TWI585356B - Plate-type heat pipe - Google Patents
Plate-type heat pipe Download PDFInfo
- Publication number
- TWI585356B TWI585356B TW101108571A TW101108571A TWI585356B TW I585356 B TWI585356 B TW I585356B TW 101108571 A TW101108571 A TW 101108571A TW 101108571 A TW101108571 A TW 101108571A TW I585356 B TWI585356 B TW I585356B
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- Prior art keywords
- heat pipe
- flat heat
- channel
- capillary structure
- partition
- Prior art date
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F1/00—Tubular elements; Assemblies of tubular elements
- F28F1/02—Tubular elements of cross-section which is non-circular
- F28F1/022—Tubular elements of cross-section which is non-circular with multiple channels
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
- F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2225/00—Reinforcing means
- F28F2225/04—Reinforcing means for conduits
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Geometry (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
本發明涉及一種熱管,尤係一種平板熱管。 The invention relates to a heat pipe, in particular to a flat heat pipe.
目前業界普遍採用熱管來解決高速電腦的高密度散熱問題,如熱導管、回路式熱管、以及平板熱管(Vapor Chamber)等產品。 At present, heat pipes are widely used in the industry to solve high-density heat dissipation problems of high-speed computers, such as heat pipes, loop heat pipes, and Vapor Chambers.
平板熱管的工作原理與傳統熱管相同,因其具有比傳統熱管更大的熱傳導面積,且符合“輕、薄、短、小”的高實用價值,而被大量應用在具有較大散熱面的電子產品上。 The working principle of the flat heat pipe is the same as that of the traditional heat pipe. Because it has a larger heat conduction area than the traditional heat pipe and meets the high practical value of “light, thin, short and small”, it is widely used in electrons with a large heat dissipation surface. On the product.
傳統的平板熱管包括一金屬殼體及均勻貼設於金屬殼體內表面各處的一連續的毛細結構。毛細結構包含一蒸汽通道於其內。平板熱管工作時,毛細結構內的工作介質因受熱而蒸發並進入蒸汽通道。自毛細結構各處進入蒸汽通道的工作介質容易相互干擾而形成紊流,進而使殼體局部形成熱點,導致熱量不能均勻的自殼體各處散發。 A conventional flat heat pipe includes a metal casing and a continuous capillary structure uniformly attached to the inner surface of the metal casing. The capillary structure includes a vapor passage therein. When the flat heat pipe is working, the working medium in the capillary structure evaporates due to heat and enters the steam passage. The working medium entering the steam passage from the capillary structure easily interferes with each other to form a turbulent flow, thereby causing a hot spot to be locally formed in the casing, so that heat cannot be uniformly distributed from all parts of the casing.
有鑒於此,有必要提供一種具有良好散熱性能的平板熱管。 In view of this, it is necessary to provide a flat heat pipe having good heat dissipation performance.
一種平板熱管,包括內部形成有收容空間的一殼體及設於所述收容空間內的毛細結構與工作介質,所述平板熱管還包括一隔板,所述隔板的上下相對兩端分別抵頂所述殼體的相對兩內表面而將 所述收容空間分割為並排的一第一通道及一第二通道,同時,所述隔板將所述毛細結構分割為分別貼設於其相對兩側面並分別位於第一通道及第二通道內的二毛細部。 A flat heat pipe includes a casing having a receiving space formed therein and a capillary structure and a working medium disposed in the receiving space, the flat heat pipe further comprising a partition, wherein upper and lower opposite ends of the partition respectively abut Toping the opposite inner surfaces of the housing The accommodating space is divided into a first channel and a second channel which are arranged side by side. Meanwhile, the partition plate divides the capillary structure into two opposite sides and are respectively located in the first channel and the second channel. Two capillary parts.
與習知技術相比,本發明的平板熱管因隔板將收容空間分割為第一通道及第二通道,且毛細結構的二毛細部分別分佈在第一通道及第二通道的一側,使得工作介質蒸發後,蒸發氣體之間的相互干擾較小,第一通道及第二通道內的蒸發氣體分佈相對均勻,從而避免了紊流的產生而達到均勻向外的傳熱效果。 Compared with the prior art, the flat heat pipe of the present invention divides the receiving space into the first channel and the second channel by the partition plate, and the two capillary portions of the capillary structure are respectively distributed on one side of the first channel and the second channel, so that After the working medium evaporates, the mutual interference between the evaporating gases is small, and the distribution of the evaporating gas in the first channel and the second channel is relatively uniform, thereby avoiding the generation of turbulent flow and achieving a uniform outward heat transfer effect.
下面參照附圖,結合具體實施例對本發明作進一步的描述。 The invention will now be further described with reference to the specific embodiments thereof with reference to the accompanying drawings.
1‧‧‧平板熱管 1‧‧‧ flat heat pipe
10‧‧‧殼體 10‧‧‧shell
11‧‧‧頂板 11‧‧‧ top board
13‧‧‧底板 13‧‧‧floor
15‧‧‧連接板 15‧‧‧Connecting board
17‧‧‧收容空間 17‧‧‧ accommodating space
30‧‧‧隔板 30‧‧‧Baffle
50‧‧‧毛細結構 50‧‧‧Capillary structure
51‧‧‧腰部 51‧‧‧ waist
53‧‧‧貼設部 53‧‧‧ affiliation department
55‧‧‧毛細部 55‧‧‧Makeup
171‧‧‧第一通道 171‧‧‧First Passage
173‧‧‧第二通道 173‧‧‧second channel
531‧‧‧貼設面 531‧‧‧ affixed
圖1係本發明平板熱管的橫向示意圖。 BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is a schematic transverse view of a flat heat pipe of the present invention.
圖2係本發明平板熱管的縱向示意圖。 Figure 2 is a schematic longitudinal view of the flat heat pipe of the present invention.
請參閱圖1,本發明的平板熱管1包括一殼體10、位於殼體10內的一隔板30、一毛細結構50及複數工作介質(圖未示)。 Referring to FIG. 1, the flat heat pipe 1 of the present invention comprises a casing 10, a partition 30 located in the casing 10, a capillary structure 50 and a plurality of working mediums (not shown).
該殼體10由導熱性能良好的材料如黃銅、銅合金等一體製成,包括一縱長的頂板11、與頂板11間隔且平行相對的一縱長的底板13及連接頂板11及底板13邊緣的二弧形連接板15。所述頂板11及底板13的外表面之間的距離在0.8毫米到2.0毫米之間,亦即整個殼體10的高度在0.8毫米到2.0毫米之間。所述頂板11、底板13與連接板15共同形成一縱長的收容空間17。 The housing 10 is integrally formed of a material having good thermal conductivity such as brass, copper alloy, etc., and includes an elongated top plate 11, an elongated base plate 13 spaced apart from and parallel with the top plate 11, and a top plate 11 and a bottom plate 13 Two curved connecting plates 15 at the edges. The distance between the outer surfaces of the top plate 11 and the bottom plate 13 is between 0.8 mm and 2.0 mm, that is, the height of the entire casing 10 is between 0.8 mm and 2.0 mm. The top plate 11, the bottom plate 13 and the connecting plate 15 together form an elongated receiving space 17.
所述毛細結構50為由銅、銀或鋁絲等金屬絲編織的編織網結構或由金屬粉末燒結形成的粉末燒結結構。所述毛細結構50沿殼體10 的長度方向設置於收容空間17的中部且其上下相對兩端分別貼設頂板11及底板13的內表面。本實施例中,該毛細結構50為一縱長條,其長度與頂板11的長度相當,橫截面大致呈“工”字型,包括一腰部51及位於腰部51上下相對兩端的二貼設部53。每一貼設部53的橫向寬度較腰部51的寬,縱向長度與腰部51的長度相等。每一貼設部53具有一縱長的貼設面531,用於與殼體10相應的表面貼設。每一貼設部53與貼設面531相對的表面的邊緣向與該貼設面531連接的側面呈45度圓弧角過度,用以增加毛細結構50與工作介質的接觸面積。 The capillary structure 50 is a woven mesh structure woven from a metal wire such as copper, silver or aluminum wire or a powder sintered structure formed by sintering a metal powder. The capillary structure 50 is along the housing 10 The longitudinal direction is disposed in the middle of the accommodating space 17 and the upper surfaces of the top plate 11 and the bottom plate 13 are respectively attached to the upper and lower ends. In this embodiment, the capillary structure 50 is a longitudinal strip having a length corresponding to the length of the top plate 11 and a cross-section substantially in the shape of a "work", including a waist portion 51 and two attachment portions at the upper and lower ends of the waist portion 51. 53. The lateral width of each of the attachment portions 53 is wider than that of the waist portion 51, and the longitudinal length is equal to the length of the waist portion 51. Each of the affixing portions 53 has an elongated mounting surface 531 for attaching to a corresponding surface of the housing 10. The edge of the surface of each of the attachment portions 53 opposite to the attachment surface 531 is excessively inclined at an angle of 45 degrees to the side surface to which the attachment surface 531 is connected, for increasing the contact area of the capillary structure 50 with the working medium.
所述隔板30為一縱長的實心板體,由導熱性能良好且具有一定抗壓強度的材料製成,如金屬等。所述隔板30的長度與所述殼體10的頂板11的長度相當,高度等於所述頂板11與底板13內表面之間的距離。 The separator 30 is a longitudinal solid plate body made of a material having good thermal conductivity and a certain compressive strength, such as metal. The length of the partition 30 is equivalent to the length of the top plate 11 of the casing 10, and the height is equal to the distance between the top plate 11 and the inner surface of the bottom plate 13.
所述隔板30沿殼體10的長度方向設置於所述毛細結構50的中部且其上下端分別垂直抵頂頂板11及底板13的內表面。如此,隔板30在縱向方向上將毛細結構50分割為分別貼設在其相對兩側面的二毛細部55,並且隔板30將收容空間17分割為並排的一第一通道171及一第二通道173。所述二毛細部55分別位於所述收容空間17的第一通道171及第二通道173內。因隔板30的長度與殼體10的頂板11及底板13的長度相同,從而將收容空間17分割成在工作介質運行方向相互不連通的第一通道171及第二通道173。 The partition plate 30 is disposed in the middle of the capillary structure 50 along the longitudinal direction of the casing 10 and has upper and lower ends perpendicular to the inner surfaces of the top plate 11 and the bottom plate 13, respectively. Thus, the partition 30 divides the capillary structure 50 into two bristles 55 respectively attached to opposite sides thereof in the longitudinal direction, and the partition 30 divides the accommodating space 17 into a first passage 171 and a second side by side. Channel 173. The two capillary portions 55 are respectively located in the first passage 171 and the second passage 173 of the receiving space 17 . Since the length of the partition plate 30 is the same as the length of the top plate 11 and the bottom plate 13 of the casing 10, the accommodating space 17 is divided into the first passage 171 and the second passage 173 which are not in communication with each other in the running direction of the working medium.
請同時參閱圖2,當平板熱管1的底板13與熱源接觸而吸收熱量時,其內的工作介質因受熱而蒸發,這些蒸發的工作介質分別在第一通道171及第二通道173內沿圖2所指的箭頭方向運行,通過頂 板11向外散熱而冷凝,冷凝後的工作介質由於二毛細部55的牽引而快速回流至底板13處。同時,隔板30也快速的將其吸收的熱量傳導至頂板11散發,而增強平板熱管1的傳熱效率。 Referring to FIG. 2 at the same time, when the bottom plate 13 of the flat heat pipe 1 is in contact with a heat source to absorb heat, the working medium therein is evaporated by heat, and the evaporated working medium is respectively in the first channel 171 and the second channel 173. 2 refers to the direction of the arrow, through the top The plate 11 is condensed by heat dissipation to the outside, and the condensed working medium is quickly returned to the bottom plate 13 due to the pulling of the bristles 55. At the same time, the partition 30 also rapidly transfers the heat absorbed thereby to the top plate 11 to dissipate, thereby enhancing the heat transfer efficiency of the flat heat pipe 1.
由於毛細結構50與頂板11接觸的貼設部53較腰部51寬,從而使毛細結構50與冷凝後的工作介質的接觸面積增加。同時,又由於與底板13接觸的貼設部53較腰部51大,從而形成一倒置的漏斗結構,快速的牽引工作介質回流,加快了工作介質的回流速度。 Since the attachment portion 53 of the capillary structure 50 in contact with the top plate 11 is wider than the waist portion 51, the contact area of the capillary structure 50 with the condensed working medium is increased. At the same time, since the attaching portion 53 which is in contact with the bottom plate 13 is larger than the waist portion 51, an inverted funnel structure is formed, and the working medium is quickly pulled back to speed up the reflow speed of the working medium.
因隔板30位於殼體10中部且將收容空間17分割為第一通道171及第二通道173,且毛細部55僅分佈在第一通道171及第二通道173的一側,使得工作介質蒸發後,蒸發氣體之間的相互干擾較小,第一通道171及第二通道173內的蒸發氣體分佈相對均勻,從而避免了紊流的產生並達到均勻向外的傳熱效果。同時由於隔板30具有一定的抗壓強度,如此,可增強殼體10的抗變形能力,進一步保證了平板熱管1的穩定性。 Because the partition 30 is located in the middle of the casing 10 and divides the receiving space 17 into the first passage 171 and the second passage 173, and the capillary portion 55 is distributed only on one side of the first passage 171 and the second passage 173, so that the working medium evaporates. After that, the mutual interference between the evaporation gases is small, and the distribution of the evaporation gas in the first passage 171 and the second passage 173 is relatively uniform, thereby avoiding the generation of turbulence and achieving a uniform outward heat transfer effect. At the same time, since the partition 30 has a certain compressive strength, the deformation resistance of the casing 10 can be enhanced, and the stability of the flat heat pipe 1 is further ensured.
可以理解的,在其他實施例中,所述隔板30也可以沿殼體10的寬度方向設置,只要其能夠將殼體10內部蒸發的工作介質流通的收容空間17一分為二即可。可以理解的,也可根據需要,在殼體10內部設置多個隔板30,將收容空間17分割成所需要數量的通道。 It can be understood that in other embodiments, the partition plate 30 may be disposed along the width direction of the casing 10 as long as it can divide the accommodating space 17 through which the working medium evaporated inside the casing 10 flows. It can be understood that a plurality of partitions 30 may be provided inside the casing 10 as needed to divide the accommodating space 17 into a required number of passages.
綜上所述,本發明符合發明專利要件,爰依法提出專利申請。惟,以上所述者僅為本發明之較佳實施例,舉凡熟悉本案技藝之人士,在爰依本發明精神所作之等效修飾或變化,皆應涵蓋於以下之申請專利範圍內。 In summary, the present invention complies with the requirements of the invention patent and submits a patent application according to law. The above description is only the preferred embodiment of the present invention, and equivalent modifications or variations made by those skilled in the art will be included in the following claims.
1‧‧‧平板熱管 1‧‧‧ flat heat pipe
10‧‧‧殼體 10‧‧‧shell
11‧‧‧頂板 11‧‧‧ top board
13‧‧‧底板 13‧‧‧floor
15‧‧‧連接板 15‧‧‧Connecting board
17‧‧‧收容空間 17‧‧‧ accommodating space
30‧‧‧隔板 30‧‧‧Baffle
50‧‧‧毛細結構 50‧‧‧Capillary structure
51‧‧‧腰部 51‧‧‧ waist
53‧‧‧貼設部 53‧‧‧ affiliation department
55‧‧‧毛細部 55‧‧‧Makeup
171‧‧‧第一通道 171‧‧‧First Passage
173‧‧‧第二通道 173‧‧‧second channel
531‧‧‧貼設面 531‧‧‧ affixed
Claims (10)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201210058060XA CN103307915A (en) | 2012-03-07 | 2012-03-07 | Flat plate heat pipe |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201337196A TW201337196A (en) | 2013-09-16 |
TWI585356B true TWI585356B (en) | 2017-06-01 |
Family
ID=49113013
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW101108571A TWI585356B (en) | 2012-03-07 | 2012-03-14 | Plate-type heat pipe |
Country Status (3)
Country | Link |
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US (1) | US20130233520A1 (en) |
CN (1) | CN103307915A (en) |
TW (1) | TWI585356B (en) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5654176B2 (en) * | 2012-04-16 | 2015-01-14 | 古河電気工業株式会社 | heat pipe |
CN111306972A (en) | 2014-11-28 | 2020-06-19 | 台达电子工业股份有限公司 | Heat pipe |
US11306974B2 (en) | 2016-06-15 | 2022-04-19 | Delta Electronics, Inc. | Temperature plate and heat dissipation device |
US11543188B2 (en) | 2016-06-15 | 2023-01-03 | Delta Electronics, Inc. | Temperature plate device |
CN106310911B (en) * | 2016-08-22 | 2022-08-05 | 山东国舜建设集团有限公司 | Combined deep purification device for desulfurization wet flue gas |
CN107504847A (en) * | 2017-09-14 | 2017-12-22 | 济南大学 | A kind of heat-pipe elements of two-way heat transfer |
CN113819783A (en) * | 2021-09-10 | 2021-12-21 | 联想(北京)有限公司 | Heat pipe and manufacturing method thereof |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1928484A (en) * | 2005-09-05 | 2007-03-14 | 鸿富锦精密工业(深圳)有限公司 | Heat pipe and method for manufacturing same |
CN101162134A (en) * | 2006-10-10 | 2008-04-16 | 台达电子工业股份有限公司 | Heat pipe and its manufacturing method |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005043026A (en) * | 2003-07-25 | 2005-02-17 | Toyo Radiator Co Ltd | Flat tube for heat exchanger |
JP4391366B2 (en) * | 2003-09-12 | 2009-12-24 | 古河電気工業株式会社 | Heat sink with heat pipe and method of manufacturing the same |
US7447029B2 (en) * | 2006-03-14 | 2008-11-04 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Vapor chamber for dissipation heat generated by electronic component |
CN101398272A (en) * | 2007-09-28 | 2009-04-01 | 富准精密工业(深圳)有限公司 | Hot pipe |
US20100071879A1 (en) * | 2008-09-19 | 2010-03-25 | Foxconn Technology Co., Ltd. | Method for manufacturing a plate-type heat pipe and a plate-type heat pipe obtained thereby |
US20100077614A1 (en) * | 2008-09-26 | 2010-04-01 | Foxconn Technology Co., Ltd. | Method for manufacturing a wick structure of a plate-type heat pipe |
CN101493296B (en) * | 2009-02-27 | 2010-10-06 | 赵耀华 | Novel flat-plate heat pipe with stratose microflute subfebrile temperature tube group |
-
2012
- 2012-03-07 CN CN201210058060XA patent/CN103307915A/en active Pending
- 2012-03-14 TW TW101108571A patent/TWI585356B/en not_active IP Right Cessation
- 2012-04-03 US US13/437,952 patent/US20130233520A1/en not_active Abandoned
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1928484A (en) * | 2005-09-05 | 2007-03-14 | 鸿富锦精密工业(深圳)有限公司 | Heat pipe and method for manufacturing same |
CN101162134A (en) * | 2006-10-10 | 2008-04-16 | 台达电子工业股份有限公司 | Heat pipe and its manufacturing method |
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US20130233520A1 (en) | 2013-09-12 |
TW201337196A (en) | 2013-09-16 |
CN103307915A (en) | 2013-09-18 |
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