JP2011249870A5 - - Google Patents
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- JP2011249870A5 JP2011249870A5 JP2010117637A JP2010117637A JP2011249870A5 JP 2011249870 A5 JP2011249870 A5 JP 2011249870A5 JP 2010117637 A JP2010117637 A JP 2010117637A JP 2010117637 A JP2010117637 A JP 2010117637A JP 2011249870 A5 JP2011249870 A5 JP 2011249870A5
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- JP
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- Prior art keywords
- circuit board
- terminals
- flexible printed
- image sensor
- terminal
- Prior art date
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Claims (7)
前記撮像素子のそれぞれの端子を前記複数の端子接続用パットのそれぞれに接続固定した状態で、隣り合う端子が接続された端子接続用パットは異なる平面に位置し、1つの端子を挟んで隣接する端子接続用パットは同一の平面に位置することを特徴とする撮像装置。 A plurality of terminals arranged and extending from the side surface of the image sensor, and a plurality of terminal connections arranged at positions adjacent to the image sensor, wherein the plurality of terminals are electrically connected by a conductive fixing member, respectively. In an imaging device comprising a circuit board in which a pad is arranged at an end of a wiring,
With the terminals of the imaging device connected and fixed to the plurality of terminal connection pads, the terminal connection pads to which adjacent terminals are connected are located on different planes and are adjacent to each other with one terminal interposed therebetween. An image pickup apparatus, wherein the terminal connecting pads are located on the same plane.
前記フレキシブルプリント基板の撮像素子側の端部であって、前記フレキシブルプリント基板の外周面である第1面側に端面から突出する前記端子接続用パットとしてのフライングリードを設け、前記フレキシブルプリント基板の内周面である第2面側に前記端子接続用パットを設ける一方、
前記撮像素子の配列された複数の端子を、前記撮像素子の前面に配置された光学部材側と、前記フレキシブルプリント基板側との交互に折り曲げて、前記フライングリードと前記端子接続用パットに接続することを特徴とする請求項1に記載の撮像装置。 The circuit board is a flexible printed circuit board that is bent and formed into a box shape,
A flying lead as the terminal connection pad protruding from the end surface is provided on the first surface side which is an outer peripheral surface of the flexible printed circuit board, which is an end of the flexible printed circuit board on the image pickup element side, and the flexible printed circuit board While providing the terminal connection pad on the second surface side that is the inner peripheral surface,
A plurality of terminals on which the image sensor is arranged are alternately bent on the optical member side disposed on the front surface of the image sensor and the flexible printed circuit board side, and connected to the flying lead and the terminal connection pad. The imaging apparatus according to claim 1.
前記複数の端子の長さを切断して一定の長さに設定する構成において、
前記回路基板の外面側である第1面と前記回路基板の内面側である第2面との交互に、前記端子接続用パットを構成する一端側が前記スルーホールに連通し、他端側が閉塞され、その深さ寸法が予め定めた寸法に設定した溝を設けたことを特徴とする請求項1に記載の撮像装置。 At the end on the image sensor side of the circuit board, a through hole through which each terminal of the image sensor passes is arranged in a straight line along the end surface,
In the configuration in which the length of the plurality of terminals is cut and set to a certain length,
The first surface, which is the outer surface side of the circuit board, and the second surface, which is the inner surface side of the circuit board, are alternately connected to one end side of the terminal connection pad to the through hole and the other end side is closed. The imaging apparatus according to claim 1, wherein a groove whose depth dimension is set to a predetermined dimension is provided.
前記フレキシブルプリント基板の撮像素子側の端部に、前記撮像素子のそれぞれの端子が通過するスルーホールを前記端面に対して千鳥配列で設け、
前記複数の端子の長さを切断して一定の長さに設定する構成において、
前記端子接続用パットは、前記スルーホールと、該スルーホールに同心でこのスルーホールの外径より大径な環状凹部と、前記スルーホールと同心で前記管状凹部より大径であって、前記撮像素子の1つの端子を挟んで隣接する端子間に配置される円周部を備えて形成され、
前記フレキシブルプリント基板の長手軸に平行なスリットによって分割されていることを特徴とする請求項1に記載の撮像装置。 The circuit board is a flexible printed circuit board that is bent and formed into a box shape,
At the end of the flexible printed circuit board on the image sensor side, through holes through which the respective terminals of the image sensor pass are provided in a staggered arrangement with respect to the end surface,
In the configuration in which the length of the plurality of terminals is cut and set to a certain length,
The terminal connecting pad has the through hole, an annular recess concentric with the through hole and larger in diameter than the outer diameter of the through hole, and concentric with the through hole and larger in diameter than the tubular recess, and the imaging Formed with a circumferential portion disposed between adjacent terminals across one terminal of the element,
The imaging apparatus according to claim 1, wherein the imaging apparatus is divided by a slit parallel to a longitudinal axis of the flexible printed circuit board.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010117637A JP5541968B2 (en) | 2010-05-21 | 2010-05-21 | Imaging device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010117637A JP5541968B2 (en) | 2010-05-21 | 2010-05-21 | Imaging device |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2011249870A JP2011249870A (en) | 2011-12-08 |
JP2011249870A5 true JP2011249870A5 (en) | 2013-07-04 |
JP5541968B2 JP5541968B2 (en) | 2014-07-09 |
Family
ID=45414643
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2010117637A Expired - Fee Related JP5541968B2 (en) | 2010-05-21 | 2010-05-21 | Imaging device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP5541968B2 (en) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6124505B2 (en) * | 2012-04-05 | 2017-05-10 | オリンパス株式会社 | Imaging module |
JP5711178B2 (en) * | 2012-04-06 | 2015-04-30 | オリンパスメディカルシステムズ株式会社 | Imaging device and endoscope using the imaging device |
WO2014010283A1 (en) * | 2012-07-10 | 2014-01-16 | オリンパスメディカルシステムズ株式会社 | Ultrasonic endoscope |
CN105636499A (en) * | 2013-07-01 | 2016-06-01 | 恩多巧爱思股份有限公司 | Circuit board assembly of a multiple viewing elements endoscope |
CN108697313A (en) | 2016-03-15 | 2018-10-23 | 奥林巴斯株式会社 | The manufacturing method of photographic device, endoscope and photographic device |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08264705A (en) * | 1995-03-28 | 1996-10-11 | Seiko Epson Corp | Semiconductor device and package structure and packaging method using the same |
JP2000210252A (en) * | 1999-01-25 | 2000-08-02 | Sony Corp | Solid imaging device |
-
2010
- 2010-05-21 JP JP2010117637A patent/JP5541968B2/en not_active Expired - Fee Related
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