TWI596886B - 半導體元件 - Google Patents
半導體元件 Download PDFInfo
- Publication number
- TWI596886B TWI596886B TW105101002A TW105101002A TWI596886B TW I596886 B TWI596886 B TW I596886B TW 105101002 A TW105101002 A TW 105101002A TW 105101002 A TW105101002 A TW 105101002A TW I596886 B TWI596886 B TW I596886B
- Authority
- TW
- Taiwan
- Prior art keywords
- contact layer
- movable object
- diselenide
- semiconductor device
- dioxide
- Prior art date
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- 239000004065 semiconductor Substances 0.000 title claims description 69
- 239000000463 material Substances 0.000 claims description 59
- 239000000758 substrate Substances 0.000 claims description 14
- 239000002202 Polyethylene glycol Substances 0.000 claims description 12
- 229920001223 polyethylene glycol Polymers 0.000 claims description 12
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 11
- MCEWYIDBDVPMES-UHFFFAOYSA-N [60]pcbm Chemical compound C123C(C4=C5C6=C7C8=C9C%10=C%11C%12=C%13C%14=C%15C%16=C%17C%18=C(C=%19C=%20C%18=C%18C%16=C%13C%13=C%11C9=C9C7=C(C=%20C9=C%13%18)C(C7=%19)=C96)C6=C%11C%17=C%15C%13=C%15C%14=C%12C%12=C%10C%10=C85)=C9C7=C6C2=C%11C%13=C2C%15=C%12C%10=C4C23C1(CCCC(=O)OC)C1=CC=CC=C1 MCEWYIDBDVPMES-UHFFFAOYSA-N 0.000 claims description 11
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 10
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 claims description 10
- 239000002033 PVDF binder Substances 0.000 claims description 8
- 229910021542 Vanadium(IV) oxide Inorganic materials 0.000 claims description 8
- 229920002981 polyvinylidene fluoride Polymers 0.000 claims description 8
- GRUMUEUJTSXQOI-UHFFFAOYSA-N vanadium dioxide Chemical compound O=[V]=O GRUMUEUJTSXQOI-UHFFFAOYSA-N 0.000 claims description 8
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 7
- 229910000420 cerium oxide Inorganic materials 0.000 claims description 7
- BMMGVYCKOGBVEV-UHFFFAOYSA-N oxo(oxoceriooxy)cerium Chemical compound [Ce]=O.O=[Ce]=O BMMGVYCKOGBVEV-UHFFFAOYSA-N 0.000 claims description 7
- 229910052787 antimony Inorganic materials 0.000 claims description 6
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 claims description 6
- GNTDGMZSJNCJKK-UHFFFAOYSA-N divanadium pentaoxide Chemical compound O=[V](=O)O[V](=O)=O GNTDGMZSJNCJKK-UHFFFAOYSA-N 0.000 claims description 6
- 229920001609 Poly(3,4-ethylenedioxythiophene) Polymers 0.000 claims description 5
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims description 5
- JENGXLIUJCOWGI-UHFFFAOYSA-N [Se-][Se-].[Zn+2] Chemical compound [Se-][Se-].[Zn+2] JENGXLIUJCOWGI-UHFFFAOYSA-N 0.000 claims description 5
- KBPGBEFNGHFRQN-UHFFFAOYSA-N bis(selanylidene)tin Chemical compound [Se]=[Sn]=[Se] KBPGBEFNGHFRQN-UHFFFAOYSA-N 0.000 claims description 5
- 239000004408 titanium dioxide Substances 0.000 claims description 5
- 239000004642 Polyimide Substances 0.000 claims description 4
- 229910021389 graphene Inorganic materials 0.000 claims description 4
- WPYVAWXEWQSOGY-UHFFFAOYSA-N indium antimonide Chemical compound [Sb]#[In] WPYVAWXEWQSOGY-UHFFFAOYSA-N 0.000 claims description 4
- 229920000301 poly(3-hexylthiophene-2,5-diyl) polymer Polymers 0.000 claims description 4
- 229920001721 polyimide Polymers 0.000 claims description 4
- TVIVIEFSHFOWTE-UHFFFAOYSA-K tri(quinolin-8-yloxy)alumane Chemical compound [Al+3].C1=CN=C2C([O-])=CC=CC2=C1.C1=CN=C2C([O-])=CC=CC2=C1.C1=CN=C2C([O-])=CC=CC2=C1 TVIVIEFSHFOWTE-UHFFFAOYSA-K 0.000 claims description 4
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 claims description 3
- 229910002601 GaN Inorganic materials 0.000 claims description 3
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 claims description 3
- GPXJNWSHGFTCBW-UHFFFAOYSA-N Indium phosphide Chemical compound [In]#P GPXJNWSHGFTCBW-UHFFFAOYSA-N 0.000 claims description 3
- 229920000109 alkoxy-substituted poly(p-phenylene vinylene) Polymers 0.000 claims description 3
- MRPWWVMHWSDJEH-UHFFFAOYSA-N antimony telluride Chemical compound [SbH3+3].[SbH3+3].[TeH2-2].[TeH2-2].[TeH2-2] MRPWWVMHWSDJEH-UHFFFAOYSA-N 0.000 claims description 3
- ROUIDRHELGULJS-UHFFFAOYSA-N bis(selanylidene)tungsten Chemical compound [Se]=[W]=[Se] ROUIDRHELGULJS-UHFFFAOYSA-N 0.000 claims description 3
- 229910052799 carbon Inorganic materials 0.000 claims description 3
- 230000005685 electric field effect Effects 0.000 claims description 3
- 229910002804 graphite Inorganic materials 0.000 claims description 3
- 239000010439 graphite Substances 0.000 claims description 3
- CWQXQMHSOZUFJS-UHFFFAOYSA-N molybdenum disulfide Chemical compound S=[Mo]=S CWQXQMHSOZUFJS-UHFFFAOYSA-N 0.000 claims description 3
- 229910052982 molybdenum disulfide Inorganic materials 0.000 claims description 3
- QGLKJKCYBOYXKC-UHFFFAOYSA-N nonaoxidotritungsten Chemical compound O=[W]1(=O)O[W](=O)(=O)O[W](=O)(=O)O1 QGLKJKCYBOYXKC-UHFFFAOYSA-N 0.000 claims description 3
- 229910052698 phosphorus Inorganic materials 0.000 claims description 3
- 239000011574 phosphorus Substances 0.000 claims description 3
- ITRNXVSDJBHYNJ-UHFFFAOYSA-N tungsten disulfide Chemical compound S=[W]=S ITRNXVSDJBHYNJ-UHFFFAOYSA-N 0.000 claims description 3
- 229910001930 tungsten oxide Inorganic materials 0.000 claims description 3
- 229910001218 Gallium arsenide Inorganic materials 0.000 claims description 2
- NFMAZVUSKIJEIH-UHFFFAOYSA-N bis(sulfanylidene)iron Chemical compound S=[Fe]=S NFMAZVUSKIJEIH-UHFFFAOYSA-N 0.000 claims description 2
- 229910000339 iron disulfide Inorganic materials 0.000 claims description 2
- MHWZQNGIEIYAQJ-UHFFFAOYSA-N molybdenum diselenide Chemical compound [Se]=[Mo]=[Se] MHWZQNGIEIYAQJ-UHFFFAOYSA-N 0.000 claims description 2
- 239000011787 zinc oxide Substances 0.000 claims description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims 1
- CVMDEPMCKBDVDT-UHFFFAOYSA-N [Cr+4].[Se--].[Se--] Chemical compound [Cr+4].[Se--].[Se--] CVMDEPMCKBDVDT-UHFFFAOYSA-N 0.000 claims 1
- PICQSJQNJSMSNL-UHFFFAOYSA-N [S--].[S--].[Cr+4] Chemical compound [S--].[S--].[Cr+4] PICQSJQNJSMSNL-UHFFFAOYSA-N 0.000 claims 1
- WCQOLGZNMNEYDX-UHFFFAOYSA-N bis(selanylidene)vanadium Chemical compound [Se]=[V]=[Se] WCQOLGZNMNEYDX-UHFFFAOYSA-N 0.000 claims 1
- NGTSQWJVGHUNSS-UHFFFAOYSA-N bis(sulfanylidene)vanadium Chemical compound S=[V]=S NGTSQWJVGHUNSS-UHFFFAOYSA-N 0.000 claims 1
- 229910052718 tin Inorganic materials 0.000 claims 1
- -1 Poly(3-hexylthiophene-2,5-diyl) Polymers 0.000 description 13
- 238000010586 diagram Methods 0.000 description 9
- 229910052782 aluminium Inorganic materials 0.000 description 8
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 8
- 238000000034 method Methods 0.000 description 7
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 7
- 239000004810 polytetrafluoroethylene Substances 0.000 description 7
- 238000004088 simulation Methods 0.000 description 5
- 239000004205 dimethyl polysiloxane Substances 0.000 description 4
- 235000013870 dimethyl polysiloxane Nutrition 0.000 description 4
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 4
- 239000004677 Nylon Substances 0.000 description 3
- 239000004793 Polystyrene Substances 0.000 description 3
- 150000001450 anions Chemical class 0.000 description 3
- 230000001276 controlling effect Effects 0.000 description 3
- BHEPBYXIRTUNPN-UHFFFAOYSA-N hydridophosphorus(.) (triplet) Chemical compound [PH] BHEPBYXIRTUNPN-UHFFFAOYSA-N 0.000 description 3
- 230000007935 neutral effect Effects 0.000 description 3
- 229920001778 nylon Polymers 0.000 description 3
- 230000008447 perception Effects 0.000 description 3
- 229920000139 polyethylene terephthalate Polymers 0.000 description 3
- 239000005020 polyethylene terephthalate Substances 0.000 description 3
- 229920002160 Celluloid Polymers 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- BWGNESOTFCXPMA-UHFFFAOYSA-N Dihydrogen disulfide Chemical compound SS BWGNESOTFCXPMA-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 229920000144 PEDOT:PSS Polymers 0.000 description 2
- 229920003171 Poly (ethylene oxide) Polymers 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 2
- 238000004364 calculation method Methods 0.000 description 2
- 229910052804 chromium Inorganic materials 0.000 description 2
- 239000011651 chromium Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- XIMIGUBYDJDCKI-UHFFFAOYSA-N diselenium Chemical compound [Se]=[Se] XIMIGUBYDJDCKI-UHFFFAOYSA-N 0.000 description 2
- 229910052732 germanium Inorganic materials 0.000 description 2
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 229910010272 inorganic material Inorganic materials 0.000 description 2
- 239000011147 inorganic material Substances 0.000 description 2
- 239000011368 organic material Substances 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 229910052720 vanadium Inorganic materials 0.000 description 2
- LEONUFNNVUYDNQ-UHFFFAOYSA-N vanadium atom Chemical compound [V] LEONUFNNVUYDNQ-UHFFFAOYSA-N 0.000 description 2
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 description 1
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- 229920000742 Cotton Polymers 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 1
- 108010010803 Gelatin Proteins 0.000 description 1
- 244000043261 Hevea brasiliensis Species 0.000 description 1
- 229910016001 MoSe Inorganic materials 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- 229910000577 Silicon-germanium Inorganic materials 0.000 description 1
- 229910006404 SnO 2 Inorganic materials 0.000 description 1
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 1
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- 239000008273 gelatin Substances 0.000 description 1
- 229920000159 gelatin Polymers 0.000 description 1
- 235000019322 gelatine Nutrition 0.000 description 1
- 235000011852 gelatine desserts Nutrition 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 230000001939 inductive effect Effects 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- NFFIWVVINABMKP-UHFFFAOYSA-N methylidynetantalum Chemical compound [Ta]#C NFFIWVVINABMKP-UHFFFAOYSA-N 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229920003052 natural elastomer Polymers 0.000 description 1
- 229920001194 natural rubber Polymers 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920001467 poly(styrenesulfonates) Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 239000011112 polyethylene naphthalate Substances 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 239000011593 sulfur Substances 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 229910003468 tantalcarbide Inorganic materials 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 210000002268 wool Anatomy 0.000 description 1
Classifications
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
- H02N1/00—Electrostatic generators or motors using a solid moving electrostatic charge carrier
- H02N1/04—Friction generators
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
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- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/7722—Field effect transistors using static field induced regions, e.g. SIT, PBT
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- H—ELECTRICITY
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- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/12—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
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- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/41—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions
- H01L29/417—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions carrying the current to be rectified, amplified or switched
- H01L29/41725—Source or drain electrodes for field effect devices
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/41—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions
- H01L29/423—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions not carrying the current to be rectified, amplified or switched
- H01L29/42312—Gate electrodes for field effect devices
- H01L29/42316—Gate electrodes for field effect devices for field-effect transistors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/43—Electrodes ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/45—Ohmic electrodes
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K10/00—Organic devices specially adapted for rectifying, amplifying, oscillating or switching; Organic capacitors or resistors having potential barriers
- H10K10/20—Organic diodes
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
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- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/12—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/16—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only elements of Group IV of the Periodic Table
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- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/12—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/16—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only elements of Group IV of the Periodic Table
- H01L29/1606—Graphene
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- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
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- H01L29/16—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only elements of Group IV of the Periodic Table
- H01L29/1608—Silicon carbide
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- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/12—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/16—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only elements of Group IV of the Periodic Table
- H01L29/161—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only elements of Group IV of the Periodic Table including two or more of the elements provided for in group H01L29/16, e.g. alloys
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/12—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/20—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only AIIIBV compounds
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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Description
本發明是有關於一種半導體元件，且特別是有關於一種靜電感應的半導體元件。
科技與人類的互動在於介面的設計，如何將訊息輸入與輸出為最重要的功能。人類的感知來自於五種知覺：視覺、聽覺、味覺、嗅覺與觸覺，其中以觸覺為最直接的感知源但也較難以仿造。
目前的半導體元件通常需外加電壓或接外部電源以使半導體元件正常運作，致使半導體在製程上較為複雜且使其應用範圍受限。因此，若能夠使半導體元件自行發電，不需外加電壓或藉由外部電源供應而運作的半導體元件，將可擴大其應用範圍。
本發明提供一種半導體元件，可藉由產生感應電荷而自行發電，並達到可撓性、透明且薄型的優點。
本發明提供一種半導體元件。半導體元件包括基板、接
觸層以及活性層。接觸層位於基板上，接觸層與可移動物件進行相對運動。活性層位於接觸層與基板之間。
在本發明的一實施例中，上述接觸層為介電層。
在本發明的一實施例中，上述接觸層的材料包括聚乙二醇、氧化矽、聚二甲基矽氧烷、聚醯亞胺(Polyimide)、聚偏二氟乙烯(Polyvinylidene fluoride,PVDF)、二氧化鈦、二氧化錫、二硒化鋅、二硒化錫、二氧化釩、多孔性二氧化矽、PCBM([6,6]-phenyl-C61-butyric acid methyl ester)、PEDOT：PSS(poly(3,4-ethylenedioxythiophene)polystyrene sulfonate)或任何有機與無機之介電系數>1以上的材料，另外，亦包括尼絨(Nylon)、矽膠、橡膠、毛皮等但不限於此。
在本發明的一實施例中，上述接觸層的厚度介於10nm至20mm之間。
在本發明的一實施例中，更包括源極和汲極位於接觸層中。
在本發明的一實施例中，上述可移動物件與接觸層之間具有相對電位差。
在本發明的一實施例中，上述活性層的材料包括銻化銦、砷化鎵、磷化銦、矽化鍺、碳化矽、鍺、矽、氧化鋅、二氧化鈦、二氧化錫、二氧化釩、五氧化二釩、二硫化鉬、二硒化鎢、二硒化鋅、二硒化錫、二硫化鎢、氧化鎢、石墨烯、紅磷、黑磷、棕磷、氮化鎵、PCBM([6,6]-phenyl-C61-butyric acid methyl ester)、
石墨/P3HT(Poly(3-hexylthiophene-2,5-diyl)：PCBM、MEH-PPV(Poly[2-methoxy-5-(2-ethylhexyloxy)-1,4-phenylenevinylene])、PEDOT：PS(Polystyrene)、Tris(8-hydroxyquinolinato)aluminium(Al(C9H6NO)3,Alq3)、碳60、III-V族或II-VI族半導體或其組合。
在本發明的一實施例中，上述可移動物件與接觸層之間的間距d之範圍介於10nm至20mm之間，且較佳為介於1μm至200μm之間。
基於上述，本發明的半導體元件，藉由材料的選擇，可做成具有可撓性、透明且薄型的半導體元件。此外，由於本發明是藉由控制可移動物件與半導體元件的接觸層之間的間距，產生相對電位差而感應電流或電壓，所產生的感應電流或電壓足以控制半導體元件開關(活性層的通道開閉)。因此，本發明的半導體元件之閘極源不需外加電壓或接外部電源即可運作。又，本發明的半導體元件是藉由可移動物件取代傳統半導體元件結構中的閘電極，也就是說，當以手指作為本發明的可移動物件時，可省去傳統半導體元件結構中的閘電極構件，故可減少整體半導體元件的厚度，而達到薄型化的優點。
為讓本發明的上述特徵和優點能更明顯易懂，下文特舉實施例，並配合所附圖式作詳細說明如下。
10‧‧‧半導體元件
100‧‧‧基板
102‧‧‧接觸層
104‧‧‧活性層
105a‧‧‧增強區域
105b‧‧‧空乏區域
106‧‧‧源極
108‧‧‧汲極
110、110a、110b‧‧‧可移動物件
300‧‧‧網狀式陣列電極
302、304‧‧‧電極
d‧‧‧間距
w‧‧‧寬度
D1、D2‧‧‧方向
圖1為依照本發明的一實施例所繪示的半導體元件的剖面圖。
圖2A至圖2E為依照本發明的一實施例所繪示的半導體元件的電荷感應原理圖。
圖3A和圖3B為依照圖2A至圖2E所繪示的半導體元件電荷感應的電性表現圖。
圖4A至圖4E為依照本發明的另一實施例所繪示的半導體元件的電荷感應原理圖。
圖5A和圖5B為依照圖4A至圖4E所繪示的半導體元件電荷感應的電性表現圖。
圖6A和圖6B為依照本發明的不同實施例之可移動物件與接觸層材料之間的電位差模擬圖。
圖7為依照本發明的實施例應用於網狀式陣列電極的電路圖。
圖1為依照本發明的一實施例所繪示的半導體元件的剖面圖。
請參照圖1，本發明的半導體元件10包括基板100、接觸層102以及活性層104。基板100的材料包括可撓性材料或硬式材料，例如聚對苯二甲酸乙酯(polyethylene terephthalate，PET)、玻璃、矽、不鏽鋼、氧化鋁(Al2O3)、鋁、聚醯亞胺(polyimide，PI)、聚間苯二甲酸乙二酯(polyethylene naphthalate，PEN)、聚二甲基矽氧烷(Polydimethylsiloxane，PDMS)、銅、塑膠、聚偏
二氟乙烯(Polyvinylidene fluoride,PVDF)、玻璃纖維，或有機與無機之混合物等，但不限於此，且這些材料可為透明或不透明之材料。基板100的厚度例如是介於1μm至10mm之間，較佳厚度介於100μm至1mm之間。
接觸層102位於基板100上。接觸層102可以例如是介電層。舉例來說，接觸層102的材料例如包括聚乙二醇(polyethylene oxide，PEO)、氧化矽(SiO2)、聚二甲基矽氧烷、聚醯亞胺(Polyimide)、聚偏二氟乙烯(Polyvinylidene fluoride,PVDF)、二氧化鈦、二氧化錫、二硒化鋅、二硒化錫、二氧化釩、多孔性二氧化釩、PCBM、PEDOT、PSS或任何有機與無機之高介電係數(介電係數>1)的材料等，但不限於此。在一具體實施例中，當接觸層102的材料為聚乙二醇時，由於聚乙二醇具有較佳的量子電容量(4×10-3F/m2)，又，聚乙二醇為透明且具有可撓性的材料，因而可使製程簡便並使後續的應用更為廣泛，但本發明不以上述材料為限。接觸層102的厚度例如介於10nm至20mm，且較佳厚度介於100μm與1mm之間。在一實施例中，接觸層102例如更包括源極106與汲極108位於其中。在一實施例中，汲極108例如可以接地。
活性層104位於接觸層102與基板100之間。活性層104的材料例如是有機或無機n型、p型或p-n型的半導體材料，也可以例如是有機與無機混成的半導體材料。舉例來說，活性層104的材料例如包括銻化銦(InSb)、砷化鎵(GaAs)、磷化銦(InP)、
矽化鍺(SiGe)、碳化矽(SiC)、鎵(Ga)、矽(Si)、氧化鋅(ZnO)、二氧化鈦(TiO2)、二氧化錫(SnO2)、二氧化釩(VO2)、五氧化二釩(V2O5)、二硒化鉬(MoSe2)、二硫化鐵(FeS2)、二硫化釩(VS2)、二硒化釩(VSe2)、二硫化鉻(CrS2)、二硒化鉻(CrSe2)、二硫化鉬(MoS2)、二硒化鎢(WSe2)、二硫化鎢(WS2)、氧化鎢(WOx)、石墨烯(Graphene)、紅磷(red phosphorous)、黑磷(black phosphorous)、棕磷(Brown phosphorous)、氮化鎵、PCBM、石墨/P3HT：PCBM、MEH-PPV、PEDOT：PS、Alq3、碳60、III-V族或II-VI族半導體或其組合，但不限於此，且可為任何離子型、非離子型之半導體材料。上述材料可以是寬能隙或窄能隙的半導體材料，也可以是單界面或p-n接面混合的半導體材料，但本發明不限於此。
值得注意的是，接觸層102可以與一可移動物件110進行相對運動。接觸層102與可移動物件110之間的相對運動產生間距d，間距d範圍例如介於10nm至20mm之間，且較佳為介於1μm至200μm之間。可移動物件110的材料沒有特定限制，只要可移動物件110的材料與接觸層102的材料之間具有相對電位差即可。舉例來說，當接觸層102的材料為聚乙二醇，可移動物件110的材料相較於聚乙二醇可以是帶有較高陰電性(亦稱高電負度，High electronegativity)的材料，即得電子親合能力較強的材料，例如聚四氟乙烯(polytetrafluoroethylene，PTFE)。反之，可移動物件110的材料相較於聚乙二醇可以是帶有較高正電性(亦稱
低電負度，low electronegativity)的材料，即得電子親合能力較弱的材料，例如手指或鋁，但本發明不限於此，只要可移動物件110的材料與接觸層102的材料之間具有相對電位差即可。
圖2A至圖2E為依照本發明的一實施例所繪示的半導體元件的電荷感應原理圖。
本發明的半導體元件電荷感應的操作原理將以圖2A至圖2E的半導體元件的剖面圖來說明。
在此實施例中，將以增強區域(enhancement zone)型電荷感應的操作原理進行說明。舉例來說，基板100的材料例如是聚對苯二甲酸乙酯，接觸層102的材料例如是聚乙二醇，可移動物件110a的材料例如是聚四氟乙烯。此時，可移動物件110a相較於接觸層102是帶有較高陰電性的材料。活性層104的材料例如是銻化銦，但本發明不限於此。
如圖2A所示，在可移動物件110a與接觸層102尚未接觸或靠近時，並不會有感應電荷的產生。
接著，如圖2B所示，將可移動物件110a接觸到接觸層102時，由於可移動物件110a相對於接觸層102帶有較高陰電性，亦即102本身具有高的正電性(低電負度)，當接觸層102與可移動物件110a接觸時，高的正電性102與高陰電性110a形成電中性平衡。
然後，如圖2C所示，將可移動物件110a緩慢遠離接觸層102，由於接觸層102的表面仍呈現帶正電荷的狀態，為了達到
靜電力平衡(electrostatic equilibrium)，電子會從接地的汲極108導入以維持電中性，促使活性層104的電子濃度增加產生增強區域105a，其中增強區域105a具有寬度w。
接著，如圖2D所示，當可移動物件110a與接觸層102之間的間距d持續增加時，電子濃度亦會逐漸達到最大值，且增強區域105a的寬度w亦逐漸增加，致使流經源極106的電流上升。當靜電力達到平衡時，此時為電荷平衡的電中性狀態，電流將不再上升，而強區域105a達到最大值。
然後，如圖2E所示，將可移動物件110a再次靠近接觸層102，即可移動物件110a與接觸層102之間的間距d縮小，電子會開始從汲極回流至接地處。此時，電子濃度下降，使增強區域105a的寬度w逐漸降低，直到回到原始狀態。
值得一提的是，在上述可移動物件110a與接觸層102之間進行相對運動的過程中，由於靜電力平衡所產生的電流，足以達到控制半導體元件的開關。也就是說，半導體元件之閘極不需再外接電流控制。另外，可移動物件110a是位於外部且獨立於半導體元件，因此，不一定需要與本體半導體元件進行線路連結，可有效簡化元件設計與製程及其成本。
圖3A和圖3B為依照圖2A至圖2E所繪示的半導體元件電荷感應的電性表現圖。
如圖3A所示的結果可以得知，可移動物件110a從與接觸層102接觸至可移動物件110a遠離接觸層102，間距d逐漸增
加，電流大小亦逐漸增加。此外，由圖3B所示的結果，可計算得到在固定源極106的偏壓為1伏特時，將可移動物件110a與接觸層102接觸(d=0μm)至可移動物件110a逐漸遠離接觸層102(d=80μm)的過程中，電流大小從約6μA增加至約12μA，增加倍率約為2倍。
圖4A至圖4E為依照本發明的另一實施例所繪示的半導體元件的電荷感應原理圖。
在此實施例中，將以空乏區域(depletion zone)型電荷感應的操作原理進行說明，與上述增強區域型電荷感應的操作原理相反。更具體地說，與上述增強區域型的電荷感應不同之處在於可移動物件110b相較於接觸層102為帶有較高正電性的材料。舉例來說，接觸層102的材料例如是聚乙二醇，可移動物件110b的材料例如是手指、鋁、二氧化矽、多孔性二氧化矽或尼龍，但本發明不限於此。
如圖4A所示，在可移動物件110b與接觸層102尚未接觸或靠近時，並不會有感應電荷的產生。接著，如圖4B所示，將可移動物件110b接觸到接觸層102時，由於可移動物件110b相對於接觸層102帶有較高正電性(或低電負度)，因此，可移動物件110b本身帶正電荷而接觸層102具有較高陰電性(或高電負度)，故高正電性的可移動物件110b與高陰電性的接觸層102接觸時會形成電中性平衡。然後，如圖4C所示，將可移動物件110b緩慢遠離接觸層102，由於接觸層102的表面仍呈現帶負電荷的狀態，
為了達到靜電力的平衡，電子會從接地的汲極108導出，致使活性層104電子濃度減少，而產生空乏區域105b。接著，如圖4D所示，當可移動物件110b與接觸層102之間的間距d持續增加，空乏區域105b的寬度w亦逐漸增加，致使流經源極106的電流下降，直到靜電力達到平衡。然後，如圖4E所示，將可移動物件110b再次靠近接觸層102，即可移動物件110b與接觸層102之間的間距d縮小，電子會再度由接地端流回汲集108以抵消原來在活性成層104的正電荷，促使接觸層102的電流會開始上升直到回到原始狀態。
圖5A和圖5B為依照圖4A至圖4E所繪示的半導體元件電荷感應的電性表現圖。
如圖5A所示的結果可以得知，可移動物件110b從與接觸層102接觸至可移動物件110b遠離接觸層102，電流大小會隨可移動物件110b與接觸層102之間的間距d增加而下降。此外，由圖5B所示的結果，可計算得到在固定源極106的偏壓為1伏特時，將可移動物件110b與接觸層102接觸(d=0μm)至可移動物件110b逐漸遠離接觸層102(d=80μm)的過程中，電流大小從約7μA下降至約1.5μA，下降倍率約為5倍。
圖6A和圖6B為依照本發明的不同實施例之可移動物件與接觸層材料之間的電位差模擬圖。
根據圖6A的電位差模擬圖，可得知聚四氟乙烯相較於聚乙二醇帶有較高陰電性，其中，基於理論計算其輸出電勢可達
+126V~-206V。根據圖6B的電位差模擬圖，可得知鋁相較於聚乙二醇帶有較高正電性，其中，基於理論計算其輸出電勢可達+151V~-132V。從上述電位差模擬圖可以得知本發明的可移動物件與接觸層可以選擇具有不同帶電性的材料，也就是說，本發明可以藉由材料之間彼此得失電子的差異所產生的電流或電壓進行自發電。此外，可移動物件與接觸層的材料也可以例如選擇聚四氟乙烯與鋁做搭配，或調控聚四氟乙烯與鋁的表面粗糙度及多孔性結構，使鋁的正電荷提升或聚四氟乙烯的負電荷提升，以達到更高的電位差效果，但本發明不限於此。
圖7為依照本發明的實施例應用於網狀式陣列電極的電路圖。
如圖7所示，本發明的半導體元件可應用於網狀式陣列電極300的設計，多個第一電極302沿著第一方向D1排列且沿著第二方向D2延伸，多個第二電極304沿著第二方向D2排列且沿著第一方向D1延伸。在每個第一電極302與每個第二電極304的交界處分別設置本發明的半導體元件使其電性連接，並可藉由接觸層與可移動物件之間的電位差透過接觸摩擦在閘極與接觸層間產生電場效應。所述電場效應可透過前述之增強型與空乏型模式達到控制活性層之汲極與源極間的通道電流。再者，本半導體元件可形成陣列式控制/觸控電路感應位置並由電流大小與強弱來判斷控制訊號以處理電信訊息。
在一實施例中，網狀式陣列電極例如是包括多個本發明
的半導體元件10，如上述電荷感應原理，藉由控制可移動物件與接觸層之間的間距，可以控制任意位置的半導體元件10的開關。
值得一提的是，本發明的半導體元件無需外加其他電源即可控制其通道的開關，可以達到簡化閘極製程並達到薄型化(小於1毫米)的優點。
此外，本發明半導體元件接觸層的材料與可移動物件的材料並沒有特別限制，只要二者的材料之間具有相對的電位差即可。除上述所列舉的材料之外，可移動物件與接觸層的材料亦可從以下所列舉材料中任選二種材料組合搭配，即此二種材料之間具有相對的電位差即可。以下所述材料其帶電性由正至負依序為皮膚、玻璃、尼龍(nylon)、羊毛(wool)、鉛(lead)、棉花(cotton)、鋁(aluminum)、紙(paper)、鋼(steel)、明膠(gelatin)、鎳和銅(nickel,copper)、金和鉑(gold,platinum)、天然橡膠(natural rubber)、硫(sulfur)、醋酸鹽(acetate)、聚酯(polyester)、賽璐珞(celluloid)、氨基甲酸乙酯(urethane)、聚乙烯(polyethylene)、乙烯(vinyl)、矽(silicon)、鐵氟龍(teflon)，但本發明不限於此。
本發明的半導體元件可應用於鍵盤、脈搏感測器、力量感測器、位移監測器、速度感測器、觸控面板、應變感測器、遊戲搖桿、遊戲鍵盤等相關應用，但本發明不限於此。
綜上所述，本發明的半導體元件，藉由材料的選擇，可做成具有可撓性、透明且薄型的半導體元件。此外，由於本發明是藉由控制可移動物件與半導體元件的接觸層之間的間距，產生
相對電位差而感應電流或電壓，所產生的感應電流或電壓足以控制半導體元件開關(活性層的通道開閉)。因此，本發明的半導體元件不需外加電壓或接外部電源即可運作。又，本發明的半導體元件是藉由可移動物件取代傳統半導體元件結構中的閘電極，也就是說，當以手指作為本發明的可移動物件，可省去傳統半導體元件結構中的閘電極構件，故可減少整體半導體元件的厚度，而達到薄型化的優點。
雖然本發明已以實施例揭露如上，然其並非用以限定本發明，任何所屬技術領域中具有通常知識者，在不脫離本發明的精神和範圍內，當可作些許的更動與潤飾，故本發明的保護範圍當視後附的申請專利範圍所界定者為準。
10‧‧‧半導體元件
100‧‧‧基板
102‧‧‧接觸層
104‧‧‧活性層
106‧‧‧源極
108‧‧‧汲極
110‧‧‧可移動物件
d‧‧‧間距
Claims (5)
- 一種半導體元件，包括：基板；接觸層位於所述基板上，其中所述接觸層為介電層，而所述接觸層與可移動物件進行相對運動，且所述可移動物件與所述接觸層之間具有相對電位差，其中可藉由所述相對電位差透過所述可移動物件與所述接觸層之間的接觸摩擦產生電場效應；源極和汲極位於所述接觸層中；以及活性層位於所述接觸層與所述基板之間。
- 如申請專利範圍第1項所述的半導體元件，其中所述接觸層的材料包括聚乙二醇、氧化矽、聚醯亞胺、聚偏二氟乙烯、二氧化矽、二氧化鈦、二氧化錫、二硒化鋅、二硒化錫、二氧化釩、多孔性二氧化釩、PCBM、PEDOT、PSS或介電系數>1以上的材料及其組合。
- 如申請專利範圍第1項所述的半導體元件，其中所述接觸層的厚度介於10nm至20mm之間。
- 如申請專利範圍第1項所述的半導體元件，其中所述活性層的材料包括銻化銦、砷化鎵、磷化銦、矽化鍺、碳化矽、鍺、矽、氧化鋅、二氧化鈦、二氧化錫、二氧化釩、五氧化二釩、二硫化鉬、二硒化鎢、二硒化鋅、二硒化錫、二硫化鎢、氧化鎢、二硒化鉬、二硫化鐵、二硫化釩、二硒化釩、二硫化鉻、二硒化鉻、石墨烯、紅磷、黑磷、棕磷、氮化鎵、PCBM、石墨/P3HT： PCBM、MEH-PPV、PEDOT：PS、Alq3、碳60、III-V族或II-VI族半導體或其組合。
- 如申請專利範圍第1項所述的半導體元件，其中所述可移動物件與所述接觸層之間的一間距d之範圍介於10nm至20mm之間。
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| US20120061643A1 (en) * | 2010-01-18 | 2012-03-15 | Sumitomo Electric Industries, Ltd. | GaN-BASED SEMICONDUCTOR LIGHT EMITTING DEVICE AND THE METHOD FOR MAKING THE SAME |
| TW201227835A (en) * | 2010-12-21 | 2012-07-01 | Lg Display Co Ltd | Liquid crystal display device and method of manufacturing the same |
| CN102667684A (zh) * | 2009-12-17 | 2012-09-12 | 李圣昊 | 触控面板的触控单元结构及利用该结构的触控面板 |
| TW201521226A (zh) * | 2013-11-29 | 2015-06-01 | Epistar Corp | 發光裝置 |
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| CN104600114B (zh) * | 2013-11-01 | 2019-02-19 | 北京纳米能源与系统研究所 | 摩擦电场效应晶体管 |
| KR101398708B1 (ko) * | 2014-01-09 | 2014-05-27 | 성균관대학교산학협력단 | 강유전 특성이 커플링된 정전기 에너지 발전 소자 |
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| CN102667684A (zh) * | 2009-12-17 | 2012-09-12 | 李圣昊 | 触控面板的触控单元结构及利用该结构的触控面板 |
| US20120061643A1 (en) * | 2010-01-18 | 2012-03-15 | Sumitomo Electric Industries, Ltd. | GaN-BASED SEMICONDUCTOR LIGHT EMITTING DEVICE AND THE METHOD FOR MAKING THE SAME |
| TW201227835A (en) * | 2010-12-21 | 2012-07-01 | Lg Display Co Ltd | Liquid crystal display device and method of manufacturing the same |
| TW201521226A (zh) * | 2013-11-29 | 2015-06-01 | Epistar Corp | 發光裝置 |
| TW201528441A (zh) * | 2013-12-09 | 2015-07-16 | Sharp Kk | 氮化物半導體元件之製造方法 |
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