TWI598557B - Vapor chamber without degassing protrusion and manufacturing method thereof - Google Patents

Vapor chamber without degassing protrusion and manufacturing method thereof Download PDF

Info

Publication number
TWI598557B
TWI598557B TW104118900A TW104118900A TWI598557B TW I598557 B TWI598557 B TW I598557B TW 104118900 A TW104118900 A TW 104118900A TW 104118900 A TW104118900 A TW 104118900A TW I598557 B TWI598557 B TW I598557B
Authority
TW
Taiwan
Prior art keywords
degassing
groove
plate
shell plate
temperature equalizing
Prior art date
Application number
TW104118900A
Other languages
Chinese (zh)
Other versions
TW201643362A (en
Inventor
汪仕明
廖邦宏
王證都
Original Assignee
超眾科技股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 超眾科技股份有限公司 filed Critical 超眾科技股份有限公司
Priority to TW104118900A priority Critical patent/TWI598557B/en
Publication of TW201643362A publication Critical patent/TW201643362A/en
Application granted granted Critical
Publication of TWI598557B publication Critical patent/TWI598557B/en

Links

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Description

無除氣凸部的均溫板及其製造方法 Temperature equalizing plate without degassing convex portion and manufacturing method thereof

本發明係有關於一種均溫板結構,尤指一種無除氣凸部的均溫板及其製造方法。 The invention relates to a temperature equalizing plate structure, in particular to a temperature equalizing plate without a degassing convex portion and a manufacturing method thereof.

均溫板(Vapor Chamber)的功能及工作原理與熱導管一致,主要利用封閉於板狀腔體中的工作流體進行蒸發及凝結循環作動,讓發熱元件的熱量能快速且均勻的被均溫板吸收,從而使均溫板具快速熱傳導及熱擴散的功能。 The function and working principle of the Vapor Chamber are the same as those of the heat pipe. The working fluid enclosed in the plate cavity is used for evaporation and condensation circulation, so that the heat of the heating element can be quickly and evenly averaged. Absorbing, so that the temperature equalizing plate has the function of rapid heat conduction and heat diffusion.

然而,均溫板的製作流程需要進行填充工作流體及抽真空作業,所以均溫板的殼體在製造時,殼體本身就會向外突出一除氣凸部,以方便進行填充工作流體及抽真空作業。但是,隨著現代均溫板朝輕薄短小之目標前進,均溫板的外部突出有除氣凸部,將造成均溫板的體積無法簡化並阻礙薄型化發展。 However, the production process of the uniform temperature plate needs to be filled with the working fluid and the vacuuming operation, so when the casing of the temperature equalizing plate is manufactured, the casing itself protrudes outwardly with a degassing convex portion to facilitate filling of the working fluid and Vacuuming work. However, as the modern uniform temperature plate moves toward the goal of lightness, thinness and shortness, the outer portion of the temperature equalizing plate protrudes with a degassing convex portion, which will cause the volume of the temperature equalizing plate to be simplified and hinder the development of thinning.

有鑑於此,本發明人遂針對上述現有技術,特潛心研究並配合學理的運用,盡力解決上述之問題點,即成為本發明人開發之目標。 In view of the above, the inventors of the present invention have made great efforts to solve the above problems by focusing on the above-mentioned prior art, and have made great efforts to solve the above problems, which has become the object of development by the present inventors.

本發明之一目的,在於提供一種無除氣凸部的均溫板及其製造方法,其係利用下殼板開設有凹溝,凹溝一端與至少其一毛細通道相互連通,另一端貫穿於平面,並凹溝與上殼板之間形成除氣孔,使均溫板省略習知的除氣凸部,以達到本發明均溫板 具有體積輕薄短小及精簡之優點。 An object of the present invention is to provide a temperature equalizing plate without a degassing convex portion and a manufacturing method thereof, which are provided with a concave groove by using a lower shell plate, one end of the groove is connected with at least one capillary channel thereof, and the other end is penetrated through a flat surface, and a degassing hole is formed between the groove and the upper shell plate, so that the uniform temperature plate omits the conventional degassing convex portion to reach the temperature equalizing plate of the present invention It has the advantages of being light and thin, and compact.

為了達成上述之目的,本發明係提供一種無除氣凸部的均溫板,包括:一下殼板,具有一上表面及一外周壁,該外周壁具有一平面,該上表面區分為一內部區及環設在該內部區外圍的一外部區,該內部區具有相互連通的複數毛細通道,該外部區開設有一凹溝,該凹溝一端與至少其一該毛細通道相互連通,另一端貫穿於該平面;以及一上殼板,對應該上表面蓋合並與該下殼板相互密封接合,該上殼板具有一下表面及一外環壁,該外環壁具有一平面,該下表面設有與該凹溝呈相對配置的一下陷溝,該下陷溝一端與至少其一該輔助通道相互連通,另一端貫穿於該平面,該凹溝與該下陷溝之間形成一除氣孔,該凹溝、該下陷溝、該下殼板與該上殼板之間更具有填封於該除氣孔的一封口部,該封口部由該下殼板朝該凹溝方向以壓焊接方式成型,及該上殼板朝該下陷溝方向以壓焊接方式成型,該下殼板的內壁與該上殼板的內壁相互貼接。 In order to achieve the above object, the present invention provides a temperature equalizing plate without a degassing protrusion, comprising: a lower shell having an upper surface and an outer peripheral wall, the outer peripheral wall having a plane, the upper surface being divided into an inner portion And an outer zone disposed at a periphery of the inner zone, the inner zone having a plurality of capillary channels communicating with each other, the outer zone defining a groove, the groove being connected to at least one of the capillary channels and the other end And an upper casing plate corresponding to the upper surface cover and the sealing member of the lower casing plate, the upper casing plate having a lower surface and an outer annular wall, the outer annular wall having a plane, the lower surface being provided a lower recess disposed opposite to the recess, the one end of the lower trap communicating with at least one of the auxiliary passages, the other end penetrating the plane, and a recess is formed between the recess and the lower recess, the recess The groove, the lower trap, and the upper shell plate further have a mouth portion sealed in the degassing hole, and the sealing portion is formed by pressure welding from the lower shell plate toward the groove direction, and The upper shell plate Depressed groove forming direction pressure welding, the inner wall of the lower casing plate and the upper plate inner wall of the shell contact against one another.

為了達成上述之目的,本發明係提供一種無除氣凸部的均溫板之製造方法,包括:a)提供一下殼板,該下殼板具有一上表面及一外周壁,該外周壁具有一平面,將該上表面區分為一內部區及環設在該內部區外圍的一外部區,該內部區具有相互連通的複數毛細通道;b)對該外部區開設有一凹溝,該凹溝一端與至少其一該毛細通道相互連通,另一端貫穿於該平面;c)提供一上殼板,將該上殼板對應該上表面蓋合,並對該下殼板與該上殼板的邊緣進行密封接合作業,該上殼板具有一下表及一外環壁,該外環壁具有一平面,該下表面設有與該凹溝呈相對配置的一下陷溝,該下陷溝一端與至少其一該輔助通道相互連通,另一端貫穿於該平面,以令該凹溝與該下陷溝之間形成一除氣孔;d)提供一工作流體,透過該除氣孔將該工作流體填充於該等毛細通道並進行抽真空作業;以及e)對該除氣孔進行封口作業,該封口作業為該下殼板朝該凹溝方向進行壓焊接,及該上殼板朝該下陷溝方向進行壓焊接,使該下殼板的內壁與該 上殼板的內壁相互貼接而形成一封口部,以令該封口部填封於該除氣孔。 In order to achieve the above object, the present invention provides a method for manufacturing a temperature equalizing plate without a degassing protrusion, comprising: a) providing a lower shell having an upper surface and an outer peripheral wall, the outer peripheral wall having a plane dividing the upper surface into an inner zone and an outer zone disposed at a periphery of the inner zone, the inner zone having a plurality of capillary channels communicating with each other; b) forming a groove for the outer zone, the groove One end communicates with at least one of the capillary channels, and the other end penetrates the plane; c) provides an upper shell plate, the upper shell plate corresponds to the upper surface, and the lower shell plate and the upper shell plate The edge is sealed and joined, the upper shell has a lower surface and an outer annular wall, the outer annular wall has a flat surface, and the lower surface is provided with a lower recess opposite to the concave groove, the lower recess has one end and at least One of the auxiliary channels communicates with each other, and the other end penetrates the plane to form a degassing hole between the groove and the lower ditch; d) provides a working fluid, and fills the working fluid through the degassing hole Capillary channel and pumping And a) sealing operation of the degassing hole, wherein the sealing operation is that the lower shell plate is pressure welded in the direction of the groove, and the upper shell plate is pressure welded in the direction of the lower trap to make the lower shell plate Inner wall with the The inner walls of the upper casing are attached to each other to form a mouth portion, so that the sealing portion is sealed in the degassing hole.

10‧‧‧均溫板 10‧‧‧Wall plate

1‧‧‧下殼板 1‧‧‧Shell plate

11‧‧‧上表面 11‧‧‧ upper surface

111‧‧‧內部區 111‧‧‧Internal area

112‧‧‧外部區 112‧‧‧External area

113‧‧‧毛細通道 113‧‧‧Capillary channel

114‧‧‧凹溝 114‧‧‧ Groove

12‧‧‧外周壁 12‧‧‧ peripheral wall

121‧‧‧平面 121‧‧‧ plane

2‧‧‧上殼板 2‧‧‧Upper shell

21‧‧‧下表面 21‧‧‧ Lower surface

211‧‧‧輔助通道 211‧‧‧Auxiliary channel

212‧‧‧下陷溝 212‧‧‧The ditch

22‧‧‧外環壁 22‧‧‧ outer ring wall

221‧‧‧平面 221‧‧‧ plane

3‧‧‧除氣孔 3‧‧‧ Venting holes

4‧‧‧封口部 4‧‧‧Seal

步驟a~步驟e Step a~step e

圖1 係本發明均溫板之製造方法之步驟流程圖。 BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is a flow chart showing the steps of a method for producing a temperature equalizing plate of the present invention.

圖2 係本發明上殼板欲對應上表面蓋合之示意圖。 2 is a schematic view of the upper cover plate of the present invention corresponding to the upper surface cover.

圖3 係本發明下殼板與上殼板的邊緣進行密封接合之示意圖。 Figure 3 is a schematic view showing the sealing joint of the lower shell and the upper shell of the present invention.

圖4 係本發明均溫板之剖面示意圖。 Figure 4 is a schematic cross-sectional view of a temperature equalizing plate of the present invention.

圖5 係本發明均溫板之另一剖面示意圖。 Figure 5 is a schematic cross-sectional view showing another embodiment of the temperature equalizing plate of the present invention.

圖6 係本發明凹溝與上殼板之間形成除氣孔之示意圖。 Figure 6 is a schematic view showing the formation of a degassing hole between the groove and the upper casing of the present invention.

圖7 係本發明下殼板朝凹溝方向以壓焊接方式形成封口部之立體分解圖。 Fig. 7 is an exploded perspective view showing the sealing portion of the lower casing plate of the present invention formed by pressure welding in the direction of the groove.

圖8 係本發明均溫板另一實施例之立體分解圖。 Figure 8 is a perspective exploded view of another embodiment of the temperature equalizing plate of the present invention.

圖9 係本發明均溫板另一實施例之立體組合圖。 Figure 9 is a perspective assembled view of another embodiment of the temperature equalizing plate of the present invention.

圖10 係本發明均溫板另一實施例之剖面示意圖。 Figure 10 is a schematic cross-sectional view showing another embodiment of the temperature equalizing plate of the present invention.

圖11 係本發明均溫板另一實施例之另一剖面示意圖。 Figure 11 is another cross-sectional view showing another embodiment of the temperature equalizing plate of the present invention.

有關本發明之詳細說明及技術內容,將配合圖式說明如下,然而所附圖式僅作為說明用途,並非用於侷限本發明。 The detailed description and technical content of the present invention will be described with reference to the accompanying drawings.

請參考圖1至7所示,本發明係提供一種無除氣凸部的均溫板及其製造方法,此均溫板10主要包括一下殼板1及一上殼板2。 Referring to FIGS. 1 to 7, the present invention provides a temperature equalizing plate without a degassing convex portion and a manufacturing method thereof. The temperature equalizing plate 10 mainly comprises a lower shell plate 1 and an upper shell plate 2.

如圖1所示,係本發明均溫板10之製造方法之步驟流程。第一步驟,如圖1之步驟a及圖2所示,提供一下殼板1,下殼板1具有一上表面11及一外周壁12,外周壁12具有一平面121,將上表面11區分為一內部區111及環設在內部區111外圍的一外部區112,內部區111具有相互連通的複數毛細通道113。 As shown in Fig. 1, it is a flow chart of the manufacturing method of the temperature equalizing plate 10 of the present invention. In the first step, as shown in step a of FIG. 1 and FIG. 2, a lower shell 1 is provided. The lower shell 1 has an upper surface 11 and an outer peripheral wall 12. The outer peripheral wall 12 has a flat surface 121, and the upper surface 11 is distinguished. An inner region 111 and an outer region 112 disposed at the periphery of the inner region 111 have internal capillary channels 113 that communicate with each other.

第二步驟,如圖1之步驟b及圖2所示,對外部區112開設有一凹溝114,凹溝114一端與至少其一毛細通道12相互連通,另一端貫穿於平面121。 In the second step, as shown in step b of FIG. 1 and FIG. 2, a groove 114 is defined in the outer region 112. One end of the groove 114 communicates with at least one of the capillary channels 12, and the other end penetrates the plane 121.

第三步驟,如圖1之步驟c及圖3至圖6所示,提供一上殼板2, 將上殼板2對應上表面11蓋合,並對下殼板1與上殼板2的邊緣進行密封接合作業,以令凹溝114與上殼板2之間形成一除氣孔3。 The third step, as shown in step c of FIG. 1 and FIG. 3 to FIG. 6, provides an upper shell plate 2, The upper surface of the upper shell 11 is covered by the upper surface 11 and the edges of the lower shell 1 and the upper shell 2 are sealed and joined to form a degassing hole 3 between the recess 114 and the upper shell 2.

第四步驟,如圖1之步驟d所示,提供一工作流體,透過除氣孔3將工作流體填充於毛細通道12並進行抽真空作業。 In the fourth step, as shown in step d of Fig. 1, a working fluid is supplied, and the working fluid is filled into the capillary channel 12 through the degassing hole 3 and evacuated.

第五步驟,如圖1之步驟e及圖7所示,對除氣孔3進行封口作業,封口作業為下殼板1朝凹溝114方向以壓焊接方式形成一封口部4,封口部4填封於除氣孔3。藉此,上述步驟a至步驟e以完成本發明均溫板10之成品。 In the fifth step, as shown in step e of FIG. 1 and FIG. 7, the degassing hole 3 is sealed. The sealing operation is such that the lower shell plate 1 is formed into a mouth portion 4 by pressure welding in the direction of the groove 114, and the sealing portion 4 is filled. Sealed in the degassing hole 3. Thereby, the above steps a to e are completed to complete the finished product of the temperature equalizing plate 10 of the present invention.

如圖2至圖6所示,下殼板1具有上表面11及外周壁12,外周壁12具有平面121,上表面11區分為內部區111及環設在內部區111外圍的外部區112,內部區111具有相互連通的複數毛細通道113,外部區112開設有凹溝114,凹溝114一端與至少其一毛細通道12相互連通,另一端貫穿於平面121。其中,各毛細通道12為顆粒燒結體、金屬網體、蝕刻溝槽或其組合所構成。 As shown in FIG. 2 to FIG. 6, the lower casing 1 has an upper surface 11 and a peripheral wall 12. The outer peripheral wall 12 has a flat surface 121. The upper surface 11 is divided into an inner portion 111 and an outer portion 112 disposed around the outer portion of the inner portion 111. The inner zone 111 has a plurality of capillary channels 113 communicating with each other. The outer zone 112 is provided with a groove 114. One end of the groove 114 communicates with at least one of the capillary channels 12, and the other end penetrates the plane 121. Wherein, each capillary channel 12 is composed of a particle sintered body, a metal mesh body, an etching groove or a combination thereof.

如圖2至圖6所示,上殼板2對應上表面11蓋合並與下殼板1相互密封接合,凹溝114與上殼板2之間形成除氣孔3。 As shown in FIG. 2 to FIG. 6 , the upper shell plate 2 is correspondingly covered with the upper surface 11 and sealed to the lower shell panel 1 , and a degassing hole 3 is formed between the recessed groove 114 and the upper shell plate 2 .

另外,上殼板2可為一平板或具有複數通道,如圖5至圖6所示,本實施例之上殼板2具有複數通道,但不以此為限制。詳細說明如下,上殼板2具有下表面21,下表面21與外部區112相互密封接合,且下表面21設有對應數個毛細通道12配置的複數輔助通道211。其中,各輔助通道211為顆粒燒結體、金屬網體、蝕刻溝槽或其組合所構成。 In addition, the upper shell 2 can be a flat plate or have a plurality of channels. As shown in FIG. 5 to FIG. 6 , the upper panel 2 of the embodiment has a plurality of channels, but is not limited thereto. As described in detail below, the upper casing 2 has a lower surface 21, the lower surface 21 and the outer zone 112 are sealingly joined to each other, and the lower surface 21 is provided with a plurality of auxiliary passages 211 corresponding to the plurality of capillary passages 12. Each of the auxiliary channels 211 is composed of a particle sintered body, a metal mesh body, an etching trench, or a combination thereof.

如圖7所示,凹溝114與下殼板1之間更具有填封於除氣孔3的封口部4,封口部4由下殼板1朝凹溝114方向進行壓焊接,使下殼板1的內壁與凹溝114的內壁相互貼接,以令封口部4填封於除氣孔3。 As shown in FIG. 7, the recessed portion 114 and the lower casing plate 1 further have a sealing portion 4 sealed in the degassing hole 3, and the sealing portion 4 is pressure-welded from the lower casing plate 1 toward the concave groove 114 to make the lower casing plate. The inner wall of 1 and the inner wall of the groove 114 are in contact with each other to seal the sealing portion 4 to the degassing hole 3.

如圖2至圖3及圖5所示,本發明均溫板10之組合及使用狀態,其係利用下殼板1具有上表面11及外周壁12,外周壁12具有平面121,上表面11區分為內部區111及環設在內部區111外 圍的外部區112,內部區111具有相互連通的數個毛細通道113,外部區112開設有凹溝114,凹溝114一端與其一毛細通道12相互連通,另一端貫穿於平面121;上殼板2對應上表面11蓋合並與下殼板1相互密封接合,凹溝114與上殼板2之間形成除氣孔3。藉此,下殼板1開設有凹溝114,凹溝114一端與至少其一毛細通道12相互連通,另一端貫穿於平面121,並凹溝114與上殼板2之間形成除氣孔3,因均溫板10直接自平面121向內開設有除氣孔3,使均溫板10省略習知的除氣凸部,以達到本發明均溫板10具有體積輕薄短小及精簡之優點。 As shown in FIG. 2 to FIG. 3 and FIG. 5, the combination and use state of the temperature equalizing plate 10 of the present invention utilizes the lower casing 1 having an upper surface 11 and an outer peripheral wall 12, and the outer peripheral wall 12 has a flat surface 121 and an upper surface 11 Divided into an inner zone 111 and a ring outside the inner zone 111 The outer portion 112 has a plurality of capillary channels 113 communicating with each other, and the outer portion 112 is provided with a groove 114. One end of the groove 114 communicates with a capillary channel 12, and the other end penetrates the plane 121; the upper plate 2 Corresponding to the upper surface 11 cover and sealing joint with the lower shell plate 1, a degassing hole 3 is formed between the groove 114 and the upper shell plate 2. Thereby, the lower shell plate 1 is provided with a groove 114, one end of the groove 114 communicates with at least one of the capillary channels 12, the other end penetrates the plane 121, and a degassing hole 3 is formed between the groove 114 and the upper shell plate 2, Since the temperature equalizing plate 10 is directly provided with the degassing hole 3 inward from the plane 121, the temperature equalizing plate 10 is omitted from the conventional degassing convex portion, so that the temperature equalizing plate 10 of the present invention has the advantages of being light and thin, short and compact.

請參考圖8至圖11所示,係本發明均溫板10之另一實施例,圖8至圖11之實施例與圖2至圖7之實施例大致相同,但圖8至圖11之實施例與圖2至圖7之實施例不同之處在於上殼板2設有一下陷溝212。 Please refer to FIG. 8 to FIG. 11 , which is another embodiment of the temperature equalizing plate 10 of the present invention. The embodiments of FIGS. 8 to 11 are substantially the same as the embodiments of FIGS. 2 to 7 , but FIGS. 8 to 11 . The embodiment differs from the embodiment of Figures 2 to 7 in that the upper casing 2 is provided with a lower trap 212.

進一步說明如下,上殼板2具有一外環壁22,外環壁22具有一平面221,下表面21設有與凹溝114呈相對配置的一下陷溝212,下陷溝212一端與至少其一輔助通道211相互連通,另一端貫穿於平面221,以令凹溝114與下陷溝212共同構成除氣孔3。藉此,以達到相同於圖2至圖7之實施例的功能及功效。 Further, the upper shell plate 2 has an outer ring wall 22 having a flat surface 221, and the lower surface 21 is provided with a lower recess 212 disposed opposite to the recess 114, one end of the recessed trench 212 and at least one of The auxiliary passages 211 are in communication with each other, and the other end is penetrated through the flat surface 221 so that the concave grooves 114 and the lower recessed grooves 212 together constitute the degassing holes 3. Thereby, the functions and effects similar to the embodiments of FIGS. 2 to 7 are achieved.

另外,凹溝114、下陷溝212、下殼板1與上殼板2之間更具有填封於除氣孔3的一封口部4,此封口部4由下殼板1朝凹溝114方向以壓焊接方式成型,及上殼板2朝下陷溝212方向以壓焊接方式成型,從而使下殼板1的內壁與上殼板2的內壁相互貼接,以達到封口部4填封於除氣孔3之功效。 In addition, the groove 114, the depression groove 212, the lower shell plate 1 and the upper shell plate 2 further have a mouth portion 4 sealed in the degassing hole 3, and the sealing portion 4 is directed from the lower shell plate 1 toward the groove 114. Formed by pressure welding, and the upper shell 2 is formed by pressure welding in the direction of the lower trap 212, so that the inner wall of the lower shell 1 and the inner wall of the upper shell 2 are adhered to each other, so that the sealing portion 4 is sealed. The effect of removing the pores 3.

此外,如圖7所示,封口部4設置在除氣孔3的開口端部,即為圖2至圖7之實施例中,下殼板1的內壁與凹溝114的內壁自除氣孔3的開口端部朝內部相互貼接一段距離;同理,封口部4設置在除氣孔3的開口端部,即為圖8至圖11之實施例中,下殼板1的內壁與上殼板2的內壁自除氣孔3的開口端部朝內部相互貼接一段距離。 Further, as shown in FIG. 7, the sealing portion 4 is provided at the open end of the degassing hole 3, that is, in the embodiment of FIGS. 2 to 7, the inner wall of the lower casing 1 and the inner wall of the groove 114 are self-degassing holes. The open ends of the 3 are attached to each other at a distance toward the inside; for the same reason, the sealing portion 4 is disposed at the open end of the degassing hole 3, that is, in the embodiment of FIGS. 8 to 11, the inner wall and the upper side of the lower shell 1 The inner walls of the shell 2 are attached to each other at a distance from the open end of the degassing hole 3 toward the inside.

或者,如圖11所示,封口部4設置在除氣孔3的中間段,即為 圖8至圖11之實施例中,下殼板1的內壁與上殼板2的內壁僅在除氣孔3的中間段相互貼接;同理,封口部4設置在除氣孔3的中間段,即為圖2至圖7之實施例中,下殼板1的內壁與凹溝114的內壁僅在除氣孔3的中間段相互貼接。 Alternatively, as shown in FIG. 11, the sealing portion 4 is disposed in the middle portion of the degassing hole 3, that is, In the embodiment of FIGS. 8 to 11, the inner wall of the lower casing 1 and the inner wall of the upper casing 2 are attached to each other only in the middle portion of the degassing hole 3; similarly, the sealing portion 4 is disposed in the middle of the degassing hole 3. In the embodiment shown in Figs. 2 to 7, the inner wall of the lower casing 1 and the inner wall of the groove 114 are attached to each other only in the intermediate portion of the degassing hole 3.

綜上所述,本發明之無除氣凸部的均溫板及其製造方法,亦未曾見於同類產品及公開使用,並具有產業利用性、新穎性與進步性,完全符合新型專利申請要件,爰依專利法提出申請,敬請詳查並賜准本案專利,以保障發明人之權利。 In summary, the uniform temperature plate without degassing convex portion of the present invention and the manufacturing method thereof have not been seen in similar products and are used publicly, and have industrial utilization, novelty and progress, and fully comply with the requirements for new patent applications. To file an application in accordance with the Patent Law, please check and grant the patent in this case to protect the rights of the inventor.

10‧‧‧均溫板 10‧‧‧Wall plate

114‧‧‧凹溝 114‧‧‧ Groove

12‧‧‧外周壁 12‧‧‧ peripheral wall

121‧‧‧平面 121‧‧‧ plane

2‧‧‧上殼板 2‧‧‧Upper shell

3‧‧‧除氣孔 3‧‧‧ Venting holes

Claims (13)

一種無除氣凸部的均溫板,包括:一下殼板,具有一上表面及一外周壁,該外周壁具有一平面,該上表面區分為一內部區及環設在該內部區外圍的一外部區,該內部區具有相互連通的複數毛細通道,該外部區開設有一凹溝,該凹溝一端與至少其一該毛細通道相互連通,另一端貫穿於該平面;以及一上殼板,對應該上表面蓋合並與該下殼板相互密封接合,該上殼板具有一下表面及一外環壁,該外環壁具有一平面,該下表面設有與該凹溝呈相對配置的一下陷溝,該下陷溝一端與至少其一該輔助通道相互連通,另一端貫穿於該平面,該凹溝與該下陷溝之間形成一除氣孔,該凹溝、該下陷溝、該下殼板與該上殼板之間更具有填封於該除氣孔的一封口部,該封口部由該下殼板朝該凹溝方向以壓焊接方式成型,及該上殼板朝該下陷溝方向以壓焊接方式成型,該下殼板的內壁與該上殼板的內壁相互貼接。 A temperature equalizing plate without a degassing convex portion, comprising: a lower shell plate having an upper surface and an outer peripheral wall, the outer peripheral wall having a plane, the upper surface being divided into an inner region and a ring disposed at a periphery of the inner region An outer zone having a plurality of capillary channels communicating with each other, the outer zone defining a groove, one end of the groove communicating with at least one of the capillary channels, the other end penetrating the plane; and an upper shell plate, Corresponding to the upper surface cover merging and sealingly engaging the lower shell plate, the upper shell plate has a lower surface and an outer ring wall, the outer ring wall has a plane, and the lower surface is provided with a surface disposed opposite to the groove a recessed groove, one end of the lower trap and at least one of the auxiliary passages communicate with each other, and the other end penetrates through the plane, and a deaeration hole is formed between the recess and the lower recess, the recess, the lower recess, and the lower shell And a top portion of the upper shell plate enclosing the degassing hole, the sealing portion is formed by pressure welding from the lower shell plate toward the groove, and the upper shell plate is oriented toward the lower trap Pressure welding molding, the The inner wall of the shell plate and the inner wall of the upper casing plate contact against one another. 如請求項1所述之無除氣凸部的均溫板,其中該凹溝與該下殼板之間更具有填封於該除氣孔的一封口部。 The temperature equalizing plate having no degassing protrusion according to claim 1, wherein the groove and the lower shell plate further have a mouth portion sealed in the degassing hole. 如請求項2所述之無除氣凸部的均溫板,其中該封口部由該下殼板朝該凹溝方向以壓焊接方式成型,該下殼板的內壁與該凹溝的內壁相互貼接。 The temperature equalizing plate having no degassing protrusion according to claim 2, wherein the sealing portion is formed by pressure welding from the lower shell plate toward the groove, the inner wall of the lower shell and the inner portion of the groove The walls are attached to each other. 如請求項3所述之無除氣凸部的均溫板,其中該封口部設置在該除氣孔的開口端部或該除氣孔的中間段。 A temperature equalizing plate having no degassing protrusion according to claim 3, wherein the sealing portion is provided at an open end of the degassing hole or an intermediate portion of the degassing hole. 如請求項1所述之無除氣凸部的均溫板,其中該下表面與該外部區相互密封接合,且該下表面設有對應該等毛細通道配置的複數輔助通道。 A temperature equalizing plate having no degassing protrusion according to claim 1, wherein the lower surface and the outer portion are in sealing engagement with each other, and the lower surface is provided with a plurality of auxiliary passages corresponding to the configuration of the capillary passage. 如請求項5所述之無除氣凸部的均溫板,其中該封口部設置在該除氣孔的開口端部或該除氣孔的中間段。 A temperature equalizing plate having no degassing protrusion according to claim 5, wherein the sealing portion is provided at an open end of the degassing hole or an intermediate portion of the degassing hole. 如請求項5所述之無除氣凸部的均溫板,其中該等毛細通道與 該等輔助通道分別為顆粒燒結體、金屬網體、蝕刻溝槽或其組合所構成。 A temperature equalizing plate having no degassing protrusions as claimed in claim 5, wherein the capillary channels are The auxiliary channels are respectively composed of a particle sintered body, a metal mesh body, an etched trench, or a combination thereof. 一種無除氣凸部的均溫板之製造方法,包括:a)提供一下殼板,該下殼板具有一上表面及一外周壁,該外周壁具有一平面,將該上表面區分為一內部區及環設在該內部區外圍的一外部區,該內部區具有相互連通的複數毛細通道;b)對該外部區開設有一凹溝,該凹溝一端與至少其一該毛細通道相互連通,另一端貫穿於該平面;c)提供一上殼板,將該上殼板對應該上表面蓋合,並對該下殼板與該上殼板的邊緣進行密封接合作業,該上殼板具有一下表面及一外環壁,該外環壁具有一平面,該下表面設有與該凹溝呈相對配置的一下陷溝,該下陷溝一端與至少其一該輔助通道相互連通,另一端貫穿於該平面,以令該凹溝與該下陷溝之間形成一除氣孔;d)提供一工作流體,透過該除氣孔將該工作流體填充於該等毛細通道並進行抽真空作業;以及e)對該除氣孔進行封口作業,該封口作業為該下殼板朝該凹溝方向進行壓焊接,及該上殼板朝該下陷溝方向進行壓焊接,使該下殼板的內壁與該上殼板的內壁相互貼接而形成一封口部,以令該封口部填封於該除氣孔。 A method for manufacturing a temperature equalizing plate without a degassing convex portion, comprising: a) providing a lower shell plate having an upper surface and an outer peripheral wall, the outer peripheral wall having a plane, the upper surface being divided into one An inner zone and an outer zone disposed at a periphery of the inner zone, the inner zone having a plurality of capillary channels communicating with each other; b) a groove formed in the outer zone, the one end of the groove being interconnected with at least one of the capillary channels The other end runs through the plane; c) provides an upper shell plate, the upper shell plate is correspondingly covered with the upper surface, and the lower shell plate is sealed and joined with the edge of the upper shell plate, the upper shell plate Having a lower surface and an outer ring wall, the outer ring wall has a flat surface, the lower surface is provided with a lower recess opposite to the concave groove, and one end of the lower trap communicates with at least one of the auxiliary passages, and the other end Through the plane, a degassing hole is formed between the groove and the lower ditch; d) providing a working fluid, filling the working fluid through the degassing hole and performing vacuuming operation; and ) sealing the degassing hole Orbiting operation, the sealing operation is that the lower shell plate is pressure welded in the direction of the groove, and the upper shell plate is pressure welded in the direction of the lower trap groove, so that the inner wall of the lower shell plate and the inner wall of the upper shell plate They are attached to each other to form a mouth portion, so that the sealing portion is filled in the degassing hole. 如請求項8所述之無除氣凸部的均溫板之製造方法,其中步驟e)中該封口作業為該下殼板朝該凹溝方向進行壓焊接,使該下殼板的內壁與該凹溝的內壁相互貼接而形成一封口部,以令該封口部填封於該除氣孔。 The method for manufacturing a temperature equalizing plate having no degassing protrusion according to claim 8, wherein in the step e), the sealing operation is that the lower shell plate is pressure welded in the direction of the groove so that the inner wall of the lower shell is The inner wall of the groove is adhered to each other to form a mouth portion, so that the sealing portion is filled in the degassing hole. 如請求項9所述之無除氣凸部的均溫板之製造方法,其中該封口部設置在該除氣孔的開口端部或該除氣孔的中間段。 A method of manufacturing a temperature equalizing plate having no degassing convex portion according to claim 9, wherein the sealing portion is provided at an open end of the degassing hole or an intermediate portion of the degassing hole. 如請求項8所述之無除氣凸部的均溫板之製造方法,其中步驟c)中該上殼板具有一下表面,該下表面與該外部區相互密封接合,且該下表面設有對應該等毛細通道配置的複數輔助通道。 The method for manufacturing a temperature equalizing plate having no degassing protrusion according to claim 8, wherein in the step c), the upper casing has a lower surface, the lower surface and the outer portion are sealingly joined to each other, and the lower surface is provided A plurality of auxiliary channels that should be configured for the capillary channel. 如請求項11所述之無除氣凸部的均溫板之製造方法,其中 該封口部設置在該除氣孔的開口端部或該除氣孔的中間段。 A method for manufacturing a temperature equalizing plate having no degassing convex portion according to claim 11, wherein The sealing portion is provided at an open end of the degassing hole or an intermediate portion of the degassing hole. 如請求項11所述之無除氣凸部的均溫板之製造方法,其中該等毛細通道與該等輔助通道分別為顆粒燒結體、金屬網體、蝕刻溝槽或其組合所構成。 The method for manufacturing a temperature equalizing plate without degassing protrusions according to claim 11, wherein the capillary channels and the auxiliary channels are respectively composed of a particle sintered body, a metal mesh body, an etching groove, or a combination thereof.
TW104118900A 2015-06-11 2015-06-11 Vapor chamber without degassing protrusion and manufacturing method thereof TWI598557B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW104118900A TWI598557B (en) 2015-06-11 2015-06-11 Vapor chamber without degassing protrusion and manufacturing method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW104118900A TWI598557B (en) 2015-06-11 2015-06-11 Vapor chamber without degassing protrusion and manufacturing method thereof

Publications (2)

Publication Number Publication Date
TW201643362A TW201643362A (en) 2016-12-16
TWI598557B true TWI598557B (en) 2017-09-11

Family

ID=58055892

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104118900A TWI598557B (en) 2015-06-11 2015-06-11 Vapor chamber without degassing protrusion and manufacturing method thereof

Country Status (1)

Country Link
TW (1) TWI598557B (en)

Also Published As

Publication number Publication date
TW201643362A (en) 2016-12-16

Similar Documents

Publication Publication Date Title
US9726436B2 (en) Vapor chamber having no gas discharging protrusion and manufacturing method thereof
TWI707118B (en) Temperature plate
TWI658248B (en) Vapor chamber water-filling section sealing structure and manufacturing method thereof
TWI598554B (en) Thin vapor chamber and manufacturing method thereof
TWI601933B (en) Heat-conducting structure
TWI517927B (en) Sealing structure and sealing method of temperature plate
JP3186291U (en) Soaking plate structure
US20110315351A1 (en) Vapor chamber having composite supporting structure
TW201709999A (en) Method of producing improved vapor chamber achieves the purpose of improving production efficiency and saving time and labor power
TWM562957U (en) Combination reinforced structure of heat dissipation unit
TWI598557B (en) Vapor chamber without degassing protrusion and manufacturing method thereof
TWI774012B (en) Vapor chamber
TWI738179B (en) Thin heat dissipation device and manufacturing method thereof
TWI682144B (en) Integrated vapor chamber and method thereof
TWM549332U (en) Vapor chamber
TW201940829A (en) Vapor chamber and manufacturing method thereof
TW201940828A (en) Vapor chamber
TWI754124B (en) Manufacturing method of vaper chamber
TWI710742B (en) Vapor chamber
TWM590263U (en) Isothermal plate seal structure
TWI679394B (en) Ultra-thin heat sink
CN107846819A (en) Heat abstractor is airtight to run through structure
TW201315359A (en) Heat dissipation device and a manufacturing method thereof
TW202130960A (en) Temperature regulating board
TWI804767B (en) Vapor chamber structure and capillary structure thereof