TWI595223B - Bio-chip carrier - Google Patents

Description

Biochip carrier

This creation relates to a carrier that carries a biochip for sensing.

Bio-wafer refers to the principle of molecular biology, analytical chemistry, biochemical reaction, etc., using silicon wafers, glass, or polymers as substrates, combined with micro-product technology and biomedical technology design and production with miniaturization and rapid processing capabilities. Bio- and medical detection components enable rapid biochemical sensing or reaction on a small area for precise miniaturization of medical, environmental, food, new drug development, basic research, military defense, chemical synthesis, etc. device.

Biosensing wafers are a type of biochip used for the qualitative and quantitative determination of a test object, which may be selected from the group consisting of proteins, cells, compounds, metal ions, and combinations thereof. The wafer generally comprises a substrate, a nano particle unit respectively disposed on the substrate, and a sensing unit. The substrate is made of a light transmissive material, and the nano particle unit comprises a plurality of metal nanoparticles randomly formed on a surface of the substrate, and the sensing unit comprises a plurality of modifications on the substrate. And a receiver between the metal nanoparticles and adjacent to the metal nanoparticles. When the receiver of the sensing unit is specifically engaged with the target analyte, the local electromagnetic field induced by the metal nanoparticle is affected by the surrounding environment and causes a change in the spectral signal, thereby detecting the target analyte.

The biosensing wafer needs to be in contact with the liquid containing the analyte, perform a specific bonding reaction, a reverse cleaning, and a final drying process in the sensing process, and the sensing result can be read by an external spectrometer. The biosensing wafer should be supported by a carrier during the sensing process and spectral results reading.

The Republic of China new patent M488629 (hereinafter referred to as the 629 case) discloses a carrier carrying a biosensing wafer, the carrier is a perforated component, the perforated component has a hole, and one end of the hole is provided with a slot in which the wafer is disposed. At one end of the hole, a liquid containing the analyte is dropped into the hole to contact the surface of the wafer. The specification of the 629 further indicates that the detachable wafer and the apertured member can be bonded, riveted, screwed, soldered, embedded and hinged, and the wafer is fixed at one end of the hole.

As described above, the bio-sensing chip needs to be repeatedly cleaned during the sensing process, and the carrier disclosed in the 629 case needs to remove the liquid containing the object to be tested from the hole in the wafer cleaning process, and then, A rinse solution is added to the well, after which the rinse is removed. Therefore, the carrier of the 629 case needs to perform several times of liquid addition and removal operations and may eventually have water remaining in the hole, so it is suitable for spectral detection without drying conditions, such as an enzyme-linked immunosorbent reader. (Enzyme-Linked Immunosorbent Assay reader, ELISA reader), localized surface plasmon resonance (LSPR), which requires a dry mode, may reduce the interpretation sensitivity.

The present invention proposes a biochip carrier that improves the complexity of the prior art carrier to repeatedly add and remove liquid during the cleaning process with a one-time rinsing action; on the other hand, the creation vehicle The wafer can be fully dried by a drying process, first The prior art carrier is more suitable for spectral detection in dry mode.

The biochip carrier of the present invention comprises: a carrier body; a through hole penetrating through the upper and lower surfaces of the carrier body; an annular sidewall formed inside the through hole, the annular sidewall and the inner wall of the through hole having a spacing, the outer wall of the annular side wall is connected to the inner wall of the through hole by a connecting portion, the connecting portion maintains the spacing to form a liquid circulation portion; the annular side wall is an optical path; the wafer carries a portion of the annular side wall of the optical path; the height of the wafer carrying portion is lower than the upper surface of the carrier body; a space between the wafer carrying portion and the upper surface of the body is a carrying space; A biosensing wafer (hereinafter referred to as a wafer) is disposed.

The biological sensing wafer needs to be in contact with the liquid containing the analyte in the sensing process to perform a specific bonding reaction, and the liquid containing the analyte is instilled into the surface of the wafer through the carrying space, and is fully filled with the surface of the wafer. Contacting, the bonding reaction is performed at a predetermined time; after that, the excess liquid containing the analyte is washed with the rinsing liquid, and a sufficient amount of the rinsing liquid passes through the carrying space and the liquid circulation portion, and the liquid containing the analyte is And the wafer is removed from the wafer; the rinsing process requires a drying process or no drying process to complete the visual inspection. In the drying process, the liquid circulation portion, the optical path, and the carrying space allow the wafer to be sufficiently dried without liquid residue. . Light from a spectrometer can be illuminated through the optical path and through the wafer through which the naked eye or detector can identify or collect optical signals of the wafer.

The carrier further includes an upper cover, the upper cover includes: an upper cover body; an annular restricting portion formed on the lower surface of the upper cover body; and a through hole penetrating the annular restricting portion and the upper cover body.

The lower surface of the upper cover body covers the carrier with respect to the upper surface of the carrier body. The annular limiting portion extends into the receiving space and surrounds and is confined to the periphery of the wafer.

The biological sensing wafer needs to be in contact with the liquid containing the analyte in the sensing process to perform a specific bonding reaction, and the liquid containing the analyte is dripped on the surface of the wafer through the through hole of the cover body or is filled with In the entire through hole, the liquid containing the analyte is in sufficient contact with the surface of the wafer, and the bonding reaction is performed at a predetermined time; after that, the upper cover is removed, and the excess liquid containing the analyte is washed with the rinse liquid, which is sufficient The amount of the rinsing liquid passes through the container space and the liquid circulation portion, and the liquid containing the object to be tested is taken away from the wafer together; the rinsing process completes the visual inspection, and the drying process is not performed or the drying process is not performed. The liquid flow portion, the optical path, and the containment space allow the wafer to be sufficiently dried without liquid residue. Light from a spectrometer can be illuminated through the optical path and through the wafer through which the naked eye or detector can identify or collect optical signals of the wafer.

The effect of this creation is:

The creation of the vehicle allows for a continuous flush of the wafer to allow continuous flushing of the wafer without the need to repeatedly perform the act of adding liquid and removing liquid.

The creation of the carrier allows the wafer to be sufficiently dried by a drying process, which is more suitable for dry mode spectral detection than prior art carriers, such as localized surface plasmon resonance (LSPR), and improves sensitivity.

10‧‧‧ Vehicle body

11‧‧‧through hole

12‧‧‧ annular side wall

13‧‧‧Liquid Circulation Department

14‧‧‧Connecting Department

15‧‧‧Light path

16‧‧‧ wafer carrier

17‧‧‧Load space

20‧‧‧Biosensing Wafer

31‧‧‧Liquid containing the analyte

32‧‧‧ rinse solution

33‧‧‧Light

40‧‧‧Upper cover

41‧‧‧Cap body

42‧‧‧ lower surface

43‧‧‧Circular Restriction

44‧‧‧through holes

100‧‧‧bearing unit

101‧‧‧ upper surface

102‧‧‧lower surface

400‧‧‧Restriction unit

The first picture is the front view and internal perspective view of the created wafer carrier.

The second picture is a cross-sectional view of 2-2 of the first figure.

The third figure is an external view of the created array wafer carrier.

The fourth figure is a schematic diagram of the wafer carrier carrying a wafer and performing sensing steps.

The fifth figure is an external view of the upper cover of the wafer carrier.

The sixth picture is a sectional view of 6-6 of the fifth figure.

The seventh figure is an external view of the creation of the array type upper cover.

The eighth figure is a sectional view of the combination of the wafer carrier and the upper cover.

The ninth figure is a schematic diagram of the wafer carrier and the upper cover carrying a wafer and performing sensing steps.

The central idea expressed in the column of the above summary of the invention is expressed by way of specific examples. Various items in the embodiments are depicted in terms of ratios, dimensions, amounts of deformation, or displacements that are suitable for illustration, and are not drawn to the proportions of actual elements, as set forth above.

As shown in the first to third figures, the biochip carrier of the present invention comprises: a carrier body 10; a through hole 11 penetrating the upper surface 101 and the lower surface 102 of the carrier body 10; The shape may be a circular shape, an elliptical shape, a polygonal shape, a polygonal shape, or other various geometric shapes; an annular sidewall 12 formed inside the through hole 11 , the annular sidewall 12 having a distance from the inner wall of the through hole 11 , The outer wall of the annular side wall 12 is connected to the inner wall of the through hole 11 by at least one connecting portion 14. The connecting portion 14 maintains the spacing to form a liquid circulation portion 13; the annular side wall 12 is an optical path 15 The annular sidewall 12 may have a circular, elliptical, polygonal, polygonal, or other geometric shape; a wafer carrier 16 at one end of the annular sidewall 12; the height of the wafer carrier 16 Lower than the upper surface 101 of the carrier body 10; the wafer carrier 16 to the carrier body 10 Between the surfaces 101 is a capacitive space 17; a bio-sensing wafer 20 (hereinafter referred to as a wafer) is disposed on the wafer carrying portion 16 by a removable technical means (including bonding).

The area of the wafer 20 is 1 to 2500 mm ² , and may be, for example, (1 to 43 mm) × (1 to 43 mm). The outline shape of the wafer 20 may be a group consisting of a circle, an ellipse, a polygon, an irregular shape, and a combination thereof. The wafer 20 comprises a substrate, a nano particle unit and a sensing unit, wherein the substrate is made of a light transmissive material, and the nano particle unit is disposed on the substrate and comprises a plurality of The mutually spaced nano particles are each made of a metal having a particle diameter of 1 to 200 nm, and the nano particles have a pitch therebetween, and the pitch is 1 to 200 nm. The wafer 20 further includes a plurality of receivers disposed between the plurality of nanoparticles.

The through hole 11, the annular side wall 12, the liquid flow portion 13, the optical path 15, the wafer carrying portion 16, and the carrying space 17 are defined as a carrying unit 100 in the present creation. As shown in the first figure, a carrier unit 100 can be disposed on a carrier body 10. As shown in the third figure, a plurality of carrier units 100 can be disposed on the carrier body 10, and the carrier units 100 are arranged in a matrix. In other words, the number of carrying units 100 provided on the carrier body 10 can be an integer from 1 to 384. The carrier body 10 and the carrying unit 100 thereon can be fabricated by an integral molding technique. The material of the carrier body 10 includes, but is not limited to, polypropylene (PP), polycarbonate (PC), and poly Indoleamine (Nylon).

As shown in the fourth figure, the wafer 20 needs to be in contact with the liquid containing the analyte during the sensing process to perform a specific bonding reaction, and the analyte is selected from a protein, a cell, a compound, a metal ion and A group of combinations. The liquid 31 containing the analyte is dropped onto the surface of the wafer 20 through the space 17 to be in full contact with the surface of the wafer, and the bonding reaction is performed for a predetermined time [as shown in FIG. 4(B)]; It is necessary to rinse the excess liquid 31 containing the analyte with the rinsing liquid 32, and charge A sufficient amount of the rinsing liquid 32 passes through the accommodating space 17 and the liquid venting portion 13, and the liquid 31 containing the analyte is taken away from the wafer 20 and the carrier body 10 [as shown in the fourth figure (C)]. The rinsing process requires a drying process or no drying process to complete the visual inspection. In the drying process, the liquid permeable portion 13, the optical path 15 and the carrying space 17 allow the wafer 20 to be sufficiently dried without liquid residue [eg Figure 4 (D)]. A visible light beam 33 can be illuminated by the optical path 15 and passed through the wafer 20, and the optical or spectrometer can identify or collect the optical signal of the wafer through the carrying space 17 [as shown in the fourth figure (E)].

As shown in the fifth to eighth embodiments, the carrier further includes an upper cover 40. The upper cover 40 includes: an upper cover body 41; an annular restricting portion 43 formed on the lower surface 42 of the upper cover body 41; 43 and a through hole 44 of the upper cover body 41.

The lower surface 42 of the upper cover body 41 covers the carrier body 10 with respect to the upper surface 101 of the carrier body 10 . The annular limiting portion 43 extends into the receiving space 17 and surrounds and is limited to the wafer 20 . periphery.

The annular restriction portion 43 and the through hole 44 are defined as a restriction unit in the present creation. As shown in the fifth figure, a restriction unit 400 may be disposed on an upper cover body 41, as shown in the seventh figure, on the upper cover body 41. A plurality of restriction units 400 may be provided, and the restriction units 400 are arranged in a matrix. In other words, the number of the limiting units 400 provided on the upper cover body 41 may be an integer of 1 to 384. The upper cover body 41 and the restriction unit 400 thereon can be formed by an integral molding technique. The material of the upper cover body 41 includes, but is not limited to, polypropylene (PP), polycarbonate (PC), and polyamine (Nylon).

As shown in the ninth figure, the wafer 20 is in contact with the liquid 31 containing the analyte to perform a specific bonding reaction, and the liquid 31 containing the analyte is dripped through the through hole 44 of the upper cover body 41. The surface of the wafer 20 is either filled in the entire through hole 44 [as in the ninth diagram (B)], including the object to be tested. The liquid 31 is in sufficient contact with the surface of the wafer 20 to perform a bonding reaction for a predetermined time; thereafter, the upper cover 40 is removed [as shown in FIG. 9(C)], and the excess analyte-containing material is rinsed with the rinsing liquid 32. a liquid 31, a sufficient amount of the rinsing liquid passes through the container space 17 and the liquid circulation portion 13, and the liquid 31 containing the analyte is taken away from the wafer 20 and the carrier body 10 [as shown in the ninth diagram (D)]; The rinsing process requires a drying process or no drying process to complete the visual inspection. In the drying process, the liquid permeable portion 13, the optical path 15 and the carrying space 17 allow the wafer 20 to be sufficiently dried without liquid residue [eg Figure IX (E)]. A visible light beam 33 can be illuminated through the optical path 15 and passed through the wafer 20, and the optical or spectrometer can identify or collect the optical signal of the wafer through the carrying space 17 [as shown in FIG. 9(F)].

10‧‧‧ Vehicle body

11‧‧‧through hole

12‧‧‧ annular side wall

13‧‧‧Liquid Circulation Department

14‧‧‧Connecting Department

15‧‧‧Light path

16‧‧‧ wafer carrier

17‧‧‧Load space

100‧‧‧bearing unit

101‧‧‧ upper surface

102‧‧‧lower surface

Claims (10)

A biochip carrier includes: a carrier body; a through hole penetrating the upper surface and the lower surface of the carrier body; an annular sidewall formed inside the through hole, the annular sidewall and the inner wall of the through hole having a spacing, the outer wall of the annular side wall is connected to the inner wall of the through hole by at least one connecting portion, the connecting portion maintains the spacing to form a liquid circulation portion; the annular side wall is an optical path; a wafer a carrying portion is located at one end of the annular sidewall; the height of the wafer carrying portion is lower than an upper surface of the carrier body; a gap between the wafer carrying portion and the upper surface of the carrier body is a carrying space; A biosensing wafer is disposed in a dismountable technical manner. The biochip carrier of claim 1, wherein the through hole, the annular side wall, the connecting portion, the liquid flow portion, the optical path, the wafer carrying portion, and the carrying space constitute a carrying unit; A carrier unit can be disposed on the carrier body. The biochip carrier of claim 1, wherein the through hole, the annular side wall, the connecting portion, the liquid flow portion, the optical path, the wafer carrying portion, and the carrying space constitute a carrying unit; A plurality of carrying units can be disposed on the carrier body. The biochip carrier of claim 1, wherein the through hole, the annular side wall, the connecting portion, the liquid flow portion, the optical path, the wafer carrying portion, and the carrying space constitute a carrying unit; 1~384 carrying units can be arranged on the carrier body, and the carrying units are arranged in a matrix. The biochip carrier of any one of claims 2 to 4, wherein the carrier body and the carrying unit thereon are formed by an integral molding technique. The biochip carrier of any one of claims 2 to 4, wherein the carrier body and the carrying unit thereon are made of a plastic material. The biochip carrier of claim 1, further comprising an upper cover, the upper cover comprising an upper cover body, an annular restricting portion formed on a lower surface of the upper cover body; and a through-ring restricting portion and the upper cover a through hole of the main body; a lower surface of the upper cover body covers the carrier body with respect to the upper surface of the carrier body, and the annular restricting portion extends into the receiving space to surround and be restricted to the periphery of the wafer. The biochip carrier of claim 7, wherein the annular limiting portion and the through hole constitute a limiting unit, and one to 384 limiting units are arranged on one upper cover body, and the limiting units are arranged in a matrix. The biochip carrier according to any one of the preceding claims, wherein the upper cover body and the restriction unit thereon are formed by an integral molding technique. The biochip carrier according to any one of the preceding claims, wherein the upper cover body and the restriction unit thereon are made of a plastic material.