示,若在比第2硬塗層3b更為外側,亦即第2硬塗層3b之另一方之側亦設有複數層時,該等層係被總括稱為第2表面層12b。 In the present embodiment, the "surface layer" is used in a term used to collectively denote a layer which is provided on the outer side of the hard coat layers 3a and 3b. For example, in the example shown in FIG. 4, a plurality of layers located outside the first hard coat layer 3a, that is, a plurality of layers provided on one side of the first hard coat layer 3a are collectively referred to as a first surface. Layer 12a. Further, as shown in FIG. 5 which will be described later, when a plurality of layers are provided on the outer side of the second hard coat layer 3b, that is, on the other side of the second hard coat layer 3b, the layers are collectively referred to as 2 surface layer 12b.

第1表面層12a係如圖4所示,包含有:設 在第1硬塗層3a之其中一方之側的面上的第1折射率匹配層11a、設在第1折射率匹配層11a之其中一方之側的面上的第1氧化矽層6a、設在第1氧化矽層6a之其中一方之側的面上的第1透明導電層7a、及設在第1透明導電層7a之其中一方之側的面上的第1遮光導電層8a。以下說明各層11a、6a、7a、8a。 The first surface layer 12a is as shown in FIG. 4 and includes: The first refractive index matching layer 11a on the surface on the side of one of the first hard coat layers 3a and the first ruthenium oxide layer 6a on the surface on the side of one of the first refractive index matching layers 11a are provided. The first transparent conductive layer 7a on the surface on one side of the first ruthenium oxide layer 6a and the first light-shielding conductive layer 8a on the surface on the side of one of the first transparent conductive layers 7a. Each layer 11a, 6a, 7a, 8a will be described below.

〔折射率匹配層〕 [index matching layer]

第1折射率匹配層11a係用以調整反射率或透射率等積層體1的光學特性而設之層。例如後述,積層體1的第1透明導電層7a被圖案化而形成為薄膜感測器的透明導電圖案時,第1折射率匹配層11a係以減小設有透明導電圖案的區域、與未設有透明導電圖案的區域之間的光的透射率及反射率的差的方式發揮功能。只要可調整積層體1的光學特性,第1折射率匹配層11a的具體構成並未特別限制,例如第1折射率匹配層11a係包含有:第1高折射率層4a、及設在第1高折射率層4a之其中一方之側的第1低折射率層5a。此外,第1折射率匹配層11a的厚度係成為例如100nm。 The first index matching layer 11a is a layer provided to adjust the optical characteristics of the layered body 1 such as reflectance or transmittance. For example, when the first transparent conductive layer 7a of the laminated body 1 is patterned to form a transparent conductive pattern of the thin film sensor, the first refractive index matching layer 11a is formed to reduce the area in which the transparent conductive pattern is provided, and The function of the difference in transmittance and reflectance of light between the regions provided with the transparent conductive pattern functions. The specific configuration of the first refractive index matching layer 11a is not particularly limited as long as the optical characteristics of the laminated body 1 can be adjusted. For example, the first refractive index matching layer 11a includes the first high refractive index layer 4a and the first The first low refractive index layer 5a on the side of one of the high refractive index layers 4a. Further, the thickness of the first index matching layer 11a is, for example, 100 nm.

第1高折射率層4a係由具有比構成在第1折射率匹配層11a之另一方之側亦即基材薄膜2側與第1折射率匹配層11a相接之層的材料為更高的折射率的材料所構成之層。在本實施形態中,第1高折射率層4a係由具有比構成第1硬塗層3a的材料為更高的折射率的材料所 構成之層。以第1高折射率層4a的材料而言,係使用例如氧化鈮或氧化鋯等高折射率材料。使用高折射率材料來構成第1高折射率層4a的具體方法並未特別限制。例如第1高折射率層4a係可為藉由高折射率材料單體所構成之膜,或者亦可由有機樹脂、及被分散在有機樹脂內的高折射率材料的粒子所構成。使用有機樹脂係在提高第1高折射率層4a之生產效率方面極為有效。 The first high refractive index layer 4a is made of a material having a layer which is in contact with the first refractive index matching layer 11a on the side of the base film 2 which is the other side of the first refractive index matching layer 11a. A layer of a material of refractive index. In the present embodiment, the first high refractive index layer 4a is made of a material having a higher refractive index than the material constituting the first hard coat layer 3a. The layer of composition. As the material of the first high refractive index layer 4a, a high refractive index material such as cerium oxide or zirconium oxide is used. A specific method of forming the first high refractive index layer 4a using a high refractive index material is not particularly limited. For example, the first high refractive index layer 4a may be a film composed of a single high refractive index material, or may be composed of an organic resin and particles of a high refractive index material dispersed in the organic resin. The use of the organic resin is extremely effective in improving the production efficiency of the first high refractive index layer 4a.

第1低折射率層5a係由具有比構成在第1折射率匹配層11a之另一方之側亦即基材薄膜2側與第1折射率匹配層11a相接之層的材料為更低的折射率的材料所構成之層。在本實施形態中,第1低折射率層5a係由具有比構成第1硬塗層3a的材料為更低的折射率的材料所構成之層。以第1低折射率層5a的材料而言,係使用例如氧化矽或MgF(氟化鎂)等低折射率材料。使用低折射率材料來構成第1低折射率層5a的具體方法並未特別限制。例如第1低折射率層5a可為藉由低折射率材料單體所構成的膜,或者亦可由有機樹脂、及被分散在有機樹脂內的低折射率材料的粒子所構成。例如,藉由使用塗佈機塗敷含有有機樹脂及低折射率材料的粒子的塗佈液,可形成第1低折射率層5a,且可提高生產效率。 The first low refractive index layer 5a has a lower material than a layer that is in contact with the first refractive index matching layer 11a on the side of the base film 2 which is the other side of the first refractive index matching layer 11a. A layer of a material of refractive index. In the present embodiment, the first low refractive index layer 5a is a layer composed of a material having a lower refractive index than a material constituting the first hard coat layer 3a. As the material of the first low refractive index layer 5a, a low refractive index material such as cerium oxide or MgF (magnesium fluoride) is used. A specific method of forming the first low refractive index layer 5a using a low refractive index material is not particularly limited. For example, the first low refractive index layer 5a may be a film made of a monomer having a low refractive index material, or may be composed of an organic resin and particles of a low refractive index material dispersed in the organic resin. For example, by applying a coating liquid containing particles of an organic resin and a low refractive index material by using a coater, the first low refractive index layer 5a can be formed, and production efficiency can be improved.

〔氧化矽層〕 [矽 矽 layer]

第1氧化矽層6a係作為氧化矽的膜所形成之層。第1氧化矽層6a所含有的氧化矽的組成未特別限制,使用 具有SiOx(x為任意數)的組成的各種氧化矽,成為例如x=1.8。第1氧化矽層6a的厚度係成為例如5nm。 The first hafnium oxide layer 6a is a layer formed as a film of hafnium oxide. The composition of the cerium oxide contained in the first cerium oxide layer 6a is not particularly limited, and various cerium oxide having a composition of SiO x (x is an arbitrary number) is used, and for example, x=1.8. The thickness of the first hafnium oxide layer 6a is, for example, 5 nm.

第1氧化矽層6a係藉由濺鍍法或真空蒸鍍法等物理氣相成長法所形成。因此,第1氧化矽層6a的表面粗糙度係比藉由塗敷而形成時的第1低折射率層5a的表面粗糙度為更小。因此,藉由將如上所示之第1氧化矽層6a設在第1低折射率層5a與第1透明導電層7a之間,可穩定保持第1透明導電層7a。 The first hafnium oxide layer 6a is formed by a physical vapor phase growth method such as a sputtering method or a vacuum deposition method. Therefore, the surface roughness of the first ruthenium oxide layer 6a is smaller than the surface roughness of the first low refractive index layer 5a when formed by coating. Therefore, by providing the first hafnium oxide layer 6a as described above between the first low refractive index layer 5a and the first transparent conductive layer 7a, the first transparent conductive layer 7a can be stably held.

構成第1氧化矽層6a的氧化矽的折射率係比由丙烯酸系樹脂等所構成的第1硬塗層3a的折射率為更低。亦即,第1氧化矽層6a的折射率係與第1低折射率層5a同樣地,比第1硬塗層3a為更低。此時,藉由充分減小第1低折射率層5a的折射率與第1氧化矽層6a的折射率之間的差,第1低折射率層5a及第1氧化矽層6a可作為具有比第1硬塗層3a為更低的折射率的層而在光學上一體發揮功能。 The refractive index of the cerium oxide constituting the first cerium oxide layer 6a is lower than the refractive index of the first hard coat layer 3a made of an acrylic resin or the like. In other words, the refractive index of the first hafnium oxide layer 6a is lower than that of the first low-refractive-index layer 5a as compared with the first hard-coat layer 3a. At this time, by sufficiently reducing the difference between the refractive index of the first low refractive index layer 5a and the refractive index of the first hafnium oxide layer 6a, the first low refractive index layer 5a and the first hafnium oxide layer 6a can have The layer having a lower refractive index than the first hard coat layer 3a functions optically integrally.

其中在本實施形態中,係說明第1表面層12a包含上述第1高折射率層4a、第1低折射率層5a及第1氧化矽層6a之例,但是亦可未設有第1高折射率層4a、第1低折射率層5a及第1氧化矽層6a。因此,亦有以與第1硬塗層3a之其中一方之側的面直接相接的方式設置第1透明導電層7a的情形。此外在本實施形態中係說明在第1透明導電層7a之其中一方之側設有第1遮光導電層8a之例,惟並非侷限於此,亦可在第1透明導電層7a 之其中一方之側未設置第1遮光導電層8a。 In the present embodiment, the first surface layer 12a includes the first high refractive index layer 4a, the first low refractive index layer 5a, and the first ruthenium oxide layer 6a. However, the first high layer may not be provided. The refractive index layer 4a, the first low refractive index layer 5a, and the first ruthenium oxide layer 6a. Therefore, the first transparent conductive layer 7a may be provided so as to be in direct contact with the surface on the side of one of the first hard coat layers 3a. In the present embodiment, an example in which the first light-shielding conductive layer 8a is provided on one side of the first transparent conductive layer 7a will be described, but the invention is not limited thereto, and the first transparent conductive layer 7a may be used. The first light-shielding conductive layer 8a is not provided on one of the sides.

〔透明導電層〕 [transparent conductive layer]

以構成第1透明導電層7a的材料而言,係使用一邊具有導電性一邊顯示透光性的材料,例如使用銦錫氧化物(ITO)等金屬氧化物。第1透明導電層7a的厚度係成為例如20nm。 In the material constituting the first transparent conductive layer 7a, a material which exhibits light transmittance while having conductivity is used, and for example, a metal oxide such as indium tin oxide (ITO) is used. The thickness of the first transparent conductive layer 7a is, for example, 20 nm.

〔遮光導電層〕 [shading conductive layer]

第1遮光導電層8a係如後所述,在觸控面板等電子零件中,被使用在用以形成用以將訊號取出至外部的取出圖案或電極的層。亦即,第1遮光導電層8a係作為所謂配線材料或電極材料所被使用的層。因此,以構成第1遮光導電層8a的材料而言,係使用具有高導電性及遮光性的金屬材料。具體而言,使用以銀為主成分,並且含有銅及鈀的Ag-Pd-Cu系的銀合金,所謂APC合金。第1遮光導電層8a的厚度係成為例如100~250nm的範圍內,更具體而言成為150nm。 The first light-shielding conductive layer 8a is used in an electronic component such as a touch panel to form a layer for taking out a pattern or an electrode for taking out a signal to the outside. In other words, the first light-shielding conductive layer 8a is a layer used as a so-called wiring material or electrode material. Therefore, a metal material having high conductivity and light blocking property is used as the material constituting the first light-shielding conductive layer 8a. Specifically, an Ag-Pd-Cu-based silver alloy containing silver as a main component and containing copper and palladium is used, and an APC alloy is used. The thickness of the first light-shielding conductive layer 8a is, for example, in the range of 100 to 250 nm, and more specifically 150 nm.

但是,如上所述,在積層體1的製造工程、或使用積層體1的電子零件的製造工程中,會有積層體1的表面因某些異物而被按壓的情形。此時,在積層體1的表面,按照來自異物的按壓力、或積層體1的力學特性,產生對應異物形狀的變形。此時的變形程度若到達積層體1的第1表面層12a中的塑性變形區域時,會在積層體1 的第1表面層12a的表面形成壓痕。 However, as described above, in the manufacturing process of the laminated body 1 or the manufacturing process of the electronic component using the laminated body 1, the surface of the laminated body 1 may be pressed by some foreign matter. At this time, the surface of the laminated body 1 is deformed in accordance with the pressing force from the foreign matter or the mechanical properties of the laminated body 1 in accordance with the shape of the foreign matter. When the degree of deformation at this time reaches the plastic deformation region in the first surface layer 12a of the laminated body 1, it will be in the laminated body 1 The surface of the first surface layer 12a is formed with an indentation.

在此檢討在什麼樣的情形下,變形程度會到達第1表面層12a中的塑性變形區域。如上所述,構成第1表面層12a的層的數量為數層左右,此外,各層的厚度最大亦為一百幾十nm左右。因此,第1表面層12a全體的厚度最大亦小於1μm,通常小於0.5μm。此時,考慮若積層體1的表面因具有匹敵第1表面層12a全體的厚度、或者超出第1表面層12a全體的厚度的尺寸的異物而被按壓時,積層體1的表面會對應異物的形狀而變形而到達至塑性變形區域。例如,考慮到若數μm左右的異物夾在積層體1的表面與滾筒之間時,容易在積層體1的表面形成壓痕。此外,一般難以在比異物接觸積層體1更為之前,檢測或去除如上所示之微小異物。因此,為了防止在積層體1的表面形成壓痕,即使在積層體1的表面因數μm左右的異物而被按壓的情形下,亦以第1表面層12a的變形不會到達塑性變形區域的方式構成積層體1乃極為重要。 In this case, the degree of deformation will reach the plastic deformation region in the first surface layer 12a. As described above, the number of layers constituting the first surface layer 12a is about several layers, and the thickness of each layer is also about one hundred tens of nm at the maximum. Therefore, the thickness of the entire first surface layer 12a is also less than 1 μm at most, and is usually less than 0.5 μm. In this case, when the surface of the laminated body 1 is pressed by a foreign material having a thickness comparable to the entire thickness of the first surface layer 12a or the thickness of the entire first surface layer 12a, the surface of the laminated body 1 corresponds to the foreign matter. The shape is deformed to reach the plastic deformation region. For example, it is considered that when foreign matter of about several μm is sandwiched between the surface of the laminated body 1 and the drum, it is easy to form an indentation on the surface of the laminated body 1. Further, it is generally difficult to detect or remove minute foreign matter as shown above before the foreign matter contacts the laminated body 1. Therefore, in order to prevent the formation of an indentation on the surface of the laminated body 1, even when the foreign matter of the surface layer factor μm of the laminated body 1 is pressed, the deformation of the first surface layer 12a does not reach the plastic deformation region. It is extremely important to form the laminated body 1.

在此本案發明人係著重在上述第1硬塗層3a。如上所述,第1硬塗層3a原本為為了在基材薄膜2防止擦傷、或防止低分子聚合物(寡聚物)析出而看起來白濁而設之層。本案發明人係如以下說明所示,實現一種藉由適當調整該第1硬塗層3a的厚度等,可抑制在表面形成壓痕的積層體1。 Here, the inventor of the present invention focused on the first hard coat layer 3a described above. As described above, the first hard coat layer 3a is originally a layer which is formed to be turbid in order to prevent scratching of the base film 2 or to prevent precipitation of a low molecular weight polymer (oligomer). As described below, the inventors of the present invention can realize a laminate 1 in which an indentation is formed on the surface by appropriately adjusting the thickness of the first hard coat layer 3a and the like.

在本實施形態中,第1硬塗層3a係設計成第1表面層12a的厚度及第1硬塗層3a的厚度的合計大於 1μm。例如第1硬塗層3a的厚度係成為0.8μm~7.0μm的範圍內。藉由將第1硬塗層3a的厚度形成為0.8μm以上,可有效抑制在積層體1之其中一方之側的表面1a形成壓痕的情形。此外,藉由將第1硬塗層3a的厚度形成為7.0μm以下,可抑制在纏繞積層體1時等在第1硬塗層3a發生裂痕的情形。另一方面,如上所述,第1表面層12a全體的厚度係最大亦小於1μm,通常係小於0.5μm。此外第1硬塗層3a係由丙烯酸系樹脂等合成樹脂所構成,因此第1硬塗層3a的硬度一般低於第1表面層12a全體的硬度。此時,積層體1的表面因數μm左右的異物,例如1μm的異物而被按壓時的積層體1的變形程度主要係依第1硬塗層3a的特性來決定。 In the present embodiment, the first hard coat layer 3a is designed such that the total thickness of the first surface layer 12a and the thickness of the first hard coat layer 3a are larger than 1 μm. For example, the thickness of the first hard coat layer 3a is in the range of 0.8 μm to 7.0 μm. By forming the thickness of the first hard coat layer 3a to 0.8 μm or more, it is possible to effectively suppress the formation of an indentation on the surface 1a on the side of one of the laminated bodies 1. In addition, when the thickness of the first hard coat layer 3a is 7.0 μm or less, it is possible to suppress the occurrence of cracks in the first hard coat layer 3a when the laminated body 1 is wound. On the other hand, as described above, the thickness of the entire first surface layer 12a is also less than 1 μm at the maximum, and is usually less than 0.5 μm. Further, since the first hard coat layer 3a is made of a synthetic resin such as an acrylic resin, the hardness of the first hard coat layer 3a is generally lower than the hardness of the entire first surface layer 12a. At this time, the degree of deformation of the laminated body 1 when the foreign matter having a surface factor μm of the laminated body 1 is pressed, for example, a foreign matter of 1 μm, is mainly determined depending on the characteristics of the first hard coat layer 3a.

在此,本案發明人經不斷精心研究,如藉由後述實施例予以支持般,發現以藉由由積層體1之其中一方之側將維氏壓頭壓入在積層體1所被測定的馬氏硬度在維氏壓頭的最大壓入量為1μm時成為270N/mm2以上的方式設計第1硬塗層3a,藉此可有效抑制在積層體1的表面形成壓痕的情形。其中,在離積層體1的一方的表面1a為1μm的位置存在有第1硬塗層3a,因此維氏壓頭的最大壓入量為1μm時的馬氏硬度主要係依第1硬塗層3a的硬度來決定。在具有如上所示之馬氏硬度的積層體1中,即使在積層體1之其中一方之側的表面1a因數μm左右的異物而被按壓的情形下,亦可藉由第1硬塗層3a來抑制第1表面層12a的變形到達塑性變形區域的情形。 藉此,可抑制在積層體1之其中一方之側的表面1a形成壓痕的情形。亦即,藉由本實施形態,利用自以往所設置的第1硬塗層3a,藉此可抑制壓痕的形成。因此,積層體1之層數或製作成本係保持與以往為大致相同,而可使積層體1或由積層體1所得之電子零件的良率提升。 Here, the inventors of the present invention have continually studied carefully, and have found that the horse is measured by pressing the Vickers indenter into the laminated body 1 by the side of one of the laminated bodies 1 as supported by the later-described embodiment. When the maximum intrusion amount of the Vickers indenter is 1 μm, the first hard coat layer 3a is designed to have a thickness of 270 N/mm 2 or more, whereby the formation of an indentation on the surface of the laminated body 1 can be effectively suppressed. In addition, since the first hard coat layer 3a is present at a position 1 μm from the surface 1a of one of the laminated bodies 1, the Martens hardness when the maximum pressing amount of the Vickers indenter is 1 μm is mainly based on the first hard coat layer. The hardness of 3a is determined. In the laminated body 1 having the Martens hardness as described above, even when the surface 1a on the side of one of the laminated bodies 1 is pressed by a foreign matter having a factor of about μm, the first hard coat layer 3a can be used. The case where the deformation of the first surface layer 12a reaches the plastic deformation region is suppressed. Thereby, it is possible to suppress the formation of an indentation on the surface 1a on the side of one of the laminated bodies 1. In other words, according to the present embodiment, the formation of the indentation can be suppressed by using the first hard coat layer 3a provided in the related art. Therefore, the number of layers or the production cost of the laminated body 1 is kept substantially the same as in the related art, and the yield of the electronic component obtained by the laminated body 1 or the laminated body 1 can be improved.

以下,參照圖6(a)(b)及圖7,說明測定積層體1的馬氏硬度的方法之一例。 Hereinafter, an example of a method of measuring the Martens hardness of the laminated body 1 will be described with reference to FIGS. 6(a), (b) and 7.

首先,如圖6(a)所示,準備具備有:基材薄膜2、設在基材薄膜2之其中一方之側的面上的第1硬塗層3a、及設在第1硬塗層3a之其中一方之側的面上的第1表面層12a的積層體1。此外,準備用以對積層體1之其中一方之側的表面1a進行壓入的維氏壓頭70。 First, as shown in FIG. 6(a), a first hard coat layer 3a including a base film 2, a surface provided on one side of the base film 2, and a first hard coat layer are provided. The laminated body 1 of the first surface layer 12a on the surface on the side of one of the 3a. Further, a Vickers indenter 70 for press-fitting the surface 1a on the side of one of the laminated bodies 1 is prepared.

接著如圖6(b)所示,在積層體1之其中一方之側的表面1a壓入維氏壓頭70。此時,藉由測定將維氏壓頭70的最大壓入量h設為1μm所需之荷重F,可算出積層體1的表面1a的馬氏硬度。例如,馬氏硬度HM係藉由下式來算出。 Next, as shown in FIG. 6(b), the Vickers indenter 70 is pressed into the surface 1a on the side of one of the laminated bodies 1. At this time, the Martens hardness of the surface 1a of the laminated body 1 can be calculated by measuring the load F required to set the maximum pressing amount h of the Vickers indenter 70 to 1 μm. For example, the Martens hardness HM is calculated by the following formula.

Figure TWI613078BD00001
Figure TWI613078BD00001

F係負荷維氏壓頭的試驗力(荷重,單位為N),h係對積層體1之其中一方之側的表面1a被壓入維氏壓頭的深度(壓入量,單位為mm)。 F-loading Vickers indenter test force (load, unit is N), h is the depth to which the surface 1a on the side of one of the laminated bodies 1 is pressed into the Vickers indenter (injection amount, in mm) .

其中,以算出維氏壓頭70的最大壓入量為 1μm時的積層體1的馬氏硬度的方法而言,說明將試驗時之維氏壓頭70的最大壓入量實際形成為1μm之例,惟並非侷限於此。亦可例如圖7所示,使維氏壓頭70的最大壓入量作各種變化,測定積層體1的馬氏硬度,根據該結果,來推測維氏壓頭70的最大壓入量為1μm時的積層體1的馬氏硬度HM(1)。 Wherein, the maximum indentation amount of the Vickers indenter 70 is calculated as In the method of the Martens hardness of the laminated body 1 at 1 μm, the example in which the maximum pressing amount of the Vickers indenter 70 at the time of the test is actually formed to 1 μm is described, but the invention is not limited thereto. For example, as shown in FIG. 7, the maximum pressing amount of the Vickers indenter 70 is varied, and the Martens hardness of the laminated body 1 is measured. Based on the result, the maximum pressing amount of the Vickers indenter 70 is estimated to be 1 μm. The Martens hardness HM (1) of the laminated body 1 at the time.

其中如圖5所示,積層體1亦可另外具備有被設在第2硬塗層3b之另一方之側的面上的第2表面層12b。第2表面層12b係與第1表面層12a同樣地,包含有:設在第2硬塗層3b之另一方之側的面上的第2折射率匹配層11b、設在第2折射率匹配層11b之另一方之側的面上的第2氧化矽層6b、設在第2氧化矽層6b之另一方之側的面上的第2透明導電層7b、及設在第2透明導電層7b之另一方之側的面上的第2遮光導電層8b。第2折射率匹配層11b係與第1折射率匹配層11a同樣地,包含有:第2高折射率層4b、及設在第2高折射率層4b之另一方之側的第2低折射率層5b。構成第2高折射率層4b、第2低折射率層5b、第2氧化矽層6b、第2透明導電層7b及第2遮光導電層8b的材料係與構成第1高折射率層4a、第1低折射率層5a、第1氧化矽層6a、第1透明導電層7a及第1遮光導電層8a的材料為相同,故省略詳細說明。 As shown in FIG. 5, the laminated body 1 may be further provided with the second surface layer 12b provided on the other side of the second hard coat layer 3b. Similarly to the first surface layer 12a, the second surface layer 12b includes a second index matching layer 11b provided on the other side of the second hard coat layer 3b, and a second index matching layer. a second ruthenium oxide layer 6b on the other side of the layer 11b, a second transparent conductive layer 7b provided on the other side of the second ruthenium oxide layer 6b, and a second transparent conductive layer. The second light-shielding conductive layer 8b on the surface on the other side of 7b. Similarly to the first index matching layer 11a, the second index matching layer 11b includes the second high refractive index layer 4b and the second low refractive index provided on the other side of the second high refractive index layer 4b. Rate layer 5b. The material constituting the second high refractive index layer 4b, the second low refractive index layer 5b, the second yttria layer 6b, the second transparent conductive layer 7b, and the second light-shielding conductive layer 8b is configured to constitute the first high refractive index layer 4a, Since the materials of the first low refractive index layer 5a, the first hafnium oxide layer 6a, the first transparent conductive layer 7a, and the first light-shielding conductive layer 8a are the same, detailed description thereof will be omitted.

在圖5所示之例中,第2表面層12b的厚度係與第1表面層12a的情形同樣地,小於1μm。此外第2 硬塗層3b係被設計成第2表面層12b的厚度及第2硬塗層3b的厚度的合計為大於1μm。例如第2硬塗層3b的厚度係成為0.8μm~7.0μm的範圍內。此外第2硬塗層3b係被設計成藉由由積層體1之另一方之側將維氏壓頭壓入在積層體1所測定的馬氏硬度在維氏壓頭的最大壓入量為1μm時成為270N/mm2以上。因此,即使在積層體1之另一方之側的表面1b因異物而被按壓的情形下,亦可藉由第2硬塗層3b來抑制第2表面層12b的變形到達塑性變形區域的情形。藉此,可抑制在積層體1之另一方之側的表面1b形成壓痕。 In the example shown in FIG. 5, the thickness of the second surface layer 12b is less than 1 μm as in the case of the first surface layer 12a. Further, the second hard coat layer 3b is designed such that the total thickness of the second surface layer 12b and the thickness of the second hard coat layer 3b are more than 1 μm. For example, the thickness of the second hard coat layer 3b is in the range of 0.8 μm to 7.0 μm. Further, the second hard coat layer 3b is designed such that the maximum indentation amount of the Vickers indenter measured by the Vickers hardness measured by pressing the Vickers indenter into the laminated body 1 from the other side of the laminated body 1 is When it is 1 μm, it becomes 270 N/mm 2 or more. Therefore, even when the surface 1b on the other side of the laminated body 1 is pressed by foreign matter, the deformation of the second surface layer 12b can be suppressed from reaching the plastic deformation region by the second hard coat layer 3b. Thereby, it is possible to suppress the formation of an indentation on the surface 1b on the other side of the laminated body 1.

接著,說明由如上所示之構成所成之本實施形態之作用及效果。在此,首先參照圖1至圖3,說明使用積層體製造裝置15來製造積層體1之方法之一例。接著,參照圖8及圖9,說明藉由將積層體1圖案化所得之薄膜感測器60。 Next, the operation and effect of the embodiment made up of the above configuration will be described. Here, first, an example of a method of manufacturing the laminated body 1 using the laminated body manufacturing apparatus 15 will be described with reference to FIGS. 1 to 3. Next, a film sensor 60 obtained by patterning the laminated body 1 will be described with reference to FIGS. 8 and 9.

積層體之製造方法 Manufacturing method of laminated body

首先準備基材薄膜2。接著,使用塗佈機,將含有丙烯酸系樹脂的塗佈液塗敷在基材薄膜2的兩側。藉此,在基材薄膜2的兩側形成硬塗層3a、3b。接著,使用塗佈機,將含有有機樹脂及被分散在有機樹脂內的高折射率材料的粒子,例如氧化鋯的粒子的塗佈液塗敷在第1硬塗層3a之其中一方之側的面上。藉此,在第1硬塗層3a上形成第1高折射率層4a。之後,使用塗佈機,將含有有機 樹脂及被分散在有機樹脂內的低折射率材料的粒子,例如氧化矽的粒子的塗佈液塗敷在第1高折射率層4a之其中一方之側的面上。藉此,在第1高折射率層4a上形成第1低折射率層5a。之後,使用濺鍍法等真空成膜法,在第1低折射率層5a上形成第1氧化矽層6a。同樣地,使用濺鍍法等真空成膜法,在第1氧化矽層6a上形成第1透明導電層7a。其中亦有將如上所得之包含基材薄膜2、硬塗層3a、3b、第1高折射率層4a、第1低折射率層5a、第1氧化矽層6a及第1透明導電層7a的積層體稱為中間積層體10(參照圖4)的情形。 First, the base film 2 is prepared. Next, a coating liquid containing an acrylic resin is applied to both sides of the base film 2 by using a coater. Thereby, the hard coat layers 3a and 3b are formed on both sides of the base film 2. Then, a coating liquid containing particles of a high refractive index material dispersed in the organic resin, for example, particles of zirconia, is applied to one side of the first hard coat layer 3a by using a coater. On the surface. Thereby, the first high refractive index layer 4a is formed on the first hard coat layer 3a. After that, using a coater, it will contain organic The resin and the particles of the low refractive index material dispersed in the organic resin, for example, the coating liquid of the particles of cerium oxide are applied to the surface on one side of the first high refractive index layer 4a. Thereby, the first low refractive index layer 5a is formed on the first high refractive index layer 4a. Thereafter, the first hafnium oxide layer 6a is formed on the first low refractive index layer 5a by a vacuum film formation method such as sputtering. Similarly, the first transparent conductive layer 7a is formed on the first ruthenium oxide layer 6a by a vacuum film formation method such as sputtering. The substrate film 2, the hard coat layers 3a and 3b, the first high refractive index layer 4a, the first low refractive index layer 5a, the first hafnium oxide layer 6a, and the first transparent conductive layer 7a obtained as described above are also obtained. The laminated body is referred to as the intermediate laminated body 10 (refer to FIG. 4).

接著如圖1所示,在放捲裝置20中,準備捲繞有中間積層體10的軸21,接著,朝向成膜裝置30放捲出中間積層體10。 Next, as shown in FIG. 1, in the unwinding device 20, the shaft 21 around which the intermediate laminated body 10 is wound is prepared, and then the intermediate laminated body 10 is unwound toward the film forming apparatus 30.

接著,使用成膜裝置30,實施在中間積層體10之其中一方之側設置第1遮光導電層8a的成膜工程。在成膜工程中,首先藉由排氣手段31a,將第1區域31的內部的氣體排出至外部,藉此,將第1區域31內形成為真空狀態。此時,第2區域33及第3區域35亦藉由使用排氣手段33a及排氣手段35a而形成為真空狀態。接著,藉由惰性氣體供給裝置(未圖示),在第1區域31內導入氬等惰性氣體,之後,藉由放電裝置,對靶材32a施加放電電力。藉此可藉由所產生的濺鍍現象,將由構成靶材32a的APC合金所成之第1遮光導電層8a設在中間積層體10的第1透明導電層7a上。其中,濺鍍時之放電 電力或放電時間、惰性氣體的分壓等條件係依所希望的膜厚或搬送鼓輪38的旋轉速度等作適當設定。 Next, using the film forming apparatus 30, a film forming process in which the first light-shielding conductive layer 8a is provided on one side of the intermediate laminated body 10 is performed. In the film forming process, first, the gas inside the first region 31 is discharged to the outside by the exhaust means 31a, whereby the inside of the first region 31 is formed into a vacuum state. At this time, the second region 33 and the third region 35 are also formed into a vacuum state by using the exhaust means 33a and the exhaust means 35a. Then, an inert gas such as argon is introduced into the first region 31 by an inert gas supply device (not shown), and then discharge electric power is applied to the target 32a by the discharge device. Thereby, the first light-shielding conductive layer 8a made of the APC alloy constituting the target 32a can be provided on the first transparent conductive layer 7a of the intermediate laminated body 10 by the sputtering phenomenon. Among them, the discharge during sputtering Conditions such as the electric power or discharge time and the partial pressure of the inert gas are appropriately set depending on the desired film thickness, the rotational speed of the transport drum 38, and the like.

之後,在收捲裝置50中,藉由軸51纏繞包含:中間積層體10、及形成在中間積層體10上的第1遮光導電層8a的積層體1。藉此,獲得積層體1的捲繞體。 Thereafter, in the winding device 50, the laminated body 1 including the intermediate laminated body 10 and the first light-shielding conductive layer 8a formed on the intermediate laminated body 10 is wound by the shaft 51. Thereby, the wound body of the laminated body 1 is obtained.

但是如圖2及圖3所示,在成膜裝置30中所被成膜的第1遮光導電層8a的表面係在至藉由軸51纏繞積層體1為止之間接觸導引滾筒39、59。此時,若在積層體1與導引滾筒39、59之間夾入異物時,積層體1的表面1a,亦即第1遮光導電層8a的表面被異物按壓。在此藉由本實施形態,第1表面層12a的厚度及第1硬塗層3a的厚度的合計係成為大於1μm,而且,藉由由積層體1之其中一方之側將維氏壓頭70壓入至積層體1所測定的馬氏硬度在維氏壓頭70的最大壓入量為1μm時成為270N/mm2以上。因此,可藉由第1硬塗層3a來抑制第1表面層12a的變形到達塑性變形區域的情形。藉此,可抑制在積層體1之其中一方之側的表面1a形成壓痕。 However, as shown in FIG. 2 and FIG. 3, the surface of the first light-shielding conductive layer 8a formed in the film forming apparatus 30 is in contact with the guide rolls 39, 59 until the laminated body 1 is wound by the shaft 51. . At this time, when foreign matter is interposed between the laminated body 1 and the guide rolls 39 and 59, the surface 1a of the laminated body 1, that is, the surface of the first light-shielding conductive layer 8a is pressed by foreign matter. Here, in the present embodiment, the total thickness of the first surface layer 12a and the thickness of the first hard coat layer 3a are more than 1 μm, and the Vickers indenter 70 is pressed by the side of one of the laminated bodies 1. The Martens hardness measured in the laminated body 1 is 270 N/mm 2 or more when the maximum pressing amount of the Vickers indenter 70 is 1 μm. Therefore, the deformation of the first surface layer 12a can be suppressed from reaching the plastic deformation region by the first hard coat layer 3a. Thereby, it is possible to suppress the formation of an indentation on the surface 1a on the side of one of the laminated bodies 1.

其中,亦可在如上所述所得之積層體1之另一方之側另外設置上述第2表面層12b,藉此製造圖5所示之積層體1。此時,亦可使已經形成有第1遮光導電層8a的積層體的表背反轉後,將該積層體再次搬入至積層體製造裝置15,藉此形成第2遮光導電層8b。此時,已經形成的第1遮光導電層8a係在製造工程之間接觸搬送 鼓輪38、導引滾筒59或臨近滾筒53。因此,在製造圖5所示之積層體1的工程中,與製造圖4所示之積層體1的工程的情形相比,第1遮光導電層8a的表面被異物按壓的機會大增。此時亦藉由本實施形態,適當調整第1硬塗層3a的厚度等,藉此可抑制在第1遮光導電層8a的表面形成壓痕。其中臨近滾筒53係指以可移動的方式構成為被纏繞在軸51的積層體1的最外面、與臨近滾筒53之中與軸51相對向的面之間的距離比積層體1的厚度稍微大的滾筒。 In addition, the second surface layer 12b may be separately provided on the other side of the laminated body 1 obtained as described above, whereby the laminated body 1 shown in FIG. 5 may be produced. At this time, the front and back of the laminated body in which the first light-shielding conductive layer 8a has been formed may be reversed, and the laminated body may be carried again into the laminated body manufacturing apparatus 15 to form the second light-shielding conductive layer 8b. At this time, the first light-shielding conductive layer 8a which has been formed is contact-transported between manufacturing processes. The drum 38, the guide roller 59 or adjacent to the drum 53. Therefore, in the process of manufacturing the laminated body 1 shown in FIG. 5, the chance of the surface of the first light-shielding conductive layer 8a being pressed by foreign matter is greatly increased as compared with the case of manufacturing the laminated body 1 shown in FIG. At this time, in the present embodiment, the thickness of the first hard coat layer 3a or the like is appropriately adjusted, whereby the formation of an indentation on the surface of the first light-shielding conductive layer 8a can be suppressed. The adjacent roller 53 means that the distance between the outermost surface of the laminated body 1 wound around the shaft 51 and the surface facing the shaft 51 adjacent to the roller 51 is movably smaller than the thickness of the laminated body 1 Big roller.

觸控面板感測器之製造方法 Touch panel sensor manufacturing method

接著,以積層體1之用途之一例而言,說明藉由將積層體1進行圖案化所得之薄膜感測器(觸控面板感測器)60。薄膜感測器60係被設在液晶顯示面板或有機EL顯示面板等顯示面板的觀察者側,包含用以檢測人體等被檢測體的接觸位置的透明導電圖案等的感測器。以薄膜感測器60而言,已知有根據來自被檢測體的壓力來檢測觸控部位的電阻膜方式的薄膜感測器、或根據來自人體等被檢測體的靜電來檢測觸控部位的靜電電容方式的薄膜感測器等各種類型,惟在此參照圖8及圖9,說明藉由將積層體1圖案化來形成靜電電容方式的薄膜感測器60之例。圖8係顯示薄膜感測器60的平面圖,圖9係沿著圖8所示之薄膜感測器60的線IX-IX的剖面圖。其中,在圖8及圖9中,係藉由使用圖5所示之具備有第1表面層12a及第 2表面層12b的積層體1,來製作薄膜感測器60。 Next, a thin film sensor (touch panel sensor) 60 obtained by patterning the laminated body 1 will be described as an example of the use of the laminated body 1. The film sensor 60 is provided on the observer side of a display panel such as a liquid crystal display panel or an organic EL display panel, and includes a sensor for detecting a transparent conductive pattern such as a contact position of a subject such as a human body. In the case of the film sensor 60, a thin film sensor in which a resistive film is detected based on pressure from a subject, or a static touch from a subject such as a human body is known to detect a touched portion. Various types of capacitive sensor type thin film sensors, etc., however, an example of forming a capacitive thin film sensor 60 by patterning the laminated body 1 will be described with reference to FIGS. 8 and 9. 8 is a plan view showing the film sensor 60, and FIG. 9 is a cross-sectional view taken along line IX-IX of the film sensor 60 shown in FIG. In FIG. 8 and FIG. 9, the first surface layer 12a and the first surface layer are provided by using FIG. The laminated body 1 of the surface layer 12b is used to fabricate a thin film sensor 60.

如圖8所示,薄膜感測器60係具備有用以檢測因手指等外部導體的接近而起之靜電電容的變化的透明導電圖案62a、62b。透明導電圖案62a、62b係由:被配置在基材薄膜2之其中一方之側,朝圖8的橫方向延伸的第1透明導電圖案62a、及被配置在基材薄膜2之另一方之側,朝圖8的縱方向延伸的第2透明導電圖案62b所構成。此外薄膜感測器60係另外具備有:與第1透明導電圖案62a相連接的第1取出圖案64a、及與第2透明導電圖案62b相連接的第2取出圖案64b。此外,亦可另外設有與各取出圖案64a、64b相連接,且用以將來自各透明導電圖案62a、62b的訊號取出至外部的端子部65a、65b。 As shown in FIG. 8, the film sensor 60 is provided with transparent conductive patterns 62a and 62b for detecting a change in electrostatic capacitance due to the proximity of an external conductor such as a finger. The transparent conductive patterns 62a and 62b are disposed on the one side of the base film 2, the first transparent conductive pattern 62a extending in the lateral direction of FIG. 8, and the other side of the base film 2 The second transparent conductive pattern 62b extending in the longitudinal direction of FIG. 8 is formed. Further, the film sensor 60 further includes a first extraction pattern 64a connected to the first transparent conductive pattern 62a and a second extraction pattern 64b connected to the second transparent conductive pattern 62b. Further, terminal portions 65a and 65b for connecting the respective extraction patterns 64a and 64b and for extracting signals from the respective transparent conductive patterns 62a and 62b to the outside may be additionally provided.

如圖9所示,透明導電圖案62a、62b係藉由將積層體1的透明導電層7a、7b圖案化而得者。同樣地,第1取出圖案64a係藉由將積層體1的第1遮光導電層8a圖案化而得者。此外,雖在圖9中未圖示,但是第1端子部65a亦為藉由將積層體1的第1遮光導電層8a圖案化而得者,此外,第2取出圖案64b及第2端子部65b係藉由將積層體1的第2遮光導電層8b圖案化而得者。以將透明導電層7a、7b及遮光導電層8a、8b圖案化的方法而言,係使用例如光微影法。其中,如圖9所示,積層體1的氧化矽層6a、6b亦可以具有與透明導電圖案62a、62b或取出圖案64a、64b相對應的圖案的方式予以圖案 化。 As shown in FIG. 9, the transparent conductive patterns 62a and 62b are obtained by patterning the transparent conductive layers 7a and 7b of the laminated body 1. Similarly, the first extraction pattern 64a is obtained by patterning the first light-shielding conductive layer 8a of the laminated body 1. Further, although not shown in FIG. 9, the first terminal portion 65a is formed by patterning the first light-shielding conductive layer 8a of the laminated body 1, and the second extraction pattern 64b and the second terminal portion are also provided. 65b is obtained by patterning the second light-shielding conductive layer 8b of the laminated body 1. For the method of patterning the transparent conductive layers 7a and 7b and the light-shielding conductive layers 8a and 8b, for example, a photolithography method is used. Here, as shown in FIG. 9, the yttrium oxide layers 6a, 6b of the laminated body 1 may be patterned in such a manner as to correspond to the transparent conductive patterns 62a, 62b or the patterns of the extraction patterns 64a, 64b. Chemical.

藉由本實施形態,以藉由由積層體1的表面1a及表面1b將維氏壓頭70壓入至積層體1所被測定的馬氏硬度在維氏壓頭70的最大壓入量為1μm時成為270N/mm2以上的方式設計第1硬塗層3a及第2硬塗層3b。因此,可抑制在將積層體1圖案化的工程之間在遮光導電層8a、8b的表面形成壓痕的情形。藉此,可使薄膜感測器60的良率提升。其中,薄膜感測器60雖未圖示,亦可另外具備有用以保護藉由將遮光導電層8a、8b圖案化所得之取出圖案64a、64b的保護層。 According to the present embodiment, the maximum indentation amount of the Vickers indenter 70 is 1 μm by the Martens hardness measured by pressing the Vickers indenter 70 onto the laminated body 1 from the front surface 1a and the surface 1b of the laminated body 1. In the case of 270 N/mm 2 or more, the first hard coat layer 3a and the second hard coat layer 3b are designed. Therefore, it is possible to suppress the formation of an indentation on the surfaces of the light-shielding conductive layers 8a and 8b between the processes of patterning the laminated body 1. Thereby, the yield of the film sensor 60 can be improved. The film sensor 60 may be provided with a protective layer for protecting the extraction patterns 64a and 64b obtained by patterning the light-shielding conductive layers 8a and 8b, although not shown.

其中,考慮到若上述馬氏硬度變得過大時,硬塗層3a、3b與表面層12a、12b之間的密接性會變得不充分,或在硬塗層3a、3b容易發生裂痕。因此,較佳為以如上所述所測定的馬氏硬度成為預定的上限值以下的方式設計硬塗層3a、3b。以上限值而言,係可列舉例如500N/mm2In addition, it is considered that when the Martens hardness is excessively large, the adhesion between the hard coat layers 3a and 3b and the surface layers 12a and 12b may be insufficient, or the hard coat layers 3a and 3b may be easily cracked. Therefore, it is preferable to design the hard coat layers 3a and 3b so that the Martens hardness measured as described above becomes equal to or less than a predetermined upper limit value. The above limit is, for example, 500 N/mm 2 .

(積層體之層構成的變形例) (Modification of layer structure of laminated body)

在上述之本實施形態中,係顯示出在被使用在用以製作電子零件的積層體之中,關於包含第1透明導電層7a或第1遮光導電層8a的最終形態的積層體1,適當調整第1硬塗層3a的厚度等,藉此抑制在積層體1的表面1a形成壓痕之例。但是,藉由本實施形態之上述第1硬塗層3a所得之抑制壓痕形成的效果並非特別取決於設在第1 硬塗層3a之其中一方之側之層,亦即第1表面層12a的構成。亦即,只要設在第1硬塗層3a之其中一方之側的第1表面層12a包含至少1個任意層,即可藉由第1硬塗層3a來抑制在藉由第1表面層12a所構成的積層體1的表面1a形成壓痕。 In the above-described embodiment, the laminated body 1 including the final form of the first transparent conductive layer 7a or the first light-shielding conductive layer 8a is suitably used in the laminated body for producing an electronic component. The thickness of the first hard coat layer 3a or the like is adjusted to suppress the formation of an indentation on the surface 1a of the laminated body 1. However, the effect of suppressing the formation of the indentation obtained by the first hard coat layer 3a of the present embodiment is not particularly dependent on the first The layer on the side of one of the hard coat layers 3a, that is, the first surface layer 12a. In other words, if the first surface layer 12a provided on one of the first hard coat layers 3a includes at least one arbitrary layer, the first surface layer 12a can be suppressed by the first surface layer 12a. The surface 1a of the laminated body 1 formed is formed as an indentation.

以下例示可實現抑制壓痕形成之第1硬塗層3a的效果的積層體1的第1表面層12a的層構成。其中,第1表面層12a的層構成並非侷限於以下所示之例。 The layer configuration of the first surface layer 12a of the laminated body 1 which can suppress the effect of the first hard coat layer 3a for forming an indentation is exemplified below. However, the layer configuration of the first surface layer 12a is not limited to the examples shown below.

如圖10所示,在積層體1中被設在第1硬塗層3a之其中一方之側的第1表面層12a亦可包含第1折射率匹配層11a,而未包含其他第1氧化矽層6a、第1透明導電層7a、第1遮光導電層8a等。在圖10中係顯示第1折射率匹配層11a包含第1高折射率層4a、而未包含第1低折射率層5a之例。但是,第1折射率匹配層11a的構成並未特別限制,如圖11所示,第1折射率匹配層11a亦可為包含第1低折射率層5a,而未包含第1高折射率層4a者。此外如圖12所示,第1折射率匹配層11a亦可為包含第1高折射率層4a、及設在第1高折射率層4a之其中一方之側的第1低折射率層5a者。 As shown in FIG. 10, the first surface layer 12a provided on one side of the first hard coat layer 3a in the laminated body 1 may include the first index matching layer 11a, and does not include other first cerium oxide. The layer 6a, the first transparent conductive layer 7a, the first light-shielding conductive layer 8a, and the like. FIG. 10 shows an example in which the first index matching layer 11a includes the first high refractive index layer 4a and does not include the first low refractive index layer 5a. However, the configuration of the first index matching layer 11a is not particularly limited. As shown in FIG. 11, the first index matching layer 11a may include the first low refractive index layer 5a and may not include the first high refractive index layer. 4a. Further, as shown in FIG. 12, the first refractive index matching layer 11a may be a first low refractive index layer 5a including the first high refractive index layer 4a and one side of the first high refractive index layer 4a. .

如圖13所示,第1表面層12a係除了第1折射率匹配層11a以外,亦可另外包含設在第1折射率匹配層11a之其中一方之側的第1透明導電層7a。其中在圖13中係顯示第1折射率匹配層11a包含第1高折射率層4a及第1低折射率層5a之雙方之例,惟並非侷限於此, 與圖10及圖11的情形同樣地,第1折射率匹配層11a若包含第1高折射率層4a或第1低折射率層5a的至少一者即可。在以下圖14~圖16所示之積層體1的第1表面層12a中亦同樣地,第1折射率匹配層11a的具體構成並未特別限制。 As shown in FIG. 13, the first surface layer 12a may include a first transparent conductive layer 7a provided on one side of the first index matching layer 11a in addition to the first index matching layer 11a. FIG. 13 shows an example in which the first index matching layer 11a includes both the first high refractive index layer 4a and the first low refractive index layer 5a, but is not limited thereto. In the same manner as in the case of FIG. 10 and FIG. 11, the first refractive index matching layer 11a may include at least one of the first high refractive index layer 4a or the first low refractive index layer 5a. Similarly to the first surface layer 12a of the laminated body 1 shown in FIG. 14 to FIG. 16, the specific configuration of the first refractive index matching layer 11a is not particularly limited.

此外如圖14所示,第1表面層12a係除了圖13所示之第1表面層12a的各層以外,亦可另外包含設在第1折射率匹配層11a與第1透明導電層7a之間的第1氧化矽層6a。 Further, as shown in FIG. 14, the first surface layer 12a may be provided separately between the first refractive index matching layer 11a and the first transparent conductive layer 7a in addition to the respective layers of the first surface layer 12a shown in FIG. The first yttria layer 6a.

此外如圖15所示,第1表面層12a係除了圖14所示之第1表面層12a的各層以外,亦可另外包含設在第1透明導電層7a之其中一方之側的第1遮光導電層8a。 Further, as shown in FIG. 15, the first surface layer 12a may include the first light-shielding conductive layer provided on one side of the first transparent conductive layer 7a in addition to the respective layers of the first surface layer 12a shown in FIG. Layer 8a.

此外如圖16所示,第1表面層12a係除了圖13所示之第1表面層12a的各層以外,亦可另外包含設在第1透明導電層7a之其中一方之側的第1遮光導電層8a。 Further, as shown in FIG. 16, the first surface layer 12a may include the first light-shielding conductive layer provided on one side of the first transparent conductive layer 7a in addition to the respective layers of the first surface layer 12a shown in FIG. Layer 8a.

此外如圖17所示,在積層體1中被設在第1硬塗層3a之其中一方之側的第1表面層12a亦可包含第1氧化矽層6a,且未包含其他之第1折射率匹配層11a、第1透明導電層7a、第1遮光導電層8a等。 Further, as shown in FIG. 17, the first surface layer 12a provided on one side of the first hard coat layer 3a in the laminated body 1 may include the first ruthenium oxide layer 6a and does not include other first refracting layers. The rate matching layer 11a, the first transparent conductive layer 7a, the first light-shielding conductive layer 8a, and the like.

此外如圖18所示,第1表面層12a係除了圖17所示之第1氧化矽層6a以外,亦可另外包含設在第1氧化矽層6a之其中一方之側的第1透明導電層7a。 Further, as shown in FIG. 18, the first surface layer 12a may further include a first transparent conductive layer provided on one side of the first ruthenium oxide layer 6a in addition to the first ruthenium oxide layer 6a shown in FIG. 7a.

此外如圖19所示,第1表面層12a係除了圖18所示之第1表面層12a的各層以外,亦可另外包含設在第1透明導電層7a之其中一方之側的第1遮光導電層8a。 Further, as shown in FIG. 19, the first surface layer 12a may include a first light-shielding conductive layer provided on one side of the first transparent conductive layer 7a in addition to the respective layers of the first surface layer 12a shown in FIG. Layer 8a.

在圖10~圖19所示之積層體1之任一者中均藉由將本實施形態之上述第1硬塗層3a設在基材薄膜2之其中一方之側,可抑制在積層體1的表面1a形成壓痕。其中雖未圖示,在圖10~圖19所示之積層體1中,亦與圖5所示之積層體1同樣地,亦可在第2硬塗層3b之另一方之側設有具有與第1表面層12a相同的層構成的第2表面層12b。其中,設在第2硬塗層3b之另一方之側的第2表面層12b的構成亦可具有與設在第1硬塗層3a之其中一方之側的第1表面層12a為相同的層構成,或者亦可具有不同的層構成。例如,第2表面層12b係可具有在上述之本實施形態或變形例中所說明之第1表面層12a的各種層構成的任一者。 In any of the laminated bodies 1 shown in FIG. 10 to FIG. 19, the first hard coat layer 3a of the present embodiment is provided on one side of the base film 2, so that the laminated body 1 can be suppressed. The surface 1a forms an indentation. Although not shown, the laminated body 1 shown in FIG. 10 to FIG. 19 may be provided on the other side of the second hard coat layer 3b in the same manner as the laminated body 1 shown in FIG. The second surface layer 12b composed of the same layer as the first surface layer 12a. In addition, the second surface layer 12b provided on the other side of the second hard coat layer 3b may have the same layer as the first surface layer 12a provided on one of the first hard coat layers 3a. It may be constructed or may have a different layer composition. For example, the second surface layer 12b may have any of various layer configurations of the first surface layer 12a described in the above-described embodiment or modification.

〔實施例〕 [Examples]

接著,藉由實施例,更具體說明本發明,惟本發明只要未超出其要旨,則未限定於以下實施例的記載。 The present invention will be more specifically described by the examples, but the present invention is not limited to the description of the following examples, unless the scope of the invention is exceeded.

(試樣A1) (Sample A1)

製作出具備有:基材薄膜、及依序設在基材薄膜之其 中一方之側及另一方之側的硬塗層、高折射率層、低折射率層、氧化矽層、透明導電層及遮光導電層的積層體。基材薄膜、硬塗層、高折射率層、低折射率層、氧化矽層、透明導電層及遮光導電層的厚度分別為188μm、1.5μnm、45nm、40nm、5nm、30nm及150nm。 Produced with: a substrate film, and sequentially disposed on the substrate film A layered body of a hard coat layer, a high refractive index layer, a low refractive index layer, a ruthenium oxide layer, a transparent conductive layer, and a light-shielding conductive layer on the side of the other side and the other side. The thicknesses of the base film, the hard coat layer, the high refractive index layer, the low refractive index layer, the ruthenium oxide layer, the transparent conductive layer, and the light-shielding conductive layer were 188 μm, 1.5 μm, 45 nm, 40 nm, 5 nm, 30 nm, and 150 nm, respectively.

〔評估1馬氏硬度〕 [Evaluation 1 Martens hardness]

使用參照圖6(a)(b)所說明的方法,測定出維氏壓頭的最大壓入量為1μm時之積層體的馬氏硬度。結果,馬氏硬度為250N/mm2The Martens hardness of the laminate when the maximum indentation amount of the Vickers indenter was 1 μm was measured by the method described with reference to Fig. 6 (a) and (b). As a result, the Martens hardness was 250 N/mm 2 .

〔評估2壓痕〕 [Evaluation 2 indentation]

在將被施加至積層體的張力形成為125N的條件之下,使用導輥搬送薄片狀積層體,評估此時在積層體的表面是否形成有壓痕。結果,在積層體的表面,以40個/m2的密度確認出壓痕。作為參考,將以數位攝影機拍攝形成有壓痕的表面後的結果顯示在圖20(a)(b)。圖20(a)係顯示形成有壓痕的積層體的遮光導電層的表面的照片,圖20(b)係顯示使遮光導電層由圖20(a)所示之積層體剝離後的表面的照片。 Under the condition that the tension applied to the laminated body was set to 125 N, the sheet-like laminated body was conveyed using a guide roller, and it was evaluated whether or not an indentation was formed on the surface of the laminated body at this time. As a result, the indentation was confirmed at a density of 40/m 2 on the surface of the laminate. For reference, the result of photographing the surface on which the indentation is formed by a digital camera is shown in Fig. 20 (a) and (b). Fig. 20 (a) is a photograph showing the surface of the light-shielding conductive layer of the laminate in which the indentation is formed, and Fig. 20 (b) shows the surface of the light-shielding conductive layer peeled off from the laminate shown in Fig. 20 (a). photo.

(試樣A2) (Sample A2)

除了氧化矽層的厚度為7nm以外,針對與試樣A1為相同的積層體,與試樣A1的情形同樣地,測定馬氏硬度 的測定,此外,評估在積層體的表面是否形成有壓痕。結果,馬氏硬度為255N/mm2。此外,在積層體的表面,以39個/m2的密度確認出壓痕。 In the same manner as in the case of the sample A1, the measurement of the Martens hardness was performed in the same manner as in the case of the sample A1 except that the thickness of the ruthenium oxide layer was 7 nm, and it was evaluated whether or not an indentation was formed on the surface of the laminate. . As a result, the Martens hardness was 255 N/mm 2 . Further, indentations were confirmed at a density of 39/m 2 on the surface of the laminate.

(試樣B1) (sample B1)

關於包含基材薄膜、硬塗層、高折射率層、氧化矽層、透明導電層及遮光導電層,且各層的厚度分別為188μm、4.5μm、45nm、45nm、30nm及150nm的積層體,與試樣A1的情形同樣地,測定馬氏硬度的測定,此外,評估在積層體的表面是否形成有壓痕。結果,馬氏硬度為295N/mm2。此外,在積層體的表面並未被確認出壓痕。 a laminate comprising a base film, a hard coat layer, a high refractive index layer, a ruthenium oxide layer, a transparent conductive layer, and a light-shielding conductive layer, and each layer having a thickness of 188 μm, 4.5 μm, 45 nm, 45 nm, 30 nm, and 150 nm, respectively In the same manner as in the sample A1, the measurement of the Martens hardness was measured, and it was evaluated whether or not an indentation was formed on the surface of the laminate. As a result, the Martens hardness was 295 N/mm 2 . Further, no indentation was confirmed on the surface of the laminate.

(試樣B2) (sample B2)

關於包含基材薄膜、硬塗層、高折射率層、低折射率層、氧化矽層、透明導電層及遮光導電層,且各層的厚度分別為188μm、4.5μm、45nm、40nm、5nm、30nm及150nm的積層體,與試樣A1的情形同樣地,測定馬氏硬度的測定,此外,評估在積層體的表面是否形成有壓痕。結果,馬氏硬度為290N/mm2。此外,在積層體的表面並未被確認出壓痕。 The substrate film, the hard coat layer, the high refractive index layer, the low refractive index layer, the hafnium oxide layer, the transparent conductive layer, and the light-shielding conductive layer are included, and the thickness of each layer is 188 μm, 4.5 μm, 45 nm, 40 nm, 5 nm, and 30 nm, respectively. In the same manner as in the case of the sample A1, the laminate of 150 nm was measured for the measurement of the Martens hardness, and it was evaluated whether or not an indentation was formed on the surface of the laminate. As a result, the Martens hardness was 290 N/mm 2 . Further, no indentation was confirmed on the surface of the laminate.

(其他試樣) (other samples)

在圖21顯示試樣A1、A2、B1及B2中的馬氏硬度及 壓痕的密度的評估結果。此外,在圖21中一併顯示構成試樣A1、A2,B1及B2的積層體的各層的厚度。此外,準備具有各種層構成的積層體,針對該等各積層體,與試樣A1的情形同樣地,測定馬氏硬度的測定,此外,評估在積層體的表面是否形成有壓痕。將結果一併顯示於圖21。在圖21所示之各試樣之中,試樣B3~B17係包含具有2.0μm以上的厚度的硬塗層,而且,馬氏硬度的測定結果為270N/mm2以上的試樣。另一方面,試樣A3~A17係包含具有0.7μm的厚度的硬塗層,而且,馬氏硬度的測定結果為235N/mm2以下的試樣。 Fig. 21 shows the results of evaluation of the Martens hardness and the density of the indentations in the samples A1, A2, B1 and B2. Further, the thickness of each layer constituting the laminate of the samples A1, A2, B1, and B2 is shown together in FIG. In addition, a laminate having various layer configurations was prepared, and the measurement of the Martens hardness was measured for each of the laminates in the same manner as in the case of the sample A1, and it was evaluated whether or not an indentation was formed on the surface of the laminate. The results are shown together in Figure 21. Among the samples shown in Fig. 21, the samples B3 to B17 contained a hard coat layer having a thickness of 2.0 μm or more, and the measurement result of the Martens hardness was 270 N/mm 2 or more. On the other hand, the samples A3 to A17 contained a hard coat layer having a thickness of 0.7 μm, and the measurement result of the Martens hardness was 235 N/mm 2 or less.

由試樣A1~A17與試樣B1~B17的比較可知,以積層體的馬氏硬度為270N/mm2以上、更佳為290N/mm2以上的方式設計硬塗層,藉此可防止或抑制在積層體的表面形成壓痕。 From the comparison of the samples A1 to A17 and the samples B1 to B17, it is understood that the hard coat layer is designed such that the Martens hardness of the laminate is 270 N/mm 2 or more, more preferably 290 N/mm 2 or more, thereby preventing or Inhibition is formed on the surface of the laminate.

1‧‧‧積層體 1‧‧ ‧ laminated body

1a‧‧‧積層體1之其中一方之側的表面 1a‧‧‧ Surface of the side of one of the laminated bodies 1

1b‧‧‧積層體1之另一方之側的表面 1b‧‧‧ Surface of the other side of the laminated body 1

2‧‧‧基材薄膜 2‧‧‧Substrate film

2a‧‧‧設在基材薄膜2之其中一方之側的面 2a‧‧‧Side on the side of one of the base film 2

2b‧‧‧設在基材薄膜2之另一方的面 2b‧‧‧ is provided on the other side of the base film 2

3a、3b‧‧‧硬塗層 3a, 3b‧‧‧ hard coating

4a‧‧‧高折射率層 4a‧‧‧High refractive index layer

5a‧‧‧低折射率層 5a‧‧‧Low refractive index layer

6a‧‧‧氧化矽層 6a‧‧‧Oxide layer

7a‧‧‧透明導電層 7a‧‧‧Transparent conductive layer

8a‧‧‧遮光導電層 8a‧‧‧ shading conductive layer

10‧‧‧中間積層體 10‧‧‧Intermediate laminate

11a‧‧‧折射率匹配層 11a‧‧‧index matching layer

12a‧‧‧表面層 12a‧‧‧Surface

Claims (15)

一種積層體,其係被使用在用以製作觸控面板用的薄膜感測器的積層體,該積層體具有其中一方之側的面及另一方之側的面,該積層體係具備有:基材薄膜;被設在前述基材薄膜之其中一方之側的面上的第1硬塗層;及被設在前述第1硬塗層之其中一方之側的面上的第1表面層,前述第1表面層的厚度係小於1μm,前述第1表面層的厚度及前述第1硬塗層的厚度的合計係大於1μm,藉由由前述積層體之其中一方之側將維氏壓頭(Vickers indenter)壓入在前述積層體所測定的馬氏硬度在前述維氏壓頭的最大壓入量為1μm時成為270N/mm2以上。 A laminated body which is used in a laminated body for producing a thin film sensor for a touch panel, wherein the laminated body has a surface on one side and a side on the other side, and the laminated system is provided with a base a first hard coat layer provided on a surface of one side of the base film; and a first surface layer provided on a surface of one side of the first hard coat layer, The thickness of the first surface layer is less than 1 μm, and the total thickness of the first surface layer and the thickness of the first hard coat layer is more than 1 μm, and the Vickers indenter is provided by one side of the laminated body (Vickers) Indenter) The Martens hardness measured by the laminate is 270 N/mm 2 or more when the maximum indentation amount of the Vickers indenter is 1 μm. 如申請專利範圍第1項之積層體,其中,前述第1表面層係包含被設在前述第1硬塗層上的第1折射率匹配層。 The laminate according to the first aspect of the invention, wherein the first surface layer comprises a first index matching layer provided on the first hard coat layer. 如申請專利範圍第2項之積層體,其中,前述第1表面層係另外包含被設在前述第1折射率匹配層之其中一方之側且具有透光性及導電性的第1透明導電層。 The laminate according to the second aspect of the invention, wherein the first surface layer further comprises a first transparent conductive layer provided on one side of the first index matching layer and having translucency and conductivity. . 如申請專利範圍第3項之積層體,其中,前述第1表面層係另外包含被設在前述第1折射率匹配層與前述第 1透明導電層之間,且由氧化矽所構成之第1氧化矽層。 The laminate according to claim 3, wherein the first surface layer further includes a first refractive index matching layer and the first A first ruthenium oxide layer composed of ruthenium oxide between the transparent conductive layers. 如申請專利範圍第4項之積層體,其中,前述第1表面層係另外包含被設在前述第1透明導電層之其中一方之側,且具有遮光性及導電性的第1遮光導電層。 The laminate according to the fourth aspect of the invention, wherein the first surface layer further includes a first light-shielding conductive layer provided on one side of the first transparent conductive layer and having light-shielding properties and conductivity. 如申請專利範圍第3項之積層體,其中,前述第1表面層係另外包含被設在前述第1透明導電層之其中一方之側,且具有遮光性及導電性的第1遮光導電層。 The laminate according to the third aspect of the invention, wherein the first surface layer further includes a first light-shielding conductive layer provided on one side of the first transparent conductive layer and having light-shielding properties and conductivity. 如申請專利範圍第1項之積層體,其中,前述第1表面層係另外包含被設在前述第1硬塗層上,且由氧化矽所構成之第1氧化矽層。 The laminate according to the first aspect of the invention, wherein the first surface layer further comprises a first ruthenium oxide layer formed of the ruthenium oxide and provided on the first hard coat layer. 如申請專利範圍第7項之積層體,其中,前述第1表面層係另外包含被設在前述第1氧化矽層之其中一方之側,且具有透光性及導電性的第1透明導電層。 The laminate according to the seventh aspect of the invention, wherein the first surface layer further comprises a first transparent conductive layer provided on one side of the first ruthenium oxide layer and having light transmissivity and conductivity . 如申請專利範圍第8項之積層體,其中,前述第1表面層係另外包含被設在前述第1透明導電層之其中一方之側,且具有遮光性及導電性的第1遮光導電層。 The laminate according to the eighth aspect of the invention, wherein the first surface layer further comprises a first light-shielding conductive layer provided on one side of the first transparent conductive layer and having light-shielding properties and conductivity. 如申請專利範圍第1項至第9項中任一項之積層體,其中,前述第1硬塗層的厚度係成為0.8μm~7.0μm的範圍內。 The laminate of any one of the first to the ninth aspects, wherein the thickness of the first hard coat layer is in the range of 0.8 μm to 7.0 μm. 如申請專利範圍第1項之積層體,其中,前述第1表面層係至少包含具有透光性及導電性的第1透明導電層。 The laminate according to claim 1, wherein the first surface layer contains at least a first transparent conductive layer having light transmissivity and conductivity. 如申請專利範圍第11項之積層體,其中,前述第1表面層係另外包含被設在前述第1透明導電層之其中一 方之側,且具有遮光性及導電性的第1遮光導電層。 The laminate according to claim 11, wherein the first surface layer further comprises one of the first transparent conductive layers. A first light-shielding conductive layer having a light-shielding property and a conductive property on the side of the square. 如申請專利範圍第1項至第9項中任一項之積層體,其中,另外具備有:被設在前述基材薄膜之另一方之側的面上的第2硬塗層;及被設在前述第2硬塗層之另一方之側的面上的第2表面層,前述第2表面層的厚度係小於1μm,前述第2表面層的厚度及前述第2硬塗層的厚度的合計係大於1μm,藉由由前述積層體之另一方之側將維氏壓頭壓入在前述積層體所測定的馬氏硬度在前述維氏壓頭的最大壓入量為1μm時成為270N/mm2以上。 The laminated body according to any one of the items 1 to 9, further comprising: a second hard coat layer provided on a surface of the other side of the base film; and In the second surface layer on the other side of the second hard coat layer, the thickness of the second surface layer is less than 1 μm, and the thickness of the second surface layer and the thickness of the second hard coat layer are total It is greater than 1 μm, and the Martens hardness measured by pressing the Vickers indenter into the laminated body from the other side of the laminated body becomes 270 N/mm when the maximum pressing amount of the Vickers indenter is 1 μm. 2 or more. 一種薄膜感測器,其係具備有:基材薄膜;被設在前述基材薄膜之其中一方之側的面上的第1硬塗層;以預定的圖案設在第1硬塗層之其中一方之側,且具有透光性及導電性的第1透明導電圖案;及以預定的圖案設在第1透明導電圖案上,且具有遮光性及導電性的第1取出圖案,前述第1透明導電圖案及前述取出圖案係藉由將如申請專利範圍第5項、第9項或第12項中任一項之積層體的前述第1透明導電層及前述第1遮光導電層圖案化所得 者。 A film sensor comprising: a base film; a first hard coat layer provided on a side of one of the base film; and a first hard coat layer in a predetermined pattern a first transparent conductive pattern having light transmissivity and conductivity on one side, and a first extraction pattern provided on the first transparent conductive pattern in a predetermined pattern and having light blocking properties and conductivity, and the first transparent pattern The conductive pattern and the extraction pattern are obtained by patterning the first transparent conductive layer and the first light-shielding conductive layer of the laminate according to any one of claims 5, 9, or 12. By. 一種觸控面板裝置,其係包含:薄膜感測器、及檢測對前述薄膜感測器上的接觸位置的控制電路的觸控面板裝置,其特徵為:前述薄膜感測器具備有如申請專利範圍第14項之薄膜感測器。 A touch panel device comprising: a thin film sensor and a touch panel device for detecting a control circuit on a contact position of the thin film sensor, wherein the thin film sensor is provided with a patent application scope Film sensor of item 14.
TW103123620A 2013-08-05 2014-07-09 Used in laminated bodies for fabricating electronic parts, thin film sensors, and touch panel devices having thin film sensors TWI613078B (en)

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