TWI608213B - Heat transfer device - Google Patents

Description

Heat transfer device

The present invention relates to a heat transfer device in which a heat receiving portion is provided on one end side of a heat pipe and a heat radiating portion is provided on the other end side.

In general, a heat transfer tube in which a heat-insulating portion is provided in a container, a heat-receiving portion is provided on one end side of the heat pipe, and a heat-dissipating portion is provided on the other end side is known. In this type of heat transfer device, the actuating liquid is repeatedly evaporated in the container and recirculated to carry out heat transfer. That is, the actuating liquid evaporates on the heat receiving portion side of the container, and the evaporated working fluid moves toward the heat radiating side inside the container by the pressure difference. Further, the evaporated working fluid condenses on the heat radiating side to become a liquid, and the operating fluid recirculates on the heat receiving portion side by the capillary force of the wick provided on the inner wall of the container. As described above, in the heat transfer device including the heat pipe, since the apparent thermal conductivity of the container is several times or even several tens of times higher than that of a metal such as copper or aluminum, it is used, for example, in an electronic device such as a personal computer. Cooling of cooling target components such as CPU.

However, the heat pipe is classified into the heat receiving portion in the direction of gravity according to the position of the heat receiving portion provided with the cooling target component. The top portion of the portion is heated, and the heat receiving portion is disposed at the bottom of the lower portion in the direction of gravity to heat. When the heat pipe is disposed at the top of the heating, the backflow of the moving liquid toward the heat receiving portion at a high position is hindered by gravity, and thus the amount of heat transfer is greatly reduced.

As a method for solving this problem, a vibration machine is attached to a heat pipe to assist the flow of the liquid to the heat receiving portion disposed above the gravity direction (for example, refer to Patent Document 1).

[Previous Technical Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open No. 2-115692

[Summary of the Invention]

However, in the conventional technique exemplified in Patent Document 1, it is necessary to provide a mechanism in which the vibrating machine is complicated, and there is a problem that the volume of the container (heat pipe) is greatly increased. Therefore, the entire heat transfer device is increased in size, and it is difficult to mount a small electronic device such as a personal computer.

In order to solve the above problems, the present invention has been made in an effort to provide a heat transfer device which can be easily configured and which has improved heat transfer characteristics.

In order to achieve the above object, the present invention is provided with an encapsulation liquid A heat pipe in which a heat receiving portion is provided on one end side of the heat pipe and a heat radiating portion is provided on the other end side, wherein a capillary pressure is relatively large in the heat receiving portion of the heat pipe on the inner wall of the heat pipe. a first wick, wherein a second wick having a relatively small flow resistance is disposed in the heat dissipating portion of the heat pipe, and a curved portion that is bent between the heat receiving portion and the heat radiating portion, the first liquid absorbing liquid A boundary portion between the core and the second wick is disposed at a lower portion of the curved portion in a gravity direction, and the heat receiving portion is disposed at an upper portion of the curved portion in a gravity direction.

In this configuration, the second wick may have a plurality of groove portions extending in the longitudinal direction on the inner wall of the heat pipe.

The depth of the groove portion may be set to be 0.10 to 0.20 mm. Further, the depth of the groove portion may be 30 to 70% of the thickness of the wall of the heat pipe.

Further, the first wick may have a sintered sintered body formed of a sintered spherical body or a powder of a different shape. Further, the second wick may be provided with a metal grouping wire or a fine metal mesh. Further, the second wick may have a sintered spherical body or a porous sintered metal formed of a powder of a different shape in a central portion in the width direction of the heat pipe, and the inside of the heat pipe sandwiching the porous sintered body metal A vapor flow path is formed. Further, the second wick may have a semi-elliptical porous sintered metal formed by sintering one or more spherical bodies or powders of different shapes in a central portion in the width direction of the heat pipe, and the semi-elliptical porous sintered metal may be formed. The flat portion is provided on the inner wall of the heat pipe, and a vapor flow path is formed on the right and left sides of the heat pipe sandwiching the semi-elliptical porous sintered body metal.

Further, the heat pipe may be formed by flattening the other end side to be thinner than the thickness of the one end side. The above-mentioned operating liquid may be stored at the boundary portion of the above plurality of wicks.

According to the invention, the heat pipe includes a plurality of wicks for transferring the actuating liquid on the inner wall, and the boundary portions of the plurality of wicks are disposed at a lower portion in the gravity direction of the curved portion of the heat transport device. The boundary portion is immersed in an operating fluid that flows under gravity. Therefore, the recirculation of the actuating liquid toward the one end side of the heat pipe provided with the heat receiving portion is promoted, whereby the heat transfer efficiency can be improved with a simple configuration. Further, since the heat pipe has the bay portion between the one end side and the other end side, it is easy to store the moving liquid in the bent portion.

10,110,210‧‧‧heat conveyor

11‧‧‧ Heat pipe

11A‧‧‧One end

11B‧‧‧The other end

11C‧‧‧Bend

11D‧‧‧Storage Department

12‧‧‧heated plate (heating section)

13‧‧‧Film (heat dissipation)

14‧‧‧Hot components (cooling target components)

15‧‧‧ Container

15A‧‧‧ inner wall (inner wall)

21‧‧‧1st wick

22, 122, 222‧ ‧ second wick

23‧‧‧Borders Department

24‧‧‧Working fluid

31, 232‧‧‧Porous sintered metal

32, 132, 232‧‧‧Vapor flow path

33‧‧‧ Groove Department

34‧‧‧ Groove wick

131‧‧‧Metal marshalling line

Fig. 1 is a perspective view of the heat transport device of the embodiment.

Fig. 2 is a view showing the internal structure of the heat transport device.

Fig. 3 is a cross-sectional view showing one end side of the heat pipe.

Fig. 4 is a cross-sectional view showing the other end side of the heat pipe.

Fig. 5 is a schematic view showing the internal structure of a heat transport device according to Embodiment A.

Fig. 6 is a schematic view showing the internal structure of the heat transport device of the embodiment B.

Figure 7 is a model of the internal structure of the heat transport device of Example C. Figure.

Fig. 8 is a schematic view showing the internal structure of a heat transport device according to Embodiment D.

Fig. 9 is a schematic view showing the internal structure of a heat transport device according to a modification of the embodiment.

Fig. 10 is a schematic view showing the internal structure of a heat transport device according to another embodiment.

Fig. 11 is a cross-sectional view showing the other end side of the heat pipe of the eighth embodiment.

Fig. 12 is a schematic view showing the internal structure of another heat transfer device according to another embodiment.

Figure 13 is a cross-sectional view showing the other end side of the heat pipe.

Fig. 14 is a cross-sectional view showing the other end side of the heat pipe according to the ninth embodiment.

Hereinafter, an embodiment of the present invention will be described with reference to the drawings.

Fig. 1 is a perspective view showing the heat transport device 10 of the present embodiment.

The heat transport device 10 according to the present embodiment is used for cooling of various heat generating elements 14 such as a CPU or a semiconductor memory such as a personal computer or an information home appliance.

The heat transfer device 10 is as shown in Fig. 1 and includes a heat pipe 11; A heat receiving plate (heat receiving portion) 12 disposed on one end 11A side of the heat pipe 11 and a heat radiating fin (heat radiating portion) 13 provided on the other end 11B side of the heat pipe 11. The heat generating element 14 as a cooling target is attached to the heat receiving plate 12.

The heat pipe 11 is provided with a metal material excellent in thermal conductivity, for example, aluminum, aluminum alloy, copper, or the like, and has a hollow container 15 therein, and the working fluid 24 is sealed in the container 15 (second drawing).

As shown in Fig. 1, the heat pipe 11 is provided with a bent portion 11C bent at a substantially right angle between the one end 11A and the other end 11B, and one end 11A of the heat pipe 11 extends vertically upward from the curved portion 11C. In other words, in the heat pipe 11 of the present embodiment, the heat receiving plate 12 is disposed in the upper portion in the gravity direction, that is, in the so-called top heating mode, and the curved portion 11C is disposed in the lower portion in the gravity direction.

Further, the heat pipe 11 has a flat shape (a substantially elliptical cross section) in one end 11A and the other end 11B, and the heat receiving plate 12 and the heat radiating fin 13 are in contact with each other in a wide range, and heat exchange is possible. Further, the curved portion 11C is formed in a cylindrical shape, and a large heat transport space is provided inside. In the present embodiment, the cylindrical container 15 is bent to form the curved portion 11C in the middle, and the one end 11A and the other end 11B are pressed and flattened.

Further, at one end 11A of the heat pipe 11, the heat receiving plate 12 is attached by means of welding, brazing, soldering, or the like, and the other end 11B of the heat pipe 11 is formed to penetrate through the hole portion of the heat radiating fin 13 and fixed.

The heat receiving plate 12 is formed of a metal plate such as aluminum metal, and the heat dissipating fin 13 is formed by bending both side edges of a metal plate such as aluminum into substantially parallel portions to form a cross section. A plurality of wings of the font. The wings are arranged in the extending direction of the heat pipe 11, and the plates are integrally fixed by soldering.

Fig. 2 is a view schematically showing the internal structure of the heat transport device 10, Fig. 3 is a cross-sectional view of the heat pipe 11 at one end 11A side, and Fig. 4 is a cross-sectional view of the other end 11B side.

The operation liquid 24 is sealed in the inside of the container 15, and the inner wall surface 15A (inner wall) of the container 15 is shown in Fig. 2, and the first liquid absorbing core 21 and the second liquid are provided by the capillary pressure transfer encapsulation. Suction core 22.

The first wick 21 and the second wick 22 are different types of wicks, and the first wick 21 is disposed from the one end 11A side of the heat pipe 11 along the longitudinal direction of the heat pipe 11 (container 15). The second wick 22 is provided along the longitudinal direction of the heat pipe 11 (container 15) from the other end 11B side of the heat pipe 11. Further, the boundary portion 23 between the first wick 21 and the second wick 22 is placed at the lowermost portion of the curved portion 11C of the heat pipe 11.

Therefore, in the boundary portion 23, the operating fluid 24 condensed in the heat pipe 11 is stored, and the first wick 21 connected to the boundary portion 23 is often immersed in the working fluid 24.

The first wick 21 is a wick having a relatively large capillary pressure. In the present embodiment, as shown in Fig. 3, the inner wall surface 15A is provided with a spherical body having a particle size of about 45 to 200 μm or a metal having a different shape. The porous sintered metal 31 is composed of. The operating fluid 24 impregnated with the porous sintered metal 31 is a heat receiving plate 12 that reaches a gap that penetrates the porous sintered metal 31 by capillary pressure. In addition, the internal space surrounded by the porous sintered metal 31 is a vapor flow path 32 through which the moving liquid vapor is evaporated after the heat supplied from the heat receiving plate 12 (Fig. 1).

Further, the second wick 22 is a wick having a high flow resistance and a high permeability, and in the present embodiment, the inner wall surface 15A includes a plurality of groove portions 33 extending in the longitudinal direction. Core 34. The operating fluid 24 condensed by the heat radiating fins 13 reaches the boundary portion 23 through the groove portions 33. At this time, the conduction angle in the longitudinal direction of the heat pipe 11 (container 15) with respect to the groove portion 33 (groove) is preferably in the range of 0 to 20 degrees.

In the present embodiment, as shown in Figs. 3 and 4, the height H1 of one end 11A of the heat pipe 11 is higher than the height H2 of the other end 11B, and the wall thickness t1 of the container 15 of the one end 11A is formed to be larger than the other end 11B. The wall thickness t2 is relatively thick.

According to the present embodiment, the heat pipe 11 in which the operating fluid 24 is sealed is provided, and the heat receiving plate 12 is provided on the one end 11A side of the heat pipe 11, and the heat transfer device 10 is provided on the other end 11B. The heat pipe 11 is provided on the one end 11A side. The curved portion 11C that is bent between the other end 11B side is disposed at a lower portion in the direction of gravity, so that it is easy to store the working fluid 24 in the curved portion 11C. Further, the first liquid absorbing core 21 and the second liquid absorbing core 22 that transfer the working fluid 24 are provided on the inner wall of the heat pipe 11, and the boundary portion 23 between the first liquid absorbing core 21 and the second liquid absorbing core 22 is disposed. Since the curved portion 11C is formed, the boundary portion 23 between the first wick 21 and the second wick 22 is immersed in the operating fluid 24 stored in the curved portion 11C. Therefore, by the capillary pressure of the first wick 21, the first wick 21 realizes the task of pumping the reversal liquid 24 at a high position, and the second wick 22 can quickly actuate the effluent from the reservoir. 24 is sent to the water supply pipe of the first wick 21 to perform an effective circulating fluid. Thereby, the actuating liquid 24 is promoted toward the side The reflow of the one end 11A side of the heat pipe 11 of the heat receiving plate 12 can be simply configured to improve the heat transfer efficiency.

Further, according to the present embodiment, the first wick 21 having a relatively large capillary pressure is disposed on the one end 11A side of the heat pipe 11, and the second wick having a relatively small flow resistance is disposed on the other end 11B side of the heat pipe 11. Since the core 22 is configured, for example, even in the top heating mode in which the heat receiving plate 12 is disposed in the upper portion in the gravity direction, the working fluid 24 can be effectively returned to the one end 11A side of the heat pipe 11.

Further, according to the present embodiment, the first wick 21 is configured to include a sintered spherical body or a porous sintered metal 31 formed of a powder of a different shape. Therefore, it is possible to easily form a wick having a relatively large capillary pressure.

Further, according to the present embodiment, the second wick 22 includes the plurality of groove portions 33 extending in the longitudinal direction on the inner wall surface 15A of the heat pipe 11, so that the wick having a relatively small flow resistance can be formed.

Next, it is explained with respect to an embodiment.

(Example 1)

The container 15 of the heat pipe 11 is a cylindrical container having an outer diameter of 10 mm, a wall thickness of 0.3 mm, and a length of 260 mm. The thickness H1 on the one end 11A side of the heat pipe 11 (container 15) was pressed flat into 4.0 mm, and the thickness H2 on the other end 11B side was pressed and flattened into 2.5 mm. Further, a heat receiving plate 12 made of copper metal was placed on one end 11A side, and a heat radiating fin 13 having a length of 100 mm made of aluminum was placed on the other end 11B side.

In the inner wall surface 15A of the container 15, the first wick 21 is disposed on the one end 11A side so that the porous sintered metal 31 has a thickness of 1.3 mm, and the height of the vapor flow path 32 is 0.8 mm. Further, the second sorbent core 22 is disposed on the other end 11B side so that the porous sintered metal 31 has a thickness of 0.7 mm, and the height of the vapor flow path 32 is 0.5 mm.

In the heat pipe 11, the curved portion 11C is provided between the one end 11A and the other end 11B, and the boundary portion 23 of the wick formed by the two types of porous sintered metal 31 is formed as the curved portion 11C. In this state, a heater having a size of 16 mm × 16 mm was attached to the heat receiving plate 12, and the maximum heat transfer amount and the heat resistance between the heater and the room temperature were measured.

The maximum heat transfer amount is the maximum heat that the heat pipe 11 can transport, and the maximum value of the actuating liquid 24 that does not dry in the heat pipe 11.

The temperature at the one end 11A side and the other end 11B side of the evaporation portion are measured, and it is determined that the isothermal temperature difference is equal to or higher than the predetermined temperature difference. The heat of the heater before the drying instant was measured.

Further, the heater and the room temperature thermal resistance are values of the difference between the heater temperature and the room temperature (ambient ambient temperature) when the maximum heat transfer amount is divided by the maximum heat transfer amount. Measure and calculate this value.

(Example 2)

In comparison with the first embodiment, the porous sintered metal 31 constituting the first wick 21 is disposed to have a thickness of 1.0 mm and the height of the vapor passage 32 is 1.4 mm. The other configuration is the same as that of the first embodiment, and thus the description thereof is omitted.

(Example 3)

In the third embodiment, the second wick 22 provided on the other end 11B side of the heat pipe 11 is not provided with the groove wick 34 of the plurality of groove portions 33 extending in the longitudinal direction, not according to the porous sintered metal 31. The point is different from that of the first embodiment. The other configuration is the same as that of the first embodiment.

In the third embodiment, the depth d of the groove portion 33 (groove) was 0.25 mm, and the height of the vapor flow path 32 was 1.4 mm. Further, since the thickness H2 on the other end 11B side is 2.5 mm, the thickness t2 of the heat pipe 11 (container 15) on the other end 11B side is 0.3 mm. Therefore, the depth d of the groove portion 33 (groove) with respect to the wall thickness t2 of the heat pipe 11 (container 15) is 83.3%.

(Example 4)

In the fourth embodiment, the depth d of the groove portion 33 (groove) of the second wick 22 is 0.20 mm, and the point at which the height of the vapor flow path 32 is 1.5 mm is different from that of the third embodiment. Others are the same as in the third embodiment.

In the fourth embodiment, the depth d of the groove portion 33 (groove) with respect to the wall thickness t2 of the heat pipe 11 (container 15) is 66.7%.

(Example 5)

In the fifth embodiment, the porous sintered metal 31 constituting the first wick 21 has a thickness of 1.0 mm, and the height of the vapor passage 32 is 1.4 mm. The other is the same as in the fourth embodiment.

(Example 6)

In the sixth embodiment, the depth d of the groove portion 33 (groove) of the second wick 22 is 0.15 mm, and the point at which the height of the vapor flow path 32 is 1.6 mm is different from that of the third embodiment. Others are the same as in the third embodiment.

In the sixth embodiment, the depth d of the groove portion 33 (groove) with respect to the wall thickness t2 of the heat pipe 11 (container 15) is 50%.

(Example 7)

In the seventh embodiment, the depth d of the groove portion 33 (groove) of the second wick 22 is 0.10 mm, and the point at which the height of the vapor flow path 32 is 1.7 mm is different from that of the third embodiment. Others are the same as in the third embodiment.

In the seventh embodiment, the depth d of the groove portion 33 (groove) with respect to the wall thickness t2 of the heat pipe 11 (container 15) is 33.3%.

The values of the maximum heat transfer amount of these Examples 1 to 7 and the heat resistance between the heater and the room temperature are shown in Table 1.

According to the table 1, the second wick 22 is provided with a structure of the groin wick 34 which is relatively smaller than the flow resistance of the porous sintered metal 31, and the first wick 21 and the second wick 22 are porous. Comparing the existing compositions of the sintered metal 31, it is possible to obtain a maximum heat transfer amount of 1.5 times and a heat transfer resistance of about 0.2 degrees/W.

In addition, as the second wick 22, the depth d of the groove portion 33 is 0.10 to 0.20 mm, even in the configuration in which the groove wick 34 having the plurality of groove portions 33 extending in the longitudinal direction is provided. In the configuration, the maximum transport amount is still 110 W or more, and the thermal resistance between the heater and the room temperature is 0.70 ° C / W or less.

Therefore, the depth d of the groove portion 33 is not arbitrarily set, and when the depth d of the groove portion 33 is set to a depth of 30 to 70% with respect to the thickness of the heat pipe 11, the heat transfer characteristics can be further improved.

Next, a configuration in which the position of the boundary portion 23 between the first wick 21 and the second wick 22 is changed will be described.

(Example A)

Fig. 5 is a schematic view showing the internal structure of a heat transport device according to Embodiment A.

In the embodiment A, the boundary portion 23 between the first wick 21 and the second wick 22 is placed at a position of 0 degrees in the direction of gravity with respect to the curved portion 11C. Specifically, the angle between the reference line 50 extending from the bending center O of the curved portion 11C toward the gravity direction (vertically downward) and the boundary portion 23 is set to be 0 degrees, that is, the boundary portion 23 is located on the reference line 50.

Further, the configuration other than the position of the boundary portion 23 of the heat pipe 100 is the same as that of the above-described fifth embodiment.

(Example B)

Fig. 6 is a schematic view showing the internal structure of the heat transport device of the embodiment B.

In the second embodiment, the boundary portion 23 between the first wick 21 and the second wick 22 is disposed closer to the other end 11B side of the heat pipe 11 than the reference line 50. Specifically, the boundary portion 23 is provided at a position shifted by a predetermined distance L (20 mm) from the reference line 50 toward the other end 11B side of the heat pipe 11. The configuration other than the position of the boundary portion 23 of the heat pipe 100 is the same as that of the above-described fifth embodiment.

(Example C)

Figure 7 is a model of the internal structure of the heat transport device of Example C. Figure.

In the embodiment C, the boundary portion 23 between the first wick 21 and the second wick 22 is provided at a position 45 degrees in the direction of gravity with respect to the curved portion 11C. Specifically, it is provided at a position where the angle formed by the reference line 50 and the boundary portion 23 is 45 degrees.

Further, the configuration other than the position of the boundary portion 23 of the heat pipe 100 is the same as that of the above-described fifth embodiment.

(Example D)

Fig. 8 is a schematic view showing the internal structure of a heat transport device according to Embodiment D.

In the example D, the boundary portion 23 between the first wick 21 and the second wick 22 is provided at a position of 90 degrees in the direction of gravity with respect to the curved portion 11C. Specifically, the boundary portion 23 is placed at a position where the angle formed by the reference line 50 and the boundary portion 23 is 90 degrees, that is, from the curved center O of the curved portion 11C toward the horizontal reference line 51 extending in the horizontal direction.

Further, the configuration other than the position of the boundary portion 23 of the heat pipe 100 is the same as that of the above-described fifth embodiment.

The maximum heat transfer amount of these Examples A to D and the value of the heat resistance between the heater and the room temperature (the relationship between the position and characteristics of the wick boundary setting) are shown in Table 2.

According to this configuration, the examples A to C and the boundary portion 23 in which the boundary portion 23 is provided at an angular position smaller than 45 degrees from the gravity direction of the curved portion 11C are provided at a position 90 degrees in the direction of gravity with respect to the curved portion 11C. In the comparison of the embodiment D, the effect of improving the heat transfer characteristics of the maximum heat transfer amount of 1.5 times and the heat resistance of about 0.2 degrees/W was obtained.

As described above, the heat pipe 11 is formed such that the boundary portion 23 between the first wick 21 and the second wick 22 is positioned below the gravity direction, whereby the boundary portion 23 can be immersed in the operating fluid 24. Therefore, the first wick 21 realizes the task of reversing the pump 24 at a high position by the capillary pressure of the first wick 21, and the second wick 22 can be quickly activated from the reservoir. The liquid 24 is sent to the water supply pipe of the first wick 21 to perform an effective circulating fluid. Thereby, the recirculation of the actuating liquid 24 toward the one end 11A side of the heat pipe 11 provided with the heat receiving plate 12 is promoted, and the heat transfer efficiency can be easily improved.

Next, a modification of the embodiment will be described.

Fig. 9 is a schematic view showing the internal structure of the heat transport device 10 according to a modification of the embodiment.

In this configuration, the heat pipe 11 is as shown in Fig. 9, not only at one end A curved portion 11C is provided between the 11A and the other end 11B, and the curved portion 11C is provided with a storage portion 11D that is located at the lowermost portion of the heat pipe 11 in the direction of gravity and stores the working fluid 24. Further, the boundary portion 23 between the first wick 21 and the second wick 22 is formed in the reservoir portion 11D located in the curved portion 11C.

In this configuration, the operating fluid 24 that has been condensed by the heat dissipating fins 13 on the other end 11B side of the heat pipe 11 flows into the reservoir portion 11D through the second wick 22, and is stored in the reservoir portion 11D. As a result, the operating fluid 24 stored in the reservoir portion 11D is always immersed in the first wick 21, so that the actuating liquid 24 is recirculated toward the end 11A side of the heat pipe 11 having the heat receiving plate 12, which can be further improved. Improve heat transfer efficiency.

Next, it will be described with respect to other embodiments.

Fig. 10 is a schematic view showing the internal structure of a heat transport device 110 according to another embodiment.

In the above-described embodiment, the second wick 22 having the relatively small flow resistance is provided on the other end 11B side of the heat pipe 11 so as to provide the groove wick 34 having the plurality of groove portions 33 extending in the longitudinal direction. Composition. However, as long as the flow resistance is relatively small, the second wick 122 having a different configuration may be provided.

In the other embodiment, the second wick 122 may have a configuration in which the metal grouping line 131 is provided. In the metal grouping line 131, a plurality of metal thin wires are formed in a mesh shape, and a small flow resistance is formed as compared with the porous sintered metal 31 of the first liquid absorbing core 21.

The metal grouping line 131 is shown in Fig. 11, and is disposed on both end sides in the width direction of the other end 11B after the flat pressing process, and is formed in the center portion. A vapor flow path 132 is formed. Further, the metal grouping line 131 may be provided at one end of the one side in the width direction. Further, the second wick 122 may have a configuration in which a metal mesh or a fine metal mesh is disposed. Further, in addition to the above, the heat pipe 11 of the embodiment may be combined to constitute the storage portion 11D.

(Example 8)

In the eighth embodiment, two metal thin wires (core wire Φ0.06 mm) are formed into a mesh shape, and the metal grouping wires 131 are disposed on both end sides in the width direction of the other end 11B. The other configuration except the other end 11B side is the same as that of the above-described second embodiment.

In addition, it demonstrates about other embodiment.

Fig. 12 is a schematic view showing the internal structure of a heat transport device 210 according to still another embodiment.

In the other embodiment, the heat transfer device 210 is a second sorbent core 222 which is provided with a sintered spherical body or a powder of a different shape on the other end 11B side of the heat pipe 11. The porous sintered metal 231 is provided in the center portion in the width direction of the heat pipe 11 as shown in Fig. 13, and a vapor flow path 232 is formed on the left and right inside the heat pipe 11 sandwiching the porous sintered metal 231.

Further, the heat pipe 11 of the other embodiment may be configured to include the storage portion 11D.

(Example 9)

Fig. 14 is a cross-sectional view showing the other end 11B side of the heat pipe 11 according to the ninth embodiment.

In the ninth embodiment, the semi-elliptical porous sintered metals 231 and 231 which are formed by sintering one or more spherical bodies or different-shaped powders are provided in the central portion in the width direction of the heat pipe 11 which faces the elliptical side arc faces. . Specifically, the elliptical porous sintered metal 231 has a width of 6 mm and a height of 0.95 mm when two overlaps. The configuration other than the other end 11B side is the same as that of the above-described second embodiment.

The values of the maximum heat transfer amount of these Examples 8 and 9 and the heat resistance between the heater and the room temperature are shown in Table 3.

In the eighth and ninth embodiments, the metal grouping line 131 or the porous sintered metal 231 is provided as the second wick 122 provided on the inner wall surface 15A of the other end 11B of the heat pipe 11, thereby obtaining a comparison with the configuration of the second embodiment. The maximum conveying capacity is 1.5 times or more, and the thermal resistance is improved by about 0.2 degrees/W.

In particular, the reason why the embodiment 9 is good is that in addition to the capillary force of the semi-elliptical porous sintered metals 231 and 231, the acute angle portion is formed by the contact of the circular arc surfaces, and the groove portion can be formed at the portion thereof. With hair Thin tube force and low flow resistance.

The present invention has been described in detail above with reference to the embodiments, but the invention is not limited thereto, and may be modified without departing from the spirit and scope of the invention.

For example, in the above embodiment, the heat transfer devices 10, 110, and 210 are described in the top heating mode for the upper portion of the heat receiving plate 12 in the gravity direction, but it is obvious that the present invention can also be applied to the heat receiving plate 12 at the gravity. The configuration of the bottom heating mode of the lower part of the direction.

10‧‧‧Heat conveyor

11‧‧‧ Heat pipe

11A‧‧‧One end

11B‧‧‧The other end

11C‧‧‧Bend

12‧‧‧heated plate (heating section)

13‧‧‧Film (heat dissipation)

15‧‧‧ Container

15A‧‧‧ inner wall (inner wall)

21‧‧‧1st wick

22‧‧‧2nd wick

23‧‧‧Borders Department

24‧‧‧Working fluid

33‧‧‧ Groove Department

Claims (10)

A heat transport device comprising a heat pipe in which an actuating liquid is sealed, a heat receiving portion provided on one end side of the heat pipe, and a heat transfer device in which a heat radiating portion is provided on the other end side, wherein the heat pipe is on the inner wall of the heat pipe The heat receiving portion is provided with a first wick having a relatively large capillary pressure, and a second wick having a relatively small flow resistance is disposed in the heat radiating portion of the heat pipe, and is disposed in the heat receiving portion and the heat radiating portion. In the curved portion that is bent, the boundary between the first wick and the second wick is disposed at a lower portion in the direction of gravity of the curved portion, and the heat receiving portion is disposed at an upper portion of the curved portion in the direction of gravity. The heat transfer device according to claim 1, wherein the second wick has a plurality of groove portions extending in a longitudinal direction on the inner wall of the heat pipe. The heat transfer device according to claim 2, wherein the groove portion has a depth of 0.10 to 0.20 mm. The heat transfer device according to claim 2, wherein the depth of the groove portion is a depth of 30 to 70% with respect to a thickness of the heat pipe. The heat transfer device according to claim 1, wherein the first wick has a sintered sintered body formed of a sintered spherical body or a powder of a different shape. The heat transport device according to claim 1 or 5, wherein the second wick has a metal grouping wire or a fine metal network. The heat transfer device according to the first aspect of the invention, wherein the second wick is a porous sintered metal having a sintered spherical body or a powder of a different shape in a central portion in a width direction of the heat pipe. A vapor flow path is formed on the left and right inside the heat pipe in which the porous sintered body metal is interposed. The heat transfer device according to the first or fifth aspect of the invention, wherein the second wick has a spherical body formed by sintering one or more spherical bodies or powders having different shapes in a central portion in the width direction of the heat pipe. In the elliptical porous sintered metal, the flat portion of the semi-elliptical porous sintered metal is provided on the inner wall of the heat pipe, and a vapor flow path is formed on the right and left sides of the heat pipe sandwiching the semi-elliptical porous sintered body metal. The heat transfer device according to claim 1, wherein the heat pipe is formed by flattening the other end side to be thinner than a thickness of the one end side. The heat transfer device according to claim 1, wherein the actuating liquid is stored at a boundary portion of the plurality of types of wicks.