TWI604248B - Display module and manufacturing method of the same - Google Patents

Description

Display module and method of manufacturing same

The invention relates to a display module and a manufacturing method thereof, and in particular to a display module and a manufacturing method thereof which are helpful for improving assembly precision.

In general, the assembly process of the display module includes placing the display panel into the frame. In order to ensure that the position of the display panel within the frame is precisely matched to the touch panel on the display panel, the display panel needs to be accurately positioned within the frame. When the display panel is to be placed in the frame, most of the assemblers need to use a suitable alignment fixture to position the display panel as far as possible within the frame, or at least to make the position of the display panel within the frame different from the expected position. Fall within reasonable tolerances.

However, if the display panel is placed in the frame every time, it is necessary to use the above-mentioned alignment fixture, which not only causes an increase in cost, but also consumes assembly time.

In view of the above, it is an object of the present invention to provide a display module and a method of fabricating the same that can omit the use of the alignment fixture and reduce assembly time.

In order to achieve the above object, in accordance with an embodiment of the present invention, the display module includes a frame and a display panel. The frame has a retaining wall. The retaining wall has a first inner side and a second inner side adjacent to each other. An internal angle is formed between the first inner side and the second inner side. The display panel is located in the frame and is surrounded by the retaining wall. The display panel has a first side and a second side adjacent to each other. A first end angle is formed between the first side and the second side. The first end angle and the inner angle abut each other, and the first side abuts against the first inner side and the second side abuts the second inner side. The display panel comprises an array substrate, at least one pixel circuit, at least one lead, a pair of substrates and a display medium between the opposite substrate and the array substrate. The array substrate has a first display area and a wiring area. The wiring area surrounds the first display area. The pixel circuit is located in the first display area. The lead is electrically connected to the pixel circuit, and the lead is at least partially located in the wiring area. The opposite substrate is disposed opposite to the array substrate, the opposite substrate has a surrounding area and a second display area, and the orthographic projection of the second display area overlaps the first display area and is surrounded by the surrounding area. In addition, the display panel further has a first wireless road area. The first wireless path region is substantially L-shaped, has no lead wires thereon, and the first wireless circuit region is adjacent to the wiring region of the array substrate or the surrounding region of the opposite substrate, and the first wireless circuit region is adjacent to the first display panel. Side and second side.

According to another embodiment of the present invention, a method of manufacturing a display module includes the following steps. Providing an array of substrate mother sheets and a pair of substrate mother sheets, the array substrate mother sheets comprising a plurality of array substrate regions, the opposite substrate master sheets comprising a plurality of opposite substrate regions, each array substrate region corresponding thereto At least one of the opposing substrate regions retains a substantially L-shaped shape at its edge position No line area, and the size of the wireless path area is determined according to a predetermined position in a frame in the array substrate area or the opposite substrate area; the group array substrate and the opposite substrate master To form a display mother board structure, wherein the array substrate areas respectively correspond to the opposite substrate areas to form a plurality of display panel areas; the display mother board structure is cut into a plurality of display panels, each display panel comprising an array substrate and a The opposite substrate, the display panel is composed of one of the display panel regions, and the wireless road region is adjacent to two adjacent sides of the display panel, and no line exists on the wireless road region; and a frame is combined with one of the display panels The first end angle formed between the two adjacent sides of the display panel and the inner corner of the frame abut each other, and the display area falls in a predetermined position in the frame by the presence of the wireless road area.

With the display module of the present embodiment, the assembler does not need to pass any alignment fixtures, and the display panel has the display area accurately positioned by directly facing the side of the wireless circuit region of the display panel directly against the corresponding inner side of the frame. The expected position within the frame to improve the assembly accuracy of the display panel assembly into the frame.

1~4, 31~33‧‧ steps

10‧‧‧ display module

20‧‧‧Display module

30‧‧‧Display module

40‧‧‧Display module

110‧‧‧Frame

111‧‧‧ inside

120‧‧‧ display panel

121‧‧‧ side

122‧‧‧Residual area

210‧‧‧Frame

220‧‧ ‧ retaining wall

221‧‧‧ first inside

222‧‧‧second inside

223‧‧‧ third inside

224‧‧‧ fourth inner side

225‧‧‧ bottom

226‧‧‧ inside corner

227‧‧‧ accommodating space

230‧‧‧ display panel

240‧‧‧Array substrate

241‧‧‧ positive

242‧‧‧Back

243‧‧‧ first side

244‧‧‧ second side

245‧‧‧ side edge

246‧‧‧Connected side

247‧‧‧First end angle

248‧‧‧Wiring area

248A‧‧‧Wiring area side

248B‧‧‧The other side of the wiring area

249‧‧‧First wireless road area

249A‧‧‧First section

249B‧‧‧Second section

250‧‧‧ opposite substrate

251‧‧‧ positive

252‧‧‧ back

253‧‧‧ first outer side

254‧‧‧ second outer side

255‧‧‧ side edge

256‧‧‧ side

257‧‧‧ Surrounding area

260‧‧‧ pixel circuit

270‧‧‧ lead

280‧‧‧Box glue

280A‧‧‧-lined dotted area

290‧‧‧Display media

310‧‧‧Frame

320‧‧‧Retaining wall

321‧‧‧ first inside

322‧‧‧second inside

323‧‧‧ third inside

324‧‧‧ fourth inner side

325‧‧‧ bottom

326‧‧‧ inside corner

330‧‧‧ display panel

340‧‧‧Array substrate

341‧‧‧ positive

342‧‧‧ back

343‧‧‧ first outer side

344‧‧‧ second outer side

345‧‧‧ side edge

346‧‧‧Connected side

348‧‧‧Wiring area

350‧‧‧ opposite substrate

351‧‧‧ positive

352‧‧‧ back

353‧‧‧ first side

354‧‧‧ second side

355‧‧‧lateral edge

356‧‧‧ side

357‧‧‧ Surrounding area

357A‧‧‧around area side

357B‧‧‧around the other side of the area

358‧‧‧First wireless road area

358A‧‧‧First section

358B‧‧‧Second section

359‧‧‧First end angle

360‧‧‧pixel circuit

370‧‧‧ lead

380‧‧‧Box glue

380A‧‧‧-lined dotted area

410‧‧‧Frame

420‧‧ ‧ retaining wall

421‧‧‧ first inside

422‧‧‧second inside

423‧‧‧ third inside

424‧‧‧ fourth inner side

425‧‧‧ bottom

426‧‧‧ inside corner

430‧‧‧ display panel

440‧‧‧Array substrate

441‧‧‧ positive

442‧‧‧ back

443‧‧‧ first side

444‧‧‧ second side

445‧‧‧lateral edge

446‧‧‧Connecting side

447‧‧‧Wiring area

447A‧‧‧Wiring area side

447B‧‧‧The other side of the wiring area

448‧‧‧First wireless road area

448A‧‧‧The first strip

448B‧‧‧Second section

449‧‧‧First end angle

450‧‧‧ opposite substrate

451‧‧‧ positive

452‧‧‧ back

453‧‧‧ third outer side

454‧‧‧ fourth outer side

455‧‧‧ side edge

456‧‧‧ side

457‧‧‧ Surrounding area

457A‧‧‧around area side

457B‧‧‧around the other side of the area

458‧‧‧Second wireless road area

458A‧‧‧First section

458B‧‧‧Second section

459‧‧‧second end angle

480‧‧‧Box glue

480A‧‧‧-lined dotted area

510‧‧‧Array substrate master

511‧‧‧Array substrate area

5111‧‧‧Array substrate

520‧‧‧ opposite substrate master

521‧‧‧ facing substrate area

5211‧‧‧ opposite substrate

530‧‧‧Wireless road area

540‧‧‧Box glue

600‧‧‧Display mother board structure

610‧‧‧ display panel area

611‧‧‧ display panel

612, 613‧‧‧ two adjacent sides

700‧‧‧Wiring board

Lines 3-3, 6-6, 9-9‧‧

AA‧‧‧ display area

AA1‧‧‧First display area

AA2‧‧‧Second display area

AL‧‧‧ long axis direction

AR1‧‧‧First air gap

AR2‧‧‧Second air gap

AR3, AR4‧‧‧ air gap

BL‧‧‧Long-axis direction

C1, C2‧‧‧ split direction

Cr‧‧‧ splinters

G‧‧‧ spacing

F‧‧‧Standing plane

D21~d24, d31~d34, d41~d42, d51~d52‧‧‧minimum straight line distance

W21~w22, w31~w32, w41~w42, w51~w52‧‧‧Minimum width

OLB‧‧‧outer pin junction

R‧‧‧ surplus material

T‧‧‧blackout tape

V1‧‧‧ first cut mark

V2‧‧‧Second cut marks

1 is a top view of a display module according to the present invention; FIG. 2 is a top view of the display module according to the first embodiment of the present invention; and FIG. 3 is a cross-sectional view 3-3 of FIG. Sectional view 4A is a top view of the array substrate of FIG. 2; FIG. 4B is a top view of the opposite substrate of FIG. 2; and FIG. 5 is a view of the display module according to the second embodiment of the present invention; Figure 6 is a cross-sectional view of the array substrate of Figure 5; Figure 7A is a top view of the array substrate of Figure 5; and Figure 7B is a top view of the opposite substrate of Figure 5; 8 is a top view of a display module according to a third embodiment of the present invention; FIG. 9 is a cross-sectional view along line 9-9 of FIG. 8; and FIG. 10A is a top view of the array substrate of FIG. 10B is a top view of the opposite substrate of FIG. 8; FIG. 11 is a flow chart showing a method of manufacturing the display module according to another embodiment of the present invention; and FIG. 12A is a step 1 of FIG. FIG. 12B is a schematic diagram showing the operation of step 2 of FIG. 11; FIG. 12C is a schematic diagram showing the operation of step 3 of FIG. 11; and FIG. 13A is a flowchart showing the detailed steps of step 3 of FIG. And FIG. 13B to FIG. 13D are diagrams showing the operation of FIG. 13A.

The embodiments of the present invention are disclosed in the following drawings, and the details of However, it should be understood that these practical details are not applied to limit the issue. Bright. That is, in some embodiments of the invention, these practical details are not necessary. In addition, some of the conventional structures and elements are shown in the drawings in a simplified schematic manner in order to simplify the drawings.

1 is a top view of a display module 10 in accordance with the present invention. In order to make the drawing easy to recognize, the bottom of the frame 110 is omitted in FIG. 1 , and only the retaining wall of the frame 110 is drawn. As shown in FIG. 1 , the display module 10 includes a frame 110 and a display panel 120 . The display panel 120 is located within the frame 110 and is surrounded by the frame 110. A side surface 121 of the display panel 120 defines a residual material region 122 inwardly, that is, the residual material region 122 abuts the side surface 121 of the display panel 120. The size of the remaining material region 122 is preset, and the predetermined position of the display panel 120 in the frame 110 depends, for example, on the spacing G between the display area AA of the display panel 120 and the inner side 111 of the frame 110.

As such, when the assembler places the display panel 120 in the frame 110, the assembler does not need to pass through any alignment fixtures, and only needs to have the side 121 of the display panel 120 having the residual material region 122 directly against the corresponding inner side 111 of the frame 110. The display area AA of the display panel 120 can be accurately positioned at the desired position within the frame 110.

Several modifications and manufacturing methods of the display module of the present invention are described below through several embodiments. However, the following are merely examples, and are not limited to all types and variations of the present invention.

First embodiment

2 is a top view of the display module 20 according to the first embodiment of the present invention. In order to make the drawing easy to recognize, the bottom 225 of the frame 210 is omitted in FIG. 2, and only the retaining wall of the frame 210 is drawn. 220. Figure 3 shows the second picture A cross-sectional view along line 3-3. The display module 20 includes a frame 210 and a display panel 230. As shown in FIGS. 2 and 3, the frame 210 of the first embodiment has a retaining wall 220. The retaining wall 220 can have a first inner side 221, a second inner side 222, a third inner side 223, a fourth inner side 224, and a bottom side 225. The first inner side 221 and the third inner side 223 are disposed opposite to each other, and both the second inner side 222 and the fourth inner side 224 are adjacent to each other, and the second inner side 222 and the fourth inner side 224 are opposite to each other, and are respectively connected to the first inner side 221 and the third inner side. 223 are adjacent to each other. An inner angle 226 is formed between the first inner side 221 and the second inner side 222. The first inner side 221, the second inner side 222, the third inner side 223 and the fourth inner side 224 are all connected to the bottom portion 225. The first inner side 221, the second inner side 222, the third inner side 223, and the fourth inner side 224 and the bottom portion 225 together surround an accommodating space 227. The display panel 230 is located in the accommodating space 227 of the frame 210 and is surrounded by the retaining wall 220, wherein the display panel 230 has a first side and a second side adjacent to each other. A first end angle is formed between the first side surface and the second side surface. In this embodiment, the first side surface 243 and the second side surface 244 of the display panel 230 are located on the array substrate 240, and the first end angle 247 is shown in the first FIG. 4A is formed between the first side surface 243 and the second side surface 244 of the array substrate 240. In detail, the display panel 230 includes, for example, an array substrate 240, a counter substrate 250, at least one pixel circuit 260, at least one lead 270, a sealant 280, and a display medium 290. The display medium 290 is interposed between the opposite substrate 250 and the array substrate 240. The sealant 280 is interposed between the opposite substrate 250 and the array substrate 240 and surrounds the display medium 290.

4A is a top view of the array substrate 240 of FIG. 2. In order to more clearly show FIG. 4A, FIG. 4A still reserves a dot-shaped dotted line area 280A between the first display area AA1 and the wiring area 248 to indicate the future. The area of the seal is disposed. In addition, the first wireless road area 249 is indicated by a diagonal line for clarity. As shown in FIGS. 3 and 4A, the array substrate 240 has, for example, a front surface 241, a back surface 242, a first side surface 243, a second side surface 244, a side edge 245, and a connection side 246. The front side 241 and the back side 242 are opposite each other. The front side 241 simultaneously abuts the first side 243, the second side 244, the side edge 245, and the connecting side 246, and is surrounded by the first side 243, the second side 244, the side edge 245, and the connecting side 246. The back side 242 simultaneously abuts the first side 243, the second side 244, the side edge 245, and the connecting side 246, and is surrounded by the first side 243, the second side 244, the side edge 245, and the connecting side 246. The first side surface 243 is opposite to the side edge 245 and is adjacent to the second side surface 244 and the connecting side 246. The second side surface 244 is opposite to the connecting side 246 and is adjacent to the first side surface 243 and the side edge 245. A first end angle 247 is formed between the first side 243 and the second side 244.

The display panel 230 can have a first wireless path area, the first wireless path area is substantially L-shaped, and has no lead wires thereon, and the first wireless path area can abut the wiring area 248 of the array substrate 240 or abutting the opposite substrate 350. A surrounding area 357 (shown in FIG. 7B), and the first wireless path area abuts the first side and the second side of the display panel 230. In the present embodiment, the first wireless path region 249 is located on the array substrate 240. In detail, the array substrate 240 has a first display area AA1, a wiring area 248, and a first wireless path area 249. The wiring area 248 surrounds the first display area AA1 and connects the first wireless path area 249. That is, the first wireless path region 249 connects the wiring region 248, the first side surface 243, and the second side surface 244. The pixel circuit 260 is located in the first display area AA1. Lead 270 is electrically connected to the pixel circuit 260, and lead 270 is at least partially located in wiring area 248. The first wireless path region 249 is substantially L-shaped, such as a residual material region, without any leads thereon. The first wireless path region 249 abuts the wiring region 248 of the array substrate 240 on the one hand, and abuts the first side 243 and the second side 244 of the array substrate 240 on the other hand. More specifically, the first wireless path region 249 includes a first strip region 249A and a second strip region 249B. The first strip 249A simultaneously connects the first side 243 with one side 248A of the wiring area 248. The second strip 249B simultaneously connects the second side 244 with the other side 248B of the wiring area 248. The first strip region 249A is connected to the second strip region 249B, and the major axis direction AL of the first strip region 249A is substantially orthogonal to the long axis direction BL of the second strip region 249B, or is not orthogonal but at least intersect. In addition, the wiring region 248 of the array substrate 240 includes an outer lead land area OLB. The outer lead land area OLB is used to connect a wiring board 700. The connecting side 246 and the second side 244 are opposite each other, the first side 243 is interposed between the connecting side 246 and the second side 244, and the outer pin engaging area OLB is interposed between the connecting side 246 and the first display area AA1. The wiring board 700 is, for example, a flexible printed circuit board.

4B is a top view of the opposite substrate 250 of FIG. 2. In order to more clearly show FIG. 4B, FIG. 4B still reserves a dot-shaped dotted line area 280A between the second display area AA2 and the surrounding area 257 to indicate the area in which the sealant is to be disposed in the future. As shown in FIGS. 3 and 4B, the opposite substrate 250 is disposed opposite to the array substrate 240, and the opposite substrate 250 has a front surface 251, a back surface 252, a first outer side 253, a second outer side 254, side edges 255, and side edges 256. . The front side 251 and the back side 252 are opposite each other. The front surface 251 simultaneously abuts the first outer side 253, the second outer side 254, the side edge 255 and the side edge 256, and is subjected to the first outer side. 253. The second outer side 254, the side edge 255 and the side 256 are surrounded. The back side 252 simultaneously abuts the first outer side 253, the second outer side 254, the side edges 255, and the side edges 256, and is surrounded by the first outer side 253, the second outer side 254, the side edges 255, and the side edges 256. The first outer side 253 is opposite to the side edge 255 and is adjacent to the second outer side 254 and the side side 256. The second outer side 254 is opposite to the side side 256 and is adjacent to the first outer side 253 and the side edge 255. The opposite substrate 250 has a surrounding area 257 and a second display area AA2. The orthographic projection of the second display area AA2 overlaps the first display area AA1 and is surrounded by the surrounding area 257. The surrounding area 257 abuts the first outer side 253, the second outer side 254, the side edge 255, and the side side 256 of the opposite substrate 250, respectively. It should be understood that, in the present embodiment, unlike the wiring region 248, the surrounding region 257 may not need to be distributed with leads. However, the present invention is not limited thereto, and the surrounding region may have, for example, leads extending from the second display region AA2.

Therefore, when the assembler places the display panel in the accommodating space of the frame, the first end angle of the display panel abuts against the inner corner of the frame, and the first side of the display panel abuts the first inner side of the frame, and The second side of the display panel abuts the second inner side of the frame. In this embodiment, as shown in FIG. 2 and FIG. 3, when the assembler places the display panel 230 in the accommodating space 227 of the frame 210, the assembler transmits the first end angle 247 of the array substrate 240. The inner corners 226 of the retaining wall 220 abut against each other, the first side 243 of the array substrate 240 abuts the first inner side 221 of the retaining wall 220, and the second side 244 of the array substrate 240 abuts the second inner side 222 of the retaining wall 220. The display area of the display panel 230 can be accurately positioned at the desired location within the frame 210. In addition, the side edge and the first side of the display panel are opposite to each other and adjacent to the second side And wherein there is an air gap between the side edge of the display panel and the third inner side of the retaining wall. In this embodiment, the side edge 245 of the array substrate 240 and the first side surface 243 are opposite to each other, and the second side surface 244 is adjacent to each other, and the side edge 245 of the array substrate 240 faces the third inner side 223 of the retaining wall 220. There is no contact with the third inner side 223 of the retaining wall 220 and an air gap AR3 between the third inner side 223 of the retaining wall 220. The connecting side 246 of the array substrate 240 faces the fourth inner side 224 of the retaining wall 220 without contacting the fourth inner side 224 of the retaining wall 220 and having an air gap AR4 with the fourth inner side 224 of the retaining wall 220, respectively.

Referring to FIG. 3, the first outer side 253 of the opposite substrate 250 faces the first inner side 221 of the retaining wall 220 and has an air gap AR1 between the first inner side 221 of the retaining wall 220. In other words, the first side 243 of the array substrate 240 is closer to the first inner side 221 of the retaining wall 220 than the first outer side 253 of the counter substrate 250. Referring to FIG. 2, the second outer side 254 faces the second inner side 222 of the retaining wall 220 and has an air gap AR2 with the second inner side 222. In other words, the second side 244 of the array substrate 240 is closer to the second inner side 222 of the retaining wall 220 than the second outer side 254 of the counter substrate 250. However, the side edge 255 of the opposite substrate 250 faces the third inner side 223 of the retaining wall 220 without contacting the third inner side 223 of the retaining wall 220 and has an air gap AR3 with the third inner side 223 of the retaining wall 220. . The side 256 of the opposite substrate 250 faces the fourth inner side 224 of the retaining wall 220, does not contact the fourth inner side 224 of the retaining wall 220, and has an air gap AR4 with the fourth inner side 224 of the retaining wall 220.

In addition, in the present embodiment, the minimum linear distance from the side 248A of the wiring region 248 to the first side 243 of the array substrate 240 D21 is substantially the same as the minimum width w21 of the first stripe region 249A (Fig. 4A). The minimum linear distance d22 of the other side 248B of the wiring region 248 to the second side 244 of the array substrate 240 is substantially the same as the minimum width w22 of the second strip region 249B of the first wireless path region 249 (Fig. 4A). It should be noted that the present invention does not limit the minimum width w21 of the first strip region 249A to the minimum width w22 of the second strip region 249B, and can be adjusted according to actual conditions.

The side edge and the first side face are opposite to each other and abut the second side surface, and the auxiliary linear display panel is positioned in the frame by the remaining material area, so the minimum linear distance of the sealant to the first side is greater than the sealant to the side edge. The minimum linear distance, in this embodiment, as shown in FIG. 2, the minimum linear distance d23 of the sealant 280 to the first side 243 of the array substrate 240 is greater than the minimum straight line of the sealant 280 to the side edge 245 of the array substrate 240. The distance d24, wherein the side edge 245 and the first side surface 243 are opposite each other, and abuts the second side surface 344.

When the conventional display panel without the first wireless road area is placed in the frame, and the display area is precisely positioned at a predetermined position in the frame after precise adjustment, the minimum distance from the side of the display panel to the corresponding inner side of the frame may be As a basis for the size of the first wireless path region of the present embodiment, for example, the minimum pitch is substantially equal to the sum of the minimum width (such as w21 or w22) of the first wireless path region and an assembly margin (for example, 0.05 mm). .

Second embodiment

The display module of the second embodiment is substantially the same as the display module of the first embodiment, and the difference is that the display module of the first embodiment is only The display module of the second embodiment directly abuts the inner side of the frame through the opposite substrate to achieve the purpose of the display panel being located in the frame.

FIG. 5 is a top view of the display module 30 according to the second embodiment of the present invention. In order to make the drawing easy to recognize, the bottom 325 of the frame 310 is omitted in FIG. 5, and only the retaining wall 320 of the frame 310 is drawn. Figure 6 is a cross-sectional view along line 6-6 of Figure 5. As shown in FIGS. 5 and 6, the frame 310 of the second embodiment has a retaining wall 320. The retaining wall 320 can have a first inner side 321 , a second inner side 322 , a third inner side 323 , a fourth inner side 324 , and a bottom 325 . An inner angle 326 is formed between the first inner side 321 and the second inner side 322. Since the structure and the connection relationship of the frame 310 of the second embodiment are substantially the same as the structure and the connection relationship of the frame 210 of the first embodiment, please refer to the first embodiment or the above for the structure and connection relationship of the frame of the second embodiment. The description will not be repeated in the second embodiment.

The display panel 330 is located in the frame 310 and surrounded by the retaining wall 320, wherein the display panel 330 has a first side and a second side adjacent to each other. A first end angle is formed between the first side surface and the second side surface. In this embodiment, the first side surface 353 and the second side surface 354 of the display panel 330 are located on the opposite substrate 350, and the first end angle 359 is displayed. FIG. 7B is formed between the first side surface 353 and the second side surface 354 of the opposite substrate 350. In detail, FIG. 7A is a top view of the array substrate 340 of FIG. 5. In order to more clearly show FIG. 7A, FIG. 7A still reserves a dot-shaped dotted line area 380A between the first display area AA1 and the wiring area 348 to indicate the area in which the sealant is to be disposed in the future. As shown in FIG. 6 and FIG. 7A, the array substrate 340 has, for example, a front surface 341, The back side 342, the first outer side 343, the second outer side 344, the side edge 345, and the connecting side 346. The front side 341 and the back side 342 are opposite each other. The front surface 341 simultaneously abuts the first outer side 343, the second outer side 344, the side edge 345, and the connecting side 346, and is surrounded by the first outer side 343, the second outer side 344, the side edge 345, and the connecting side 346. The back side 342 simultaneously abuts the first outer side 343, the second outer side 344, the side edge 345, and the connecting side 346, and is surrounded by the first outer side 343, the second outer side 344, the side edge 345, and the connecting side 346. The first outer side 343 is opposite to the side edge 345 and is adjacent to the second outer side 344 and the connecting side 346. The second outer side 344 is opposite to the connecting side 346 and is adjacent to the first outer side 343 and the side edge 345. The array substrate 340 has a first display area AA1 and a wiring area 348. The wiring area 348 surrounds the first display area AA1. The wiring area 348 abuts the first outer side 343 and the second outer side 344. The pixel circuit 360 is located in the first display area AA1. The lead 370 is electrically connected to the pixel circuit 360, and the lead 370 is at least partially located in the wiring area 348.

FIG. 7B is a top view of the opposite substrate 350 of FIG. 5. In order to more clearly show FIG. 7B, FIG. 7B still reserves a dotted line area 380A between the second display area AA2 and the surrounding area 357 to indicate the area where the sealant is disposed in the future, and, in order to be clearly recognized, A wireless path area 358 is indicated by a diagonal line. As shown in FIGS. 6 and 7B, the opposite substrate 350 has a front surface 351, a back surface 352, a first side surface 353, a second side surface 354, side edges 355, and side edges 356. The front side 351 and the back side 352 are opposite each other. The front surface 351 abuts the first side surface 353, the second side surface 354, the side edge 355 and the side edge 356, and is surrounded by the first side surface 353, the second side surface 354, the side edge 355 and the side edge 356. The back surface 352 abuts the first side surface 353 and the second side surface 354 at the same time. Side edge 355 and side edge 356 are surrounded by first side 353, second side 354, side edge 355 and side 356. The first side 353 is opposite to the side edge 355 and is adjacent to the second side 354 and the side 356. The second side 354 is disposed opposite to the side 356 and is adjacent to the first side 353 and the side edge 355. A first end angle 359 is formed between the first side 353 and the second side 354.

The display panel 330 can have a first wireless path area, the first wireless path area is substantially L-shaped, and has no lead wires thereon, and the first wireless path area can abut the wiring area of the array substrate or the surrounding area of the opposite substrate. The first wireless road area abuts the first side and the second side of the display panel. In the present embodiment, the first wireless path region 358 is located on the opposite substrate 350 , and the first wireless path region 358 can abut the surrounding region 357 , the first side 353 and the second side 354 of the opposite substrate 350 . In detail, the opposite substrate 350 has a surrounding area 357, a second display area AA2, and a first wireless path area 358. The orthographic projection of the second display area AA2 overlaps the first display area AA1 and is surrounded by the surrounding area 357. The first wireless path region 358 connects the surrounding area 357, the first side 353, and the second side 354. It should be understood that, in the present embodiment, unlike the wiring area, the surrounding area 357 does not need to be distributed with leads. However, the present invention is not limited thereto, and the surrounding area may have, for example, leads extending from the second display area AA2.

The first wireless path region 358 is substantially L-shaped, such as a residual material region, without any leads thereon. The first wireless path region 358 abuts the surrounding area 357 of the opposite substrate 350 on the one hand, and abuts the first side 353 and the second side 354 of the opposite substrate 350 on the other hand. More specifically, the first wireless The road region 358 includes a first strip region 358A and a second strip region 358B. The first strip 358A simultaneously connects the first side 353 with one side 357A of the surrounding area 357. The second strip 358B simultaneously connects the second side 254 with the other side 357B of the surrounding area 357. The first strip region 358A is connected to the second strip region 358B, and the major axis direction AL of the first strip region 358A and the long axis direction BL of the second strip region 358B are substantially orthogonal to each other, or are not orthogonal but at least intersect.

Further, the wiring region 348 of the array substrate 340 includes an outer lead land area OLB. The outer lead land area OLB is used to connect a wiring board 700. In the projection surface of the parallel array substrate 340, the connection side 346 and the second side surface 354 are opposite to each other, the first side surface 353 is interposed between the second side surface 354 and the connection side 346, and the outer pin joint area OLB is connected. The side 346 is between the first display area AA1. The wiring board 700 is, for example, a flexible printed circuit board.

Therefore, as shown in FIGS. 5 and 6, when the display panel 330 is placed in the frame 310, the assembler abuts the first end corner 359 of the opposite substrate 350 and the inner corner 326 of the retaining wall 320. The first side 353 of the opposite substrate 350 abuts against the first inner side 321 of the retaining wall 320, and the second side 354 of the opposite substrate 350 abuts against the second inner side 322 of the retaining wall 320, so that the display area of the display panel 330 can be made. Precisely located in the desired position within the frame 310. In addition, the side edges of the display panel and the first side are opposite to each other and adjacent to the second side, wherein an air gap is formed between the side edge of the display panel and the third inner side of the retaining wall. In this embodiment, the side edge 355 of the opposite substrate 350 and the first side surface 353 are opposite to each other, and the second side surface 354 is adjacent to each other without contacting the third inner side 323 of the retaining wall 320, and the retaining wall 320. Third inner side 323 There is an air gap between the AR3. The side edge 356 of the counter substrate 350 does not contact the fourth inner side 324 of the retaining wall 320 and has an air gap AR4 with the fourth inner side 324 of the retaining wall 320.

At the same time, the first outer side 343 of the array substrate 340 faces the first inner side 321 of the retaining wall 320 and has an air gap AR1 between the first inner side 321 of the retaining wall 320. In other words, with respect to the first outer side 343 of the array substrate 340, the first side 353 of the opposite substrate 350 is closer to the first inner side 321 of the retaining wall 320. The second outer side 344 faces the second inner side 322 of the retaining wall 320 and has another air gap AR2 between the second inner side 322. In other words, with respect to the second outer side 344 of the array substrate 340, the second side 354 of the opposite substrate 350 is closer to the second inner side 322 of the retaining wall 320. However, the side edge 345 of the array substrate 340 does not contact the third inner side 323 of the retaining wall 320 and has an air gap AR3 between the third inner side 323 of the retaining wall 320. The connection side 346 of the array substrate 340 does not contact the fourth inner side 324 of the retaining wall 320 and has an air gap AR4 with the fourth inner side 324 of the retaining wall 320.

In addition, in the present embodiment, the minimum linear distance d31 of the side 357A of the surrounding area 357 to the first side surface 353 of the opposite substrate 350 and the minimum width w31 of the first strip area 358A of the first wireless path area 358 are substantially Same on the same. The minimum linear distance d32 of the other side 357B of the surrounding area 357 to the second side 354 of the opposite substrate 350 is substantially the same as the minimum width w32 of the second strip area 358B of the first wireless path area 358. It should be noted that the present invention does not limit the minimum width w31 of the first strip region 358A and the minimum width w32 of the second strip region 258B, and can be adjusted according to actual conditions.

The side edge and the first side face are opposite to each other and abut the second side surface, and the auxiliary linear display panel is positioned in the frame by the remaining material area, so the minimum linear distance of the sealant to the first side is greater than the sealant to the side edge. The minimum linear distance, in this embodiment, as shown in FIG. 5, the minimum linear distance d33 of the sealant 380 to the first side 353 of the opposite substrate 350 is greater than the side edge 355 of the sealant 380 to the opposite substrate 350. The minimum linear distance d34, wherein the side edge 355 and the first side surface 353 are opposite each other, and abuts the second side surface 354.

When the conventional display panel without the first wireless road area is placed in the frame, and the display area is precisely positioned at a predetermined position in the frame after precise adjustment, the minimum distance from the side of the display panel to the corresponding inner side of the frame may be As a basis for the size of the first wireless path region of the present embodiment, for example, the minimum pitch is substantially equal to the sum of the minimum width (e.g., w31 or w32) of the first wireless path region and an assembly margin (e.g., 0.05 mm).

Third embodiment

The display module of the third embodiment is substantially the same as the display module of the first embodiment, and the difference is that the display module of the first embodiment directly abuts the inner side of the frame through the array substrate of the display panel. The display module of the second embodiment directly abuts the inner side of the frame through the opposite substrate of the display panel. The display module of the third embodiment directly abuts the inner side of the frame through the opposite substrate and the array substrate of the display panel. The purpose of the display panel pair is within the frame.

FIG. 8 is a top view of the display module 40 according to the third embodiment of the present invention. In order to make the drawing easy to recognize, the bottom 425 of the frame 410 is omitted in FIG. 8 , and only the retaining wall of the frame 410 is drawn. 420. Figure 9 shows Figure 8 is a cross-sectional view along line 9-9. As shown in FIGS. 8 and 9, the frame 410 of the third embodiment has a retaining wall 420. The retaining wall 420 has a first inner side 421, a second inner side 422, a third inner side 423, a fourth inner side 424 and a bottom side 425. An inner angle 426 is formed between the first inner side 421 and the second inner side 422. Since the structure and the connection relationship of the frame 410 of the third embodiment are substantially the same as the structure and the connection relationship of the frame of the first embodiment, please refer to the first embodiment or the above for the structure and connection relationship of the frame 410 of the third embodiment. The description will not be repeated in the third embodiment. The display panel 430 is located in the frame 410 and surrounded by the retaining wall 420, wherein the display panel 430 has a first side 443 and a second side 444. In the embodiment, the first side 443 and the second side 444 of the display panel 430 are located on the array substrate 440 , and a first end angle 449 is formed between the first side 443 and the second side 444 . Display panel 430 can have a first wireless pathway region 448 that is substantially L-shaped without any leads thereon. The first wireless path region 448 is located on the array substrate 440, and the first wireless path region 448 is connected to the wiring region 447, the first side surface 443, and the second side surface 444. The opposite substrate 450 has a third side 453 and a fourth side 454 adjacent to each other. A second end angle 459 is formed between the third side 453 and the fourth side 454. The opposite substrate 450 further has a second wireless path region 458. The second wireless pathway region 458 is substantially L-shaped with no leads thereon, and the second wireless pathway region 458 abuts the surrounding region 457, the third side 453, and the fourth side 454. The orthographic projection of the second end angle 459 overlaps the first end angle 449, and both the first end angle 449 and the second end angle 459 abut the inner corner 426 of the frame 410. The third side 453 abuts the first inner side 421 and the fourth side 454 abuts the second inner side 422.

FIG. 10A is a top view of the array substrate of FIG. 8. FIG. In order to more clearly show FIG. 10A, FIG. 10A still reserves a dot-shaped dotted line area 480A between the first display area AA1 and the wiring area 447 to indicate the area in which the sealant is to be disposed in the future. In detail, as shown in FIGS. 9 and 10A, the array substrate 440 of the third embodiment has a front surface 441, a back surface 442, a first side surface 443, a second side surface 444, a side edge 445, and a connection side 446, and the array The substrate 440 has a first display area AA1, a wiring area 447, and a first wireless path area 448. The first wireless path region 448 includes a first strip region 448A and a second strip region 448B. The first strip 448A simultaneously connects the first side 443 with one side 447A of the wiring area 447. The second strip 448B simultaneously connects the second side 444 with the other side 447B of the wiring area 447. The first strip region 448A is connected to the second strip region 448B, and the major axis direction AL of the first strip region 448A and the long axis direction BL of the second strip region 448B are substantially orthogonal to each other, or are not orthogonal. At least intersect.

The structural relationship and the proportional relationship between the array substrate 440 of the third embodiment are substantially the same as those of the array substrate of the first embodiment. Therefore, the structural relationship and the proportional relationship of the array substrate of the third embodiment are referred to An embodiment will not be described in detail in the third embodiment.

FIG. 10B is a top view of the opposite substrate 450 of FIG. 8. In order to more clearly show FIG. 10B, FIG. 10B still reserves a dot-shaped dotted line area 480A between the second display area AA2 and the surrounding area 457 to indicate the area in which the sealant is to be disposed in the future. As shown in FIGS. 9 and 10B, the opposite substrate 450 has a front surface 451, a back surface 452, a third side surface 453, and a fourth side surface. 454, side edge 455 and side 456, and opposite substrate 450 has a second display area AA2, a surrounding area 457 and a second wireless path area 458. The second wireless path region 458 includes a third strip region 458A and a fourth strip region 458B. The third strip 458A simultaneously connects the third side 453 with one side 457A of the surrounding area 457. The fourth strip 458B simultaneously connects the fourth side 454 with the other side 457B surrounding the area 457. The third strip region 458A is connected to the fourth strip region 458B, and the major axis direction AL of the third strip region 458A and the major axis direction BL of the fourth strip region 458B are substantially orthogonal to each other, or are not orthogonal but At least intersect. In addition, since the array substrate 440 also has an outer lead land area OLB, the size of the first wireless path area 448 may be larger than the size of the second wireless path area 458.

Further, in the present embodiment, the minimum linear distance d41 from one side 447A of the wiring region 447 to the first side surface 443 of the array substrate 440 is substantially the same as the minimum width w41 of the first strip region 448A (Fig. 10A). The minimum linear distance d42 of the other side 447B of the wiring region 447 to the second side 444 of the array substrate 440 is substantially the same as the minimum width w42 of the second strip region 448B of the first wireless path region 448 (Fig. 10A). Moreover, however, the invention does not limit the minimum width of the first strip region to be consistent with the minimum width of the second strip region.

In the present embodiment, the minimum linear distance d51 of the side 457A of the surrounding area 457 to the third side 453 of the opposite substrate 450 is substantially the same as the minimum width w51 of the third strip 458A of the second wireless path area 458. . a minimum linear distance d52 from the other side 457B of the surrounding area 457 to the fourth side 454 of the opposite substrate 450 and a fourth of the second wireless path area 458 The minimum width w52 of the strip region 458B is substantially the same. However, the present invention does not limit the minimum width of the first strip region to be consistent with the minimum width of the second strip region.

The side edge and the first side face are opposite to each other and abut the second side surface, and the auxiliary linear display panel is positioned in the frame by the remaining material area, so the minimum linear distance of the sealant to the first side is greater than the sealant to the side edge. The minimum linear distance, in this embodiment, as shown in FIG. 9, the minimum linear distance d53 of the sealant 480 to the first side 443 of the display panel 430 is greater than the minimum straight line of the sealant 480 to the side edge 445 of the array substrate 440. The distance d54, wherein the side edge 445 and the first side 443 are opposite each other, and abuts the second side 444.

Since the structural relationship and the proportional relationship of the opposite substrate 450 of the third embodiment are substantially the same as the structural relationship and the proportional relationship of the opposite substrate 350 of the second embodiment, the structural relationship of the opposite substrate 450 of the third embodiment is adopted. Please refer to the second embodiment for the relationship with the ratio, and the details are not described in the third embodiment.

Therefore, as shown in FIGS. 8 and 9, when the display panel 430 is placed in the frame 410, the assembler transmits the first end angle 449 (FIG. 10A) of the array substrate 440 to the inner corner 426 of the retaining wall 420. Abutting against each other, the first side 443 of the array substrate 440 abuts the first inner side 421 of the retaining wall 420, and the second side 444 of the array substrate 440 abuts the second inner side 422 of the retaining wall 420; likewise, the assembler passes through The second end angle 459 (Fig. 10B) of the substrate 450 and the inner corner 426 of the retaining wall 420 abut each other, and the third side 453 of the opposite substrate 450 abuts against the first inner side 421 of the retaining wall 420, and the opposite substrate The fourth side 454 of the 450 abuts against the second inner side 422 of the retaining wall 420. So that you can display The display area of panel 430 is precisely located at the desired location within frame 410.

However, when the display panel 430 is placed in the frame 410, the side edge 445 of the array substrate 440 faces the third inner side 423 of the retaining wall 420, does not contact the third inner side 423 of the retaining wall 420, and is opposite to the retaining wall 420. There is an air gap AR3 between the three inner sides 423, and the connecting side 446 of the array substrate 440 faces the fourth inner side 424 of the retaining wall 420, does not contact the fourth inner side 424 of the retaining wall 420, and the fourth inner side 424 of the retaining wall 420 There is an air gap between AR4. Similarly, when the display panel 430 is placed in the frame 410, the side edge 455 of the opposite substrate 450 faces the third inner side 423 of the retaining wall 420, does not contact the third inner side 423 of the retaining wall 420, and the retaining wall 420 There is an air gap AR3 between the third inner side 423, and the side inner side 456 of the opposite substrate 450 faces the fourth inner side 424 of the retaining wall 420, does not contact the fourth inner side 424 of the retaining wall 420, and is opposite to the retaining wall 420. There is an air gap AR4 between the four inner sides 424. Since the array substrate 440 and the opposite substrate 450 both contact the inner sides 421, 422 of the retaining wall 420, the orthographic projection of the first wireless path region 448 at least partially overlaps the second wireless path region 458.

As such, the display module 40 of the third embodiment directly passes through the inner sides 421 and 422 of the frame 420 through the wireless path regions 448 and 458 of the opposite substrate 450 and the array substrate 440 of the display panel 430 . Therefore, the display module of the third embodiment has better bonding strength and abutment stability, and reduces the chance of cracks generated in the assembly.

In the above embodiments, as shown in FIG. 9, in order to effectively fix the display panel 430 at a specific position within the frame 410 so as not to be deviated by vibration, the display panel 430 is fixed to the bottom 425 of the frame 310 through the light-shielding tape T, so that the array The substrate 440 is not disengaged from the first inner side of the retaining wall 420 421 Abutting against the second inner side 422. In the present embodiment, the light-shielding tape is, for example, a mouth-shaped tape. However, the present invention does not limit the fixing manner, and may be fixed by clamping or locking the display panel after the display panel abuts the inner side, and may be adjusted according to requirements. .

Fourth embodiment

11 is a flow chart showing a method of manufacturing a display module in accordance with the present invention. 12A to 12C are schematic views showing steps 1 to 3 of FIG. As shown in FIG. 11 and FIG. 12A to FIG. 12C, the manufacturing method of the display module includes the following steps 1 to 4.

In step 1, an array of substrate masters 510 and a pair of substrate masters 520 are provided (Fig. 12A). More specifically, the array substrate mother substrate 510 includes a plurality of array substrate regions 511, and the opposite substrate mother substrate 520 includes a plurality of opposite substrate regions 521. One of the array substrate regions 511 and the corresponding opposite substrate regions 521, or both the array substrate region 511 and the opposite substrate region 521 may have a substantially L-shaped shape at their edge positions. Wireless road area. The size of the no-line area is determined according to a predetermined position in the frame in the future in accordance with the display area of the array substrate area 511 or the opposite substrate area 521. In this embodiment, the wireless path area 530 is located on the array substrate, and the L-shaped wireless path area 530 remains on two adjacent sides of each array substrate area 511.

In step 2, the group substrate base wafer 510 and the opposite substrate mother sheet 520 are formed into a display mother board structure 600 (Fig. 12B). The array substrate regions 511 correspond to the opposite substrate regions 521, respectively, to form a plurality of display panel regions 610, respectively. That is to say, in this embodiment, these arrays The column substrate regions 511 are respectively aligned with the opposite substrate regions 521 such that the array substrate regions 511 on the display mother substrate structure 600 and the corresponding opposite substrate regions 521 thereof form a display panel region 610.

In step 3, the display mother board structure 600 is cut into a plurality of the above-described display panels 611 (Figs. 12B and 12C). Each display panel 611 includes an array substrate 5111 and a pair of substrates 5211, and the wireless path region abuts two adjacent sides of the display panel. More specifically, in this embodiment, each display panel 611 is formed by one of the display panel regions 610. It should be noted that the array substrate region 511 defines the array substrate unit on the array substrate mother substrate 510 that has not been disconnected or is not completely broken, and the array substrate 5111 definition has been completely disconnected from the array substrate mother substrate 510. Array substrate unit. The components such as the opposite substrate region 521 and the opposite substrate region 5211 are similar concepts, and thus will not be described herein. The no-line area 530 abuts two of the adjacent sides 612, 613 of the display panel 611, and no line exists on the wireless path area 530. In this embodiment, since the wireless path region 530 is previously reserved on two adjacent sides of the array substrate 5111, as seen from the top view of FIG. 12C, the opposite substrate 5211 does not have the wireless path region 530, and the array substrate 5111 The no-line area 530 is exposed next to the opposite substrate 5211.

In step 4, one of the display panels 230 is combined into a frame 210 (Fig. 2) such that the first end angle 247 of the display panel 230 and the inner corner 226 of the frame 210 abut each other, with the wireless path region 249 The presence of the first display area AA1 (or the second display area AA2) falls within the predetermined position in the frame 210.

However, the manufacturing method of the present invention is not limited to this, and other In the embodiment, the opposite substrate region itself, or both the array substrate region and the opposite substrate region, may have the L-shaped wireless path region pre-reserved at the edge position thereof.

In step 1 of the embodiment, more specifically, when a conventional display panel that does not have a wireless road area is placed in the frame, and the display area of the conventional display panel is located at a predetermined position in the frame, conventionally The minimum spacing from the side of the display panel to the corresponding inner side of the frame can be used as a basis for designing the size of the wireless road region such that the minimum spacing is substantially the same as the minimum width and assembly margin (eg, 0.05 mm) of the wireless road region in the present embodiment. Sum. However, the present invention is not limited thereto, and the present invention does not necessarily have to use various data from the conventional display panel in the frame as a basis for designing the size of the wireless path region.

In step 2 of the present embodiment, more specifically, step 2 further includes detailed steps as follows. As shown in FIG. 12B, a plurality of sealant 540 are formed on the array substrate master 510 or the opposite substrate master 520 such that the array substrate master 510 and the opposite substrate master 520 are grouped as display mothers. After the board structure 600, each frame glue 540 is located between the array substrate area 511 and the opposite substrate area 521 of one of the display panel areas 610, and surrounds a space for placing the display medium.

In the embodiment, the wireless circuit area is pre-retained on the array substrate area and is reserved in advance on two adjacent side surfaces of each array substrate area, and the display mother board structure 600 of the present embodiment is cut into display. The cutting step of the panel 611 further includes cutting and forming at least one cutting mark on one side of the opposite substrate region of each display panel region opposite to the array substrate region, and pressing the opposite substrate region to partially remove the opposite substrate. One part of the area and exposed array The wireless path area of the substrate. In this embodiment, partially removing a portion of the opposite substrate region may further include exposing the pin bond regions outside the array substrate.

FIG. 13A is a flow chart showing the detailed steps of step 3 of FIG. 11, which is a flow chart showing the detailed steps of cutting the mother board structure into a plurality of display panels. 13B to 13D are diagrams showing the operation of FIG. 13A. The display mother board structure 600 of FIG. 13B is the inverted display board structure 600 of FIG. 12B such that the array substrate master 510 is over the opposing substrate mother sheet 520. As shown in FIG. 13A, in the present embodiment, the step 3 further includes the detail step 31 to the detail step 33 as follows. In the detail step 31, as shown in FIG. 13B, the array substrate mother substrate 510 of the mother substrate structure 600 is faced away from the opposite substrate mother substrate 520, and the array substrate region 511 is opposed to the opposite substrate. One or more first cutting marks V1 are cut and formed on one side of the region 521, and the array substrate region 511 is pressed to distinguish the outline of each array substrate region 511. In the detail step 32, as shown in FIG. 13B, on the opposite side of the array substrate mother substrate 520 of the mother substrate structure 600, the opposite substrate region of each display panel region 610 is shown. The 521 is cut away from one side of the array substrate region 511 and formed with one or more second cutting marks V2, and the opposing substrate region 521 is pressed to partially remove a portion of the opposite substrate region 521 to expose the array substrate. The wireless path area 530 of the area 511, and the outline of each of the opposite substrate areas 521 can be distinguished. It should be noted that the concept of pressing the array substrate region 511 to distinguish the outline of each array substrate region 511 includes, for example, completely disconnecting each array substrate region 511 from each other or making each array substrate region 511 mutually It is about to be disconnected (if it is left to stand, it can be disconnected by itself or disconnected by the subsequent adsorption device). Each of the opposite substrate regions 521 can be distinguished The concept of contours is similar and will not be described here.

In the detail step 33, as shown in FIG. 13D and FIG. 12C, each display panel area is sequentially separated from the remaining material R of the display mother board structure 600 to be separated into a plurality of display panels 611 (FIG. 12C) ).

Specifically, in the detail steps 31 and 32, as shown in FIGS. 13B and 13C, the cutting tool is vibrated (pressured) while cutting and forming the first cutting mark V1 or the second cutting mark V2 by the cutting tool. The first cutting mark V1 or the second cutting mark V2 is such that the corresponding substrate mother piece 510 or 520 generates a crack cr along the first cutting mark V1 or the second cutting mark V2, thereby allowing the first cutting mark V1 or the second cutting The mark V2 continues to crack until it is completely broken. However, the present invention is not limited thereto, and it is also possible to increase the first cutting mark or the second cutting mark by pushing in addition to the vibration mode.

It should be understood that, as shown in Figures 13C and 13D, when the cutting mark V1 or V2 continues to crack to a certain extent, there may still be some parts that have not been disconnected. After standing for a few seconds, the adsorption device S can be passed through. One of the display panel regions 610 of the display mother board structure 600 is sucked so that the display panel region 610 is completely disconnected from the remaining material R (as shown in FIGS. 13C and 13D), and the residual material R is naturally left on the resting plane F. (such as the workbench).

In addition, in the detail step 32, as shown in FIG. 12C, in addition to the exposed wireless path region 530, the above-mentioned partially removed portion of the opposite substrate region 521 further includes the pin bonding region OLB outside the array substrate 5111.

It should be understood that the number and position of the first cutting mark and the second cutting mark are merely examples, and the number, position and direction can be adjusted according to actual needs. In addition, the present invention is not limited to cutting the display of the mother board structure must be transparent The cutting marks are used to separate the sheets.

Moreover, since the array substrate mother substrate 510 has a better bearing capacity for the opposite substrate mother substrate 520, the present embodiment selects to form a cutting mark on the array substrate mother substrate 510 first, however, The present invention is not limited thereto, and the detail step (detail step 32) for forming a cut mark on the substrate mother sheet 520 does not necessarily require a detailed step of forming a cut mark on the array substrate mother sheet 510 (details). After step 31).

In another variation of the above manufacturing method, for example, when the wireless path region is previously reserved on the opposite substrate region and is reserved in advance on two adjacent sides of each of the opposite substrate regions, the L is When the two adjacent side surfaces of the adjacent wireless display area are adjacent to the adjacent sides of the opposite substrate, the cutting step of cutting the display mother board structure into a plurality of display panels in the present embodiment further includes: The array substrate area of each display panel area is cut away from one side of the opposite substrate area to form at least one first cutting mark, and the array substrate area is pressed to partially remove one part of the array substrate area and expose the opposite substrate a wireless circuit area, and then displaying the mother board structure upside down, cutting and forming at least one second cutting mark on one side of each of the opposite substrate areas facing the array substrate area, and pressing the opposite substrate area to Partially removing a portion of the opposing substrate region and exposing an outer pin bond region of the array substrate. In this variation, the actual method of cutting the display mother board structure into a plurality of display panels can be carried out in the manner described in FIG. 13B to FIG. 13D. Please refer to the above description, and therefore, no further description is given here. The invention is not limited to this method.

It should be noted that, in this embodiment, the at least one first cutting mark can simultaneously distinguish the contour of the array substrate region and expose the opposite base. The wireless road area of the board. The at least one second cut mark can be used to distinguish the contour of the opposite substrate region and expose the pin bond regions outside the array substrate. However, the invention is not limited thereto.

In still another variation of the above manufacturing method, when the array substrate region and the opposite substrate region respectively have substantially L-shaped wireless path regions at their edge positions, one of the wireless path regions is located on the array substrate and adjacent to the array. Two adjacent sides of the substrate, and another wireless path region is located on the opposite substrate and adjacent to two adjacent sides of the opposite substrate, and two adjacent sides of the array substrate and two adjacent sides of the opposite substrate are orthographically projected to form the above display When the two adjacent sides of the panel are used, the cutting step of cutting the display mother board structure into a display panel further includes the following steps. Cutting and forming at least one first cutting mark on one side of each of the array substrate regions facing the opposite substrate region, and pressing the array substrate region to distinguish the contour of the array substrate region; facing each of the opposite substrate regions Cutting and forming at least one second cutting mark on one side of the array substrate region, and pressing the opposite substrate region to partially remove a portion of the opposite substrate region and exposing one of the outer lead pins of the array substrate and the portion The wireless path area of the array substrate. At this time, the wireless path area of the array substrate and the wireless path area of the opposite substrate overlap each other, and since the wireless path area of the array substrate is larger than the wireless path area of the opposite substrate, the wireless path area of part of the array substrate is exposed. .

It should be understood that, in this embodiment, the second cutting marks are simultaneously used to distinguish the contour of the opposite substrate region and the wireless path region for exposing the outer pin bonding region and a portion of the array substrate. However, the invention is not limited thereto.

In this change, the display mother board structure is cut into a plurality of displays. The actual operation of the display panel can be carried out in the manner described in FIG. 13B to FIG. 13D. Please refer to the above description, and therefore, no further details are provided herein. However, the present invention is not limited to such a method.

Before the frame is combined with the display panel in another embodiment, more specifically, the manufacturing method of the display module further includes placing a backlight unit (not shown) into the frame to facilitate display as a display panel when in use. light source. However, the present invention is not limited thereto, and the present invention does not necessarily have to pass through the backlight unit as a display light source of the display panel.

Finally, the various embodiments disclosed above are not intended to limit the invention, and those skilled in the art can be protected in various modifications and refinements without departing from the spirit and scope of the invention. In the invention. Therefore, the scope of the invention is defined by the scope of the appended claims.

10‧‧‧ display module

110‧‧‧Frame

111‧‧‧ inside

120‧‧‧ display panel

121‧‧‧ side

122‧‧‧Residual area

AA‧‧‧ display area

G‧‧‧ spacing

Claims (17)

A display module includes: a frame having a retaining wall having a first inner side and a second inner side adjacent to each other, an inner corner formed between the first inner side and the second inner side; and a a display panel is disposed in the frame and surrounded by the retaining wall, wherein the display panel has a first side and a second side adjacent to each other, and a first end angle is formed between the first side and the second side. The first end angle and the inner corner abut each other, and the first side abuts the first inner side, and the second side abuts the second inner side, the display panel comprises: an array substrate having a first a display area and a wiring area surrounding the first display area; at least one pixel circuit located in the first display area; at least one lead electrically connected to the pixel circuit, and the lead is at least partially located a pair of substrates disposed opposite to the array substrate, the opposite substrate having a surrounding area and a second display area, the orthographic projection of the second display area overlapping the first display area, and receiving the surrounding area And a display medium between the opposite substrate and the array substrate, wherein the display panel further has a first wireless road region, the first wireless road region is substantially L-shaped, and the Having any lead, and the first wireless path region is adjacent to the wiring region or the opposite base of the array substrate The surrounding area of the board, and the first wireless path area is adjacent to the first side and the second side of the display panel. The display module of claim 1, wherein the first side and the second side of the display panel are located on the array substrate, the first wireless path area is located on the array substrate, and the first wireless path area is connected. The wiring area, the first side and the second side, and the first end angle is formed between the first side and the second side of the array substrate; and the opposite substrate has one adjacent to each other An outer side and a second outer side, wherein the surrounding area abuts the first outer side and the second outer side, wherein the first outer side faces the first inner side and has an air gap between the first inner side and the first inner side The outer side faces the second inner side and has another air gap between the outer side and the second inner side. The display module of claim 2, wherein the first wireless path region comprises a first strip region and a second strip region, the first strip region connecting the first side of the array substrate and the One side of the wiring area, the second strip area is connected to the second side of the array substrate and the other side of the wiring area, the first strip area is connected to the second strip area, and the first strip area is One of the major axis directions is substantially orthogonal to the long axis direction of one of the second strip regions, and a minimum linear distance from the side of the wiring region to the first side of the array substrate and the first strip region a minimum width being substantially the same, and the other side of the wiring region to the second side of the array substrate A minimum linear distance is substantially the same as a minimum width of the second strip. The display module of claim 1, wherein the first side and the second side of the display panel are located on the opposite substrate, the first wireless path area is located on the opposite substrate, and the first wireless path is The area is connected to the surrounding area, the first side and the second side, and the first end angle is formed between the first side and the second side of the opposite substrate; and the array substrate has one adjacent to each other a first outer side and a second outer side, the wiring area abutting the first outer side and the second outer side, wherein the first outer side faces the first inner side and has an air gap with the first inner side, The second outer side faces the second inner side and has another air gap between the second outer side. The display module of claim 4, wherein the first wireless path region comprises a first strip region and a second strip region, the first strip region connecting the first side of the opposite substrate and One side of the surrounding area, the second strip is connected to the second side of the opposite substrate and the other side of the surrounding area, the first strip is connected to the second strip, and the first strip One of the long axis directions of the shape is substantially orthogonal to the long axis direction of one of the second strip regions, and a minimum linear distance from the side of the surrounding region to the first side of the opposite substrate and the first strip a minimum width of the shaped area is substantially the same, and the other side of the surrounding area to the second side of the opposite substrate A minimum linear distance is substantially the same as a minimum width of the second strip. The display module of claim 1, wherein the first side and the second side of the display panel are located on the array substrate, the first wireless path area is located on the array substrate, and the first wireless path area is connected to the a wiring area, the first side and the second side, and the first end angle is formed between the first side and the second side of the array substrate; and the opposite substrate has a third side adjacent to each other And a fourth side, the opposite substrate further has a second wireless path region, the second wireless path region is substantially L-shaped, and has no lead wires thereon, the second wireless circuit region is adjacent to the surrounding region, a third side surface and a fourth side surface, wherein a second end angle is formed between the third side surface and the fourth side surface, and an orthographic projection of the second end angle overlaps the first end angle, the second end angle and the The inner corners abut each other, and the third side abuts the first inner side, and the fourth side abuts the second inner side. The display module of claim 6, wherein the first wireless path area comprises a first stripe region and a second stripe region, the first stripe region connecting the first side of the array substrate and the One side of the wiring area, the second strip area is connected to the second side of the array substrate and the other side of the wiring area, the first strip area is connected to the second strip area, and the first strip area is One of the major axis directions is substantially orthogonal to the long axis direction of one of the second stripe regions, The second wireless path region includes a third strip region and a fourth strip region, the third strip region connecting the third side of the opposite substrate and one side of the surrounding region, the fourth strip shape The fourth strip is connected to the fourth side of the opposite substrate and the other side of the surrounding area, the third strip is connected to the fourth strip, and one of the third strips has a long axis direction and the fourth strip One of the long-axis directions of the shaped area is substantially orthogonal, and a minimum linear distance from the side of the wiring area to the first side of the array substrate is substantially the same as a minimum width of the first strip-shaped area, and the wiring a minimum linear distance from the other side of the region to the second side of the array substrate is substantially the same as a minimum width of the second strip region, the side of the surrounding region to the third side of the opposite substrate a minimum linear distance substantially the same as a minimum width of the third strip region, and a minimum linear distance from the other side of the surrounding region to the fourth side of the opposite substrate and the fourth strip region A minimum width is substantially the same. The display module of claim 1, wherein the retaining wall further has a third inner side, the third inner side and the first inner side are opposite to each other, and adjacent to the second inner side; and the display panel further has a The side edge is opposite to the first side and adjacent to the second side, wherein an air gap is formed between the side edge of the display panel and the third inner side of the retaining wall. The display module of claim 1, wherein the wiring area comprises an outer pin bonding area, and the outer pin bonding area is used for connecting a wire board, the array substrate further has a connecting side, the connecting side and the second side are opposite to each other, the first side is between the connecting side and the second side, and the outer pin joint zone is between The connection side is between the first display area. The display module of claim 1, further comprising a frame glue interposed between the opposite substrate and the array substrate, and surrounding the display medium, wherein the display panel further has a side edge, The side edge and the first side face opposite each other, and adjacent to the second side, a minimum linear distance of the sealant to the first side is greater than a minimum linear distance of the sealant to the side edge. A method for manufacturing a display module, comprising: providing an array of substrate mother sheets and a pair of substrate mother sheets, wherein the array substrate mother sheets comprise a plurality of array substrate regions, the opposite substrate master sheets comprising a plurality of In the opposite substrate region, at least one of the array substrate regions and the corresponding one of the opposite substrate regions retains a substantially L-shaped wireless path region at an edge position thereof, and the wireless channel region is sized according to the The array substrate region or a display region of the opposite substrate region is determined in a predetermined position in a frame; the array substrate mother substrate and the opposite substrate mother substrate are formed into a display mother board structure, wherein The array substrate regions respectively correspond to the opposite substrate regions to form a plurality of display panel regions; the display motherboard structure is cut into a plurality of display panels, each of which is displayed The display panel comprises an array substrate and a pair of substrates, wherein the display panel is formed by one of the display panel regions, and the wireless road region is adjacent to two adjacent sides of the display panel, and there is no line on the wireless road region And arranging a frame with one of the display panels such that a first end angle formed between the two adjacent sides of the display panel is adjacent to an adjacent inner side of one of the frame retaining walls Forming one of the inner corners abutting each other, one of the two adjacent sides of the display panel abutting against the two adjacent inner sides of the retaining wall, and the two adjacent sides of the display panel The other one of the two adjacent inner sides of the retaining wall abuts each other, and the display area falls within the predetermined position in the frame by the presence of the wireless road area. The method of manufacturing the display module of claim 11, wherein the wireless path region is located on the array substrate, and the two adjacent sides of the wireless circuit region adjacent to the display panel are adjacent to the array substrate. And cutting the display mother board structure into the cutting step of the display panel, further comprising: cutting and forming at least one cut on one side of the array substrate area of the display panel area Marking, and pressing the opposite substrate region to partially remove a portion of the opposite substrate region and expose the wireless circuit region of the array substrate. The manufacturer of the display module as described in claim 12 The method wherein partially removing the portion of the counter substrate region further comprises exposing an outer pin bond region of the array substrate. The method of manufacturing the display module of claim 11, wherein the wireless path region is located on the opposite substrate, and the two adjacent sides of the wireless circuit region adjacent to the display panel are adjacent to the opposite substrate. The two adjacent sides, the cutting mother board structure is cut into the cutting steps of the display panels, and further comprising: cutting and forming at least one side of the array substrate area of the display panel area on the opposite side of the opposite substrate area a first cutting mark is applied to the array substrate region to partially remove a portion of the array substrate region and expose the wireless path region of the opposite substrate. The method of manufacturing the display module of claim 14, wherein the step of cutting the display motherboard structure into the display panels further comprises: facing the array of the opposite substrate regions of each of the display panel regions Cutting and forming at least one second cutting mark on one side of the substrate region, and pressing the opposite substrate region to partially remove a portion of the opposite substrate region and exposing an outer pin bonding region of the array substrate. The method of manufacturing the display module of claim 11, wherein the array substrate region and the corresponding opposite substrate region respectively retain the substantially L-shaped wireless path region at an edge position thereof, such that One of the wireless circuit regions is located on the array substrate and adjacent to two adjacent sides of the array substrate, and the other wireless circuit region is located on the opposite substrate and adjacent to two adjacent sides of the opposite substrate, the array substrate The two adjacent sides and the two adjacent sides of the opposite substrate are orthographically projected to form the two adjacent sides of the display panel, and the display mother board structure is cut into the cutting steps of the display panels, and further includes: The array substrate area of each display panel area is cut away from one surface of the opposite substrate area to form at least one first cutting mark, and the array substrate area is pressed to distinguish the outline of the array substrate area; The opposite substrate region of each of the display panel regions is cut away from one side of the array substrate region to form at least one second cutting mark, and the opposite substrate region is pressed to partially remove the opposite substrate region a portion of the external circuit pin area of the array substrate and a portion of the wireless circuit area of the array substrate, wherein the wireless path area of the array substrate and the wireless road area of the opposite substrate One above the other. The method of manufacturing the display module of claim 11, further comprising: placing a backlight unit into the frame before combining the frame with the display panel.