TWI592241B - Method of constant laser beam terminal energy and processing system thereof - Google Patents

Method of constant laser beam terminal energy and processing system thereof Download PDF

Info

Publication number
TWI592241B
TWI592241B TW104104195A TW104104195A TWI592241B TW I592241 B TWI592241 B TW I592241B TW 104104195 A TW104104195 A TW 104104195A TW 104104195 A TW104104195 A TW 104104195A TW I592241 B TWI592241 B TW I592241B
Authority
TW
Taiwan
Prior art keywords
unit
spacing
terminal
adjustment
processing system
Prior art date
Application number
TW104104195A
Other languages
Chinese (zh)
Other versions
TW201628752A (en
Inventor
xin-ru Huang
Original Assignee
xin-ru Huang
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by xin-ru Huang filed Critical xin-ru Huang
Priority to TW104104195A priority Critical patent/TWI592241B/en
Priority to CN201510526008.6A priority patent/CN105855698B/en
Publication of TW201628752A publication Critical patent/TW201628752A/en
Application granted granted Critical
Publication of TWI592241B publication Critical patent/TWI592241B/en

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0626Energy control of the laser beam
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0643Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising mirrors

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Lasers (AREA)
  • Laser Beam Processing (AREA)

Description

恆定雷射光束終端能量的方法及其加工系統 Constant laser beam terminal energy method and processing system thereof

本發明涉及一種恆定雷射光束終端能量的方法,特別涉及一種利用光束間距的調節來恆定雷射光束終端能量的方法。 The present invention relates to a method of constant laser beam end energy, and more particularly to a method for constant beam laser end energy using adjustment of beam spacing.

現有的雷射加工系統中,若僅就其製造成本而言,係以利用反光鏡來導引雷射光束至終端照射位置的加工系統成本相對於以光纖導引者來得較為低廉;然而,本發明僅就上述利用反光鏡導引雷射光束的現有技術所存在的問題加以探討並提出問題的解決方案;首先,所述利用反光鏡來導引雷射光束的現有雷射加工系統,當僅利用同一雷射光源產出相同光束能量照射時,其終端照射位置會因加工時的線性位移(如:固定範圍內單軸向來回位移、同一平面固定範圍內位移或三維空間固定範圍內位移),而令該終端照射位置上的反光鏡與其所對應的反光鏡之間,必然產生間距改變;然而,該間距改變則將導致該光束在不同終端照射位置的能量產生明顯差異與變化(即:間距愈小能量愈強,而間距愈大能量愈弱),如此將嚴重影響到加工對象物的被加工品質;因此,為了提昇加工品質,雷射光束在不同終端照射位置的光束能量如何加以恆定,實為加工品質得以提昇的重要關鍵因素。 In the existing laser processing system, the cost of the processing system using the mirror to guide the laser beam to the terminal irradiation position is relatively low compared to the fiber guide only in terms of its manufacturing cost; however, The invention only discusses and solves the problem of the prior art of using the mirror to guide the laser beam; first, the existing laser processing system using the mirror to guide the laser beam, when only When the same laser source is used to produce the same beam energy, the terminal irradiation position will be linearly displaced during processing (eg, single-axis back-and-forth displacement in a fixed range, displacement in a fixed range of the same plane, or displacement in a fixed range of three-dimensional space) Between the mirrors in the illumination position of the terminal and the corresponding mirrors, the pitch change is inevitably generated; however, the change in the pitch will cause significant differences and changes in the energy of the beam at different terminal illumination positions (ie: The smaller the spacing, the stronger the energy, and the larger the spacing, the weaker the energy. This will seriously affect the processed quality of the object to be processed; In order to improve the processing quality, how to balance the beam energy of the laser beam at different terminal irradiation positions is an important key factor for improving the processing quality.

為解決雷射加工系統在大範圍的不同終端照射位置所造成光束照射能量不穩定的問題,相關業界目前的解決方式主要可歸納成以下三類:第一類、如TW專利公告第498004號的現有技術,該現有技術主要是以雷射加工頭 在上方移動的方式來達其大範圍加工;也就是說,設於該現有技術雷射加工系統上方的雷射加工頭若要能自由移動,還必須得考量線路設計的問題,不但構造較為複雜且具有相當重量的雷射加工頭久經晃動,亦常會造成雷射光束聚焦點偏差等等的故障問題;另外,由於該現有技術雷射加工系統的體積相當龐大,不但會佔用大量的室內空間,且其雷射加工系統的製造成本與售價皆較高,實不符市場需求;第二類、如TW專利公告第M246083的現有技術,該現有技術主要是以加工對象物在下方大範圍移動的方式來達其大範圍加工的目的;也就是說,設於該現有技術雷射加工系統下方的加工對象物若要能自由移動,其雷射加工系統下方的面積則必須非常大,故其雖已不再具有TW專利公告第498004號第一類現有技術構造複雜與雷射加工頭晃動造成高不良率的問題,但仍存在其體積過大、室內空間佔用比例大、材料成本高與售價高等等不符市場需求的缺失;第三類、如TW專利公告第I398060號的現有技術,該現有技術主要則是經由電路控制雷射光源的能量輸出大小,來改善不同終端照射位置所需的能量而達成恆定的目的;因此,該第三類所述現有技術的雷射加工系統,其雖可改善前二類所述現有技術關於雷射加工頭晃動造成高不良率、體積過大、室內空間佔用比例大的問題,但因其雷射光源的控制電路研發成本與電子元件成本皆較高,故令其實施成雷射加工系統的售價也相對更高,仍不符市場需求。綜上所述可清楚瞭解,以上三類的現有技術,皆仍各自有其相應地缺失存在;因此,若能找出實質有效的解決方法來因應上述各類現有技術所有存在的缺失而加以符合市場的需求,實為該項技術相關業者或熟悉該項技術的研發人員當前首要之務。 In order to solve the problem that the beam irradiation energy is unstable due to the laser irradiation system in a wide range of different terminal irradiation positions, the current solutions of the relevant industry can be summarized into the following three categories: the first category, such as TW Patent Announcement No. 498004 Prior art, the prior art is mainly a laser processing head Move on top to achieve a wide range of processing; that is, the laser processing head above the prior art laser processing system must be considered to be free to move, but also must consider the design of the circuit, not only the structure is more complicated And the laser processing head with considerable weight has been shaken for a long time, which often causes the problem of the deviation of the focus of the laser beam, etc. In addition, because the volume of the prior art laser processing system is quite large, it not only takes up a lot of indoor space. And the manufacturing cost and the selling price of the laser processing system are both high, which is inconsistent with the market demand; the second type, as in the prior art of the TW Patent Publication No. M246083, the prior art mainly moves the object under the large range below. The way to achieve its wide range of processing; that is to say, if the object to be processed under the prior art laser processing system is to be freely movable, the area under the laser processing system must be very large, so Although there is no longer the problem of the complicated structure of the first type of prior art and the high defect rate caused by the shaking of the laser processing head of TW Patent Publication No. 498004, There is still a lack of volume, large proportion of indoor space, high material cost and high price, etc.; the third category, such as the prior art of TW Patent Publication No. I398060, is mainly controlled by a circuit. The energy output of the laser source is used to improve the energy required for different terminal illumination positions to achieve a constant purpose; therefore, the third type of prior art laser processing system of the third type can improve the existing two types of the existing The technology has a problem of high defect rate, excessive volume, and large proportion of indoor space caused by the shaking of the laser processing head. However, due to the high development cost and electronic component cost of the control circuit of the laser light source, it is implemented as a laser processing. The price of the system is also relatively high, still not in line with market demand. In summary, it can be clearly understood that the above three types of existing technologies still have their corresponding missing existence; therefore, if a substantial and effective solution can be found to meet all the existing shortcomings of the above various types of prior art, The demand of the market is indeed the top priority of the technology-related industry or the R&D personnel familiar with the technology.

本發明之主要目的,在於解決上述現有技術的雷射光束終端能量不均,致使被照射的加工對象物具有較高不良發生率的問題;以及, 解決所述現有技術雷射加工系統體積過大且結構過於複雜的問題;再者,解決該現有技術雷射加工系統的製造成本偏高、售價昂貴而不符市場需求的問題。 The main object of the present invention is to solve the above-mentioned prior art laser beam terminal energy unevenness, resulting in a problem that the object to be processed has a high incidence of failure; The problem that the prior art laser processing system is too large and the structure is too complicated is solved. Furthermore, the problem that the manufacturing cost of the prior art laser processing system is high and the price is expensive is not in line with the market demand.

根據上述目的,本發明提出一種恆定雷射光束終端能量的方法,係用以恆定雷射光束於不同終端照射位置的能量;該方法包括:提供一得以照射出一光束的雷射光源;提供一得以位移且接收該光束而導引至終端照射位置的終端作用單元;提供至少一位於該光束路徑且得以直線位移的間距調節單元;提供至少四個介於該雷射光源與該終端作用單元之間且位於該光束路徑的反射體,其中至少有二個以上的偶數個該反射體係固設於該間距調節單元,並依序以每二個該反射體成為一組該間距調節單元來計算數量,且每組該間距調節單元所對應射入與反射出的二條該光束路徑係與該間距調節單元本身所位移直線保持平行;而該間距調節單元與其外所對應的該反射體之間則維持有一得以提供該間距調節單元形成基準線的固定間距;預定出一該終端作用單元位移的最大作用範圍,並以該光束路徑相對該最大作用範圍所形成的座標軸來計算出該雷射光源至該終端作用單元的最大總間距與所在位置,並將其設定為該終端作用單元的基準點;沿該座標軸同步計算出當該終端作用單元於該最大作用範圍內位移時相對於該基準點所形成的相對距離後再加以總和取得一相對距離加總值;以及,同步將該相對距離加總值的二分之一設為該間距調節單元的調節總長,並依該間距調節單元的數量來加以分配該調節總長而同步令該間距調節單元進行調節動作,使該間距調節單元相對該基準線所形成的總間距與該調節總長相同,而令該光束由該雷射光源至該終端作用單元所形成的間距始終等同於所述最大總間距。 In accordance with the above objects, the present invention provides a method of constant laser beam end energy for energizing a constant laser beam at different terminal illumination locations; the method comprising: providing a laser source capable of illuminating a beam; providing a a terminal action unit capable of being displaced and receiving the light beam to be guided to the terminal illumination position; providing at least one pitch adjustment unit located in the beam path and linearly displaced; providing at least four interposed laser light sources and the terminal action unit And a reflector located in the beam path, wherein at least two or more of the plurality of reflection systems are fixed to the pitch adjustment unit, and the number of the two of the reflectors is used as a set of the pitch adjustment unit to calculate the quantity And each of the two sets of the beam path corresponding to the incident and adjustment unit is parallel to the displacement line of the pitch adjustment unit itself; and the spacing adjustment unit is maintained between the reflector corresponding to the outside thereof There is a fixed spacing for providing the spacing adjustment unit to form a reference line; a displacement of the terminal action unit is predetermined a maximum effective range, and calculating a maximum total distance and a position of the laser light source to the terminal action unit by using a coordinate axis formed by the beam path relative to the maximum range of action, and setting the reference point of the terminal action unit And calculating, according to the coordinate axis, a relative distance formed by the terminal when the terminal acting unit is displaced within the maximum range of motion, and then obtaining a relative distance sum value; and synchronizing the relative distance One-half of the total value is set as the total adjustment length of the pitch adjustment unit, and the adjustment total length is allocated according to the number of the pitch adjustment units, and the pitch adjustment unit is synchronously adjusted to make the pitch adjustment unit relative to the reference The total spacing formed by the lines is the same as the total length of the adjustment, and the spacing formed by the laser source from the laser source to the terminal action unit is always equal to the maximum total spacing.

更進一步地,所述恆定雷射光束終端能量的方法,其中所述調 節總長係依該間距調節單元的數量來加以平均分配予該間距調節單元來進行調節動作。 Still further, the method of terminating the energy of a constant laser beam, wherein the tuning The total length of the section is equally distributed to the pitch adjustment unit according to the number of the pitch adjustment units for the adjustment operation.

更進一步地,所述恆定雷射光束終端能量的方法,其中所述間距調節單元中的該反射體,其所射入與反射出該光束路徑所形成的夾角為直角。 Further, the method for terminating the energy of the constant laser beam, wherein the reflector in the pitch adjusting unit has a right angle formed by the angle formed by reflecting the reflected beam path.

根據上述目的,本發明提出一種恆定雷射光束終端能量的加工系統,所述加工系統具備一得以照射出一光束的雷射光源、一得以位移且接收該光束而導引至終端照射位置的終端作用單元與一控制該加工系統動作的控制單元;其特徵在於:所述加工系統還具備至少一位於該光束路徑且得以直線位移的間距調節單元;至少四個介於該雷射光源與該終端作用單元之間且位於該光束路徑的反射體,其中至少有二個以上的偶數個該反射體係固設於該間距調節單元,係依序以每二個該反射體成為一組該間距調節單元計算數量,且每組該間距調節單元所對應射入與反射出的二條該光束路徑係與該間距調節單元本身所位移直線保持平行;而該間距調節單元與其外所對應的該反射體之間則維持有一得以提供該間距調節單元形成基準線的固定間距;且該加工系統還預定有一該終端作用單元位移的最大作用範圍,並以該光束路徑相對該最大作用範圍所形成的座標軸計算出該雷射光源至該終端作用單元的最大總間距與所在位置,設定為一該終端作用單元的基準點;爰是,當該終端作用單元受該控制單元控制而於該最大作用範圍內位移時,該控制單元即得以沿該座標軸同步取得相對於該基準點所形成的相對距離,並將該相對距離加以總和而取得一相對距離加總值,再將該相對距離加總值的二分之一提供成為該間距調節單元的調節總長,並依該間距調節單元的數量來加以分配而控制該間距調節單元進行調節動作,讓該間距調節單元相對該基準線所形成的總間距與該調節總長相同,即得令 該光束由該雷射光源至該終端作用單元所形成的間距始終等同於該最大總間距;達成該加工系統的該光束於不同終端照射位置皆得以具有恆定的能量。 In accordance with the above objects, the present invention provides a processing system for constant laser beam end energy, the processing system having a laser source capable of illuminating a beam of light, a terminal that is displaced and receives the beam and directed to the terminal illumination position a function unit and a control unit for controlling the action of the processing system; wherein the processing system further comprises at least one pitch adjustment unit located in the beam path and linearly displaced; at least four between the laser source and the terminal a reflector between the active cells and located in the beam path, wherein at least two or more of the reflective systems are fixed to the pitch adjusting unit, and each of the two reflectors is a set of the pitch adjusting unit Calculating the number, and each of the two beam paths corresponding to the incident and the corresponding ones of the spacing adjustment unit are parallel to the displacement line of the spacing adjustment unit itself; and the spacing adjustment unit is between the reflectors corresponding to the outside thereof Maintaining a fixed pitch that provides the pitch adjustment unit to form a reference line; and the processing system is also predetermined a maximum range of action of the displacement of the terminal unit, and calculating a maximum total distance and a position of the laser light source to the terminal acting unit with respect to a coordinate axis formed by the beam path relative to the maximum range of action, and setting the function as a terminal a reference point of the unit; that is, when the terminal action unit is controlled by the control unit to be displaced within the maximum range of motion, the control unit can synchronously obtain a relative distance with respect to the reference point along the coordinate axis, and The relative distance is summed to obtain a relative distance sum value, and then one-half of the relative distance sum is provided as the adjustment total length of the pitch adjusting unit, and is allocated according to the number of the spacing adjusting unit. Controlling the spacing adjustment unit to perform an adjustment operation, so that the total spacing formed by the spacing adjustment unit relative to the reference line is the same as the total adjustment length, that is, The distance formed by the laser source from the laser source to the terminal action unit is always equal to the maximum total pitch; the beam of the processing system is capable of having a constant energy at different terminal illumination positions.

更進一步地,所述恆定雷射光束終端能量的加工系統,其中所述反射體為一全反射鏡;而所述終端作用單元為一光學聚焦裝置;另外,所述間距調節單元中的該反射體,其所射入與反射出該光束路徑所形成的夾角為直角。 Further, the processing system of the constant laser beam end energy, wherein the reflector is a total reflection mirror; and the terminal action unit is an optical focusing device; in addition, the reflection in the pitch adjustment unit The angle formed by the body and reflected from the path of the beam is a right angle.

更進一步地,所述恆定雷射光束終端能量的加工系統,其中所述加工系統係組設於一座體上,而該座體還具備有一承載該終端作用單元並得於該座體上直線水平位移的水平位移架。 Further, the processing system of the constant laser beam end energy, wherein the processing system is assembled on a body, and the base body further has a working unit that carries the terminal and is horizontally leveled on the body. Horizontal displacement of the displacement.

更進一步地,所述恆定雷射光束終端能量的加工系統,其中所述該座體還具備有至少一帶動桿、一位於該終端作用單元下方的滾筒與至少一軸桿。 Further, the processing system of the constant laser beam end energy, wherein the base body further comprises at least one driving rod, a roller under the terminal acting unit and at least one shaft.

更進一步地,所述恆定雷射光束終端能量的加工系統,其中所述終端作用單元得藉由該水平位移架而達成線性位移。 Further, the processing system of the constant laser beam terminal energy, wherein the terminal action unit has to achieve linear displacement by the horizontal displacement frame.

更進一步地,所述恆定雷射光束終端能量的加工系統,其中所述水平位移架兩端接設有一得與該水平位移架同步直線水平位移並得以帶動該終端作用單元上下移動的垂直位移架。 Further, the processing system of the constant laser beam end energy, wherein the horizontal displacement frame is connected with a vertical displacement frame which is horizontally displaced with the horizontal displacement frame and drives the terminal action unit to move up and down. .

更進一步地,所述恆定雷射光束終端能量的加工系統,其中所述垂直位移架具備有一藉由連桿連接帶動該終端作用單元並得與該終端作用單元同步位移的帶動裝置。 Further, the processing system of the constant laser beam end energy, wherein the vertical displacement frame is provided with a driving device that drives the terminal action unit by a link connection and is synchronously displaced with the terminal action unit.

通過上述技術方案可知,本發明相較於現有技術實質所達成的有益效果在於:一、本發明確實得以有效恆定雷射光束終端能量而提昇系統效能;二、本發明所述加工系統的構造確實得以簡化,令該加工系統的 體積相對得以縮小,故可有效減少該加工系統架設時所需佔用的室內空間比例;三、由於本發明確實簡化了該加工系統的構造,所以該加工系統的故障發生率便可大為降低,更有利於該加工系統降低製造成本、提昇產量與降低售價,故本發明確實可有效因應雷射加工系統市場質與量的需求。 According to the above technical solution, the beneficial effects achieved by the present invention over the essence of the prior art are as follows: 1. The present invention can effectively improve the system performance by effectively limiting the terminal energy of the laser beam; 2. The structure of the processing system of the present invention is indeed Simplified to make the processing system The volume is relatively reduced, so that the proportion of the indoor space required for the erection of the processing system can be effectively reduced. Third, since the present invention simplifies the construction of the processing system, the failure rate of the processing system can be greatly reduced. It is more advantageous for the processing system to reduce manufacturing costs, increase production and lower the selling price, so the present invention can effectively meet the market quality and quantity requirements of the laser processing system.

10‧‧‧加工系統 10‧‧‧Processing system

11‧‧‧控制單元 11‧‧‧Control unit

20‧‧‧雷射光源 20‧‧‧Laser light source

21‧‧‧光束 21‧‧‧ Beam

30‧‧‧間距調節單元 30‧‧‧pitch adjustment unit

40‧‧‧反射體 40‧‧‧ reflector

50‧‧‧終端作用單元 50‧‧‧terminal action unit

60‧‧‧最大作用範圍 60‧‧‧Maximum range of action

70‧‧‧座體 70‧‧‧ body

71‧‧‧水平位移架 71‧‧‧ horizontal displacement frame

72‧‧‧垂直位移架 72‧‧‧Vertical displacement frame

73‧‧‧帶動桿 73‧‧‧Drive rod

74‧‧‧滾筒 74‧‧‧Roller

75‧‧‧張力軸桿 75‧‧‧Tension shaft

80‧‧‧帶動裝置 80‧‧‧Drive device

81‧‧‧連桿 81‧‧‧ linkage

90‧‧‧加工對象物 90‧‧‧Processing objects

a,b,b1,b2,b3,c,L0‧‧‧固定間距 a, b, b1, b2, b3, c, L0‧‧ ‧ fixed spacing

B0‧‧‧基準點 B0‧‧‧ benchmark

B1‧‧‧基準線 B1‧‧‧ baseline

L1,L2‧‧‧個別間距 L1, L2‧‧‧ individual spacing

x,y,z‧‧‧座標軸 X, y, z‧‧‧ coordinate axis

x0,y0,z0‧‧‧軸向最大間距 X0, y0, z0‧‧‧ axial maximum spacing

x1,y1,z1‧‧‧相對距離 X1, y1, z1‧‧‧ relative distance

圖1,為本發明第一較佳實施例的上視平面示意圖。 1 is a top plan view of a first preferred embodiment of the present invention.

圖2,為本發明「圖1」的連續動作示意圖。 Fig. 2 is a schematic view showing the continuous operation of "Fig. 1" of the present invention.

圖3,為本發明「圖2」的連續動作示意圖。 Fig. 3 is a schematic view showing the continuous operation of "Fig. 2" of the present invention.

圖4,為本發明「圖2」的實施樣態立體示意圖。 Fig. 4 is a perspective view showing the embodiment of Fig. 2 of the present invention.

圖5,為本發明第二較佳實施例的上視平面示意圖。 Figure 5 is a top plan view of a second preferred embodiment of the present invention.

圖6,為本發明「圖5」的連續動作示意圖。 Fig. 6 is a schematic view showing the continuous operation of "Fig. 5" of the present invention.

圖7,為本發明「圖6」的連續動作示意圖。 Fig. 7 is a schematic view showing the continuous operation of "Fig. 6" of the present invention.

圖8,為本發明「圖6」的另一樣態動作上視平面示示意圖。 Fig. 8 is a top plan view showing another embodiment of the "Fig. 6" of the present invention.

圖9,為本發明第三較佳實施例的上視平面示意圖。 Figure 9 is a top plan view of a third preferred embodiment of the present invention.

圖10,為本發明「圖9」的連續動作示意圖。 Fig. 10 is a schematic view showing the continuous operation of Fig. 9 of the present invention.

圖11,為本發明「圖10」的連續動作示意圖。 Figure 11 is a schematic view showing the continuous operation of Figure 10 of the present invention.

圖12,為本發明「圖10」的另一樣態動作上視平面示示意圖。 Fig. 12 is a top plan view showing another embodiment of the "Fig. 10" of the present invention.

圖13,為本發明第四較佳實施例的上視平面示意圖。 Figure 13 is a top plan view of a fourth preferred embodiment of the present invention.

圖14,為本發明「圖13」的連續動作示意圖。 Fig. 14 is a schematic view showing the continuous operation of Fig. 13 of the present invention.

圖15,為本發明「圖14」的連續動作示意圖。 Fig. 15 is a schematic view showing the continuous operation of Fig. 14 of the present invention.

圖16,為本發明「圖14」的實施樣態立體示意圖。 Fig. 16 is a perspective view showing the embodiment of Fig. 14 of the present invention.

圖17,為本發明第五較佳實施例的實施樣態立體示意圖。 Figure 17 is a perspective view showing the embodiment of the fifth preferred embodiment of the present invention.

圖18,為本發明第六較佳實施例的等角示意圖。 Figure 18 is an isometric view of a sixth preferred embodiment of the present invention.

圖19,為本發明「圖18」的連續動作示意圖。 Fig. 19 is a schematic view showing the continuous operation of Fig. 18 of the present invention.

圖20,為本發明「圖19」的連續動作示意圖。 Fig. 20 is a schematic view showing the continuous operation of Fig. 19 of the present invention.

圖21,為本發明「圖19」的實施樣態立體示意圖。 Fig. 21 is a perspective view showing the embodiment of Fig. 19 of the present invention.

有關本發明所述恆定雷射光束終端能量的方法及其加工系統,其較佳實施例及詳細技術內容,茲配合圖式說明如後。首先,請同時參閱「圖1」~「圖4」所示,為本發明第一較佳實施例的上視平面示意圖及其連續動作與實施樣態立體示意圖。如圖所示可清楚看出,本發明所述方法包括:提供一得以照射出一光束21的雷射光源20;提供一得以位移且接收該光束21而導引至終端照射位置的終端作用單元50;提供至少一位於該光束21路徑且得以直線位移的間距調節單元30;提供至少四個介於該雷射光源20與該終端作用單元50之間且位於該光束21路徑的反射體40,其中至少有二個以上的偶數個該反射體40係固設於該間距調節單元30,並依序以每二個該反射體40成為一組該間距調節單元30來計算數量(其中該「圖1」~「圖4」的該間距調節單元30數量僅為一組;另如「圖5」~「圖8」中平行併列的該間距調節單元30數量之計算即為二組,以及如「圖9」~「圖12」中以不同方向直線位移的該間距調節單元30數量之計算當然為二組),且每組該間距調節單元30所對應射入與反射出的二條該光束21路徑係與該間距調節單元30本身所位移直線保持平行;也就是說,固設於該間距調節單元30的二該反射體40,其所射入與反射出該光束21路徑所形成的夾角無須以形成直角為其必要(如「圖12」所示即可得知),只要能使該間距調節單元30所對應射入與反射出的二條該光束21路徑與該間距調節單元30本身所位移直線保持平行即可達成,但為了實施上的方便,則以形成直角為最佳;而該間距調節單元30與其外所對應的該反射體40之間則維持有一得以提供該間 距調節單元30形成基準線B1的固定間距L0;也就是說,該間距調節單元30與其外用以對應反射的該反射體40之間具有該固定間距L0,且該間距調節單元30係以相對該基準線B1的間距來計算;預定出一該終端作用單元50位移的最大作用範圍60,並以該光束21路徑相對該最大作用範圍60所形成的座標軸x軸與座標軸y軸來計算出該雷射光源20至該終端作用單元50的最大總間距與所在位置,並將其設定為該終端作用單元50的基準點B0;沿該座標軸x軸與該座標軸y軸同步計算出當該終端作用單元50於該最大作用範圍60內位移時相對於該基準點B0所形成的相對距離後再加以總和取得一相對距離加總值(如「圖2」~「圖4」所示,該間距調節單元30位移後形成一相對距離x1與一相對距離y1);以及,同步將該相對距離(如「圖2」~「圖4」所示,該間距調節單元30位移後形成一相對距離x1與一相對距離y1)加總值的二分之一設為該間距調節單元30的調節總長L(為了方便下方算式的記載,故本發明以下皆會將該調節總長之後加上符號“L”或僅簡化為“L”來表示),並依該間距調節單元30的數量(該「圖1」~「圖4」中該間距調節單元30數量僅為一組)來加以分配該調節總長L而同步令該間距調節單元30進行個別間距L1的調節動作,使該間距調節單元30相對該基準線B1所形成的總間距(該個別間距L1)與該調節總長L相同(故該「圖1」~「圖4」中僅一組的該間距調節單元30相對該基準線B1所形成的間距即與該調節總長L相同),而令該光束21由該雷射光源20至該終端作用單元50所形成的間距始終等同於所述最大總間距。值得一提的是,由「圖1」可清楚看出,所述最大總間距=固定間距a+固定間距L0+固定間距b+固定間距L0+固定間距c+軸向最大間距x0+軸向最大間距y0;因此,該終端作用單元50位移後於座標軸x、座標軸y二軸向相對該基準點B0的距離長度(該相對距離x1與該相對距離y1)相加後的二分之一,即為本發明該間距調節單元30相對該基準線B1的該 個別間距L1(由於該個別間距L1已包含了二段該光束21路徑的長度,因此才等於該相對距離x1與該相對距離y1加總值的二分之一)。故當該終端作用單元50於該最大作用範圍60內位移如「圖2」~「圖4」時,即可得知該間距調節單元30的該調節總長L則等於該個別間距L1,亦等於該相對距離x1與該相對距離y1加總後的二分之一。然而,於「圖1」~「圖4」中,若僅以其圖式中符號表示本發明的方法,則可將其簡化為算式(一):L=L1=(x1+y1)/2 The preferred embodiment and the detailed technical content of the method for processing the energy of the constant laser beam terminal according to the present invention and the processing system thereof are as follows. First, please refer to FIG. 1 to FIG. 4, which are schematic diagrams of a top view of the first preferred embodiment of the present invention, and a schematic diagram of the continuous action and the implementation state. As is apparent from the figures, the method of the present invention comprises: providing a laser source 20 capable of illuminating a beam 21; providing a terminal unit that is displaced and receives the beam 21 for guidance to the terminal illumination position 50; providing at least one pitch adjustment unit 30 located in the path of the light beam 21 and linearly displaceable; providing at least four reflectors 40 between the laser light source 20 and the terminal action unit 50 and located in the path of the light beam 21, At least two or more of the reflectors 40 are fixed to the pitch adjustment unit 30, and each of the two reflectors 40 is used as a set of the pitch adjustment unit 30 to calculate the number (where the figure The number of the spacing adjustment units 30 from 1" to "Fig. 4" is only one set; the calculation of the number of the spacing adjustment units 30 parallel in parallel in "Fig. 5" to "Fig. 8" is two groups, and The number of the spacing adjustment units 30 that are linearly displaced in different directions in FIG. 9 to FIG. 12 is of course two sets, and the path of the two beams 21 corresponding to each of the spacing adjustment units 30 is reflected and reflected. And the spacing adjustment unit 30 The straight line of the displacement is kept parallel; that is, the two reflectors 40 fixed to the spacing adjusting unit 30 are not necessary to form a right angle with the angle formed by the path of the reflected beam 21 (eg, As can be seen from Fig. 12, it can be achieved that the path of the two beams 21 reflected and reflected by the pitch adjusting unit 30 can be parallel to the line of displacement of the pitch adjusting unit 30 itself, but For the convenience of implementation, it is preferable to form a right angle; and the gap adjusting unit 30 and the reflector 40 corresponding thereto are maintained to provide a space therebetween. The fixing unit 30 forms a fixed pitch L0 of the reference line B1; that is, the spacing adjusting unit 30 has the fixed spacing L0 between the reflector 40 and the reflector 40 for external reflection, and the spacing adjusting unit 30 is opposite to the The pitch of the reference line B1 is calculated; a maximum range 60 of displacement of the terminal action unit 50 is predetermined, and the beam is calculated by the coordinate axis x-axis and the coordinate axis y-axis formed by the beam 21 path relative to the maximum range 60; The maximum total distance and location of the light source 20 to the terminal action unit 50 are set as the reference point B0 of the terminal action unit 50; along the coordinate axis x-axis and the coordinate axis y-axis are calculated as the terminal action unit 50, when the displacement is within the maximum range of action 60, relative to the relative distance formed by the reference point B0, and then summed to obtain a relative distance summed value (as shown in FIG. 2 to FIG. 4). After 30 displacements, a relative distance x1 and a relative distance y1) are formed; and, the relative distance is synchronized (as shown in FIG. 2 to FIG. 4), and the spacing adjustment unit 30 is displaced to form a relative distance x1 and A relative distance y1) plus one-half of the total value is set as the total adjustment length L of the pitch adjusting unit 30 (in order to facilitate the description of the following formula, the present invention will add the symbol "L" or the following to the total length of the adjustment. It is only simplified to "L", and the total length L is allocated according to the number of the spacing adjustment units 30 (the number of the spacing adjustment units 30 in the "FIG. 1" to "FIG. 4" is only one set). Synchronization causes the pitch adjustment unit 30 to perform an adjustment operation of the individual pitch L1 such that the total pitch (the individual pitch L1) formed by the pitch adjustment unit 30 with respect to the reference line B1 is the same as the adjustment total length L (so, "FIG. 1" ~ "FIG. 4", only one set of the pitch adjustment unit 30 is formed at a pitch with respect to the reference line B1, that is, the same as the adjustment total length L, and the light beam 21 is caused by the laser light source 20 to the terminal action unit 50. The resulting spacing is always equivalent to the maximum total spacing. It is worth mentioning that, as can be clearly seen from Fig. 1, the maximum total spacing = fixed spacing a + fixed spacing L0 + fixed spacing b + fixed spacing L0 + fixed spacing c + axial maximum spacing x 0 + axial maximum spacing y0; After the displacement of the terminal action unit 50, the distance between the coordinate axis x and the coordinate axis y two axial directions relative to the reference point B0 (the relative distance x1 and the relative distance y1) is added, which is the pitch of the present invention. The adjustment unit 30 is opposite to the reference line B1 The individual spacing L1 (since the individual spacing L1 already contains the length of the path of the two segments of the beam 21, it is equal to the relative distance x1 and the relative distance y1 plus one-half of the total value). Therefore, when the terminal action unit 50 is displaced within the maximum range of motion 60 as shown in FIG. 2 to FIG. 4, it can be known that the adjusted total length L of the pitch adjustment unit 30 is equal to the individual pitch L1, which is equal to The relative distance x1 is added to the relative distance y1 by a factor of two. However, in "Fig. 1" to "Fig. 4", if the method of the present invention is represented by only the symbols in the drawings, it can be simplified to the formula (1): L = L1 = (x1 + y1) / 2

其中,0≦x1<x0;且0≦y1<y0 Where 0≦x1<x0; and 0≦y1<y0

另請同時參閱「圖5」~「圖8」所示,為本發明第二較佳實施例的上視平面示意圖及其連續動作示意圖,以及「圖9」~「圖12」所示,為本發明第三較佳實施例的上視平面示意圖及其連續動作示意圖。本發明第二、第三較佳實施例相較於本發明第一較佳實施例的差異在於;依該間距調節單元30的數量來加以分配該調節總長L而同步令該間距調節單元30進行個別間距L1與個別間距L2的調節動作(其中該間距調節單元30的數量,於該「圖5」~「圖12」中為皆為二組),使該間距調節單元30相對該基準線B1所形成的總間距與該調節總長L相同(故該「圖6」~「圖8」與「圖10」~「圖12」中二組的該間距調節單元30的個別間距L1與個別間距L2相加總後要與該調節總長L相同,而其中「圖6」、「圖7」與「圖10」~「圖12」的該調節總長L係平均分配給個別間距L1與個別間距L2,而「圖8」所表現的則為該調節總長L不以平均分配的方式給個別間距L1與個別間距L2),而令該光束21由該雷射光源20至該終端作用單元50所形成的間距始終等同於所述最大總間距。值得一提的是,由「圖6」~「圖8」與「圖10」~「圖12」同理可知;該終端作用單元50位移後於座標軸x、座標軸y二軸向相對該基準點B0的距離長度(該相對距離x1與該相對距離y1)相加後的二分之一,即為本發 明該間距調節單元30的該調節總長L(即該個別間距L1與該個別間距L2相加總)。故當該終端作用單元50於該最大作用範圍60內位移如「圖6」~「圖8」與「圖10」~「圖12」時,即可得知該間距調節單元30所需的該調節總長L,則等於該個別間距L1加上該個別間距L2,亦等於該相對距離x1與該相對距離y1加總後的二分之一。然而於「圖5」~「圖12」中,若僅以其圖式中符號表示本發明的方法,則可將其簡化為算式(二):L=(L1+L2)=(x1+y1)/2 Please also refer to FIG. 5 to FIG. 8 for a schematic view of a top plan view and a continuous operation diagram thereof according to a second preferred embodiment of the present invention, and FIG. 9 to FIG. A schematic top plan view of a third preferred embodiment of the present invention and a schematic diagram of its continuous operation. The second and third preferred embodiments of the present invention differ from the first preferred embodiment of the present invention in that the adjustment total length L is assigned according to the number of the spacing adjustment units 30 and the spacing adjustment unit 30 is synchronized. The adjustment operation of the individual spacing L1 and the individual spacing L2 (wherein the number of the spacing adjusting units 30 are both in the "Fig. 5" to "Fig. 12"), so that the spacing adjusting unit 30 is opposite to the reference line B1 The total pitch formed is the same as the total length L of the adjustment (therefore the individual spacing L1 and the individual spacing L2 of the spacing adjustment unit 30 of the two groups in the "Fig. 6" to "Fig. 8" and "Fig. 10" to "Fig. 12" The total sum L is the same as the total length L of the adjustment, and the total adjustment length L of "Fig. 6", "Fig. 7" and "Fig. 10" to "Fig. 12" is equally distributed to the individual spacing L1 and the individual spacing L2, The "FIG. 8" shows that the adjustment total length L is not evenly distributed to the individual spacing L1 and the individual spacing L2), and the beam 21 is formed by the laser source 20 to the terminal action unit 50. The spacing is always equal to the maximum total spacing. It is worth mentioning that, from Fig. 6 to Fig. 8 and Fig. 10 to Fig. 12, the end effect unit 50 is displaced from the coordinate axis x and the coordinate axis y to the reference point. The distance length of B0 (the relative distance x1 and the relative distance y1) is one-half of the sum, that is, the hair The adjustment total length L of the spacing adjustment unit 30 (that is, the individual spacing L1 is added to the individual spacing L2). Therefore, when the terminal action unit 50 is displaced within the maximum range of motion 60 as shown in FIG. 6 to FIG. 8 and FIG. 10 to FIG. 12, the pitch adjustment unit 30 is required to be known. Adjusting the total length L is equal to the individual spacing L1 plus the individual spacing L2, which is equal to the relative distance x1 and the relative distance y1 summed up by one-half. However, in "Fig. 5" to "Fig. 12", if the method of the present invention is represented by only the symbols in the drawings, it can be simplified to the formula (2): L = (L1 + L2) = (x1 + y1) )/2

其中,0≦x1<x0;且0≦y1<y0 Where 0≦x1<x0; and 0≦y1<y0

且其中,0≦L1≦(x1+y1)/2;且0≦L2≦(x1+y1)/2 And wherein 0≦L1≦(x1+y1)/2; and 0≦L2≦(x1+y1)/2

也就是說,當決定分配給該個別間距L1多少距離之後,則該個別間距L2能被分配的距離則僅為該調節總長L減去該個別間距L1所剩餘的距離。 That is to say, after determining the distance allocated to the individual spacing L1, the distance that the individual spacing L2 can be allocated is only the distance of the adjustment total length L minus the individual spacing L1.

亦或該算式(二)中,L1=L2;也就是說,其中所述調節總長L係可依該間距調節單元30的數量來加以平均分配給該個別間距L1與該個別間距L2(而圖式中是以二個該間距調節單元30為例,故該調節總長L除以2後,即為個別間距)。值得一提的是,該調節總長L若非必要平均分配時,設計者可視實施成品的大小、形狀或位置等條件需求而設計成個別所屬的不同距離,而重點在於該個別間距L1與該個別間距L2加總後需等於該調節總長L。 Or in the formula (2), L1=L2; that is, wherein the adjustment total length L can be equally distributed to the individual spacing L1 and the individual spacing L2 according to the number of the spacing adjusting units 30 (FIG. In the formula, the two spacing adjustment units 30 are taken as an example, so that the total length L of the adjustment is divided by 2, that is, the individual spacing). It is worth mentioning that if the total length L of the adjustment is not necessary, the designer can design different distances according to the requirements of the size, shape or position of the finished product, and the emphasis is on the individual spacing L1 and the individual spacing. After L2 is added, it needs to be equal to the total length L of the adjustment.

再請同時再參閱「圖13」~「圖16」所示,為本發明第四較佳實施例的上視平面示意圖及其連續動作與實施樣態立體示意圖;以及參閱「圖17」所示,為本發明第五較佳實施例的實施樣態立體示意圖。同樣地,如圖所示先預定出一該終端作用單元50位移的最大作用範圍60,並以該光束21路徑相對該最大作用範圍60所形成的座標軸x軸來計算出該雷射光源20至該終端作用單元50的最大總間距與所在位置,並將其設定為該終端作用單元50的基準點B0;以及,同步將該相對距離(如「圖14」~「圖17」所示,該間距 調節單元30位移後僅具有一相對距離x1)加總值(故僅為該相對距離x1)的二分之一設為該間距調節單元30的調節總長L(亦即個別間距L1),並依該間距調節單元30的數量(該「圖14」~「圖17」中該間距調節單元30數量僅為一組)來加以分配該調節總長L而同步令該間距調節單元30進行該個別間距L1的調節動作,使該間距調節單元30相對該基準線B1所形成的總間距與該調節總長L相同(故該「圖14」~「圖17」中僅一組的該間距調節單元30所形成的該個別間距L1即與該調節總長L相同),而令該光束21由該雷射光源20至該終端作用單元50所形成的間距始終等同於所述最大總間距。值得一提的是,同理該終端作用單元50位移後於座標軸x軸向相對該基準點B0的距離長度(該相對距離x1)的二分之一,即為本發明該間距調節單元30的該調節總長L(由於該個別間距L1已包含了二段該光束21路徑的長度,因此才等於等於該相對距離x1的二分之一)。故當該終端作用單元50於該最大作用範圍60內位移如「圖14」~「圖17」時,即可得知該間距調節單元30的該調節總長L則等於個別間距L1,亦等於該相對距離x1的二分之一。然而於「圖13」~「圖17」中,若僅以其圖式中符號表示本發明的方法,則可將其簡化為算式(三):L=L1=x1/2 Please also refer to FIG. 13 to FIG. 16 for a schematic view of a top view of the fourth preferred embodiment of the present invention, and a schematic diagram of its continuous operation and implementation; and FIG. 17 A perspective view of an embodiment of the fifth preferred embodiment of the present invention. Similarly, as shown in the figure, a maximum effective range 60 of the displacement of the terminal action unit 50 is first determined, and the laser light source 20 is calculated by the coordinate axis x axis formed by the path of the light beam 21 with respect to the maximum effective range 60. The maximum total spacing and location of the terminal action unit 50 is set as the reference point B0 of the terminal action unit 50; and the relative distance is synchronized (as shown in FIG. 14 to FIG. 17). spacing After the displacement of the adjusting unit 30, only one relative distance x1) is added, so that only one-half of the relative distance x1 is set as the total adjustment length L of the spacing adjusting unit 30 (that is, the individual spacing L1), and The number of the spacing adjustment units 30 (the number of the spacing adjustment units 30 in the "FIG. 14" to "FIG. 17" is only one set) is allocated to the adjustment total length L and the spacing adjustment unit 30 is synchronized to perform the individual spacing L1. The adjustment operation is such that the total distance formed by the pitch adjustment unit 30 with respect to the reference line B1 is the same as the total adjustment length L (so that only one of the "pitch adjustment units 30" of the "FIG. 14" to "FIG. 17" is formed. The individual spacing L1 is the same as the total adjustment length L, and the spacing formed by the laser beam 20 from the laser source 20 to the terminal action unit 50 is always equal to the maximum total spacing. It is worth mentioning that, similarly, one-half of the distance length (the relative distance x1) of the coordinate axis x axial direction relative to the reference point B0 after the displacement of the terminal action unit 50 is the pitch adjustment unit 30 of the present invention. The adjustment total length L (since the individual spacing L1 already contains the length of the path of the two segments of the beam 21, it is equal to equal to one-half of the relative distance x1). Therefore, when the terminal action unit 50 is displaced within the maximum range of motion 60 as shown in FIG. 14 to FIG. 17, it can be known that the adjusted total length L of the pitch adjustment unit 30 is equal to the individual pitch L1, which is equal to the Relative distance x1 is one-half. However, in "Fig. 13" to "Fig. 17", if the method of the present invention is represented by only the symbols in the drawings, it can be simplified to the equation (3): L = L1 = x1/2

其中,0≦x1<x0 Where 0≦x1<x0

另請同時參閱「圖18」~「圖21」所示,為本發明第六較佳實施例的等角示意圖及其連續動作與實施樣態立體示意圖。同樣地,如圖所示先預定出一該終端作用單元50位移的最大作用範圍60,並以該光束21路徑相對該最大作用範圍60所形成的座標軸x軸、座標軸y軸與座標軸z軸來計算出該雷射光源20至該終端作用單元50的最大總間距與所在位置,並將其設定為該終端作用單元50的基準點B0;以及,同步將該相對距離(如「圖19」~「圖21」 所示,該間距調節單元30位移後形成一相對距離x1、一相對距離y1與一相對距離z1)加總值的二分之一設為該間距調節單元30的調節總長L,並依該間距調節單元30的數量(該「圖19」~「圖21」中該間距調節單元30數量僅為一組)來加以分配該調節總長L而同步令該間距調節單元30進行個別間距L1的調節動作,使該間距調節單元30相對該基準線B1所形成的總間距與該調節總長L相同(故該「圖19」~「圖21」中僅一組的該間距調節單元30所形成的該個別間距L1即與該調節總長L相同),而令該光束21由該雷射光源20至該終端作用單元50所形成的間距始終等同於所述最大總間距。同理,該終端作用單元50位移後於座標軸x、座標軸y與座標軸z三軸向相對該基準點B0的距離長度(該相對距離x1、該相對距離y1與該相對距離z1)相加後的二分之一,即為本發明該間距調節單元30的該調節總長L(由於該個別間距L1已包含了二段該光束21路徑的長度,因此才等於該相對距離x1、該相對距離y1與加總值的二分之一)。故當該終端作用單元50於該最大作用範圍60內位移如「圖19」~「圖21」時,即可得知該間距調節單元30的該調節總長L則等於個別間距L1,亦等於該相對距離x1、該相對距離y1與該相對距離z1加總後的二分之一。然而於「圖18」~「圖21」中,若僅以其圖式中符號表示本發明的方法,則可將其簡化為算式(四):L=L1=(x1+y1+z1)/2 Please also refer to FIG. 18 to FIG. 21 for an isometric view of the sixth preferred embodiment of the present invention, and a schematic diagram of the continuous operation and the embodiment. Similarly, as shown in the figure, a maximum effective range 60 of the displacement of the terminal action unit 50 is first determined, and the coordinate axis x-axis, the coordinate axis y-axis and the coordinate axis z-axis formed by the beam 21 path relative to the maximum range of action 60 are Calculating the maximum total distance and location of the laser source 20 to the terminal action unit 50, and setting it as the reference point B0 of the terminal action unit 50; and synchronizing the relative distance (as shown in FIG. 19) "Figure 21" As shown, the spacing adjustment unit 30 is displaced to form a relative distance x1, a relative distance y1 and a relative distance z1), and one-half of the total value is set as the total adjustment length L of the spacing adjustment unit 30, and according to the spacing The number of adjustment units 30 (the number of the spacing adjustment units 30 in the "FIG. 19" to "FIG. 21" is only one set) is assigned to the adjustment total length L and the adjustment of the spacing adjustment unit 30 to the individual spacing L1 is synchronized. The total spacing formed by the spacing adjustment unit 30 with respect to the reference line B1 is the same as the total adjustment length L (so that only one of the spacing adjustment units 30 of the "FIG. 19" to "FIG. 21" forms the individual. The pitch L1 is the same as the total length L of the adjustment, and the spacing formed by the laser beam 20 from the laser source 20 to the terminal action unit 50 is always equal to the maximum total pitch. Similarly, after the terminal action unit 50 is displaced, the distance length between the coordinate axis x, the coordinate axis y, and the coordinate axis z of the three axes relative to the reference point B0 (the relative distance x1, the relative distance y1 and the relative distance z1) are added. One-half, that is, the adjusted total length L of the pitch adjusting unit 30 of the present invention (since the individual spacing L1 already includes the length of the path of the two segments of the light beam 21, it is equal to the relative distance x1, the relative distance y1 and Add one-half of the total value). Therefore, when the terminal action unit 50 is displaced within the maximum range of motion 60 as shown in FIG. 19 to FIG. 21, it can be known that the adjusted total length L of the pitch adjustment unit 30 is equal to the individual pitch L1, which is equal to the The relative distance x1, the relative distance y1 and the relative distance z1 are summed up by one-half. However, in "Fig. 18" to "Fig. 21", if the method of the present invention is represented by only the symbols in the drawings, it can be simplified to the equation (4): L = L1 = (x1 + y1 + z1) / 2

其中,0≦x1<x0;且0≦y1<y0;且0≦z1<z0 Where 0≦x1<x0; and 0≦y1<y0; and 0≦z1<z0

綜合以上本發明技術內容該算式(一)~該算式(四)的揭示可知,本發明所述方法可延伸出下列標準算式:L=(L1+L2+…+Ln)=(x1+y1+z1)/2 According to the disclosure of the above formula (1) to the formula (4), the method of the present invention can extend the following standard formula: L=(L1+L2+...+Ln)=(x1+y1+z1) )/2

其中,0≦x1<x0;且0≦y1<y0;且0≦z1<z0 Where 0≦x1<x0; and 0≦y1<y0; and 0≦z1<z0

且其中,0≦L1,L2,…或Ln≦(x1+y1+z1)/2 And wherein 0≦L1, L2,... or Ln≦(x1+y1+z1)/2

同理,L1,L2,…Ln可依該算式(二)推論得知該如何加以分配,故在此處不再加以贅述;而該標準算式中亦或可為L1=L2=…=Ln;此也就是說,其中所述調節總長L係依該間距調節單元30的數量來加以平均分配(故當該間距調節單元30具有n個時,則該調節總長L便於除以n後,即為個別間距)。值得一提的是,該調節總長L若非必要平均分配時,設計者可視實施成品的大小、形狀或位置等條件需求而設計成個別所屬的不同間距,而重點在於該個別間距L1至該個別間距Ln加總後需等於該調節總長L。當然,由上述算式得知,設計者實可依加工性質與需求來取決要選擇僅以x軸線性位移的該終端作用單元50來實施,或以x軸與y軸二維平面位移的該終端作用單元50來實施,亦或以x軸、y軸與z軸三維空間位移的該終端作用單元50來實施而設計出該加工系統10;更可依該加工系統10實際形狀將該間距調節單元30設置出適當的數量。舉例而言,本發明所述方法的該標準算式:L=(L1+L2+…+Ln)=(x1+y1+z1)/2;當設計如「圖2」所示時,則L2~Ln皆為0,且z1亦為0,故帶入後該標準算式:L=(L1+0)=(x1+y1+0)/2即等同該算式(一):L=L1=(x1+y1)/2;當設計如「圖6」、「圖8」、「圖10」與「圖12」所示時,則L3~Ln皆為0,且z1亦為0,故帶入後該標準算式:L=(L1+L2+0)=(x1+y1+0)/2即等同該算式(二):L=(L1+L2)=(x1+y1)/2;當設計如「圖14」所示時,則L2~Ln皆為0,且y1與z1亦皆為0,故帶入後該標準算式:L=(L1+0)=(x1+0+0)/2即等同該算式(三):L=L1=x1/2;最後,當設計如「圖19」所示時,則L2~Ln皆為0,故帶入後該標準算式:L=(L1+0)=(x1+y1+z1)/2即等同該算式(四):L=L1=(x1+y1+z1)/2;故該標準算式經由帶入各實施例後,皆分別可等同算式(一)~算式(四),如是可證本發明所請方法確實適用所述各實施例與樣態。 Similarly, L1, L2, ... Ln can be inferred according to the formula (2) to know how to allocate it, so it will not be repeated here; and the standard formula may also be L1=L2=...=Ln; That is to say, wherein the total length L of the adjustment is evenly distributed according to the number of the spacing adjustment units 30 (so when the spacing adjustment unit 30 has n, the adjustment total length L is conveniently divided by n, that is Individual spacing). It is worth mentioning that if the total length L of the adjustment is not necessary, the designer can design different spacings according to the requirements of the size, shape or position of the finished product, and the emphasis is on the individual spacing L1 to the individual spacing. After Ln is added, it needs to be equal to the total length L of the adjustment. Of course, it is known from the above formula that the designer can select the end effect unit 50 that is only displaced by the x-axis linearity, or the terminal that is displaced by the x-axis and the y-axis two-dimensional plane, depending on the processing property and the demand. The processing unit 10 is implemented by the action unit 50, or the end effect unit 50 of the x-axis, the y-axis and the z-axis three-dimensional spatial displacement; the pitch adjustment unit can be further shaped according to the actual shape of the processing system 10. 30 sets the appropriate amount. For example, the standard formula of the method of the present invention: L = (L1 + L2 + ... + Ln) = (x1 + y1 + z1) / 2; when the design is as shown in "Figure 2", then L2 ~ Ln Both are 0, and z1 is also 0, so the standard formula is: Br=(L1+0)=(x1+y1+0)/2 is equivalent to the formula (1): L=L1=(x1+ Y1)/2; when the design is as shown in "Figure 6", "Figure 8", "Figure 10" and "Figure 12", then L3~Ln are all 0, and z1 is also 0, so after bringing in The standard formula: L = (L1 + L2 + 0) = (x1 + y1 + 0) / 2 is equivalent to the formula (two): L = (L1 + L2) = (x1 + y1) / 2; when the design is like " As shown in Fig. 14", L2~Ln are all 0, and y1 and z1 are also 0, so the standard formula is: L=(L1+0)=(x1+0+0)/2 Equivalent to the formula (3): L=L1=x1/2; Finally, when the design is as shown in Fig. 19, then L2~Ln are all 0, so the standard formula is: L=(L1+0) )=(x1+y1+z1)/2 is equivalent to the formula (4): L=L1=(x1+y1+z1)/2; therefore, the standard equations can be equivalent to each other after being brought into the respective embodiments. (1) The formula (4), if it is ok, the method of the present invention does apply to the various embodiments and aspects.

再請參閱「圖4」所示,為本發明第一較佳實施例「圖2」的實施樣態立體示意圖。如圖所示可清楚看出,所述加工系統10具備一得以照射出一光束21的雷射光源20、一得以位移且接收該光束21而導引至終端照射位置的終端作用單元50(如:光學聚焦裝置)與一控制該加工系統10動作的控制單元11(如:可程式控制器CPU);其中,所述加工系統10還具備至少一位於該光束21路徑且得以直線位移的間距調節單元30;以及五個介於該雷射光源20與該終端作用單元50之間且位於該光束21路徑的反射體40(如:全反射鏡),其中具有二個該反射體40固設於該間距調節單元30,故該「圖4」中該間距調節單元30數量僅為一組,且該間距調節單元30所對應射入與反射出的二條該光束21路徑係與該間距調節單元30本身所位移直線保持平行;也就是說,固設於該間距調節單元30的二該反射體40,其所射入與反射出該光束21路徑所形成的夾角無須以形成直角為其必要(如「圖12」所示即可得知),只要能使該間距調節單元30所對應射入與反射出的二條該光束21路徑與該間距調節單元30本身所位移直線保持平行即可達成,但為了實施上的方便,則以形成直角為最佳;而該間距調節單元30與其外所對應的該反射體40之間則維持有一得以提供該間距調節單元30形成基準線B1的固定間距L0;也就是說,該間距調節單元30與其外用以對應反射的該反射體40之間具有該固定間距L0,且該間距調節單元30係以相對該基準線B1的間距來計算;且該加工系統10還預定有一該終端作用單元50位移的最大作用範圍60,並以該光束21路徑相對該最大作用範圍60所形成的座標軸x軸與座標軸y軸計算出該雷射光源20至該終端作用單元50的最大總間距與所在位置,設定為該終端作用單元50的基準點B0;故當該終端作用單元50受該控制單元11控制而於該最大作用範圍60內位移時,該控制單元11即得以沿該座標軸x軸與該座標軸y軸同步取得相對於該基準點B0所形成的相對距離x1與相對距 離y1,並將該相對距離x1與該相對距離y1加以總和而取得一相對距離加總值(x1+y1),再將該相對距離加總值(x1+y1)的二分之一[(x1+y1)/2]提供成為該間距調節單元30的調節總長L,並依該間距調節單元30的數量來加以分配(在此僅一組的數量)而控制該間距調節單元30進行一個別間距L1的調節動作,讓該間距調節單元30相對該基準線B1所形成的總間距與該調節總長L相同(亦為該個別間距L1),即得令該光束21由該雷射光源20至該終端作用單元50所形成的間距始終等同於該最大總間距;如是,達成該加工系統10的該光束21於不同終端照射位置皆得以具有恆定的能量;其中,所述加工系統10係組設於一座體70上,而該座體70還具備有一承載該終端作用單元50並得於該座體70上直線水平位移的水平位移架71,且該終端作用單元50得藉由該水平位移架71的設計與支撐而達成線性位移。 Referring to FIG. 4 again, a perspective view of an embodiment of the first preferred embodiment of the present invention, FIG. 2, is shown. As can be clearly seen, the processing system 10 is provided with a laser source 20 that emits a beam of light 21, a terminal action unit 50 that is displaced and receives the beam 21 for guidance to the terminal illumination position (eg, : an optical focusing device) and a control unit 11 (eg, a programmable controller CPU) that controls the operation of the processing system 10; wherein the processing system 10 further includes at least one pitch adjustment in the path of the beam 21 and linear displacement a unit 30; and five reflectors 40 (eg, total reflection mirrors) between the laser light source 20 and the terminal action unit 50 and located in the path of the light beam 21, wherein two of the reflectors 40 are fixed to The spacing adjustment unit 30 is such that the number of the spacing adjustment units 30 in the "FIG. 4" is only one set, and the path of the two beams 21 that are incident and reflected by the spacing adjustment unit 30 and the spacing adjustment unit 30 are The straight line of the displacement is kept parallel; that is, the two reflectors 40 fixed to the spacing adjusting unit 30 are not necessary to form a right angle with the angle formed by the path of the reflected beam 21 (eg, "Figure 12 As can be seen, as long as the path of the two beams 21 reflected and reflected by the pitch adjusting unit 30 can be kept parallel with the line of displacement of the pitch adjusting unit 30 itself, in order to implement Conveniently, the right angle is preferably formed; and the spacing adjustment unit 30 and the reflector 40 corresponding thereto are maintained with a fixed distance L0 for providing the spacing adjustment unit 30 to form the reference line B1; that is, The spacing adjustment unit 30 has the fixed spacing L0 between the reflector 40 and the reflector 40 for external reflection, and the spacing adjustment unit 30 is calculated with the spacing of the reference line B1; and the processing system 10 is further configured with the The maximum effective range 60 of the displacement of the terminal action unit 50, and calculating the maximum total distance of the laser light source 20 to the terminal action unit 50 by the coordinate axis x-axis and the coordinate axis y-axis formed by the path of the light beam 21 relative to the maximum range of action 60 And the location is set as the reference point B0 of the terminal action unit 50; therefore, when the terminal action unit 50 is controlled by the control unit 11 and is displaced within the maximum range 60 The control unit 11, i.e., along the coordinate axis is the x axis and y-axis of the coordinate axes to obtain relative synchronization of the reference point B0 distance x1 is formed from the opposite From y1, sum the relative distance x1 and the relative distance y1 to obtain a relative distance sum value (x1+y1), and then add the relative distance to the total value (x1+y1) by one-half [( X1+y1)/2] is provided as the adjustment total length L of the pitch adjustment unit 30, and is allocated according to the number of the pitch adjustment units 30 (here only one set) and the pitch adjustment unit 30 is controlled to perform one different The adjustment action of the spacing L1 is such that the total spacing formed by the spacing adjustment unit 30 relative to the reference line B1 is the same as the total adjustment length L (also the individual spacing L1), that is, the beam 21 is caused by the laser source 20 The spacing formed by the terminal action unit 50 is always equal to the maximum total pitch; if so, the beam 21 of the processing system 10 is capable of having constant energy at different terminal illumination positions; wherein the processing system 10 is assembled The body 70 is further provided with a horizontal displacement frame 71 carrying the terminal action unit 50 and horizontally displaced horizontally on the base body 70, and the terminal action unit 50 is provided by the horizontal displacement frame. The design and support of the 71 achieves a linear displacement.

另外,再請參閱「圖16」,為本發明第四較佳實施例「圖14」的實施樣態立體示意圖。如圖所示可清楚看出,所述加工系統10具備一得以照射出一光束21的雷射光源20、一得以位移且接收該光束21而導引至終端照射位置的終端作用單元50(如:光學聚焦裝置)與一控制該加工系統10動作的控制單元11(如:可程式控制器CPU);其中,所述加工系統10係組設於一座體70上,而該座體70還具備有一承載該終端作用單元50並得於該座體70上直線水平位移的水平位移架71,且該所述終端作用單元50得藉由該水平位移架71的設計與支撐而達成線性位移;另外,所述該座體70還具備有至少一帶動桿73、一位於該終端作用單元50下方的滾筒74與至少一張力軸桿75;該加工系統10則可藉由該帶動桿73帶動一承載於該滾筒74上且為軟性材料的加工對象物90而令該加工對象物90持續向下位移,該加工對象物90向下位移則相對於該終端作用單元50會產生猶如座標軸y軸向的位移,並藉由該張力軸桿75的拉緊而讓該終端作用單元50即可於該加工對象物90任 意位置上切割或雕刻。另外,所述加工系統10還具備一位於該光束21路徑且得以直線位移的間距調節單元30;以及五個介於該雷射光源20與該終端作用單元50之間且位於該光束21路徑的反射體40(如:全反射鏡),其中有二個該反射體40固設於該間距調節單元30,故該「圖16」的該間距調節單元30數量僅為一組,且該間距調節單元30所對應射入與反射出的二條該光束21路徑係與該間距調節單元30本身所位移直線保持平行;為了實施上的方便,則以形成直角為最佳;而該間距調節單元30與其外所對應的該反射體40之間則維持有一得以提供該間距調節單元30形成基準線B1的固定間距L0;也就是說,該間距調節單元30與其外用以對應反射的該反射體40之間具有該固定間距L0,且該間距調節單元30係以相對該基準線B1的間距來計算;且該加工系統10還預定有一該終端作用單元50位移的最大作用範圍60,並以該光束21路徑相對該最大作用範圍60所形成的座標軸x軸計算出該雷射光源20至該終端作用單元50的最大總間距與所在位置,設定為該終端作用單元50的基準點B0;故當該終端作用單元50受該控制單元11控制而於該最大作用範圍60內位移時,該控制單元11即得以沿該座標軸x軸同步取得相對於該基準點B0所形成的相對距離x1,並將該相對距離x1加以總和(因本實施樣態僅該相對距離x1,故加總後亦為該相對距離x1)而取得一相對距離加總值x1,再將該相對距離加總值x1的二分之一(x1/2)提供成為該間距調節單元30的調節總長L,並依該間距調節單元30的數量來加以分配(在此僅一組的數量)而控制該間距調節單元30進行個別間距L1的調節動作,讓該間距調節單元30與該基準線B1所形成的總間距與該調節總長L相同(亦等同該個別間距L1),即得令該光束21由該雷射光源20至該終端作用單元50所形成的間距始終等同於該最大總間距;如是,達成該加工系統10的該光束21於不同終端照射位置皆得以具有恆定的能量。 In addition, please refer to FIG. 16 again, which is a perspective view of an embodiment of the fourth preferred embodiment of the present invention. As can be clearly seen, the processing system 10 is provided with a laser source 20 that emits a beam of light 21, a terminal action unit 50 that is displaced and receives the beam 21 for guidance to the terminal illumination position (eg, : an optical focusing device) and a control unit 11 (eg, a programmable controller CPU) that controls the operation of the processing system 10; wherein the processing system 10 is assembled on a body 70, and the base 70 further has a horizontal displacement frame 71 carrying the terminal action unit 50 and linearly displaced on the base body 70, and the terminal action unit 50 is linearly displaced by the design and support of the horizontal displacement frame 71; The base 70 is further provided with at least one driving rod 73, a drum 74 located under the terminal action unit 50 and at least one force shaft 75. The processing system 10 can drive a bearing by the driving rod 73. The object to be processed 90 is continuously displaced downward on the drum 74 and is a workpiece 90 of a soft material. When the object 90 is displaced downward, it is generated in the axial direction of the coordinate axis y with respect to the terminal action unit 50. Displacement, and Tension rod 75 by a shaft of the tension applying means 50 so that the terminal can be in any of the processing object 90 Cut or engrave at the desired position. In addition, the processing system 10 further includes a pitch adjustment unit 30 located in the path of the light beam 21 and linearly displaced; and five interposed between the laser light source 20 and the terminal action unit 50 and located in the path of the light beam 21. The reflector 40 (such as a total reflection mirror), wherein two of the reflectors 40 are fixed to the spacing adjustment unit 30, so the number of the spacing adjustment units 30 of the "FIG. 16" is only one group, and the spacing is adjusted. The path of the two beams 21 corresponding to the incident and reflected by the unit 30 is parallel to the line of displacement of the pitch adjusting unit 30 itself; for the convenience of implementation, it is preferable to form a right angle; and the pitch adjusting unit 30 is Between the reflectors 40 corresponding to the outside, there is maintained a fixed pitch L0 for providing the pitch adjusting unit 30 to form the reference line B1; that is, between the spacing adjusting unit 30 and the reflector 40 for externally corresponding reflection Having the fixed pitch L0, and the pitch adjusting unit 30 is calculated with a pitch relative to the reference line B1; and the processing system 10 is further predetermined to have a maximum range of action of the terminal acting unit 50. The maximum total distance and position of the laser light source 20 to the terminal action unit 50 are calculated by the path of the beam 21 relative to the coordinate axis x axis formed by the maximum range 60, and is set as the reference point B0 of the terminal action unit 50. Therefore, when the terminal action unit 50 is controlled by the control unit 11 to be displaced within the maximum range of motion 60, the control unit 11 can synchronously obtain a relative distance x1 with respect to the reference point B0 along the coordinate axis x-axis. And the relative distance x1 is summed (only the relative distance x1 is used in the present embodiment, so the relative distance x1 is also added after the summation) to obtain a relative distance total value x1, and then the relative distance is added to the total value. One-half (x1/2) of x1 is provided as the adjustment total length L of the pitch adjustment unit 30, and is allocated according to the number of the pitch adjustment units 30 (here only one set) to control the pitch adjustment unit 30, the adjustment operation of the individual spacing L1 is performed, and the total spacing formed by the spacing adjustment unit 30 and the reference line B1 is the same as the total adjustment length L (also equivalent to the individual spacing L1), that is, the beam 21 is caused by the laser. Light source 20 to the end Spacing means 50 formed action always equal to the maximum total distance; if so, to reach the machining system 21 of the beam 10 are different to the irradiation position of the terminal having a constant energy.

值得一提的是,為了能更清楚說明本發明恆定雷射光束終端能量的加工系統,另請參閱「圖17」所示,為本發明第五較佳實施例的實施樣態立體示意圖。如圖所示可清楚看出,本實施樣態與「圖16」的第四較佳實施例的實施樣態差異在於:設計者得以依其實際加工需求與該加工系統10的大小、形狀或位置等條件,而將該雷射光源20與該終端作用單元50(如:光學聚焦裝置)的位置改變後,則介於該雷射光源20與該終端作用單元50之間僅需用到四個該反射體40(如:全反射鏡)即可達成本發明。 It is worth mentioning that, in order to more clearly illustrate the processing system of the constant laser beam end energy of the present invention, please refer to FIG. 17 for a schematic perspective view of the fifth preferred embodiment of the present invention. As can be clearly seen from the figure, the embodiment of the present embodiment differs from the embodiment of the fourth preferred embodiment of FIG. 16 in that the designer can adapt to the actual processing requirements and the size, shape or shape of the processing system 10. After the position of the laser light source 20 and the terminal action unit 50 (eg, optical focusing device) is changed, only four positions between the laser light source 20 and the terminal action unit 50 are required. The reflector 40 (e.g., a total reflection mirror) can achieve the present invention.

請再參閱「圖21」」所示,為本發明第六較佳實施例「圖19」的實施樣態立體示意圖。如圖所示可清楚看出,所述加工系統10具備一得以照射出一光束21的雷射光源20、一得以位移且接收該光束21而導引至終端照射位置的終端作用單元50(如:光學聚焦裝置)與一控制該加工系統10動作的控制單元11(如:可程式控制器CPU);其中,所述加工系統10係組設於一座體70上,而該座體70還具備有一承載該終端作用單元50並得於該座體70上直線水平位移的水平位移架71,而所述終端作用單元50得藉由該水平位移架71的設計與支撐而達成線性位移,另該水平位移架71兩端接設有一得與該水平位移架71同步直線水平位移並得以帶動該終端作用單元50上下移動的垂直位移架72;其中,所述加工系統10還具備至少一位於該光束21路徑且得以直線位移的間距調節單元30;以及五個介於該雷射光源20與該終端作用單元50之間且位於該光束21路徑的反射體40(如:全反射鏡),其中具有二個該反射體40固設於該間距調節單元30,故該「圖21」的該間距調節單元30數量僅為一組,且該間距調節單元30所對應射入與反射出的二條該光束21路徑係與該間距調節單元30本身所位移直線保持平行;為了實施上的方便,則以形成直角為最佳;而該間距調節單元30與其外所對應的該反射體40之間則維持有一得以提供該間距調節單元30形成基準線B1的固定 間距L0;也就是說,該間距調節單元30與其外用以對應反射的該反射體40之間具有該固定間距L0,且該間距調節單元30係以相對該基準線B1的間距來計算;且該加工系統10還預定有一該終端作用單元50位移的最大作用範圍60,並以該光束21路徑相對該最大作用範圍60所形成的座標軸x軸、座標軸y軸與座標軸z軸計算出該雷射光源20至該終端作用單元50的最大總間距與所在位置,設定為該終端作用單元50的基準點B0;故當該終端作用單元50受該控制單元11控制而於該最大作用範圍60內位移時,該控制單元11即得以沿該座標軸x軸、該座標軸y軸與該座標軸z軸同步取得相對於該基準點B0所形成的相對距離x1、相對距離y1與相對距離z1,並將該相對距離x1、該相對距離y1與該相對距離z1加以總和而取得一相對距離加總值(x1+y1+z1),再將該相對距離加總值(x1+y1+z1)的二分之一[(x1+y1+z1)/2]提供成為該間距調節單元30的調節總長L,並依該間距調節單元30的數量來加以分配(在此僅一組的數量)而控制該間距調節單元30進行個別間距L1的調節動作,讓該間距調節單元30相對該基準線B1所形成的總間距(即該個別間距L1)與該調節總長L相同,即得令該光束21由該雷射光源20至該終端作用單元50所形成的間距始終等同於該最大總間距;如是,達成該加工系統10的該光束21於不同終端照射位置皆得以具有恆定的能量。另外,值得一提的是,所述垂直位移架72具備有一藉由連桿81連接帶動該終端作用單元50並得與該終端作用單元50同步位移的帶動裝置80。 Please refer to FIG. 21 again, which is a perspective view showing an embodiment of the sixth preferred embodiment of the present invention. As can be clearly seen, the processing system 10 is provided with a laser source 20 that emits a beam of light 21, a terminal action unit 50 that is displaced and receives the beam 21 for guidance to the terminal illumination position (eg, : an optical focusing device) and a control unit 11 (eg, a programmable controller CPU) that controls the operation of the processing system 10; wherein the processing system 10 is assembled on a body 70, and the base 70 further has There is a horizontal displacement frame 71 that carries the terminal action unit 50 and is horizontally displaced horizontally on the base body 70, and the terminal action unit 50 is linearly displaced by the design and support of the horizontal displacement frame 71. The horizontal displacement frame 71 is connected to a vertical displacement frame 72 which is horizontally displaced in synchronization with the horizontal displacement frame 71 and drives the terminal action unit 50 to move up and down. The processing system 10 further includes at least one light beam. a 21-path and linearly displaced pitch adjustment unit 30; and five reflectors 40 (eg, total reflection mirrors) between the laser source 20 and the terminal action unit 50 and located in the path of the beam 21, wherein The two kinds of the reflectors 40 are fixed to the pitch adjusting unit 30. Therefore, the number of the pitch adjusting units 30 of the "FIG. 21" is only one set, and the two correspondingly incident and reflected by the spacing adjusting unit 30 are The path of the beam 21 is parallel to the line of displacement of the pitch adjusting unit 30 itself; for the convenience of implementation, it is preferable to form a right angle; and the spacing adjusting unit 30 is maintained between the reflector 40 corresponding to the outside thereof. There is a fixing for providing the spacing adjustment unit 30 to form the reference line B1. a spacing L0; that is, the spacing adjustment unit 30 has the fixed spacing L0 between the reflector 40 and the reflector 40 for external reflection, and the spacing adjustment unit 30 is calculated with a spacing from the reference line B1; The processing system 10 further defines a maximum effective range 60 of the displacement of the terminal action unit 50, and calculates the laser light source by the coordinate axis x-axis, the coordinate axis y-axis and the coordinate axis z-axis formed by the beam 21 path relative to the maximum range of action 60. The maximum total distance and position of the terminal action unit 50 is set to the reference point B0 of the terminal action unit 50; therefore, when the terminal action unit 50 is controlled by the control unit 11 and is displaced within the maximum range 60 The control unit 11 is configured to obtain a relative distance x1, a relative distance y1 and a relative distance z1 formed relative to the reference point B0 along the coordinate axis x-axis and the coordinate axis y-axis, and the relative distance z1. X1, the relative distance y1 is summed with the relative distance z1 to obtain a relative distance sum value (x1+y1+z1), and then the relative distance is added to one-half of the total value (x1+y1+z1) [ (x1+y1+z1 /2] provides the adjustment total length L of the pitch adjustment unit 30, and allocates according to the number of the pitch adjustment units 30 (here only one set) and controls the pitch adjustment unit 30 to adjust the individual pitch L1. The total spacing (ie, the individual spacing L1) formed by the spacing adjustment unit 30 relative to the reference line B1 is the same as the total adjustment length L, that is, the beam 21 is caused by the laser source 20 to the terminal action unit 50. The resulting spacing is always equal to the maximum total spacing; if so, the beam 21 of the processing system 10 is achieved to have a constant energy at different terminal illumination locations. In addition, it is worth mentioning that the vertical displacement frame 72 is provided with a driving device 80 that is connected to the terminal action unit 50 by the connecting rod 81 and is displaced synchronously with the terminal action unit 50.

綜上所述,本發明確實得以有效恆定雷射光束終端能量而提昇系統效能;且本發明所述加工系統10的構造確實得以簡化,令該加工系統的體積相對得以縮小,故可有效減少該加工系統架設時所需佔用的室內空間比例;再者,由於本發明確實簡化了該加工系統的構造,所以該加工系統10 的故障發生率便可大為降低,更有利於該加工系統10降低製造成本、提昇產量與降低售價,故本發明確實可有效因應雷射加工系統市場質與量的需求。 In summary, the present invention does improve the system performance by effectively reducing the terminal energy of the constant laser beam; and the configuration of the processing system 10 of the present invention is indeed simplified, so that the volume of the processing system is relatively reduced, thereby effectively reducing the The proportion of the indoor space required for the processing system to be erected; furthermore, since the present invention does simplify the construction of the processing system, the processing system 10 The failure rate can be greatly reduced, which is more conducive to the processing system 10 to reduce manufacturing costs, increase production and lower the selling price, so the present invention can effectively meet the market quality and quantity requirements of the laser processing system.

以上已將本發明做一詳細說明,惟以上所述者,僅為本發明的較佳實施例而已,當不能以此限定本發明實施的範圍,即凡依本發明請求項所作的均等變化與修飾,皆應仍屬本發明的專利涵蓋範圍內。 The present invention has been described in detail above, but the foregoing is only a preferred embodiment of the present invention, and is not intended to limit the scope of the embodiments of the present invention. Modifications are still within the scope of the patents of the present invention.

20‧‧‧雷射光源 20‧‧‧Laser light source

21‧‧‧光束 21‧‧‧ Beam

30‧‧‧間距調節單元 30‧‧‧pitch adjustment unit

40‧‧‧反射體 40‧‧‧ reflector

50‧‧‧終端作用單元 50‧‧‧terminal action unit

60‧‧‧最大作用範圍 60‧‧‧Maximum range of action

a,b,c,L0‧‧‧固定間距 a, b, c, L0‧‧‧ fixed spacing

B0‧‧‧基準點 B0‧‧‧ benchmark

B1‧‧‧基準線 B1‧‧‧ baseline

L1‧‧‧個別間距 L1‧‧‧ individual spacing

x,y,z‧‧‧座標軸 X, y, z‧‧‧ coordinate axis

x1,y1,z1‧‧‧相對距離 X1, y1, z1‧‧‧ relative distance

Claims (10)

一種恆定雷射光束終端能量的方法,係用以恆定雷射光束於不同終端照射位置的能量;該方法包括:提供一得以照射出一光束(21)的雷射光源(20);提供一得以位移且接收該光束(21)而導引至終端照射位置的終端作用單元(50);提供至少一位於該光束(21)路徑且得以直線位移的間距調節單元(30);提供至少四個介於該雷射光源(20)與該終端作用單元(50)之間且位於該光束(21)路徑的反射體(40),其中至少有二個以上的偶數個該反射體(40)係固設於該間距調節單元(30),並依序以每二個該反射體(40)成為一組該間距調節單元(30)來計算數量,且每組該間距調節單元(30)所對應射入與反射出的二條該光束(21)路徑係與該間距調節單元(30)本身所位移直線保持平行;而該間距調節單元(30)與其外所對應的該反射體(40)之間則維持有一得以提供該間距調節單元(30)形成基準線(B1)的固定間距(L0);預定出一該終端作用單元(50)位移的最大作用範圍(60),並以該光束(21)路徑相對該最大作用範圍(60)所形成的座標軸來計算出該雷射光源(20)至該終端作用單元(50)的最大總間距與所在位置,並將其設定為該終端作用單元(50)的基準點(B0);沿該座標軸同步計算出當該終端作用單元(50)於該最大作用範圍(60)內位移時相對於該基準點(B0)所形成的相對距離後再加以總和取得一相對距離加總值;以及,同步將該相對距離加總值的二分之一設為該間距調節單元(30)的調 節總長,並依該間距調節單元(30)的數量來加以分配該調節總長而同步令該間距調節單元(30)進行調節動作,使該間距調節單元(30)相對該基準線(B1)所形成的總間距與該調節總長相同,而令該光束(21)由該雷射光源(20)至該終端作用單元(50)所形成的間距始終等同於所述最大總間距。 A method for constant end energy of a laser beam for energy of a constant laser beam at different terminal illumination locations; the method comprising: providing a laser source (20) capable of illuminating a beam (21); providing Displacement and receiving the beam (21) to the terminal action unit (50) of the terminal illumination position; providing at least one pitch adjustment unit (30) located in the path of the beam (21) and linearly displaced; providing at least four a reflector (40) between the laser light source (20) and the terminal action unit (50) and located in the path of the light beam (21), wherein at least two or more of the reflectors (40) are secured The spacing adjustment unit (30) is arranged, and each of the two reflectors (40) is used as a group of the spacing adjustment unit (30) to calculate the quantity, and each group of the spacing adjustment unit (30) corresponds to the shot. The two beams (21) path in and out are kept parallel to the line of displacement of the pitch adjusting unit (30) itself; and the spacing adjusting unit (30) is between the reflector (40) corresponding to the outside thereof Maintaining a fixed line (B1) for providing the pitch adjustment unit (30) Distance (L0); a maximum effective range (60) of the displacement of the terminal action unit (50) is predetermined, and the laser (21) path is calculated relative to the coordinate axis formed by the maximum effective range (60) The maximum total distance and position of the light source (20) to the terminal action unit (50), and set it as a reference point (B0) of the terminal action unit (50); synchronously calculate the action unit along the coordinate axis (50) a relative distance summed with respect to the relative distance formed by the reference point (B0) when the displacement is within the maximum range of action (60), and a relative distance summation value is obtained; and the relative distance is added to the total value. One-half is set to the adjustment of the pitch adjustment unit (30) The total length of the section is allocated according to the number of the spacing adjustment unit (30), and the adjustment adjustment unit (30) is synchronized to perform the adjustment operation, so that the spacing adjustment unit (30) is opposite to the reference line (B1) The total spacing formed is the same as the total length of the adjustment, and the spacing formed by the beam (21) from the laser source (20) to the terminal action unit (50) is always equal to the maximum total spacing. 如申請專利範圍第1項所述恆定雷射光束終端能量的方法;其中,所述調節總長係依該間距調節單元(30)的數量來加以平均分配予該間距調節單元(30)來進行調節動作。 The method of claiming a constant laser beam end energy according to claim 1, wherein the adjustment total length is equally distributed to the spacing adjustment unit (30) for adjustment according to the number of the spacing adjustment units (30) action. 如申請專利範圍第1或2項所述恆定雷射光束終端能量的方法;其中,所述間距調節單元(30)中的該反射體(40),其所射入與反射出該光束(21)路徑所形成的夾角為直角。 The method of claiming the energy of the constant laser beam end according to claim 1 or 2; wherein the reflector (40) in the pitch adjusting unit (30) injects and reflects the beam (21) The angle formed by the path is a right angle. 一種恆定雷射光束終端能量的加工系統,所述加工系統(10)具備一得以照射出一光束(21)的雷射光源(20)、一得以位移且接收該光束(21)而導引至終端照射位置的終端作用單元(50)與一控制該加工系統(10)動作的控制單元(11);其特徵在於:所述加工系統(10)還具備至少一位於該光束(21)路徑且得以直線位移的間距調節單元(30);至少四個介於該雷射光源(20)與該終端作用單元(50)之間且位於該光束(21)路徑的反射體(40),其中至少有二個以上的偶數個該反射體(40)係固設於該間距調節單元(30),係依序以每二個該反射體(40)成為一組該間距調節單元(30)計算數量,且每組該間距調節單元(30)所對應射入與反射出的二條該光束(21)路徑係與該間距調節單元(30)本身所位移直線保持平行;而該間距調節單元(30)與其外所對應的該反射體(40)之間則維持有一得以提供該間距調節單元(30)形成基準線(B1)的固定間距(L0);且該加工系統(10)還預定有一該終端作用單元(50)位移的最大作用範圍(60),並以該光束(21)路徑相對該最大作用範圍(60) 所形成的座標軸計算出該雷射光源(20)至該終端作用單元(50)的最大總間距與所在位置,設定為一該終端作用單元(50)的基準點(B0);爰是,當該終端作用單元(50)受該控制單元(11)控制而於該最大作用範圍(60)內位移時,該控制單元(11)即得以沿該座標軸同步取得相對於該基準點(B0)所形成的相對距離,並將該相對距離加以總和而取得一相對距離加總值,再將該相對距離加總值的二分之一提供成為該間距調節單元(30)的調節總長,並依該間距調節單元(30)的數量來加以分配而控制該間距調節單元(30)進行調節動作,讓該間距調節單元(30)相對該基準線(B1)所形成的總間距與該調節總長相同,即得令該光束(21)由該雷射光源(20)至該終端作用單元(50)所形成的間距始終等同於該最大總間距;達成該加工系統(10)的該光束(21)於不同終端照射位置皆得以具有恆定的能量。 A processing system for constant laser beam end energy, the processing system (10) having a laser source (20) capable of illuminating a beam (21), being displaced and receiving the beam (21) a terminal action unit (50) for the terminal illumination position and a control unit (11) for controlling the operation of the processing system (10); characterized in that the processing system (10) further comprises at least one path located in the light beam (21) a pitch adjustment unit (30) capable of linear displacement; at least four reflectors (40) interposed between the laser light source (20) and the terminal action unit (50) and located in the path of the light beam (21), wherein at least Two or more even-numbered reflectors (40) are fixed to the pitch adjustment unit (30), and the number of the two-dimensional reflectors (40) is calculated as a set of the pitch adjustment units (30). And each of the two sets of the beam (21) path corresponding to the incident and adjustment unit (30) is parallel to the displacement line of the pitch adjustment unit (30) itself; and the pitch adjustment unit (30) A gap adjustment unit (30) is provided between the reflector (40) corresponding to the outside thereof. a fixed pitch (L0) of the reference line (B1); and the processing system (10) is further predetermined to have a maximum effective range (60) of displacement of the terminal action unit (50), and the beam (21) path is opposite to the maximum Range of action (60) The formed coordinate axis calculates the maximum total distance and position of the laser light source (20) to the terminal action unit (50), and is set as a reference point (B0) of the terminal action unit (50); When the terminal action unit (50) is controlled by the control unit (11) to be displaced within the maximum range (60), the control unit (11) can synchronously acquire the reference point (B0) along the coordinate axis. Forming a relative distance, and summing the relative distances to obtain a relative distance summing value, and then providing one-half of the relative distance plus the total value as the adjustment total length of the spacing adjusting unit (30), and The number of the spacing adjustment units (30) is distributed to control the spacing adjustment unit (30) to perform an adjustment operation, so that the total spacing formed by the spacing adjustment unit (30) relative to the reference line (B1) is the same as the total length of the adjustment. That is, the distance formed by the laser beam (21) from the laser source (20) to the terminal action unit (50) is always equal to the maximum total pitch; the beam (21) of the processing system (10) is achieved. Different terminal illumination positions have a constant energy. 如申請專利範圍第4項所述恆定雷射光束終端能量的加工系統;其中,所述反射體(40)為一全反射鏡;而所述終端作用單元(50)為一光學聚焦裝置;另外,所述間距調節單元(30)中的該反射體(40),其所射入與反射出該光束(21)路徑所形成的夾角為直角。 a processing system for constant laser beam end energy according to claim 4; wherein the reflector (40) is a total reflection mirror; and the terminal action unit (50) is an optical focusing device; The reflector (40) in the pitch adjustment unit (30) is at a right angle to the angle formed by the path of the reflected beam (21). 如申請專利範圍第4或5項所述恆定雷射光束終端能量的加工系統;其中,所述加工系統(10)係組設於一座體(70)上,而該座體(70)還具備有一承載該終端作用單元(50)並得於該座體(70)上直線水平位移的水平位移架(71)。 A processing system for constant laser beam end energy according to claim 4 or 5; wherein the processing system (10) is assembled on a body (70), and the base (70) is further provided There is a horizontal displacement frame (71) carrying the terminal action unit (50) and being horizontally displaced horizontally on the seat body (70). 如申請專利範圍第6項所述恆定雷射光束終端能量的加工系統;其中,所述該座體(70)還具備有至少一帶動桿(73)、一位於該終端作用單元(50)下方的滾筒(74)與至少一軸桿(75)。 A machining system for constant laser beam end energy according to claim 6; wherein the base (70) further comprises at least one driving rod (73) and one below the terminal acting unit (50) The drum (74) is coupled to at least one shaft (75). 如申請專利範圍第6項所述恆定雷射光束終端能量的加工系統;其中,所述終端作用單元(50)得藉由該水平位移架(71)而達成線性位移。 A machining system for constant laser beam end energy as described in claim 6; wherein the terminal action unit (50) is linearly displaced by the horizontal displacement frame (71). 如申請專利範圍第8項所述恆定雷射光束終端能量的加工系統;其中,所述水平位移架(71)兩端接設有一得與該水平位移架(71)同步直線水平位移並得以帶動該終端作用單元(50)上下移動的垂直位移架(72)。 The processing system of the constant laser beam terminal energy according to claim 8; wherein the horizontal displacement frame (71) is connected at both ends to be horizontally displaced with the horizontal displacement frame (71) and is driven. The terminal acts on the vertical displacement frame (72) of the unit (50) moving up and down. 如申請專利範圍第9項所述恆定雷射光束終端能量的加工系統;其中,所述垂直位移架(72)具備有一藉由連桿(81)連接帶動該終端作用單元(50)並得與該終端作用單元(50)同步位移的帶動裝置(80)。 The processing system of the constant laser beam terminal energy according to claim 9; wherein the vertical displacement frame (72) is provided with a connecting rod (81) connecting the terminal acting unit (50) and obtaining The terminal action unit (50) drives the displacement device (80).
TW104104195A 2015-02-09 2015-02-09 Method of constant laser beam terminal energy and processing system thereof TWI592241B (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW104104195A TWI592241B (en) 2015-02-09 2015-02-09 Method of constant laser beam terminal energy and processing system thereof
CN201510526008.6A CN105855698B (en) 2015-02-09 2015-08-25 Method for keeping constant terminal energy of laser beam and processing system thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW104104195A TWI592241B (en) 2015-02-09 2015-02-09 Method of constant laser beam terminal energy and processing system thereof

Publications (2)

Publication Number Publication Date
TW201628752A TW201628752A (en) 2016-08-16
TWI592241B true TWI592241B (en) 2017-07-21

Family

ID=56624026

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104104195A TWI592241B (en) 2015-02-09 2015-02-09 Method of constant laser beam terminal energy and processing system thereof

Country Status (2)

Country Link
CN (1) CN105855698B (en)
TW (1) TWI592241B (en)

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004209542A (en) * 2003-01-08 2004-07-29 Matsushita Electric Ind Co Ltd Laser beam machine for electronic component
ES2303215T3 (en) * 2005-06-21 2008-08-01 Fameccanica.Data S.P.A. PROCEDURE AND DEVICE FOR CUTTING ITEMS BY LASER, IN PARTICULAR HEALTH PRODUCTS AND THEIR COMPONENTS, WITH A LASER POINT OF DIAMETER INCLUDED BETWEEN 0.1 AND 0.3 MM.
US20090052010A1 (en) * 2007-08-23 2009-02-26 Raymond Michaud Apparatus for providing multiple independently controllable beams from a single laser output beam and delivering the multiple beams via optical fibers
US9059567B2 (en) * 2011-12-07 2015-06-16 Mitsubishi Electric Corporation CO2 laser device and CO2 laser processing device
PL222531B1 (en) * 2012-04-05 2016-08-31 Wrocławskie Centrum Badań Eit + Spółka Z Ograniczoną Method and system for color marking of metals
CN103785949B (en) * 2013-11-29 2015-10-14 邱博 Laser soldering device and method for laser welding

Also Published As

Publication number Publication date
TW201628752A (en) 2016-08-16
CN105855698A (en) 2016-08-17
CN105855698B (en) 2017-11-03

Similar Documents

Publication Publication Date Title
CN204322752U (en) A kind of controllable distance indicating device of 3D laser marking machine
TWI581006B (en) Gantry equipment and control methods
CN107243690A (en) A kind of laser multifocal dynamic machining method and system
TWI764519B (en) A kind of laser radar and its scanning method
CN107971629A (en) Laser working light path structure
CN112068309B (en) Three-dimensional scanning system containing double-paraboloid mirror dynamic focusing module
CN112264722A (en) Laser micropore machining equipment and machining method suitable for thin-wall parts
KR20140121927A (en) Appraratus for manufacturing pattern on a light guide plate
TWI592241B (en) Method of constant laser beam terminal energy and processing system thereof
CN105562925A (en) CO2 laser cutting device and optical path transmission method thereof
CN202257029U (en) Large-area laser-projection scanning type exposure workbench
CN204195067U (en) A kind of optical-fiber laser light splitting and cutter head device
CN116136394B (en) Laser measuring head device integrating dotted line and double modes and structural curved surface measuring method
CN109719387A (en) Laser processing device and method, laser package method, laser anneal method
TWM509089U (en) Process system with constant laser beam terminal energy
CN102169221B (en) Reflector
KR101520401B1 (en) Movable table system
CN208289223U (en) Optical beam scanning system for laser micropore processing
CN116100807A (en) Tooling structure capable of adjusting coaxiality of light spots of laser module and coaxiality adjusting method
CN105467583A (en) A small-scope laser translational scanning mirror apparatus
CN106052656B (en) A kind of level mode of laser group and laser level
CN205764445U (en) Heat insulating strip double-sided laser coder
CN205271138U (en) Accurate laser beam machining device based on pivot angle compression
CN206936633U (en) A kind of laser optical path adjusting means and laser die cutting machine
RU2283738C1 (en) Device for laser working

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees