TWI588406B - Light-emitting apparatus - Google Patents

Description

Illuminating device

The present invention relates to a light-emitting device, and more particularly to a light-emitting device having a uniform light field.

Light-Emitting Diode (LED) has the characteristics of low energy consumption, long life, small size, fast response, and stable optical output. Therefore, it gradually replaces the traditional illumination source and is used in various household lighting devices. . However, a light-emitting diode is a point source, and most of the light is usually only radiated in a single direction, so the production of a full-period light field like an incandescent bulb often requires complicated structural design or manufacturing processes.

The present invention discloses a light-emitting device comprising a main carrier having a first edge and a second edge; a projection extending from the first edge and having a first surface and a first surface In contrast to the second surface, wherein the first surface is coplanar with the second plate edge. A carrier plate extends from the second surface and has an oblique angle with the protrusion. A first lighting unit is located on the secondary carrier board.

The above and other objects, features, and advantages of the present invention will become more apparent and understood.

The present invention will be described with reference to the drawings, in which the same or the same reference numerals are used, and in the drawings, the shape or thickness of the elements may be expanded or reduced.

FIG. 1A is a perspective view showing a light-emitting assembly 100 according to an embodiment of the present invention. The light-emitting assembly 100 includes a carrier 10, a plurality of light-emitting units 11, 16 are disposed on the carrier 10, electrodes 12A and 12B are positive and negative electrodes respectively, and are disposed on the carrier 10, and a wire structure (not shown) An electrical connection is made between the light emitting units 11, 16. The carrier 10 includes a main carrier 102, four protrusions 103A, 103B, 103C, 103D, and four secondary carriers 101A, 101B, 101C, 101D. The light emitting unit 16 and the electrodes 12A, 12B are located on the same side of the main carrier 102. In another embodiment, the electrodes 12A, 12B and the light emitting unit 16 are located on opposite sides of the main carrier 102.

In the present embodiment, the main carrier 102 has a quadrangular shape and four plate sides 1021, 1022, 1023, 1024, and defines a centroid passing through the center of the main carrier 102 and perpendicular to the central axis C of the main carrier 102. . Here, the main carrier 102 covers an area of an approximately quadrilateral shape. The protruding portions 103A, 103B, 103C, and 103D each have a quadrangular shape and are respectively located at four corners of the main carrier 102. The protrusions 103A, 103B, 103C, 103D each protrude outward from the four board sides 1021, 1022, 1023, 1024 of the main carrier board 102 and extend in different directions on the XY plane. The projections 103A, 103B, 103C, 103D are substantially coplanar with the main carrier 102. In one embodiment, the projections 103A, 103B, 103C, 103D are integrally formed with the main carrier 102 without additional connectors being formed therebetween. Furthermore, the protrusions 103A, 103B, 103C, 103D each have a first surface coplanar with the board edges 1021, 1022, 1023, 1024 of the main carrier 102. As shown in FIGS. 1A and 1C, the protruding portion 103D is extended from the plate side 1024 in the X direction, and the first surface 1031 of the protruding portion 103D is coplanar with the plate edge 1023. The length (H1) of the protruding portion 103D connected to the main carrier 102 is less than 1/3 of the length (H2) of the board side 1024 of the main carrier 102. For the relationship between the protruding portions 103A, 103B, and 103C and the main carrier 102, reference may be made to the content of the protruding portion 103D, and details are not described herein again.

Referring to Figures 1A-1B, the projections 103A, 103B, 103C, 103D each have a second surface relative to the first surface. The secondary carrier plates 101A, 101B, 101C, and 101D each extend substantially in the Z-axis direction from the second surface of the corresponding protruding portions 103A, 103B, 103C, and 103D. As shown in FIG. 1B, taking the secondary carrier 101D as an example, the secondary carrier 101D has a bent region 101D1 extending outward from the second surface 1032 of the protruding portion 103D (Y-axis direction), and an extended region 101D2 The inclination angle θ extends upward from the bending portion 101D1 (Z-axis direction), wherein θ is defined as an angle between the extension portion 101D2 and the protruding portion 103D, which may be 0° to 345°. In one embodiment, θ is between 90° and 145°. Similarly, the secondary carrier plates 101A, 101B, and 101C are also inclined at an oblique angle with the corresponding protruding portions 103A, 103B, and 103C. The inclination angles of the secondary carrier plates 101A to 101D and the corresponding protruding portions 103A to 103D may be the same or different. For example, in another embodiment, depending on the design of the light pattern, the inclination angle θ of one portion is between 0° and 180°, and the inclination angle θ of the other portion is between 181° and 345°. In addition, the corresponding description of the secondary carrier boards 101A, 101B, 101C can be referred to the description of the secondary carrier board 101D, which will not be described herein.

Referring to Figs. 1A and 1C, one side of the secondary carrier plates 101A, 101B, 101C, and 101D and a third surface of the corresponding protruding portions 103A, 103B, 103C, and 103D are apart from each other by a distance d. For the sake of clarity, the 1C figure is a pattern in which the first B diagram is rotated by 90 degrees. Taking the secondary carrier 101D as an example, the secondary carrier 101D has a side 141 spaced apart from the third surface 1033 of the projection 103D by a distance d between 0 and 10 mm. For the relationship between the side of one of the sub-carriers 101A, 101B, and 101C and the corresponding protrusions 103A, 103B, and 103C, reference may be made to the description of the front switch 101D and the protrusion 103D, which will not be described herein.

As shown in FIG. 1A, a plurality of light emitting units 11 are located on the secondary carrier plates 101A to 101D, and a plurality of light emitting units 16 are located on the main carrier 102. The light-emitting units 11 located on the different sub-boards 101A to 101D radiate light in different directions. A plurality of light emitting units 16 are located on the main carrier 102 and are arranged in a quadrangular shape around the central axis C. In combination with the light emission of the light-emitting unit 11 and the light-emitting unit 16 in different directions, the light-emitting assembly 100 can achieve an approximately full-period light pattern. The definition of full-circumference here can be found in the definition of ENERGY STAR. In another embodiment, the arrangement of the plurality of light emitting units 16 may also be in other forms, such as a circle, a triangle, an arbitrary polygon, or a matrix. Depending on the optoelectronic characteristics of the illumination unit 16 and the optical type of the illumination assembly 100, the illumination unit 16 can be configured in a tighter or more loose configuration. For example, the illumination unit 16 can be configured concentrically or in multiple layers of different geometries. (For example, the inner layer is a single point, a triangle, a quadrangle, and the outer layer is a circle, a pentagon, a hexagon, etc.).

The secondary carriers 101A-101D of the light-emitting assembly 100 are rectangular in shape and have a width and a length. In one embodiment, the secondary carrier plates 101A-101D have a length of 18 mm to 30 mm and a width of less than 5 mm; and the light-emitting units 11 on the secondary carrier plates 101A-101D have a width of 0.5 mm to 1.5 mm and a length of 1 mm. ～3 mm and arranged in a single row along the length direction of the secondary carriers 101A to 101D (one-dimensional array). Therefore, the secondary carrier plate and the light-emitting unit 11 located thereon form an elongated light-emitting structure, which is defined herein as a filament structure. Therefore, the light emitting assembly 100 has a plurality of filament structures. The distance and number between each of the light-emitting units 11 can be appropriately increased or decreased depending on the light type and brightness required for the light-emitting assembly 100. In another embodiment, the width of the secondary carrier plates 101A-101D is greater than 5 mm, such that the plurality of light-emitting units 11 are arranged in a plurality of rows in the secondary carrier plates 101A-101D (two-dimensional array).

The main carrier, the projections, and the secondary carrier may be integrally formed and have the same material. The carrier 10 is preferably formed of a material that is thermally conductive and bendable, such as a ceramic heat sink substrate or a metal-based printed circuit board (MCPCB). The metal-based printed circuit board comprises a circuit structure layer and a metal plate. The circuit structure layer is bonded to the metal plate through an insulating dielectric layer. The material of the metal plate is a material with good thermal conductivity such as copper or aluminum. Since the thermal conductivity of the metal material is greater than that of the ceramic material, and the thermal conductivity of the ceramic material is greater than that of the glass material, the light-emitting assembly 100 uses a metal-based printed circuit board (MCPCB) as the carrier 10 compared to the ceramic when the carrier has the same size. When the heat dissipating substrate is used as the carrier 10, it can withstand a high operating current. When the light-emitting device 100 uses the ceramic heat-dissipating substrate as the carrier 10, it can withstand a higher operating current than the glass substrate as the carrier 10. For example, the metal-based printed circuit board (MCPCB) as the light-emitting component 100 of the carrier 10 can operate at a current of 90 to 120 mA, and the ceramic heat-dissipating substrate can serve as a light-emitting component 100 of the carrier 10 with an operating current of 60 to 80 mA. The light-emitting assembly 100 of the carrier 10 can operate at a current of 30 to 50 mA. Further, since the ceramic heat dissipation substrate or the metal-based printed circuit board (MCPCB) is used as the light-emitting assembly 100 of the carrier 10, it can withstand a high operating current, and can be configured as compared with the light-emitting assembly 100 using the glass substrate as the carrier 10. Fewer illumination units can achieve the same lumen value.

1D and 1E are respectively equivalent circuit diagrams of different embodiments of the light-emitting assembly 100. 1D is a schematic diagram showing an equivalent circuit of an embodiment. The light-emitting units 11 on the same sub-boards 101A to 101D and the light-emitting units 16 on the main carrier 102 are connected in series to form different strings of light-emitting units. All of the light emitting cell strings are connected in parallel with each other and electrically connected to the electrodes 12A, 12B. 1E is a schematic diagram showing an equivalent circuit of another embodiment. The light-emitting unit 11 on a single secondary carrier (101A, 101B, 101C or 101D) forms a light-emitting unit string, and the light-emitting unit 16 on the main carrier 102 is also A string of light emitting cells is formed. Each of the light emitting cell strings is connected in series to each other and electrically connected to the electrodes 12 A, 12B. In another embodiment, the partial light-emitting unit strings are first connected in series to each other, and further connected in series with other light-emitting units, or the partial light-emitting unit strings are first connected in parallel with each other and in series with other light-emitting unit strings.

2A to 2D are flowcharts showing the fabrication of the light-emitting assembly 100 when d=0 in Fig. 1C. Referring to FIG. 2A, a quadrilateral carrier 10' is provided, electrodes 12A, 12B, and a wire structure (not shown) for electrically connecting the light-emitting units are formed on the carrier 10'. Four grooves 17 are formed on the carrier 10' by a cutting or stamping method, thereby defining the secondary carrier plates 101A, 101B, 101C, 101D, the main carrier 102, and the projections 103A, 103B, 103C, 103D. The groove 17 has a width of 1 mm to 10 mm. Subsequently, referring to FIG. 2B, the light-emitting units 11, 16 are disposed on the main carrier 102 and the secondary carriers 101A to 101D.

Referring to Fig. 2C, the photoelectric characteristics (e.g., operating voltage, brightness) of the light-emitting units 11, 16 are tested by the test device T electrically conductive electrodes 12A, 12B. Since the electrodes 12A, 12B are electrically connected to all of the light emitting units 11, 16 via the wire structure, when the test device T is electrically connected to the electrodes 12A, 12B, all the light emitting units 11, 16 on the carrier 10' can be tested at one time. Photoelectric properties. Alternatively, the wire structure on the carrier 10' can be designed such that each of the secondary carrier and the illumination unit on the primary carrier can be measured separately or simultaneously. Referring to FIG. 2D, the sub-carriers 101A to 101D are bent to form the light-emitting assembly 100. Alternatively, a bending line (L) may be formed in advance by a cutting blade, and the secondary carrier plates 101A to 101D may be bent along the bending line (L). Therefore, it is possible to prevent the protruding portion and/or the secondary carrier plates 101A to 101D from being broken due to excessive stress during the bending process. (Refer to Figure 1A)

In one embodiment, the secondary carrier boards 101A-101D and the main carrier board 102 and the light-emitting units 11, 16 in the light-emitting assembly 100 can be regarded as four filaments fixed on a light board (the main carrier board 102 and the light-emitting unit 16). (Secondary boards 101A to 101D and light emitting unit 11). Compared to the use of four independent filaments and a light panel to make the light-emitting assembly 100, four separate filaments need to be tested one by one before being assembled with the light panel. However, all the filaments can be tested at one time by using the structure or process of the embodiment, and the light-emitting component 100 can be obtained by bending the secondary carrier plates 101A-101D, which can greatly simplify the manufacturing process of the light-emitting component 100 (reducing the test steps and shortening Test time, and assembly time).

Fig. 2E is a view showing a pentagon carrier 10" according to an embodiment of the present invention. Fig. 2E shows a state in which the carrier 10" is not bent. Five linear grooves 17 are formed on the carrier 10", thereby defining five secondary carriers 101"A-101"E and a primary carrier 102". For other related descriptions, refer to the paragraph corresponding to Figure 2A. In the present embodiment, the shape of the carrier 10" is not limited to the pentagonal carrier 10" and may be other polygons such as a triangle, a hexagon, a heptagon, an octagon or the like. Therefore, when the carrier plate is an N-sided shape (N is a positive integer not less than 3), N grooves can be formed to define N secondary carrier plates and a primary carrier plate, and then refer to steps 2A-2D. To produce a light-emitting assembly having N secondary carriers.

Fig. 2F shows a schematic view of a circular carrier 10'" according to an embodiment of the present invention. Fig. 2F shows a state in which the carrier 10'" is not bent. In the present embodiment, three arcuate grooves 17 are formed on the carrier 10'", thereby defining three secondary carriers 101'"A-101'"C and a main carrier 102'". In another embodiment, four arcuate grooves may also be formed to define four secondary carrier plates and one primary carrier plate. Therefore, when M arcuate trenches are formed to define M secondary carrier plates and a main carrier plate (M is a positive integer not less than 2), reference is made to the steps of FIGS. 2B to 2D to make one having a secondary load. The illuminating component of the board.

Figure 3 is a perspective view showing a light-emitting assembly 200 in accordance with another embodiment of the present invention. The light-emitting assembly 200 includes a carrier 20, a plurality of light-emitting units 11 and 16 disposed on the carrier 20, electrodes 22A and 22B are positive and negative electrodes respectively, and are disposed on the carrier 20, and a wire structure (not shown) is used. The light emitting units 11, 16 are electrically connected. The light emitting unit 16 and the electrodes 22A, 22B are located on the same side of the carrier 20. In another embodiment, the electrodes 22A, 22B and the light emitting unit 16 are located on opposite sides of the carrier 20. The carrier 20 includes a main carrier 202 and four secondary carriers 201A to 201D. The outer plate edge of the main carrier plate 202 has a quadrangular shape and defines two diagonal lines A1, A2 and a central axis C passing through the two diagonal points and perpendicular to the main carrier plate 202. The main carrier 202 has four board sides 2021 to 2024 and four protrusions 203A to 203D. The protruding portions 203A to 203D have a triangular-like outer shape and extend inward from the plate edges 2021 to 2024 in the direction of the central axis C. Taking the protruding portion 203D as an example, a bottom edge of the protruding portion 203D is a plate edge 2024 of the main carrier 202, and an arc angle 203D1 is located near the central axis C and opposite to the bottom edge or the edge 2024, but does not touch. To the central axis C. The first oblique side 203D2 and the second oblique side 203D3 of the protruding portion 203D are each spaced apart from a hypotenuse of the adjacent protruding portions 203C, 203A by a distance greater than zero. The protrusions 203A-203D collectively define a cross-shaped opening 204, and the position of the cross-shaped opening 204 is substantially located on the two diagonals A1, A2. The secondary carrier plates 201A to 201D are respectively located between the adjacent protrusions and extend substantially in the Z-axis direction. For example, the distance (H3) between the two adjacent protrusions 203B, 203C is greater than the width (H4) of the secondary carrier 201C; H3-H4 = 1 mm to 10 mm. The manufacturing process of the light-emitting component 200 is similar to that of the light-emitting component 100, that is, a trench is formed on the carrier 20 by cutting or stamping, thereby defining the secondary carrier boards 201A-201D, the main carrier board 202, and the protrusions 203A-203D. Outline and position. After the test equipment is used to perform a one-time test on all the light-emitting units on the carrier 20, the steps of bending the secondary carriers 201A to 201D are performed to form the light-emitting assembly 200. Therefore, in the bending step, it is advantageous to bend the secondary carrier plates 201A to 201D when H3 > H4. Further, the angle θ between the secondary carriers 201A to 201D and the main carrier 202 is 0° to 180°. In another embodiment, the angle θ between the secondary carrier plates 201A-201D and the main carrier plate 202 is 181°-345°; or, the inclination angle θ of a part of the secondary carrier plates is between 0° and 180°, and another part is The inclination angle θ of the carrier plate is between 181° and 345°. For the connection relationship between the secondary carrier boards 201A to 201D and the main carrier board 202, reference may be made to the description of the first embodiment in FIG. 1A, and details are not described herein again.

As shown in FIG. 3, in the light-emitting assembly 200, a plurality of light-emitting units 11 are located on the secondary carrier boards 201A-201D, and a plurality of light-emitting units 16 are located on the main carrier board 202 and arranged around the central axis C. In combination with the light emission of the light-emitting unit 11 and the light-emitting unit 16 in different directions, the light-emitting assembly 200 can achieve an almost full-circumferential light pattern. Similarly, depending on the optoelectronic characteristics of the illumination unit 16 and the optical type of the illumination assembly 200, the illumination unit 16 can be configured in a tighter or looser configuration. The secondary carrier boards 201A-201D and the plurality of light-emitting units 11 are similar in size and arrangement to the light-emitting assembly 100. Therefore, the secondary carrier boards 201A-201D and the light-emitting unit 11 located thereon can be regarded as a filament structure and emit light. Assembly 200 can be viewed as a light emitting structure having a plurality of filaments.

In one embodiment, the secondary carrier boards 201A-201D, the main carrier board 202, and the light-emitting units 11, 16 can be regarded as four filaments (secondary board) fixed on a light board (the main carrier board 202 and the light-emitting unit 16). 201A to 201D and light emitting unit 11). When the light-emitting assembly 200 is fabricated using four separate filaments and a light panel, the four separate filament structures need to be tested one by one before being assembled with the light panel. However, the structure or process of the embodiment can be used to test all the filaments at a time and then bend the secondary carrier plates 201A-201D, thus greatly simplifying the process of manufacturing the light-emitting assembly 200 (reducing test steps, shortening test time, and assembly time) ).

In another embodiment, the carrier 20 has an N-sided shape and has N apex angles (N is a positive integer not less than 3). The carrier 20 has N segments extending from the central axis (through the centroid and perpendicular to the virtual line segment of the carrier) to the apex angle, so that the carrier 30 is equally divided into N triangular-like protrusions, and a self-definition is defined. A radial opening that is axially outwardly emitted from the center, the position of the opening being substantially on the N line segments. The N secondary carrier plates are respectively located between the two adjacent projections and extend substantially in the Z-axis direction. For a detailed description of the connection relationship between the secondary carrier board and the main carrier board, refer to the corresponding paragraphs mentioned above, and details are not described herein again.

Figure 4 is a perspective view showing a light-emitting assembly 300 in another embodiment of the present invention. The light-emitting component comprises a circular carrier 30, a plurality of light-emitting units are disposed on the carrier 30, electrodes 32A and 32B are respectively disposed on the carrier 30, and a wire structure (not shown) is used for electrically connecting the light. Units 11, 16. The light emitting unit 16 and the electrodes 32A, 32B are located on the same side of the carrier 30. In another embodiment, the electrodes 32A, 32B and the light emitting unit 16 are located on opposite sides of the carrier 30. The carrier 30 includes a main carrier 302 and four secondary carriers 301A to 301D. The outer plate side of the main carrier plate 302 has a circular profile, a central axis C passing through the center and perpendicular to the main carrier plate 302, and four radii B1 to B4 extending outward from the central axis. The angle between the two adjacent radii is 90 degrees, and the outer edge of the main carrier 302 is equally divided into four rims 3021 to 3024. Further, the main carrier 302 has four projecting portions 303A to 303D having a fan-like shape and extending inward from the plate sides 3021 to 3024 in the direction of the central axis C. The protrusions 303A-303D collectively define a cross-shaped opening 304, and the position of the cross-shaped opening 304 is substantially located on the four radii B1 to B4.

The secondary carrier plates 301A to 301D are respectively located between the adjacent protrusions 303A to 303D and extend substantially toward the Z axis. For example, the distance (H5) between the two adjacent protrusions 303A, 303B is greater than the width (H6) of the secondary carrier 301A; H5-H6 = 1 mm to 10 mm. The manufacturing process of the light-emitting assembly 300 first forms a groove on the carrier 30 by cutting or stamping, thereby defining the secondary carrier plates 301A-301D and the main carrier 302. After the one-time conduction test is performed on all the light-emitting units on the carrier 30 by using the test equipment, the steps of bending the secondary carrier plates 301A to 301D are performed to form the light-emitting assembly 300. Therefore, in the bending step, the design of H5>H6 can facilitate bending the secondary carrier plates 201A-201D. Further, the angle θ between the secondary carrier plates 301A to 301D and the main carrier 302 is 0° to 180°. In another embodiment, in order to illuminate the position below the carrier 30, the angle θ between the secondary carrier plates 301A-301D and the main carrier 302 may be 181°-345°; or, the inclination angle θ of a part of the secondary carrier is between The inclination angle θ of 0 to 180 degrees and the other sub-board is between 181° and 345°. The detailed connection relationship between the secondary carrier boards 301A to 301D and the main carrier board 302 is described with reference to the first embodiment of FIG. 1A, and details are not described herein.

As shown in FIG. 4, in the light-emitting assembly 300, a plurality of light-emitting units 11 are located on the secondary carrier plates 301A to 301D, and a plurality of light-emitting units 16 are located on the main carrier 302 and arranged around the central axis C. In combination with the light-emitting direction of the light-emitting unit 11 and the light-emitting unit 16, the light-emitting assembly 300 can achieve an almost full-circumferential light pattern. Similarly, depending on the optoelectronic characteristics of the illumination unit 16 and the optical type of the illumination assembly 300, the illumination unit 16 can be configured in a tighter or looser configuration.

In one embodiment, the secondary carrier boards 301A-301D, the main carrier board 302, and the light-emitting units 11, 16 can be regarded as four filaments (secondary board) fixed on a light board (the main carrier board 302 and the light-emitting unit 16). 301A to 301D and light emitting unit 11). Compared to the use of four independent filaments and a light panel to create the illumination group 300, four independent filaments need to be tested one by one before being assembled with the light panel. However, all the filaments can be tested at one time by using the structure or process of the embodiment, and the secondary carrier plates 301A to 301D are bent, thereby greatly simplifying the manufacturing process of the light-emitting assembly 300 (reducing test steps, shortening test time, and assembly time). .

In another embodiment, the carrier 30 may have N radii extending from the central axis C toward the outer edge of the carrier 30 (N is a positive integer not less than 3), so that the carrier 30 is equally divided into N Scalloped protrusion. N protrusions extending from the outer plate edge toward the central axis collectively define a radial opening that is emitted from the central axial direction, and the position of the opening is substantially located on the N radii. The N secondary carrier plates are respectively located between the two adjacent projections and extend substantially in the Z-axis direction.

Fig. 5 is a perspective view showing the light emitting device 1000. In this embodiment, the light-emitting component 100 is taken as an example, but the purpose thereof is not to limit the scope of the present invention, and other light-emitting components 200, light-emitting components 300, and the like can also be applied to the light-emitting device 1000. As shown in FIG. 5, the light-emitting device 1000 includes a lamp cover 1003, a carrier plate 1001, and a heat sink 1002. The light emitting assembly 100 is disposed on the carrier board 1001 and covered by the lamp cover 1003. The carrier plate 1001 may be a metal material, a ceramic material or a heat conductive plastic. The light-emitting component 100 is fixed to the carrier 1001 by solder, a conductive adhesive, a buckle, or a screw, so that heat generated by the light-emitting unit on the light-emitting component 100 can be transmitted to the heat sink 1002 through the carrier 1001. The material of the heat sink 1002 comprises metal, thermally conductive plastic, or ceramic. The manner in which the heat sink 1002 is engaged with the carrier plate 1001 can be by clamping, adhering, soldering, screwing, or molding. The heat sink 1002 has a cavity (not shown) inside. An electronic control component (not shown) is disposed in the cavity and electrically connects the light emitting component 100 and an external circuit (not shown). In an embodiment, the electronic control unit and the light emitting unit can be disposed on the main carrier board and the secondary carrier board in the same step (for example, FIG. 2B).

The shape of the lamp cover 1003 may be spherical, tubular or candle-shaped. The shape of the lampshade 1003 can be referred to the American National Standards Institute (ANSI) standards, such as A series, B series, S series, F series, and G series (G series). The lamp cover 1003 can be composed of a transparent, translucent transparent material. The lamp cover 1003 may be filled with air, a transparent material, or a combination of the two. Optionally, a film (not shown) may be included on the inner surface of the globe 1003, the film comprising a wavelength converting material, diffusing particles, or a combination thereof. The wavelength converting material is used for wavelength conversion of the light emitted by the light emitting component 100. For example, the light emitting component 100 emits blue light, and the light is converted into yellow light by the wavelength converting material, and the white light is generated when the blue light and the yellow light are mixed. The diffusing particles are used to scatter light generated by blue, yellow, white, or/and other light-emitting components 100.

FIG. 6A is a perspective view showing a light-emitting assembly 400 according to another embodiment of the present invention. The light-emitting assembly 400 includes a circular carrier 40, and a plurality of light-emitting units 11 are disposed on the carrier 40. The circular carrier 40 includes a main carrier 402, a plurality of first-type secondary carriers 401, and a plurality of second-type secondary carriers 403. A plurality of light emitting units 11 are distributed on the first type of secondary carrier 401. The main carrier plate 402 has a circular outer plate edge 4022 and a circular inner plate edge 4021, so that the main carrier plate 402 generally assumes a ring shape. The outer plate edge 4022 and the inner plate edge 4021 have the same center. The first type of secondary carrier 401 and the second type of secondary carrier 403 extend substantially in the Z-axis direction from the inner plate edge 4021 and are spaced apart from each other. The angle θ between the first type of secondary carrier 401 and the main carrier 402 is 90o to 180o. The angle θ1 between the second type secondary carrier 403 and the main carrier 402 is 90° to 180°. θ and θ1 may be the same or different. The first type of secondary carrier 401 has a width W1 and a length L1. The second type secondary carrier plate 403 has an approximately trapezoidal shape with an upper base width W2 and a bevel length L2. The upper base width W2 and the oblique side length L2 of the second type secondary carrier plate 403 may be the same as or different from the width W1 and the length L1 of the first type secondary carrier plate 401. Different W1 and L1 of the first type of secondary carrier 401 may be the same or different, and different W2 and L2 of the second type secondary carrier 403 may be the same or different. The number of first type secondary boards 401 and the number of second type secondary boards 403 may also be the same or different. In this embodiment, the light-emitting assembly 400 has four first-type secondary carrier plates 401, four second-type secondary carrier plates 403, W2>W1, L2< L1, and width W1 of all first-type secondary carrier plates 401. Same as the length L1, the width W2 and the length L2 of all the second type of secondary carrier plates 403 are the same.

As shown in FIG. 6A, a plurality of light-emitting units 11 are located on the first-type secondary carrier 401, and no light-emitting units are disposed on the second-type secondary carrier 403 and the main carrier 402. A light emitting unit (not shown) is selectively disposed on the main carrier 402 to increase the brightness of the light emitting assembly 400 in the positive Z direction.

FIG. 6B shows a schematic view of the light-emitting assembly 400 disposed on a carrier plate 1001'. The carrier plate 1001' is, for example, the carrier plate 1001 in Fig. 5, but has a projection 10011 at its center, such as a frustum, a pyramid, a corner post, or a cylinder. If there is an accommodating space under or inside the protruding portion 10011, an electronic control component (not shown) can be accommodated. The electronic control unit electrically connects the light emitting assembly 400 with an external circuit. Since this additional accommodating space can accommodate all or part of the electronic control components, the volume of the heat sink 1002 (refer to 1002 of FIG. 5) under the carrier board 1001' can be reduced. Therefore, the light-emitting device (as shown in FIG. 5) can increase the height of the lamp cover 1003 and reduce the height of the heat sink 1002 while maintaining the same height, that is, the height ratio of the lamp cover 1003 to the heat sink 1002 can be increased. Since the volume of the lamp cover 1003 becomes larger and closer to the lamp holder, the light-emitting surface area also increases, and the amount of light emitted laterally and downwardly (negative Z direction) can also be increased.

As shown in FIG. 6B, the second type of secondary carrier 403 is completely adhered to the side surface 10012 of the protruding portion 10011 for increasing the heat dissipation efficiency of the light emitting assembly 400. In one embodiment, the carrier plate 1001' is made of a metal material. To prevent short-circuiting of the light-emitting unit 11 on the first-type secondary carrier 401, the first-type secondary carrier 401 may not be associated with the side surface 10012 of the protruding portion 10011 ( That is, θ < θ1) contact. Alternatively, an insulating layer material is formed between the first type of secondary carrier 401 and the side surface 10012 of the protruding portion 10011 (the insulating layer material is formed on the first type of secondary carrier 401 or/and the side surface 10012), and thus the first type The carrier 401 and the second type secondary carrier 403 may be in contact with the side surface 10012 of the protrusion 10011 (ie, θ = θ1). Moreover, the wire structure may be disposed on a side of the first type secondary board 401 facing the protruding portion 10011, and the wire structure may be disposed on the side of the first type secondary board 401 for placing the light emitting unit 11 or the first type secondary board. Within 401.

7A and 7B show schematic views of a light emitting assembly 500 in accordance with another embodiment of the present invention. Figure 7A shows a top view of the light-emitting assembly 500 before being bent. FIG. 7B is a perspective view showing the light-emitting assembly 500 after bending. As shown in FIGS. 7A and 7B, the light-emitting assembly 500 includes a circular carrier 50, four light-emitting structures 503A-503D, and a wire structure (not shown). Each of the light-emitting structures 503A to 503D includes a carrier 5031A to 5031D and a plurality of light-emitting units 11 are disposed on the carrier boards 5031A to 5031D. As shown in Fig. 7A, the circular carrier 50 before unfolding has four grooves 17 which are not in communication with each other, defining a main carrier 502 and four secondary carriers 501A to 501D. The outer plate side of the main carrier plate 502 has a circular shape and defines a central axis C perpendicular to the main carrier plate 502 and two diameters C1, C2 passing through the central axis. The angle between C1 and C2 is 90 degrees with each other. The groove 17 has a U-shape with a diameter C1 or C2 as an axis of symmetry, whereby the defined sub-carriers 501A to 501D are substantially located on the diameters C1 and C2. As shown in FIG. 7B, the secondary carrier plates 501A to 501D are bent so that the outer carrier sides of the secondary carrier plates 501A to 501D are substantially deflected in the Z-axis direction and have an inclination angle with the main carrier plate 502. θ is 0° to 180°.

As shown in FIGS. 7A and 7B, the carrier plates 5031A to 5031D have substantially the same width as the secondary carrier plates 501A to 501D, and one end is connected to the secondary carrier plates 501A to 501D. The light emitting unit 11 on the carrier boards 5031A to 5031D can be electrically connected to a wire structure (not shown) on the carrier board 50. The light-emitting structures 503A to 503D are fixed to the secondary carrier plates 501A to 501D by solder, a conductive adhesive, a snap, or a screw. In other words, the carrier plates 5031A to 5031D and the carrier 50 have two independent structures. The light-emitting assembly 500, like the light-emitting assembly 100, 200, 300, can be placed in the light-emitting device 1000 as in FIG.

Fig. 8 is a schematic cross-sectional view showing the light-emitting unit 11. The light-emitting unit 16 is similar to the light-emitting unit 11, and only the light-emitting unit 11 will be described in detail herein. The light emitting unit 11 includes a light emitting body 111, a first transparent body 112, an optical conversion structure 113, a second transparent body 114, a third transparent body 115, and an optical layer 119. The light emitting body 111 includes a first type semiconductor layer, an active layer, a second type semiconductor layer (not shown), and two electrodes 120A, 120B. When the illuminating body 111 is a heterostructure, the first type semiconductor layer and the second type semiconductor layer, for example, a cladding layer and/or a confinement layer, respectively provide electrons and holes, so that Electrons and holes are combined in the active layer to emit light. The first type semiconductor layer, the active layer, and the second type semiconductor layer may comprise a III-V semiconductor material such as Al _x In _y Ga _{( 1-xy )} N or Al _x In _y Ga _{( 1-xy )} P, wherein 0≦x, y≦1; (x+y)≦1. Depending on the material of the active layer, the illuminating body 111 can emit a peak (Peak wavelength) or a dominant wavelength between 610 nm and 650 nm, with a peak or dominant wavelength between 530 nm and 570 nm. Green light, or blue light with a peak between 450 nm and 490 nm. The light emitting unit 11 further includes a reflective insulating layer 116A, 116B formed under the first transparent body 112, an optical conversion structure 113 and the second transparent body 114 and not covering the two electrodes 120A, 120B of the light emitting body 111; and the extension electrode 117A, 117B is formed on the two electrodes 120A and 120B, respectively, and is electrically connected to the two electrodes 120A and 120B. The first transparent body 112, the second transparent body 114, and the third transparent body 115 are transparent to light, such as sunlight or light emitted from the light-emitting body 111. In an embodiment, the first transparent body 112, the second transparent body 114, or/and the third transparent body 115 may comprise diffusion particles such as titanium dioxide, zirconium oxide, zinc oxide or aluminum oxide.

In one embodiment, the optical conversion structure 113 includes a plurality of phosphor particles (not shown) and conforms to the contour of the first transparent body 112. Partially adjacent phosphor particles are in contact with each other, but partially adjacent phosphor particles are not in contact with each other. The phosphor particles have a particle size (diameter) of about 5 um to 100 um and may contain one or more types of phosphor materials. Fluorescent powder materials include, but are not limited to, yellow-green phosphor powder and red phosphor powder. The components of the yellow-green phosphor are, for example, aluminum oxide (YAG or TAG), citrate, vanadate, alkaline earth metal selenide, or metal nitride. The components of the red phosphor are, for example, fluoride (K ₂ TiF ₆ : Mn ⁴⁺ , K ₂ SiF ₆ : Mn ⁴⁺ ), citrate, vanadate, alkaline earth metal sulfide, metal oxynitride, or tungsten. a mixture of molybdate groups. The optical conversion structure 113 can absorb the first light emitted by the light-emitting body 111 and convert it into a second light of a different spectrum from the first light. Mixing the first light with the second light produces a mixed light, such as white light. In this embodiment, the light generated by the light-emitting unit 11 in the thermal steady state has a white light color temperature of 2200K~6500K (for example: 2200K, 2400K, 2700K, 3000K, 5700K, 6500K), and its color point value (CIE x, y) ) will fall within the range of seven MacAdam ellipse and have a color rendering (CRI) greater than 80 or greater than 90. In another embodiment, the first light is mixed with the second light to produce violet, yellow, or other non-white light.

The first transparent body 112 and the second transparent body 114 respectively comprise Silicone, Epoxy, Polyimidine (PI), benzocyclobutene (BCB), Perfluorocyclobutane (PFCB). , SU8, Acrylic Resin, Polymethyl Methacrylate (PMMA), Polyethylene terephthalate (PET), Polycarbonate (PC), Polyetherimide, Fluorocarbon Fluorocarbon Polymer, alumina (Al ₂ O ₃ ), SINR, or spin-on glass (SOG). The third transparent body 115 comprises Sapphire, Diamond, Glass, Epoxy, quartz, Acrylic Resin, SiO _x , alumina ( Al ₂ O ₃ ), zinc oxide (ZnO), or silicone (Silicone). The reflective insulating layer 116 comprises a mixture of a substrate and a high reflectivity material. The substrate can be a silicone-based or epoxy-based; the high reflectivity material can comprise titanium dioxide, ceria or alumina. Further, the reflective insulating layer 126 may have a function of reflecting light or diffusing light. The extension electrodes 117A, 117B comprise a metal such as copper, titanium, gold, nickel, or combinations thereof.

As shown in FIG. 8 , the third transparent body 115 is formed above the second transparent body 114 and has a shape of an upper width and a lower width. In detail, the third transparent body 115 has a first portion 1151 and a first transparent body 115 . The second part 1152. The second portion 1152 is closer to the second transparent body 114 and has a width smaller than the width of the first portion 1151. The thickness of the first portion 1151 is about 1% to 20% or 1% to 10% of the thickness of the third transparent body 115. In this embodiment, the junction of the first portion 1151 and the second portion 1152 is an arc. The first portion 1151 has a side surface 1151S that is away from the light emitting body 111 than the side surface 1142 of the second transparent body 114. Alternatively, the side surface 1151S can also be substantially flush with the side surface 1142. The lower surface of the reflective insulating layer 116B between the extension electrodes 117A, 117B has a raised arc-like structure whose maximum thickness is thicker than the electrodes 120A, 120B. The reflective insulating layer 116A located on both sides of the electrodes 120A, 120B also has an arcuate lower surface, and its thickness gradually increases from the electrodes 120A, 120B toward the outer side of the light emitting unit 11, and the outer surface of the final reflective insulating layer 116A and the second The side surfaces 1142 of the transparent body are coplanar. The lower surface of the portion of the reflective insulating layer 116A is covered by the extending electrodes 117A, 117B and is in contact with each other, and the other portion is away from the lower surface of the light emitting body 111 without being covered by the extending electrodes 117A, 117.

As shown in FIG. 8, the optical layer 119 is formed between the third transparent body 115 and the second transparent body 114. The optical layer 119 may be a single layer or a multilayer structure, such as a metal layer comprising, for example, silver or aluminum, or an oxide layer comprising, for example, titanium dioxide. The multilayer structure may be a laminate of metal and metal oxide or a distributed Bragg reflector (DBR) to achieve reflection. A laminate of a metal and a metal oxide such as a laminate of aluminum and aluminum oxide. The decentralized Bragg mirrors can be non-semiconductor laminates or semiconductor stacks. The material of the non-semiconductor laminate may be selected from one of the group consisting of alumina (Al ₂ O 3 ), yttrium oxide (SiO ₂ ), titania (TiO ₂ ), niobium pentoxide (Nb ₂ O ₅ ), tantalum nitride (SiN). _x ). The material of the semiconductor stack can be selected from one of the following groups: gallium nitride (GaN), aluminum gallium nitride (AlGaN), aluminum indium gallium nitride (AlInGaN), aluminum arsenide (AlAs), aluminum gallium arsenide ( AlGaAs), gallium arsenide (GaAs). In this embodiment, the light is not completely reflected, whether it is a single layer structure or a multilayer structure, so that at least part of the light passes directly through the reflection structure 129.

In one embodiment, the optical layer 119 is a dispersed Bragg mirror composed of a non-semiconductor material (e.g., an oxide such as SiO ₂ or TiO ₂ ) having optical characteristics as shown in Figs. 9A to 9B. The optical layer 119 has a reflectance close to 100% for light having a wavelength of 420 to 750 nm, and can reflect light emitted from the light-emitting body 111, including red light, yellow light, blue light, and green light. The optical layer 119 has a reflectance of less than 50 to 10% or less for light having a wavelength of 350 to 420 nm and more than 750 nm. As shown in FIG. 9A, the optical layer 119 may further include a first optical layer 1191 and a second optical layer 1192. The first optical layer 1191 and the second optical layer 1192 have different numbers of laminations and/or thicknesses of different laminations. The first optical layer 1191 is between 420 and 600 nm, and the second optical layer 1192 has a reflectivity of approximately 100% between 550 and 750 nm. A reflection effect equivalent to that of Fig. 9A can be provided by a combination of two optical layers. In FIG. 9B, the optical layer 119 is composed of a first optical layer 1191, a second optical layer 1192, and a third optical layer 1193. Each of the three optical layers has different optical characteristics, and is close to 420 to 750 nm after stacking. 100% reflectivity. 9A-9B are schematic diagrams showing the optical characteristics of the optical layer 119 according to an embodiment of the present invention, wherein the thickness of the first optical layer 1191, the second optical layer 1192, and the third optical layer 1193 are different. In other embodiments, the three optical layers described above are the same thickness. In other embodiments, the optical layer 119 can be composed of three or more layers of material having the same or different thicknesses. The plurality of material layers included in the optical layer 119 each have different optical characteristics, and can provide similar reflectance in the same wavelength range. For example, in FIG. 9A, the first optical layer 1191 and the second optical layer 1192 are at 550. Between ~600nm has a reflectivity close to 100%. In other embodiments, the optical layer 119 may have a near 100% reflectivity between 380 and 980 nm. In other embodiments, optical layer 119 has a reflectivity greater than 85% for light having a wavelength in the range of 450 nm to 475 nm and greater than 80% for light having a wavelength range of 400 nm to 600 nm. Light that is not reflected by the optical layer 119 may enter the third transparent body 115 and exit the light emitting unit 11 from above or from the side of the third transparent body 115.

As shown in FIG. 8, the optical layer 119 substantially covers the cross section of the entire light emitting unit 11, that is, the optical layer 119 covers the light emitting body 111 and the reflective insulating layer 116. The light emitted by the illuminating body 111 necessarily passes through the optical layer 119 before passing through the third transparent body 115. A portion of the portion that is reflected by the optical layer 119 exits the light-emitting unit directly through the side surface 1142, and a portion thereof is first reflected by the reflective insulating layer 116A, and then exits the light-emitting unit 11 by the side surface 1142. Therefore, for the light emitting unit 11, more light intensity can be obtained in the horizontal direction.

Figure 10 is a cross-sectional view showing a light-emitting unit 11 according to another embodiment of the present invention (the outline of the light-emitting unit 11 may be a square, a rectangle, a diamond, a triangle or other polygon as viewed from a top view). The light emitting unit 11 includes a light emitting body 111. The two electrodes 120A, 120B are located on the lower surface 1111 of the light-emitting body 111 (the lower surface 1111 may be a plane or a combination of a plurality of planes/curves), and the side surfaces 1201 of the two electrodes 120A, 120B do not exceed the side surface of the light-emitting body 111 1112. An optical conversion structure 113 covers the upper surface 1113 of the light-emitting body 111, the side surface 1112, and the side surfaces 1201 of the two electrodes. The optical conversion structure 113 is also filled between the two electrodes 120A, 120B. The lower surface 1202 of the two electrodes 120A, 120B is not covered by the optical conversion structure 113 and is used to electrically connect to an external circuit. The lower surface 1131 of the optical conversion structure 113 is substantially coplanar with the lower surface 1202 of the electrodes 120A, 120B (for example, the difference between the lower surface 1202 and the lower surface 1131 is not more than 1/2 or 1/3 of the electrode height). The light emitting unit 11 can be a six-sided light emitting body and has an illumination angle of about 140 degrees. The angle of illumination described herein is defined as the range of angles that are included when the brightness is 50% of the maximum brightness. For a detailed description of the illumination angle, refer to the contents of the Taiwan application 104103105.

Figure 11 is a cross-sectional view showing a light-emitting unit 11 according to another embodiment of the present invention (the outline of the light-emitting unit 11 may be a square, a rectangle, a diamond, a triangle or other polygon as viewed from a top view). The light emitting unit 11 includes a light emitting body 111. The two electrodes 120A, 120B are located on the lower surface 1111 of the light emitting body 111, and the side surfaces 1201 of the two electrodes do not exceed the side surface 1112 of the light emitting body 111. The optical conversion structure 113 covers the upper surface 1113 of the light-emitting body 111, the side surface 1112, and the side surfaces 1201 of the two electrodes. The optical conversion structure 113 is also filled between the two electrodes 120A, 120B. The lower surface 1202 of the two electrodes 120A, 120B is not covered by the optical conversion structure 113 and is used to electrically connect to an external circuit. The lower surface 1131 of the optical conversion structure 113 is substantially coplanar with the lower surface 1202 of the electrodes 120A, 120B (for example, the difference between the lower surface 1202 and the lower surface 1131 is not more than 1/2 or 1/3 of the electrode height). The reflective insulating layer 116 is located above the optical conversion structure 113, covering the light emitting body 111 and the optical conversion structure 113. The side surface 1161 of the reflective insulating layer 116 is substantially coplanar with the side surface 1132 of the optical conversion structure 113. The reflective insulating layer 116 comprises a mixture of a substrate and a high reflectivity material. The substrate can be either a silicone-based or an epoxy-based; the high reflectivity material can comprise titanium dioxide, ceria or alumina. In the present embodiment, the light field formed by the light-emitting unit 11 has a similar light intensity at various angles in the horizontal direction.

The light-emitting unit of Fig. 8 or Fig. 11 has a larger light intensity in the horizontal direction than the light-emitting unit of Fig. 10. Therefore, in the light-emitting device 1000 of FIG. 5, the light-emitting assembly 100 uses the light-emitting unit 11 of FIG. 10 on the secondary carrier, and the light-emitting assembly 100 is compared with the light-emitting unit 11 of FIG. 8 or FIG. The number of secondary carriers can be reduced. Alternatively, fewer light-emitting units can be used on each carrier board. On the other hand, if the light emission in the positive Z direction is required on the main carrier, the light emitting unit as shown in FIG. 10 can be disposed to increase the amount of light emitted by the light emitting device 1000 in the positive Z direction. However, the combination of the light-emitting units required for the main carrier board and the secondary carrier board is not limited to the above combination, and the light-emitting units of different configurations may be alternately arranged on the main carrier board and the secondary carrier board according to the requirements of the light type and brightness of the actual light-emitting device 1000. In the above, for example, the light-emitting unit of FIG. 8 and the light-emitting unit of FIG. 10 are simultaneously disposed on the secondary carrier. In addition, in other light-emitting components 200-500, the configuration of the light-emitting unit is the same as that of the light-emitting component 100, and details are not repeated herein.

It is to be understood that the above-described embodiments of the present invention may be combined or substituted with each other as appropriate, and are not limited to the specific embodiments described. The examples of the invention are intended to be illustrative only and not to limit the scope of the invention. Any obvious modifications or variations of the present invention are possible without departing from the spirit and scope of the invention.

100, 200, 300, 400, 500 light-emitting modules 101A-101D, 201A-201D, 301A-301D, 501A-501D secondary carrier board 101"A-101"E, 101'"A-101'"C secondary carrier board 102 , 202, 302, 402, 502, 102", 102'" main carrier boards 10, 20, 30, 40, 50, 10', 10", 10'", 5031A to 5031D carrier boards 12A, 12B, 22A, 22B 32A, 32B electrodes 103A to 103D, 203A to 203D, 303A to 303D, 10011 protruding portions θ, θ1 inclination angles 11, 16 light-emitting unit C central axes d, H5 distances 1021 to 1024, 2021 to 2024, 3021 to 3024 H1, H2, H3, L1, L2 length 101D1 bending zone 101D2 extension zone 141 side edge 1031 first surface 1032 second surface 1033 third surface T test equipment L bending line 17 groove A1, A2 diagonal 204, 304 opening 203D1 arc angle 203D2 first oblique side 203D3 second oblique side B1 ~ B4 radius 1000 illuminating device 1003 lampshade 1001, 1001' carrier plate 1002 Heat sink 401 First type secondary carrier plate 403 Second type secondary carrier plate H4, H6, W1, W2 Width 4021 Inner plate edge 4022 Outer plate edge 10012 Side surface 503A to 503D Light-emitting structure C1, C2 Diameter 111 Light-emitting body 112 First Transparent body 113 optical conversion structure 114 second transparent body 115 third transparent body 120A, 120B electrode 116, 116A, 116B reflective insulating layer 117A, 117B extended electrode 119 optical layer 1151 first portion 1152 second portion 1151S, 1142 1112, 1201, 1132, 1161 side surface 1191 first optical layer 1192 second optical layer 1193 third optical layer 1113 upper surface 1111, 1131, 1202 lower surface

1A is a perspective view of a light-emitting assembly according to an embodiment of the invention.

Fig. 1B and Fig. 1C are partial enlarged views of the light-emitting unit of Fig. 1A.

FIG. 1D is a schematic diagram of an equivalent circuit of the light-emitting unit on the light-emitting component of FIG. 1A.

Fig. 1E is a schematic diagram showing another equivalent circuit of the light-emitting unit on the light-emitting unit of Fig. 1A.

2A-2D are flow diagrams showing the fabrication of a light-emitting assembly in accordance with an embodiment of the present invention.

FIG. 2E is a schematic diagram of a carrier board of a light-emitting component according to another embodiment of the present invention.

FIG. 2F is a schematic diagram of a carrier board of a light-emitting component according to still another embodiment of the present invention.

3 is a perspective view of a light-emitting assembly according to an embodiment of the invention.

4 is a perspective view of a light-emitting assembly according to still another embodiment of the present invention.

FIG. 5 is a perspective view of a light emitting device according to an embodiment of the invention.

6A is a perspective view of a light-emitting assembly according to another embodiment of the present invention.

FIG. 6B is a perspective view of a light-emitting component placed on a carrier board according to an embodiment of the invention.

7A and 7B are perspective views of a light-emitting assembly according to another embodiment of the present invention.

Figure 8 is a cross-sectional view of a light emitting unit in accordance with an embodiment of the present invention.

9A and 9B are graphs showing the relationship between reflectance and wavelength of an optical layer according to an embodiment of the present invention.

Figure 10 is a cross-sectional view showing a light emitting unit according to another embodiment of the present invention.

Figure 11 is a cross-sectional view showing a light emitting unit according to another embodiment of the present invention.

100 Light-emitting components 101A-101D Secondary carrier 102 Main carrier 10 Carriers 12A, 12B Electrodes 103A-103D Projection θ Angle of inclination 11, 16 Light-emitting unit C Central axis 1021 to 1024 Plate edge H1, H2 Length 1032 Second surface 1033 Third surface

Claims (10)

A light-emitting device comprising: a main carrier having a first edge and a second edge; a projection extending from the first edge and having a first surface and a first surface opposite the first surface a second surface, wherein the first surface is coplanar with the second plate edge; a primary carrier plate extending from the second surface and having an oblique angle with the protrusion; and a first illumination unit located at the secondary carrier on. The illuminating device of claim 1, wherein the tilt angle is between 90 and 145 degrees. The illuminating device of claim 1, wherein the first rim is not parallel to the second rim. The illuminating device according to claim 1, wherein the main carrier, the protruding portion, and the secondary carrier are integrally formed. The illuminating device of claim 1, wherein the main carrier, the protrusion, and the secondary carrier comprise a bendable material. The illuminating device of claim 1, wherein the secondary carrier has a width which is less than 5 mm. The illuminating device of claim 1, further comprising a second illuminating unit located on the main carrier. The illuminating device of claim 1, further comprising a pair of positive and negative electrodes on the main carrier and electrically connected to the first illuminating unit. The illuminating device of claim 1, wherein the first illuminating unit comprises a transparent body, a wavelength conversion layer, and a illuminating body is located under the transparent body and the wavelength conversion layer. The illuminating device of claim 9, wherein the illuminating body further comprises a reflective material on the illuminating body.