TWI606745B - 用於製備透明磷光性陶瓷板的製程 - Google Patents
用於製備透明磷光性陶瓷板的製程 Download PDFInfo
- Publication number
- TWI606745B TWI606745B TW105138216A TW105138216A TWI606745B TW I606745 B TWI606745 B TW I606745B TW 105138216 A TW105138216 A TW 105138216A TW 105138216 A TW105138216 A TW 105138216A TW I606745 B TWI606745 B TW I606745B
- Authority
- TW
- Taiwan
- Prior art keywords
- phosphorescent
- ceramic plate
- yag phosphor
- present disclosure
- transparent ceramic
- Prior art date
Links
- 239000000919 ceramic Substances 0.000 title claims description 24
- 238000004519 manufacturing process Methods 0.000 title description 3
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 19
- 238000000034 method Methods 0.000 claims description 15
- 239000002245 particle Substances 0.000 claims description 12
- 238000000227 grinding Methods 0.000 claims description 9
- 238000005245 sintering Methods 0.000 claims description 4
- 238000000465 moulding Methods 0.000 claims description 3
- 238000001035 drying Methods 0.000 claims description 2
- 229910019655 synthetic inorganic crystalline material Inorganic materials 0.000 description 12
- 239000004065 semiconductor Substances 0.000 description 9
- 239000010410 layer Substances 0.000 description 6
- 230000003287 optical effect Effects 0.000 description 6
- 239000000843 powder Substances 0.000 description 6
- 238000009826 distribution Methods 0.000 description 5
- 238000002360 preparation method Methods 0.000 description 4
- 229910052684 Cerium Inorganic materials 0.000 description 3
- GWXLDORMOJMVQZ-UHFFFAOYSA-N cerium Chemical compound [Ce] GWXLDORMOJMVQZ-UHFFFAOYSA-N 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 239000012190 activator Substances 0.000 description 2
- 239000000969 carrier Substances 0.000 description 2
- 239000002243 precursor Substances 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 238000010532 solid phase synthesis reaction Methods 0.000 description 2
- 238000001228 spectrum Methods 0.000 description 2
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 239000004840 adhesive resin Substances 0.000 description 1
- 229920006223 adhesive resin Polymers 0.000 description 1
- JNDMLEXHDPKVFC-UHFFFAOYSA-N aluminum;oxygen(2-);yttrium(3+) Chemical compound [O-2].[O-2].[O-2].[Al+3].[Y+3] JNDMLEXHDPKVFC-UHFFFAOYSA-N 0.000 description 1
- 229910000420 cerium oxide Inorganic materials 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000012153 distilled water Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000002223 garnet Substances 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 238000004020 luminiscence type Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- BMMGVYCKOGBVEV-UHFFFAOYSA-N oxo(oxoceriooxy)cerium Chemical compound [Ce]=O.O=[Ce]=O BMMGVYCKOGBVEV-UHFFFAOYSA-N 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 238000007517 polishing process Methods 0.000 description 1
- 238000012216 screening Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 229910019901 yttrium aluminum garnet Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Luminescent Compositions (AREA)
- Led Device Packages (AREA)
- Compositions Of Oxide Ceramics (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020150191757A KR20170081042A (ko) | 2015-12-31 | 2015-12-31 | 형광체 투명 세라믹 플레이트의 제조방법 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201735726A TW201735726A (zh) | 2017-10-01 |
| TWI606745B true TWI606745B (zh) | 2017-11-21 |
Family
ID=59224881
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW105138216A TWI606745B (zh) | 2015-12-31 | 2016-11-22 | 用於製備透明磷光性陶瓷板的製程 |
Country Status (3)
| Country | Link |
|---|---|
| KR (1) | KR20170081042A (ko) |
| TW (1) | TWI606745B (ko) |
| WO (1) | WO2017116000A1 (ko) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102121249B1 (ko) * | 2018-07-04 | 2020-06-10 | 한국광기술원 | 형광체 플레이트 및 그의 제조방법 |
| KR102278026B1 (ko) * | 2019-11-18 | 2021-07-15 | 주식회사 에프씨씨 | 테이프 형태의 형광체 시트 제조방법 |
| CN112661512A (zh) * | 2020-12-23 | 2021-04-16 | 新沂市锡沂高新材料产业技术研究院有限公司 | 一种室温下荧光粉与氧化钇陶瓷致密化的方法 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4605829B2 (ja) * | 1998-05-25 | 2011-01-05 | 京セラ株式会社 | 高強度、高硬度アルミナセラミックス及びその製造方法 |
| JP2006315955A (ja) * | 2000-07-10 | 2006-11-24 | Toshiba Ceramics Co Ltd | セラミックス部材 |
| KR20080038179A (ko) * | 2005-08-31 | 2008-05-02 | 쿄세라 코포레이션 | 내식성 부재, 이것을 사용한 처리 장치 및 시료 처리 방법,그리고 내식성 부재의 제조 방법 |
| CN103890138B (zh) * | 2011-08-16 | 2016-06-22 | 日东电工株式会社 | 磷光化合物及其制备方法 |
| KR102255213B1 (ko) * | 2013-12-10 | 2021-05-24 | 삼성전자주식회사 | 형광체와 이를 포함하는 발광 소자 |
-
2015
- 2015-12-31 KR KR1020150191757A patent/KR20170081042A/ko active Search and Examination
-
2016
- 2016-11-10 WO PCT/KR2016/012929 patent/WO2017116000A1/ko active Application Filing
- 2016-11-22 TW TW105138216A patent/TWI606745B/zh active
Also Published As
| Publication number | Publication date |
|---|---|
| KR20170081042A (ko) | 2017-07-11 |
| WO2017116000A1 (ko) | 2017-07-06 |
| TW201735726A (zh) | 2017-10-01 |
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