TWI610723B - Substrate processing apparatus, jig and teaching method - Google Patents

Abstract

The present invention reduces the work performed by the operator for teaching, and enables more accurate teaching.

In the jig 70, the imaging unit 71 is arranged to face the scale surface 72A. In addition, imaging is performed by the imaging unit 71 in a state where the jig 70 is mounted on the rotary base 6 and the ejection portion 31 is positioned relative to the scale surface 72A of the jig 70. Therefore, according to the photographing result, the position information of the ejection portion 31 observed from the rotation base 6 can be obtained.

Description

Substrate processing device, jig, and teaching method

The invention relates to a substrate processing device, a jig, and a teaching method.

In the manufacturing steps of a semiconductor device or a liquid crystal display device, in order to perform a treatment with a processing liquid on a surface of a substrate such as a semiconductor wafer or a glass substrate for a liquid crystal display panel, there is a one-piece substrate processing using a one-by-one processing substrate Device situation.

For example, the substrate processing apparatus described in Patent Document 1 includes a rotating chuck for holding the substrate in a substantially horizontal posture and rotating, and a nozzle for ejecting a processing liquid toward a main surface of the substrate held by the rotating chuck; And a nozzle moving mechanism that moves the nozzle along a specific track passing the center of the substrate.

[Prior technical literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open No. 2011-77245

In liquid processing, there is a case where the nozzle is moved above the substrate by the nozzle moving mechanism, and then the processing liquid is ejected from the nozzle in a stopped state toward a specific position (for example, the center of rotation) on the surface of the substrate. In this case, if the nozzle is deviated from a desired position, there is a processing liquid that does not uniformly cover the surface of the substrate, and a treatment is generated on the substrate. Unevenness (uneven supply of treatment liquid).

In liquid processing, the nozzle may be moved (scanned) within a predetermined range on a specific trajectory, and the processing liquid may be ejected from the nozzle toward the substrate. In this case, if the nozzle deviates from a predetermined range and moves, it is difficult to perform a desired liquid treatment on the surface of the substrate.

Therefore, after the nozzles are assembled in the processing chamber that houses the nozzles, teaching operations are performed on a control device that controls the operation of the nozzles. In the teaching operation, the displacement amount registered from the mechanical origin position (hereinafter, referred to as "origin position") of the nozzle (or the member holding the nozzle) to the specific reference position on the trajectory is set in the control device. And an instruction value given to the nozzle moving unit to move the nozzle to the reference position.

Such teaching is usually performed manually by the operator. As an example, at the time of teaching, the operator holds a specific jig substrate marked with a specific reference position on the upper surface to a substrate holding mechanism. In addition, the operator uses a remote controller or the like to give an instruction value (for example, the number of pulses) to the substrate moving unit (for example, a stepping motor), and gradually moves the nozzle along the trajectory set above the substrate in small amounts. Then, at the reference positions marked on the upper surface of the jig substrate, the nozzles are aligned with each reference position visually. Then, the control device registers the displacement amount (shift amount from the origin position) when the nozzle coincides with the reference position and the instruction value given to the nozzle moving unit.

However, the teaching by manual work is extremely complicated and labor-intensive work, and it is impossible to avoid personal differences due to the operators.

Therefore, an object of the present invention is to provide a substrate processing apparatus, a jig, and a teaching method that can reduce the work performed by an operator for teaching and can realize more accurate teaching.

A substrate processing apparatus according to a first aspect of the present invention includes a substrate holding unit including a table-shaped base portion and holding the substrate horizontally above the base portion; The nozzle moves the processing fluid from the front end; the nozzle moving unit receives the control signal and moves the nozzle in the horizontal direction according to the control signal; the input unit is inputted with the information related to the displacement of the nozzle; the action A control unit that sends a control signal to control the operation of the nozzle moving unit according to the information input to the input unit; a jig that can attach and detach the peripheral end portion of the base unit; and a setting unit that The shooting result obtained sets an operation rule corresponding to the displacement amount of the nozzle and the instruction value of the control signal; and the jig includes: an imaging unit, in an installation state where the jig is installed at the peripheral end portion A horizontal direction is taken as a shooting direction; and a scale portion includes a scale surface on which a distance indicator is drawn, and the scale surface is spaced apart from the image pickup portion at an interval where the front end portion of the nozzle can be inserted and arranged oppositely; And inserting between the imaging portion and the scale surface between the front end portion and positioning the front end portion relative to the scale surface State for the imaging unit captures the distal end portion and said surface of the scale.

The substrate processing apparatus of the second aspect of the present invention is the substrate processing apparatus of the first aspect of the present invention, wherein the front end portion is in contact with the scale surface, and the front end portion is opposite to the scale surface. Positioning.

The substrate processing apparatus according to the third aspect of the present invention is the substrate processing apparatus according to the first aspect of the present invention, wherein the jig includes a fastening portion, and the fastening portion may be connected to the base portion. Part of the surface and part of the side are in close contact with each other, and the installation state is a state in which the specific area of the base portion is in close contact with the fastening portion of the jig, and the jig is hung on the base portion.

The substrate processing apparatus of the fourth aspect of the present invention is the substrate processing apparatus of the first aspect of the present invention, and further includes a coupling member, which is a rod-shaped body extending in the horizontal direction and has one end. The part is connected to the central part of the upper surface of the base part, and the other end part is connected to the jig. The mounting state is a state where the jig and the base part are connected via the coupling member.

The substrate processing apparatus according to the fifth aspect of the present invention is a substrate according to the first aspect of the present invention. The processing device is characterized in that the scale surface is arranged substantially parallel to a specific trajectory portion of the movement trajectory of the nozzle movement by the nozzle moving unit, and is located at the specific trajectory portion to be approximately the same as the movement trajectory. The orthogonal direction is the shooting direction.

The substrate processing apparatus of the sixth aspect of the present invention is the substrate processing apparatus of the first aspect of the present invention, characterized in that the length of the scale surface in the horizontal direction is longer than the horizontal direction of the front end portion of the nozzle. Width, and the entire width of the front end portion falls within the unfolded range of the scale surface that becomes the background, whereby both sides of the front end portion and the scale surface can be photographed collectively by using the imaging unit.

A substrate processing apparatus of a seventh aspect of the present invention is the substrate processing apparatus of the first aspect of the present invention, characterized in that the jig further includes an illuminating section which is arranged near the imaging section and is The imaging unit side illuminates the front end portion and the scale surface.

An eighth aspect of the substrate processing apparatus of the present invention is the substrate processing apparatus of the first aspect of the present invention, characterized in that in the above operation rule, the displacement amount of the nozzle and a control signal given to the nozzle moving unit The indicated value is linear.

A substrate processing apparatus according to a ninth aspect of the present invention is the substrate processing apparatus according to the first aspect of the present invention, characterized in that the movement trajectory of the front end portion crosses horizontally and is held by the substrate holding unit. The trajectory above the substrate is referred to as the first peripheral end position and the second peripheral end position when the peripheral end of the substrate held by the substrate holding unit intersects with the movement trajectory when viewed in a horizontal plane, respectively. The control unit controls the operation of the nozzle moving unit such that the nozzle moves to the first peripheral end position, and performs imaging by the imaging unit.

The substrate processing apparatus of the tenth aspect of the present invention is the substrate processing apparatus of the ninth aspect of the present invention, and further controls the above by the operation control unit such that the nozzle is moved to the two peripheral end position. In the state of the nozzle moving unit, By the above-mentioned camera.

The substrate processing apparatus according to the eleventh aspect of the present invention is the substrate processing apparatus according to any one of the first aspect to the tenth aspect of the present invention, wherein the front end portion is a discharge portion of the nozzle.

The substrate processing apparatus of the twelfth aspect of the present invention is the substrate processing apparatus of any one of the first aspect to the tenth aspect of the present invention, and further includes an accessory, which is mounted on the ejection of the nozzle The front end portion is the accessory attached to the discharge portion of the nozzle.

The jig of the thirteenth aspect of the present invention is characterized in that it is used by a user in a substrate processing apparatus, and the substrate processing apparatus includes a substrate holding unit having a base portion and horizontally above the base portion. A holding substrate; a nozzle that discharges a processing fluid from a front end portion; and a nozzle moving unit that moves the nozzle in a horizontal direction; the jig can be attached to and detached from a peripheral end portion of the base portion, and includes: an imaging portion, The jig is mounted on the peripheral end portion in a horizontal direction as a shooting direction; and a scale portion includes a scale surface on which a distance indicator is drawn, and the scale surface is separated from the imaging portion for the above The front end portion is arranged opposite to each other at an interval; and in a state where the front end portion is inserted between the imaging portion and the scale surface and the front end portion is positioned relative to the scale surface, the imaging portion photographs the front end portion And the above scale surface.

The teaching method of the fourteenth aspect of the present invention is characterized in that it is a person who sets an operation rule in a substrate processing device, and the substrate processing device corresponds to an indication value of a nozzle displacement unit and a control signal given to a nozzle moving unit. The operation rule is that the nozzle is moved and the processing fluid is ejected from the front end of the nozzle, thereby processing the substrate horizontally held above the base portion of the substrate holding unit. The above teaching method includes: (a) an input step, It is to input information related to the displacement amount of the nozzle; (b) Nozzle movement step, which is to send the above control signal to control the movement of the nozzle moving unit according to the input information input in the above input step; (c) treatment There is a moving step, which involves moving the camera With the scale and the scale part, the camera section takes the horizontal direction as the shooting direction. The scale section includes a scale surface on which a distance indicator is drawn, and the scale surface is separated from the camera section and can be inserted by the front end portion. They are arranged facing each other at intervals, and the state is such that the jig is mounted on the peripheral end portion of the base portion, and the front end portion of the nozzle after moving in the nozzle moving step is inserted into the imaging unit and Positioned between the scale surfaces and relative to the scale surface of the jig; (d) an imaging step, in a state obtained by the jig moving step, photographing the front end portion by the imaging unit And the scale surface; and (e) a setting step for setting the action rule based on a photographing result obtained in the imaging step.

In the first aspect to the twelfth aspect, and the fourteenth aspect of the present invention, the jig includes: an imaging unit, which is photographed in a horizontal direction in a state where the jig is mounted on a peripheral end portion of the base portion. Direction; and a scale section, which includes a scale surface on which a distance indicator is drawn, and the scale surface and the camera section are spaced apart from each other at an interval where the front end of the nozzle can be inserted and arranged opposite to each other. In a state where the front end portion is inserted between the imaging portion and the scale surface and the front end portion is positioned relative to the scale surface, the imaging portion photographs the front end portion and the scale surface. Then, according to the photographing result obtained by the jig, an action rule is set to correspond to the displacement amount of the nozzle and the instruction value of the control signal given to the nozzle moving unit. In this manner, the imaging by the imaging unit is performed in a state where the base portion, the jig, and the nozzle front end portion are respectively positioned. Therefore, based on the photographing results, the position information of the tip portion of the nozzle viewed from the base portion can be obtained. In particular, since a jig having an imaging unit is mounted on the peripheral end portion of the base portion, position information of the nozzle tip portion near the peripheral end portion of the base portion can be obtained.

In the aspect of the present invention in which the action rule is set based on the photographing result obtained by the jig, compared with other aspects in which the action rule is set based on the position information of the nozzle front end portion obtained by the operator's eyes Lightening of the work performed by the operator for teaching, and more accurate teaching can be achieved.

In addition, since the front end portion of the nozzle is photographed by the imaging portion having the horizontal direction as the imaging direction, the position of the front end portion of the nozzle can be accurately grasped by imaging.

The thirteenth aspect of the present invention is a jig suitable for the substrate processing apparatus of the first aspect to the twelfth aspect of the present invention and the teaching method of the fourteenth aspect.

1‧‧‧ substrate processing device

1A‧‧‧ substrate processing device

1B‧‧‧Substrate processing device

2‧‧‧ rotating chuck

3‧‧‧ Nozzle

4‧‧‧ chuck rotation drive mechanism

5‧‧‧rotation axis

6‧‧‧ rotating base

7‧‧‧ clamping member

8‧‧‧ supply pipe

9‧‧‧ Valve

10‧‧‧ arm

11‧‧‧ support shaft

12‧‧‧ Stepping Motor

14‧‧‧ Track

14A‧‧‧Track location

20‧‧‧Control Department

21‧‧‧Motor control section

22‧‧‧Drive circuit

23‧‧‧ home position

30‧‧‧Input Department

31‧‧‧Ejection Department

70‧‧‧Jig

71‧‧‧ Camera Department

72‧‧‧ scale

72A‧‧‧Scale surface

73‧‧‧Lighting Department

74‧‧‧Body

74A‧‧‧ lower surface

75‧‧‧ convex

75A‧‧‧curved surface

76‧‧‧Combined components

77‧‧‧Fixture

78‧‧‧ Annex

79‧‧‧ front end

720‧‧‧ tick marks

721‧‧‧ tick marks

C‧‧‧ rotation center

D1‧‧‧distance

Fa‧‧‧shift

L1‧‧‧ scale position

L2‧‧‧ scale position

r1‧‧‧action rules

r2‧‧‧action rules

ST1 ~ ST5‧‧‧‧steps

ST11 ~ ST19‧‧‧step

P0 ~ P5‧‧‧Position

Xa‧‧‧pulse number

Xb‧‧‧pulse number

W‧‧‧ Wafer

FIG. 1 is a diagram schematically showing the configuration of the substrate processing apparatus 1.

FIG. 2 is a side view of the substrate processing apparatus 1 in a mounted state.

FIG. 3 is a plan view of the substrate processing apparatus 1 in a mounted state.

FIG. 4 is a bottom view of the jig 70.

FIG. 5 is an example of an image captured by the imaging section 71.

FIG. 6 is a diagram showing an example of a flow of teaching work.

FIG. 7 is a diagram showing an example of an operation rule.

FIG. 8 is a plan view of the substrate processing apparatus 1 schematically showing the trajectory 14 of the ejection section 31.

FIG. 9 is a plan view of the substrate processing apparatus 1 in a mounted state of the jig 70.

FIG. 10 is an example of an image captured by the imaging section 71.

FIG. 11 is a plan view of the substrate processing apparatus 1 in a mounted state of the jig 70.

FIG. 12 is an example of an image captured by the imaging section 71.

FIG. 13 is a coordinate diagram illustrating the resetting operation of the operation rule.

FIG. 14 is a diagram showing an example of a process of scanning liquid processing.

FIG. 15 is a plan view of the substrate processing apparatus 1A in a mounted state.

FIG. 16 is a side view of the substrate processing apparatus 1B in a mounted state.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

<1 one embodiment> <1.1 Configuration of Substrate Processing Device 1>

FIG. 1 is a diagram schematically showing the configuration of a substrate processing apparatus 1 according to an embodiment of the present invention. The substrate processing apparatus 1 is a single-chip type apparatus for applying a processing solution to a surface of a substrate (for example, a semiconductor wafer).

The substrate processing apparatus 1 includes, in its processing chamber, a spin chuck 2 that holds and rotates the wafer W substantially horizontally, and a nozzle 3 that ejects the upper surface of the wafer W held by the spin chuck 2. Treatment solution.

The rotary chuck 2 (substrate holding unit) is fixed to the upper end of the rotary shaft 5 rotated by the chuck rotation driving mechanism 4. The rotary chuck 2 includes a rotary base 6 (a pedestal-shaped base portion) whose upper surface is flat and has a substantially circular plate shape, and a plurality of clamping members 7 which are equal to a circumference of the upper surface of the rotary base 6 A plurality of positions of the end portions are provided at substantially equal intervals for holding the wafer W in a substantially horizontal posture. When the rotating shaft 5 is rotated by the chuck rotation driving mechanism 4 in a state where the wafer W is held by the plurality of holding members 7, the wafer W surrounds the rotating shaft together with the rotating base 6 in a state of maintaining the horizontal posture. The center axis of 5 rotates.

In addition to the above-mentioned configuration, as the rotary chuck 2, for example, a vacuum suction type (vacuum chuck) capable of holding the wafer W in a horizontal posture by vacuum suction of the lower surface of the wafer W may be used.

The nozzle 3 is connected to a supply pipe 8 which is supplied with a processing liquid from a processing liquid supply source. In the middle of the supply pipe 8, a valve 9 is installed for switching the discharge / discharge stop of the processing liquid from the nozzle 3. As a processing liquid, the content corresponding to the processing of the surface of the wafer W is used. For example, if it is a cleaning process for removing particles from the surface of the wafer W, a cleaning agent containing a chemical solution such as SC1 (ammonia-hydrogen peroxide mixture) is used. In addition, if it is a cleaning process for etching an oxide film from the surface of the wafer W, a cleaning agent containing a chemical solution such as hydrofluoric acid or BHF (Buffered HF: buffered hydrofluoric acid) is used. In addition, if it is a polymer removal process for removing resist residue that remains as a polymer on the surface of the wafer W after the resist is stripped, SPM (sulfuric acid / hydrogen peroxide mixture: sulfuric acid / peroxidation) is used. Hydrogen mixture) or SC1 (ammonia-hydrogen peroxide mixture: ammonia-hydrogen peroxide mixture) and other polymer removal solution. In the cleaning treatment to remove metal pollutants, hydrofluoric acid or SC2 (hydrochloric acid / hydrogen peroxide mixture) or SPM (sulfuric acid / hydrogen peroxide mixture: sulfuric acid / hydrogen peroxide mixture) is used. Liquid medicine.

The nozzle 3 is attached to the front end of the arm 10 extending substantially horizontally above the rotary chuck 2. The lower surface of the base end of the arm 10 is fixed to the upper end of the support shaft 11. The support shaft 11 extends substantially perpendicularly to the side of the spin chuck 2. A stepping motor 12 is coupled to the support shaft 11 as an arm swinging mechanism for swinging the arm 10. A driving circuit 22 for driving the stepping motor 12 is connected to the stepping motor 12. In this way, the stepping motor 12 and the drive circuit 22 constitute a nozzle moving unit that moves the nozzle 3.

By inputting a rotational driving force from the stepping motor 12 to the support shaft 11 to rotate the support shaft 11 within a specific angular range, the arm 10 can be shaken above the wafer W held by the rotary chuck 2. During the shaking process, the arm 10 can arrange the nozzle 3 in the original position 23 (illustrated by a two-dot chain line in FIG. 1) on the side of the rotary chuck 2 and the wafer held by the rotary chuck 2 Above W (illustrated by solid lines in Figure 1). Thereby, the nozzle 3 can scan (move) the ejection position of the processing liquid on the surface of the wafer W. By driving the stepping motor 12, the nozzle 3 moves along a track 14 formed in a circular arc shape having a center on the support shaft 11.

The substrate processing apparatus 1 includes a control unit 20 including a CPU (Central Processing Unit), a RAM (Random Access Memory), and a ROM (Read Only Memory). The control unit 20 is connected with a chuck rotation driving mechanism 4 and a processing liquid valve 9 as control targets.

The control unit 20 includes a motor control unit 21 for controlling the stepping motor 12. The motor control unit 21 (action control unit) sends a pulse signal (control signal) corresponding to the displacement amount of the nozzle 3 to the drive circuit 22. The drive circuit 22 receives a pulse signal sent from the motor control unit 21 and gives an excitation signal corresponding to the pulse signal to the stepping motor 12.

In the motor control unit 21, an operation rule is registered in which the displacement amount of the nozzle corresponds to the instruction value (number of pulses) of the control signal given to the stepping motor 12. The action rule can be expressed by a function of the above-mentioned shift amount and the above-mentioned instruction value, and can also be represented by a table including a correspondence between at least one pair of the above-mentioned shift amount and the above-mentioned instruction value. This kind of operation rule setting operation is called teaching operation. In this embodiment, a description will be given of a case where a linear function of the displacement amount and the instruction value (operation rule shown in FIG. 7) is registered in the motor control unit 21 by the teaching operation.

The substrate processing apparatus 1 includes an input unit 30 including a mouse, a keyboard, a touch panel, and the like. Therefore, the operator of the device can input information related to the amount of displacement of the nozzle. The above information can be roughly divided into pulse information specifying the instruction value (number of pulses) of the control signal and position information specifying the displacement amount (nozzle position) of the nozzle 3.

When the information input to the input section 30 is pulse information, the motor control section 21 outputs a control signal corresponding to the number of pulses to the drive circuit 22 to rotate the stepping motor 12. Thereby, the movement of the nozzle 3 corresponding to the input information can be realized.

On the other hand, when the information input to the input section 30 is position information, first, the motor control section 21 calculates the number of pulses to be given to the drive circuit 22 based on the position information and the operation rule. Then, the motor control unit 21 outputs a control signal corresponding to the number of pulses to the drive circuit 22 to rotate the stepping motor 12. Thereby, the movement of the nozzle 3 corresponding to the input information can be realized.

The substrate processing apparatus 1 includes a jig 70 that can be attached to and detached from the rotary base 6 in a state where the wafer W is not held. The jig 70 is a measuring device used in teaching work. FIG. 2 is a side view of the substrate processing apparatus 1 in a state where the jig 70 is mounted on the peripheral end portion of the rotary base 6. FIG. 3 is a plan view of the substrate processing apparatus 1 in a state where the jig 70 is mounted on the peripheral end portion of the rotary base 6. FIG. 4 is a bottom view of the jig 70. In addition, in FIG. 3, the structure of the illumination section 73 is omitted and drawn. Moreover, in FIG. 4, each structure of the jig 70 arrange | positioned on the upper surface side is shown by the broken line.

The jig 70 includes an imaging unit 71 that is attached to the peripheral end portion of the rotary base 6 on the jig 70. In the installed state, the horizontal direction is taken as the shooting direction; the scale section 72 includes a scale surface 72A on which nine scale lines 720 are drawn; the lighting section 73 is arranged near the camera section 71 and from the side of the camera section 71 The front end portion (ejection portion 31) of the nozzle 3 and the scale surface 72A are illuminated, and the main body portion 74 holds these portions integrally.

In addition, the jig 70 includes a convex portion 75 protruding downward from the flat lower surface 74A of the main body portion 74. Furthermore, a part of the side surface of the convex portion 75 includes a curved surface 75A along an arc having a curvature radius that is the same as the curvature radius of the side surface of the rotary base 6. Hereinafter, a portion of the jig 70 configured by the lower surface 74A of the main body portion 74 and the curved surface 75A of the convex portion 75 is referred to as an engaging portion.

As described above, since the upper surface of the rotary base 6 and the lower surface 74A of the main body portion 74 are both flat, and the radius of curvature of the side of the rotary base 6 is the same as the radius of curvature of the curved surface 75A of the convex portion 75, the engaging portion can be It is in close contact with a specific area (shoulder) of the rotary base 6 including a part of the upper surface and a part of the side surface. In this embodiment, the mounting state of the fixture 70 mounted on the peripheral end of the rotary base 6 means that a specific area of the rotary base 6 is in close contact with the engaging portion of the fixture 70, and the fixture 70 is hung on the rotary base. Block 6 status.

In this embodiment, since the jig 70 and the rotation base 6 are not mechanically fixed, the state in which the fastening part of the jig 70 and the peripheral end of the rotation base 6 are closely contacted can be maintained, and the jig 70 can be rotated along The peripheral end portion of the base 6 slides. That is, when it is convenient to slide the jig 70 in this way, as long as the mounting state is maintained, the amount of displacement of the nozzle 3 observed from the peripheral end portion of the rotary base 6 can be detected by imaging by the imaging unit 71 described later.

The main body section 74 holds the imaging section 71 and the scale section 72 so that the imaging section 71 and the scale surface 72A are spaced apart from each other so that the ejection section 31 can be inserted to face each other.

In the teaching operation described later, it is assumed that the jig 70 is mounted on the rotary base 6 and the ejection section 31 is inserted between the imaging section 71 and the scale surface 72A by shaking the arm 10 (more specifically, In other words, the ejection portion 31 is positioned in contact with the scale surface 72A). Hereinafter, this state shown in FIGS. 2 and 3 is referred to as a positioning state. If borrowing under positioning When the imaging section shoots the ejection section 31 and the scale surface 72A, the imaging result is given to the control section 20. Then, the control unit 20 obtains the position information of the ejection unit 31 by performing arithmetic processing based on the imaging result. Since the jig 70 is mounted on the peripheral end portion of the rotary base 6 in the positioning state, the position information of the ejection portion 31 near the peripheral end portion of the rotary base 6 can be obtained as the measured value.

FIG. 5 is an example of an image captured by the imaging section 71. Hereinafter, a description will be given of a case where the position of the center scale line 721 of the nine scale lines 720 and the position of the peripheral end portion of the wafer W held by the rotary base 6 in the mounting state are the same in a plan view. For example, in the example shown in FIG. 5, the position of the ejection portion 31 of the nozzle 3 becomes the position of the scale line 721 (the position corresponding to the peripheral end portion of the wafer W) toward the right side (the origin position of the arm 10). Side) Offset distance D1.

In the example shown in FIG. 5, the length of the scale surface 72A in the horizontal direction is longer than the width of the discharge portion 31 in the horizontal direction, and the entire width of the discharge portion 31 falls within the expanded range of the scale surface 72A that becomes the background. . Therefore, both sides of the ejection section 31 and the scale surface 72A can be captured by the imaging section 71 collectively. Since the entire width of the ejection portion 31 and the scale surface 72A serving as the background can be photographed in this manner, the measurement accuracy is improved compared to the case where only the right end or the left end of the ejection portion 31 is photographed.

Further, as described above, the jig 70 includes the illumination section 73 that illuminates the ejection section 31 and the scale surface 72A. Therefore, since the area to be photographed is illuminated by the timing of shooting by the imaging section 71, the measurement accuracy is improved compared to the case where only indoor light is used as the illumination light.

<1.2 Teaching Assignment> <1.2.1 Setting of Action Rules>

FIG. 6 is a diagram showing an example of a flow of teaching work. FIG. 7 is a diagram showing an example of an operation rule of this embodiment. FIG. 8 is a plan view of the substrate processing apparatus 1 schematically showing the trajectory 14 of the ejection section 31 of the nozzle 3.

As shown in FIG. 8, the trajectory 14 of the ejection portion 31 is transversely cut by the rotating base in a horizontal direction. 6 The track above the held wafer W. In the following, an example of a teaching operation for moving the nozzle 3 from the position P0 to the vicinity of the position P3 along the trajectory 14 will be described (FIG. 8). Here, the position P0 is the position of the ejection portion 31 in a case where the arm 10 is disposed at the origin position. The position P3 (the first peripheral end position) corresponds to the position corresponding to the one point on the position P0 out of two points on the track 14 corresponding to directly above the peripheral end portion of the wafer W held by the spin base 6. .

In the teaching work, first, the operator of the device inputs pulse information (that is, the number of pulses of the stepping motor 12) to the input section 30 (step ST1: input step). More specifically, the operator inputs specific pulse information (the pulse number Xa shown in FIG. 7) so that the discharge portion 31 of the nozzle 3 is arranged near the position P3. Here, the number of pulses is a value corresponding to the rotation amount of the motor based on the origin position of the arm 10 (origin position on the machine).

The motor control unit 21 outputs a control signal corresponding to the number of pulses to the drive circuit 22 based on the input information input in the input step. As a result, the stepping motor 12 rotates the nozzle 3 in accordance with a specific number of pulses. As a result, the ejection part 31 of the nozzle 3 is arrange | positioned near the position P3 (step ST2: nozzle movement process).

Then, the operator attaches the jig 70 to the peripheral end portion of the rotary base 6 and slides along the peripheral end portion. In addition, when the scale surface 72A is in contact with the ejection portion 31 of the nozzle 3, the slide of the jig 70 is stopped. Thereby, the jig 70 is set to the above-mentioned positioning state (step ST3: jig moving step).

In the positioning state obtained by the jig moving step, the imaging section 71 photographs the ejection section 31 and the scale surface 72A (ST4: imaging step). The shooting result is given to the control unit 20.

The control unit 20 obtains position information (a shift amount Fa described later) of the ejection unit 31 by performing arithmetic processing based on the imaging result (FIG. 5) obtained in the imaging step. Then, the control unit 20 sets an operation rule (FIG. 7) in which the displacement amount of the nozzle 3 corresponds to the instruction value (the number of pulses) of the control signal given to the stepping motor 12 (step ST5: setting step).

Hereinafter, details of the setting procedure will be described with reference to FIG. 8.

The support shaft 11 and the rotation base 6 of the arm 10 are fixed to the device. Therefore, from position P0 to The displacement amount of the ejection portion 31 of the trajectory 14 at the position P1 is always constant. Here, the position P1 is a position corresponding to one point on the position P0 side among two points on the trajectory 14 corresponding to directly above the peripheral end portion of the rotary base 6. The rotation center C of the rotation base 6 coincides with the rotation center C of the wafer W held by the rotation base 6. Therefore, the displacement amount of the ejection portion 31 along the trajectory 14 from the position P1 to the position P3 is always constant. Therefore, the displacement amount of the ejection portion 31 along the trajectory 14 from the position P0 to the position P3 is also always fixed.

In addition, based on the imaging results obtained by the imaging section 71, the position P2, which is the position of the ejection section 31 after the nozzle moving step is moved, can be measured, and the distance between the positions P3. In the example shown in FIG. 5, as described above, it can be determined that the position P2 is shifted from the position P3 to the position P0 by the distance D1. Based on the measurement result, the control unit 20 can calculate the displacement amount of the ejection unit 31 along the trajectory 14 from the position P3 to the position P2.

Therefore, the control unit 20 can calculate a self-calculation value based on the displacement amount of the ejection portion 31 from the positions P0 to P3 as a fixed value and the displacement amount of the ejection portion 31 from the position P3 to the position P2 which can be calculated by measurement. The displacement amount of the ejection portion 31 from the position P0 to the position P2 (the displacement amount Fa shown in FIG. 7).

The control unit 20 (setting unit) sets the operation rule using the pair of the pulse number Xa input from the input unit 30 and the value of the displacement amount Fa of the ejection unit 31 shifted by this (FIG. 7). For example, when the action rule is expressed by a linear function (Figure 7) of the displacement amount and the instruction value as in this embodiment, (pulse number, nozzle displacement amount) = (0, 0), The linear function of 2 points of (Xa, Fa) is set as the action rule.

<1.2.2 Reset of Operation Rules>

An example of teaching work in the case where the operation rule is reset is described below. This teaching operation is performed based on the position shift amount of the ejection section 31 obtained from the photographing result obtained by the jig 70.

FIG. 9 is a schematic plan view of the substrate processing apparatus 1. FIG. 10 is a captured image when the ejection section 31 is captured by the imaging section 71 in the state shown in FIG. 9. As shown in Figures 9 and 10 In this state, the ejection unit 31 is located at the teaching reference position (for example, the position immediately above the first peripheral end position P3 of the wafer W). Moreover, the ejection part 31 contacts the scale surface 72A of the jig 70 at the scale position L1.

FIG. 11 is a schematic plan view of the substrate processing apparatus 1. FIG. 12 is a captured image when the ejection section 31 is captured by the imaging section 71 in the state shown in FIG. 11. In the state shown in FIGS. 11 and 12, the ejection portion 31 is located at a position P2 shifted from the teaching reference position (position P3). Moreover, the ejection part 31 contacts the scale surface 72A of the jig 70 at a scale position L2 different from the scale position L1.

FIG. 13 is a diagram showing the correspondence between the scale position, the displacement amount of the nozzle, and the instruction value (number of pulses) of the control signal in the teaching operation when the operation rule is reset. The first quadrant of FIG. 13 shows the correspondence between the displacement amount of the nozzles and the instruction value (number of pulses) of the control signals in the operation rules r1 and r2 described later. The second quadrant of FIG. 13 shows the correspondence between the scale position obtained by the photographing result of the autonomous tool 70 and the displacement amount of the nozzle. As long as shooting is performed in the above-mentioned positioning state, the relationship between the scale position and the amount of displacement of the nozzle is fixed.

In the motor control unit 21, an operation rule obtained by a previous teaching operation is registered in advance as a reference operation rule r1. In the previous teaching operation described above, it is assumed that the nozzle displacement amount is 0 when the number of pulses is 0, and the nozzle is shifted to the position P3 when the number of pulses is Xa (FIG. 9 and FIG. 10). As a result, the reference operation rule r1 appears as a linear function that passes through two points (number of pulses, nozzle displacement) = (0, 0), (Xa, P3) (refer to the first quadrant of FIG. 13).

Of course, it is not necessary to reset the operation rule during the period when the reference operation rule r1 is valid. However, for some reason, a state in which the reference action rule r1 fails (more specifically, a state in which the nozzle is shifted to a position shifted from the position P3 despite the input pulse number is Xa) may occur. When the validity of the previously registered action rule is reduced, the teaching operation is performed again to set the action rule again.

In this resetting, first, the operator inputs the pulse number Xa (step ST1). The number of pulses Xa is the number of pulses corresponding to the teaching reference position P3 under the reference operation rule r1.

Thereby, the stepping motor 12 is driven and the nozzle 3 is moved (step ST2). If the reference operation rule r1 is valid, the ejection unit 31 should be shifted to the teaching reference position P3 in step ST2. However, in the following, a case where the ejection unit 31 is shifted to a position P2 (the nozzle position shown in FIGS. 11 and 12) different from the teaching reference position P3 in step ST2 will be described.

After the nozzle moving step (step ST2), a jig moving step (step ST3) and an imaging step (step ST4) are performed. As a result, the jig 70 is in contact with the ejection unit 31 in the state shown in FIG. 11, and a captured image shown in FIG. 12 is obtained.

In the setting step (step ST5), the scale position L2 obtained in the imaging step is applied to the coordinate map of the second quadrant in FIG. 13 to obtain the position P2 of the ejection section 31 corresponding to the scale position L2. Next, the operation rule is set again based on the position P2 and the pulse number Xa. For example, a second-order linear function that passes (number of pulses, nozzle displacement) = (0, 0), (Xa, P2) is set as the action rule r2 (refer to the first quadrant of FIG. 13), and registered in Motor control section 21.

After the teaching operation, the motor control unit 21 may apply the operation rule r2 to the input position information to generate a pulse signal. For example, when the position P3 is designated as the position information for the motor control unit 21, the motor control unit 21 applies the position P3 to the operation rule r2, and calculates and drives the pulse number Xb different from the previous pulse number Xa. Circuit 22.

<1.3 Liquid Handling>

FIG. 14 is a diagram showing an example of a process of scanning liquid processing. In the following, a case is described as an example, in which the ejection portion 31 of the nozzle 3 is scanned back and forth between a position P3 and a position P4 corresponding to a position directly above the rotation center C of the rotary base 6, and The wafer W held and rotated by the spin base 6 ejects a processing liquid.

First, in a state where the nozzle 3 is arranged at the original position 23 retracted from above the spin chuck 2, an unprocessed wafer W is delivered to the spin chuck 2 by a transfer robot (not shown) (step ST11).

Then, the operator of the device inputs various processing information to the input section 30 (step ST12). The processing information includes information related to the rotation speed of the wafer W, information related to the supply amount of the processing liquid, information related to the displacement amount of the ejection section 31, and information related to the processing time.

In step ST12, as the information related to the rotation speed of the wafer W, for example, constant speed rotation is input at a specific liquid processing rotation speed. As the information related to the supply amount of the processing liquid, for example, a specific supply amount is input. Further, as the information related to the displacement amount of the ejection section 31, for example, the information of the position P3 and the position P4 is input as the position information of the ejection section 31 to be scanned. The motor control unit 21 calculates the number of pulses to be given to the drive circuit 22 (specifically, the number of pulses corresponding to the position P3 and the number of pulses corresponding to the position P4) based on the position information and the above-mentioned operation rule obtained through teaching work. Then, the motor control unit 21 outputs a control signal corresponding to the number of pulses to the drive circuit 22.

Thereby, the chuck rotation driving mechanism 4 is driven to rotate the wafer W held by the chuck 2 at a constant speed at a specific liquid processing rotation speed (step ST13). In addition, the motor control unit 21 drives the stepping motor 12 to swing the arm 10 to scan the nozzle 3 back and forth above the rotation center C of the wafer W in a rotating state (step ST14). After that, the control unit 20 opens the valve 9 and ejects the processing liquid from the ejection unit 31 of the nozzle 3 (step ST15). After the processing liquid sprayed from the spraying portion 31 toward the vertical downward direction is sprayed onto the upper surface of the wafer W, it is spread along the upper surface of the wafer W by the centrifugal force of rotation.

In this embodiment, since the position of the ejection part 31 moves back and forth between positions P3 and P4, the spraying position of the processing liquid ejected from the nozzle 3 on the upper surface of the wafer W is also from the peripheral position to The range of the center position varies. Thereby, the processing by the processing liquid is performed over the entire range of the upper surface of the rotating wafer W.

When a specific time has elapsed from the start of processing, the control unit 20 closes the valve 9 and stops supplying the processing liquid to the nozzle 3 (step ST16). The control unit 20 stops driving of the chuck rotation driving mechanism 4 and stops the rotation of the wafer W held by the chuck 2 (step ST17). After that, the control unit 20 is disposed on the nozzle 3 above the retreat of the spin chuck 2 The timing of the home position stops the driving of the stepping motor 12 (step ST18). As a result, the wafer W that has undergone the liquid processing is carried out by a transfer robot (not shown) (step ST19).

<1.4 effect>

In the jig 70, the imaging unit 71 is arranged to face the scale surface 72A. In addition, in a state where the jig 70 is mounted on the rotary base 6 and the ejection portion 31 is positioned with respect to the scale surface 72A of the jig 70, imaging by the imaging unit 71 is performed. Therefore, according to the photographing result, the position information of the ejection portion 31 observed from the rotation base 6 can be obtained. In particular, since the jig 70 having the imaging unit 71 is mounted on the peripheral end portion of the rotary base 6, the position information of the ejection portion 31 near the peripheral end portion of the rotary base 6 can be obtained.

In the present aspect in which the action rule is set based on the shooting result (position information of the ejection section 31) obtained by the jig 70, and in other cases where the action rule is set based on the position information of the ejection section 31 obtained by the operator's visual inspection Compared with the aspect, the work performed by the operator for teaching can be reduced, and more accurate teaching can be realized.

In addition, since the ejection section 31 is photographed by the imaging section 71 with the horizontal direction as the imaging direction, the position of the ejection section 31 can be accurately grasped by imaging. Furthermore, since the imaging direction is horizontal, the inner dimension of the processing chamber in the up-down direction can be reduced.

In the present embodiment, a scale surface 72A is arranged substantially parallel to a specific trajectory portion 14A of the movement trajectory 14 of the nozzle 3, and the imaging direction is performed at the trajectory portion 14A in a direction substantially orthogonal to the trajectory 14 The image is captured by the imaging unit 71 (FIG. 3). Since the measurement of the control position error in the direction along the movement trajectory 14 is more important in the movement control of the nozzle 3, the control position error can be measured more precisely by the above configuration.

<2 Variations>

The embodiments of the present invention have been described above, but the present invention can be modified in various ways other than the above without departing from the spirit of the present invention.

FIG. 15 is a plan view showing a state in which the jig 70 is mounted on the rotary base 6 in the substrate processing apparatus 1A of the modification example.

The substrate processing apparatus 1A is provided with a coupling member 76 of a rod-shaped body extending in the horizontal direction in addition to the respective configurations of the substrate processing apparatus 1 of the embodiment described above. Further, during teaching work, a fixing member 77 such as a bolt is used to combine one end portion of the coupling member 76 with the center portion of the upper surface of the rotary base 6 and the other end portion of the coupling member 76 and the jig 70. In this case, the so-called mounting state refers to a state where the fastening portion of the jig 70 is in close contact with a specific area of the rotary base 6 and the jig 70 and the rotary base 6 are connected via a coupling member 76.

In the aspect of this modified example, the jig 70 is not easily detached from the rotation base 6 and can be maintained in a stable state. This aspect is particularly effective in a substrate processing apparatus having a specific member in a central portion of the rotary base 6 in a plan view. For example, in a substrate processing apparatus having a central surface provided with a lower surface treatment liquid nozzle for supplying a lower surface treatment liquid to the lower surface of a wafer W held by a plurality of holding members 7, it is possible to replace the lower surface when teaching. The surface treatment liquid nozzle is implemented by coupling the coupling member 76.

FIG. 16 is a side view showing a state where the jig 70 is mounted on the rotary base 6 in the substrate processing apparatus 1B according to the modification.

The substrate processing apparatus 1B includes, in addition to the respective configurations of the substrate processing apparatus 1 of the above embodiment, an attachment 78 attached to the ejection section 31. In addition, during teaching work, the front end 79 of the attachment 78 contacts the scale surface 72A, and the attachment 78 and the nozzle 3 integrated with the attachment 78 are positioned relative to the scale surface 72A.

If the diameter of the end portion 79 in front of the attachment 78 is smaller than the diameter of the ejection portion 31 when viewed from the horizontal plane, the position of the nozzle 3 can be grasped more accurately according to the photographing result obtained by photographing the front end portion 79 and the scale surface 72A.

In the case where the substrate processing apparatus has a plurality of nozzles having different diameters of the ejection portions, it is effective to attach the attachment 78 to each nozzle and perform the teaching operation of each nozzle. Thereby, since the front end portion 79 and the scale surface 72A of the photographing accessory 78 are taken, teaching work can be performed regardless of the difference in the diameter of the ejection portion. In the example shown in FIG. 16, a cap-shaped attachment covering the ejection portion 31 is described, but various attachments may be used.

Also, in the above embodiment, the case where the action rule is expressed by a linear function is explained, but it is not limited to this. The action rule may also include the displacement amount of the nozzle 3 and the instruction value (pulse) of the control signal to the stepper motor Number) of at least one pair of corresponding table performance. That is, to facilitate this situation, as long as the amount of displacement of the nozzle 3 and the indication value of the control signal given to the stepping motor 12 have a linear relationship, the action rule can be set by the photographing operation performed by the jig 70 at least once.

Moreover, in the said embodiment, although the state which made the nozzle 3 scan back and forth between the position P3 (1st peripheral edge position) and the position P4 (center position) was demonstrated as an example, it is not limited to this. As another example, the nozzle 3 may be scanned back and forth between the position P3 (the first peripheral end position) and the position P5 (the second peripheral end position). Here, the position P5 is a position on a different side from the position P3 among two points on the trajectory 14 corresponding to directly above the peripheral end portion of the wafer W held by the rotating base 6. Furthermore, as another example, the nozzle 3 may be moved to a specific position above the wafer W, and the processing liquid may be supplied from the nozzle 3 fixed at the specific position toward the wafer W (the nozzle 3 is not made during processing). Scanning appearance).

Also, in the teaching operation of the above embodiment, a description has been given of a case where the nozzle 3 is photographed near the position P3 and an operation rule is set based on the photographed result, but it is not limited to this. For example, the imaging of the imaging unit 71 of the jig 70 or the like may be performed at the position P3 (the first peripheral end position) and the position P5 (the second peripheral end position), and the imaging may be performed at multiple positions. In addition, the teaching operation may include a confirmation step. After the operation step is set based on the shooting result of the specific position (after step ST5), the nozzle 3 is moved to the specific position again and the imaging section 71 is used. Take a shot.

Moreover, in the said embodiment, although the teaching operation was demonstrated using only the imaging result acquired by the imaging part 71 of the jig 70, it is not limited to this. The substrate processing apparatus may be provided with another imaging unit (for example, an imaging unit that performs imaging of the ejection unit 31 at the position P4) other than the jig 70 to grasp the position of the ejection unit 31. The shooting result obtained by the imaging section 71 and the shooting result obtained by the other imaging sections described above As a result of teaching assignments.

Moreover, in the said embodiment, although the aspect where nine scale lines 720 were drawn on the scale surface 72A was demonstrated, it is not limited to this. As the distance indicator drawn on the scale surface 72A, in addition to the scale line, various distance indicators such as points or concentric circles can also be used.

In the above-mentioned embodiment, the stepping motor 12 has been described as an example of the nozzle moving unit. However, other types of motors (for example, servo motors) may be used.

In addition, it is not limited to the state in which the processing liquid is ejected from the nozzle 3. Various forms of spraying the processing fluid from the nozzle 3, such as a pattern of spraying the processing gas from the nozzle 3, a pattern of spraying the mixed fluid of the processing liquid and the processing gas from the nozzle 3, and the like can also be adopted.

In the above-mentioned embodiment, the ejection portion 31 is positioned on the jig 70 by bringing the ejection portion 31 of the nozzle 3 into contact with the scale surface 72A, but the positioning method of the ejection portion 31 is not limited to this. For example, a positioning portion other than the scale portion 72 may be provided on the jig 70, and the ejection portion 31 may be positioned on the jig 70 by contacting the ejection portion 31 with the positioning portion.

The substrate processing apparatus, jig, and teaching method of the embodiment and its modification have been described above, but these are examples of preferred embodiments of the present invention and do not limit the scope of implementation of the present invention. Within the scope of the invention, the present invention can be freely combined with each embodiment, or any constituent element of each embodiment can be changed, or any constituent element can be omitted in each embodiment.

1‧‧‧ substrate processing device

3‧‧‧ Nozzle

5‧‧‧rotation axis

6‧‧‧ rotating base

7‧‧‧ clamping member

10‧‧‧ arm

31‧‧‧Ejection Department

70‧‧‧Jig

71‧‧‧ Camera Department

72‧‧‧ scale

72A‧‧‧Scale surface

73‧‧‧Lighting Department

74‧‧‧Body

75‧‧‧ convex

Claims (13)

A substrate processing apparatus, comprising: a substrate holding unit including a table-shaped base portion, and holding the substrate horizontally above the base portion; a nozzle that sprays a processing fluid from a front end portion; and a nozzle moving unit that Receiving a control signal and moving the nozzle in a horizontal direction according to the control signal; an input unit that is inputted with information related to a displacement amount of the nozzle; an operation control unit that sends a control signal according to the information input to the input unit While controlling the movement of the nozzle moving unit; a jig that can attach and detach the peripheral end portion of the base portion; and a setting unit that sets an operation rule that causes the displacement amount of the nozzle to correspond to the indicated value of the control signal; In addition, the jig includes: a camera unit that uses a horizontal direction as a shooting direction in a state where the jig is installed on the peripheral end portion; and a scale unit that includes a scale surface on which a distance indicator is drawn, and the scale The ulnar surface and the imaging unit are spaced apart from each other at an interval where the front end portion of the nozzle can be inserted, and is inserted into the front end portion. In a state where the imaging portion is positioned between the scale surface and the front end portion is positioned relative to the scale surface, the setting unit sets the action based on a result of photographing the front end portion and the scale surface by the imaging portion. rule. The substrate processing apparatus according to claim 1, wherein the front end portion contacts the scale surface, and the front end portion is positioned relative to the scale surface. For example, the substrate processing apparatus of claim 1, wherein the jig includes a buckle portion, and the buckle portion may be in close contact with a specific area of the base portion including a portion of the upper surface and a portion of the side surface, and the installation state is the base The specific area of the unit is in close contact with the engaging portion of the jig, and the jig is hung on the base portion. For example, the substrate processing apparatus of claim 1 further includes a coupling member, which is a rod-shaped body extending in the horizontal direction, and one end portion is coupled to the central portion of the upper surface of the base portion, and the other end portion is coupled to the above. The jig is coupled, and the mounting state is a state where the jig and the base portion are connected via the coupling member. For example, the substrate processing apparatus according to claim 1, wherein the scale surface is arranged substantially parallel to a specific trajectory portion of a moving trajectory of the nozzle moving unit by the nozzle moving unit, and the specific trajectory portion is located at the specific trajectory portion to match the moving trajectory. The substantially orthogonal direction is the imaging direction, and imaging by the imaging unit is performed. For example, the substrate processing apparatus of claim 1, wherein the length of the scale surface in the horizontal direction is longer than the horizontal width of the front end portion of the nozzle, and the entire width of the front end portion falls on the scale surface that becomes the background. Within the expanded range, both sides of the front end portion and the scale surface can be photographed collectively by the imaging unit. The substrate processing apparatus according to claim 1, wherein the jig further includes an illuminating section which is arranged near the imaging section and illuminates the front end section and the scale surface from the imaging section side. For example, the substrate processing apparatus of claim 1, wherein in the above operation rule, the displacement amount of the nozzle and the instruction value of the control signal given to the nozzle moving unit have a linear relationship. For example, the substrate processing apparatus of claim 1, wherein the movement trajectory of the front end portion is a trajectory that crosses the substrate above the substrate held by the substrate holding unit in a horizontal direction. When the positions where the end and the movement track intersect in the horizontal plane are referred to as the first peripheral end position and the second peripheral end position, respectively, the motion control unit controls the nozzle to move the nozzle to the first peripheral end position. In a state where the mobile unit is operating, shooting by the imaging unit is performed. In the substrate processing apparatus according to claim 9, the imaging by the imaging unit is performed in a state where the operation control unit controls the operation of the nozzle moving unit so that the nozzle moves to the two-peripheral position. The substrate processing apparatus according to any one of claims 1 to 10, wherein the front end portion is a discharge portion of the nozzle. The substrate processing apparatus according to any one of claims 1 to 10, further comprising an accessory mounted on the ejection portion of the nozzle, and the front end portion is the accessory mounted on the ejection portion of the nozzle. A teaching method is characterized in that it is a person who sets an operation rule in a substrate processing device, and the substrate processing device makes the above-mentioned operation rule according to an operation rule corresponding to an amount of displacement of a nozzle and an instruction value given to a control signal to a nozzle moving unit. The nozzle moves and the processing fluid is ejected from the front end of the nozzle, thereby processing the substrate horizontally held above the base portion of the substrate holding unit. The above teaching method includes: (a) an input step, which is input to the nozzle Information related to the displacement amount; (b) a nozzle moving step, which sends the control signal to control the operation of the nozzle moving unit according to the input information input in the input step; (c) The fixture moving step is to move the fixture including a camera part and a scale part, the camera part uses a horizontal direction as a shooting direction, the scale part includes a scale surface on which a distance indicator is drawn, and the scale The surface and the imaging unit are spaced apart from each other at an interval where the front end portion can be inserted, and is arranged in a state where the jig is mounted on the peripheral end portion of the base portion and is in the nozzle moving step. The tip portion of the nozzle after the movement is inserted between the imaging unit and the scale surface and positioned relative to the scale surface of the jig; (d) an imaging step, which is a step of moving the jig by the jig In the obtained state, the front end portion and the scale surface are photographed by the imaging unit; and (e) a setting step that sets the operation rule based on a photographing result obtained in the imaging step.