TWI608238B - Probe type electrical connection assembly - Google Patents

Description

Probe type electrical connection assembly

The present invention relates to a probe type electrical connection component, and more particularly to a probe type electrical connection capable of being applied to a probe card for wafer inspection or a semiconductor component detecting device and the like, and providing an electrical connection function. Component.

Currently, it is applied to a probe card for wafer inspection or a semiconductor component detecting device, and a probe type electrical connection component that provides an electrical connection function is constructed, and a probe of a conventional semiconductor component detection type is used. For example, as shown in FIG. 15, the probe type electrical connection assembly mainly comprises a plate body 60, a plurality of probes 70 and a probe cover plate 61, and a plurality of probes are formed in the plate body 60. a hole, one end (upper end or lower end) of each probe hole is formed with a small hole end, and the plurality of probes 70 are respectively installed in the probe holes of the plate body 60, and the base of each probe 70 is used by the probe a peripheral support and a limit of the small hole end of the hole, a plurality of perforations are formed in the probe cover 61, the aperture of the through hole is smaller than the aperture of the probe hole, and the probe cover 61 is closedly locked to the plate body 60 away from the probe hole One side of the small hole end, wherein when the small hole end of the probe hole is located at the bottom end of the probe hole, the probe cover is attached to the top surface of the plate body (not shown); when the probe hole is When the small end is located at the top end of the probe hole, the probe cover 61 is disposed on the bottom surface of the plate body 60, and is combined with the plate body 60 by the probe cover 61. The carrier plate is configured so that the plurality of probes 70 positioned therein, and the plurality of the contact probes 70 and the end portion of the lower end portion of the contact plate 61 can be extended and the probe cover 61, respectively.

As shown in FIG. 15, the conventional probe type electrical connection assembly is applied to a detection fixture, and is applied to a semiconductor component detecting device as an example, which is mounted on a circuit carrier 80 to electrically connect the probe type. Each probe 70 of the component electrically contacts the corresponding contact of the circuit carrier 80, and is electrically connected to the detection system through the circuit carrier 80; when the semiconductor component 50 to be tested is displaced, the probe type electrical connection component, and The semiconductor component 50 to be tested is pressed down, so that each contact of the bottom of the semiconductor component 50 to be tested is electrically contacted with the corresponding probe 70, and then the detection system performs open circuit, open circuit and functional detection of the semiconductor component 50 to be tested. It is judged whether or not the function of the semiconductor element 50 to be tested is normal.

The foregoing existing probe type electrical connection component can be applied to provide electrical connection functions of a wafer to be tested or a semiconductor component to be tested in various types of detection fixtures, but the existing probe type electrical connection component must be mounted on the probe board. The probe cover is added to the body, and the combined carrier plate combined with the probe cover can simultaneously position all of the probes, so that the carrier structure is complicated and the cost is high. Furthermore, when the carrier plate combined with the probe cover and the plate body is assembled in the alignment of the plurality of probes, the carrier structure deformation generated when the semiconductor component to be tested is pressed down is often difficult to align and assemble. The problem of inconvenience.

On the other hand, the existing probe type electrical connection assembly must use the combined carrier plate combined with the probe cover to position the probe, so that the overall thickness of the existing probe type electrical connection assembly is large, and the probe length is Relatively long, it is difficult to provide a short and small probe for assembly and use, and thus the signal transmission distance through the probe is long, which is disadvantageous for the detection performance of the wafer or the semiconductor component.

It is an object of the present invention to provide a probe type electrical connection assembly that solves the problems of inconvenient assembly and high cost of the prior art probe type electrical connection assembly, and the difficulty in reducing the thickness and the use of a short probe due to the combined carrier.

In order to achieve the foregoing object, the probe type electrical connection assembly of the present invention comprises: a carrier plate having a plurality of spaced apart probe holes that are vertically penetrated, each probe hole including a hole portion and a a hole end portion at one end of the hole portion, a hole diameter of the hole end portion is smaller than an aperture of the hole portion; a plurality of probes respectively mounted in the plurality of probe holes of the carrier, the probe a member having elastic members capable of lengthwise expansion and deformation, the probes each including a probe base portion, an upper contact end portion at an upper end of the probe base portion, and a lower contact end portion at a lower end of the probe base portion. The probe base is located in a hole portion of the probe hole, and the upper contact end portion protrudes from a hole portion of the probe hole to a top surface of the carrier plate, and one end of the probe base portion is the probe a hole end portion of the pinhole; and a plurality of positioning members respectively fixed to the bottom of the carrier, and the positioning member extends into the probe hole to contact the probe base of the probe, each The probe base of the probe is positioned by the frictional resistance generated by the contact of the positioning member adjacent thereto A probe hole in the carrier plate.

According to the invention, the probe type electrical connection component is mainly installed in a plurality of probe holes of the carrier by using a plurality of probes, and is respectively fixed in the carrier by using a plurality of positioning components, and the positioning component is respectively The probe base is inserted into the probe hole to contact the probe so that the probe base of each probe is positioned in the probe hole of the carrier by the frictional resistance of the contact of the positioning member. The probe type electrical connection component of the present invention utilizes the positioning component to respectively position a small number of probes in the carrier board, so that the existing probe type electrical connection component must be installed on the top or bottom of the board body on which the probe is mounted. The probe cover and the probe cover must be inconvenient to assemble with most of the probes at the same time.

Furthermore, the probe type electrical connection assembly of the present invention simplifies the construction of the carrier plate by omitting the probe cover of the existing probe type electrical connection assembly, thereby simplifying fabrication and saving cost, and is compared with the existing probe type electrical connection. The combination of the plate body and the cover plate enables the probe to be positioned, and the invention can reduce the thickness of the carrier plate and the length of the probe, thereby facilitating the assembly and use of the short probe, thereby shortening the transmission distance of the signal through the probe. By applying the present invention to various types of test fixtures, the detection performance can be improved.

In addition, the probe type electrical connection component of the present invention can omit the probe cover plate of the existing probe type electrical connection component, and in the process of assembling and replacing the probe, the probe can be directly taken by the tool, and a small amount of probes can be taken. The needles are individually replaced and can be operated accurately.

As shown in FIG. 1, FIG. 4, FIG. 7, FIG. 8, FIG. 12 and FIG. 13, a plurality of preferred embodiments of the probe type electrical connection assembly of the present invention are disclosed. The probe type electrical connection assembly includes a carrier. 10, 10A, 10B, 10C, 10D, 10E, a plurality of probes 20, 20A, 20B, 20C, 20D, 20E and a plurality of positioning members 30, 30A, 30B, 30C, 30D, 30E.

2 and 3, or 5 and 6, or 7, or 9 to 11, or 12 or 13, the carrier 10, 10A, 10B, 10C, 10D, 10E may Made of an insulating material, a plurality of probe holes 11, 11A, 11B, 11C, 11D, 11E are formed in the carrier 10, 10A, 10B, 10C, 10D, and 10E, and the plurality of probe holes 11, 11A, 11B, 11C, 11D, and 11E are perforations that pass through from top to bottom at intervals, and the apertures, distribution positions, and interval sizes of the plurality of probe holes 11, 11A, 11B, 11C, 11D, and 11E are set depending on the product. As shown in FIG. 3, FIG. 11 and FIG. 12, each of the probe holes 11, 11C, 11D includes a hole portion 111, 111C, 111D and a hole end portion 112, 112C connected to one end of the hole portion 111, 111C, 111D. , 112D, the aperture ends 112, 112C, 112D have a smaller aperture than the apertures 111, 111C, 111D, as shown in FIG. 3, the aperture end 112 may be located at the lower end of the aperture 111, or, as shown in FIG. 11 or As shown in Fig. 12, the hole end portions 112C, 112D may be located at the upper ends of the hole portions 111C, 111D.

As shown in FIG. 1 , FIG. 4 , FIG. 7 , FIG. 8 , FIG. 12 and FIG. 13 , the carrier boards 10 , 10A , 10B , 10C , 10D , and 10E can be manufactured according to the product use of the probe type electrical connection assembly. A seat plate capable of carrying a semiconductor component (as shown in FIGS. 1 to 3 or as shown in FIGS. 4 to 6 and 7) or a flat plate (as shown in FIGS. 8 , 11 , 12 , and 13 ) Shown). As shown in FIG. 1 to FIG. 3, or FIG. 4 to FIG. 6, or FIG. 7, when the carrier 10, 10A, 10B is a seat plate capable of carrying a semiconductor component, as shown in FIG. 1, the top surface of the carrier 10 is as shown in FIG. An element placement groove 13 may be formed, and the plurality of probe holes 11 are distributed in the groove bottom plate of the component placement groove 13.

In addition, as shown in FIG. 1 , FIG. 4 , FIG. 7 , FIG. 8 , FIG. 12 and FIG. 13 , the plurality of probe holes 11 , 11A , 11B in the carrier plates 10 , 10A , 10B , 10C , 10D , and 10E , The distribution patterns of 11C, 11D, and 11E are applied to the detected wafer or semiconductor component product according to the probe type electrical connection component (for example, a known BGA type semiconductor element, a QFP type semiconductor element, or a QFN type semiconductor element, etc.) The contact distribution pattern is set as shown in FIG. 1, FIG. 4, FIG. 7, FIG. 8, FIG. 12 and FIG. 13, for example, the plurality of probe holes 11, 11A, 11B, 11C, 11D, 11E A matrix arrangement may be formed in the carrier boards 10, 10A, 10B, 10C, 10D, and 10E; or, the plurality of probe holes may be formed in a four-inline type arrangement in which a circle is wound in a carrier, etc. (not shown) ).

As shown in FIG. 3, FIG. 6, FIG. 7, FIG. 9, FIG. 10, FIG. 11, FIG. 12 or FIG. 13, the probes 20, 20A, 20B, 20C, 20D, and 20E include elastic members (not shown). As shown in FIG. 3, FIG. 6, FIG. 7, FIG. 9, FIG. 10, FIG. 11 or FIG. 12, the probes 20, 20A, 20B, 20C, and 20D include conductive members having a variable length and contraction. a probe base 21, 21A, 21B, 21C, 21D, an upper contact end 22, 22A, 22B, 22C, 22D at the upper end of the probe base 21, 21A, 21B, 21C, 21D, and a probe base 21, 21A, 21B, 21C, 21D lower end end portions 23, 23A, 23B, 23C, 23D, each of the probes 20, 20A, 20B, 20C, 20D are respectively mounted on the carrier 10, 10A, In the probe holes 11, 11A, 11B, 11C, and 11D of 10B, 10C, and 10D, the probe bases 21, 21A, 21B, 21C, and 21D are located in the hole portions of the probe holes 11, 11A, 11B, 11C, and 11D. 111, 111A, 111B, 111C, and 111D, the upper contact end portions 22, 22A, 22B, 22C, 22D, and 22E are formed by the hole portions 111, 111A of the probe holes 11, 11A, 11B, 11C, 11D, and 11E, 111B, 111C, 111D, 111E upper end protrudes from the carrier 10, 10A, 10B, 10C, 1 0D, 10E top surface, the lower contact end portions 22, 22A, 22B, 22C, 22D, 22E can be extended downward from the lower ends of the hole portions 111, 111C, 111D of the probe holes 11, 11A, 11B, 11C, 11D The bottom surfaces of the boards 10, 10A, 10B, 10C, 10D, or the bottom edges of the lower contact ends 22, 22A, 22B, 22C, 22D may also be substantially flush with the bottom surfaces of the carrier boards 10, 10A, 10B, 10C, 10D. That is, the bottom edges of the lower contact ends 21, 21A, 21B, 21C, and 21D are close to the height of the bottom surface of the carrier sheets 10, 10A, 10B, 10C, and 10D or the bottom surfaces of the carrier sheets 10, 10A, 10B, 10C, and 10D.

The probe may be a single-motion telescopic probe or a double-action telescopic probe. When the probe is a single-motion telescopic probe, the upper contact end can be expanded and contracted relative to the probe base, and the lower contact end The portion is fixed to the bottom end of the probe base; when the probe is a double-action telescopic probe, the upper contact end portion and the lower contact end portion can respectively expand and contract with respect to the probe base portion. As shown in FIG. 3, FIG. 6, FIG. 7 or FIG. 11, the lower contact end portions 23, 23A, 23B, and 23C are of a telescopic type at the lower ends of the probe base portions 21, 21A, 21B, and 21C, or As shown in Fig. 12, the lower contact end portion 23D can be fixed to the lower end of the probe base portion 21D.

In the foregoing, the upper contact end portion can be extended and contracted at the upper end of the probe base by an elastic member provided inside the probe base, and the lower contact end portion can also be coupled to the elastic member or the other one disposed inside the probe base portion. The elastic member can be stretched and contracted at the lower end of the probe base, or the lower contact end portion can be integrally formed at the lower end of the probe base, and the elastic member can be a spring or a spring piece.

2, 3, 5, 6, 7, 11, 12 or 13, the positioning members 30, 30A, 30B, 30C, 30D, 30E are made of insulating material. The plurality of positioning members 30, 30A, 30B, 30C, 30D, and 30E are respectively fixed in the carrier 10, 10A, 10B, 10C, 10D, and 10E, that is, the positioning members 30, 30A, and 30B. 30C, 30D, 30E are tightly coupled with the carrier plates 10, 10A, 10B, 10C, 10D, 10E, and the positioning members 30, 30A, 30B, 30C, 30D, 30E extend into the probe holes 11, 11A, 11B , probes 21, 21A, 21B, 21C, 21D of probes 20, 20A, 20B, 20C, 20D, 20E in each of 11C, 11D, 11E, each probe 20, 20A, 20B, 20C, 20D, 20E One end of the probe base 21, 21A, 21B, 21C, 21D abuts against the hole portions 111, 111A of the probe holes 11, 11A, 11B, 11C, 11D, 11E of the carrier 10, 10A, 10B, 10C, 10D, 111B, 111C, 111D and the sidewall between the hole ends 112, 112A, 112B, 112C, 112D, and the probe base 21, 21A, 21B, 21C of each probe 20, 20A, 20B, 20C, 20D, 20E, 21D, 21E by abutting the positioning members 30, 30A, 30B, 30C 30D, 30E frictional resistance arising on the contact plate positioned on the carrier 10,10A, 10B, 10C, 10D, 10E of the probe holes 11,11A, 11B, 11C, 11D, 11E in.

As shown in FIG. 2 and FIG. 3, in the preferred embodiment, the carrier 10 and the top portion further define a plurality of positioning recesses 12, each of the positioning recesses 12 is adjacent to the top end of the probe hole 11 adjacent to the side, and each probe The pinholes 11 are all in communication with the plurality of positioning recesses 12. The plurality of positioning members 30 are respectively disposed in the plurality of positioning recesses 12, and a part of the positioning members 30 protrudes into the probe hole 11 to contact the upper portion of the probe base portion 21 of the probe 20, so that each probe The upper portion of the probe base portion 21 of 20 is positioned in the probe hole 11 of the carrier 10 by the frictional resistance generated by the contact of the plurality of said positioning members 30.

As shown in FIG. 4 to FIG. 6 , FIG. 7 , FIG. 11 , FIG. 12 or FIG. 13 , in the preferred embodiment, a plurality of positioning recesses 12A are formed at the bottom of the carrier 10A, 10B, 10C, 10D, and 10E. 12B, 12C, 12D, 12E, each of the positioning recesses 12A, 12B, 12C, 12D, 12E is adjacent to the bottom end of the probe holes 11A, 11B, 11C, 11D, 11E, and each probe hole 11A, 11B, 11C, 11D, and 11E are all connected to the plurality of positioning recesses 12A, 12B, 12C, 12D, and 12E. The plurality of positioning members 30A, 30B, 30C, 30D, and 30E are respectively disposed in the plurality of positioning recesses 12A, 12B, 12C, 12D, and 12E, and the positioning members 30A, 30B, 30C, 30D, and 30E are A portion of the probe bases 21A, 11B, 11C, 11D, and 11E are inserted into the probe holes 11A, 11B, 11C, 11D, and 11E to contact the probe bases 20A, 20B, 20C, 20C, and 21E in the middle or lower portions of the probe base portions 21A, 21B, 21C, and 21D, so that each probe 20A, The middle or lower section of the probe base 21, 21A, 21B, 21C, 21D of 20B, 20C, 20D, 20E is positioned by the frictional resistance generated by the contact of a plurality of the positioning members 30A, 30B, 30C, 30D, 30E connected to each other. In the probe holes 11A, 11B, 11C, 11D, 11E of the carrier plates 10A, 10B, 10C, 10D, 10E.

As shown in FIG. 1 to FIG. 3, FIG. 6 or FIG. 7, FIG. 11, FIG. 12 and FIG. 13, in the preferred embodiment, the plurality of carrier boards 10, 10A, 10B, 10C, and 10D are The probe holes 11, 11A, 11B, 11C, and 11D are arranged in a matrix, and the periphery of each of the probe holes 11, 11A, 11B, 11C, and 11D and at least two positioning recesses 12, 12A, 12A, 12B, 12C, and 12D Connected. The positioning recesses 12, 12A, 12A, 12B, and 12C may be holes or long holes, as shown in FIG. 3, FIG. 6, FIG. 11 and FIG. 12, when the positioning recesses 12, 12A, 12B, and 12C are holes. Each probe hole 11, 11A, 11B, 11C is in communication with four hole-shaped positioning recesses 12, 12A, 12B, 12C; as shown in FIG. 13, when the positioning recess 12D is a long hole, each column of probes The hole 11E communicates with the two long hole-shaped positioning recesses 12E. As shown in FIG. 11 and FIG. 12, a groove may be formed on the top of the carrier plates 10C and 10D, and the plurality of probe holes 11C and 11D are disposed on the groove bottom of the groove.

As shown in Figures 2 and 3, or Figures 5 and 6, or Figure 7, or Figure 9 to Figure 11 or Figure 12 or Figure 13, the positioning members 30, 30A, 30B, 30C, 30D, 30E may be an insulating block, a sphere or a strip, etc. as shown in FIGS. 2 and 3, or 5 and 6, or 7, or 9 to 11 or 12, when the carrier 10 The positioning recesses 12, 12A, 12B, 12C, and 12D at the top or bottom of 10A, 10B, 10C, and 10D are holes, and the positioning members 30, 30A, 30B, 30C, and 30D are corresponding blocks or spheres, so that each The upper or lower sections of the probe bases 21, 21A, 21B, 21C, 21D of a probe 20, 20A, 20B, 20C, 20D provide frictional resistance to the four positioning members 30, 30A, 30B, 30C, 30D and are positioned The probe holes 10 of the carrier plates 10, 10A, 10B, 10C, and 10D. As shown in the preferred embodiment of FIG. 13, when the positioning recess 12E at the bottom of the carrier 10E is a long hole, the positioning member 30E is a corresponding strip body, so that the probe base of each column of the probe 20E is The lower stage provides frictional resistance to the two positioning members 30E and is positioned in the probe hole 11E of the carrier 10E.

In addition, the positioning component may also be an annular body (not shown), and each positioning component is respectively fixed in the probe hole of the carrier or the bottom of the carrier plate forms a plurality of annular positioning recesses communicating with the probe hole, so that The probe base of each probe is provided with frictional resistance to the positioning member and positioned in the probe aperture of the carrier.

The probe type electrical connection component of the present invention can be applied to various types of detecting fixtures such as a probe card for wafer inspection or a semiconductor component detecting device, and is applied to a semiconductor component detecting device as an example, as shown in FIG. The pin type electrical connection component is combined with a carrier set on a circuit carrier 40 of a semiconductor component detecting device (or a circuit switching interface added to the circuit carrier), and each of the probe type electrical connecting components The contact end portion 23C of the probe 20C is electrically connected to a corresponding contact point on the circuit carrier 10C. When the semiconductor component 50 to be tested is displaced on the probe type electrical connection component in the carrier, the semiconductor component 50 to be tested is subjected to a lower pressure, and each contact of the bottom of the semiconductor component 50 to be tested is electrically contacted correspondingly. The upper contact end portion 22C of the probe 20C electrically connects the semiconductor element 50 to be tested through the plurality of probes 20C of the probe type connection assembly to the circuit carrier 10C of the detecting device, and then the semiconductor device to be tested by the semiconductor device detecting device The component 50 performs detection to determine whether the function of the semiconductor component 50 to be tested is normal.

In summary, the probe type electrical connection component of the present invention is respectively installed in a plurality of probe holes of the carrier by using a plurality of probes, and is respectively fixed in the carrier by using a plurality of positioning components, and each positioning is performed. The component protrudes into the probe base and contacts the probe base of the probe, and the probe base of each probe is positioned in the probe hole of the carrier by the frictional resistance of the contact of the positioning component, thereby making the invention The probe type electrical connection assembly simplifies the configuration of the carrier board by using only a small number of probes in each of the positioning components, and can eliminate the need for the existing probe type electrical connection components to be mounted on the board of the probe. With the addition of the probe cover, the cover must be inconvenient to assemble with most of the probes at the same time and the cost is high.

At the same time, the probe type connecting component of the present invention can omit multiple probes by using a combination of a plate body and a probe cover plate compared with the existing probe type electrical connection component because the probe cover plate of the existing probe type electrical connection component can be omitted. The combined structure enables the invention to reduce the thickness of the carrier and the length of the probe, thereby shortening the transmission distance of the signal through the probe, and the invention can be applied to various detection fixtures to improve the detection performance.

In addition, the probe type electrical connection assembly of the present invention can omit the probe cover of the existing probe type electrical connection assembly. In the process of assembly and replacement of the probe, the probe type electrical connection assembly of the present invention can directly The probe is taken by a tool, and a small number of probes can be accurately replaced individually, which facilitates assembly and replacement of the probe, and is an invention of a probe type electrical connection component having industrial value.

10, 10A, 10B, 10C, 10D, 10E‧‧‧ carrier board

11, 11A, 11B, 11C, 11D, 11E‧‧ ‧ probe holes

111, 111C, 111D‧‧‧ Hole Department

112, 112C, 112D‧‧‧ hole end

12, 12A, 12B, 12C, 12D, 12E‧‧‧ positioning recess

13‧‧‧Component placement slot

20, 20A, 20B, 20C, 20D, 20E‧‧ ‧ probe

21, 21A, 21B, 21C, 21D‧‧‧ probe base

22, 22A, 22B, 22C, 22D‧‧‧ upper contact end

23, 23A, 23B, 23C, 23D‧‧‧ contact end

30, 30A, 30B, 30C, 30D, 30E‧‧‧ Positioning parts

40‧‧‧Circuit carrier board

50‧‧‧Semiconductor components to be tested

60‧‧‧ board

61‧‧‧Probe cover

70‧‧‧ probe

80‧‧‧circuit carrier board

1 is a top plan view showing a first preferred embodiment of the probe type electrical connection assembly of the present invention. 2 is a partially enlarged schematic view showing the first preferred embodiment of the probe type electrical connection assembly shown in FIG. 1. 3 is a cross-sectional view showing the position of the cutting line A-A of the first preferred embodiment of the probe type electrical connecting assembly of FIG. 1. 4 is a bottom plan view showing a second preferred embodiment of the probe type electrical connection assembly of the present invention. FIG. 5 is a partially enlarged schematic view showing a second preferred embodiment of the probe type electrical connection assembly shown in FIG. 4. 6 is a cross-sectional view showing the position of the cutting line B-B of the second preferred embodiment of the probe type electrical connecting assembly shown in FIG. 4. Figure 7 is a partial cross-sectional view showing a third preferred embodiment of the probe type electrical connection assembly of the present invention. Figure 8 is a bottom perspective view of a fourth preferred embodiment of the probe type electrical connection assembly of the present invention. FIG. 9 is a partial perspective exploded view of the fourth preferred embodiment of the probe type electrical connection assembly shown in FIG. 7. FIG. Figure 10 is a partial bottom plan view showing the fourth preferred embodiment of the probe type electrical connector assembly of Figure 7. Figure 11 is a schematic cross-sectional view showing the position of the face line C-C shown in Figure 10. Figure 12 is a partial side cross-sectional view showing a fifth preferred embodiment of the probe type electrical connection assembly of the present invention. Figure 13 is a partial bottom plan view showing a sixth preferred embodiment of the probe-type electrical connection assembly of the present invention. FIG. 14 is a view showing a state in which the fourth preferred embodiment of the probe type electrical connection assembly shown in FIG. 8 is mounted on a circuit carrier to provide a state of use for detecting a semiconductor component to be tested. 15 is a schematic cross-sectional view showing the conventional probe type electrical connection component mounted on a circuit carrier for semiconductor component detection.

10‧‧‧ Carrier Board

11‧‧‧ probe hole

111‧‧‧ Hole Department

112‧‧‧ hole end

12‧‧‧ positioning recess

20‧‧‧ probe

21‧‧‧ Probe base

22‧‧‧Upper contact end

23‧‧‧ Lower contact end

30‧‧‧ Positioning parts

Claims (6)

A probe type electrical connection assembly includes: a carrier plate having a plurality of probe holes arranged in a matrix and spaced upwardly and vertically, each probe hole comprising a hole portion and a hole at one end of the hole portion The end portion, the hole end portion has a smaller hole diameter than the hole portion, and the side of the carrier plate away from the hole end portion of the probe hole forms a plurality of positioning concave portions, and the positioning concave portion has a long hole shape. a row of the probe holes communicating with two of the long hole-shaped positioning recesses; a plurality of probes respectively mounted in the plurality of probe holes of the carrier, the probes comprising elastic members And a conductive member capable of lengthwise expansion and change, the probes each comprising a probe base, an upper contact end located at an upper end of the probe base, and a lower contact end located at a lower end of the probe base, the probe base being located In the hole portion of the probe hole, the upper contact end portion protrudes from a hole portion of the probe hole from a top surface of the carrier plate, and one end of the probe base portion is a hole end of the probe hole Limiting position; and a plurality of positioning members respectively fixed to the plurality of positioning at the bottom of the carrier In the portion, the positioning member is a strip corresponding to the long hole-shaped positioning recess, and a part of the positioning member protrudes into the probe hole to contact the probe base of the probe, so that each column is The probe base of the probe is positioned in the probe hole of the carrier by the frictional resistance generated by the contact of the two positioning members. The probe type electrical connection assembly of claim 1, wherein the contact end portion and the lower contact end portion of the probe are both of a retractable type, and the lower contact end portion is formed by the probe hole The lower end of the hole portion projects downward from the bottom surface of the carrier or is flush with the bottom surface of the carrier. The probe type electrical connection assembly of claim 1, wherein the contact end portion of the probe is of a retractable type, and the lower contact end portion is fixed to a lower end of the probe base, the lower portion The bottom edge of the contact end is flush with the bottom surface of the carrier. A probe type electrical connection assembly includes: a carrier plate having a plurality of matrix-shaped spaced-apart probe holes, wherein each probe hole includes a hole portion and a hole end at one end of the hole portion a portion of the hole end having a smaller diameter than the hole portion An aperture, a side of the carrier that is away from the end of the hole of the probe hole, and a plurality of annular positioning recesses that communicate with the probe hole; a plurality of probes respectively mounted on the plurality of probe holes of the carrier The probe is a conductive member comprising an elastic member capable of varying length and length. The probes each include a probe base, an upper contact end at the upper end of the probe base, and a lower end of the probe base. a lower contact end, the probe base being located in a hole portion of the probe hole, the upper contact end projecting from a hole portion of the probe hole to a top surface of the carrier, the probe base One end of the probe hole is limited to the end of the hole of the probe hole; and a plurality of positioning members are respectively fixed on the bottom of the carrier, the positioning component is an annular body, and each positioning component is mounted on the annular positioning In the recess, the probe base of each of the probes is provided with frictional resistance to the positioning member and positioned in the probe hole of the carrier. The probe type electrical connection assembly of claim 4, wherein the contact end portion and the lower contact end portion of the probe are both of a retractable type, and the lower contact end portion is formed by the probe hole The lower end of the hole portion projects downward from the bottom surface of the carrier or is flush with the bottom surface of the carrier. The probe type electrical connection assembly of claim 4, wherein the contact end portion of the probe is of a retractable type, and the lower contact end portion is fixed to a lower end of the probe base, the lower portion The bottom edge of the contact end is flush with the bottom surface of the carrier.