TWI595264B - Microscopy imaging apparatus with angle-adjustable lens - Google Patents
Microscopy imaging apparatus with angle-adjustable lens Download PDFInfo
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- TWI595264B TWI595264B TW104121206A TW104121206A TWI595264B TW I595264 B TWI595264 B TW I595264B TW 104121206 A TW104121206 A TW 104121206A TW 104121206 A TW104121206 A TW 104121206A TW I595264 B TWI595264 B TW I595264B
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Description
本發明與用於檢查異方性導電膠的導電粒子的系統有關,尤指該系統中用於取像的顯微取像設備。 The present invention relates to a system for inspecting conductive particles of an anisotropic conductive paste, and more particularly to a microscopic image taking device for image taking in the system.
使用異方性導電膠(anisotropic conductive film;ACF)將一軟性電路板或晶片組裝至一液晶面板或印刷電路板上的技術已經普遍運用於液晶面板、印刷電路板的製造工程中,與此相關者,例如捲帶封裝(tape carrier package;TCP)、薄膜覆晶封裝(chip on film;COF)、將驅動晶片直接組裝到玻璃基板之玻璃覆晶封裝(chip on glass;COG)及將晶片直接組裝到印刷電路板之電路板覆晶封裝(chip on board;COB)等,多以異方性導電膠進行。 The use of anisotropic conductive film (ACF) to assemble a flexible circuit board or wafer onto a liquid crystal panel or printed circuit board has been widely used in the manufacture of liquid crystal panels and printed circuit boards. For example, a tape carrier package (TCP), a chip on film (COF), a chip on glass (COG) that directly assembles a driver wafer to a glass substrate, and a direct wafer A circuit board (COB), etc., which is assembled to a printed circuit board, is mostly performed by an anisotropic conductive paste.
異方性導電膠由導電粒子與絕緣膠材所組成,其具有垂直導通、左右絕緣的特性,然而,在進行熱壓程序時,若異方性導電膠受壓的壓力不均或不足,都會導致可導通的變形導電粒子數目不足,而使傳導性不佳。此外,當導電粒子密度分佈不均時,也會使得傳導性不佳。因此,在使用異方性導電膠的組接場合中,通常需檢查導電粒子壓痕的狀態、數目及分佈,以確定導電性的狀況,台灣公告583403號專利案即顯示用於這類檢查用途的一種導電粒子壓合自動檢測系統。 The anisotropic conductive adhesive is composed of conductive particles and insulating rubber material, and has the characteristics of vertical conduction and left and right insulation. However, when the hot pressing process is performed, if the pressure of the anisotropic conductive adhesive is uneven or insufficient, The number of deformable conductive particles that cause conduction is insufficient, resulting in poor conductivity. In addition, when the density distribution of the conductive particles is uneven, the conductivity is also poor. Therefore, in the case of using an anisotropic conductive paste, it is usually necessary to check the state, number and distribution of the conductive particle indentation to determine the conductivity. The Taiwan Patent No. 583403 shows the use for such inspection. An automatic detection system for conductive particle compression.
該系統係採取影像檢查技術,其利用具有光學顯微鏡的影像擷取模組來擷取晶片接腳經壓合後的數位影像,並將數位影像傳送至影像處理模組處理,該影像處理模組的處理結果即供分析之用,以判斷導電粒子的導電性狀況是否良好。與此類似的技術,亦可見於台灣公開第200910484號案。 The system adopts an image inspection technology, which uses an image capturing module with an optical microscope to capture a digital image of a wafer pin that has been pressed, and transmits the digital image to an image processing module for processing. The processing result is used for analysis to determine whether the conductive state of the conductive particles is good. A similar technology can be found in Taiwan Public Publication No. 200910484.
由於上述導電粒子非常微小,若光學顯微鏡的鏡頭稍有偏差而未正對於目標物上所欲取像的區域,或是鏡頭與該取像區之間的垂直距離稍微不足或稍微過大,都會導致取像不夠清晰,增加後續影像處理難度及分析上的正確性,因此,如何提供一種能確保取像清晰度在可接受範圍內的新式顯微取像設備,乃為當務之急。 Since the above-mentioned conductive particles are very small, if the lens of the optical microscope is slightly deviated and the area to be imaged on the target is not directly, or the vertical distance between the lens and the image capturing area is slightly insufficient or slightly too large, The image is not clear enough to increase the difficulty of subsequent image processing and the correctness of the analysis. Therefore, it is imperative to provide a new type of microscopic image capturing device that ensures the image resolution is within an acceptable range.
有鑑於此,本發明提供一種顯微取像設備,用於對一目標物的取像區進行取像。該顯微取像設備大致包括一x軸移載裝置、一z軸移載裝置係由該x軸移載裝置帶動而能沿x軸移動、一雷射追焦模組係設於該z軸移載裝置的一z軸載板上、及一顯微取像鏡組係設於該z軸載板上。 In view of the above, the present invention provides a microscopic image capturing apparatus for taking an image capturing area of a target. The microscopic image capturing apparatus generally includes an x-axis transfer device, and a z-axis transfer device is driven by the x-axis transfer device to be movable along the x-axis, and a laser tracking module is disposed on the z-axis A z-axis carrier on the transfer device and a micro-mirror lens are mounted on the z-axis carrier.
該雷射追焦模組具有一雷射位移偵測模組正對該目標物的該取像區;而該顯微取像鏡組具有一鏡頭正對該目標物的該取像區。該雷射追焦模組係藉由該x軸移載裝置而能沿x軸移動,並在移動的同時偵測該目標物的取像區與該鏡頭之間的垂直距離變化。該z軸載板係藉由該x軸移載裝置而能沿x軸移動,該z軸移載裝置並能根據該雷射位移偵測模組的偵測結果,微調該z軸載板的高度位置。 The laser tracking module has a laser displacement detecting module that is facing the image capturing area of the target object; and the microscopic image capturing group has a shooting area of the target facing the object. The laser tracking module is movable along the x-axis by the x-axis transfer device, and detects a vertical distance change between the image capturing area of the object and the lens while moving. The z-axis carrier plate is movable along the x-axis by the x-axis transfer device, and the z-axis transfer device can finely adjust the z-axis carrier plate according to the detection result of the laser displacement detecting module. Height position.
此外,該雷射追焦模組還包括一第一z軸調整機構係設於該z軸載板及一x軸調整機構係設於該第一z軸調整機構上且承載該雷射位移偵測模組。該第一z軸調整機構係用以調整該雷射位移偵測模組在z軸上的位置,而該x軸調整機構係用以調整該雷射位移偵測模組在x軸上的位置。該顯微取像鏡組還包括一第二z軸調整機構係設於該z軸載板及一水平角度調整機構係設於該第二z軸調整機構上且承載該顯微影像擷取模組。該第二z軸調整機構係用以調整該顯微影像擷取模組在z軸上的位置,該水平角度調整機構係用以調整該顯微影像擷取模組的角度位置,以使該鏡頭的焦平面與該目標物的取像區平行。 In addition, the laser tracking module further includes a first z-axis adjustment mechanism coupled to the z-axis carrier and an x-axis adjustment mechanism coupled to the first z-axis adjustment mechanism and carrying the laser displacement detector Test module. The first z-axis adjustment mechanism is configured to adjust a position of the laser displacement detecting module on the z-axis, and the x-axis adjusting mechanism is configured to adjust a position of the laser displacement detecting module on the x-axis. . The micromirror group further includes a second z-axis adjustment mechanism coupled to the z-axis carrier and a horizontal angle adjustment mechanism coupled to the second z-axis adjustment mechanism and carrying the microscopic image capture mode group. The second z-axis adjustment mechanism is configured to adjust a position of the micro-image capturing module on the z-axis, and the horizontal angle adjusting mechanism is configured to adjust an angular position of the micro-image capturing module to enable the The focal plane of the lens is parallel to the image capturing area of the target.
較佳地,該顯微取像設備更包括一y軸移載裝置,該顯微取像鏡組係藉由y軸移載裝置而設於該z軸載板上。該y軸移載裝置包括一座板、一組y軸軌道、一y軸載板及一y軸驅動單元。該座板係設於該z軸載板上。該組y軸軌道係設於該座板上且沿y軸延伸一段長度。該y軸 載板係可滑動地設於該組y軸軌道上且承載該顯微影像擷取模組。該y軸驅動單元係設於座板上且用以驅動該y軸載板沿著該組y軸軌道移動。 Preferably, the microscopic image capturing apparatus further comprises a y-axis transfer device disposed on the z-axis carrier by a y-axis transfer device. The y-axis transfer device includes a board, a set of y-axis rails, a y-axis carrier, and a y-axis drive unit. The seat plate is disposed on the z-axis carrier. The set of y-axis tracks are disposed on the seat plate and extend along the y-axis for a length. The y-axis The carrier plate is slidably disposed on the set of y-axis tracks and carries the microscopic image capturing module. The y-axis driving unit is disposed on the seat plate and is configured to drive the y-axis carrier to move along the set of y-axis tracks.
較佳地,該第一z軸調整機構包括一載片及一z軸調整螺栓。該載片係面對面地貼靠於該z軸載板上。該z軸調整螺栓係螺設於該z軸載板上且由下往上頂抵該載片。該x軸調整機構包括一活動板及兩x軸調整螺栓。該活動板係面對面地貼靠於該載片上且承載該雷射位移偵測模組。該兩x軸調整螺栓分別螺設於該載片的兩相對側且分別頂抵該活動板在x軸方向上的兩相對側邊。 Preferably, the first z-axis adjustment mechanism comprises a slide and a z-axis adjustment bolt. The carrier is placed face to face against the z-axis carrier. The z-axis adjusting bolt is screwed on the z-axis carrier and abuts against the carrier from bottom to top. The x-axis adjustment mechanism includes a movable plate and two x-axis adjustment bolts. The movable panel is placed face to face on the carrier and carries the laser displacement detecting module. The two x-axis adjusting bolts are respectively screwed on opposite sides of the slide piece and respectively respectively abut against opposite side edges of the movable plate in the x-axis direction.
較佳地,該y軸移載裝置的該座板具有相互垂直連接的一第一片體及一第二片體。該第一片體係面對面地貼靠於該z軸載板上,該第二z軸調整機構包括一調整螺栓,該調整螺栓螺設於該z軸載板上且由下往上抵靠於該第一片體的底緣。 Preferably, the seat plate of the y-axis transfer device has a first piece and a second piece that are perpendicularly connected to each other. The first piece of the system is abutted against the z-axis carrier. The second z-axis adjustment mechanism includes an adjustment bolt. The adjustment bolt is screwed on the z-axis carrier and abuts from the bottom to the top. The bottom edge of the first sheet.
較佳地,該y軸載板具有一表面背對於該座板的該第二片體,該水平角度調整機構包括一軸柱、一前後擺動座及兩調整螺栓。該軸柱設於該y軸載板的該表面上。該前後擺動座具有相互垂直連接的一第一片體及一第二片體。該第一片體係面對面地貼靠於該y軸載板的該表面上,且該第一片體具有一軸孔對應接收該軸柱,使得該第一片體能在該表面上以該軸柱為軸地作前後擺動。該兩調整螺栓係螺設於該y軸載板上,其中一調整螺栓的位置高於該軸柱,且抵於該第一片體的前側邊的上部,另一調整螺栓的位置低於該軸柱,且推抵該第一片體的前側邊的下部。 Preferably, the y-axis carrier has a second surface facing away from the seat plate, and the horizontal angle adjusting mechanism comprises a shaft column, a front and rear swing seat and two adjusting bolts. The shaft is disposed on the surface of the y-axis carrier. The front and rear swinging seats have a first piece and a second piece that are perpendicularly connected to each other. The first piece is abutted against the surface of the y-axis carrier, and the first body has a shaft hole corresponding to the shaft, so that the first body can be the same on the surface. The shaft is swung back and forth. The two adjusting bolts are screwed on the y-axis carrier, wherein an adjusting bolt is located higher than the shaft and is opposite to the upper portion of the front side of the first body, and the position of the other adjusting bolt is lower than The shaft column is pushed against the lower portion of the front side of the first sheet.
較佳地,該水平角度調整機構包括一左右擺動座及兩支調整螺栓。該左右擺動座係承載該顯微影像擷取模組且具有一軸塊,該軸塊被安裝於該前後擺動座的該第二片體上的一軸槽內,使得該左右擺動座能以軸塊為軸地作左右擺動。該兩支調整螺栓係螺設於該前後擺動座的該第二片體上,其中一調整螺栓的位置高於該軸塊,且抵於該左右擺動座的一側邊的上部,另一調整螺栓的位置低於該軸塊,且抵於該左右擺動座的該側邊的下部。 Preferably, the horizontal angle adjusting mechanism comprises a left and right swinging seat and two adjusting bolts. The left and right swinging seat carries the microscopic image capturing module and has a shaft block, and the shaft block is mounted in a shaft groove on the second piece of the front and rear swinging seat, so that the left and right swinging seat can be a shaft block Shake left and right for the axis. The two adjusting bolts are screwed on the second piece of the front and rear swinging seats, wherein an adjusting bolt is positioned higher than the shaft block and abuts against an upper portion of one side of the left and right swinging seats, and another adjustment The bolt is positioned lower than the axle block and abuts the lower portion of the side of the left and right swing seats.
1‧‧‧x軸移載裝置 1‧‧‧x-axis transfer device
10‧‧‧長條座 10‧‧‧ long strip
11‧‧‧x軸軌道 11‧‧‧x-axis orbit
12‧‧‧x軸載板 12‧‧‧x axle carrier
13‧‧‧x軸驅動單元 13‧‧‧x-axis drive unit
13a‧‧‧定子 13a‧‧‧stator
13b‧‧‧動子 13b‧‧‧ mover
2‧‧‧z軸移載裝置 2‧‧‧z-axis transfer device
20‧‧‧z軸軌道 20‧‧‧z axis orbit
21‧‧‧z軸載板 21‧‧‧z axle carrier
22‧‧‧z軸驅動單元 22‧‧‧z-axis drive unit
220‧‧‧伺服馬達 220‧‧‧Servo motor
3‧‧‧雷射追焦模組 3‧‧‧Laser tracking module
30‧‧‧雷射位移偵測模組 30‧‧‧Laser Displacement Detection Module
31‧‧‧雷射調整組件 31‧‧‧Laser adjustment components
32‧‧‧第一z軸調整機構 32‧‧‧First z-axis adjustment mechanism
320‧‧‧載片 320‧‧‧ slides
321‧‧‧z軸調整螺栓 321‧‧‧z axis adjustment bolt
322‧‧‧擋件 322‧‧‧ §
323‧‧‧翼板 323‧‧‧ wing
324‧‧‧長導孔 324‧‧‧Long guide hole
325‧‧‧導板 325‧‧‧ Guide
326‧‧‧栓板 326‧‧‧
327‧‧‧長形階級孔 327‧‧‧Long class hole
328‧‧‧導栓 328‧‧‧ Guide bolt
33‧‧‧x軸調整機構 33‧‧‧x-axis adjustment mechanism
330‧‧‧活動板 330‧‧‧ activity board
331‧‧‧x軸調整螺栓 331‧‧‧x axle adjustment bolt
332‧‧‧擋件 332‧‧‧ §
336‧‧‧導栓 336‧‧‧ lead
337‧‧‧長導孔 337‧‧‧Long guide hole
4‧‧‧y軸移載裝置 4‧‧‧y-axis transfer device
40‧‧‧座板 40‧‧‧ seat board
400‧‧‧第一片體 400‧‧‧ first piece
401‧‧‧第二片體 401‧‧‧Second body
41‧‧‧y軸軌道 41‧‧‧y-axis orbit
42‧‧‧y軸載板 42‧‧‧y axle carrier
43‧‧‧y軸驅動單元 43‧‧‧y-axis drive unit
43a‧‧‧定子 43a‧‧‧ Stator
43b‧‧‧動子 43b‧‧‧ mover
5‧‧‧顯微取像鏡組 5‧‧‧Microscope image group
50‧‧‧顯微影像擷取模組 50‧‧‧Microscopic image capture module
501‧‧‧鏡頭 501‧‧‧ lens
51‧‧‧鏡組調整組件 51‧‧‧Mirror adjustment components
52‧‧‧第二z軸調整機構 52‧‧‧Second z-axis adjustment mechanism
520‧‧‧調整螺栓 520‧‧‧Adjustment bolt
521‧‧‧栓板 521‧‧‧ board
522‧‧‧擋件 522‧‧‧ §
523‧‧‧導栓 523‧‧‧ Guide bolt
524‧‧‧長導孔 524‧‧‧Long guide hole
53‧‧‧水平角度調整機構 53‧‧‧Horizontal angle adjustment mechanism
530‧‧‧軸柱 530‧‧‧ shaft column
531‧‧‧前後擺動座 531‧‧‧ swinging seat
531a‧‧‧第一片體 531a‧‧‧first body
531b‧‧‧第二片體 531b‧‧‧Second body
531c‧‧‧軸孔 531c‧‧‧Axis hole
531d‧‧‧軸槽 531d‧‧‧ shaft slot
532‧‧‧栓座 532‧‧‧ pedestal
533‧‧‧調整螺栓 533‧‧‧Adjusting bolts
534‧‧‧擋件 534‧‧‧ §
535‧‧‧弧形導孔 535‧‧‧Arc-shaped guide holes
535a‧‧‧導栓 535a‧‧‧Tip
536‧‧‧左右擺動座 Swinging seat around 536‧‧
536a‧‧‧上板 536a‧‧‧Upper board
536b‧‧‧下板 536b‧‧‧ lower board
536c‧‧‧立板 536c‧‧‧立板
536d‧‧‧軸塊 536d‧‧‧ axle block
537‧‧‧調整螺栓 537‧‧‧Adjustment bolt
538‧‧‧擋件 538‧‧‧ §
539‧‧‧栓座 539‧‧‧ pedestal
540‧‧‧支導栓 540‧‧‧Support bolt
541‧‧‧弧形導孔 541‧‧‧Arc-shaped guide holes
8‧‧‧目標物 8‧‧‧ Targets
80‧‧‧晶片 80‧‧‧ wafer
801‧‧‧前半邊 801‧‧‧ first half
802‧‧‧後半邊 The second half of 802‧‧
9‧‧‧吸附載台 9‧‧‧Adsorption platform
第一圖係本發明顯微取像設備的立體分解示意圖。 The first figure is a perspective exploded view of the microscopic image capturing apparatus of the present invention.
第二圖係本發明顯微取像設備的立體結構之局部放大示意圖。 The second drawing is a partially enlarged schematic view showing the three-dimensional structure of the microscopic image capturing apparatus of the present invention.
第三圖係本發明顯微取像設備的前視圖。 The third drawing is a front view of the microscopic image taking apparatus of the present invention.
第四圖係本發明顯微取像設備的側視圖。 The fourth drawing is a side view of the microscopic image taking apparatus of the present invention.
第五圖係本發明顯微取像設備對一基板掃描取像的路徑圖。 The fifth figure is a path diagram of the scanning and imaging of a substrate by the microscopic image capturing apparatus of the present invention.
第六圖係本發明顯微取像設備之雷射調整組件的立體分解示意圖。 Figure 6 is a perspective exploded view of the laser adjustment assembly of the microscopic image taking device of the present invention.
第七圖係本發明顯微取像設備之雷射追焦模組及其調整組件的立體結構示意圖。 The seventh figure is a three-dimensional structure diagram of a laser focusing module and an adjusting component thereof of the microscopic image capturing apparatus of the present invention.
第八圖係本發明顯微取像設備之雷射追焦模組及其調整組件的前視圖。 The eighth drawing is a front view of the laser focusing module of the microscopic image capturing apparatus of the present invention and its adjusting assembly.
第九圖係本發明顯微取像設備之顯微取像鏡組及其調整組件的立體分解示意圖。 The ninth drawing is a perspective exploded view of the microscopic image taking group of the microscopic image capturing apparatus of the present invention and its adjusting assembly.
第十圖係本發明顯微取像設備之顯微取像鏡組及其調整組件的立體結構示意圖。 The tenth drawing is a schematic view showing the three-dimensional structure of the microscopic image taking group of the microscopic image capturing apparatus of the present invention and its adjusting assembly.
第十一圖係本發明顯微取像設備之顯微取像鏡組之調整組件的立體分解示意圖。 The eleventh drawing is a perspective exploded view of the adjustment assembly of the microscopic image taking lens set of the microscopic image capturing apparatus of the present invention.
第十二圖係本發明顯微取像設備之顯微取像鏡組之調整組件的立體結構示意圖。 Twelfth is a schematic perspective view showing the adjustment structure of the microscopic image taking lens set of the microscopic image capturing apparatus of the present invention.
第十三圖係本發明顯微取像設備之顯微取像鏡組之調整組件的局部側視圖。 Figure 13 is a partial side elevational view of the adjustment assembly of the microscopic image taking set of the microscopic image taking device of the present invention.
第十四圖係本發明顯微取像設備之顯微取像鏡組之調整組件的局部前視圖。 Figure 14 is a partial front elevational view of the adjustment assembly of the microscopy lens assembly of the microscopic image taking device of the present invention.
第一圖顯示本發明之顯微取像設備的一個較佳實施例,其包括一雷射追焦模組3及一顯微取像鏡組5,並藉此二者對第二圖所示的目標物8進行顯微取像。 The first figure shows a preferred embodiment of the microscopic image capturing apparatus of the present invention, which comprises a laser tracking module 3 and a microscopic lens assembly 5, and the two are shown in the second figure. Target 8 is subjected to microscopic imaging.
如第二圖所示,在此例子中,目標物8係為放置在一吸附載台9上的一液晶面板,該液晶面板被吸附載台9吸住而固定不動,且其相鄰的一長側邊及一短側邊係凸出於吸附載台9的外面。該液晶面板還具 有多個晶片80,該些晶片80係藉由玻璃覆晶封裝技術(chip on glass;COG),也就是利用異方性導電膠(anisotropic conductive film;ACF)而熱壓到形成於該液晶面板的一頂面的多個導電金屬墊(圖中未示)上,其中一晶片80鄰近且平行於該液晶面板的該短側邊,其餘晶片80鄰近該液晶面板的該長側邊,且平行於該長側邊地排列成一直線。需指出的是,各側邊所對應的晶片80的數量不以前述為限。 As shown in the second figure, in this example, the target 8 is a liquid crystal panel placed on an adsorption stage 9, which is held by the adsorption stage 9 and fixed, and its adjacent one The long side and a short side protrude from the outside of the adsorption stage 9. The liquid crystal panel also has There are a plurality of wafers 80 which are hot pressed onto the liquid crystal panel by chip on glass (COG), that is, using an anisotropic conductive film (ACF). a plurality of conductive metal pads (not shown) on a top surface, wherein a wafer 80 is adjacent to and parallel to the short side of the liquid crystal panel, and the remaining wafers 80 are adjacent to the long side of the liquid crystal panel and are parallel Arranged in a straight line on the long side. It should be noted that the number of wafers 80 corresponding to each side is not limited to the foregoing.
目標物8的一底面還具有多個取像區,在此例子中,每個取像區剛好對應位在各個晶片80的正下方,且每個取像區的大小大致相同於相對應的晶片80的底面面積。由於該些晶片80所佔據的是該液晶面板的透明部份,故可利用顯微取像鏡組5的一顯微影像擷取模組50的一鏡頭501對該些取像區進行取像。所取得的影像資料能顯示異方性導電膠的導電粒子在導電金屬墊上所造成的壓痕。這些影像資料接著被傳送到一影像分析判斷單元(圖中未示)進行影像處理與分析,並根據分析結果判讀每一晶片80與對應導電金屬墊的導電連接狀況的良莠。其中,目標物8所指的物品種類及數量,不以該液晶面板為限,例如可為一或多片電路板或其它種類物品供分別放在一或多個吸附載台9上。 A bottom surface of the object 8 further has a plurality of image capturing regions. In this example, each of the image capturing regions is located just below the respective wafers 80, and each of the image capturing regions is substantially the same size as the corresponding wafer. The bottom surface area of 80. Since the wafers 80 occupy a transparent portion of the liquid crystal panel, the image capturing regions of the microscopic image capturing module 50 of the microscopic image capturing lens group 5 can be imaged by using a lens 501 of the microscopic image capturing module 50. . The obtained image data can show the indentation caused by the conductive particles of the anisotropic conductive paste on the conductive metal pad. The image data is then transmitted to an image analysis judging unit (not shown) for image processing and analysis, and the quality of the conductive connection between each wafer 80 and the corresponding conductive metal pad is determined based on the analysis result. The type and quantity of the items referred to by the target 8 are not limited to the liquid crystal panel. For example, one or more circuit boards or other types of articles may be respectively placed on one or more adsorption stages 9 .
如第三、四圖所示,雷射追焦模組3與顯微取像鏡組5都已藉本身的調整機構(容後詳述)而手動調整到能對目標物8清晰取像的位置(清晰取像是指所擷取到的影像清晰度在可接受範圍內),且此目標物8已藉由吸附載台9的轉動而轉動到使其長側邊確實平行於顯微取像鏡組5的移動路線。雷射追焦模組3係能沿x軸移動,並在移動的同時偵測目標物8的取像區與鏡頭501之間的垂直距離變化。顯微取像鏡組5係能跟隨雷射追焦模組3一起沿x軸移動,並能根據雷射追焦模組3的一雷射位移偵測模組30的偵測結果,與雷射追焦模組3一起沿z軸微調高度位置,以使顯微影像擷取模組50的鏡頭501與雷射位移偵測模組30在一起沿x軸移動時都隨時保持在能對目標物8清晰取像的位置,以確保所攝取到的影像的清晰度能符合要求。如此,就算目標物8的取像區有凹凸不平之處而使得鏡頭501與取像區之間的垂直距離(焦距)在該處稍微不足或稍微過大,都能藉由雷射位移偵測模組30予以偵測出來,並依偵測結果微調雷射追焦模組3與顯微取像鏡組5的高度位置,以使鏡頭501與取像區之間的垂直距離 (焦距)保持在一預定值,確保雷射位移偵測模組30與鏡頭501在該處仍能對目標物8清晰取像。 As shown in the third and fourth figures, both the laser tracking module 3 and the micro-mirror group 5 have been manually adjusted to obtain a clear image of the object 8 by its own adjustment mechanism (described later in detail). Position (clear image capture means that the captured image clarity is within an acceptable range), and the target 8 has been rotated by the rotation of the adsorption stage 9 such that its long side is indeed parallel to the microscopic take Like the movement path of the mirror group 5. The laser tracking module 3 is capable of moving along the x-axis and detecting a change in the vertical distance between the image capturing area of the object 8 and the lens 501 while moving. The micro-mirror group 5 can move along the x-axis along with the laser-tracking module 3, and can detect the result of the laser-detecting module 30 according to the laser-tracking module 3, and the mine The shot tracking module 3 finely adjusts the height position along the z axis so that the lens 501 of the micro image capturing module 50 and the laser displacement detecting module 30 are always in the same position when moving along the x axis. The object 8 is clearly positioned to ensure that the sharpness of the captured image meets the requirements. Thus, even if the image capturing area of the object 8 has irregularities such that the vertical distance (focal length) between the lens 501 and the image capturing area is slightly insufficient or slightly too large, the laser displacement detecting mode can be used. The group 30 is detected, and the height position of the laser tracking module 3 and the micro-mirror group 5 is finely adjusted according to the detection result, so that the vertical distance between the lens 501 and the image capturing area is The (focal length) is maintained at a predetermined value to ensure that the laser displacement detecting module 30 and the lens 501 can still clearly image the object 8 there.
如第三及五圖所示,當位於一原始位置的鏡頭501隨著顯微取像鏡組5從一起點A移動到一終點B時,顯微影像擷取模組50就通過鏡頭501以線掃瞄方式(line scan)取得鄰近目標物8長側邊的每一個取像區(即每一晶片80的底面)的影像資料,並將它們傳送給上述影像分析判斷單元。在此例子中,因鏡頭501的取像範圍很小,故所取得的影像資料只是該些取像區的前半邊801的影像,因此,顯微取像鏡組5還具有沿y軸移動的能力,當鏡頭501到達終點B時,顯微取像鏡組5即相對於雷射追焦模組3地稍微往前移(即往吸附載台9方向移動),以使鏡頭501沿y軸向前移動到能使其取像範圍涵蓋該些取像區的後半邊802。接著,顯微取像鏡組5沿x軸往反向移動,使得鏡頭501從該終點B移動到該起點A,在此移動過程中,顯微影像擷取模組50通過鏡頭501以線掃瞄方式取得鄰近目標物8長側邊的每一個取像區後半邊802的影像資料,並將它們傳送給上述影像分析判斷單元。當鏡頭501回到起點A時,顯微取像鏡組5即相對於雷射追焦模組3地稍微往後移,以使鏡頭501沿y軸向後移動返回該原始位置。至此,本發明之顯微取像設備即完成對鄰近目標物8長側邊的取像區的顯微取像作業。在此例子中,當鏡頭501回到該原始位置之後,吸附載台9轉動90度,以使鄰近目標物8短側邊的取像區位於雷射位移偵測模組30與鏡頭501的正上方,隨後本發明之顯微取像設備即對鄰近目標物8短側邊的取像區進行顯微取像作業,此大致相同於前述,容不贅述。 As shown in the third and fifth figures, when the lens 501 at an original position moves from the point A to the end point B as the micro-mirror group 5 moves, the micro-image capturing module 50 passes through the lens 501. The line scan acquires image data of each of the image capturing areas (i.e., the bottom surface of each wafer 80) adjacent to the long side of the object 8, and transmits them to the image analysis judging unit. In this example, since the image capturing range of the lens 501 is small, the obtained image data is only the image of the front half 801 of the image capturing area, and therefore, the microscopic image capturing lens group 5 also has a movement along the y axis. Capability, when the lens 501 reaches the end point B, the micro-mirror group 5 is moved forward slightly relative to the laser-tracking module 3 (ie, moving toward the adsorption stage 9) so that the lens 501 is along the y-axis. Move forward to enable the image capture range to cover the second half 802 of the capture zones. Next, the micro-mirror group 5 is moved in the opposite direction along the x-axis, so that the lens 501 is moved from the end point B to the starting point A. During the movement, the micro-image capturing module 50 is scanned by the lens 501. The image data of the second half 802 of each image capturing area adjacent to the long side of the object 8 is obtained by the aiming method, and transmitted to the image analysis judging unit. When the lens 501 returns to the starting point A, the micro-mirror group 5 is slightly moved backward relative to the laser-tracking module 3 to move the lens 501 back in the y-axis back to the original position. Up to this point, the microscopic image capturing apparatus of the present invention completes the microscopic image capturing operation of the image capturing area adjacent to the long side of the object 8. In this example, after the lens 501 returns to the original position, the adsorption stage 9 is rotated by 90 degrees so that the image capturing area adjacent to the short side of the target 8 is located in the positive direction of the laser displacement detecting module 30 and the lens 501. Above, the microscopic image capturing apparatus of the present invention performs microscopic image capturing operation on the image capturing area adjacent to the short side of the object 8, which is substantially the same as the foregoing, and is not described herein.
從上述說明可知,雷射追焦模組3與顯微取像鏡組5是具有一起沿x軸移動及一起沿z軸移動的能力,且顯微取像鏡組5還單獨具有沿y軸移動的能力。其中,雷射追焦模組3與顯微取像鏡組5沿x軸一起移動是為了讓鏡頭501依預定路線以掃瞄方式取得目標物8的取像區的影像資料。顯微取像鏡組5自己沿y軸移動是為了變換鏡頭501的取像範圍所涵蓋的區域,這是在鏡頭501的取像範圍很小的時候才需要的功能,並非必要。至於雷射追焦模組3與顯微取像鏡組5沿z軸一起移動,則是為了隨時調整兩者的高度位置,以使鏡頭501在移動過程中能保持在能對目標物8清晰取像的位置。以下進一步說明能實現雷射追焦模組3與顯微取像鏡組5前述 移動能力的較佳實施例,但不以此為限。 As can be seen from the above description, the laser tracking module 3 and the micro-mirror group 5 have the ability to move along the x-axis and move along the z-axis together, and the micro-mirror group 5 also has a separate y-axis. The ability to move. The laser tracking module 3 and the micro-mirror lens group 5 move together along the x-axis to enable the lens 501 to acquire the image data of the image capturing area of the object 8 in a scanning manner according to a predetermined route. The micro-mirror lens group 5 itself moves along the y-axis in order to change the area covered by the image capturing range of the lens 501, which is a function required when the image capturing range of the lens 501 is small, and is not necessary. As for the laser tracking module 3 and the micro-mirror group 5 moving along the z-axis, it is to adjust the height position of the two at any time, so that the lens 501 can be kept clear to the target 8 during the movement. Take the location of the image. The following further illustrates that the laser tracking module 3 and the micro-mirror group 5 can be implemented as described above. A preferred embodiment of the mobility capability, but not limited thereto.
如第一圖所示,本發明之顯微取像設備還包括一x軸移載裝置1、由x軸移載裝置1帶動而能沿x軸左右移動的一z軸移載裝置2、及由z軸移載裝置2帶動而能沿z軸作上下移動的一y軸移載裝置4。其中,z軸移載裝置2係承載雷射追焦模組3,y軸移載裝置4係承載顯微取像鏡組5。然而,顯微取像鏡組5亦可選擇直接由z軸移載裝置2予以承載,此時即無需y軸移載裝置4。 As shown in the first figure, the microscopic image capturing apparatus of the present invention further includes an x-axis transfer device 1, a z-axis transfer device 2 driven by the x-axis transfer device 1 and movable along the x-axis, and A y-axis transfer device 4 that is driven by the z-axis transfer device 2 to move up and down along the z-axis. The z-axis transfer device 2 carries the laser tracking module 3, and the y-axis transfer device 4 carries the micro-mirror group 5. However, the micro-mirror group 5 can also be selected to be carried directly by the z-axis transfer device 2, in which case the y-axis transfer device 4 is not required.
x軸移載裝置1可選用第一圖中所示的構造,其包括一長條座10、一組x軸軌道11係設於長條座10上且沿x軸延伸一段長度、一x軸載板12係可滑動地設於x軸軌道11上、以及一x軸驅動單元13係設於長條座10上且連接x軸載板12。較佳地,x軸驅動單元13可選用現有的線性馬達。第一、四圖中顯示該線性馬達的定子13a,而滑行於定子13a內的動子13b則連接著x軸載板12。如此,x軸驅動單元13就能驅動x軸載板12沿著x軸軌道11作左右移動。 The x-axis transfer device 1 can be selected from the configuration shown in the first figure, and includes a long seat 10, a set of x-axis rails 11 are attached to the elongated base 10 and extend along the x-axis for a length, an x-axis. The carrier 12 is slidably disposed on the x-axis rail 11 and an x-axis driving unit 13 is attached to the elongated base 10 and connected to the x-axis carrier 12. Preferably, the x-axis drive unit 13 can be selected from existing linear motors. The stator 13a of the linear motor is shown in Figs. 4 and 4, and the mover 13b slid in the stator 13a is connected to the x-axis carrier 12. Thus, the x-axis driving unit 13 can drive the x-axis carrier 12 to move left and right along the x-axis rail 11.
z軸移載裝置2可選用第一圖中所示的構造,其包括一組z軸軌道20係設於x軸載板12上且沿z軸延伸一段長度、一z軸載板21係可滑動地設於z軸軌道20上、以及設於x軸載板12上的一z軸驅動單元22。較佳地,z軸驅動單元22可選用現有產品,例如包含一伺服馬達220及一組精密導螺桿機構(圖中未示)的習知伺服驅動模組。如此,z軸驅動單元22就能驅動z軸載板21沿著z軸軌道20作上下移動。 The z-axis transfer device 2 can be selected from the configuration shown in the first figure, and includes a set of z-axis rails 20 which are arranged on the x-axis carrier 12 and extend along the z-axis for a length, and a z-axis carrier 21 can be A z-axis drive unit 22 is slidably disposed on the z-axis rail 20 and on the x-axis carrier 12. Preferably, the z-axis drive unit 22 can be selected from existing products, such as a conventional servo drive module including a servo motor 220 and a set of precision lead screw mechanisms (not shown). Thus, the z-axis drive unit 22 can drive the z-axis carrier 21 to move up and down along the z-axis track 20.
雷射追焦模組3與顯微取像鏡組5設於z軸載板21上,z軸載板21可滑動地設於x軸載板12,因此,在x軸驅動單元13的帶動下,雷射追焦模組3、顯微取像鏡組5與z軸載板21能一起沿x軸移動,一如第三圖所示,在z軸驅動單元22的帶動下,雷射追焦模組3與顯微取像鏡組5能一起沿z軸上下移動,一如第四圖所示。 The laser focusing module 3 and the micro-mirror group 5 are disposed on the z-axis carrier 21, and the z-axis carrier 21 is slidably disposed on the x-axis carrier 12, and thus is driven by the x-axis driving unit 13. Next, the laser tracking module 3, the micro-mirror group 5 and the z-axis carrier 21 can move together along the x-axis, as shown in the third figure, driven by the z-axis driving unit 22, the laser The chasing module 3 and the micro-mirror group 5 can move up and down along the z-axis together, as shown in the fourth figure.
顯微取像鏡組5可選擇直接連接到z軸載板21上,較佳地,可藉由一y軸移載裝置4連接到z軸載板21上。y軸移載裝置4可選用第一圖所示的構造,其包括一座板40係設於z軸載板21上、一組y軸軌道41係設於座板40上且沿y軸延伸一段長度、一y軸載板42係可滑動地設於y軸軌道41上、以及一y軸驅動單元43係設於座板40上且連接y軸載 板42。較佳地,y軸驅動單元43可選用現有的線性馬達,第一、三圖中顯示該線性馬達的定子43a固定在座板40上且沿y軸延伸一段長度,而滑行於定子43a內的動子43b則連接著y軸載板42。如此,y軸驅動單元43就能驅動y軸載板42沿著y軸軌道41作前後移動,使得設於y軸載板42的顯微取像鏡組5跟著前後移動,進而使得鏡頭501能相對於雷射位移偵測模組30沿y軸作前後移動。 The micro-mirror group 5 can be selectively connected directly to the z-axis carrier 21, preferably via a y-axis transfer device 4 to the z-axis carrier 21. The y-axis transfer device 4 can be selected from the configuration shown in the first figure, and includes a plate 40 attached to the z-axis carrier 21, and a set of y-axis rails 41 attached to the seat plate 40 and extending along the y-axis. The length, a y-axis carrier plate 42 is slidably disposed on the y-axis track 41, and a y-axis drive unit 43 is attached to the seat plate 40 and connected to the y-axis carrier. Board 42. Preferably, the y-axis driving unit 43 can select an existing linear motor. The stator 43a of the linear motor shown in the first and third figures is fixed on the seat plate 40 and extends along the y-axis for a length, and is slid in the stator 43a. The sub-43b is connected to the y-axis carrier 42. In this way, the y-axis driving unit 43 can drive the y-axis carrier 42 to move back and forth along the y-axis track 41, so that the micro-mirror group 5 disposed on the y-axis carrier 42 moves back and forth, thereby enabling the lens 501 to The laser displacement detecting module 30 moves back and forth along the y axis.
為了使雷射追焦模組3與顯微取像鏡組5能藉其本身調整機構而手動快速調整到能對目標物8清晰取像的位置,如第六~八圖所示,雷射追焦模組3還包括一雷射調整組件31,如第九~十一圖所示,顯微取像鏡組5還包括一鏡組調整組件51。 In order to enable the laser tracking module 3 and the micro-mirror group 5 to be manually and quickly adjusted to the position where the object 8 can be clearly imaged by its own adjustment mechanism, as shown in the sixth to eighth images, the laser The tracking module 3 further includes a laser adjustment component 31. As shown in the ninth through eleventh, the microscopy lens assembly 5 further includes a lens adjustment assembly 51.
第六~八圖顯示雷射調整組件31的一個較佳實施例,其包設於z軸載板21上的一第一z軸調整機構32、及設於第一z軸調整機構32上且承載雷射位移偵測模組30的一x軸調整機構33。 6 to 8 show a preferred embodiment of the laser adjustment assembly 31, which is provided on the z-axis carrier 21 with a first z-axis adjustment mechanism 32 and on the first z-axis adjustment mechanism 32. An x-axis adjustment mechanism 33 carrying the laser displacement detecting module 30 is provided.
第一z軸調整機構32用以調整雷射位移偵測模組30相對於z軸載板21作上下移動。在此例子中,第一z軸調整機構32係選擇圖中所示的構造,其至少包括一載片320、兩支z軸調整螺栓321(也可以一支或更多支)、及一擋件322。該載片320係面對面地貼靠於z軸載板21上,兩z軸調整螺栓321分別螺設於z軸載板21兩相對側且分別由下往上頂抵載片320,較佳地,兩z軸調整螺栓321係螺設於z軸載板21的兩側栓板210上且頂抵著載片320的兩側翼板323。擋件322係穿過載片320的一長形階級孔327而固定在z軸載板21上,用以擋住載片320,使它保持貼靠且不致於脫離。如此,當轉動兩z軸調整螺栓321,就能使載片320沿z軸方向上移或下移。其中,為了確保載片320能垂直地上下移動,第一z軸調整機構32還包括多支導栓328及兩導板325,該些導栓328設於z軸載板21上且分別對應位於載片320的多個緃向長導孔324內,兩導板325設於z軸載板21上且分別貼靠載片320的兩相對側邊。 The first z-axis adjustment mechanism 32 is configured to adjust the vertical displacement of the laser displacement detecting module 30 relative to the z-axis carrier 21. In this example, the first z-axis adjustment mechanism 32 selects the configuration shown in the drawing, which includes at least one slide 320, two z-axis adjustment bolts 321 (may also be one or more), and one stop. Pieces 322. The carrier 320 is abutted against the z-axis carrier 21 facing each other, and the two z-axis adjusting bolts 321 are respectively screwed on opposite sides of the z-axis carrier 21 and respectively abut the carrier 320 from the bottom to the top, preferably The two z-axis adjusting bolts 321 are screwed on the two side plates 210 of the z-axis carrier 21 and abut against the side flaps 323 of the carrier 320. The stop member 322 is secured to the z-axis carrier plate 21 through an elongate member aperture 327 of the carrier sheet 320 for retaining the carrier sheet 320 so that it remains in abutment without detachment. Thus, when the two z-axis adjustment bolts 321 are rotated, the slide piece 320 can be moved up or down in the z-axis direction. The first z-axis adjustment mechanism 32 further includes a plurality of guide pins 328 and two guide plates 325. The guide pins 328 are disposed on the z-axis carrier 21 and are respectively located corresponding to the slides 320. The plurality of guide plates 325 are disposed on the z-axis carrier plates 21 and abut the opposite sides of the carrier 320, respectively.
x軸調整機構33用以調整雷射位移偵測模組30相對於z軸載板21作左右移動。在此例子中,x軸調整機構33係選擇圖中所示的構造,其至少包括一活動板330、兩支x軸調整螺栓331、及兩個擋件332(也可以一或多個)。活動板330係面對面地貼靠於載片320上,兩x軸調整螺栓331 分別螺設於載片320兩相對側且分別頂抵活動板330的左側邊及右側邊,較佳地,兩x軸調整螺栓331係螺設於載片320上的兩相對栓板326上且頂抵著活動板330中間部份的左側邊及右側邊。擋件332係固定在載片320上,用以擋住活動板330,使它保持貼靠且不致於脫離。如此,只需一手轉動左邊的x軸調整螺栓331使其向右推抵活動板330的左側邊,另一手反向轉動右邊的x軸調整螺栓331使其向右後退,就能使活動板330向右移動。至於調整活動板330向左移動的動作與前述類似,差別只在於轉動兩x軸調整螺栓331的動作相反而已,容不贅述。其中,為了確保活動板330能水平地左右移動,x軸調整機構33還包括多支導栓336,該些導栓336設於載片320上且分別對應位於活動板330的多個橫向長導孔337內。 The x-axis adjustment mechanism 33 is configured to adjust the left and right movement of the laser displacement detecting module 30 with respect to the z-axis carrier 21. In this example, the x-axis adjustment mechanism 33 selects the configuration shown in the drawings, which includes at least one movable plate 330, two x-axis adjustment bolts 331, and two stops 332 (may also be one or more). The movable plate 330 is placed face to face on the slide 320, and the two x-axis adjusting bolts 331 The two x-axis adjusting bolts 331 are screwed on the opposite side plates 326 of the carrier 320, and are respectively screwed on opposite sides of the carrier 320 and respectively abutted against the left side and the right side of the movable plate 330. The top is abutted against the left side and the right side of the middle portion of the movable panel 330. The stop member 332 is fixed to the carrier 320 for blocking the movable plate 330 so that it remains in contact without being detached. In this way, the left x-axis adjusting bolt 331 is rotated by one hand to push it to the right side of the movable plate 330, and the other hand reversely rotates the right x-axis adjusting bolt 331 to retreat to the right, so that the movable plate 330 can be made. move to the right. The action of adjusting the movement of the movable plate 330 to the left is similar to that described above, except that the operation of rotating the two x-axis adjusting bolts 331 is reversed, and will not be described again. In order to ensure that the movable plate 330 can move horizontally to the left and right, the x-axis adjusting mechanism 33 further includes a plurality of guiding pins 336 disposed on the slide 320 and corresponding to the plurality of lateral long guides located on the movable plate 330 respectively. Inside the hole 337.
如第八圖所示,藉由轉動兩調整螺栓321就能使載片320上下移動,以使雷射位移偵測模組30跟著上下移動到想要的高度位置。藉由轉動兩調整螺栓331就能使活動板330左右位移,以使雷射位移偵測模組30跟著左右移動到想要的位置。 As shown in the eighth figure, the slide 320 can be moved up and down by rotating the two adjustment bolts 321 to move the laser displacement detecting module 30 up and down to a desired height position. The movable plate 330 can be displaced to the left and right by rotating the two adjusting bolts 331 to move the laser displacement detecting module 30 to the left and right to the desired position.
第九~十圖顯示鏡組調整組件一個較佳實施例,其包括設於z軸載板21上的一第二z軸調整機構52及設於y軸載板42上的一水平角度調整機構53。第二z軸調整機構52用以調整顯微影像擷取模組50的高度位置。水平角度調整機構53承載顯微影像擷取模組50,用以調整顯微影像擷取模組50使其焦平面與目標物8的取像區平行。 9 to 10 show a preferred embodiment of the lens assembly assembly, comprising a second z-axis adjustment mechanism 52 disposed on the z-axis carrier 21 and a horizontal angle adjustment mechanism disposed on the y-axis carrier 42 53. The second z-axis adjustment mechanism 52 is used to adjust the height position of the micro image capturing module 50. The horizontal angle adjusting mechanism 53 carries the microscopic image capturing module 50 for adjusting the microscopic image capturing module 50 such that its focal plane is parallel to the image capturing area of the object 8.
在此例子中,y軸移載裝置4的座板40具有相互垂直且一體成型的一第一片體400及一第二片體401,第一片體400係面對面地貼靠於z軸載板21上。 In this example, the seat plate 40 of the y-axis transfer device 4 has a first piece 400 and a second piece 401 which are formed integrally and perpendicularly to each other. The first piece 400 is placed face to face against the z-axis. On the board 21.
在此例子中,第二z軸調整機構52係選擇圖中所示的構造,其至少包括一支調整螺栓520(也可以多支)及一擋件522。調整螺栓520螺設於z軸載板21的一栓板521上且由下往上抵靠於第一片體400的底緣。擋片522擋住第一片體400的一側,使它保持貼靠且不致於脫離。如此,只需轉動調整螺栓520就能一併調整y軸移載裝置4與顯微影像擷取模組50的高度位置。其中,為了確保座板40能垂直地上下移動,z軸調整機構52還包括多支導栓523,該些導栓523設於z軸載板21上且分別對應位於座板40的第一片體400的多個緃向長導孔524內。 In this example, the second z-axis adjustment mechanism 52 selects the configuration shown in the drawings, which includes at least one adjustment bolt 520 (may also be multiple) and a stop 522. The adjusting bolt 520 is screwed on a bolt plate 521 of the z-axis carrier 21 and abuts against the bottom edge of the first sheet 400 from bottom to top. The flap 522 blocks one side of the first body 400 such that it remains in abutment and does not disengage. Thus, the height position of the y-axis transfer device 4 and the micro-image capturing module 50 can be adjusted together by simply rotating the adjusting bolt 520. In order to ensure that the seat plate 40 can move vertically up and down, the z-axis adjustment mechanism 52 further includes a plurality of guide pins 523 disposed on the z-axis carrier 21 and corresponding to the first piece of the seat plate 40, respectively. A plurality of turns of the body 400 are in the long guide holes 524.
如第十一、十二圖所示,在此例子中,水平角度調整機構53係選擇圖中所示的構造,其至少包括一前後擺動座531、兩調整螺栓533、及一擋件534。前後擺動座531具有相互垂直的一第一片體531a及一第二片體531b,第一片體531a係面對面地貼靠於且樞設於y軸載板42上,較佳地,第一片體531a具有一軸孔531c對應接收設於y軸載板42上的一軸柱530,使得前後擺動座531能以軸柱530為軸地作前後擺動。擋件534設於y軸載板42上,用於擋住第一片體531a的一側,使它保持貼靠且不致於脫離。兩調整螺栓533螺設於y軸載板42上,例如對應螺設於y軸載板42前側邊的栓座532上。其中一調整螺栓533的位置高於軸柱530(即第一片體531a的轉動軸心),另一調整螺栓533的位置低於軸柱530,用以分別對應推抵第一片體531a前側邊的上部及下部,藉以調整前後擺動座531作前後擺動。如第十三圖所示,當一手轉動較高的調整螺栓533而使其向前移動並推抵第一片體531a,另一手反向轉動較低的調整螺栓533而使其向後移動,就能使前後擺動座531以軸柱530為軸地向前擺動。至於調整前後擺動座531向後擺動的動作與前述類似,差別只在於轉動兩調整螺栓533的動作相反而已,容不贅述。因此,藉由轉動兩調整螺栓533就能調整顯微影像擷取模組50往前或往後擺動到想要的角度位置。其中,為了確保前後擺動座531能平順地前後擺動,水平角度調整機構53還包括多支導栓535a,該些導栓535a設於y軸載板42上且分別對應位於第一片體531a的多個弧形導孔535內。 As shown in the eleventh and twelfth drawings, in this example, the horizontal angle adjusting mechanism 53 selects the configuration shown in the drawing, which includes at least a front and rear swinging seat 531, two adjusting bolts 533, and a stopper 534. The front and rear swinging seats 531 have a first body 531a and a second body 531b which are perpendicular to each other. The first body 531a is abutted against and pivoted on the y-axis carrier 42. Preferably, the first The body 531a has a shaft hole 531c corresponding to a shaft column 530 disposed on the y-axis carrier 42 so that the front and rear swing seats 531 can swing back and forth with the shaft 530 as an axis. A stopper 534 is provided on the y-axis carrier 42 for blocking one side of the first body 531a so that it remains in contact without being detached. The two adjusting bolts 533 are screwed on the y-axis carrier plate 42, for example, corresponding to the bolt seat 532 which is screwed on the front side of the y-axis carrier plate 42. One of the adjusting bolts 533 is located higher than the shaft post 530 (ie, the rotating shaft center of the first sheet body 531a), and the other adjusting bolt 533 is positioned lower than the shaft post 530 for respectively pushing against the first sheet body 531a. The upper and lower sides of the side are used to adjust the front and rear swinging seats 531 to swing back and forth. As shown in the thirteenth figure, when the higher adjustment bolt 533 is rotated by one hand and moved forward and pushed against the first piece 531a, the other hand reversely rotates the lower adjustment bolt 533 to move it backward, The front and rear swinging seats 531 can be swung forward with the shaft 530 as an axis. As for the adjustment of the swinging seat 531 backward and backward, the action of swinging backward is similar to that described above, and the only difference is that the operation of rotating the two adjusting bolts 533 is reversed, and will not be described again. Therefore, the micro image capturing module 50 can be adjusted to swing forward to the desired angular position by rotating the two adjusting bolts 533. In order to ensure that the front and rear swinging seats 531 can smoothly swing back and forth, the horizontal angle adjusting mechanism 53 further includes a plurality of guiding bolts 535a, which are disposed on the y-axis carrier 42 and respectively corresponding to the first body 531a. A plurality of curved guide holes 535 are included.
水平角度調整機構53還包括一左右擺動座536、另兩支調整螺栓537、及兩個擋件538(也可以是一個或多個)。左右擺動座536具有一上板536a、一下板536b及一立板536c。立板536c的上下側邊分別連接上、下板536a、536b,上、下板536a、536b則連接顯微影像擷取模組50。立板536c係面對面地貼靠於前後擺動座531的第二片體531b上且具有一軸塊536d,軸塊536d被安裝於第二片體531b上的一軸槽531d內,使得左右擺動座536能以軸塊536d為軸地作左右擺動。擋件538設於第二片體531b上,用於擋住立板536c的一側,使它保持貼靠且不致於脫離。另兩支調整螺栓537係螺設於前後擺動座531的第二片體531b,例如分對應螺設於前後擺動座531的第二片體531b一側邊的兩栓座539上。其中一調整螺栓537的位 置高於軸塊536d(即立板536c的轉動軸心),另一調整螺栓537的位置低於軸塊536d,用以分別對應推抵立板536c右側邊的上部及下部,藉以調整左右擺動座536作左右擺動。如第十四圖所示,當一手轉動較高的調整螺栓537而使其向左移動並推抵立板536c的右側邊上部,另一手反向轉動較低的調整螺栓537而使其向後移動,就能使左右擺動座536以軸塊536d為軸地向左擺動。至於調整左右擺動座536向右擺動的動作與前述類似,差別只在於轉動兩調整螺栓537的動作相反而已,容不贅述。因此,藉由轉動兩調整螺栓537就能調整顯微影像擷取模組50往左或往右擺動到想要的角度位置。其中,為了確保左右擺動座536能平順地左右擺動,水平角度調整機構53還包括多支導栓540,該些導栓540設於前後擺動座531的第二片體531b上且分別對應位於立板536c的多個弧形導孔541內。 The horizontal angle adjusting mechanism 53 further includes a left and right swinging seat 536, two other adjusting bolts 537, and two blocking members 538 (which may also be one or more). The left and right swinging seats 536 have an upper plate 536a, a lower plate 536b and a vertical plate 536c. The upper and lower sides of the vertical plate 536c are respectively connected to the upper and lower plates 536a and 536b, and the upper and lower plates 536a and 536b are connected to the microscopic image capturing module 50. The vertical plate 536c abuts against the second plate 531b of the front and rear swinging seats 531 and has a shaft block 536d. The shaft block 536d is mounted in a shaft groove 531d on the second body 531b, so that the left and right swinging seats 536 can The shaft block 536d is pivoted left and right. The blocking member 538 is disposed on the second piece 531b for blocking one side of the vertical plate 536c so as to remain in abutment and not to be disengaged. The other two adjusting bolts 537 are screwed to the second plate body 531b of the front and rear swinging seats 531, for example, correspondingly to the two bolt seats 539 which are provided on one side of the second piece body 531b of the front and rear swinging seats 531. One of the adjustment bolts 537 The position of the other adjusting bolt 537 is lower than that of the shaft block 536d, and is corresponding to the upper and lower portions of the right side of the vertical plate 536c, thereby adjusting the left and right swings. Block 536 swings left and right. As shown in Fig. 14, when the upper adjusting bolt 537 is rotated by one hand and moved to the left and pushed to the upper side of the right side of the vertical plate 536c, the other hand reversely rotates the lower adjusting bolt 537 to move it backward. The left and right swinging seats 536 can be swung leftward about the shaft block 536d. As for the action of adjusting the left and right swinging seats 536 to the right, the difference is only that the action of rotating the two adjusting bolts 537 is reversed, and will not be described again. Therefore, the micro image capturing module 50 can be adjusted to swing to the left or right to the desired angular position by rotating the two adjusting bolts 537. In order to ensure that the left and right swinging seats 536 can swing smoothly to the left and right, the horizontal angle adjusting mechanism 53 further includes a plurality of guiding bolts 540, and the guiding bolts 540 are disposed on the second body 531b of the front and rear swinging seats 531 and respectively corresponding to the standing The plurality of arcuate guide holes 541 of the plate 536c.
從上述說明可知,本發明之顯微取像設備不但能藉由雷射追焦模組3及顯微取像鏡組5對目標物8進行顯微取像,且能在進行前述取像運作之前,先藉由此二者本身的調整機構,以手動方式先調整雷射位移偵測模組30在x軸方向上的位置與z軸方向上的位置,再快速調整顯微影像擷取模組50在z軸方向上的位置與水平角度位置,以使雷射位移偵測模組30與顯微影像擷取模組50的鏡頭501能位於適當的高度位置,及使顯微影像擷取模組50的鏡頭501的焦平面與目標物8的取像區平行,進而確保顯微取像上的清晰度能在可接受的範圍內。 As can be seen from the above description, the microscopic image capturing apparatus of the present invention can perform microscopic image capturing of the target object 8 by the laser focusing module 3 and the microscopic image capturing lens group 5, and can perform the above image capturing operation. Before, the position of the laser displacement detecting module 30 in the x-axis direction and the position in the z-axis direction are manually adjusted by the two adjusting mechanisms of the two, and then the microscopic image capturing mode is quickly adjusted. The position of the group 50 in the z-axis direction and the horizontal angular position, so that the laser displacement detecting module 30 and the lens 501 of the microscopic image capturing module 50 can be positioned at an appropriate height, and the microscopic image can be captured. The focal plane of the lens 501 of the module 50 is parallel to the imaging area of the target 8, thereby ensuring that the sharpness in the microscopic image is within an acceptable range.
無論如何,任何人都可以從上述例子的說明獲得足夠教導,並據而了解本發明內容確實不同於先前技術,且具有產業上之利用性,及足具進步性。是本發明確已符合專利要件,爰依法提出申請。 In any event, anyone can obtain sufficient teaching from the description of the above examples, and it is understood that the present invention is indeed different from the prior art, and is industrially usable and progressive. It is the invention that has indeed met the patent requirements and has filed an application in accordance with the law.
1‧‧‧x軸移載裝置 1‧‧‧x-axis transfer device
12‧‧‧x軸載板 12‧‧‧x axle carrier
13‧‧‧x軸驅動單元 13‧‧‧x-axis drive unit
13a‧‧‧定子 13a‧‧‧stator
13b‧‧‧動子 13b‧‧‧ mover
2‧‧‧z軸移載裝置 2‧‧‧z-axis transfer device
20‧‧‧z軸軌道 20‧‧‧z axis orbit
21‧‧‧z軸載板 21‧‧‧z axle carrier
22‧‧‧z軸驅動單元 22‧‧‧z-axis drive unit
220‧‧‧伺服馬達 220‧‧‧Servo motor
3‧‧‧雷射追焦模組 3‧‧‧Laser tracking module
30‧‧‧雷射位移偵測模組 30‧‧‧Laser Displacement Detection Module
4‧‧‧y軸移載裝置 4‧‧‧y-axis transfer device
40‧‧‧座板 40‧‧‧ seat board
41‧‧‧y軸軌道 41‧‧‧y-axis orbit
42‧‧‧y軸載板 42‧‧‧y axle carrier
43‧‧‧y軸驅動單元 43‧‧‧y-axis drive unit
43a‧‧‧定子 43a‧‧‧ Stator
43b‧‧‧動子 43b‧‧‧ mover
5‧‧‧顯微取像鏡組 5‧‧‧Microscope image group
50‧‧‧顯微影像擷取模組 50‧‧‧Microscopic image capture module
501‧‧‧鏡頭 501‧‧‧ lens
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TW201010918A (en) * | 2008-09-09 | 2010-03-16 | Cheng Mei Instr Technology Co Ltd | System for inspection of chips in tray and method for inspection thereof |
TWM399319U (en) * | 2010-09-24 | 2011-03-01 | Hirose Tech Co Ltd | Scan type auto focus detecting image capture apparatus |
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