TWI596994B - Tear-resistant structure of the flexible circuit board - Google Patents
Tear-resistant structure of the flexible circuit board Download PDFInfo
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- TWI596994B TWI596994B TW103105584A TW103105584A TWI596994B TW I596994 B TWI596994 B TW I596994B TW 103105584 A TW103105584 A TW 103105584A TW 103105584 A TW103105584 A TW 103105584A TW I596994 B TWI596994 B TW I596994B
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- circuit board
- flexible circuit
- section
- cutting
- extending
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/028—Bending or folding regions of flexible printed circuits
- H05K1/0281—Reinforcement details thereof
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/028—Bending or folding regions of flexible printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09145—Edge details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/2009—Reinforced areas, e.g. for a specific part of a flexible printed circuit
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structure Of Printed Boards (AREA)
Description
本發明係為一種軟性電路板的結構設計,尤指一種軟性電路板的防撕裂結構。 The invention is a structural design of a flexible circuit board, in particular a tearproof structure of a flexible circuit board.
在現今使用的各種電子裝置中,由於信號線傳輸量越來越大,故所需要的信號傳輸線即越來越多。在信號傳輸線技術中,以軟性電路板為目前最具發展性之技術,軟性電路板具有重量輕、體積小等特性,主要係為配合各類外型系統產品的組裝條件,以提高配線密度特性作為訊號連接或元件組裝的電路載體,由於軟性電路板可以接主動、被動或模組元件,因此軟板亦具有機構性之特點。 In various electronic devices used today, since the amount of signal line transmission is increasing, more and more signal transmission lines are required. In the signal transmission line technology, the flexible circuit board is the most developed technology at present, and the flexible circuit board has the characteristics of light weight and small volume, and is mainly used to meet the assembly conditions of various external type system products to improve the wiring density characteristics. As a circuit carrier for signal connection or component assembly, since the flexible circuit board can be connected to active, passive or module components, the soft board is also mechanical.
傳統的軟性電路板在佈線的末端做防撕裂孔,防止軟性電路板的切割線因拉扯、折疊、通過軸孔或維修操作時產生撕裂。由於傳統的軟性電路板佈線簡單,線與線之間的間距夠大足以用大圓形做防撕裂孔,防止軟性電路板的切割線因拉扯或折疊時產生撕裂。 Conventional flexible boards make tear-proof holes at the ends of the wiring, preventing the cutting lines of the flexible circuit board from tearing due to pulling, folding, passing through the shaft holes or maintenance operations. Since the conventional flexible circuit board is simple in wiring, the line-to-line spacing is large enough to make a tear-proof hole with a large circle, preventing the cutting line of the flexible circuit board from being torn due to pulling or folding.
隨著現今技術的改良,軟性電路板的佈線複雜度較高造成線與線的間距較小,習知的防撕裂孔設計較大會影響軟性電路板的佈線,故要如何在不影響佈線的有限空間裡防止軟性電路板的切割線因拉扯、折疊、通過軸孔或維修操作時產生撕裂。解決上述習知技術之不足,即為從事此行業相關業者所亟欲研發之課題。 With the improvement of the current technology, the wiring complexity of the flexible circuit board is relatively high, resulting in a small line-to-line spacing. The conventional tear-proof hole design greatly affects the wiring of the flexible circuit board, so how to not affect the wiring The limited space prevents the cutting line of the flexible circuit board from tearing due to pulling, folding, passing through the shaft hole or maintenance operation. To solve the above-mentioned shortcomings of the prior art, that is, the subject of research and development that is relevant to those engaged in this industry.
緣此,本發明的目的是提供一種軟性電路板的防撕裂結 構,在不影響佈線的有限空間裡藉由軟性電路板在延伸區段形成有至少一切割線,該切割線的末端延伸出有一應力導向切割段,防止軟性電路板的切割線因拉扯或折疊時產生撕裂。 Accordingly, it is an object of the present invention to provide a tear-proof junction of a flexible circuit board. Forming at least one cutting line in the extending section by a flexible circuit board in a limited space that does not affect the wiring, the end of the cutting line extending a stress guiding cutting section to prevent the cutting line of the flexible circuit board from being pulled or folded There is a tear.
本發明為解決習知技術之問題所採用之技術手段係在一軟性電路板的延伸區段形成有至少一切割線,且在該切割線的至少一末端延伸出有一應力導向切割段,該應力導向切割段的切割方向係與該延伸方向間呈一角度差,以作為該軟性電路板的防撕裂結構。 The technical means adopted by the present invention to solve the problems of the prior art is that at least one cutting line is formed in an extended section of a flexible circuit board, and a stress guiding cutting section is extended at at least one end of the cutting line. The cutting direction of the guiding cutting section is at an angular difference from the extending direction as a tear-proof structure of the flexible circuit board.
該軟性電路板的該應力導向切割段可呈一直線、弧形、S形之一,亦可在該應力導向切割段的終止端更連通形成有一防撕裂孔,該撕裂孔作為一應力阻絶結構,而有效加強防撕裂的效果。 The stress guiding cutting section of the flexible circuit board may be in the shape of a straight line, an arc, or an S shape, or may be further connected to form a tear preventing hole at the terminating end of the stress guiding cutting section, the tearing hole serving as a stress resistance Absolute structure, and effectively strengthen the anti-tear effect.
其中該軟性電路板的外緣對應於該切割線處,更形成有一凹部,該軟性電路板的該延伸區段更沿著該切割線及該凹部,將該軟性電路板予以折疊。其中該軟性電路板的該延伸區段更以一螺旋構件或一捲束構件予以捲束。 Wherein the outer edge of the flexible circuit board corresponds to the cutting line, and a recess is formed, and the extended section of the flexible circuit board further folds the flexible circuit board along the cutting line and the recess. Wherein the extended section of the flexible circuit board is further wound by a spiral member or a bundle member.
其中該軟性電路板係可為軟性扁平排線(FFC)、軟性印刷電路板(FPC)之一。 The flexible circuit board can be one of a soft flat cable (FFC) and a flexible printed circuit board (FPC).
在功效方面,本發明藉由應力導向切割段,使得在該軟性電路板的佈線複雜度較高造成線與線的間距較小且不影響佈線的有限空間裡,該應力導向切割段會順應佈線路徑及改變角度方向,達到防止軟性電路板的切割線因拉扯、折疊、通過軸孔或維修操作時產生撕裂。 In terms of efficacy, the present invention guides the cutting segment by stress, so that the stress-oriented cutting segment conforms to the wiring in a case where the wiring complexity of the flexible circuit board is high and the line-to-line spacing is small and the wiring is not affected. The path and the direction of the angle are changed to prevent the cutting line of the flexible circuit board from being torn due to pulling, folding, passing through the shaft hole or maintenance operation.
本發明所採用的具體實施例,將藉由以下之實施例及附呈圖式作進一步之說明。 The specific embodiments of the present invention will be further described by the following examples and the accompanying drawings.
100‧‧‧軟性電路板 100‧‧‧Soft circuit board
101‧‧‧第一連接區段 101‧‧‧First connection section
102‧‧‧第二連接區段 102‧‧‧Second connection section
103‧‧‧延伸區段 103‧‧‧Extended section
1‧‧‧導線 1‧‧‧ wire
11‧‧‧差模信號線 11‧‧‧Differential signal line
12‧‧‧差模信號線 12‧‧‧Differential signal line
2‧‧‧切割線 2‧‧‧ cutting line
21‧‧‧末端 End of 21‧‧‧
22‧‧‧應力導向切割段 22‧‧‧stress-oriented cutting section
23‧‧‧凹部 23‧‧‧ recess
24‧‧‧焊墊 24‧‧‧ solder pads
25‧‧‧電子元件 25‧‧‧Electronic components
26‧‧‧焊接腳 26‧‧‧welding feet
3‧‧‧電子裝置 3‧‧‧Electronic devices
31‧‧‧轉軸構件 31‧‧‧Shaft members
32‧‧‧軸孔 32‧‧‧Axis hole
4‧‧‧螺旋構件 4‧‧‧Spiral components
5‧‧‧防撕裂孔 5‧‧‧Anti-corruption hole
6‧‧‧弧形應力導向切割段 6‧‧‧Arc-shaped stress-oriented cutting section
7‧‧‧S形應力導向切割段 7‧‧‧S-shaped stress-oriented cutting section
P‧‧‧信號腳位 P‧‧‧ signal pin
M‧‧‧延伸方向 M‧‧‧ extending direction
θ‧‧‧角度差 Θ‧‧‧angle difference
圖1顯示本發明第一實施例之示意圖。 Figure 1 shows a schematic view of a first embodiment of the invention.
圖2顯示圖1中的局部擴大示意圖。 Figure 2 shows a partial enlarged view of Figure 1.
圖3顯示圖1中的局部擴大立體示意圖。 Figure 3 shows a partially enlarged perspective view of Figure 1.
圖4顯示在應用時軟性電路板受到折疊之示意圖。 Figure 4 shows a schematic diagram of the flexible circuit board being folded during application.
圖5顯示一螺旋構件捲束在軟性電路板的延伸區段之示意圖。 Figure 5 shows a schematic view of a helical member bundle in an extended section of a flexible circuit board.
圖6顯示一捲束構件捲束在軟性電路板的延伸區段之示意圖。 Figure 6 shows a schematic view of a bundle of bundle members in an extended section of a flexible circuit board.
圖7顯示軟性電路板的延伸區段通過一電子裝置的轉軸構件之軸孔之示意圖。 Figure 7 is a schematic illustration of the axial section of the extension member of the flexible circuit board through the hinge member of an electronic device.
圖8顯示軟性電路板的其中一端佈設複數個焊墊,可供電子元件的焊接腳焊著連接之示意圖。 FIG. 8 shows a schematic diagram of a plurality of solder pads disposed on one end of the flexible circuit board for solder joints of the electronic components.
圖9顯示本發明第二實施例之示意圖。 Figure 9 is a schematic view showing a second embodiment of the present invention.
圖10顯示本發明第三實施例之示意圖。 Fig. 10 is a view showing a third embodiment of the present invention.
圖11顯示本發明第四實施例之示意圖。 Figure 11 is a view showing a fourth embodiment of the present invention.
請參閱圖1及圖2,其中圖1係顯示本發明第一實施例之示意圖,圖2係顯示圖1中的局部擴大示意圖。如圖所示,一軟性電路板100包括有一第一連接區段101、一第二連接區段102、以及連接在該第一連接區段101與該第二連接區段102之間的延伸區段103,該延伸區段103以一延伸方向M延伸。 Please refer to FIG. 1 and FIG. 2, wherein FIG. 1 is a schematic view showing a first embodiment of the present invention, and FIG. 2 is a partially enlarged schematic view of FIG. As shown, a flexible circuit board 100 includes a first connection section 101, a second connection section 102, and an extension connected between the first connection section 101 and the second connection section 102. In the segment 103, the extension section 103 extends in an extending direction M.
延伸區段103包括有以延伸方向M延伸的複數條導線1,各導線1分別連接至佈設在該第一端及該第二端的對應信號腳位P。該導線1中可包括有電力線、接地線、信號線,亦可以包括有至少一對呈對佈設的差模信號線11、12,用以載送差模信號。 The extending section 103 includes a plurality of wires 1 extending in an extending direction M, and the wires 1 are respectively connected to corresponding signal pins P disposed at the first end and the second end. The wire 1 may include a power line, a ground line, and a signal line, and may also include at least one pair of differential mode signal lines 11 and 12 disposed to carry the differential mode signal.
同時參閱圖3所示,在該延伸區段103形成有至少一切割線2,該切割線2係沿著該延伸方向M延伸,而在該切割線2的兩端各別形成一末端21。該軟性電路板100的外緣對應於該切割線2 處,更形成有一凹部23。 Referring to FIG. 3, at least one cutting line 2 is formed in the extending section 103. The cutting line 2 extends along the extending direction M, and a distal end 21 is formed at each end of the cutting line 2. The outer edge of the flexible circuit board 100 corresponds to the cutting line 2 At the same time, a recess 23 is formed.
在本發明的設計中,該軟性電路板100的該切割線2的該至少一末端21延伸出有一應力導向切割段22,該應力導向切割段22的切割方向係與該延伸方向M間呈一角度差θ,且該應力導向切割段22截止於一終止端,該應力導向切割段22係作為該軟性電路板100的防撕裂結構。 In the design of the present invention, the at least one end 21 of the cutting line 2 of the flexible circuit board 100 extends with a stress guiding cutting section 22, and the cutting direction of the stress guiding cutting section 22 is formed between the extending direction M and the extending direction M. The angle difference θ and the stress guiding cutting section 22 are cut off at a terminating end, and the stress guiding cutting section 22 serves as a tear preventing structure of the flexible circuit board 100.
參閱圖4所示,在實際應用時,可以以該切割線2及凹部23為折線而將該延伸區段103予以折疊,可使延伸區段103的寬度減少,以利電路佈線時可減少延伸區段103在電路設計上所佔據之空間。 Referring to FIG. 4, in the actual application, the extending section 103 can be folded by using the cutting line 2 and the recess 23 as a fold line, so that the width of the extending section 103 can be reduced, so as to reduce the extension when the circuit is wired. Section 103 is the space occupied by the circuit design.
當軟性電路板100的切割線2受折疊操作、受到拉扯時、或是在產品產製過程中,應力會由該應力導向切割段22予以導向。如果沒有該應力導向切割段22的設計,很容易會切割線2的末端21形成應力集中點而直接受到撕裂。 When the cutting line 2 of the flexible circuit board 100 is subjected to folding operation, being pulled, or during product production, stress is guided by the stress guiding cutting section 22. Without the design of the stress-directed cutting section 22, it is easy for the end 21 of the cutting line 2 to form a stress concentration point and be directly torn.
參閱圖5所示,當軟性電路板100沿著切割線2受折疊後,可進一步以一螺旋構件4捲束在軟性電路板100的該延伸區段103或以一捲束構件41予以捲束(如圖6所示),以利整線。 Referring to FIG. 5, after the flexible circuit board 100 is folded along the cutting line 2, it may be further wound by a spiral member 4 in the extended section 103 of the flexible circuit board 100 or wound by a winding member 41. (As shown in Figure 6), to facilitate the entire line.
參閱圖7所示,在以螺旋構件4或捲束構件41捲束軟性電路板100的延伸區段103之後,可將延伸區段103通過一電子裝置3的轉軸構件31之軸孔32或一機構的窄孔。 Referring to FIG. 7, after the extending portion 103 of the flexible circuit board 100 is wound by the spiral member 4 or the winding member 41, the extending portion 103 can be passed through the shaft hole 32 or the shaft member 31 of the electronic device 3. The narrow hole of the mechanism.
前述實施例中是以軟性電路板100兩端的第一連接區段101與第二連接區段102皆佈設有信號腳位P作為圖例,當然也可以如圖8所示,在第一連接區段101與第二連接區段102之一或兩者佈設複數個焊墊24,以供一電子元件25的焊接腳26焊著連接在對應的焊墊24。 In the foregoing embodiment, the first connecting section 101 and the second connecting section 102 at both ends of the flexible circuit board 100 are provided with a signal pin P as a legend. Of course, as shown in FIG. 8, in the first connecting section. A plurality of pads 24 are disposed between one or both of the second connecting sections 102 for soldering the soldering legs 26 of an electronic component 25 to the corresponding pads 24.
請參閱圖9,其顯示本發明第二實施例之示意圖,其顯 示在應力導向切割段22的該終止端更連通形成有一防撕裂孔5。當軟性電路板100的切割線2受折疊操作、受到拉扯時、或是在產品產製過程中,應力除了會由該應力導向切割段22予以導向之外,更可以藉由防撕裂孔5作為一應力阻絶結構,而有效加強防撕裂的效果。 Please refer to FIG. 9, which shows a schematic diagram of a second embodiment of the present invention. A tear-proof hole 5 is formed in the end of the stress-directed cutting section 22 to be more communicated. When the cutting line 2 of the flexible circuit board 100 is subjected to folding operation, being pulled, or during production of the product, the stress may be guided by the stress guiding cutting section 22, and the tearing hole 5 may be used. As a stress-resisting structure, it effectively enhances the effect of tear prevention.
前述實施例中所顯示的應力導向切割段22係呈一直線,且該直線型式的應力導向切割段22係順沿著兩相鄰導線1間的區域而延伸。應力導向切割段22亦可以呈其它的結構型式,例如圖10所示的本發明第三實施例中,在軟性電路板100的切割線2的該至少一末端21延伸出有一弧形應力導向切割段6,同樣可以作為該軟性電路板100的防撕裂結構。 The stress guiding cutting segments 22 shown in the previous embodiments are in a straight line, and the linear type of stress guiding cutting segments 22 extend along the area between two adjacent wires 1. The stress-oriented cutting section 22 can also be in other structural forms. For example, in the third embodiment of the present invention shown in FIG. 10, an arc-shaped stress-oriented cutting is extended at the at least one end 21 of the cutting line 2 of the flexible circuit board 100. The segment 6 can also serve as a tear-resistant structure of the flexible circuit board 100.
圖11所示的本發明第四實施例中,在軟性電路板100的切割線2的該至少一末端21延伸出有一S形應力導向切割段7,同樣可以作為該軟性電路板100的防撕裂結構。 In the fourth embodiment of the present invention shown in FIG. 11, a S-shaped stress guiding cutting section 7 extends from the at least one end 21 of the cutting line 2 of the flexible circuit board 100, and can also serve as a tear-proof of the flexible circuit board 100. Split structure.
以上所舉實施例僅係用以說明本發明,並非用以限制本發明之範圍,凡其他未脫離本發明所揭示之精神下而完成的等效修飾或置換,均應包含於後述申請專利範圍內。 The above-mentioned embodiments are only intended to illustrate the invention, and are not intended to limit the scope of the invention, and other equivalent modifications or substitutions which are not departing from the spirit of the invention are intended to be included in the scope of the appended claims. Inside.
100‧‧‧軟性電路板 100‧‧‧Soft circuit board
101‧‧‧第一連接區段 101‧‧‧First connection section
102‧‧‧第二連接區段 102‧‧‧Second connection section
103‧‧‧延伸區段 103‧‧‧Extended section
1‧‧‧導線 1‧‧‧ wire
2‧‧‧切割線 2‧‧‧ cutting line
21‧‧‧末端 End of 21‧‧‧
22‧‧‧應力導向切割段 22‧‧‧stress-oriented cutting section
23‧‧‧凹部 23‧‧‧ recess
P‧‧‧信號腳位 P‧‧‧ signal pin
M‧‧‧延伸方向 M‧‧‧ extending direction
Claims (11)
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
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TW103105584A TWI596994B (en) | 2014-02-20 | 2014-02-20 | Tear-resistant structure of the flexible circuit board |
CN201410133187.2A CN104869745B (en) | 2014-02-20 | 2014-04-03 | anti-tearing structure of flexible circuit board |
US14/283,372 US9433086B2 (en) | 2014-02-20 | 2014-05-21 | Flexible circuit board with tear protection structure |
Applications Claiming Priority (1)
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TW103105584A TWI596994B (en) | 2014-02-20 | 2014-02-20 | Tear-resistant structure of the flexible circuit board |
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TW201534184A TW201534184A (en) | 2015-09-01 |
TWI596994B true TWI596994B (en) | 2017-08-21 |
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TW103105584A TWI596994B (en) | 2014-02-20 | 2014-02-20 | Tear-resistant structure of the flexible circuit board |
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US (1) | US9433086B2 (en) |
CN (1) | CN104869745B (en) |
TW (1) | TWI596994B (en) |
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US9433086B2 (en) | 2016-08-30 |
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CN104869745A (en) | 2015-08-26 |
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