CN114166754A - Automatic focusing device for line scanning automatic optical detection system - Google Patents
Automatic focusing device for line scanning automatic optical detection system Download PDFInfo
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- CN114166754A CN114166754A CN202111611765.5A CN202111611765A CN114166754A CN 114166754 A CN114166754 A CN 114166754A CN 202111611765 A CN202111611765 A CN 202111611765A CN 114166754 A CN114166754 A CN 114166754A
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- wafer
- lifting
- module
- bearing
- optical detection
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/01—Arrangements or apparatus for facilitating the optical investigation
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/9501—Semiconductor wafers
Abstract
The invention relates to an automatic focusing device for a line scanning automatic optical detection system, which comprises: the optical detection equipment fixing module is used for fixing the optical detection equipment; the wafer lifting bearing module is used for bearing the wafer and driving the wafer to move, and the wafer lifting bearing module is positioned below the optical detection equipment; the distance detection module is arranged in the automatic focusing device and can detect the position of the spacing distance between the wafer and the optical detection equipment, and the distance detection module is connected with the wafer lifting bearing module. The automatic focusing device realizes focusing by fixing the optical detection equipment and adjusting the position of the wafer by the wafer lifting bearing module, can better shoot the wafer, effectively shortens setting time, enables the optical detection equipment to finish focusing more quickly, and does not generate large inertia in the vertical direction due to the lighter integral structure of the wafer, thereby reducing the requirement on the torque force of a brake motor.
Description
Technical Field
The present invention relates to the field of chip manufacturing technology, and more particularly, to an auto-focusing device for a line scanning auto-optical inspection system.
Background
In the chip manufacturing process, a Line Scan automatic optical inspection system (Line Scan AOI) is used to inspect a wafer to determine whether there is a defect or flaw on the wafer, and an automatic focusing device is often required to be installed in the Line Scan automatic optical inspection system for focusing in order to clearly capture and capture the image of the wafer.
In the prior art, a wafer is generally placed on a fixed wafer fixing device 11, and then the optical detection device 2 is placed on a lifting device capable of driving the optical detection device to lift, the lifting device includes a gantry 12 and a lifting component 13, the lifting component 13 on the gantry 12 drives the optical detection device 2 to move up and down to achieve focusing, and the structure of the optical detection device can be seen in fig. 1.
Because the optical detection device 2 is heavy in weight, when the lifting component 13 drives the optical detection device 2 to move up and down, the setting time is long, and the optical detection device 2 needs a long time to be stable, so that the optical detection device 2 is often out of focus. Meanwhile, in the process of driving the optical detection device 2 to move, the optical detection device 2 is caused to vibrate, so that the optical detection device has large inertia in the vertical direction, and a large torque requirement is required on a brake motor.
Disclosure of Invention
The invention aims to overcome the defects of the prior art and provide the automatic focusing device for the line scanning automatic optical detection system, which has high stability, short setting time and good adaptability.
In order to achieve the above object, the auto-focusing device for line scanning automatic optical inspection system of the present invention comprises:
the automatic focusing device for the line scanning automatic optical detection system is mainly characterized by comprising the following components:
the optical detection equipment fixing module is used for fixing the optical detection equipment;
the wafer lifting bearing module is used for bearing a wafer and driving the wafer to move, and the wafer lifting bearing module is positioned below the optical detection equipment;
the distance detection module is arranged in the automatic focusing device and can detect the position of the spacing distance between the wafer and the optical detection equipment, and the distance detection module is connected with the wafer lifting bearing module.
The above-mentioned auto focusing device for line scanning automatic optical inspection system, wherein the wafer lifting and carrying module comprises:
the wafer bearing and fixing mechanism is used for bearing and fixing the wafer;
and the lifting support mechanism is arranged below the wafer bearing and fixing mechanism, is connected with the distance detection module and is used for driving the wafer bearing and fixing mechanism to lift.
The above-mentioned auto focusing device for line scanning automatic optical inspection system, wherein the wafer lifting and carrying module further comprises:
the number of the angle adjusting mechanisms is matched with that of the lifting supporting mechanisms, and each lifting supporting mechanism is connected with the wafer bearing and fixing mechanism through the corresponding angle adjusting mechanism.
In the above automatic focusing device for the line scanning automatic optical inspection system, the angle adjusting mechanism is composed of a universal joint.
The above auto focusing device for line scanning automatic optical inspection system, wherein the lifting support mechanism comprises a guiding component, a connecting component and a lifting driving component;
the wafer bearing and fixing mechanism is connected with the guide assembly through the connecting assembly, and the lifting driving assembly drives the connecting assembly to move up and down on the guide assembly.
The above auto-focusing device for line scanning automatic optical inspection system, wherein the guiding assembly comprises a sliding block and a sliding rail;
the lifting driving assembly comprises a motor;
the connecting assembly is fixed on the sliding block, and the motor drives the sliding block to move up and down along the sliding rail.
The automatic focusing device for the line scanning automatic optical detection system is characterized in that the connecting assembly is connected with the wafer bearing and fixing mechanism through an angle adjusting mechanism, and the lifting driving assembly is connected with the distance detection module.
The automatic focusing device for the line scanning automatic optical inspection system comprises a wafer lifting and supporting module, wherein the wafer lifting and supporting module comprises three lifting and supporting mechanisms, and the three lifting and supporting mechanisms are uniformly distributed on the outer edge of the wafer bearing and fixing mechanism.
The automatic focusing device for the line scanning automatic optical inspection system is characterized in that the distance detection module is composed of a displacement meter, and the displacement meter is arranged in the optical inspection equipment fixing module and can detect the position of the spacing distance between the wafer and the optical inspection equipment.
The automatic focusing device for the line scanning automatic optical detection system further comprises a translation module, wherein the translation module is fixed below the wafer lifting and bearing module.
The automatic focusing device for the line scanning automatic optical detection system has the advantages that:
the wafer lifting bearing module capable of driving the wafer to lift drives the wafer to lift, so that the optical detection equipment fixed on the optical detection equipment fixing module can realize focusing in a static state, the wafer can be better shot, the wafer lifting bearing module can effectively shorten setting time in the process of driving the wafer to lift due to the fact that the overall structure of the wafer is light, the optical detection equipment can complete focusing more quickly, and the wafer lifting bearing module cannot generate large inertia in the vertical direction due to the fact that the overall structure of the wafer is light, and therefore the requirement for the torque force of a brake motor is reduced.
Drawings
The conception, the specific structure and the technical effects of the present invention will be further described with reference to the accompanying drawings to fully understand the objects, the features and the effects of the present invention.
FIG. 1 is a schematic diagram of an auto-focusing device for a line scan automatic optical inspection system in the prior art.
FIG. 2 is a schematic structural diagram of an auto-focusing device for a line scan automatic optical inspection system according to an embodiment of the present invention.
FIG. 3 is a front view of an auto-focusing apparatus for a line scan automatic optical inspection system according to an embodiment of the present invention.
FIG. 4 is a side view of an auto-focusing device for a line scan automatic optical inspection system according to an embodiment of the present invention.
Fig. 5 is a partially enlarged view of the area a in fig. 4.
Reference numerals
11 wafer fixing equipment
12 gantry
13 lifting component
2 optical detection device
3 optical detection equipment fixing module
4 wafer lifting bearing module
41 wafer bearing and fixing mechanism
42 lifting supporting mechanism
421 connecting rod
422 sliding block
423 sliding rail
424 electric motor
43-degree adjusting mechanism
5 Displacement meter
Detailed Description
In order to make the technical means, the characteristics, the purposes and the functions of the invention easy to understand, the invention is further described with reference to the specific drawings. However, the present invention is not limited to the following embodiments.
It should be understood that the structures, ratios, sizes, and the like shown in the drawings and described in the specification are only used for matching with the disclosure of the specification, so as to be understood and read by those skilled in the art, and are not used to limit the conditions under which the present invention can be implemented, so that the present invention has no technical significance, and any structural modification, ratio relationship change, or size adjustment should still fall within the scope of the present invention without affecting the efficacy and the achievable purpose of the present invention.
Referring to fig. 2 to 5, the autofocus apparatus for a line scan automatic optical inspection system in this embodiment includes:
the optical detection device fixing module 3 is used for fixing the optical detection device 2;
the wafer lifting and bearing module 4 is used for bearing a wafer and driving the wafer to move, and the wafer lifting and bearing module 4 is positioned below the optical detection equipment 2;
and the distance detection module is arranged in the automatic focusing device and can detect the position of the spacing distance between the wafer and the optical detection equipment 2, and the distance detection module is connected with the wafer lifting bearing module 4.
In this embodiment, the optical detection device 2 is fixed on the optical detection device fixing module 3, the optical detection device 2 is not moved, and a wafer lifting and carrying module 4 capable of driving the wafer to move up and down is arranged to drive the wafer to move so as to implement focusing operation, and the distance between the wafer and the optical detection device 2 is detected by the distance detection module, and the detected data is sent to the wafer lifting and carrying module 4, so as to control the distance that the wafer lifting and carrying module 4 drives the wafer to move, thereby performing effective, accurate and rapid focusing, and better shooting the wafer, because the whole structure of the wafer is light, the wafer lifting and carrying module 4 can effectively shorten setting time in the process of driving the wafer to lift, and the optical detection device 2 can more quickly complete focusing, and because the whole structure of the wafer is light, it does not create significant inertia in the vertical direction, thereby reducing the torque requirements on the brake motor.
In this embodiment, the wafer lift carrying module 4 includes:
the wafer bearing and fixing mechanism 41 is used for bearing and fixing the wafer, the wafer bearing and fixing mechanism 41 can be composed of a sucker mechanism, the wafer bearing and fixing mechanism 41 can be driven to lift and lower better for the device, and in practical application, the sucker mechanism as light as possible can be adopted to form the wafer bearing and fixing mechanism 41;
and the lifting support mechanism 42 is arranged below the wafer bearing and fixing mechanism 41, each lifting support mechanism 42 is connected with the distance detection module, and the lifting support mechanism 42 is used for driving the wafer bearing and fixing mechanism 41 to lift, so that the relative distance between the wafer and the optical detection device 2 is adjusted, and effective focusing is performed.
In this embodiment, the wafer lifting and carrying module 4 further includes:
the number of the angle adjusting mechanisms 43 is matched with that of the lifting supporting mechanisms 42, and each lifting supporting mechanism 42 is connected with the wafer bearing and fixing mechanism 41 through the corresponding angle adjusting mechanism 43.
By arranging the angle adjusting mechanism 43, the inclination angle of the wafer bearing and fixing mechanism 41 can be effectively adjusted, so that the best parallel line between the wafer and the optical detection equipment 2 can be adjusted, and the detection requirement is met.
In this embodiment, the angle adjustment mechanism 43 is constituted by a universal joint.
In this embodiment, the lifting support mechanism 42 includes a guiding component, a connecting component and a lifting driving component;
the wafer bearing and fixing mechanism 41 is connected with the guide assembly through the connecting assembly, and the lifting driving assembly drives the connecting assembly to move up and down on the guide assembly.
The connection assembly is constituted by a connection rod 421 in this embodiment.
In this embodiment, the guide assembly includes a slider 422 and a slide rail 423;
the lift drive assembly includes a motor 424;
the connecting assembly is fixed on the sliding block 422, the motor 424 drives the sliding block 422 to move up and down along the sliding rail 423 so as to drive the wafer to lift, and the lifting driving assembly is connected with the distance detection module.
With the structure design, the moving direction of the wafer bearing and fixing mechanism 41 can be better controlled, so that the wafer bearing and fixing mechanism can move up and down along the linear direction.
In other embodiments, a limiting component may be disposed on both upper and lower sides of the sliding block 422, so as to limit the moving distance of the wafer carrying and fixing mechanism 41.
In this embodiment, the connecting assembly is connected to the wafer-supporting fixing mechanism 41 through an angle adjusting mechanism 43.
In specific implementation, when the wafer lifting/lowering module 4 includes two or more lifting/lowering support mechanisms 42 and the angle adjusting mechanism 43 is disposed on each lifting/lowering support mechanism 42, the inclination of the wafer supporting/fixing mechanism 41 can be adjusted by only adjusting the lifting/lowering height difference between the lifting/lowering support mechanisms 42, and the inclination of the wafer supporting/fixing mechanism 41 does not need to be adjusted by an additional control mechanism, so that the overall structure is very simple and convenient to operate.
In this embodiment, the wafer lifting and carrying module 4 includes three lifting and supporting mechanisms 42, and the three lifting and supporting mechanisms 42 are uniformly distributed on the outer edge of the wafer carrying and fixing mechanism 41.
Such a structure allows the wafer carrier fixing mechanism 41 to be more stably fixed to the three elevation supporting mechanisms 42.
When the tilt angle of the wafer mounting/fixing mechanism 41 needs to be adjusted, the tilt angle of the wafer mounting/fixing mechanism 41 can be adjusted only by adjusting the elevation distance of each elevation supporting mechanism 42 and the angle of the angle adjusting mechanism 43.
As shown in fig. 3, the wafer supporting and fixing mechanism 41 is currently in a state of being tilted to the right, and if it needs to be adjusted to a horizontal state, it only needs to fix the middle lifting and supporting mechanism 42 without moving, and adjust the left lifting and supporting mechanism 42 downward, and adjust the right lifting and supporting mechanism 42 upward, and each angle adjusting mechanism 43 will turn to a corresponding angle during the adjustment process, so as to adjust the wafer supporting and fixing mechanism 41 to the horizontal state (or the lowest lifting and supporting mechanism 42 may be kept stationary, and the heights of the other two lifting and supporting mechanisms 42 are adjusted, so that the wafer supporting and fixing mechanism 41 is in the horizontal state).
That is, in this embodiment, the height and the tilt direction of the wafer supporting mechanism 41 are adjusted by disposing three elevating support mechanisms 42 with universal joints below the wafer supporting mechanism 41, so as to adjust the optimal parallel line in the focusing process, and after the tilt angle is adjusted, the three elevating support mechanisms 42 are simultaneously and equidistantly elevated for focusing.
Through the structural design, the applicable range of the wafer lifting and carrying module 4 is wider, and when the angle of the optical detection device 2 irradiating the wafer is not in a horizontal state, the horizontal angle of the wafer carrying and fixing mechanism 41 can be adjusted to meet the scanning requirement.
In this embodiment, the distance detection module is composed of a displacement meter 5, and the displacement meter 5 is disposed in the optical detection device fixing module 3 at a position capable of detecting the separation distance between the wafer and the optical detection device 2, so as to detect the distance between the wafer and the optical detection device 2.
The displacement meter 5 can monitor the lifting distance and the inclination angle of the wafer bearing and fixing mechanism 41 in real time, so that the motor 424 is adjusted, and the focusing accuracy and rapidity are guaranteed.
In this embodiment, the auto-focusing device further includes a translation module (the translation module is not shown in the figure because the translation module can be formed by a mechanism capable of carrying and driving an object to translate in the prior art), and the translation module is fixed below the wafer lifting and carrying module 4 to drive the wafer to move in the horizontal direction, so as to achieve the line scanning effect. As shown in fig. 1, in this embodiment, a gantry is used to form an optical inspection apparatus fixing module 3 for fixing an optical inspection apparatus 2. The wafer lifting and carrying module 4 can be driven by the translation module to reciprocate back and forth from the lower part of the portal frame, so that the optical detection equipment 2 can realize the line scanning operation of the wafer.
When the automatic focusing device in the above embodiment is used for focusing, the lifting support mechanisms 42 and the angle adjustment mechanisms 43 are controlled to adjust the inclination angle of the wafer bearing and fixing mechanism 41, then all the lifting support mechanisms 42 are controlled to lift simultaneously to adjust the horizontal height of the wafer bearing and fixing mechanism 41, and after the adjustment is completed, the translation module drives the whole wafer bearing and fixing mechanism 41 to move, so as to realize the line scanning operation on the wafer.
In the embodiment, the lifting mechanism is arranged on the equipment for bearing the wafer, and the focusing is realized by driving the wafer to move, so that the setting time in the focusing process can be effectively shortened, the probability of defocusing is reduced, and in the focusing process, the lifting distance of the wafer lifting bearing module 4 is fed back to the wafer lifting bearing module 4 through the distance detection module, so that the lifting distance of the wafer lifting bearing module 4 can be timely adjusted, and the focusing accuracy is guaranteed.
The automatic focusing device in the above embodiment has multiple degrees of freedom, can ensure flexible focusing, and keeps the horizontal plane of the wafer bearing and fixing mechanism 41 parallel to the scanning line, and has a wide application range.
The foregoing detailed description of the preferred embodiments of the invention has been presented. It should be understood that numerous modifications and variations could be devised by those skilled in the art in light of the present teachings without departing from the inventive concepts. Therefore, the technical solutions available to those skilled in the art through logic analysis, reasoning and limited experiments based on the prior art according to the concept of the present invention should be within the scope of protection defined by the claims.
Claims (10)
1. An auto-focusing device for a line scan automatic optical inspection system, comprising:
the optical detection equipment fixing module is used for fixing the optical detection equipment;
the wafer lifting bearing module is used for bearing a wafer and driving the wafer to move, and the wafer lifting bearing module is positioned below the optical detection equipment;
the distance detection module is arranged in the automatic focusing device and can detect the position of the spacing distance between the wafer and the optical detection equipment, and the distance detection module is connected with the wafer lifting bearing module.
2. The auto-focusing apparatus of claim 1, wherein the wafer lifting and carrying module comprises:
the wafer bearing and fixing mechanism is used for bearing and fixing the wafer;
and the lifting support mechanism is arranged below the wafer bearing and fixing mechanism, is connected with the distance detection module and is used for driving the wafer bearing and fixing mechanism to lift.
3. The auto-focusing apparatus of claim 2, wherein the wafer lifting and carrying module further comprises:
the number of the angle adjusting mechanisms is matched with that of the lifting supporting mechanisms, and each lifting supporting mechanism is connected with the wafer bearing and fixing mechanism through the corresponding angle adjusting mechanism.
4. The auto-focusing apparatus for a line scanning auto-optical inspection system as claimed in claim 3, wherein the angle adjusting mechanism is constituted by a universal joint.
5. The auto-focusing apparatus of claim 2, wherein the lifting support mechanism comprises a guiding component, a connecting component and a lifting driving component;
the wafer bearing and fixing mechanism is connected with the guide assembly through the connecting assembly, the lifting driving assembly drives the connecting assembly to move up and down on the guide assembly, and the lifting driving assembly is connected with the distance detection module.
6. The auto-focusing apparatus of claim 5,
the guide assembly comprises a sliding block and a sliding rail;
the lifting driving assembly comprises a motor;
the connecting assembly is fixed on the sliding block, and the motor drives the sliding block to move up and down along the sliding rail.
7. The auto-focusing apparatus of claim 5, wherein the connecting member is connected to the wafer holding and fixing mechanism through an angle adjusting mechanism.
8. The auto-focusing apparatus of claim 2, wherein the wafer lifting and supporting module comprises three lifting and supporting mechanisms, and the three lifting and supporting mechanisms are uniformly distributed on the outer edge of the wafer supporting and fixing mechanism.
9. The auto-focusing apparatus of claim 1, wherein the distance detecting module is a displacement meter, and the displacement meter is disposed in the optical inspection device fixing module at a position where the distance between the wafer and the optical inspection device can be detected.
10. The auto-focusing apparatus of claim 1, further comprising a translation module fixed under the wafer lifting and carrying module.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111611765.5A CN114166754A (en) | 2021-12-27 | 2021-12-27 | Automatic focusing device for line scanning automatic optical detection system |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111611765.5A CN114166754A (en) | 2021-12-27 | 2021-12-27 | Automatic focusing device for line scanning automatic optical detection system |
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| CN114166754A true CN114166754A (en) | 2022-03-11 |
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| CN202111611765.5A Pending CN114166754A (en) | 2021-12-27 | 2021-12-27 | Automatic focusing device for line scanning automatic optical detection system |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115372375A (en) * | 2022-10-24 | 2022-11-22 | 苏州天准科技股份有限公司 | Wafer detection device and detection method |
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2021
- 2021-12-27 CN CN202111611765.5A patent/CN114166754A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115372375A (en) * | 2022-10-24 | 2022-11-22 | 苏州天准科技股份有限公司 | Wafer detection device and detection method |
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