TWI597742B - Transparent conductive body and touch panel - Google Patents

Description

Transparent conductor and touch panel

The present invention relates to a transparent conductor and a touch panel using the same.

The transparent conductor can be used as a display of a liquid crystal display (LCD), a plasma display panel (PDP), an electroluminescence panel (organic EL, inorganic EL), or the like, and a transparent electrode of a solar cell or the like. Moreover, in addition to these, it can also be used for an electromagnetic wave shielding film, an anti-infrared film, etc. As a material of the metal oxide layer in the transparent conductor, ITO in which tin (Sn) is added to indium oxide (In ₂ O ₃ ) is widely used.

In recent years, terminals such as smart phones and tablet terminals that have touch panels are rapidly spreading. These systems have a configuration in which a touch sensor portion is provided on a liquid crystal panel and a cover glass is provided on the outermost surface. The touch sensor unit is formed by attaching one or two thin films on which one or two ITO films are formed by sputtering on one surface or both surfaces of a glass or a film substrate.

With the increase in the size of the touch panel and the high precision of the touch sensor function, a transparent conductor having high transmittance and low resistance has been sought. In order to reduce the electric resistance of the transparent conductor using the ITO film, it is necessary to thicken the film thickness of the ITO film or to crystallize the ITO film by thermal annealing. However, if the ITO film is thickened, the transmittance is lowered. In addition, it is generally difficult to thermally anneal the film substrate at a high temperature. Therefore, the ITO film provided on the film substrate has a situation in which it is difficult to maintain high transmittance and reduce electric resistance.

In such a case, a transparent conductive film having a laminated structure of a metal oxide layer containing a zinc oxide as a main component and a metal layer is proposed (for example, Patent Document 1).

[Previous Technical Literature] [Patent Literature]

Patent Document 1: Japanese Patent Laid-Open No. Hei 9-291355

In the use of a touch panel or the like, the detection of the touch position is performed by patterning the transparent conductive film into a conductive portion and an insulating portion. Therefore, in a transparent conductor having a laminated structure of a metal oxide layer and a metal layer, it is sought to remove the metal oxide layer and the metal layer together by etching. However, in the laminated structure of the metal oxide layer and the metal layer containing zinc oxide as a main component, there is a case where it is difficult to remove the metal oxide layer and the metal layer by etching together.

Therefore, the present invention provides a transparent conductor which can easily pattern a metal oxide layer and a metal layer, and the transparent conductor has a laminated structure of a metal oxide layer containing a zinc oxide as a main component and a metal layer. Further, the present invention provides a touch panel that can be easily manufactured by using such a transparent conductor.

An aspect of the present invention provides a transparent conductor in which a transparent resin substrate, a first metal oxide layer, a metal layer containing a silver alloy, and a second metal oxide layer, a second metal, are sequentially laminated The oxide layer contains ZnO as a main component and contains In ₂ O ₃ , TiO ₂ , Ga ₂ O _{3 ,} and GeO ₂ as subcomponents, and the content of TiO ₂ is relative to ZnO, In ₂ O ₃ , TiO ₂ , Ga ₂ O _{3 .} The total of the five components of GeO ₂ is 12 mol% or less.

Such a transparent conductor has a laminated structure, and the laminated structure includes a second metal oxide layer constituting the outermost surface and a metal layer containing a silver alloy. The second metal oxide layer and the metal layer can be easily removed together by etching. In addition, a transparent conductor having high transparency, high conductivity, and excellent corrosion resistance can be produced. Therefore, it can be suitably used for applications requiring etching such as a touch panel.

In a plurality of embodiments, the total content of ZnO in the second metal oxide layer may be 72 to 85 mol based on the total of the five components of ZnO, In ₂ O ₃ , TiO ₂ , Ga ₂ O _{3 ,} and GeO _{2 .} %. The content of In ₂ O ₃ may be 4 to 13 mol% based on the total of the above five components. The content of TiO ₂ may be 3 to 12 mol% based on the total of the above five components. The content of Ga ₂ O ₃ may be 3 to 9 mol% based on the total of the above five components. The content of GeO ₂ may be 3 to 12 mol% based on the total of the above five components. By containing ZnO, In ₂ O ₃ , TiO ₂ , Ga ₂ O _{3 ,} and GeO ₂ in the above ratio, the transparency, conductivity, corrosion resistance, and etching property of the second metal oxide layer can be sufficiently improved.

Further, in some embodiments, the second metal oxide layer may have specific crystallinity. Thereby, the second metal oxide layer has alkali resistance in addition to etching properties. In the patterning step of the transparent conductive film obtained by the wet method, patterning is performed using a photoresist, and finally, photoresist peeling is performed, and an alkali solution is used for resist stripping. Therefore, when patterning by the wet method, it is preferable that the metal oxide layer has both alkali resistance which can be dissolved in an acid to be etched and not dissolved in a base.

In several embodiments, the first metal oxide layer contains ZnO as a main component, and contains In ₂ O ₃ , TiO ₂ , Ga ₂ O _{3 ,} and GeO ₂ as auxiliary components, and the content of TiO ₂ is relative to ZnO and In. The total of the five components of ₂ O ₃ , TiO ₂ , Ga ₂ O ₃ and GeO ₂ may be 12 mol% or less. Thereby, the first metal oxide layer, the second metal oxide layer, and the metal layer can be easily removed by etching. In addition, a transparent electric conductor having high transparency, high electrical conductivity, and excellent corrosion resistance can be produced.

In several embodiments, the metal layer may have a thickness of 4 to 11 nm. Thereby, the transparency of the transparent conductor can be sufficiently improved, and the surface resistance can be lowered. In some embodiments, the silver alloy may be an alloy of Ag and at least one metal selected from the group consisting of Pd, Cu, Nd, In, Sn, and Sb.

Another aspect of the present invention provides a touch panel having a sensor film on a panel, the sensor film being composed of the transparent conductor. Since such a touch panel has a sensor film composed of the above transparent conductor, it can be easily manufactured.

According to the invention, it is possible to provide a transparent conductor in which a metal oxide layer and a metal layer can be easily patterned in a transparent conductor having a laminated structure of a metal oxide layer containing a zinc oxide as a main component and a metal layer. Further, in the invention of the present invention, a touch panel which can be easily manufactured by using such a transparent conductor can be provided.

10‧‧‧Transparent resin substrate

12‧‧‧1st metal oxide layer

14‧‧‧2nd metal oxide layer

16‧‧‧metal layer

15a, 15b‧‧‧ sensor electrodes

17, 18‧‧‧ optical glue

19‧‧‧ glass cover

20‧‧‧hard coating

22‧‧‧1st hard coat

24‧‧‧2nd hard coat

50‧‧‧Conductor lines

70‧‧‧ panel

80‧‧‧ electrodes

90‧‧‧Adhesive

92‧‧‧shims

100, 101‧‧‧ Transparent conductor

100a‧‧‧Y sensor film

100b‧‧‧X sensor film

200‧‧‧ touch panel

Fig. 1 is a cross-sectional view schematically showing an embodiment of a transparent conductor.

Fig. 2 is a cross-sectional view schematically showing another embodiment of a transparent conductor.

3 is a schematic cross-sectional view showing a part of a cross section of an embodiment of a touch panel in an enlarged manner.

4(A) and 4(B) are thin sensor tubes constituting one embodiment of the touch panel Plan view of the membrane.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, the present invention is not limited to any of the following embodiments. In the drawings, the same or equivalent elements are designated by the same reference numerals, and the repeated description is omitted as appropriate.

Fig. 1 is a schematic cross-sectional view showing an embodiment of a transparent conductor. The transparent conductor 100 has a laminated structure in which a film-shaped transparent resin substrate 10, a first metal oxide layer 12, a metal layer 16, and a second metal oxide layer 14 are sequentially disposed.

"Transparent" in this specification means that visible light penetrates, and light can be scattered to some extent. The degree of scattering of light differs depending on the level required for the use of the transparent conductor 100. The case of what is commonly referred to as translucent light scattering is also included in the concept of "transparency" in this specification. It is preferred that the degree of scattering of light is small, and it is preferred that the transparency is high. The total light transmittance of the entire transparent conductor 100 is, for example, 80% or more, preferably 83% or more, and more preferably 85% or more. The total light transmittance is a transmittance including diffused transmitted light obtained by using an integrating sphere, and can be measured using a commercially available haze meter.

The transparent resin substrate 10 is not particularly limited, and may be a flexible organic resin film. The organic resin film may also be an organic resin sheet. Examples of the organic resin film include polyester films such as polyethylene terephthalate (PET) and polyethylene naphthalate (PEN), polyolefin films such as polyethylene and polypropylene, and polycarbonate. Film, acrylic film, drop An ene film, a polyarylate film, a polyether ruthenium film, a diethyl fluorene-based cellulose film, a triethylene fluorene-based cellulose film, or the like. Among these, a polyester film such as polyethylene terephthalate (PET) or polyethylene naphthalate (PEN) is preferable.

The transparent resin substrate 10 is preferably thick from the viewpoint of rigidity. On the other hand, from the viewpoint of thinning the transparent conductor 100, the transparent resin substrate 10 is preferably thin. From such a viewpoint, the thickness of the transparent resin substrate 10 is, for example, 10 to 200 μm. The refractive index of the transparent resin substrate 10 is, for example, from 1.50 to 1.70 from the viewpoint of producing a transparent conductor having excellent optical properties. Further, the refractive index in the present specification is a value measured under conditions of λ = 633 nm and a temperature of 20 °C.

The transparent resin substrate 10 preferably has high dimensional stability upon heating. The flexible organic resin film usually produces dimensional changes caused by expansion or contraction by heating during film formation. In the case of uniaxial stretching or biaxial stretching, a transparent resin substrate 10 which is low in cost and thin in thickness can be produced. When the extraction electrode is formed, if the transparent conductor 100 is heated, dimensional changes occur due to heat shrinkage. These dimensional changes can be measured in accordance with ASTM D1204-02 or JIS-C-2151. The dimensional change rate before and after the heat treatment was determined by the following formula when the size before heating was set to L _o and the size after heating was set to L.

Dimensional change rate (%) = 100 × (LL _o ) / L _o

In the case where the dimensional change rate (%) is a positive number, it indicates that expansion has occurred by heat treatment; in the case of a negative number, it indicates that shrinkage has occurred by heat treatment. The dimensional change rate of the biaxially stretched transparent resin substrate 10 can be measured in both the progress direction (MD direction) and the lateral direction (TD direction) at the time of stretching. The dimensional change rate of the transparent resin substrate 10 is, for example, -1.0 to -0.3% in the MD direction and -0.1 to +0.1% in the TD direction.

The transparent resin substrate 10 may be subjected to at least one surface treatment selected from the group consisting of corona discharge treatment, glow discharge treatment, flame treatment, ultraviolet irradiation treatment, electron beam irradiation treatment, and ozone treatment. The transparent resin substrate 10 may be a resin film. By using a resin film, the transparent conductor 100 can be made into a conductor excellent in flexibility. Therefore, it is not limited to a transparent conductor used for a touch panel, and can also be used as a transparent electrode or an electromagnetic wave mask for flexible organic EL illumination or the like.

For example, in the case where the transparent conductor 100 is used as a sensor film constituting a touch panel, the transparent resin substrate 10 can also use a flexible organic resin film to enable external input to fingers, pens, and the like. Moderately deformed.

The second metal oxide layer 14 is a transparent layer containing an oxide containing ZnO as a main component and containing In ₂ O ₃ , TiO ₂ , Ga ₂ O _{3 ,} and GeO ₂ as a subcomponent, and the content of TiO ₂ is relative to ZnO. The total of the five components of In ₂ O ₃ , TiO ₂ , Ga ₂ O ₃ and GeO ₂ is 12 mol% or less. The main component referred to herein is a component having the highest molar content in the five components of ZnO, In ₂ O ₃ , TiO ₂ , Ga ₂ O ₃ and GeO ₂ . The accessory component is a component other than the above-mentioned five components. Since the second metal oxide layer 14 contains ZnO as a main component, it is excellent in economy. Further, the second metal oxide layer 14 having both high conductivity and high transparency can be formed without using ITO. Thereby, the second metal oxide layer 14 having a low surface resistance can be obtained without performing thermal annealing.

In the second metal oxide layer 14 , the content of the TiO ₂ is 12 mol% or less, preferably 10 mol% or less, from the viewpoint of sufficiently improving the etching property. In addition, the content of the TiO ₂ in the second metal oxide layer 14 is preferably 3 mol% or more, and more preferably 4 mol% or more from the viewpoint of sufficiently improving the storage stability. If the content of TiO ₂ is too large, the laminated structure of the second metal oxide layer 14 and the metal layer 16 becomes impossible to etch. In addition, the resistance value also deteriorates. On the other hand, if the content of TiO ₂ is too small, the storage stability of the above laminated structure is lowered.

In the second metal oxide layer 14 , the content of ZnO is, for example, 72 mol % or more, and preferably 75 mol % or more from the viewpoint of sufficiently improving the transmittance and conductivity from the total of the above five components. In the second metal oxide layer 14 , the content of ZnO is, for example, 85 mol % or less, preferably 82 mol % or less, from the viewpoint of sufficiently improving the storage stability with respect to the total of the above five components. When the content of ZnO is too large, it tends to cause white turbidity when stored in a high-temperature and high-humidity environment. On the other hand, if the content of ZnO is too small, the transmittance and conductivity tend to be lowered.

In the second metal oxide layer 14 , the content of the In ₂ O ₃ is preferably 13 mol% or less from the viewpoint of sufficiently reducing the surface resistance and sufficiently increasing the transmittance. 11 mol% or less. In the second metal oxide layer 14 , the content of the In ₂ O ₃ is, for example, 4 mol% or more, and preferably 6 mol% or more from the viewpoint of sufficiently improving the storage stability. When the content of In ₂ O ₃ is too large, the surface resistance tends to be high and the transmittance tends to decrease. On the other hand, when the content of In ₂ O ₃ is too small, white turbidity tends to occur when stored in a high-temperature and high-humidity environment, and the surface resistance tends to be high.

In the second metal oxide layer 14 , the content of the Ga ₂ O ₃ is preferably 9 mol% or less from the viewpoint of sufficiently reducing the surface resistance and sufficiently increasing the transmittance. 7 mol% or less. In the second metal oxide layer 14 , the content of the Ga ₂ O ₃ is, for example, 3 mol% or more, and preferably 3.5 mol% or more, from the viewpoint of sufficiently improving the storage stability. When the content of Ga ₂ O ₃ is too large, the surface resistance tends to be high. On the other hand, when the content of Ga ₂ O ₃ is too small, white turbidity tends to occur when stored in a high-temperature and high-humidity environment, and the surface resistance tends to be high.

In the second metal oxide layer 14 , the content of the GeO ₂ is, for example, 12 mol% or less, preferably 10 mol%, from the viewpoint of sufficiently reducing the surface resistance and sufficiently increasing the transmittance. the following. In the second metal oxide layer 14 , the content of the GeO ₂ is preferably 3 mol% or more, and preferably 3.5 mol% or more from the viewpoint of sufficiently improving the storage stability with respect to the total of the above five components. When the content of GeO ₂ is too large, the surface resistance tends to be high and the transmittance tends to decrease. On the other hand, when the content of GeO ₂ is too small, the surface resistance tends to be high when stored in a high-temperature, high-humidity environment.

The second metal oxide layer 14 preferably has specific crystallinity. The second metal oxide layer has alkali resistance in addition to etching properties by having specific crystallinity. The crystallinity of the second metal oxide layer 14 is obtained by X-ray diffraction (XRD) analysis of the thin film of the formed second metal oxide layer 14, and the specific crystallinity in the present invention means that it is caused by ZnO. The value obtained by dividing the peak intensity of the diffraction peak of XRD by the film thickness (unit: nm) of the film of the second metal oxide layer 14 is 50 or more. The second crystalline metal oxide layer 14 having a low crystallinity of less than 50 does not exhibit sufficient alkali resistance.

The second metal oxide layer 14 has a function of adjusting optical characteristics, protecting the metal layer 16, and ensuring conductivity. The second metal oxide layer 14 may contain a trace component or an unavoidable component in addition to the above five components within a range that does not greatly impair the function. However, from the viewpoint of producing the transparent conductor 100 having sufficiently high characteristics, it is preferable that the total ratio of the five components in the second metal oxide layer 14 is high. The ratio is, for example, 95 mol% or more, preferably 97 mol% or more. Further, the second metal oxide layer 14 is preferably free of ITO.

The first metal oxide layer 12 and the second metal oxide layer 14 may be the same in thickness, structure, and composition, or may be different. The description of the composition of the second metal oxide layer 14 can be directly applied to the first metal oxide layer 12. First metal oxidation The material layer 12 has the same composition as that of the second metal oxide layer 14, so that the first metal oxide layer 12, the metal layer 16, and the second metal oxide layer 14 can be removed by etching. In addition, transparency and corrosion resistance can be further improved.

The first metal oxide layer 12 may have a different composition from the second metal oxide layer 14. In this case, only the second metal oxide layer 14 and the metal layer 16 are removed by etching, and the first metal oxide layer 12 can be directly left. Further, it is preferable that the first metal oxide layer 12 also has specific crystallinity.

The thickness of the first metal oxide layer 12 and the second metal oxide layer 14 is, for example, 10 to 70 nm from the viewpoint of being suitable for the thickness of various touch panels.

The first metal oxide layer 12 and the second metal oxide layer 14 can be produced by a vacuum film formation method such as a vacuum deposition method, a sputtering method, an ion plating method, or a CVD method. Among these, from the viewpoint of being able to downsize the film forming chamber and the film forming speed, a sputtering method is preferred. As the sputtering method, DC magnetron sputtering can be cited. As the target, an oxide target, a metal or a semimetal target can be used.

A wiring electrode or the like may be provided on the second metal oxide layer 14. The current of the metal layer 16 to be described later is conducted from the wiring electrode or the like provided on the second metal oxide layer 14 via the second metal oxide layer 14 . Therefore, the second metal oxide layer 14 preferably has high conductivity. From such a viewpoint, the surface resistance value of the single film of the second metal oxide layer 14 is, for example, preferably 1.0 × 10 ^{+ 7} Ω / □ (= 1.0E + 7 Ω / sq.) or less, and further preferably 5.0 × 10 ^{+ 6} Below Ω/□.

The metal layer 16 is a layer containing a silver alloy as a main component. Since the metal layer 16 has high conductivity, the surface resistance of the transparent conductor 100 can be sufficiently reduced. Examples of the metal element constituting the silver alloy include Ag and at least one selected from the group consisting of Pd, Cu, Nd, In, Sn, and Sb. As an example of the silver alloy, Ag-Pd, Ag-Cu, Ag-Pd-Cu, Ag-Nd-Cu, Ag-In-Sn, and Ag-Sn-Sb.

The metal layer 16 may contain an additive in addition to the silver alloy. The additive is preferably easily removed by an etchant. The content of the silver alloy in the metal layer 16 may be, for example, 90% by mass or more, or may be 95% by mass or more. The thickness of the metal layer 16 is, for example, 1 to 30 nm. The thickness of the metal layer 16 is preferably from 4 to 11 nm from the viewpoint of sufficiently reducing the surface resistance of the transparent conductor 100 and sufficiently increasing the total light transmittance. If the thickness of the metal layer 16 is too large, the total light transmittance tends to decrease. On the other hand, if the thickness of the metal layer 16 is too small, the surface resistance tends to be high.

The metal layer 16 has a function of adjusting the total light transmittance and surface resistance of the transparent electric conductor 100. The metal layer 16 can be produced by a vacuum film formation method such as a vacuum deposition method, a sputtering method, an ion plating method, or a CVD method. Among these, from the viewpoint of being able to downsize the film forming chamber and the film forming speed, a sputtering method is preferred. As the sputtering method, DC magnetron sputtering can be cited. As the target, a metal target can be used.

At least a part of the first metal oxide layer 12 and the second metal oxide layer 14 and at least a part of the metal layer 16 in the transparent conductor 100 can be removed by etching or the like.

Fig. 2 is a schematic cross-sectional view showing another embodiment of a transparent conductor. The transparent conductor 101 is different from the transparent conductor 100 in that a pair of hard coat layers 20 are provided so as to sandwich the transparent resin substrate 10 . The other configuration is the same as that of the transparent conductor 100.

The transparent conductor 101 is provided as a pair of hard coat layers 20 on the main surface of the transparent resin substrate 10 on the side of the first metal oxide layer 12, and is provided with the first hard coat layer 22 and oxidized on the first metal with the transparent resin substrate 10. The second hard coat layer 24 is provided on the main surface on the side opposite to the object layer 12 side. That is, the transparent conductor 101 has the second hard coat layer 24, the transparent resin substrate 10, the first hard coat layer 22, the first metal oxide layer 12, the metal layer 16, and the second metal laminated in this order. A laminated structure of the oxide layer 14. The thickness, structure, and composition of the first hard coat layer 22 and the second hard coat layer 24 may be the same or different. Further, it is not always necessary to provide both the first hard coat layer 22 and the second hard coat layer 24, and only one of them may be provided.

By providing the hard coat layer 20, the damage generated on the transparent resin substrate 10 can be sufficiently suppressed. The hard coat layer 20 contains a cured resin obtained by curing a resin composition. The resin composition preferably contains at least one selected from the group consisting of a thermosetting resin composition, an ultraviolet curable resin composition, and an electron beam curable resin composition. The thermosetting resin composition may contain at least one selected from the group consisting of an epoxy resin, a phenol oxygen resin, and a melamine resin.

The resin composition is, for example, a composition containing a curable compound having an energy ray-reactive group such as a (meth) acrylonitrile group or a vinyl group. Further, the expression of the (meth)acryl fluorenyl group means at least one of an acryloyl group and a methacryl group. The curable compound is preferably a polyfunctional monomer or oligomer containing two or more, preferably three or more, energy ray-reactive groups in one molecule.

The curable compound preferably contains an acrylic monomer. Specific examples of the acrylic monomer include 1,6-hexanediol di(meth)acrylate, triethylene glycol di(meth)acrylate, and ethylene oxide-modified bisphenol A di(methyl). Acrylate, trimethylolpropane tri(meth)acrylate, trimethylolpropane ethylene oxide modified tri(meth)acrylate, trimethylolpropane propylene oxide modified tri(meth)acrylate , pentaerythritol tetra (meth) acrylate, ditrimethylolpropane tetra (meth) acrylate, dipentaerythritol penta (meth) acrylate, dipentaerythritol hexa (meth) acrylate, pentaerythritol tri (methyl) Acrylate, 3-(meth)acryloxyglycerol mono(meth)acrylate, and the like. However, it is not necessarily limited to these. For example, a polyurethane modified acrylate, an epoxy modified acrylate, or the like can also be exemplified.

As the curable compound, a compound having a vinyl group can also be used. Examples of the compound having a vinyl group include ethylene glycol divinyl ether, pentaerythritol divinyl ether, 1,6-hexanediol divinyl ether, trimethylolpropane divinyl ether, and ethylene oxide modification. Hydroquinone divinyl ether, ethylene oxide modified bisphenol A divinyl ether, pentaerythritol trivinyl ether, dipentaerythritol hexavinyl ether, and ditrimethylolpropane polyvinyl ether. However, it is not necessarily limited to these.

In the case where the curable compound is cured by ultraviolet rays, the resin composition contains a photopolymerization initiator. As the photopolymerization initiator, various substances can be used. For example, it can be suitably selected from well-known compounds, such as an acetophenone, a benzoin, a benzophenone, and a thioxanone. More specifically, DAROCUR 1173, IRGACURE 651, IRGACURE 184, IRGACURE 907 (all of which are trade names, manufactured by Ciba Specialty Chemicals Inc.), and KAYACURE DETX-S (trade name, manufactured by Nippon Kayaku Co., Ltd.) can be cited. .

The mass of the photopolymerization initiator may be from 0.01 to 20% by mass or from 0.5 to 5% by mass based on the mass of the curable compound. The resin composition may also be a known resin composition in which a photopolymerization initiator is added to an acrylic monomer. Examples of the resin composition in which the photopolymerization initiator is added to the acrylic monomer include SD-318 (trade name, manufactured by Dainippon Ink and Chemicals Co.) and XNR5535 (trade name, which are ultraviolet curable resins). Changchun Industry Co., Ltd. manufactures) and so on.

The resin composition may contain organic fine particles and/or inorganic fine particles in order to increase the strength of the coating film and/or adjust the refractive index and the like. Examples of the organic fine particles include organic fine particles, crosslinked acrylic fine particles, and crosslinked polystyrene fine particles. Examples of the inorganic fine particles include cerium oxide fine particles, alumina fine particles, zirconia fine particles, titanium oxide fine particles, and iron oxide fine particles. among them, Preferred are cerium oxide microparticles.

The microparticles are preferably treated with a decane coupling agent for their surfaces, and energy ray-reactive groups such as (meth)acryl fluorenyl groups and/or vinyl groups are present in a film form on the surface. If microparticles having such reactivity are used, the microparticles react with each other upon irradiation of the energy ray, or the microparticles react with the polyfunctional monomer or oligomer, so that the strength of the film can be enhanced. It is preferred to use cerium oxide microparticles treated with a decane coupling agent containing a (meth) acrylonitrile group.

The average particle diameter of the fine particles is smaller than the thickness of the hard coat layer 20, and may be 100 nm or less or 20 nm or less from the viewpoint of ensuring sufficient transparency. On the other hand, from the viewpoint of production of the colloidal solution, it may be 5 nm or more, or may be 10 nm or more. In the case of using the organic fine particles and/or the inorganic fine particles, the total amount of the organic fine particles and the inorganic fine particles may be, for example, 5 to 500 parts by mass, or may be 20 to 200 parts by mass, per 100 parts by mass of the curable compound.

When a resin composition hardened by energy rays is used, the resin composition can be cured by irradiation with an energy ray such as ultraviolet rays. Therefore, it is also preferred to use such a resin composition from the viewpoint of the production steps.

The first hard coat layer 22 can be produced by applying a solution or dispersion of a resin composition onto one surface of the transparent resin substrate 10, drying it, and curing the resin composition. The coating at this time can be carried out by a known method. Examples of the coating method include an extrusion nozzle method, a blade coating method, a knife method, a bar coating method, a contact coating method, a contact reverse coating method, and a gravure method. Roll coating method, dipping method, reverse roll coating method, direct roll coating method, curtain coating method, extrusion method, and the like. Similarly to the first hard coat layer 22, the second hard coat layer 24 can be formed on the other surface of the transparent resin substrate 10.

The thickness of the first hard coat layer 22 and the second hard coat layer 24 is, for example, 0.5 to 10 μm. When the thickness exceeds 10 μm, thickness unevenness, wrinkles, and the like tend to occur. On the other hand, when the thickness is less than 0.5 μm, when the transparent resin substrate 10 contains a relatively small amount of a low molecular weight component such as a plasticizer or an oligomer, it may be difficult to sufficiently suppress the bleeding of these components. Further, from the viewpoint of suppressing the bending, the thicknesses of the first hard coat layer 22 and the second hard coat layer 24 are preferably the same.

The refractive indices of the first hard coat layer 22 and the second hard coat layer 24 are, for example, 1.40 to 1.60. The absolute value of the difference in refractive index between the transparent resin substrate 10 and the first hard coat layer 22 is preferably 0.1 or less. The absolute value of the difference in refractive index between the transparent resin substrate 10 and the second hard coat layer 24 is also preferably 0.1 or less. By reducing the absolute value of the difference in refractive index between the first hard coat layer 22 and the second hard coat layer 24 and the transparent resin substrate 10, the thickness of the first hard coat layer 22 and the second hard coat layer 24 can be suppressed. The intensity of uneven interference that occurs unevenly.

The thickness of each layer constituting the transparent conductors 100 and 101 can be measured by the following procedure. The transparent conductors 100, 101 were cut by a focused ion beam apparatus (FIB, Focused Ion Beam) to obtain a cross section. The cross section was observed using a transmission electron microscope (TEM), and the thickness of each layer was measured. The measurement is preferably carried out at 10 or more positions which are arbitrarily selected, and the average value thereof is determined. As a method of obtaining a cross section, a microtome can also be used as a device other than the focused ion beam device. As a method of measuring the thickness, a scanning electron microscope (SEM) can also be used. Alternatively, the film thickness can be measured using a fluorescent X-ray apparatus.

The thickness of the transparent conductors 100 and 101 may be 200 μm or less, or may be 150 μm or less. As long as it is such a thickness, the required level of thinning can be sufficiently satisfied. The total light transmittance of the transparent conductors 100, 101 may be a high value of, for example, 85% or more. In addition, the surface resistance value (4-terminal method) of the transparent conductors 100 and 101 does not advance even if The thermal annealing of the first metal oxide layer 12 and the second metal oxide layer 14 may be, for example, 30 Ω/□ or less, or may be 25 Ω/□ or less.

The transparent conductors 100 and 101 having the above-described configuration have a laminated structure in which the first metal oxide layer 12, the metal layer 16, and the second metal oxide layer 14 are laminated. This laminated structure can be easily removed together using a usual etching liquid. In addition, it has a high transmittance and has high conductivity even without thermal annealing. Therefore, it can be preferably used as a sensor film for a touch panel.

FIG. 3 is a schematic cross-sectional view showing a part of a cross section of the touch panel 200 including a pair of sensor films. 4(A) and 4(B) are plan views of the sensor films 100a and 100b using the above-described transparent conductor 100. The touch panel 200 includes a pair of sensor films 100a and 100b that are disposed to face each other by the optical glue 18. The touch panel 200 is configured such that the touch position of the contact body can be calculated as a coordinate position (lateral position and vertical position) in a plane parallel to the two-dimensional coordinate (X-Y coordinate) of the panel 70 that serves as the screen.

Specifically, the touch panel 200 includes a sensor film 100a for longitudinal position detection (hereinafter referred to as "Y sensor film") attached to the optical adhesive 18, and a sensor film for lateral position detection. 100b (hereinafter referred to as "X sensor film"). On the lower surface side of the X sensor film 100b, a spacer 92 is provided between the X sensor film 100b and the panel 70 of the display device.

The upper side of the Y sensor film 100a (the side opposite to the side of the panel 70) is provided with a glass cover 19 by the optical glue 17. In other words, the touch panel 200 has a laminated structure in which the X sensor film 100b, the Y sensor film 100a, and the cover glass 19 are arranged in this order from the panel 70 side.

Detecting the Y position sensor film 100a in the longitudinal position and detecting the lateral position The X sensor film 100b is composed of the above transparent conductor 100. The Y sensor film 100a and the X sensor film 100b have a sensor electrode 15a and a sensor electrode 15b as conductive portions in such a manner as to face the glass cover 19.

The sensor electrode 15a is composed of a first metal oxide layer 12, a second metal oxide layer 14, and a metal layer 16. As shown in FIG. 4(A), the sensor electrode 15a extends in the longitudinal direction (y direction) in such a manner as to be able to detect the touch position in the longitudinal direction (y direction). The plurality of sensor electrodes 15a are arranged in parallel with each other in the longitudinal direction (y direction). One end of the sensor electrode 15a is connected to the electrode 80 on the side of the driving IC by a conductor line 50 formed of a silver paste.

The X-sensor film 100b for detecting the lateral position has a sensor electrode 15b on the opposite side to the Y-sensor film 100a. The sensor electrode 15b is composed of a first metal oxide layer 12, a second metal oxide layer 14, and a metal layer 16. As shown in FIG. 4(B), the sensor electrode 15b extends in the lateral direction (x direction) so as to be able to detect the lateral (x-direction) touch position. The plurality of sensor electrodes 15b are arranged in parallel with each other in the lateral direction (x direction). One end of the sensor electrode 15b is connected to the electrode 80 on the side of the driving IC by a conductor line 50 formed of a silver paste.

The sensor tube film 100a for Y and the sensor film 100b for X are orthogonal to each other when viewed from the stacking direction of the sensor film 100a for Y and the sensor film 100b for X, with the respective sensor electrodes 15a, 15b. The method is overlapped by the optical glue 18. The Y sensor film 100a is provided with a glass cover 19 on the side opposite to the X sensor film 100b side by the optical glue 17. The optical glues 17, 18, the glass cover 19, and the panel 70 can use a usual substance.

The conductor line 50 and the electrode 80 in FIGS. 4(A) and (B) may be made of a conductive material such as metal (for example, Ag). The conductor line 50 and the electrode 80 can be exemplified by Such as screen printing for patterning.

The shape and number of the sensor electrodes 15a and 15b in each of the sensor films 100a and 100b are not limited to those shown in Figs. 3, 4(A) and 4(B). For example, the number of the sensor electrodes 15a, 15b can also be increased to improve the detection accuracy of the touch position.

The X sensor film 100b is provided with a panel 70 on the side opposite to the Y sensor film 100a side by a spacer 92. The spacer 92 may be disposed at a position corresponding to the shape of the sensor electrodes 15a, 15b and a position surrounding the entirety of the sensor electrodes 15a, 15b. The spacer 92 may be formed of a light transmissive material such as PET (polyethylene terephthalate) resin. One end of the spacer 92 is bonded to the lower surface of the X sensor film 100b by an optical adhesive or a light-transmitting adhesive 90 such as acrylic or epoxy. The other end of the spacer 92 is adhered to the panel 70 of the display device by an adhesive 90. As described above, by arranging the X sensor film 100b and the face plate 70 via the spacer 92, the slit S can be provided between the X sensor film 100b and the panel 70 of the display device.

A control unit (IC) is electrically connected to the electrode 80. The change in capacity of each of the sensor electrodes 15a and 15b due to a change in electrostatic capacitance between the fingertip and the Y sensor film 100a of the touch panel 200 is measured. The control unit can calculate the touch position of the contact body as a coordinate position (the intersection of the position in the X-axis direction and the position in the Y-axis direction) based on the measurement result. Further, in addition to the above, various methods known in the art for driving the sensor electrodes and calculating the coordinate position may be employed.

The touch panel 200 can be manufactured in the following order. After the transparent conductor 100 is prepared, the first metal oxide layer 12, the metal layer 16, and the second metal oxide layer 14 are etched and patterned. Specifically, the photoresist is applied on the surface of the second metal oxide layer 14 by spin coating using a photolithography technique. Thereafter, in order to improve the adhesion, prebaking may be performed. Next, configure the mask pattern and Exposure is carried out and developed with a developing solution, thereby forming a photoresist pattern. The formation of the photoresist pattern is not limited to the photolithography method, and may be formed by screen printing or the like.

Next, the transparent conductor 100 in which the photoresist pattern is formed is immersed in the acidic etching solution, and the first metal oxide layer 12, the second metal oxide layer 14, and the metal layer 16 in the portion where the photoresist pattern is not formed are dissolved and removed. Thereafter, the photoresist is removed, whereby the Y sensor film 100a on which the sensor electrode 15a is formed and the X sensor film 100b on which the sensor electrode 15b is formed can be obtained.

When the first metal oxide layer 12 and the second metal oxide layer 14 have different compositions, if the first metal oxide layer 12 is made of a composition that is not removed by etching, the metal layer 16 and the second metal oxide layer are formed. 14 is etched together, and the first metal oxide layer 12 may be directly left after etching. As the etching liquid, an etching solution of an inorganic acid can be used. For example, a phosphoric acid-based etching solution is preferred.

Next, a metal paste such as a silver alloy paste is applied to form a conductor line 50 and an electrode 80. Thereby, the control unit (not shown) and the sensor electrodes 15a and 15b are electrically connected. Next, the Y sensor film 100a and the X sensor film 100b are attached to the same direction with the respective sensor electrodes 15a and 15b using the optical glue 18. In this case, when viewed from the stacking direction of the Y sensor film 100a and the X sensor film 100b, the sensor electrodes 15a and 15b are attached to each other so as to be orthogonal to each other. Then, the glass cover 19 and the Y sensor film 100a are attached using the optical glue 17. Thereby, the touch panel 200 can be manufactured.

In the touch panel 200, the transparent conductor 100 is used as the Y sensor film 100a and the X sensor film 100b. The transparent conductor 100 can remove the first metal oxide layer 12, the second metal oxide layer 14, and the metal layer 16 by etching. Thereby, the manufacturing process of the touch panel 200 can be simplified, and the touch panel 200 can be easily manufactured.

Further, it is not necessary to use the transparent conductor 100 for both the Y sensor film 100a and the X sensor film 100b, and any other transparent conductor may be used. Even with such a touch panel, the display can be made sufficiently clear. Further, as the sensor film, the transparent conductor 101 may be used instead of the transparent conductor 100.

Thus, the transparent conductors 100 and 101 can be preferably used for a touch panel. However, the use thereof is not limited to the touch panel. For example, the first metal oxide layer 12, the second metal oxide layer 14, and the metal layer 16 may be processed into a specific shape by etching to form the first metal oxide layer. 12. The second metal oxide layer 14 and the portion (the conductive portion) of the metal layer 16 and the portion (non-conductive portion) not including the first metal oxide layer 12, the second metal oxide layer 14, and the metal layer 16 are Used for transparent electrodes, antistatic, electromagnetic waves in various display devices such as liquid crystal displays (LCDs), plasma display panels (PDPs), electroluminescent panels (organic EL, inorganic EL), electrochromic devices, and electronic paper. For masks. In addition, it can also be used as an antenna.

The preferred embodiments of the present invention have been described above, but the present invention is not limited to the above embodiments. For example, the transparent conductor 101 described above has a pair of hard coat layers 20, but may be provided with only one of the first hard coat layer 22 and the second hard coat layer 24. Further, a hard coat layer may be provided on one surface of the transparent resin substrate 10, and a plurality of optical adjustment layers may be provided on the other surface by coating. In this case, the first metal oxide layer 12, the metal layer 16, and the second metal oxide layer 14 may be provided on the optical adjustment layer. Further, the transparent conductors 100, 101 may be provided with any layer at any position other than the above layers within a range that does not greatly impair the function.

[Examples]

The present invention will be specifically described below by way of examples and comparative examples, but the present invention is not limited to these examples.

[Examples 1 to 18] (Production of Transparent Conductor 101)

A transparent conductor as shown in Fig. 2 was produced. The transparent conductor has a laminated structure in which a transparent resin substrate sandwiched between a pair of hard coat layers, a first metal oxide layer, a metal layer, and a second metal oxide layer are laminated in this order. The transparent conductors of the respective examples were produced in the following manner.

A polyethylene terephthalate film (manufactured by Toray Industries, Inc., model: U48) having a thickness of 100 μm was prepared. This PET film was used as a transparent resin substrate. The first hard coat layer and the second hard coat layer preparation paint were prepared in the following order.

First, prepare the following raw materials.

. Reactive group modified phthalic acid gel (dispersion medium: propylene glycol monomethyl ether acetate, no Volatile component: 40% by weight): 100 parts by weight

. Dipentaerythritol hexaacrylate: 48 parts by weight

. 1,6-hexanediol diacrylate: 12 parts by weight

. Photopolymerization initiator (1-hydroxycyclohexyl phenyl ketone): 2.5 parts by weight

The above raw materials were diluted and mixed with a solvent (propylene glycol monomethyl ether (PGMA)) to disperse the components in a solvent. Thus, a coating material having a nonvolatile content (NV) of 25.5% by weight was prepared. The coating thus obtained was used as a coating material for the first hard coat layer and the second hard coat layer.

A coating material for producing a first hard coat layer was applied to one surface of a transparent resin substrate to prepare a coating film. After removing the solvent in the coating film in a hot air drying oven set at 80 ° C, ultraviolet rays having an integrated light amount of 400 mJ/cm ² were irradiated with a UV treatment apparatus to cure the coating film. Thus, a first hard coat layer having a thickness of 5 μm was formed on one surface of the transparent resin substrate. Similarly, a second hard coat layer having a thickness of 5 μm was formed on the other surface of the transparent resin substrate.

The first metal oxide layer, the metal layer, and the second metal oxide layer are sequentially formed on the first hard coat layer by DC magnetron sputtering. The first metal oxide layer and the second metal oxide layer were formed using a ZnO-In ₂ O ₃ —TiO ₂ —Ga ₂ O ₃ —GeO ₂ target having the composition shown in Table 1. The first metal oxide layer and the second metal oxide layer in each of the examples are formed using targets having the same composition. The composition of the first metal oxide layer and the second metal oxide layer in each of the examples is shown in Table 1. The thickness of the first metal oxide layer and the second metal oxide layer in each of the examples was 50 nm.

In all of the examples shown in Table 1, the metal layer was formed using a target of AgPdCu (Ag: Pd: Cu = 99.0: 0.5: 0.5 (% by mass)). The metal layer 16 has a thickness of 5 nm.

(Evaluation of Transparent Conductor 101)

The etching characteristics were evaluated in the following order. First, a PAN-based etching solution containing phosphoric acid, acetic acid, and nitric acid is prepared. The transparent conductor of each example was immersed in the etching solution at room temperature for 1 minute, and etched. Thereafter, the total light transmittance was measured to determine whether or not the first metal oxide layer, the metal layer, and the second metal oxide layer were dissolved. Specifically, the total light transmittance of the sample after etching was determined to be "A" only when the total light transmittance of the transparent resin substrate was matched, and the case where the inconsistency was determined as "B". The total light transmittance (transmittance) was measured using a haze meter (trade name: NDH-7000, manufactured by Nippon Denshoku Industries Co., Ltd.). The evaluation results are shown in Table 1.

Use 4-terminal resistivity meter (trade name: Loresta GP, Mitsubishi Chemical The surface resistance of each of the examples was measured. The results are shown in Table 1. In Table 1, "surface resistance (1)" is a surface resistance value obtained by preserving a transparent conductor in an environment of 85 ° C and 85% RH (relative humidity: 85%) for 50 hours, and "surface resistance (2)" is The surface resistance value after storage in the above environment.

After the transparent conductor of each example was stored in an environment of 85 ° C and 85% RH, the storage stability was evaluated by visual observation. The case where white turbidity was observed in the transparent conductor was judged as "B", and the case where it was not seen was judged as "A". The results are shown in Table 1.

As shown in Table 1, the evaluation of the etching characteristics was "A" in all the examples. From this, it was confirmed that the metal oxide layer and the metal layer in the transparent conductors of Examples 1 to 18 can be easily removed. The transparent conductors of Examples 13 and 14 had the highest total light transmittance, but the storage stability was evaluated as B. For the storage stability, for example, a noise mask such as a noise mask that does not seek such a high level of transparency (for example, a noise mask or the like) is a level that can be sufficiently used. Further, the total light transmittance of the transparent conductors of Examples 15 and 16 was slightly lower because the content of In ₂ O ₃ was high, and thus the absorption rate was increased. However, in the case of the total light transmittance, there is no problem in practical use in the case where the wiring electrode is not required to be electrically connected to the second metal oxide layer. Further, the transparent conductors of Examples 17 and 18 had a slightly lower total light transmittance, which was because the content of GeO ₂ was high, and thus the absorption rate was increased.

In order to evaluate the characteristics of the metal oxide layer, a sample of only a metal oxide layer (single layer) was produced in the same manner as described above. The evaluation of the sample was carried out in the same manner as described above. The results of the evaluation are shown in Table 2. In addition, the absorptivity of Table 2 is a value obtained by the equation of 100-penetration-reflectance=absorption rate using the measurement result of the transmittance and the reflectance measured by the spectroscope. This absorption rate is a value at a wavelength of 380 nm.

As shown in Table 2, it was confirmed that the absorption rate of the metal oxide layer of each Example was sufficiently low. Further, it has been confirmed that even if ZnO is contained as a main component, by containing In ₂ O ₃ , TiO ₂ , Ga ₂ O _{3 ,} and GeO ₂ as subcomponents, and having a specific TiO ₂ content, etching characteristics and conductivity can be improved. Sex.

[Examples 19 to 29]

A transparent conductor was produced in the same manner as in Example 1 except that the composition of the target when the metal layer was formed was changed, and the composition of the metal layer was changed and/or the thickness of the metal layer was changed as shown in Table 3. That is, the thickness of the metal layer was changed in Examples 19 to 25. In Example 26, a metal layer was formed using an AgNdCu (Ag:Nd:Cu=99.0:0.5:0.5 (% by mass)) target. In Example 27, a metal layer was formed using an AgInSn (Ag:In:Sn=99.0:0.5:0.5 (% by mass)) target. In Example 28, a metal layer was formed using an AgSnSb (Ag:Sn:Sb=99.0:0.5:0.5 (% by mass)) target. In Example 29, a metal layer was formed using an AgCu (Ag: Cu = 99.5: 0.5 (% by mass)) target.

The evaluation of the transparent conductors of Examples 19 to 29 obtained in the same manner as in Example 1 was carried out. The evaluation results are shown in Table 3. Further, the compositions and thicknesses of the metal oxide layers of Examples 19 to 29 were the same as in Example 1.

According to the results shown in Table 3, the evaluation of etching characteristics in any of the examples The price is "A". From this, it was confirmed that the metal oxide layer and the metal layer in the transparent conductors of Examples 19 to 29 can be easily removed. In addition, when the thickness of the metal layer is increased, it is confirmed that the surface resistance tends to be small, and the total light transmittance tends to decrease. In addition, when the silver alloy contains Pd, it is confirmed that the storage stability is particularly excellent.

[Examples 30 to 32]

In the embodiment 30, when the first metal oxide layer, the metal layer, and the second metal oxide layer are sequentially formed by DC magnetron sputtering on the first hard coat layer, the first metal oxide layer and the second metal oxide layer In the same manner as in Example 1, except that the ZnO-In ₂ O ₃ -TiO ₂ -Ga ₂ O ₃ -GeO ₂ target having the composition shown in Table 4 was used as the metal oxide layer, argon was used only for the sputtering gas. Further, in Examples 31 and 32, the first metal oxide layer and the second metal oxide layer used the target having the same composition as that of Example 30, and the sputtering gas used argon and oxygen as shown in Table 4. Mixed gas is formed.

With respect to the transparent conductors in the respective examples, alkali resistance was evaluated in the following order. A KOH solution having a concentration of 3 wt% was prepared. The transparent conductors of the respective examples were immersed in the alkali solution at room temperature for 2 minutes. Thereafter, the total light transmittance was measured to determine whether or not the first metal oxide layer, the metal layer, and the second metal oxide layer were dissolved. Specifically, the case where the total light transmittance of the sample immersed in the alkali solution coincides with the total light transmittance before immersion is determined as "A", and the case where the sample does not match is determined as "B". The total light transmittance (transmittance) was measured using a haze meter (trade name: NDH-7000, manufactured by Nippon Denshoku Industries Co., Ltd.). The evaluation results are shown in Table 4.

Further, a single-layer second metal oxide layer (thickness: 70 nm) similar to the second metal oxide layer in Examples 30 to 32 was prepared, and the XRD peak intensity in the vicinity of 2θ = 32.2 deg of ZnO was measured. Divide the measurement result and the XRD peak intensity by the first The values obtained for the 2 metal oxide layer and the full width at half maximum of the XRD peak are shown in Table 4. As described above, the transparent conductor having the metal oxide having specific crystallinity has excellent alkali resistance in addition to excellent etching properties.

[Comparative Examples 1 to 2]

The transparent conductors of Comparative Examples 1 and 2 were produced in the same manner as in Example 1 except that the target having the composition shown in Table 5 was used as the target for forming the first metal oxide layer and the second metal oxide layer. In each of the comparative examples, the first metal oxide layer and the second metal oxide layer were formed using targets having the same composition. The composition of the first metal oxide layer and the second metal oxide layer in each comparative example is shown in Table 5. The respective characteristics of the transparent conductor of each comparative example were evaluated in the same manner as in the first embodiment. The results are shown in Table 5.

As shown in Table 5, it was confirmed that the metal oxide having a content of TiO ₂ outside the range of the present invention has five components including ZnO-In ₂ O ₃ -TiO ₂ -Ga ₂ O ₃ -GeO _{2 .} The transparent conductor of the layer is not sufficiently etched.

(industrial availability)

According to the disclosure, a transparent electric conductor capable of easily patterning a metal oxide layer and a metal layer can be provided. In addition, according to the content of the present disclosure, by using such a transparent conductor, a touch panel that can be easily manufactured can be provided.

10‧‧‧Transparent resin substrate

12‧‧‧1st metal oxide layer

14‧‧‧2nd metal oxide layer

16‧‧‧metal layer

100‧‧‧Transparent conductor

Claims (4)

A transparent conductor comprising a transparent resin substrate, a first metal oxide layer, a metal layer containing a silver alloy, and a second metal oxide layer; wherein the first metal oxide layer contains ZnO as a main component And containing In ₂ O ₃ , TiO ₂ , Ga ₂ O _{3 ,} and GeO ₂ as subcomponents, and the content of TiO ₂ is relative to five components of ZnO, In ₂ O ₃ , TiO ₂ , Ga ₂ O _{3 ,} and GeO ₂ . a total of 12 mol% or less; the silver alloy is an alloy of Ag and at least one metal selected from the group consisting of Pd, Cu, Nd, In, Sn, and Sb; and the second metal oxide layer contains ZnO as a main component and contains _{in 2 O 3, TiO 2,} Ga 2 O 3 and GeO ₂ as an accessory component, TiO ₂ content with respect to the _{2 O 3, TiO 2, Ga} 2 O 3 and GeO ₂ of the five components ZnO, in the total of 12mol % or less; among the layers of the first metal oxide layer and the second metal oxide layer, the content of ZnO is five components of ZnO, In ₂ O ₃ , TiO ₂ , Ga ₂ O ₃ and GeO ₂ the total of 72 ~ 85mol%, the content of in ₂ O ₃ with respect to the total of five components is 4 ~ 13mol%, TiO ₂ content with respect to the five kinds of It divided the total of 3 ~ 12mol%, the content of Ga ₂ O ₃ with respect to the total of five components 3 ~ 9mol%, GeO ₂ content with respect to the total of five components 3 ~ 12mol%. The transparent conductor according to claim 1, wherein the second metal oxide layer has a specific crystallinity, and the specific crystallinity is a peak intensity of a diffraction peak due to XRD of ZnO divided by a second metal oxide. The film thickness (unit nm) of the film of the object layer has a crystallinity of 50 or more. The transparent conductor of claim 1 or 2, wherein the metal layer has a thickness of 4 to 11 nm. A touch panel is provided with a sensor film on a panel, and the sensor film is composed of a transparent conductor of any one of claims 1 to 3.