TWI607816B - Laser beam auxiliary illumination system for increasing powder efficiency and method thereof - Google Patents

Laser beam auxiliary illumination system for increasing powder efficiency and method thereof Download PDF

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TWI607816B
TWI607816B TW105136405A TW105136405A TWI607816B TW I607816 B TWI607816 B TW I607816B TW 105136405 A TW105136405 A TW 105136405A TW 105136405 A TW105136405 A TW 105136405A TW I607816 B TWI607816 B TW I607816B
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laser beam
laser
workpiece
processing
powder utilization
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TW201817529A (en
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李炫璋
郭靜男
陳信助
蔡國騰
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財團法人工業技術研究院
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增加粉末利用率之雷射光束輔助照射系統及其方法 Laser beam assisted illumination system for increasing powder utilization rate and method thereof

本揭露係關於一種粉末披覆或熔覆製程技術,詳而言之,係關於一種增加粉末利用率之雷射光束輔助照射系統及其方法。 The present disclosure relates to a powder coating or cladding process technology, and more particularly to a laser beam assisted illumination system and method for increasing powder utilization.

雷射披覆製程技術(Laser Cladding)與雷射金屬熔覆製程技術(Laser Metal Deposition,LMD)可搭配五軸或Robot移載,進行3D曲面列印、披覆與修補等製程,適合少量多樣之高單價客製化商品。 Laser Cladding and Laser Metal Deposition (LMD) can be used with 5D or Robot transfer for 3D surface printing, coating and repair, suitable for a small variety The high unit price of customized products.

雷射披覆製程技術或雷射金屬熔覆製程技術係於工件材料表面上,透過覆蓋或噴粉方式提供金屬粉末,並藉由雷射光之熱效應作用,達到高溫融化產生冶金變化,進而達到表面融熔披覆之效果,實際應用在使工件材料表面上披覆有耐磨或抗蝕之金屬材料。然目前雷射披覆製程技術或雷射金屬熔覆製程技術中,會遭遇一些問題,像是因材料平面光滑而使金屬粉末不易附著,在進行熔覆製程時將造成粉末飛濺,無法提升粉末利用率(powder efficiency),另外,若執行曲面或傾斜表面加工時,因接觸面積過小,粉末也有不易附著之情況,亦使得粉末利用率偏低。 The laser coating process technology or the laser metal cladding process technology is applied to the surface of the workpiece material to provide metal powder by covering or dusting, and by the thermal effect of the laser light, the high temperature melting is caused to produce metallurgical changes, thereby achieving the surface. The effect of the melt coating is actually applied to the surface of the workpiece material coated with a metal material that is resistant to wear or corrosion. However, in the current laser coating process technology or laser metal cladding process technology, there are some problems, such as the metal material is not easy to adhere due to the smooth surface of the material, which will cause powder splash during the cladding process, and the powder cannot be lifted. Utilization (powder In addition, when the curved surface or the inclined surface is processed, the powder is also difficult to adhere due to the contact area being too small, and the powder utilization rate is also low.

儘管有人提出透過噴砂之處理方式在金屬表面產生不同程度的粗糙度,使雷射焊接之效率提高,但此將提升成本。又或者,有人提出使用分光後的雷射光或電弧使金屬表面達到不同範圍的溫度後,之後以雷射銲接加工將產生不同的加工效率,然此方法為規範加溫範圍,將導致額外能耗。又或者,有人提出建置一個雷射加工密閉空間,並降低空間內的大氣壓力,再進行雷射加工以提升加工效率,然此方法亦將提高成本。 Although it has been proposed to produce different degrees of roughness on the metal surface by means of sand blasting, the efficiency of laser welding is improved, but this will increase the cost. Or, it has been proposed that after the laser light or arc of the split light is used to bring the metal surface to a different temperature range, the laser processing will produce different processing efficiencies, but the method is to regulate the heating range, which will lead to additional energy consumption. . Or, it has been proposed to build a laser processing confined space, and reduce the atmospheric pressure in the space, and then laser processing to improve processing efficiency, but this method will also increase the cost.

由上可知,現行雷射披覆製程或雷射金屬熔覆製程存在有粉末利用率偏低的缺陷,且目前已知解決方案都導致成本提升,若能找出一種可提升粉末利用率之方法,特別是,可沿用既有設備而無須增設其他設備,致使成本無額外增加,實為目前本技術領域人員急迫解決之技術問題。 It can be seen from the above that the current laser coating process or the laser metal cladding process has the defect of low powder utilization rate, and the known solutions all lead to cost increase, and if a method for improving the utilization rate of the powder can be found In particular, the existing equipment can be used without additional equipment, so that the cost is not increased, which is a technical problem that is urgently solved by those skilled in the art.

本揭露係提出一種增加粉末利用率之雷射光束輔助照射系統,設置於雷射加工機台內,提供加工件於雷射熔覆前之預處理,該增加粉末利用率之雷射光束輔助照射系統包含接收模組、處理模組以及控制模組。該接收模組係接收外部輸入之預掃設定,該處理模組係由該預掃設定產生該加工件之預加工參數以及該雷射加工機台所發射之雷射光束的輸出參數,該控制模組係依據該輸出參數調整該 雷射光束之輸出,以及依據該預加工參數控制該雷射光束之移動,以執行該加工件於該雷射熔覆前之預處理,使該加工件之表面產生熔池或令該加工件之表面粗糙度產生變化。 The present disclosure proposes a laser beam assisted illumination system for increasing powder utilization, which is disposed in a laser processing machine to provide pretreatment of the workpiece before laser cladding, and the laser beam assisted illumination for increasing powder utilization. The system includes a receiving module, a processing module, and a control module. The receiving module receives the pre-sweep setting of the external input, and the processing module generates the pre-processing parameters of the workpiece and the output parameters of the laser beam emitted by the laser processing machine by the pre-sweep setting, the control mode The group adjusts the output parameter according to the output parameter Output of the laser beam, and controlling the movement of the laser beam according to the pre-processing parameter to perform pre-treatment of the workpiece before the laser cladding, so that the surface of the workpiece is molten or the workpiece is processed The surface roughness changes.

本揭露另提出一種增加粉末利用率之雷射光束輔助照射方法,用於提供加工件於雷射熔覆前之預處理,該方法包括:接收外部輸入之預掃設定;由該預掃設定產生該加工件之預加工參數以及雷射加工機台所發射之雷射光束的輸出參數;依據該輸出參數調整該雷射光束之輸出;以及依據該預加工參數控制該雷射光束之移動,以令該加工件之表面產生熔池或令該加工件之表面粗糙度產生變化。 The present disclosure further provides a laser beam assisted illumination method for increasing powder utilization for providing pretreatment of a workpiece prior to laser cladding, the method comprising: receiving a pre-sweep setting of an external input; generating from the pre-sweep setting a pre-processing parameter of the workpiece and an output parameter of the laser beam emitted by the laser processing machine; adjusting an output of the laser beam according to the output parameter; and controlling movement of the laser beam according to the pre-processing parameter The surface of the workpiece produces a molten pool or changes in the surface roughness of the workpiece.

相較於習知技術,本揭露所提出之增加粉末利用率之雷射光束輔助照射系統及其方法,利用雷射光束輔助照射加工件,控制雷射光束之能量參數及路徑位置,在加工件表面產生熔池或粗糙度變化之下,藉以達成加工件表面粉末附著率之改變,使得雷射熔覆加工時的粉末利用率提升,特別的是,因噴粉熔覆製程中粉末不易被回收再利用,故僅能提高粉末利用率才能解決材料浪費的問題,本揭露藉由改變加工件表面特性與粗糙度,增加粉末與加工件表面之接觸面積,或是增加粉末在加工件表面之停留時間,此將有助於提升粉末利用率,進而達到降低製造成本之功效。 Compared with the prior art, the laser beam assisted illumination system and method for increasing powder utilization proposed by the present disclosure use a laser beam to assist the illumination of the workpiece, and control the energy parameters and path position of the laser beam in the workpiece. The surface is caused by the molten pool or the roughness change, so as to achieve the change of the powder adhesion rate on the surface of the workpiece, so that the powder utilization rate during the laser cladding processing is improved, in particular, the powder is not easily recovered in the powder coating process. Reuse, so only the powder utilization rate can be improved to solve the problem of material waste. The present disclosure increases the contact area between the powder and the surface of the workpiece by changing the surface characteristics and roughness of the workpiece, or increases the retention of the powder on the surface of the workpiece. Time, this will help to improve the utilization of the powder, thereby reducing the cost of manufacturing.

1‧‧‧雷射光束輔助照射系統 1‧‧‧Laser beam assisted illumination system

11‧‧‧接收模組 11‧‧‧ receiving module

12‧‧‧處理模組 12‧‧‧Processing module

13‧‧‧控制模組 13‧‧‧Control Module

200‧‧‧預掃設定 200‧‧‧Pre-sweep settings

31‧‧‧原加工範圍 31‧‧‧Original processing range

32、33‧‧‧預掃範圍 32, 33‧‧‧ Pre-sweep range

501、502、503‧‧‧圖片 501, 502, 503‧‧ pictures

504‧‧‧線 504‧‧‧ line

71‧‧‧加工頭 71‧‧‧Processing head

72‧‧‧噴嘴 72‧‧‧ nozzle

73‧‧‧加工區域 73‧‧‧Processing area

74‧‧‧路徑 74‧‧‧ Path

75‧‧‧雷射光束 75‧‧‧Laser beam

76‧‧‧金屬粉末 76‧‧‧Metal powder

77‧‧‧氣體 77‧‧‧ gas

S61~S64‧‧‧步驟 S61~S64‧‧‧Steps

第1圖係為本揭露之增加粉末利用率之雷射光束輔助 照射系統的示意圖;第2圖係為本揭露之加工件執行雷射光束輔助照射的示意圖;第3圖係為本揭露之加工件執行雷射光束輔助照射之預掃範圍的示意圖;第4A-4D圖係為本揭露之加工件執行雷射光束輔助照射之預掃路徑的示意圖;第5圖係為加工件於不同處理狀態下的差異圖;第6圖係為本揭露之增加粉末利用率之雷射光束輔助照射方法的步驟圖;以及第7圖係為本揭露之雷射加工機台的局部示意圖。 Figure 1 is a laser beam assisted by this method for increasing powder utilization. Schematic diagram of the illumination system; FIG. 2 is a schematic diagram of the laser beam assisted illumination of the workpiece of the present disclosure; FIG. 3 is a schematic diagram of the pre-sweep range of the laser beam assisted illumination of the workpiece of the disclosure; 4A- The 4D diagram is a schematic diagram of the pre-sweep path of the laser beam assisted illumination of the disclosed workpiece; the fifth diagram is the difference diagram of the workpiece under different treatment states; and the sixth diagram is the increased powder utilization rate of the disclosure. A step diagram of a laser beam assisted illumination method; and a seventh diagram is a partial schematic view of the laser processing machine of the present disclosure.

以下藉由特定的具體實施形態說明本揭露之技術內容,熟悉此技藝之人士可由本說明書所揭示之內容輕易地瞭解本揭露之優點與功效。然本揭露亦可藉由其他不同的具體實施形態加以施行或應用。 The technical contents of the present disclosure are described in the following specific embodiments, and those skilled in the art can easily understand the advantages and effects of the disclosure by the contents disclosed in the specification. However, the disclosure may also be implemented or applied by other different embodiments.

請參照第1圖,係為本揭露之增加粉末利用率之雷射光束輔助照射系統的示意圖。如圖所示,雷射光束輔助照射系統1可設置於雷射加工機台內,用以提供加工件於雷射熔覆前之預處理,其中,雷射光束輔助照射系統1包括接收模組11、處理模組12以及控制模組13。 Please refer to FIG. 1 , which is a schematic diagram of a laser beam assisted illumination system for increasing powder utilization according to the present disclosure. As shown, the laser beam assisted illumination system 1 can be disposed in a laser processing machine for providing pre-treatment of the workpiece prior to laser cladding, wherein the laser beam assisted illumination system 1 includes a receiving module. 11. The processing module 12 and the control module 13.

接收模組11係接收外部輸入之預掃設定200。首先,為了使雷射加工機台可執行加工件於雷射熔覆前之預處理,故須給予雷射光束輔助照射系統1有關預處理的設 定,用於控制該雷射加工機台如何執行加工件於雷射熔覆前之預處理。 The receiving module 11 receives the pre-sweep setting 200 of the external input. Firstly, in order to enable the laser processing machine to perform the pre-treatment of the workpiece before laser cladding, the laser beam-assisted illumination system 1 must be given the pre-treatment design. It is used to control how the laser processing machine performs pre-treatment of the workpiece before laser cladding.

處理模組12係由該預掃設定200產生該加工件之預加工參數以及該雷射加工機台所發射之雷射光束的輸出參數。如前所述,須給予雷射光束輔助照射系統1有關預處理的設定,故處理模組12透過預掃設定200產生相關參數,包括對於加工件的預加工參數,例如雷射光束於加工件上的預掃範圍、預掃路徑或移動速度等,以及雷射加工機台於加工件上所發射之雷射光束的能量大小,例如雷射光束之光束直徑、聚焦位置或加工功率。 The processing module 12 generates pre-processing parameters of the workpiece and output parameters of the laser beam emitted by the laser processing machine by the pre-scan setting 200. As previously mentioned, the laser beam is required to assist the illumination system 1 with respect to the pre-processing settings, so that the processing module 12 generates the relevant parameters through the pre-scan setting 200, including pre-processing parameters for the workpiece, such as laser beam to the workpiece. The pre-sweep range, the pre-sweep path or the moving speed, and the energy of the laser beam emitted by the laser processing machine on the workpiece, such as the beam diameter, focus position or processing power of the laser beam.

控制模組13係依據該輸出參數調整該雷射光束之輸出,以及依據該預加工參數控制該雷射光束之移動,以執行該加工件於該雷射熔覆前之預處理,使該加工件之表面產生熔池或令該加工件之表面粗糙度產生變化,其中,輸出參數用來調整雷射光束之輸出,包括雷射光束其預掃範圍,雷射光束要執行之預掃路徑,以及雷射光束移動時之移動速度。另外,預加工參數用來控制雷射光束之移動,包括雷射光束的光束直徑、聚焦位置或加工功率。 The control module 13 adjusts the output of the laser beam according to the output parameter, and controls the movement of the laser beam according to the pre-processing parameter to perform pre-processing of the workpiece before the laser cladding, so that the processing The surface of the piece produces a molten pool or changes the surface roughness of the workpiece, wherein the output parameter is used to adjust the output of the laser beam, including the pre-sweep range of the laser beam, and the pre-sweep path to be performed by the laser beam. And the speed at which the laser beam moves. In addition, pre-processing parameters are used to control the movement of the laser beam, including the beam diameter, focus position or processing power of the laser beam.

藉此透過將雷射光束發射至加工件上所選擇區域範圍,以執行加工件於雷射熔覆前之預處理,其目的是使加工件之表面產生熔池,或者是令加工件之表面粗糙度產生變化。據此,在加工件之表面產生熔池,可有助於金屬粉末附著其上,另外,透過增加粗糙度,以使雷射熔覆所噴灑之金屬粉末更易附著於加工件之表面上。 Thereby, the laser beam is emitted to the selected area on the workpiece to perform the pre-treatment of the workpiece before the laser cladding, the purpose of which is to create a molten pool on the surface of the workpiece, or to make the surface of the workpiece The roughness changes. Accordingly, the formation of a molten pool on the surface of the workpiece can contribute to the adhesion of the metal powder, and further, by increasing the roughness, the metal powder sprayed by the laser cladding can be more easily attached to the surface of the workpiece.

前述輸出參數可包括雷射光束之光束直徑、聚焦位置或加工功率。於具體實施時,雷射光束之能量變化範圍可為原加工能量的50~150%,雷射光束之光束直徑可為0.5~3毫米(mm),而雷射光束之聚焦位置可為加工件之表面+/-10mm範圍內,即表面上或下10mm的範圍內。 The aforementioned output parameters may include the beam diameter, focus position or processing power of the laser beam. In the specific implementation, the energy range of the laser beam can be 50~150% of the original processing energy, the beam diameter of the laser beam can be 0.5~3 mm (mm), and the focus position of the laser beam can be the workpiece The surface is in the range of +/- 10 mm, that is, in the range of 10 mm above or below the surface.

前述預加工參數包括雷射光束之預掃範圍、預掃路徑或移動速度。於具體實施時,雷射光束之預掃範圍為原加工範圍的+/-1~5mm以內,雷射光束之移動速度可為5~100mm/秒,雷射光束之預掃路徑可為單向、雙向、回字型、Z字型路徑並搭配0~360度的旋轉角度。 The aforementioned pre-processing parameters include a pre-scan range of the laser beam, a pre-sweep path or a moving speed. In the specific implementation, the pre-scan range of the laser beam is within +/-1~5mm of the original processing range, the moving speed of the laser beam can be 5~100mm/sec, and the pre-sweep path of the laser beam can be one-way. , two-way, return type, z-shaped path with 0 to 360 degrees of rotation.

請參照第2圖,係為本揭露之加工件執行雷射光束輔助照射的示意圖。如圖所示,加工件表面可為任何自由曲面,在未執行任何預處理情況下,原表面為平滑表面,此時若直接執行雷射熔覆,則噴灑於表面上的金屬粉末容易飛濺或附著不易,對此,本揭露提出對雷射熔覆的加工區域進行預處理。 Please refer to FIG. 2, which is a schematic diagram of performing laser beam assisted illumination on the workpiece of the present disclosure. As shown in the figure, the surface of the workpiece can be any free surface. If no pretreatment is performed, the original surface is a smooth surface. If laser cladding is directly performed, the metal powder sprayed on the surface is easy to splash or The adhesion is not easy, and the present disclosure proposes to pretreat the processing area of the laser cladding.

首先,決定出之後雷射熔覆的加工區域,並於該加工區域上執行雷射光束輔助照射之預處理,則預掃後加工件之表面將變得粗糙或產生熔池,其中,熔池是指加工件母材部分因焊熱而熔化成池狀。經過預處理,金屬粉末附著性提高,若此情況下執行雷射金屬熔覆製程,則金屬粉末的使用率將有所提升。 First, after determining the processing area of the laser cladding after the laser processing, and performing the pretreatment of the laser beam assisted illumination on the processing area, the surface of the workpiece after the pre-sweeping will become rough or create a molten pool, wherein the molten pool It means that the base material of the workpiece is melted into a pool shape due to the heat of welding. After pretreatment, the adhesion of the metal powder is improved, and if the laser metal cladding process is performed in this case, the utilization rate of the metal powder will be improved.

請參照第3圖,係為本揭露之加工件執行雷射光束輔助照射之預掃範圍的示意圖。基於雷射光束之預掃範圍為 原加工範圍的+/-1~5mm,如圖所示,原加工範圍31即為執行雷射金屬熔覆製程的加工區域,此時雷射光束之預掃範圍則為原加工範圍31的邊界加/減1~5mm,如圖中較小的預掃範圍32或較大的預掃範圍33所示。 Please refer to FIG. 3, which is a schematic diagram of the pre-sweep range of the laser beam assisted illumination performed on the workpiece of the present disclosure. The pre-scan range based on the laser beam is The original processing range is +/-1~5mm. As shown in the figure, the original processing range 31 is the processing area for performing the laser metal cladding process. At this time, the pre-scan range of the laser beam is the boundary of the original processing range 31. Add/subtract 1~5mm, as shown in the smaller pre-scan range 32 or the larger pre-scan range 33.

本揭露提出可依據需求設定出預掃範圍,相較於現有對整個加工件執行加熱而須較多能耗,本揭露僅對原加工區域或加工區域略大或略小之特定範圍內執行預處理,故可降低預處理程序之能耗。 The disclosure proposes that the pre-sweep range can be set according to requirements, and the energy consumption is required to perform heating on the entire workpiece, and the disclosure only performs the pre-preparation within a specific range of the original processing area or the processing area slightly larger or slightly smaller. Processing can reduce the energy consumption of the pre-processing program.

請參照第4A-4D圖,係為本揭露之加工件執行雷射光束輔助照射之預掃路徑的示意圖。如圖所示,各圖式係顯示不同方式之預掃路徑,第4A圖為單向預掃路徑,第4B圖為雙向預掃路徑,第4C圖為回字型預掃路徑,第4D圖為Z字型預掃路徑。不同方式之預掃路徑可搭配0~360度的旋轉角度。 Please refer to FIG. 4A-4D for a schematic diagram of a pre-sweep path for performing laser beam-assisted illumination for the workpiece of the present disclosure. As shown in the figure, each pattern shows different pre-sweep paths, Figure 4A is a unidirectional pre-sweep path, Figure 4B is a bi-directional pre-sweep path, and Figure 4C is a retro-type pre-sweep path, Figure 4D Pre-sweep the path for the zigzag. Different ways of pre-sweeping paths can be combined with a rotation angle of 0 to 360 degrees.

由上可知,本揭露之雷射光束之預掃路徑,亦可依據執行上需求而有不同選擇,藉以控制雷射光束以不同類型掃描路徑來執行雷射光束輔助照射,故在預掃設定中將包含預掃路徑之設定。 It can be seen from the above that the pre-sweep path of the laser beam of the present disclosure can also be selected according to the requirements of execution, so as to control the laser beam to perform laser beam-assisted illumination with different types of scanning paths, so in the pre-sweep setting The settings for the pre-sweep path will be included.

請參照第5圖,係為加工件於不同處理狀態下的差異圖。圖片501為未執行預處理的原材料表面,圖片502為現有透過噴砂之預處理的材料表面,圖片503則為執行本揭露之預處理的原材料表面。如圖所示,本揭露經雷射預掃後,加工件表面有較大熔池範圍,熔覆強度也較強,如該圖內的線504下方所示,經雷射預掃後之熔池範圍顯大 於未執行預處理或經噴砂預處理之熔池範圍。 Please refer to Figure 5 for the difference diagram of the workpiece in different processing states. Picture 501 is the surface of the raw material that has not been pretreated, picture 502 is the surface of the material that has been pretreated by sand blasting, and picture 503 is the surface of the raw material that performs the pretreatment of the present disclosure. As shown in the figure, after the laser pre-sweeping, the surface of the workpiece has a large molten pool range, and the cladding strength is also strong, as shown by the line 504 in the figure, after the laser is pre-swept. Large pool range In the range of molten pools where pretreatment or sandblasting pretreatment is not performed.

由上可知,本揭露係使用雷射光束進行預加工路徑預掃描,透過調整雷射光束之功率、聚焦位置、加工速度、加工路徑等機制,藉此調整加工件之材料表面特徵,即產生熔池或粗糙度改變。特別的是,雷射預掃僅針對預加工範圍進行,如此可精準進行輔助加工,並不會影響非加工區。因此,本揭露由雷射輔助照射,以於雷射熔覆製程時達成粉末利用率之提升,故可減少材料噴濺導致浪費之問題。 It can be seen from the above that the present invention uses a laser beam to perform pre-scanning of the pre-processing path, and adjusts the power of the laser beam, the focus position, the processing speed, the processing path and the like, thereby adjusting the surface characteristics of the workpiece, that is, melting. The pool or roughness changes. In particular, the laser pre-scan is only for the pre-machining range, so that the auxiliary machining can be performed accurately without affecting the non-machining zone. Therefore, the present disclosure is assisted by laser irradiation to achieve an increase in powder utilization rate during the laser cladding process, thereby reducing the problem of waste caused by material splashing.

請參考第6圖,係說明本揭露之增加粉末利用率之雷射光束輔助照射方法的步驟圖。具體來說,增加粉末利用率之雷射光束輔助照射方法可用於提供加工件於雷射熔覆前之預處理,詳細步驟如下所述。 Please refer to FIG. 6 for a step-by-step diagram of the laser beam assisted illumination method for increasing powder utilization of the present disclosure. In particular, a laser beam assisted illumination method that increases powder utilization can be used to provide pretreatment of the workpiece prior to laser cladding, the detailed steps being as follows.

於步驟S61中,係接收外部輸入之預掃設定。具體實施時,可依據需求,在執行雷射熔覆製程之前,於加工件之加工區域上進行預處理,故先須給定執行預處理之預掃設定,亦即有關雷射光束及加工區域之大小或範圍等設定值。 In step S61, the pre-sweep setting of the external input is received. In the specific implementation, according to the requirements, before the laser cladding process is performed, the pretreatment is performed on the processing area of the workpiece, so the pre-sweep setting for performing the pre-processing, that is, the relevant laser beam and the processing region, must be given first. Set values such as size or range.

於步驟S62中,係由該預掃設定產生加工件之預加工參數以及雷射加工機台所發射之雷射光束的輸出參數。詳言之,可對預掃設定進行解析,以得到有關加工件之預加工參數,以及有關雷射光束的輸出參數,其中,該輸出參數可包括雷射光束之光束直徑、聚焦位置或加工功率,而該預加工參數包括雷射光束之預掃範圍、預掃路徑或移動 速度。 In step S62, the pre-processing parameters of the workpiece and the output parameters of the laser beam emitted by the laser processing machine are generated by the pre-scan setting. In particular, the pre-sweep settings can be analyzed to obtain pre-machined parameters for the workpiece and the output parameters of the laser beam, wherein the output parameters can include the beam diameter, focus position or machining power of the laser beam. And the pre-processing parameters include a pre-sweep range of the laser beam, a pre-sweep path or a movement speed.

於步驟S63中,係依據該輸出參數調整該雷射光束之輸出。本步驟係依據輸出參數調整雷射光束之輸出,亦即調整雷射光束使其符合執行預處理之情況,包括雷射光束的光束直徑、雷射光束的聚焦位置以及雷射光束的加工功率等。 In step S63, the output of the laser beam is adjusted according to the output parameter. In this step, the output of the laser beam is adjusted according to the output parameter, that is, the laser beam is adjusted to meet the pre-processing conditions, including the beam diameter of the laser beam, the focus position of the laser beam, and the processing power of the laser beam. .

舉例來說,該雷射光束之加工功率可為原加工能量之50~150%,該雷射光束之聚焦位置可為該加工件之表面上或下10mm範圍內。 For example, the processing power of the laser beam may be 50 to 150% of the original processing energy, and the focusing position of the laser beam may be within 10 mm of the surface of the workpiece.

於步驟S64中,係依據該預加工參數控制該雷射光束之移動,以令該加工件之表面產生熔池或令該加工件之表面粗糙度產生變化。具體來說,本步驟係依據預加工參數控制雷射光束之移動,亦即控制雷射光束的移動方向、範圍等,使雷射光束輔助照射可符合預處理之需求,其包括雷射光束的預掃範圍、雷射光束的預掃路徑以及雷射光束的移動速度。 In step S64, the movement of the laser beam is controlled according to the pre-processing parameter to cause a molten pool on the surface of the workpiece or to change a surface roughness of the workpiece. Specifically, this step controls the movement of the laser beam according to the pre-processing parameters, that is, controls the moving direction and range of the laser beam, so that the laser beam assisted illumination can meet the requirements of the pre-processing, including the laser beam. Pre-sweep range, pre-sweep path of the laser beam, and moving speed of the laser beam.

舉例來說,該雷射光束之預掃範圍為該加工件之原加工範圍加/減1~5mm,該雷射光束之預掃路徑為單向、雙向、回字型、Z字型路徑並配合0~360度之角度旋轉。 For example, the pre-scan range of the laser beam is plus/minus 1~5 mm of the original processing range of the workpiece, and the pre-sweep path of the laser beam is a one-way, two-way, back-shaped, z-shaped path and Rotate at an angle of 0 to 360 degrees.

另外,該雷射加工機台可透過雷射熔覆頭提供該雷射光束,而該雷射熔覆頭更於該加工件執行該雷射熔覆時提供金屬粉末及/或所須氣體。 In addition, the laser processing machine can provide the laser beam through a laser cladding head, and the laser cladding head provides metal powder and/or a required gas when the workpiece is subjected to the laser cladding.

本揭露提出雷射光束預掃機制,使得加工件之材料表面產生熔池或改變表面粗糙度,進而提升粉末利用率,其 中,透過設定使雷射光束進行預加工路徑的預掃加工,並非任意範圍的改變表面形貌,可降低不必要的能耗,故不僅可提升粉末利用率,更可以精確方式完成預處理程序。 The present disclosure proposes a laser beam pre-sweeping mechanism to cause a molten pool or a surface roughness to be changed on the surface of the workpiece, thereby improving powder utilization. In the pre-sweeping process of setting the laser beam to the pre-machining path, the surface topography is not changed in any range, and the unnecessary energy consumption can be reduced, so that the powder utilization rate can be improved, and the pre-processing procedure can be completed in an accurate manner. .

經實驗可得到,在雷射光束之傾斜角度為30度、移動速度為5mm/s、雷射光束之披覆功率為1600W、粉盤轉速為2RPM、負載氣體(Carry gas)為4SLM、保護氣體(Shielding gas)為10SLM等條件下執行雷射熔覆製程,本揭露經預處理將有助於提升粉末利用率。 It can be obtained experimentally that the tilt angle of the laser beam is 30 degrees, the moving speed is 5 mm/s, the laser beam is 1600 W, the powder disk speed is 2 RPM, the load gas is 4 SLM, and the shielding gas is (Shielding gas) Performs a laser cladding process under conditions such as 10SLM. The pretreatment will help to improve the powder utilization rate.

如下面表一所示,係表示在未預處理、不同情況預處理下的粉末披覆情況,其中,A表示一般情況直接披覆,B表示表面噴砂後直接披覆,C表示預掃1600W後以1600W披覆,D表示預掃1000W後以1600W披覆,E表示預掃2000W後以1600W披覆。 As shown in Table 1 below, it indicates the powder coating in the case of pre-treatment and pretreatment under different conditions. Among them, A indicates direct overcoating in general, B indicates direct mulching after surface blasting, and C indicates pre-sweeping after 1600W. Draped at 1600W, D means 1200W after pre-sweeping 1000W, and E means 1200W after pre-sweeping 2000W.

利用率可由下面算式求得:利用率=披覆量/噴粉量= 重量差/(重量差+周遭粉末)。 The utilization rate can be obtained by the following formula: utilization rate = drape amount / dusting amount = Weight difference / (weight difference + surrounding powder).

由表一可知,經預掃後再執行雷射熔覆製程(C、D和E)等方案,所得到之粉末利用率顯優於未預處理或噴砂預處理等方案所得到者。 It can be seen from Table 1 that after the pre-sweeping and then performing the laser cladding process (C, D and E), the obtained powder utilization rate is better than that obtained by the unpretreatment or sandblasting pretreatment.

另外,在某一個熔池溫度/雷射功率/焊點直徑等特殊雷射參數下,可產生特別粗糙的表面。下面表二則列出不同雷射功率下、不同量測點、多次量測所得到粗糙度的情況。 In addition, a special rough surface can be produced under special laser parameters such as bath temperature/laser power/weld diameter. Table 2 below lists the roughness obtained under different laser powers, different measurement points, and multiple measurements.

其中,雷射光束之傾斜角度為0度、移動速度為10mm/s、加工功率分別為1.5KW/2KW/2.5KW/3KW、以及原材料的粗糙度Ra趨近於1(Ra1)等條件下執行雷射熔覆製程,可得本揭露經預處理有助於改變粗糙度。 Among them, the tilt angle of the laser beam is 0 degree, the moving speed is 10 mm/s, the processing power is 1.5KW/2KW/2.5KW/3KW, respectively, and the roughness Ra of the raw material approaches 1 (Ra) 1) Performing a laser cladding process under the same conditions, it can be obtained that the pretreatment helps to change the roughness.

由表二可知,經預掃後再執行雷射熔覆製程,在不同加工功率(1.5KW/2KW/2.5KW/3KW)下,預掃後的表面粗糙度是大於未有預處理的表面粗糙度。 It can be seen from Table 2 that the laser cladding process is performed after pre-sweeping. Under different processing powers (1.5KW/2KW/2.5KW/3KW), the surface roughness after pre-sweeping is greater than the surface roughness without pretreatment. degree.

本揭露還提出一種雷射加工機台,其具有提供雷射光束之雷射熔覆頭,且雷射加工機台內建前述之雷射光束輔助照射系統,藉此執行加工件於雷射熔覆前之預處理,包括接收外部輸入之預掃設定,由該預掃設定產生該加工件之預加工參數以及該雷射光束的輸出參數,依據該預加工參數控制該雷射熔覆頭之移動以及依據該輸出參數調整該雷射光束之輸出,以執行該加工件於該雷射熔覆前之預處理,使該加工件之表面產生熔池或令該加工件之表面粗糙度產生變化。 The disclosure also proposes a laser processing machine having a laser cladding head for providing a laser beam, and the laser processing machine is provided with the aforementioned laser beam auxiliary illumination system, thereby performing processing of the laser beam Pre-pretreatment, including receiving a pre-sweep setting of an external input, the pre-machining parameter of the workpiece and the output parameter of the laser beam are generated by the pre-sweep setting, and the laser cladding head is controlled according to the pre-processing parameter Moving and adjusting the output of the laser beam according to the output parameter to perform pre-treatment of the workpiece before the laser cladding, causing a molten pool on the surface of the workpiece or changing the surface roughness of the workpiece .

前述之雷射熔覆頭更於該加工件執行該雷射熔覆時提供金屬粉末,又或者可透過雷射熔覆頭提供雷射熔覆時所須氣體,例如保護氣體及/或負載氣體。 The foregoing laser cladding head provides metal powder when the workpiece is subjected to the laser cladding, or can provide a gas required for laser cladding, such as a shielding gas and/or a load gas, through a laser cladding head. .

請參考第7圖,係說明本揭露之雷射加工機台的局部示意圖。具體來說,於此所述之雷射加工機台,主要整合雷射光源、送粉機、同軸噴粉加工頭、控制軟體以及雷射複合控制器等元件,以建置出可執行雷射披覆製程或雷射金屬熔覆製程之雷射加工機台。由於本揭露技術重點在於雷射熔覆製程之前的預處理,故圖式中僅繪示與本揭露相關之結構。 Please refer to FIG. 7 for a partial schematic view of the laser processing machine of the present disclosure. Specifically, the laser processing machine described herein mainly integrates a laser light source, a powder feeding machine, a coaxial powder processing head, a control software body, and a laser composite controller to construct an executable laser. Laser processing machine for coating process or laser metal cladding process. Since the present disclosure focuses on the pre-treatment before the laser cladding process, only the structure related to the present disclosure is shown in the drawings.

如圖所示,雷射光束75可經由加工頭71射向加工件,加工頭71前端連接噴嘴72。在進行預處理時,可由加工件選出加工區域73作為預處理範圍,其中,可選定路徑74使得雷射光束75沿著該路徑74對加工件執行雷射光束輔助照射,令加工件之表面產生熔池或使其粗糙度產生變化。 As shown, the laser beam 75 can be directed toward the workpiece via the processing head 71, and the front end of the processing head 71 is coupled to the nozzle 72. When pre-processing is performed, the processing region 73 can be selected as a pre-processing range by the workpiece, wherein the path 74 can be selected such that the laser beam 75 performs laser beam-assisted illumination on the workpiece along the path 74 to produce a surface of the workpiece. The bath or its roughness changes.

之後,在執行雷射熔覆製程時,雷射熔覆頭包括加工頭71和噴嘴72,除了雷射光束75經加工頭71由噴嘴72射出外,金屬粉末76以及熔覆所須氣體77,都可經由噴嘴72噴出,此為雷射熔覆製程相關技術,故不再贅述。由此可知,本揭露所提出之預處理,可使用既有設備來執行,無須新增其他設備,故可在無過多額外成本增加下,同時達到粉末利用率的提升。 Thereafter, when performing the laser cladding process, the laser cladding head includes a processing head 71 and a nozzle 72, except that the laser beam 75 is ejected from the nozzle 72 through the processing head 71, the metal powder 76 and the gas 77 required for cladding. Both can be ejected through the nozzle 72, which is a laser cladding process related technology, and therefore will not be described again. It can be seen that the pre-processing proposed by the present disclosure can be performed by using existing equipment without adding other equipment, so that the powder utilization rate can be improved without excessive additional cost.

綜上所述,本揭露之增加粉末利用率之雷射光束輔助照射系統及其方法,使用雷射光束預掃以產生加工件材料表面之熔池或改變表面粗糙度,不影響非加工區域的表面品質,故優於不易控制範圍的噴砂製程,另外,本揭露使用雷射光束預掃可有效控制材料表面的熔池或改變表面粗糙之程度,因而亦優於不易控制粗糙度的人工噴砂製程。 In summary, the laser beam assisted illumination system and method for increasing powder utilization of the present disclosure use a laser beam pre-sweep to generate a molten pool on the surface of the workpiece material or change the surface roughness without affecting the non-processed area. The surface quality is better than the sandblasting process which is difficult to control. In addition, the use of the laser beam pre-sweep can effectively control the molten pool on the surface of the material or change the degree of surface roughness, and thus is superior to the artificial sandblasting process which is difficult to control the roughness. .

上述實施形態僅例示性說明本揭露之原理及其功效,而非用於限制本揭露。任何熟習此項技藝之人士均可在不違背本揭露之精神及範疇下,對上述實施形態進行修飾與改變。因此,本揭露之權利保護範圍,應如後述之申請專利範圍所列。 The above embodiments are merely illustrative of the principles of the disclosure and its functions, and are not intended to limit the disclosure. Any person skilled in the art can modify and change the above embodiments without departing from the spirit and scope of the disclosure. Therefore, the scope of protection of the present disclosure should be as set forth in the scope of the patent application described later.

S61~S64‧‧‧步驟 S61~S64‧‧‧Steps

Claims (24)

一種增加粉末利用率之雷射光束輔助照射系統,包含:接收模組,係接收外部輸入之預掃設定;處理模組,係由該預掃設定產生加工件之預加工參數以及雷射加工機台所發射之雷射光束的輸出參數;以及控制模組,係依據該輸出參數調整該雷射光束之輸出,以及依據該預加工參數控制該雷射光束之移動,以執行該加工件於雷射熔覆前之預處理,俾於該加工件之表面產生熔池或令該加工件之表面粗糙度產生變化。 A laser beam assisted illumination system for increasing powder utilization, comprising: a receiving module for receiving a pre-sweep setting of an external input; and a processing module for generating pre-processing parameters of the workpiece and the laser processing machine by the pre-sweep setting The output parameter of the laser beam emitted by the station; and the control module, the output of the laser beam is adjusted according to the output parameter, and the movement of the laser beam is controlled according to the pre-processing parameter to execute the workpiece on the laser The pre-crushing pretreatment produces a molten pool on the surface of the workpiece or changes the surface roughness of the workpiece. 如申請專利範圍第1項所述增加粉末利用率之雷射光束輔助照射系統,其中,該輸出參數包括該雷射光束之光束直徑、聚焦位置或加工功率。 A laser beam assisted illumination system for increasing powder utilization as described in claim 1 wherein the output parameter comprises a beam diameter, a focus position or a processing power of the laser beam. 如申請專利範圍第2項所述增加粉末利用率之雷射光束輔助照射系統,其中,該雷射光束之加工功率為原加工能量之50~150%。 A laser beam assisted illumination system that increases powder utilization as described in claim 2, wherein the processing power of the laser beam is 50 to 150% of the original processing energy. 如申請專利範圍第2項所述增加粉末利用率之雷射光束輔助照射系統,其中,該雷射光束之聚焦位置為該加工件之表面上或下10mm範圍內。 A laser beam assisted illumination system that increases powder utilization as described in claim 2, wherein the laser beam has a focus position within 10 mm above or below the surface of the workpiece. 如申請專利範圍第2項所述增加粉末利用率之雷射光束輔助照射系統,其中,該雷射光束之光束直徑為0.5~3mm。 A laser beam assisted illumination system that increases powder utilization as described in claim 2, wherein the laser beam has a beam diameter of 0.5 to 3 mm. 如申請專利範圍第1項所述增加粉末利用率之雷射光束輔助照射系統,其中,該預加工參數包括該雷射光束之預掃範圍、預掃路徑或移動速度。 A laser beam assisted illumination system for increasing powder utilization as described in claim 1 wherein the pre-processing parameter comprises a pre-sweep range, a pre-sweep path or a moving speed of the laser beam. 如申請專利範圍第6項所述增加粉末利用率之雷射光束輔助照射系統,其中,該雷射光束之預掃範圍為該加工件之原加工範圍加/減1~5mm。 The laser beam assisted illumination system for increasing the powder utilization rate as described in claim 6 of the patent application, wherein the pre-scan range of the laser beam is plus/minus 1~5 mm of the original processing range of the workpiece. 如申請專利範圍第6項所述增加粉末利用率之雷射光束輔助照射系統,其中,該雷射光束之預掃路徑為單向、雙向、回字型、Z字型路徑並配合0~360度之角度旋轉。 A laser beam assisted illumination system for increasing powder utilization as described in claim 6 of the patent application, wherein the pre-sweep path of the laser beam is a one-way, two-way, back-type, Z-shaped path with 0-360 The angle of rotation. 如申請專利範圍第6項所述增加粉末利用率之雷射光束輔助照射系統,其中,該雷射光束之移動速度為5~100mm/秒。 A laser beam assisted illumination system that increases powder utilization as described in claim 6 of the patent application, wherein the laser beam has a moving speed of 5 to 100 mm/sec. 如申請專利範圍第1項所述增加粉末利用率之雷射光束輔助照射系統,其中,該雷射加工機台更包括雷射熔覆頭,用於提供該雷射光束。 A laser beam assisted illumination system for increasing powder utilization as described in claim 1 wherein the laser processing machine further comprises a laser cladding head for providing the laser beam. 如申請專利範圍第10項所述增加粉末利用率之雷射光束輔助照射系統,其中,該雷射熔覆頭更於該加工件執行該雷射熔覆時提供金屬粉末。 A laser beam assisted illumination system for increasing powder utilization as described in claim 10, wherein the laser cladding head provides metal powder when the workpiece is subjected to the laser cladding. 如申請專利範圍第10項所述增加粉末利用率之雷射光束輔助照射系統,其中,該雷射熔覆頭更於該加工件執行該雷射熔覆時所須氣體。 A laser beam assisted illumination system for increasing powder utilization as described in claim 10, wherein the laser cladding head performs a gas required for the laser cladding to be performed on the workpiece. 一種增加粉末利用率之雷射光束輔助照射方法,用於提供加工件於雷射熔覆前之預處理,該方法包 括:接收外部輸入之預掃設定;由該預掃設定產生該加工件之預加工參數以及雷射加工機台所發射之雷射光束的輸出參數;依據該輸出參數調整該雷射光束之輸出;以及依據該預加工參數控制該雷射光束之移動,以令該加工件之表面產生熔池或令該加工件之表面粗糙度產生變化。 A laser beam assisted illumination method for increasing powder utilization for providing pretreatment of a workpiece prior to laser cladding, the method package Included: receiving a pre-sweep setting of the external input; generating, by the pre-sweep setting, a pre-processing parameter of the workpiece and an output parameter of the laser beam emitted by the laser processing machine; and adjusting an output of the laser beam according to the output parameter; And controlling the movement of the laser beam according to the pre-processing parameter to cause a molten pool on the surface of the workpiece or to change a surface roughness of the workpiece. 如申請專利範圍第13項所述之增加粉末利用率之雷射光束輔助照射方法,其中,該輸出參數包括該雷射光束之光束直徑、聚焦位置或加工功率。 A laser beam assisted illumination method for increasing powder utilization as described in claim 13 wherein the output parameter comprises a beam diameter, a focus position or a processing power of the laser beam. 如申請專利範圍第14項所述之增加粉末利用率之雷射光束輔助照射方法,其中,該雷射光束之加工功率為原加工能量之50~150%。 A laser beam assisted illumination method for increasing powder utilization rate as described in claim 14 wherein the processing power of the laser beam is 50 to 150% of the original processing energy. 如申請專利範圍第14項所述之增加粉末利用率之雷射光束輔助照射方法,其中,該雷射光束之聚焦位置為該加工件之表面上或下10mm範圍內。 A laser beam assisted illumination method for increasing powder utilization according to claim 14, wherein the laser beam has a focus position within 10 mm above or below the surface of the workpiece. 如申請專利範圍第14項所述之增加粉末利用率之雷射光束輔助照射方法,其中,該雷射光束之光束直徑為0.5~3mm。 A laser beam assisted illumination method for increasing powder utilization as described in claim 14 wherein the laser beam has a beam diameter of 0.5 to 3 mm. 如申請專利範圍第13項所述之增加粉末利用率之雷射光束輔助照射方法,其中,該預加工參數包括該雷射光束之預掃範圍、預掃路徑或移動速度。 A laser beam assisted illumination method for increasing powder utilization according to claim 13 wherein the pre-processing parameter comprises a pre-sweep range, a pre-sweep path or a moving speed of the laser beam. 如申請專利範圍第18項所述之增加粉末利用率之 雷射光束輔助照射方法,其中,該雷射光束之預掃範圍為該加工件之原加工範圍加/減1~5mm。 Increase the powder utilization rate as described in item 18 of the patent application scope The laser beam assisted illumination method, wherein the pre-scan range of the laser beam is plus/minus 1~5 mm of the original processing range of the workpiece. 如申請專利範圍第18項所述之增加粉末利用率之雷射光束輔助照射方法,其中,該雷射光束之預掃路徑為單向、雙向、回字型、Z字型路徑並配合0~360度之角度旋轉。 The laser beam assisted illumination method for increasing powder utilization rate as described in claim 18, wherein the pre-sweep path of the laser beam is a one-way, two-way, return type, zigzag path and cooperate with 0~ 360 degree angle rotation. 如申請專利範圍第18項所述之增加粉末利用率之雷射光束輔助照射方法,其中,該雷射光束之移動速度為5~100mm/秒。 A laser beam assisted illumination method for increasing powder utilization rate as described in claim 18, wherein the laser beam has a moving speed of 5 to 100 mm/sec. 如申請專利範圍第13項所述之增加粉末利用率之雷射光束輔助照射方法,其中,該雷射加工機台透過雷射熔覆頭提供該雷射光束。 A laser beam assisted illumination method for increasing powder utilization as described in claim 13 wherein the laser processing machine supplies the laser beam through a laser cladding head. 如申請專利範圍第22項所述之增加粉末利用率之雷射光束輔助照射方法,其中,該雷射熔覆頭更於該加工件執行該雷射熔覆時提供金屬粉末。 A laser beam assisted illumination method for increasing powder utilization as described in claim 22, wherein the laser cladding head provides metal powder when the workpiece is subjected to the laser cladding. 如申請專利範圍第22項所述之增加粉末利用率之雷射光束輔助照射方法,其中,該雷射熔覆頭更於該加工件執行該雷射熔覆時所須氣體。 A laser beam assisted illumination method for increasing powder utilization as described in claim 22, wherein the laser cladding head performs a gas required for the laser cladding to perform the laser cladding.
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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1991016146A1 (en) * 1990-04-12 1991-10-31 Messer Griesheim Gmbh Process for the thermal coating of surfaces with a fluoropolymer
CN101277769A (en) * 2005-07-20 2008-10-01 佛兰芒技术研究所有限公司 A method and apparatus for applying a coating on a substrate
TW201638685A (en) * 2015-04-28 2016-11-01 東台精機股份有限公司 Laser cladding head and sensing method thereof for processing surface

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1991016146A1 (en) * 1990-04-12 1991-10-31 Messer Griesheim Gmbh Process for the thermal coating of surfaces with a fluoropolymer
CN101277769A (en) * 2005-07-20 2008-10-01 佛兰芒技术研究所有限公司 A method and apparatus for applying a coating on a substrate
TW201638685A (en) * 2015-04-28 2016-11-01 東台精機股份有限公司 Laser cladding head and sensing method thereof for processing surface

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